Air conditioner bypass-based vehicle-mounted T-BOX and gateway fusion heat dissipation structure, method and automobile
Patent Information
- Application Number
- CN202311278919.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-28
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2043-09-28
AI Technical Summary
[0005]虽然上述技术方案具有对应的优点,但是将车载T-BOX与网关融合在一个设备上后,由于车载T-BOX与网关的散热量较大,依靠单独的风机来进行散热,可能无法达到较好的散热效果,此时,空调系统作为车辆的制冷系统,将空调系统的部分冷气输送至车载T-BOX与网关部位进行散热具有便携的优势
[0022]1、本发明通过设置的第一散热孔和第二散热孔,能够正常进行散热操作,通过设置的散热鳍片和散热片,能够进行导热操作,达到散热导热的效果。
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Figure CN117295307B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of automotive parts technology, and more specifically, to a vehicle-mounted T-BOX and gateway integrated heat dissipation structure, method, and vehicle based on air conditioning bypass. Background Technology
[0002] The in-vehicle T-BOX, also known as a vehicle networking system, mainly consists of four parts: a host unit, the in-vehicle T-BOX, a mobile app, and a backend system. The host unit is mainly used for in-vehicle audio-visual entertainment and vehicle information display. The in-vehicle T-BOX is mainly used to communicate with the backend system / mobile app to realize vehicle information display and control via the mobile app. The gateway refers to the interconnection device that enables network interconnection at the transmission layer. For the in-vehicle T-BOX to communicate with the backend system / mobile app, a gateway must be installed as a prerequisite. Currently, most in-vehicle T-BOXs and gateways are set up separately. When set up separately, since both the T-BOX and the gateway have external casings, the two casings occupy a lot of space. In addition, wiring is required externally, resulting in numerous wires and inconvenience to users. Currently, many car manufacturers have conducted in-depth research on integrating the in-vehicle T-BOX and gateway into a single device to reduce space occupation and external wiring hassles.
[0003] Chinese patent application CN113895211A discloses a control device, method, and air conditioner for an automotive air conditioner. The device includes: a data acquisition unit configured to acquire the current level of condensate in the drip tray and the vehicle's speed and acceleration during operation of the vehicle; a control unit configured to determine the road surface smoothness based on gravitational acceleration, vehicle speed, and acceleration; and to control the start or stop of a DC water pump based on the current level of condensate in the drip tray and the road surface smoothness to adjust the current level of condensate in the drip tray. This solution, by regulating the amount of condensate in the drip tray of the automotive air conditioner, prevents leakage of the air conditioner during vehicle operation.
[0004] Patent CN116638928A discloses an air conditioning outlet temperature control device and control method, and an automobile, relating to the field of automotive air conditioning accessories technology. The device, located within an air conditioning outlet duct, includes a first blade and a second blade. The first blade is rotatably mounted on one side of the air conditioning outlet duct; the second blade is rotatably mounted on the other side. By rotating the first blade and / or the second blade to a set position, the diameter of the air inlet and outlet sides of the air conditioning outlet duct is adjusted. This invention, through the coordinated rotation of the first and second blades, forms a gas channel with varying diameter at the air conditioning outlet, causing changes in gas velocity and generating a temperature difference as the gas flows through, thereby accelerating the cooling or heating speed of the vehicle's air conditioning system. It also provides an automatic operating procedure for controlling the air conditioning outlet temperature control device, facilitating user operation. Automobiles equipped with this device experience faster cooling or heating inside the vehicle, reducing user waiting time.
[0005] While the aforementioned technical solutions have their respective advantages, integrating the vehicle-mounted T-BOX and gateway into a single device presents challenges. Due to the significant heat dissipation of the T-BOX and gateway, relying solely on individual fans for cooling may not achieve optimal results. Therefore, utilizing the air conditioning system as the vehicle's cooling system, by directing a portion of the cool air to the T-BOX and gateway for heat dissipation, offers a portability advantage. In light of this, we propose a heat dissipation structure, method, and vehicle based on an air conditioning bypass for the integrated cooling system of the vehicle-mounted T-BOX and gateway. Summary of the Invention
[0006] The purpose of this invention is to provide a heat dissipation structure, method, and vehicle based on an air conditioning bypass-in-vehicle T-BOX and gateway integration, in order to solve the defects mentioned in the background art.
