Resistance heater material temperature prediction method, apparatus, device, medium, and vehicle

Abstract

The application discloses a resistance heater material temperature prediction method, device, equipment, medium and vehicle, and the method comprises the following steps: acquiring a first temperature of a resistance heater material at an initial moment, gear information of the resistance heater and a target moment; the resistance heater material comprises cooling water and a material plate wrapping the resistance heater; according to a preset unit time step, the number of unit time steps required from the initial moment to the target moment is determined; according to the first temperature and the gear information of the resistance heater, iterative calculation is performed for a set number of times to obtain a target temperature of the resistance heater material at the target moment. Through the resistance heater material temperature prediction method, the temperature of the resistance heater material can be quickly and accurately predicted.

Description

Technical Field

[0001] This disclosure belongs to the field of thermal management technology, specifically relating to a method, apparatus, equipment, medium, and vehicle for predicting the material temperature of a resistance heater. Background Technology

[0002] The automotive thermal management system needs to automatically adjust the cooling intensity according to driving conditions and environmental conditions to keep the corresponding components working within the optimal temperature range, specifically keeping the engine working within the corresponding optimal temperature range.

[0003] As an important heating component of the engine, the resistance heater is placed in the cooling water of the engine's cooling system. The resistance heater heats the cooling water so that it operates within the optimal temperature range.

[0004] In order to keep the resistance heater material (which may include the material plate covering the resistance heater and the cooling water) operating within the optimal temperature range, it is necessary to predict the temperature of the resistance heater material. Existing methods for predicting the temperature of resistance heater material usually rely on human experience, which results in an inaccurate and slow prediction. Summary of the Invention

[0005] The purpose of this application is to provide a method, apparatus, device, medium, and vehicle for predicting the temperature of resistance heater materials, so as to achieve the effect of rapid and accurate prediction of the temperature of resistance heater materials.

[0006] The technical solution of this application is as follows:

[0007] Firstly, a method for predicting the temperature of a resistance heater material is provided, the method comprising:

[0008] The system acquires the initial temperature of the resistance heater material, the resistance heater's setting information, and the target time; the resistance heater material includes cooling water and a material plate encasing the resistance heater.

[0009] Based on the preset unit time step, determine the number of unit time steps required from the initial time to the target time;

[0010] Based on the first temperature and the setting information of the resistance heater, a set number of iterative calculations are performed to obtain the target temperature of the resistance heater material at the target time.

[0011] In a second aspect, a device for predicting the temperature of a resistance heater material is provided, the device comprising:

[0012] The acquisition module is used to acquire the initial temperature of the resistance heater material, the resistance heater's setting information, and the target time; the resistance heater material includes cooling water and a material plate that wraps the resistance heater.

[0013] The first determining module is used to determine the number of unit time steps required from the initial time to the target time based on a preset unit time step.

[0014] The second determining module is used to perform a set number of iterative calculations based on the first temperature and the gear information of the resistance heater to obtain the target temperature of the resistance heater material at the target time.

[0015] Thirdly, embodiments of this application provide a resistance heater material temperature prediction device, which includes a processor, a memory, and a program or instructions stored in the memory and executable on the processor. When the program or instructions are executed by the processor, they implement the steps of any of the resistance heater material temperature prediction methods described in the embodiments of this application.

[0016] Fourthly, embodiments of this application provide a computer-readable storage medium storing a program or instructions that, when executed by a processor, implement the steps of the resistance heater material temperature prediction method described in any embodiment of this application.

[0017] Fifthly, embodiments of this application provide a vehicle, the vehicle comprising at least one of the following:

[0018] The resistance heater material temperature prediction device as described in the first aspect;

[0019] The resistance heater material temperature prediction device as described in the second aspect;

[0020] The computer-readable storage medium as described in the third aspect.

[0021] The technical solutions provided by the embodiments of this application bring at least the following beneficial effects:

[0022] The method for predicting the temperature of a resistance heater material provided in this application obtains the number of unit time steps required from the initial time to the target time, and performs a set number of iterative calculations based on the first temperature of the resistance heater material at the initial time and the resistance heater's setting information to obtain the target temperature of the resistance heater material at the target time. In this way, when predicting the target temperature of the resistance heater material at the target time, there is no need for human prediction based on experience, which improves the accuracy and efficiency of the predicted temperature of the resistance heater material.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application, and do not constitute an undue limitation of this application.

[0025] Figure 1 This is a schematic flowchart of a method for predicting the material temperature of a resistance heater according to the first aspect of this application.

[0026] Figure 2 This is a schematic diagram illustrating the calculation process for each iteration according to the first aspect of the embodiment of this application;

[0027] Figure 3 This is a schematic diagram of a single-layer heat exchange model of a resistance heater according to the first aspect of this application;

[0028] Figure 4 This is a schematic diagram of the structure of a resistance heater material temperature prediction device provided in the second aspect embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the structure of an electronic device provided in the third aspect of this application. Detailed Implementation

[0030] To better understand the above-mentioned objectives, features, and advantages of this disclosure, the solutions disclosed herein will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0031] Numerous specific details are set forth in the following description in order to provide a full understanding of this disclosure, but this disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some, and not all, of the embodiments of this disclosure.

[0032] As described in the background art, existing methods for predicting the temperature of resistance heater materials suffer from insufficient accuracy and slow prediction speed. To address these issues, this application provides a method for predicting the temperature of resistance heater materials. By acquiring the number of unit time steps required from the initial time to the target time, and based on the initial temperature of the resistance heater material and the resistance heater's setting information, a set number of iterative calculations are performed to obtain the target temperature of the resistance heater material at the target time. Thus, when predicting the target temperature of the resistance heater material at the target time, there is no need for manual prediction based on experience, improving the accuracy and efficiency of the predicted temperature of the resistance heater material.

