An amorphous nanocrystalline ribbon cooling device

Abstract

The application provides a kind of amorphous nanocrystalline strip cooling device, including copper jacket, the outer surface of the copper jacket is used to cool the amorphous nanocrystalline strip, the inner wall of the copper jacket is connected with heat dissipation piece, the flange ring is installed at both ends of the copper jacket respectively, the flange ring is connected with external water pipe, the circulating cooling water supplied by the external water pipe flows through the inside of the copper jacket, for taking away the heat of the amorphous nanocrystalline strip.The cooling device improves the heat dissipation capacity of the cooling matrix by setting heat dissipation piece on the inner wall of the copper jacket, as the rapid cooling capacity improves in the preparation process of the amorphous nanocrystalline strip, the roll shear thickness of the amorphous nanocrystalline strip improves, the apparent quality of the strip improves, and then the market is provided with the amorphous nanocrystalline strip with higher toughness and higher surface quality.

Description

Technical Field

[0001] This invention relates to the field of power electronics, and in particular to a cooling device for amorphous nanocrystalline ribbons. Background Technology

[0002] The main manufacturing process for the industrial production of amorphous and nanocrystalline ribbons is planar flow casting, also known as single-roll rapid quenching. Its main principle is that high-temperature molten metal is sprayed through injection holes onto a cooling substrate filled with circulating cooling medium. The cooling substrate rotates at a high speed of 30 meters per second, with circulating cooling medium continuously flowing through it. Rapid heat transfer is achieved through the cooling substrate and the cooling medium flowing inside it, resulting in rapid cooling and subsequent rapid solidification of the high-temperature molten metal. The solidification rate is approximately 106°C / s.

[0003] In industrial production, cooling substrates primarily utilize copper alloys with high thermal conductivity. Currently, copper alloys with thermal conductivity ranging from 130 to 260 are in use. Traditional amorphous and nanocrystalline ribbon cooling devices typically employ a copper sleeve as the cooling substrate for cooling and forming. However, due to the smooth inner wall of the copper sleeve, heat dissipation is inadequate, leading to reduced toughness of the amorphous and nanocrystalline ribbon and consequently, decreased processing efficiency in subsequent rolling and shearing processes. The cooling medium used in industrial production cooling substrates is mainly distilled water. The rapid flow of distilled water increases the rapid heat transfer capacity of the cooling system. While distilled water has a high specific heat capacity, its thermal conductivity is limited. To produce amorphous and nanocrystalline ribbons with higher toughness, it is necessary to improve the thermal conductivity of the cooling medium.

[0004] Chinese patent application number CN201310029641.5 discloses a copper sleeve structure for an amorphous crystallizer, which includes a water channel on the inner circumference of the copper sleeve and an adjusting copper strip disposed in the water channel near the side of the copper sleeve.

[0005] Chinese Patent Application No. CN201710290622.6 discloses a cooling structure for an axially non-uniform amorphous crystallizer copper sleeve, comprising several rectangular cooling water tanks. These cooling water tanks are distributed in segments with equal arc lengths along the inner circumference of the amorphous crystallizer copper sleeve, and are also equidistantly distributed at varying depths in the central region along the axial direction of the copper sleeve. The arc length Rc of each cooling water tank segment along the circumference of the copper sleeve is 155–200 mm. Circumferential ribs are provided between each cooling water tank segment, and the width Rlc of the circumferential ribs is 9–14 mm. The total width Wc of all cooling water tank segments is equal to the strip width Wa + 0–6 mm.

[0006] Chinese patent application number CN201710290622.6 discloses a cooling structure for an axially non-uniform amorphous crystallizer copper sleeve, including several cooling water tanks with rectangular cross sections. The cooling water tanks are distributed in segments with equal arc lengths along the inner circumference of the amorphous crystallizer copper sleeve, and are also equidistantly distributed in the central region along the axial direction of the amorphous crystallizer copper sleeve with varying depths.