[0007] To achieve the above objectives, the present invention provides the following technical solution:
[0008] One objective of this invention is to provide a fusion heat dissipation structure for an in-vehicle T-BOX and gateway based on an air conditioning bypass, comprising an outer frame plate and a support plate disposed below the outer frame plate. An in-vehicle T-BOX motherboard is fixedly mounted at the center of the outer frame plate, and a gateway motherboard is fixedly mounted at the center of the support plate. A central bracket is provided between the outer frame plate and the support plate, and a wiring hole is provided at the center of the central bracket for electrical connection between the in-vehicle T-BOX motherboard and the gateway motherboard. A fixing ring is fixedly mounted on one side of the central bracket, and a fan is fixedly mounted on the inner wall of the fixing ring for heat dissipation between the in-vehicle T-BOX motherboard and the gateway motherboard.
[0009] As a preferred embodiment of the present invention, guide sleeves are fixedly installed at the four corners of the central support, and the central support is located at half the height of the guide sleeves. The two ends of the guide sleeves are respectively inserted and engaged with the outer frame plate and the support plate to support the central support, so that the central support will not squeeze the electronic components on the vehicle T-BOX motherboard and the gateway motherboard and cause damage.
[0010] As a preferred embodiment of the present invention, the support plate is provided with a lower cover on its exterior. The outer frame plate, the support plate, and the corresponding guide sleeve are fixedly installed on the bottom surface of the lower cover by the same fastening screw for fixed installation operation and normal assembly and use.
[0011] As a preferred embodiment of the present invention, a plurality of heat dissipation fins are fixedly installed on the bottom wall of the lower cover in a linear and equidistant arrangement. The end plates of the heat dissipation fins extend to the outside of the lower cover. The number of heat dissipation fins is 10 to 30, and the distance between two adjacent heat dissipation fins is 2 mm to 4 mm, which facilitates the use of heat dissipation fins for heat dissipation between the lower cover and the gateway motherboard.
[0012] As a preferred embodiment of the present invention, temperature sensors are fixedly installed on both the inner wall and the outer surface of the lower cover. The two temperature sensors are used to measure the temperature inside and outside the lower cover, respectively, so as to facilitate real-time monitoring of the temperature inside and outside the lower cover.
[0013] As a preferred embodiment of the present invention, the left and right side plates of the lower cover are provided with first heat dissipation holes that communicate with the outside. An external pipe is fixedly installed on the front plate of the lower cover. An air inlet pipe is connected to the flange at the end of the external pipe. A tee pipe is fixedly installed at the end of the air inlet pipe. A tee valve is fixedly installed on the tee pipe. An air conditioning duct for connecting to the vehicle's air conditioning duct is fixedly installed on one of the tee pipes. An air hood for conveying outside air is fixedly installed on the remaining tee pipe, so that the air conditioning duct or outside cold air can be introduced for heat dissipation by changing the connection of the tee pipe.
[0014] As a preferred embodiment of the present invention, an air hood fixing frame is fixedly installed at the end of the air hood, and a dust filter is detachably connected inside the air hood fixing frame. The dust filter is used to filter the air so that dust does not enter the vehicle T-BOX motherboard and gateway motherboard.
[0015] As a preferred embodiment of the present invention, a lower limiting frame is fixedly installed on the top shell of the lower cover, and an upper cover is provided above the lower cover. Second heat dissipation holes for ventilation and heat dissipation are provided on both the left and right side plates of the upper cover. Multiple heat dissipation fins arranged linearly and at equal intervals are fixedly installed on the top plate of the upper cover. The distance between two adjacent heat dissipation fins is 3mm to 6mm, and the number of heat dissipation fins is 10 to 30. The number of second heat dissipation holes on each side is 3 to 6. An upper limiting frame is fixedly installed on the shell of the upper cover. The upper limiting frame and the lower limiting frame are fixedly connected by multiple fastening screws, facilitating heat dissipation using the second heat dissipation holes and heat dissipation fins. Furthermore, the upper and lower limiting frames facilitate fixed installation.
[0016] The second objective of this invention is to provide a heat dissipation method for a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, including the aforementioned vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass. The heat dissipation method includes the following steps:
[0017] S1. Temperature detection: The temperature outside the lower cover is detected by a temperature sensor located outside the lower cover, and the temperature inside the lower cover is detected by a temperature sensor located inside the lower cover. During the temperature detection process, the following two situations may occur: one is that the temperature outside the lower cover is lower than the temperature inside the lower cover, and the other is that the temperature outside the lower cover is higher than the temperature inside the lower cover.
[0018] S2. If the temperature outside the lower cover is lower than the temperature inside the lower cover, open the three-way valve to connect the air hood with the air inlet pipe, then start the fan to make the fan work, so as to deliver the low-temperature outside air to the space between the upper and lower covers to dissipate heat from the vehicle T-BOX motherboard and gateway motherboard. The heat is discharged outward through the first and second heat dissipation holes.