[0033] The method for predicting the material temperature of a resistance heater provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0034] Figure 1 This is a flowchart illustrating a method for predicting the temperature of a resistance heater material according to an embodiment of this application. The execution entity of this method can be a server. It should be noted that the aforementioned execution entity does not constitute a limitation on this application.

[0035] like Figure 1 As shown, the method for predicting the material temperature of a resistance heater provided in this application embodiment may include steps 110-130.

[0036] Step 110: Obtain the initial temperature of the material in the resistance heater, the setting information of the resistance heater, and the target time.

[0037] The materials for the resistance heater may include cooling water and a material plate that wraps around the resistance heater.

[0038] Step 120: Determine the number of unit time steps required from the initial time to the target time based on the preset unit time step.

[0039] Step 130: Based on the first temperature and the setting information of the resistance heater, perform iterative calculations for a set number of times to obtain the target temperature of the resistance heater material at the target time.

[0040] The set number of times can be equal to the number in step 120.

[0041] In some embodiments of this application, by obtaining the number of unit time steps required from the initial time to the target time, and based on the first temperature of the resistance heater material at the initial time and the resistance heater's setting information, a set number of iterative calculations are performed to obtain the target temperature of the resistance heater material at the target time. Thus, when predicting the target temperature of the resistance heater material at the target time, there is no need for human prediction based on experience, which improves the accuracy and efficiency of the predicted temperature of the resistance heater material.

[0042] The method for predicting the material temperature of a resistance heater provided in the embodiments of this application is described in detail below.

[0043] Step 110: Obtain the initial temperature of the material in the resistance heater, the setting information of the resistance heater, and the target time.

[0044] The materials for the resistance heater may include cooling water and a material plate that wraps around the resistance heater.

[0045] The initial moment can be the moment when you begin to predict the temperature of the resistance heater material.

[0046] The first temperature can be the temperature of the resistance heater material at the initial moment.

[0047] The gear information can be used to characterize the number of resistance heaters in the parallel circuit where the resistance heater is located.

[0048] The target time could be the moment at which the temperature of the resistance heater material is to be predicted.

[0049] In one example, if we want to predict the temperature of the resistance heater material within the next hour, starting from 8:00 AM on April 18, 2022, then 8:00 AM on April 18, 2022 is the initial time, and 9:00 AM on April 18, 2022 is the target time.

[0050] In some embodiments of this application, the initial temperature of the resistance heater material can be obtained by a sensor placed on the resistance heater material. The specific method of obtaining the temperature is not limited here.

[0051] The setting information for the resistance heater can be obtained by locating the parallel circuit in which the resistance heater is connected. The specific method of obtaining this information is not specified here.

[0052] Step 120: Determine the number of unit time steps required from the initial time to the target time based on the preset unit time step.

[0053] The preset unit time step can be a pre-set unit time step. For example, the unit time step can be 5 minutes or 10 minutes. The specific setting can be determined according to user needs and is not limited here.

[0054] Continuing with the example above, the initial time is 8:00 AM on April 18, 2022, and the target time is 9:00 AM on April 18, 2022. That is, the time from the initial time to the target time is 60 minutes. If the preset unit time step is 5 minutes, then the number of unit time steps required from the initial time to the target time is i = 60 / 5 = 12.

[0055] Step 130: Based on the first temperature and the setting information of the resistance heater, perform iterative calculations for a set number of times to obtain the target temperature of the resistance heater material at the target time.

[0056] The set number can be a pre-set number of iterations. Specifically, this set number can be consistent with the number of unit time steps required from the initial time to the target time, as determined in step 120 above.

[0057] The target temperature can be obtained by iterative calculation based on the first temperature and the setting information of the resistance heater, and the temperature of the resistance heater material at the target time.

[0058] like Figure 2 As shown, each iteration of the calculation may include steps 210-230:

[0059] Step 210: Based on the first temperature of the material plate at the first moment, the setting information of the resistance heater, and the first heat transfer relationship between the resistance heater and the material plate, obtain the second temperature of the material plate after the resistance heater heats the material plate.

[0060] The material plate can be the same material used to wrap the resistance heater. Specifically, it can be an aluminum plate.

[0061] The first moment can be the initial moment or a moment between the initial moment and the target moment. The initial value of the first moment can be the initial moment.

[0062] The first heat transfer relationship can be the heat transfer relationship between the resistance heater and the material plate.

[0063] The second temperature can be the temperature of the material plate after the resistance heater heats it.

[0064] In some embodiments of this application, the specific first heat transfer relationship can be as shown in the following formula (1):

[0065]

[0066] In the above formula (1), T 临时 T0 represents the second temperature of the material plate after it has been heated by the resistance heater, and Q represents the first temperature of the material plate at the first moment. 电 This can be the heat generated by the resistance heater; m is the mass of the aluminum plate; C p铝 This is the specific heat of the aluminum plate.

[0067] In some embodiments of this application, to further improve the accuracy of the predicted temperature of the resistance heater material, step 210 may specifically include:

[0068] Based on the first temperature of the material board at the first moment, the setting information of the resistance heater, and the calculation formula of the first resistance of the circuit where the resistance heater is located, the first resistance information of the circuit where the resistance heater is located is obtained.

[0069] Calculate the first heat of the resistance heater based on the first resistance information;

[0070] Based on the first heat and the first heat transfer relationship between the resistance heater and the material plate, the second temperature of the material plate after the resistance heater heats the material plate is obtained.