[0007] The aforementioned patents primarily address the issue of uniformity within the coverage area of ​​the cooling substrate, without considering the overall cooling system and improving overall heat transfer capacity.

[0008] For the reasons mentioned above, there is a need for a cooling device for amorphous and nanocrystalline ribbons to address the shortcomings of existing technologies. Summary of the Invention

[0009] The purpose of this invention is to provide a cooling device for amorphous nanocrystalline ribbons. This device solves the technical problem of insufficient cooling capacity of existing cooling systems used in the industrial preparation of amorphous nanocrystalline ribbons, and can produce amorphous nanocrystalline ribbons with high toughness and high surface quality.

[0010] To achieve the above objectives, the present invention provides the following technical solution:

[0011] A cooling device for amorphous nanocrystalline ribbon includes a copper sleeve. The outer surface of the copper sleeve is used to cool the amorphous nanocrystalline ribbon. A heat sink is connected to the inner wall of the copper sleeve. Flange rings are installed at both ends of the copper sleeve. The flange rings are connected to an external water pipe. Circulating cooling water supplied by the external water pipe flows through the interior of the copper sleeve to remove heat from the amorphous nanocrystalline ribbon.

[0012] Furthermore, in the above-mentioned amorphous nanocrystalline ribbon cooling device, the heat dissipation component is a copper rod, and several copper rods are provided. One end of the copper rod is welded to the inner wall of the copper sleeve, and the other end of the copper rod extends into the interior of the copper sleeve. Preferably, the diameter of the copper rod is 2mm to 5mm and the length is 0.5mm to 1mm.

[0013] Furthermore, in the aforementioned amorphous nanocrystalline ribbon cooling device, multiple rings of copper rods are arranged from one end of the copper sleeve to the other end, with the copper rods in adjacent rings being staggered, and the copper rods in each ring being evenly distributed along the circumference of the copper sleeve.

[0014] Furthermore, in the above-mentioned amorphous nanocrystalline ribbon cooling device, the heat dissipation component is a copper sheet, and several copper sheets are provided. One end of the copper sheet is welded to the inner wall of the copper sleeve, and the other end of the copper sheet extends into the interior of the copper sleeve.

[0015] Furthermore, in the aforementioned amorphous nanocrystalline ribbon cooling device, the cross-section of the copper sheet is a fan-shaped annular structure, the cross-section of the copper sheet is perpendicular to the axis of the copper sleeve, the radius of the copper sheet is 0.5mm to 1mm, and the thickness of the copper sheet is 2mm to 3mm.

[0016] Furthermore, in the aforementioned amorphous nanocrystalline ribbon cooling device, multiple rings of copper sheets are arranged from one end of the copper sleeve to the other end, with the copper sheets in adjacent rings being staggered, and several copper sheets in each ring being evenly distributed along the circumference of the copper sleeve.

[0017] Furthermore, in the aforementioned amorphous nanocrystalline ribbon cooling device, a notch is provided at the other end of the copper sheet. The notch extends from the other end of the copper sheet to one end of the copper sheet. Multiple notches are uniformly provided on each copper sheet. The width of the notch is 2mm to 4mm, and the depth of the notch is 0.5mm to 1mm.

[0018] Furthermore, in the aforementioned amorphous nanocrystalline ribbon cooling device, the inner wall of the copper sleeve is provided with spiral grooves or jar-shaped protrusions.

[0019] Furthermore, in the above-mentioned amorphous nanocrystalline ribbon cooling device, the circulating cooling water is composed of solid particles and distilled water. By mass percentage, the solid particles are 0.1% to 2% of the distilled water, the diameter of the solid particles is ≤50 micrometers, and the thermal conductivity of the solid particles is greater than that of distilled water at room temperature.

[0020] Furthermore, in the above-mentioned amorphous nanocrystalline ribbon cooling device, the solid particles are made of one or a mixture of several of SiC, Al2O3, SiO2, and C powder. Preferably, the diameter of the solid particles is <30 micrometers, and the solid particles are 0.15% to 0.5% of distilled water by mass percentage.