[0019] S3. If the temperature outside the lower cover is greater than the temperature inside the lower cover, and the temperature inside the lower cover still exceeds the standard value even with the fan working to dissipate heat, the three-way valve opens to connect the air conditioning duct and the air intake duct. If the vehicle's air conditioning system is already on, the air conditioning duct connects to the pipes in the vehicle's air conditioning system, and a suitable amount of cold air from the vehicle's air conditioning system enters the lower cover through the air conditioning duct and the air intake duct to work with the fan to dissipate heat. If the vehicle's air conditioning system is not on, the temperature inside the lower cover exceeding the standard value is transmitted to the vehicle's central control unit in real time. The vehicle's central control unit automatically turns on the vehicle's air conditioning system and closes the air ducts entering the vehicle's interior from the air conditioning system for cooling.
[0020] A third objective of this invention is to provide an automobile, including the aforementioned integrated heat dissipation structure of the vehicle-mounted T-BOX and gateway based on air conditioning bypass, and a connecting component for mounting and connecting the integrated heat dissipation structure of the vehicle-mounted T-BOX and gateway based on air conditioning bypass.
[0021] Compared with the prior art, the beneficial effects of the present invention are:
[0022] 1. The present invention can perform heat dissipation operation normally through the first heat dissipation hole and the second heat dissipation hole, and can perform heat conduction operation through the heat dissipation fins and heat sink, so as to achieve the effect of heat dissipation and heat conduction.
[0023] 2. This invention uses a central support and a fan to separate the vehicle-mounted T-BOX motherboard and the gateway motherboard by a certain distance, so that the vehicle-mounted T-BOX motherboard and the gateway motherboard will not interfere with each other. In addition, the operation of the fan can perform heat dissipation and improve the heat dissipation effect.
[0024] 3. Through the configuration of components such as the three-way pipe, this invention can deliver an appropriate amount of cold air from the vehicle's air conditioning system to the space between the lower and upper covers for cooling and heat dissipation, thereby achieving a better heat dissipation effect. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the overall structure provided for an embodiment of the present invention;
[0027] Figure 2 This is one of the exploded structural diagrams provided in the embodiments of the present invention;
[0028] Figure 3 This is the second schematic diagram of the exploded structure provided in the embodiment of the present invention;
[0029] Figure 4 This is the third schematic diagram of the exploded structure provided in the embodiment of the present invention;
[0030] Figure 5 This is one of the structural schematic diagrams provided in the embodiments of the present invention;
[0031] Figure 6 This is a second partial structural schematic diagram provided for an embodiment of the present invention;
[0032] Figure 7This is the third partial structural schematic diagram provided for an embodiment of the present invention;
[0033] Figure 8 A flowchart of a heat dissipation system provided in an embodiment of the present invention.
[0034] The following are the labeling elements in the figure:
[0035] 1. Outer frame panel; 10. Vehicle T-BOX mainboard; 2. Support plate; 20. Gateway mainboard; 3. Center bracket; 30. Wiring hole; 31. Guide sleeve; 32. Fixing ring; 33. Fan; 4. Lower cover; 40. Heat sink fins; 41. Temperature sensor; 42. First heat dissipation hole; 43. External pipe; 44. Air inlet pipe; 45. T-pipe; 451. T-valve; 46. Air conditioning duct; 47. Air shroud; 48. Air shroud fixing frame; 481. Dust filter; 49. Lower limit frame; 5. Upper cover; 50. Second heat dissipation hole; 51. Heat sink; 52. Upper limit frame. Detailed Implementation
[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0037] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0038] Example 1
[0039] Please see Figures 1-8As shown, this embodiment provides a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, including an outer frame plate 1 and a support plate 2 disposed below the outer frame plate 1. The vehicle-mounted T-BOX motherboard 10 is fixedly installed at the center of the outer frame plate 1, and the gateway motherboard 20 is fixedly installed at the center of the support plate 2. A central bracket 3 is provided between the outer frame plate 1 and the support plate 2. A wire hole 30 is provided at the center of the central bracket 3. The wire hole 30 is used for electrical connection between the vehicle-mounted T-BOX motherboard 10 and the gateway motherboard 20, which facilitates wire threading and enables normal data transmission between the gateway motherboard 20 and the vehicle-mounted T-BOX motherboard 10.