[0071] The formula for calculating the first resistance can be the formula for calculating the total resistance of the resistive heater in its circuit.

[0072] The first resistance information can be the total resistance of the circuit containing the resistance heater.

[0073] The first heat source can be the heat of the material plate obtained based on the first resistance information.

[0074] In some embodiments of this application, the first resistance information of the circuit containing the resistance heater is calculated according to the first resistance calculation formula shown in formula (2) below:

[0075]

[0076] In the above formula (2), R is the resistance of the resistance heater; R sum is the total resistance of the circuit containing the resistance heater (i.e., the first resistance information); n is the setting information of the resistance heater.

[0077] According to the above formula (2), the first resistance information of the circuit where the resistance heater is located can be obtained.

[0078] Then, the power of the resistance heater can be obtained according to formula (3):

[0079]

[0080] Where U is the total voltage of the circuit containing the resistance heater (this voltage can be obtained through a voltmeter); P is the power of the resistance heater.

[0081] Then, according to formula (4), the first heat of the resistance heater can be obtained:

[0082] Q 铝 =P*t (4)

[0083] Among them, Q 铝 t represents the initial heat of the resistance heater; t is the unit time step.

[0084] The first heat of the resistance heater is obtained through the above formula (4), and the second temperature of the material plate after the resistance heater heats the material plate can be obtained through the first heat of the resistance heater according to formula (1).

[0085] In some embodiments of this application, the first resistance information of the circuit where the resistance heater is located is obtained by using the first temperature of the material plate at a first moment, the setting information of the resistance heater, and the first resistance calculation formula of the circuit where the resistance heater is located; the first heat of the resistance heater is calculated based on the first resistance information; and the second temperature of the material plate after the resistance heater heats the material plate is obtained based on the first heat and the first heat transfer relationship between the resistance heater and the material plate. In this way, the accurate outlet water temperature and the temperature of the material plate at the second moment can be obtained based on the second temperature, thereby further improving the accuracy of the predicted temperature of the resistance heater material.

[0086] In some embodiments of this application, in order to further improve the accuracy of the predicted temperature of the resistance heater material, the first resistance calculation formula of the resistance heater in formula (2) above can be obtained by the following simulation method:

[0087] Based on the setting information of the resistance heater and the formula for calculating the second resistance of the resistance heater, the second resistance information of the circuit where the resistance heater is located is obtained.

[0088] The second resistance information, as well as the current and temperature information of the circuit where the resistance heater is located, are fitted to determine the parameter information in the first resistance calculation formula;

[0089] Based on the parameter information, determine the formula for calculating the first resistance of the resistance heater.

[0090] The formula for calculating the second resistance can be the formula for calculating the resistance of the resistance heater.

[0091] The second resistance information could be the resistance of the resistance heater.

[0092] The parameter information can be the various parameters that make up the formula for calculating the first resistance.

[0093] In some embodiments of this application, the formula for calculating the second resistance of the resistance heater can be the formula shown in formula (5) below:

[0094]

[0095] In the above formula (5), R0 is the resistance at temperature T0; B is the resistivity of the resistance heater (this resistivity is a constant and is related to the model of the resistance heater); T0 is the temperature of the resistance heater when it is not working; T is the temperature of the resistance heater at the current working moment.

[0096] In some embodiments of this application, the parameters B, T0 and R0 in the above formula (5) are unknown.

[0097] Then, using the resistance heater's gear information obtained during the current simulation, and the above formula (5), the total resistance (i.e., the second resistance information) of the circuit where the resistance heater is located in the current simulation can be obtained through formula (2).

[0098] Then, based on the second resistance information, the total current of the circuit containing the resistance heater obtained from steady-state measurement, and the temperature of the circuit containing the resistance heater, the temperature rise curve of the resistance heater is fitted in reverse. The fitted temperature rise curve of the resistance heater is compared with the temperature rise curve fitted under the same conditions previously. Based on the comparison results, the parameters B, T0, and R0 in the above formula (5) are determined. Specifically, if the temperature rise curve of the resistance heater currently fitted is consistent with the temperature rise curve fitted under the same conditions previously, then the parameters B, T0, and R0 in the current formula (5) are consistent with the parameters of the temperature rise curve fitted under the same conditions previously.

[0099] In some embodiments of this application, the total current in the circuit containing the resistance heater can be obtained using an ammeter. The temperature of the circuit containing the resistance heater can be determined by the temperature of the cooling water in which the resistance heater is placed. Specifically, it can be the temperature of the cooling water in which the resistance heater is placed, because the resistance heater is placed in the cooling water, and the temperature of the cooling water is transmitted through the resistance heater; therefore, the temperature of the cooling water can be indirectly used to characterize the temperature of the resistance heater.

[0100] In some embodiments of this application, after obtaining the parameters B, T0 and R0 in formula (5) by the above method, formula (5) can be obtained, and then formula (2) can be obtained, that is, the first resistance calculation formula.

[0101] In the embodiments of the present application, second resistance information of the circuit where the resistance heater is located is obtained according to the gear information of the resistance heater and the second resistance calculation formula of the resistance heater; fitting is performed on the second resistance information as well as the current information and temperature information of the circuit where the resistance heater is located, to determine each parameter information in the first resistance calculation formula, and the first resistance calculation formula of the resistance heater is determined according to each parameter information. In this way, an accurate first resistance calculation formula of the resistance heater can be obtained, and then the target temperature of the resistance heater material at the target moment can be accurately predicted according to the first resistance calculation formula, which improves the accuracy of the predicted temperature of the resistance heater material.