[0021] Analysis shows that the present invention discloses an amorphous nanocrystalline ribbon cooling device. This cooling device improves the heat dissipation capacity of the cooling substrate by setting heat dissipation components on the inner wall of the copper sleeve. With the improvement of rapid cooling capacity during the preparation of amorphous nanocrystalline ribbon, the roll-shearable thickness of the amorphous nanocrystalline ribbon is increased, the surface quality of the ribbon is improved, and thus the market is provided with amorphous nanocrystalline ribbon with higher toughness and higher surface quality. Attached Figure Description

[0022] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. Wherein:

[0023] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present invention.

[0024] Figure 2 This is a three-dimensional structural diagram of a copper sleeve according to an embodiment of the present invention.

[0025] Figure 3 This is a three-dimensional structural diagram of the copper sleeve according to another embodiment of the present invention.

[0026] Figure 4 This is a three-dimensional structural diagram of a copper sheet according to another embodiment of the present invention.

[0027] Explanation of reference numerals in the attached drawings: 1. Copper sleeve; 2. Flange ring; 3. Copper rod; 4. Copper sheet; 5. Notch. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. Various examples are provided by way of explanation and not by way of limitation. Indeed, those skilled in the art will recognize that modifications and variations can be made to the invention without departing from its scope or spirit. For example, a feature shown or described as part of one embodiment may be used in another embodiment to produce yet another embodiment. Therefore, it is desirable that the invention encompass such modifications and variations falling within the scope of the appended claims and their equivalents.

[0029] In the description of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. The terms "connected," "linked," and "set up" used in this invention should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a direct connection or an indirect connection through intermediate components; a wired connection, a radio connection, or a wireless communication signal connection. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0030] The accompanying drawings illustrate one or more examples of the invention. The detailed description uses numerals and letters to refer to features in the drawings. Similar or analogous reference numerals in the drawings and description have been used to refer to similar or analogous parts of the invention. As used herein, the terms “first,” “second,” and “third,” etc., are used interchangeably to distinguish one component from another and are not intended to indicate the location or importance of individual components.

[0031] like Figures 1 to 4 As shown, according to an embodiment of the present invention, a cooling device for amorphous nanocrystalline ribbons is provided, such as... Figure 1 As shown, the device includes a copper sleeve 1. The outer surface of the copper sleeve 1 is used for rapid cooling of the amorphous nanocrystalline ribbon. A heat sink is connected to the inner wall of the copper sleeve 1. The copper sleeve 1 with the heat sink serves as the cooling substrate. Flange rings 2 are installed at both ends of the copper sleeve 1, and the flange rings 2 are connected to external water pipes. Circulating cooling water supplied by the external water pipes flows through the interior of the copper sleeve 1 to remove heat from the amorphous nanocrystalline ribbon. When preparing the amorphous nanocrystalline ribbon using this cooling device, high-temperature molten metal is sprayed onto the outer surface of the copper sleeve 1 through injection holes. Circulating cooling water flows through the interior of the copper sleeve 1 with the heat sink for heat dissipation, thereby achieving the purpose of rapid cooling of the amorphous nanocrystalline ribbon. By setting a heat sink inside the copper sleeve 1 to improve the heat dissipation capacity of the cooling substrate, the rapid cooling capacity during the preparation of the amorphous nanocrystalline ribbon is improved, the roll-shearable thickness of the amorphous nanocrystalline ribbon is increased, and the surface quality of the ribbon is improved, thus providing the market with amorphous nanocrystalline ribbons with higher toughness and higher surface quality.