[0040] Specifically, a fixing ring 32 is fixedly installed on one side plate of the central support 3, and a fan 33 is fixedly installed on the inner wall of the fixing ring 32. The fan 33 is used to dissipate heat between the vehicle T-BOX motherboard 10 and the gateway motherboard 20.
[0041] In this embodiment, guide sleeves 31 are fixedly installed at the four corners of the central bracket 3, and the central bracket 3 is located at half the height of the guide sleeves 31. The two ends of the guide sleeves 31 are respectively inserted and engaged with the outer frame plate 1 and the support plate 2 to support the central bracket 3. This allows the vehicle T-BOX motherboard 10 and the gateway motherboard 20 to be placed on both sides of the central bracket 3 for heat dissipation. At the same time, because the guide sleeves 31 have a certain height, the central bracket 3 will not squeeze the electronic components on the vehicle T-BOX motherboard 10 and the gateway motherboard 20 and cause damage.
[0042] Example 2
[0043] Please see Figures 1-8 As shown, this embodiment provides a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, including an outer frame plate 1 and a support plate 2 disposed below the outer frame plate 1. The vehicle-mounted T-BOX motherboard 10 is fixedly installed at the center of the outer frame plate 1, and the gateway motherboard 20 is fixedly installed at the center of the support plate 2. A central bracket 3 is provided between the outer frame plate 1 and the support plate 2. A wire hole 30 is provided at the center of the central bracket 3. The wire hole 30 is used for electrical connection between the vehicle-mounted T-BOX motherboard 10 and the gateway motherboard 20, which facilitates wire threading and enables normal data transmission between the gateway motherboard 20 and the vehicle-mounted T-BOX motherboard 10.
[0044] Specifically, a fixing ring 32 is fixedly installed on one side plate of the central support 3, and a fan 33 is fixedly installed on the inner wall of the fixing ring 32. The fan 33 is used to dissipate heat between the vehicle T-BOX motherboard 10 and the gateway motherboard 20.
[0045] In this embodiment, guide sleeves 31 are fixedly installed at the four corners of the central bracket 3, and the central bracket 3 is located at half the height of the guide sleeves 31. The two ends of the guide sleeves 31 are respectively inserted and engaged with the outer frame plate 1 and the support plate 2 to support the central bracket 3. This allows the vehicle T-BOX motherboard 10 and the gateway motherboard 20 to be placed on both sides of the central bracket 3 for heat dissipation. At the same time, because the guide sleeves 31 have a certain height, the central bracket 3 will not squeeze the electronic components on the vehicle T-BOX motherboard 10 and the gateway motherboard 20 and cause damage.
[0046] Specifically, the support plate 2 is provided with a lower cover 4 on its exterior. The outer frame plate 1, the support plate 2 and the corresponding guide sleeve 31 are fixedly installed on the bottom surface of the lower cover 4 by the same fastening screw for fixed installation operation and normal assembly and use.
[0047] Furthermore, multiple heat dissipation fins 40 arranged linearly and at equal intervals are fixedly installed on the bottom wall of the lower cover 4. The end plates of the heat dissipation fins 40 extend to the outside of the lower cover 4. The number of heat dissipation fins 40 is 10 to 30, and the distance between two adjacent heat dissipation fins 40 is 2mm to 4mm, which facilitates the use of heat dissipation fins 40 to perform heat dissipation between the lower cover 4 and the gateway motherboard 20.
[0048] In addition, temperature sensors 41 are fixedly installed on both the inner wall and the outer surface of the lower cover 4. The two temperature sensors 41 are used to measure the temperature inside and outside the lower cover 4, respectively, so as to understand the temperature inside and outside the lower cover 4 in real time and to select the heat dissipation method according to the actual temperature for subsequent heat dissipation operation.
[0049] Example 3
[0050] Please see Figures 1-8 As shown, this embodiment provides a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, including an outer frame plate 1 and a support plate 2 disposed below the outer frame plate 1. The vehicle-mounted T-BOX motherboard 10 is fixedly installed at the center of the outer frame plate 1, and the gateway motherboard 20 is fixedly installed at the center of the support plate 2. A central bracket 3 is provided between the outer frame plate 1 and the support plate 2. A wire hole 30 is provided at the center of the central bracket 3. The wire hole 30 is used for electrical connection between the vehicle-mounted T-BOX motherboard 10 and the gateway motherboard 20, which facilitates wire threading and enables normal data transmission between the gateway motherboard 20 and the vehicle-mounted T-BOX motherboard 10.