[0102] Step 220: Obtain the outlet water temperature of the cooling water according to the second temperature, the first temperature of the cooling water at the first moment, the second temperature, and the first functional relational expression.

[0103] Herein, the second moment may be the moment corresponding to the next unit time step of the first moment. A unit time step may be spaced between the first moment and the second moment.

[0104] With further reference to the above example, the initial moment is 8 a.m. on April 18, 2022, the target moment is 9 a.m. on April 18, 2022, if the preset unit time step is 5 minutes, and the first moment is 8:30 a.m. on April 18, 2022, then the second moment may be 8:35 a.m. on April 18, 2022.

[0105] The first functional relational expression may be a functional relational expression between the second temperature, the first temperature of the cooling water at the first moment, and the outlet water temperature of the cooling water. The first functional relational expression may be obtained by fitting according to a single-layer heat exchange model corresponding to the resistance heater.

[0106] The outlet water temperature of the cooling water may be the temperature of the cooling water at the second moment.

[0107] In some embodiments of the present application, the functional relational expression of the second temperature, the first temperature of the cooling water at the first moment, and the outlet water temperature of the cooling water may be a formula in the form of Formula (6):

[0108]

[0109] In Formula (6), T 临时 is the second temperature; T W，out is the outlet water temperature of the cooling water; T W，in is the inlet water temperature of the cooling water; α is the heat exchange coefficient between the material plate and the cooling water; A is the area of the material plate; is the mass flow rate of the cooling water; C p水 is the constant-pressure specific heat of the cooling water. The outlet water temperature of the cooling water, that is, the temperature of the cooling water at the second moment, can be calculated according to Formula (6).

[0110] Step 230: Determine the fourth temperature of the material board based on the outlet water temperature.

[0111] The fourth temperature can be the temperature of the material plate at the second moment.

[0112] In some embodiments of this application, in order to accurately calculate the fourth temperature of the material plate, step 230 may specifically include:

[0113] Based on the energy conservation formula of cooling water, and the first temperature of cooling water at the first moment and the outlet temperature of cooling water, the second heat transferred from the material plate to the cooling water is obtained.

[0114] Based on the third temperature of the material plate and the second temperature of the external environment at the first moment, as well as the heat exchange principle between the material plate and the external environment, the third heat transferred from the material plate to the external environment is obtained.

[0115] Based on the second and third heat sources, as well as the third temperature, the fourth temperature of the material plate after heat transfer to the external environment is obtained.

[0116] The energy conservation formula for cooling water can be expressed as follows (7):

[0117]

[0118] In formula (7), C p水 The specific heat at constant pressure of cooling water; dT is the mass flow rate of the cooling water. w It is the difference between the inlet temperature of the cooling water (i.e., the first temperature of the cooling water at the first moment) and the outlet temperature (the outlet temperature of the cooling water at the second moment).

[0119] According to the above formula (7), the amount of heat transferred from the material plate to the cooling water per unit length can be obtained.

[0120] The amount of heat transferred from the material plate to the cooling water per unit length is integrated over the length from the inlet to the outlet of the material plate to obtain the second amount of heat transferred from the material plate to the cooling water.

[0121] The heat exchange principle between the material plate and the external environment can be expressed by the following formula (8):

[0122] Q = α * A * (T) 铝 -T abs (8)

[0123] In formula (8), α is the heat transfer coefficient between the material plate and the external environment; A is the area of ​​the material plate; T abs The second temperature of the external environment at the first moment; T 铝This is the third temperature of the material plate.

[0124] The third heat transfer from the material plate to the external environment can be calculated using the above formula (8).

[0125] Then, the second heat, the third heat, and the third temperature of the material plate are substituted into formula (9) to obtain the fourth temperature of the material plate after the material plate transfers heat to the external environment.

[0126]

[0127] In formula (9), T end The fourth temperature of the material plate after it has transferred heat to the external environment; T 临时 The third temperature of the material plate; Q 水 The second heat transferred from the material plate to the cooling water; Q 环 The third type of heat transferred from the material plate to the external environment; m is the mass of the aluminum plate; C p铝 This is the specific heat of the aluminum plate.

[0128] In the embodiments of this application, during each iteration, the second temperature of the material plate after the resistive heater heats the material plate is obtained based on the first temperature of the material plate at the first moment, the gear information of the number of resistive heaters in the parallel circuit where the resistive heater is located, and the first heat transfer relationship between the resistive heater and the material plate. Based on the second temperature and the first temperature of the cooling water at the first moment, and the functional relationship between the second temperature, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water obtained by fitting the single-layer heat transfer model corresponding to the resistive heater, the fourth temperature of the material plate is determined based on the outlet temperature. In this way, by using the circuit characteristics to inversely fit the characteristics of the thermistor, a resistive heater heating model for dynamically predicting the temperature of the resistive heater material can be built. Thus, when predicting the target temperature of the resistive heater material at the target moment, the constructed resistive heater heating model is used for temperature prediction, eliminating the need for manual prediction based on experience, thereby improving the accuracy and efficiency of the predicted temperature of the resistive heater material.

[0129] In the embodiments of this application, the second heat transferred from the material plate to the cooling water is obtained by using the energy conservation formula of the cooling water, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water; the third heat transferred from the material plate to the external environment is obtained by using the third temperature of the material plate, the second temperature of the external environment at the first moment, and the heat exchange principle formula between the material plate and the external environment; the fourth temperature of the material plate after transferring heat to the external environment is obtained by using the second heat, the third heat, and the third temperature. In this way, the accurate fourth temperature of the material plate after transferring heat to the external environment can be obtained, that is, the temperature of the material plate at the second moment. Furthermore, the target temperature of the resistance heater material at the target moment can be accurately predicted based on the fourth temperature, thereby improving the accuracy of the predicted temperature of the resistance heater material.