[0032] Furthermore, in one embodiment of the present invention, as... Figure 2 As shown, the heat sink is a copper rod 3, and several copper rods 3 are provided. One end of the copper rod 3 is welded to the inner wall of the copper sleeve 1, and the other end of the copper rod 3 extends into the interior of the copper sleeve 1. When the high temperature of the amorphous nanocrystalline ribbon is transferred to the copper sleeve 1, the high temperature of the copper sleeve 1 is also transferred to the copper rod 3. The arrangement of the copper rod 3 increases the contact area between the cooling substrate and the circulating cooling water, improves the heat conduction and heat dissipation efficiency, and thus improves the cooling effect on the amorphous nanocrystalline ribbon. Preferably, the diameter of the copper rod 3 is 2mm to 5mm and the length is 0.5mm to 1mm. This arrangement ensures that the copper rod 3 improves the heat dissipation efficiency while also preventing significant water resistance during the high-speed rotation of the copper sleeve 1.

[0033] Furthermore, several copper rods 3 are arranged in a circular array around the axis of the copper sleeve 1. Multiple rings of copper rods 3 are arranged from one end of the copper sleeve 1 to the other, with the copper rods 3 in adjacent rings staggered. Several copper rods 3 in each ring are evenly distributed around the circumference of the copper sleeve 1. This arrangement can further improve the heat dissipation efficiency of the copper rods 3.

[0034] Furthermore, in another embodiment of the invention, such as Figure 3 As shown, the heat sink is a copper sheet 4, and several copper sheets 4 are provided. One end of the copper sheet 4 is welded to the inner wall of the copper sleeve 1, and the other end of the copper sheet 4 extends into the interior of the copper sleeve 1. The arrangement of the copper sheet 4 increases the contact area between the cooling substrate and the circulating cooling water, improves the heat conduction and heat dissipation efficiency, and thus improves the cooling effect on the amorphous nanocrystalline ribbon.

[0035] Furthermore, the cross-section of the copper sheet 4 is a fan-shaped ring structure, with the outer arc of the fan-shaped ring being one end of the copper sheet 4. The cross-section of the copper sheet 4 is perpendicular to the axis of the copper sleeve 1. The width of the copper sheet 4 is 0.5mm to 1mm, and the thickness of the copper sheet 4 is 2mm to 3mm. This configuration ensures that the copper sheet 4 has high heat dissipation efficiency.

[0036] Furthermore, several copper plates 4 are arranged in a circular array around the axis of the copper sleeve 1. Multiple rings of copper plates 4 are arranged from one end of the copper sleeve 1 to the other, with the copper plates 4 in adjacent rings staggered. Several copper plates 4 in each ring are evenly distributed around the circumference of the copper sleeve 1. This arrangement can further improve the heat dissipation efficiency and cooling effect of the copper plates 4, and reduce the water resistance when the circulating cooling water flows through the copper sleeve 1.

[0037] Furthermore, such as Figure 4 As shown, a notch 5 is provided at the other end of the copper sheet 4. The notch 5 extends from the other end of the copper sheet 4 to one end of the copper sheet 4. Compared with one end of the copper sheet 4, the other end of the copper sheet 4 is closer to the axis of the copper sleeve 1. Multiple notches 5 are evenly provided on each copper sheet 4. The width of the notch 5 is 2mm to 4mm and the depth of the notch 5 is 0.5mm to 1mm. This arrangement allows the circulating cooling water flowing along the axis of the copper sleeve 1 to easily pass through the notches 5 on the copper sheet 4 and flow away. In addition, the notch 5 can also increase the contact area between the copper sheet 4 and the circulating cooling water, further improving the heat dissipation efficiency and cooling effect, and further reducing the water resistance of the circulating cooling water as the copper sheet 4 rotates at high speed with the copper sleeve 1.

[0038] Furthermore, in other embodiments of the present invention, the inner wall of the copper sleeve 1 is provided with spiral grooves or jar-shaped protrusions, which can further increase the contact area between the copper sleeve 1 and the circulating cooling water.