[0051] Specifically, a fixing ring 32 is fixedly installed on one side plate of the central support 3, and a fan 33 is fixedly installed on the inner wall of the fixing ring 32. The fan 33 is used to dissipate heat between the vehicle T-BOX motherboard 10 and the gateway motherboard 20.
[0052] In this embodiment, guide sleeves 31 are fixedly installed at the four corners of the central bracket 3, and the central bracket 3 is located at half the height of the guide sleeves 31. The two ends of the guide sleeves 31 are respectively inserted and engaged with the outer frame plate 1 and the support plate 2 to support the central bracket 3. This allows the vehicle T-BOX motherboard 10 and the gateway motherboard 20 to be placed on both sides of the central bracket 3 for heat dissipation. At the same time, because the guide sleeves 31 have a certain height, the central bracket 3 will not squeeze the electronic components on the vehicle T-BOX motherboard 10 and the gateway motherboard 20 and cause damage.
[0053] Specifically, the support plate 2 is provided with a lower cover 4 on its exterior. The outer frame plate 1, the support plate 2 and the corresponding guide sleeve 31 are fixedly installed on the bottom surface of the lower cover 4 by the same fastening screw for fixed installation operation and normal assembly and use.
[0054] Furthermore, multiple heat dissipation fins 40 arranged linearly and at equal intervals are fixedly installed on the bottom wall of the lower cover 4. The end plates of the heat dissipation fins 40 extend to the outside of the lower cover 4. The number of heat dissipation fins 40 is 10 to 30, and the distance between two adjacent heat dissipation fins 40 is 2mm to 4mm, which facilitates the use of heat dissipation fins 40 to perform heat dissipation between the lower cover 4 and the gateway motherboard 20.
[0055] In addition, temperature sensors 41 are fixedly installed on both the inner wall and the outer surface of the lower cover 4. The two temperature sensors 41 are used to measure the temperature inside and outside the lower cover 4, respectively, so as to understand the temperature inside and outside the lower cover 4 in real time and to select the heat dissipation method according to the actual temperature for subsequent heat dissipation operation.
[0056] It is worth noting that the left and right side panels of the lower cover 4 are provided with first heat dissipation holes 42 that connect to the outside. An external pipe 43 is fixedly installed on the front side panel of the lower cover 4. An air inlet pipe 44 is connected to the flange at the end of the external pipe 43. A three-way pipe 45 is fixedly installed at the end of the air inlet pipe 44. A three-way valve 451 is fixedly installed on the three-way pipe 45. An air conditioning cold air pipe 46 for connecting to the vehicle's air conditioning pipe is fixedly installed on one of the pipes of the three-way pipe 45. An air hood 47 for supplying outside air is fixedly installed on the remaining pipe of the three-way pipe 45. This allows for the entry of air conditioning cold air or outside cold air by changing the connection of the three-way pipe 45 to perform heat dissipation operations and improve the heat dissipation effect.
[0057] It is worth noting that an air shroud fixing frame 48 is fixedly installed at the end of the air shroud 47. A dust filter 481 is detachably connected inside the air shroud fixing frame 48. Specifically, the dust filter 481 is fixedly connected to the air shroud fixing frame 48 by multiple fastening screws. The dust filter 481 is used to filter the air, so that dust will not enter the vehicle T-BOX motherboard 10 and gateway motherboard 20. In addition, it also facilitates the disassembly and cleaning of the dust filter 481.
[0058] Example 4
[0059] Please see Figures 1-8 As shown, this embodiment provides a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, including an outer frame plate 1 and a support plate 2 disposed below the outer frame plate 1. The vehicle-mounted T-BOX motherboard 10 is fixedly installed at the center of the outer frame plate 1, and the gateway motherboard 20 is fixedly installed at the center of the support plate 2. A central bracket 3 is provided between the outer frame plate 1 and the support plate 2. A wire hole 30 is provided at the center of the central bracket 3. The wire hole 30 is used for electrical connection between the vehicle-mounted T-BOX motherboard 10 and the gateway motherboard 20, which facilitates wire threading and enables normal data transmission between the gateway motherboard 20 and the vehicle-mounted T-BOX motherboard 10.
[0060] Specifically, a fixing ring 32 is fixedly installed on one side plate of the central support 3, and a fan 33 is fixedly installed on the inner wall of the fixing ring 32. The fan 33 is used to dissipate heat between the vehicle T-BOX motherboard 10 and the gateway motherboard 20.