[0130] In some embodiments of this application, since the functional relationship between the second temperature, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water is obtained by fitting the single-layer heat transfer model corresponding to the resistance heater, in order to accurately predict the target temperature of the resistance heater material at the target moment and improve the accuracy of the predicted temperature of the resistance heater material, a single-layer heat transfer model that can dynamically predict the temperature of the resistance heater material must first be constructed.

[0131] In some embodiments of this application, in order to accurately predict the target temperature of the resistance heater material at the target time, the above-mentioned method for predicting the temperature of the resistance heater material may further include, before step 110:

[0132] Based on the first resistance calculation formula of the resistance heater, the electric power of the resistance heater, the mass of the material plate surrounding the resistance heater and the specific heat of the material plate, the third temperature of the material plate after the resistance heater heats the material plate is obtained.

[0133] Based on the third temperature and the heat transfer principle between the material plate and the cooling water, the second heat transfer relationship between the second temperature and the cooling water is obtained.

[0134] Based on the energy conservation formula of cooling water and the second heat transfer relationship, the model parameters of the single-layer heat transfer model corresponding to the resistance heater are obtained by integrating from the inlet to the outlet of the material plate.

[0135] Based on the model parameters, construct a resistance heater model.

[0136] The resistance heater model can be used to characterize the area of ​​the material plate, the heat transfer coefficient between the material plate and the cooling water, and the first correspondence. This first correspondence can be the correspondence between a first temperature, the inlet temperature of the cooling water, and the inlet temperature of the cooling water.

[0137] The second heat transfer relationship can be the heat transfer relationship between the second temperature and the cooling water.

[0138] In some embodiments of this application, the resistance heater model can be regarded as Figure 3 The single-layer heat transfer model 300 is shown. In... Figure 3 In the diagram, 310 represents the material plate that wraps around the resistance heater, the lower side of the material plate is the cooling water, the right side of the material plate is the external environment, and 320 represents the electrical charge applied to the resistance heater.

[0139] against Figure 3 In the model shown, electrical power directly enters the resistance heater to heat the material plate through heat conduction. The material plate, cooling water, and external environment undergo convective heat exchange. When the power reaches equilibrium, it has the characteristics shown in the following formula (10):

[0140] Q 电 =Q 水 +Q abs (10)

[0141] In formula (10), Q 电 Q is the amount of heat used to heat the material plate. 水 The heat of cooling water; Q abs This refers to the heat generated by the external environment.

[0142] In some embodiments of this application, during the heating process, the electric power directly enters the heating material plate, causing the material plate to heat up. Then, the material plate undergoes convective heat exchange with the cooling water and the external environment. In the dynamic simulation, a temporary temperature is needed to distinguish between the two heat exchange steps in each time step, so that formula (1) and formula (9) can be obtained.

[0143] In some embodiments of this application, the heat of the resistance heater (i.e., Q in formula (1)) is obtained based on the electrical power applied by the resistance heater. 电 Then, based on the parameter T0 in the first resistance calculation formula in formula (2) (at this time, since temperature prediction has not yet been performed, T0 here is the parameter T0 obtained after fitting according to the above calculation formula (5), rather than the first temperature of the material plate at the first moment), as well as the mass of the material plate wrapping the resistance heater and the specific heat of the material plate, the third temperature of the material plate after the resistance heater heats the material plate (i.e., T in formula (1)) can be obtained according to formula (1). 临时 ).

[0144] Based on this third temperature and formula (9), the final temperature of the aluminum plate after heat transfer to the external environment can be obtained (i.e., T in formula (9)). end ).

[0145] Then, based on the final temperature of the aluminum plate after heat transfer to the external environment, and the heat exchange principle between the material plate and the cooling water, the second heat exchange relationship between the second temperature and the cooling water is obtained as shown in the following formula (11).

[0146] Q=α*dA*(T 临时 -T W )=α*L c dx*(T 临时 -T W (11)

[0147] In formula (11), α is the heat transfer coefficient between the material plate and the cooling water; L c T represents the characteristic length of the material plate, indicating the heat transfer area per unit length; 临时 The third temperature; T W This refers to the temperature of the cooling water.

[0148] Then, based on the energy conservation formula of cooling water shown in formula (7) and the second heat transfer relationship, the model parameters of the single-layer heat transfer model corresponding to the resistance heater can be obtained by integrating from the inlet to the outlet of the material plate, and thus the parameters in formula (6) can be obtained.

[0149] Then, based on these parameters, we can obtain formula (6), which is the resistance heater model.

[0150] In the embodiments of this application, the third temperature of the material plate after the resistance heater heats the material plate is obtained by calculating the first resistance of the resistance heater, the electric power of the resistance heater, the mass of the material plate surrounding the resistance heater, and the specific heat of the material plate. Based on the third temperature and the heat transfer principle between the material plate and the cooling water, the second heat transfer relationship between the second temperature and the cooling water is obtained. Based on the energy conservation formula of the cooling water and the second heat transfer relationship, the model parameters of the single-layer heat transfer model corresponding to the resistance heater are obtained by integrating from the inlet to the outlet of the material plate. Based on the model parameters, a resistance heater model can be constructed. Thus, the temperature of the resistance heater material at each moment can be dynamically predicted based on the model. In the embodiments of this application, the temporary temperature (i.e., the third temperature) within the time step is used to reflect the heat transfer at different time scales, which can reflect the common physical processes and improve the accuracy of the personalized model.