[0039] Furthermore, the circulating cooling water consists of micron-sized solid particles and distilled water. By mass percentage, the solid particles comprise 0.1% to 2% of the distilled water, with a diameter ≤50 micrometers and a thermal conductivity greater than that of distilled water at room temperature. During the cooling process, the micron-sized solid particles come into contact with the inner surface of the copper sleeve 1 and the heat sink during flow. Because the micron-sized solid particles have a higher heat transfer velocity compared to distilled water, faster heat transfer is achieved to maintain the temperature of the copper sleeve 1 and prevent a continuous rise in temperature during production, which would affect the cooling effect on the high-temperature molten metal. When the proportion of solid particles in the distilled water is less than 0.1%, the solid impact heat transfer ratio is too low to support rapid heat transfer. When the proportion of solid particles in the distilled water is greater than 2%, the wear and blockage effects on other equipment (such as motors and heat exchangers) are significantly enhanced, making it insufficient to support the long-term preparation of amorphous nanocrystalline ribbons.

[0040] Furthermore, the solid particles are made of one or a mixture of several of SiC, Al2O3, SiO2, and C powder. At room temperature, the thermal conductivity of distilled water is 0.599 W / mK, that of SiC is approximately 250 W / mK, that of alumina is approximately 30 W / mK, and that of SiO2 is approximately 1.4 W / mK. Preferably, the diameter of the solid particles is <30 micrometers, and the solid particles constitute 0.15% to 0.5% of the distilled water by mass percentage.

[0041] Amorphous nanocrystalline ribbons were prepared using this cooling device. The composition system of the amorphous nanocrystalline ribbons was FeCuNbSiB, with the atomic ratio of each element being Fe:Cu:Nb:Si:B = 74:1:3:13:9. Amorphous nanocrystalline ribbons with different thicknesses and compositions were produced, and the toughness and appearance quality of the ribbons were evaluated. The toughness evaluation standard adopted the limit thickness of roll-shearable ribbons in industrial production, that is, the thickness of the ribbon can be normally roll-sheared, and the number of broken ends is ≤1 / 1500 meters. The appearance quality of the ribbons was evaluated using three grades: A, B, and C.

[0042] Grade A strip: No protrusions in the thickness direction of the strip; no burrs on the edges of the strip in the width direction; no holes in the strip.

[0043] Grade B strip: No protrusions in the thickness direction of the strip; no burrs on the edge of the strip in the width direction; no holes with a diameter >1mm in the strip.

[0044] Grade C strip: No protrusions in the thickness direction of the strip; slight burrs on the edge of the strip in the width direction; no holes with a diameter > 2mm in the strip.

[0045] Example 1

[0046] The cooling device includes a copper sleeve 1, with a flange ring 2 fixedly installed at each end of the copper sleeve 1. The copper sleeve 1 is equipped with heat dissipation components, and the circulating cooling water is distilled water.

[0047] The heat sink includes several copper rods 3, which are fixedly welded to the inner wall of the copper sleeve 1. The copper rods 3 are arranged in a ring array around the axis of the copper sleeve 1. The copper rods 3 and the copper sleeve 1 are made of copper. The copper rods 3 increase the contact area between the inner wall of the copper sleeve 1 and the circulating cooling water, thereby improving the heat dissipation efficiency and cooling effect.

[0048] Example 2

[0049] The heat sink consists of several copper plates 4, and the circulating cooling water is distilled water.

[0050] Several copper plates 4 are fixedly welded to the inner wall of the copper sleeve 1, and the copper plates 4 are arranged in a ring array around the axis of the copper sleeve 1. Several notches 5 are opened near the copper plates 4. The copper plates 4 and the copper sleeve 1 are made of copper. The copper plates 4 increase the contact area between the inner wall of the copper sleeve 1 and the circulating cooling water. The notches 5 opened on the copper plates 4 not only facilitate the flow of circulating cooling water, but also further increase the contact area between the copper plates 4 and the circulating cooling water, thereby improving heat dissipation efficiency and cooling effect.

[0051] Example 3

[0052] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 0.1% of the distilled water.

[0053] Example 4

[0054] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 0.5% of the distilled water.

[0055] Example 5

[0056] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 1.5% of the distilled water.