[0061] In this embodiment, guide sleeves 31 are fixedly installed at the four corners of the central bracket 3, and the central bracket 3 is located at half the height of the guide sleeves 31. The two ends of the guide sleeves 31 are respectively inserted and engaged with the outer frame plate 1 and the support plate 2 to support the central bracket 3. This allows the vehicle T-BOX motherboard 10 and the gateway motherboard 20 to be placed on both sides of the central bracket 3 for heat dissipation. At the same time, because the guide sleeves 31 have a certain height, the central bracket 3 will not squeeze the electronic components on the vehicle T-BOX motherboard 10 and the gateway motherboard 20 and cause damage.
[0062] Specifically, the support plate 2 is provided with a lower cover 4 on its exterior. The outer frame plate 1, the support plate 2 and the corresponding guide sleeve 31 are fixedly installed on the bottom surface of the lower cover 4 by the same fastening screw for fixed installation operation and normal assembly and use.
[0063] Furthermore, multiple heat dissipation fins 40 arranged linearly and at equal intervals are fixedly installed on the bottom wall of the lower cover 4. The end plates of the heat dissipation fins 40 extend to the outside of the lower cover 4. The number of heat dissipation fins 40 is 10 to 30, and the distance between two adjacent heat dissipation fins 40 is 2mm to 4mm, which facilitates the use of heat dissipation fins 40 to perform heat dissipation between the lower cover 4 and the gateway motherboard 20.
[0064] In addition, temperature sensors 41 are fixedly installed on both the inner wall and the outer surface of the lower cover 4. The two temperature sensors 41 are used to measure the temperature inside and outside the lower cover 4, respectively, so as to understand the temperature inside and outside the lower cover 4 in real time and to select the heat dissipation method according to the actual temperature for subsequent heat dissipation operation.
[0065] It is worth noting that the left and right side panels of the lower cover 4 are provided with first heat dissipation holes 42 that connect to the outside. An external pipe 43 is fixedly installed on the front side panel of the lower cover 4. An air inlet pipe 44 is connected to the flange at the end of the external pipe 43. A three-way pipe 45 is fixedly installed at the end of the air inlet pipe 44. A three-way valve 451 is fixedly installed on the three-way pipe 45. An air conditioning cold air pipe 46 for connecting to the vehicle's air conditioning pipe is fixedly installed on one of the pipes of the three-way pipe 45. An air hood 47 for supplying outside air is fixedly installed on the remaining pipe of the three-way pipe 45. This allows for the entry of air conditioning cold air or outside cold air by changing the connection of the three-way pipe 45 to perform heat dissipation operations and improve the heat dissipation effect.
[0066] It is worth noting that an air shroud fixing frame 48 is fixedly installed at the end of the air shroud 47. A dust filter 481 is detachably connected inside the air shroud fixing frame 48. Specifically, the dust filter 481 is fixedly connected to the air shroud fixing frame 48 by multiple fastening screws. The dust filter 481 is used to filter the air, so that dust will not enter the vehicle T-BOX motherboard 10 and gateway motherboard 20. In addition, it also facilitates the disassembly and cleaning of the dust filter 481.
[0067] In this embodiment, a lower limit frame 49 is fixedly installed on the top shell of the lower cover 4, and an upper cover 5 is provided above the lower cover 4. The left and right side plates of the upper cover 5 are provided with second heat dissipation holes 50 for ventilation and heat dissipation, so that the internal heat can be discharged outward through the second heat dissipation holes 50 for heat dissipation operation.
[0068] Specifically, multiple heat sinks 51 arranged linearly and at equal intervals are fixedly installed on the top plate of the top cover 5. The distance between two adjacent heat sinks 51 is 3mm to 6mm, and the number of heat sinks 51 is 10 to 30. The number of second heat dissipation holes 50 on each side is 3 to 6, which facilitates the use of the second heat dissipation holes 50 and heat sinks 51 for heat dissipation operation, so that multiple heat sinks 51 can increase the heat dissipation area and improve the heat conduction effect.
[0069] It is worth noting that an upper limit frame 52 is fixedly installed on the housing of the upper cover 5. The upper limit frame 52 and the lower limit frame 49 are fixedly connected by multiple fastening screws. The upper limit frame 52 and the lower limit frame 49 facilitate the fixed installation operation.
[0070] Example 5
[0071] Please see Figures 1-8 As shown, this embodiment provides a heat dissipation method for a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass. The heat dissipation method includes the following steps:
[0072] S1. Temperature detection: The temperature outside the lower cover 4 is detected by a temperature sensor 41 located outside the lower cover 4, and the temperature inside the lower cover 4 is detected by a temperature sensor 41 located inside the lower cover 4. During the temperature detection process, the following two situations may occur: one is that the temperature outside the lower cover 4 is lower than the temperature inside the lower cover 4, and the other is that the temperature outside the lower cover 4 is higher than the temperature inside the lower cover 4. The specific detected temperature can be displayed on the central control display screen on the vehicle's central control host.