[0151] It should be noted that the material temperature prediction method for resistance heaters provided in this application embodiment can be executed by a material temperature prediction device for resistance heaters, or by a control module in the material temperature prediction device for executing the material temperature prediction method for resistance heaters.

[0152] Based on the same inventive concept as the above-described method for predicting the material temperature of a resistance heater, this application also provides a device for predicting the material temperature of a resistance heater. The following is in conjunction with... Figure 4 The resistance heater material temperature prediction device provided in the embodiments of this application will be described in detail.

[0153] Figure 4 This is a schematic diagram of the structure of a resistance heater material temperature prediction device according to an exemplary embodiment.

[0154] like Figure 4 As shown, the resistance heater material temperature prediction device 400 may include:

[0155] The acquisition module 410 is used to acquire the first temperature of the resistance heater material at the initial moment, the resistance heater's setting information, and the target time; the resistance heater material includes cooling water and a material plate that wraps the resistance heater.

[0156] The first determining module 420 is used to determine the number of unit time steps required from the initial time to the target time based on a preset unit time step.

[0157] The second determining module 430 is used to perform a set number of iterative calculations based on the first temperature and the gear information of the resistance heater to obtain the target temperature of the resistance heater material at the target time; wherein the set number of calculations is equal to the quantity.

[0158] In the embodiments of this application, the initial temperature of the resistance heater material, the resistance heater's setting information, and the target time are obtained by the acquisition module. Then, the number of unit time steps required from the initial time to the target time is determined by the first determination module. Then, the second determination module performs a set number of iterative calculations based on the initial temperature of the resistance heater material and the resistance heater's setting information to obtain the target temperature of the resistance heater material at the target time. In this way, when predicting the target temperature of the resistance heater material at the target time, there is no need for human prediction based on experience, which improves the accuracy and efficiency of the predicted temperature of the resistance heater material.

[0159] In some embodiments of this application, the calculation process of the second determining module 430 in each iteration includes:

[0160] Based on the first temperature of the material plate at a first moment, the gear information of the resistance heater, and the first heat transfer relationship between the resistance heater and the material plate, the second temperature of the material plate after the resistance heater heats the material plate is obtained; wherein, the initial value of the first moment is the initial moment; the gear information is used to characterize the number of resistance heaters in the parallel circuit in which the resistance heater is located;

[0161] The outlet temperature of the cooling water is obtained based on the second temperature, the first temperature of the cooling water at the first moment, and the first functional relationship; wherein, the outlet temperature of the cooling water is the temperature of the cooling water at the second moment; the interval between the first moment and the second moment is a unit time step; the first functional relationship is obtained by fitting the single-layer heat transfer model corresponding to the resistance heater; the first functional relationship is a functional relationship between the second temperature, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water;

[0162] Based on the outlet water temperature, a fourth temperature of the material plate is determined; wherein the fourth temperature is the temperature of the material plate at the second moment.

[0163] In some embodiments of this application, to further improve the accuracy of the predicted temperature of the resistance heater material, the second determining module 430 may specifically be used for:

[0164] Based on the first temperature of the material plate at the first moment, the setting information of the resistance heater, and the calculation formula of the first resistance of the circuit where the resistance heater is located, the first resistance information of the circuit where the resistance heater is located is obtained.

[0165] Based on the first resistance information, the first heat of the resistance heater is calculated;

[0166] Based on the first heat and the first heat transfer relationship between the resistance heater and the material plate, the second temperature of the material plate after the resistance heater heats the material plate is obtained.

[0167] In some embodiments of this application, to further improve the accuracy of the predicted temperature of the resistance heater material, the second determining module 430 may also be used for:

[0168] Based on the energy conservation formula of the cooling water, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water, the second heat transferred from the material plate to the cooling water is obtained.

[0169] Based on the third temperature of the material plate and the second temperature of the external environment at the first moment, as well as the heat exchange principle between the material plate and the external environment, the third heat transferred by the material plate to the external environment is obtained.

[0170] Based on the first heat and the second heat, as well as the third temperature, a fourth temperature of the material plate after the material plate transfers heat to the external environment is obtained.

[0171] In some embodiments of this application, in order to accurately predict the target temperature of the resistance heater material at a target time, the aforementioned resistance heater material temperature prediction device may further include:

[0172] The third determining module is used to obtain the third temperature of the material plate after the resistance heater heats the material plate, based on the first resistance calculation formula of the resistance heater, the electric power of the resistance heater, the mass of the material plate surrounding the resistance heater and the specific heat of the material plate.

[0173] The fourth determining module is used to obtain a second heat transfer relationship between the second temperature and the cooling water based on the third temperature and the heat transfer principle between the material plate and the cooling water.

[0174] The fifth determining module is used to integrate from the inlet to the outlet of the material plate according to the energy conservation formula of the cooling water and the second heat transfer relationship to obtain the model parameters of the single-layer heat transfer model corresponding to the resistance heater.

[0175] The sixth determining module is used to construct the resistance heater model according to the model parameters; wherein the resistance heater model is used to characterize the area of ​​the material plate, the heat transfer coefficient between the material plate and the cooling water, and a first correspondence; wherein the first relationship is the correspondence between the first temperature, the inlet temperature of the cooling water, and the inlet temperature of the cooling water.