[0057] Example 6

[0058] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiO2 particles with a diameter of 50 μm. By mass percentage, the SiO2 particles account for 0.1% of the distilled water.

[0059] Example 7

[0060] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiO2 particles with a diameter of 50 μm. By mass percentage, the SiO2 particles account for 0.5% of the distilled water.

[0061] Example 8

[0062] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 20 μm. By mass percentage, the SiC particles account for 1.5% of the distilled water.

[0063] Example 9

[0064] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 20 μm. By mass percentage, the SiC particles account for 0.1% of the distilled water.

[0065] Example 10

[0066] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 20 μm. By mass percentage, the SiC particles account for 0.5% of the distilled water.

[0067] Example 11

[0068] The structure of the cooling substrate is the same as in Example 1, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 1.5% of the distilled water.

[0069] Example 12

[0070] The structure of the cooling substrate is the same as in Example 2, and the circulating cooling water used is a cooling medium consisting of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 0.1% of the distilled water.

[0071] Example 13

[0072] The structure of the cooling substrate is the same as in Example 2, and the circulating cooling water used is a cooling medium of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 0.5% of the distilled water.

[0073] Example 14

[0074] The structure of the cooling substrate is the same as in Example 2, and the circulating cooling water used is a cooling medium of micron-sized solid particles and distilled water. The micron-sized solid particles are SiC particles with a diameter of 50 μm. By mass percentage, the SiC particles account for 1.5% of the distilled water.

[0075] Comparative Example 1

[0076] The cooling substrate is a smooth-surfaced copper sleeve with no other physical structure. The circulating cooling water used is distilled water.

[0077] Table 1: Comparison of data from Examples 1 to 14 and Comparative Example 1

[0078]

[0079]

[0080] As shown in Table 1, by comparing the roll-shearable limit thickness and apparent quality grade of the amorphous nanocrystalline ribbons in Examples 1, 2, and 1, it can be seen that by adding physical structures (copper rods 3 or copper sheets 4) to the inner surface of the smooth copper sleeve 1, the cooling capacity of the cooling device can be effectively improved, the roll-shearable limit thickness of the amorphous nanocrystalline ribbon can be increased, and the apparent quality grade of the amorphous nanocrystalline ribbon can be improved.

[0081] By comparing Examples 1, 3, 4, and 5, it is evident that as the circulating cooling water is replaced with SiC particles with a diameter of 50 μm, the roll-shearable limit thickness of the amorphous nanocrystalline ribbon increases. Furthermore, as the proportion of SiC particles increases, the roll-shearable limit thickness of the amorphous nanocrystalline ribbon also increases accordingly. The same conclusions can be obtained through Examples 2, 12, 13, and 14.

[0082] By comparing Examples 6, 7, and 8 with Examples 3, 4, and 5, it can be found that replacing the micron-sized solid particles from SiC particles with SiO2 particles slightly reduces the roll-shear limit thickness of the amorphous nanocrystalline ribbon.

[0083] By comparing Examples 9, 10, and 11 with Examples 3, 4, and 5, it can be found that by changing the composition of the circulating cooling water from 50μm solid particles to 20μm solid particles, the roll-shear limit thickness of the amorphous nanocrystalline ribbon can be further increased under the same conditions.

[0084] Analysis of the roll-shearable limit thickness and apparent quality of the amorphous nanocrystalline ribbons in various embodiments shows that when the roll-shearable limit thickness of the amorphous nanocrystalline ribbon is <21μm, the apparent grade of the ribbon is C; when the roll-shearable limit thickness of the ribbon is 21μm to 21.5μm, the apparent grade of the ribbon is B; and when the roll-shearable limit thickness of the amorphous nanocrystalline ribbon is >21.5μm, the apparent grade of the ribbon is A.