[0073] S2. If the temperature outside the lower cover 4 is lower than the temperature inside the lower cover 4, open the three-way valve 451 to connect the air shroud 47 with the air inlet pipe 44. At this time, the air conditioning cold air pipe 46 is not connected to the air inlet pipe 44. Then start the fan 33 to make the fan 33 work. After the fan 33 works, the low temperature outside air is transported through the air shroud 47 and the air inlet pipe 44 to the space between the upper cover 5 and the lower cover 4 to dissipate heat from the vehicle T-BOX motherboard 10 and the gateway motherboard 20. The heat is discharged outward through the first heat dissipation hole 42 and the second heat dissipation hole 50.
[0074] S3. If the temperature outside the lower cover 4 is greater than the temperature inside the lower cover 4, and the temperature inside the lower cover 4 still exceeds the standard value under the condition that the fan 33 is working normally for heat dissipation, then the three-way valve 451 opens to connect the air conditioning cold air pipe 46 and the air intake pipe 44. If the vehicle's internal air conditioning system is already on, then the air conditioning cold air pipe 46 is connected to the pipes in the vehicle's air conditioning system. A suitable amount of cold air from the vehicle's air conditioning system enters the lower cover 4 along the air conditioning cold air pipe 46 and the air intake pipe 44 and works with the fan 33 to dissipate heat. If the vehicle's internal air conditioning system is not on, the temperature inside the lower cover 4 that exceeds the standard value is transmitted to the vehicle's central control host in real time. The vehicle's central control host automatically turns on the vehicle's air conditioning system and closes the air pipes in the air conditioning system that enter the vehicle's interior for cooling. The closure of the air pipes inside the vehicle ensures that the air from the air conditioning system will not enter the passenger compartment. When the air conditioning system needs to be turned on while the vehicle is in motion, the air conditioning cold air pipe 46 still provides a suitable amount of air intake, which will not affect the normal airflow into the passenger compartment.
[0075] Finally, it should be noted that the vehicle-mounted T-BOX motherboard 10, gateway motherboard 20, fan 33, three-way valve 451, vehicle air conditioning system, vehicle central control host and central control display screen, etc. involved in this invention are all general standard parts or parts known to those skilled in the art. Their structure and principle can be known to those skilled in the art through technical manuals or conventional experimental methods. In the idle space of this device, all the above-mentioned electrical components, which refer to power components, electrical components and adapted controllers and power supplies, are connected by wires. The specific connection method should refer to the working principle in this invention. The electrical connections between each electrical component are completed in the order of operation. The detailed connection methods are all technologies known in the art.
[0076] This embodiment also provides a vehicle, including the above-mentioned vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, and a connection component for installing and connecting the vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass.
[0077] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, comprising an outer frame plate (1) and a support plate (2) disposed below the outer frame plate (1), characterized in that: The vehicle T-BOX motherboard (10) is fixedly installed at the center of the outer frame plate (1), and the gateway motherboard (20) is fixedly installed at the center of the support plate (2). A central bracket (3) is provided between the outer frame plate (1) and the support plate (2). A wire hole (30) is provided at the center of the central bracket (3). The wire hole (30) is used for electrical connection between the vehicle T-BOX motherboard (10) and the gateway motherboard (20). A fixing ring (32) is fixedly installed on one side plate of the central bracket (3). A fan (33) is fixedly installed on the inner wall of the fixing ring (32). The fan (33) is used for heat dissipation between the vehicle T-BOX motherboard (10) and the gateway motherboard (20). The support plate (2) is provided with a lower cover (4) on the outside. The left and right sides of the lower cover (4) are provided with first heat dissipation holes (42) that communicate with the outside. An external pipe (43) is fixedly installed on the front side of the lower cover (4). An air inlet pipe (44) is connected to the flange at the end of the external pipe (43). A three-way pipe (45) is fixedly installed at the end of the air inlet pipe (44). A three-way valve (451) is fixedly installed on the three-way pipe (45). An air conditioning cold air pipe (46) for connecting with the vehicle air conditioning pipe is fixedly installed on one of the pipes of the three-way pipe (45). An air hood (47) for conveying outside air is fixedly installed on the remaining pipe of the three-way pipe (45).