[0176] In some embodiments of this application, to further improve the accuracy of the predicted temperature of the resistance heater material, the aforementioned resistance heater material temperature prediction device may further include:

[0177] The seventh determining module is used to obtain the second resistance information of the circuit where the resistance heater is located based on the gear position information of the resistance heater and the second resistance calculation formula of the resistance heater;

[0178] The eighth determining module is used to fit the second resistance information, as well as the current and temperature information of the circuit where the resistance heater is located, to determine the parameter information in the first resistance calculation formula;

[0179] The ninth determining module is used to determine the first resistance calculation formula of the resistance heater based on the parameter information.

[0180] In some embodiments of this application, the single-layer heat transfer model corresponding to the resistance heater is:

[0181]

[0182] Among them, T 临时The second temperature; T W，out T represents the outlet temperature of the cooling water. W，in α is the inlet temperature of the cooling water; α is the heat transfer coefficient between the material plate and the cooling water; A is the area of ​​the material plate. C is the mass flow rate of the cooling water; p水 This refers to the specific heat at constant pressure of the cooling water.

[0183] The engine cooling system temperature prediction device provided in this application embodiment can be used to execute the engine cooling system temperature prediction method provided in the above method embodiments. Its implementation principle and technical effect are similar, and will not be described in detail here for the sake of brevity.

[0184] Based on the same inventive concept, embodiments of this application also provide an electronic device.

[0185] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. For example... Figure 5 As shown, the electronic device may include a processor 501 and a memory 502 storing computer programs or instructions.

[0186] Specifically, the processor 501 may include a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of the present invention.

[0187] Memory 502 may include mass storage for data or instructions. For example, and not limitingly, memory 502 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 502 may include removable or non-removable (or fixed) media. Where appropriate, memory 502 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 502 is non-volatile solid-state memory. Memory may include read-only memory (ROM), random-access memory (RAM), disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical / tangible memory storage devices. Therefore, typically, a memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described in the resistance heater material temperature prediction method provided in the above embodiments.

[0188] The processor 501 reads and executes computer program instructions stored in the memory 502 to implement any of the resistance heater material temperature prediction methods in the above embodiments.

[0189] In one example, the electronic device may also include a communication interface 503 and a bus 510. Wherein, as... Figure 5 As shown, the processor 501, memory 502, and communication interface 503 are connected through bus 510 and complete communication with each other.

[0190] The communication interface 503 is mainly used to realize communication between various modules, devices, units and / or devices in the embodiments of the present invention.

[0191] Bus 510 includes hardware, software, or both, that couples components of an electronic device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 510 may include one or more buses. Although specific buses are described and illustrated in embodiments of the invention, the invention contemplates any suitable bus or interconnect.

[0192] This electronic device can execute the resistance heater material temperature prediction method in the embodiments of the present invention, thereby achieving... Figure 1 and Figure 2 A method for predicting the material temperature of a resistance heater is described.

[0193] Furthermore, in conjunction with the resistance heater material temperature prediction method in the above embodiments, this invention can be implemented using a readable storage medium. This readable storage medium stores program instructions; when these program instructions are executed by a processor, they implement any of the resistance heater material temperature prediction methods in the above embodiments.

[0194] Furthermore, in conjunction with the resistance heater material temperature prediction method in the above embodiments, this invention can be implemented in a vehicle. The vehicle includes the resistance heater material temperature prediction device, the resistance heater material temperature prediction equipment, and the computer-readable storage medium described in the above embodiments.

[0195] It should be clarified that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of the present invention.

[0196] The functional blocks shown in the above-described structural diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this invention are programs or code segments used to perform the required tasks. The programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried in a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0197] It should also be noted that the exemplary embodiments mentioned in this invention describe methods or systems based on a series of steps or apparatus. However, this invention is not limited to the order of the steps described above; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0198] The aspects of this application have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by dedicated hardware performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0199] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the term "comprising" or any other variations thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0200] The above description is merely a specific embodiment of the present invention. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the protection scope of the present invention.

Claims

1. A method for predicting the material temperature of a resistance heater, characterized in that, The method includes: The system acquires the initial temperature of the resistance heater material, the resistance heater's setting information, and the target time; wherein the resistance heater material includes cooling water and a material plate encasing the resistance heater. Based on the preset unit time step, determine the number of unit time steps required from the initial time to the target time; Based on the first temperature and the setting information of the resistance heater, a set number of iterative calculations are performed to obtain the target temperature of the resistance heater material at the target time; wherein, the set number of calculations is equal to the quantity. Each iteration of the calculation process includes: Based on the first temperature of the material plate at a first moment, the gear information of the resistance heater, and the first heat transfer relationship between the resistance heater and the material plate, the second temperature of the material plate after the resistance heater heats the material plate is obtained; wherein, the initial value of the first moment is the initial moment; the gear information is used to characterize the number of resistance heaters in the parallel circuit in which the resistance heater is located; The outlet temperature of the cooling water is obtained based on the second temperature, the first temperature of the cooling water at the first moment, and the first functional relationship; wherein, the outlet temperature of the cooling water is the temperature of the cooling water at the second moment; the interval between the first moment and the second moment is a unit time step; the first functional relationship is obtained by fitting the single-layer heat transfer model corresponding to the resistance heater; the first functional relationship is a functional relationship between the second temperature, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water; Based on the outlet water temperature, a fourth temperature of the material plate is determined; wherein the fourth temperature is the temperature of the material plate at the second moment.