[0085] In summary, by increasing the heat exchange area of ​​the cooling substrate and adjusting the composition of the circulating cooling water, the roll-shearable thickness limit of the strip can be increased, while simultaneously improving the strip's surface quality grade. A larger heat exchange area in the cooling substrate results in a better heat exchange effect of the cooling system. Similarly, in the circulating cooling water, a higher thermal conductivity of solid particles leads to a better heat exchange effect, and a higher proportion of solid particles also results in a better heat exchange effect.

[0086] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0087] A cooling device for amorphous nanocrystalline ribbon is provided. This cooling device improves the heat dissipation capacity of the cooling substrate by setting heat dissipation components on the inner wall of the copper sleeve 1. With the improvement of rapid cooling capacity during the preparation of amorphous nanocrystalline ribbon, the roll-shearable thickness of the amorphous nanocrystalline ribbon is increased, the surface quality of the ribbon is improved, and thus the amorphous nanocrystalline ribbon with higher toughness and higher surface quality is provided to the market.

[0088] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An amorphous nanocrystalline ribbon cooling device, characterized by, Including copper sleeves, The outer surface of the copper sleeve is used to cool the amorphous nanocrystalline ribbon, and a heat sink is connected to the inner wall of the copper sleeve. Flange rings are installed at both ends of the copper sleeve, and external water pipes are connected to the flange rings. Circulating cooling water supplied by the external water pipes flows through the interior of the copper sleeve to remove heat from the amorphous nanocrystalline ribbon. The circulating cooling water consists of solid particles and distilled water. The solid particles, by mass percentage, comprise 0.1% to 2% of distilled water. The diameter of the solid particles is 20μm~50μm. The solid particles are made of one or a mixture of several of the following materials: SiC, Al2O3, SiO2, and C powder. The thermal conductivity of the solid particles is greater than that of distilled water at room temperature. The heat sink is a copper rod, and several copper rods are provided. One end of the copper rod is welded to the inner wall of the copper sleeve, and the other end of the copper rod extends into the interior of the copper sleeve. or, The heat sink is a copper sheet, and several copper sheets are provided. One end of the copper sheet is welded to the inner wall of the copper sleeve, and the other end of the copper sheet extends into the interior of the copper sleeve.

2. The amorphous nanocrystalline ribbon cooling device according to claim 1, characterized in that, The copper rod has a diameter of 2mm to 5mm and a length of 0.5mm to 1mm.

3. The amorphous nanocrystalline ribbon cooling device according to claim 2, characterized in that, Multiple rings of copper rods are arranged from one end of the copper sleeve to the other end, with the copper rods in adjacent rings being staggered, and the copper rods in each ring being evenly distributed along the circumference of the copper sleeve.

4. The amorphous nanocrystalline ribbon cooling device according to claim 1, characterized in that, The copper sheet has a fan-shaped annular cross-section, and the cross-section of the copper sheet is perpendicular to the axis of the copper sleeve. The radius of the copper sheet is 0.5mm to 1mm, and the thickness of the copper sheet is 2mm to 3mm.

5. The amorphous nanocrystalline ribbon cooling device according to claim 1, characterized in that, Multiple rings of copper sheets are arranged from one end of the copper sleeve to the other end, with the copper sheets in adjacent rings being staggered, and several copper sheets in each ring being evenly distributed along the circumference of the copper sleeve.

6. The amorphous nanocrystalline ribbon cooling device according to claim 1, characterized in that, A notch is provided at the other end of the copper sheet, and the notch extends from the other end of the copper sheet toward one end of the copper sheet. Each copper sheet has a plurality of notches evenly provided, the width of the notches being 2mm to 4mm and the depth of the notches being 0.5mm to 1mm.

7. The amorphous nanocrystalline ribbon cooling device according to claim 1, characterized in that, The inner wall of the copper sleeve is provided with spiral grooves or jar-shaped protrusions.

8. The amorphous nanocrystalline ribbon cooling device according to claim 1, characterized in that, The diameter of the solid particles is 20 micrometers or less and less than 30 micrometers. The solid particles are 0.15% to 0.5% of distilled water by mass percentage.

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