2. The vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass as described in claim 1, characterized in that: The four corners of the central support (3) are each fixedly equipped with a vertically arranged guide sleeve (31). The central support (3) is located at half the height of the guide sleeve (31). The two ends of the guide sleeve (31) are respectively inserted and engaged with the outer frame plate (1) and the support plate (2) to support the central support (3).
3. The vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass as described in claim 2, characterized in that: The outer frame plate (1), the support plate (2) and the corresponding guide sleeve (31) are fixedly installed on the bottom surface of the lower cover (4) by the same fastening screw for fixed installation operation.
4. The vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass as described in claim 3, characterized in that: Multiple heat dissipation fins (40) arranged linearly and at equal intervals are fixedly installed on the bottom wall of the lower cover (4). The end plates of the heat dissipation fins (40) extend to the outside of the lower cover (4). The number of heat dissipation fins (40) is 10 to 30, and the distance between two adjacent heat dissipation fins (40) is 2 mm to 4 mm.
5. The vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass according to claim 4, characterized in that: Temperature sensors (41) are fixedly installed on both the inner wall and the outer surface of the lower cover (4). The two temperature sensors (41) are used to measure the temperature inside and outside the lower cover (4), respectively.
6. The integrated heat dissipation structure of vehicle-mounted T-BOX and gateway based on air conditioning bypass according to claim 5, characterized in that: The air hood (47) is fixedly installed with a hood fixing frame (48) at its end. A dust filter (481) is detachably connected inside the hood fixing frame (48). The dust filter (481) is used to filter the air.
7. The vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass according to claim 4, characterized in that: A lower limit frame (49) is fixedly installed on the top shell of the lower cover (4). An upper cover (5) is provided above the lower cover (4). Second heat dissipation holes (50) for ventilation and heat dissipation are provided on both the left and right side plates of the upper cover (5). Multiple heat dissipation fins (51) arranged linearly and equally spaced are fixedly installed on the top plate of the upper cover (5). The distance between two adjacent heat dissipation fins (51) is 3mm to 6mm. The number of heat dissipation fins (51) is 10 to 30. The number of second heat dissipation holes (50) on each side is 3 to 6. An upper limit frame (52) is fixedly installed on the shell of the upper cover (5). The upper limit frame (52) and the lower limit frame (49) are fixedly connected by multiple fastening screws.
8. A heat dissipation method for a vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass, characterized in that: The heat dissipation method for the vehicle-mounted T-BOX and gateway fusion heat dissipation structure based on air conditioning bypass as described in any one of claims 1-7 includes the following steps: S1. Temperature detection: The temperature outside the lower cover (4) is detected by a temperature sensor (41) located outside the lower cover (4), and the temperature inside the lower cover (4) is detected by a temperature sensor (41) located inside the lower cover (4). During the temperature detection process, the following two situations will occur: one is that the temperature outside the lower cover (4) is lower than the temperature inside the lower cover (4), and the other is that the temperature outside the lower cover (4) is higher than the temperature inside the lower cover (4). S2. If the temperature outside the lower cover (4) is lower than the temperature inside the lower cover (4), open the three-way valve (451) to connect the air hood (47) with the air inlet pipe (44), then start the fan (33) to make the fan (33) work, so that the low temperature outside air is delivered to the space between the upper cover (5) and the lower cover (4) to dissipate heat from the vehicle T-BOX motherboard (10) and the gateway motherboard (20), and the heat is discharged outward along the first heat dissipation hole (42) and the second heat dissipation hole (50); S3. If the temperature outside the lower cover (4) is greater than the temperature inside the lower cover (4) and the temperature inside the lower cover (4) still exceeds the standard value under the condition that the fan (33) is working to dissipate heat, the three-way valve (451) is opened to connect the air conditioning cold air pipe (46) and the air intake pipe (44). If the vehicle's internal air conditioning system has been turned on, the air conditioning cold air pipe (46) is connected to the pipe in the vehicle's air conditioning system. A suitable amount of cold air from the vehicle's air conditioning system enters the lower cover (4) along the air conditioning cold air pipe (46) and the air intake pipe (44) and works with the fan (33) to dissipate heat. If the vehicle's internal air conditioning system has not been turned on, the temperature inside the lower cover (4) that exceeds the standard value is transmitted to the vehicle's central control host in real time. The vehicle's central control host automatically turns on the vehicle's air conditioning system and closes the air pipe in the air conditioning system that enters the vehicle's interior to cool down.
9. A car, characterized in that: It includes the vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass as described in any one of claims 1-7, and a connecting component for installing and connecting the vehicle-mounted T-BOX and gateway integrated heat dissipation structure based on air conditioning bypass.
Citation Information
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