2. The method for predicting the material temperature of a resistance heater according to claim 1, characterized in that, The step of obtaining the second temperature of the material plate after the resistance heater heats the material plate, based on the first temperature of the material plate at a first moment, the setting information of the resistance heater, and the first heat transfer relationship between the resistance heater and the material plate, includes: Based on the first temperature of the material plate at the first moment, the setting information of the resistance heater, and the calculation formula of the first resistance of the circuit where the resistance heater is located, the first resistance information of the circuit where the resistance heater is located is obtained. Based on the first resistance information, the first heat of the resistance heater is calculated; Based on the first heat and the first heat transfer relationship between the resistance heater and the material plate, the second temperature of the material plate after the resistance heater heats the material plate is obtained.

3. The method for predicting the material temperature of a resistance heater according to claim 2, characterized in that, Determining the fourth temperature of the material plate based on the outlet water temperature includes: Based on the energy conservation formula of the cooling water, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water, the second heat transferred from the material plate to the cooling water is obtained. Based on the second temperature of the material plate and the second temperature of the external environment at the first moment, as well as the heat exchange principle between the material plate and the external environment, the third heat transferred by the material plate to the external environment is obtained. Based on the second heat and the third heat, and the second temperature of the material plate, the fourth temperature of the material plate after heat transfer to the external environment is obtained.

4. The method for predicting the material temperature of a resistance heater according to claim 1, characterized in that, Before acquiring the first temperature of the resistance heater material at its initial moment, the resistance heater's setting information, and the target moment, the method further includes: Based on the first resistance calculation formula of the resistance heater, the electric power of the resistance heater, the mass of the material plate surrounding the resistance heater and the specific heat of the material plate, the third temperature of the material plate after the resistance heater heats the material plate is obtained; Based on the third temperature and the heat exchange principle between the material plate and the cooling water, a second heat exchange relationship between the third temperature and the cooling water is obtained; Based on the energy conservation formula of the cooling water and the second heat transfer relationship, the model parameters of the single-layer heat transfer model corresponding to the resistance heater are obtained by integrating from the inlet to the outlet of the material plate. Based on the model parameters, a single-layer heat transfer model corresponding to the resistance heater is constructed; wherein, the single-layer heat transfer model corresponding to the resistance heater is used to characterize the area of ​​the material plate, the heat transfer coefficient between the material plate and the cooling water, and the first correspondence relationship; wherein, the first correspondence relationship is the correspondence relationship between the first temperature, the inlet temperature of the cooling water and the outlet temperature of the cooling water.

5. The method for predicting the material temperature of a resistance heater according to claim 4, characterized in that, Before obtaining the third temperature of the material plate after the resistance heater has heated it, based on the first resistance calculation formula of the resistance heater, the electrical power of the resistance heater, the mass of the material plate surrounding the resistance heater, and the specific heat of the material plate, the method further includes: Based on the setting information of the resistance heater and the second resistance calculation formula of the resistance heater, the second resistance information of the circuit where the resistance heater is located is obtained; The second resistance information, as well as the current and temperature information of the circuit where the resistance heater is located, are fitted to determine the parameter information in the first resistance calculation formula; Based on the parameter information, the first resistance calculation formula for the resistance heater is determined.

6. The method for predicting the material temperature of a resistance heater according to any one of claims 1-5, characterized in that, The single-layer heat transfer model corresponding to the resistance heater is: in, The second temperature of the material plate after the resistance heater heats the material plate; This refers to the outlet temperature of the cooling water. This refers to the inlet temperature of the cooling water. The heat transfer coefficient between the material plate and the cooling water; The area of ​​the material plate; The mass flow rate of the cooling water; This refers to the specific heat at constant pressure of the cooling water.

7. A device for predicting the material temperature of a resistance heater, characterized in that, The device includes: The acquisition module is used to acquire the initial temperature of the resistance heater material, the resistance heater's setting information, and the target time; the resistance heater material includes cooling water and a material plate that wraps the resistance heater. The first determining module is used to determine the number of unit time steps required from the initial time to the target time based on a preset unit time step. The second determining module is used to perform a set number of iterative calculations based on the first temperature and the gear information of the resistance heater to obtain the target temperature of the resistance heater material at the target time. The second determination module's calculation process for each iteration includes: Based on the first temperature of the material plate at a first moment, the gear information of the resistance heater, and the first heat transfer relationship between the resistance heater and the material plate, the second temperature of the material plate after the resistance heater heats the material plate is obtained; wherein, the initial value of the first moment is the initial moment; the gear information is used to characterize the number of resistance heaters in the parallel circuit in which the resistance heater is located; The outlet temperature of the cooling water is obtained based on the second temperature, the first temperature of the cooling water at the first moment, and the first functional relationship; wherein, the outlet temperature of the cooling water is the temperature of the cooling water at the second moment; the interval between the first moment and the second moment is a unit time step; the first functional relationship is obtained by fitting the single-layer heat transfer model corresponding to the resistance heater; the first functional relationship is a functional relationship between the second temperature, the first temperature of the cooling water at the first moment, and the outlet temperature of the cooling water; Based on the outlet water temperature, a fourth temperature of the material plate is determined; wherein the fourth temperature is the temperature of the material plate at the second moment.

8. A device for predicting the material temperature of a resistance heater, characterized in that, The resistance heater material temperature prediction device includes: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, it implements the resistance heater material temperature prediction method as described in any one of claims 1-6.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer program instructions that, when executed by a processor, implement the method for predicting the material temperature of a resistance heater as described in any one of claims 1-6.

10. A vehicle, characterized in that, The vehicle includes at least one of the following: The resistance heater material temperature prediction device as described in claim 7; The resistance heater material temperature prediction device as described in claim 8; The computer-readable storage medium as described in claim 9.

Images