Graphite bubble heat-conducting gasket

Abstract

This invention discloses a graphite foam thermally conductive pad comprising a first base layer, a thermally conductive layer, and a second base layer arranged sequentially. A receiving space is formed within the thermally conductive layer, connecting the first and second base layers. A pouch containing phase change paraffin powder is placed within the receiving space. A thermally conductive plate, with a corrugated structure, is positioned above the pouch within the receiving space. An elastic element is provided on the top surface of the thermally conductive plate, and the other end of the elastic element abuts against the bottom surface of the second base layer. Through the elastic force of the elastic element, the thermally conductive plate abuts against the pouch, creating a clearance space between the thermally conductive plate and the second base layer. This clearance space is filled with thermally conductive material. This invention solves the problem that traditional thermally conductive pads only provide heat dissipation and cannot withstand the impact of bumps or collisions during vehicle operation, which could damage electrical components.

Description

Technical Field

[0001] This invention relates to the field of thermal conductive pad technology, specifically to a graphite foam thermal conductive pad. Background Technology

[0002] In new energy vehicles, many electrical components generate heat during operation. If this heat is not dissipated in time, it will have a significant negative impact on the vehicle's performance and safety. To ensure rapid cooling, cooling pads or the vehicle's metal shell are needed to quickly transfer heat. Typically, the electrical components and heat sinks cannot be in complete contact, meaning there are gaps between them, which affects heat dissipation efficiency. To improve cooling speed, a thermally conductive pad is usually placed between the electrical components and the heat dissipation device to facilitate rapid heat transfer between them.

[0003] However, traditional thermal pads only have a heat dissipation effect and cannot address the problem of electrical components being damaged due to bumps or collisions during vehicle operation. Summary of the Invention

[0004] To overcome the above-mentioned shortcomings, the present invention aims to provide a graphite foam thermal pad.

[0005] To achieve the above objectives, the technical solution adopted by the present invention includes a first base layer, a heat-conducting layer and a second base layer arranged in sequence, wherein an accommodating space is formed within the heat-conducting layer that connects the first base layer and the second base layer;

[0006] The accommodating space contains a bag filled with phase change paraffin powder.

[0007] This application combines the heat emitted by electrical components during operation with the absorption of solid phase change wax, thereby causing the phase change wax to transform into a liquid state. At the same time, the liquid phase change wax counteracts the external forces acting on the electrical components, thus forming a protective effect on the electrical components. The combination of these two working states achieves their respective effects and is practical.

[0008] In a preferred embodiment of the graphite foam thermal pad, a thermally conductive plate is provided above the pouch within the accommodating space. The thermally conductive plate has a corrugated structure, and an elastic element is provided on the top surface of the thermally conductive plate. The other end of the elastic element abuts against the bottom surface of the second base layer. With the help of the elastic force of the elastic element, the thermally conductive plate abuts against the pouch, and a clearance space is formed between the thermally conductive plate and the second base layer. The clearance space is filled with thermally conductive material.

[0009] The waveform structure of the heat-conducting plate and the bag can increase the contact area between the liquid phase change paraffin and the heat-conducting material inside the bag, further improving the heat dissipation effect on the liquid phase change paraffin and electrical components, and effectively improving the application effect of this application.

[0010] In a preferred embodiment of the graphite foam thermally conductive pad, the thermally conductive plate is divided into multiple sections within the accommodating space and arranged sequentially. A limiting groove is vertically formed on the inner wall of the thermally conductive layer, and the top end of the thermally conductive plate extends into the limiting groove. By vertically forming the limiting groove on the inner wall of the thermally conductive layer along its length, and allowing the top end of the thermally conductive plate to extend into the limiting groove, the thermally conductive plate moves only in the vertical direction, thereby avoiding interference between the various thermally conductive plates.

[0011] In a preferred embodiment of the graphite foam thermal pad, the elastic element is a spring made of Ni-Ti shape memory alloy. The Ni-Ti shape memory alloy spring deforms upon heating, and the elastic element pushes the pouch through the heat-conducting plate, causing the solid-liquid phase change paraffin wax inside the pouch to move. This allows the solid phase change paraffin wax at different locations to shift, thus avoiding the problem of only a portion of the solid phase change paraffin wax absorbing heat due to localized heat dissipation from electronic components, effectively improving the heat dissipation effect of this application for electrical components.

[0012] In a preferred embodiment of the graphite foam thermal pad, the thermally conductive material is graphene powder.

[0013] In a preferred embodiment of the graphite foam thermal pad, the volume of the clearance space within the accommodating space is 0.5-1 times the volume of the space occupied by the pouch. By setting the volume of the space occupied by the pouch to be larger than the volume of the clearance space, the amount of phase change paraffin stored in the pouch can be increased, thereby improving the heat dissipation effect of this application on electrical components.

[0014] In a preferred embodiment of the graphite foam thermal pad, the thermal plate is made of copper or aluminum.

[0015] In the preferred technical solution of the graphite foam thermal pad, a release film is provided on the bottom surface of the first base layer.

[0016] In the preferred embodiment of the graphite foam thermal conductive pad, the thermal conductive pad is any one of square, fan-shaped, or circular.

[0017] In a preferred embodiment of the graphite foam thermal pad, the thickness of the thermal pad is 0.5-40 mm. The overall thickness of the thermal pad refers to the thickness of the release film, the first base layer, the thermally conductive layer, and the second base layer after stacking.

[0018] The beneficial effects of this invention are:

[0019] (1) This application combines the heat emitted by the electrical components during operation with the absorption of solid phase change wax, thereby causing the phase change wax to become liquid. At the same time, the liquid phase change wax counteracts the external force acting on the electrical components and forms a reverse protection for the electrical components. The combination of the two working states achieves their respective effects and is practical.

[0020] (2) By means of the elastic force of the elastic element, the heat-conducting plate with a wave structure is pressed against the top of the bag, thereby coupling the bag with the heat-conducting plate. The wave structure of the heat-conducting plate and the bag can increase the contact area between the liquid phase change paraffin and the heat-conducting material inside the bag, further improving the heat dissipation effect on the liquid phase change paraffin and electrical components, and effectively improving the use effect of this application. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the present invention after the second layer has been removed;

[0022] Figure 2 This is a cross-sectional view of the present invention;

[0023] Figure 3 for Figure 2 Enlarged view of a portion of point A in the middle;

[0024] Figure 4 This is a structural diagram of the heat-conducting plate;

[0025] In the diagram: 1. First base layer; 2. Heat-conducting layer; 21. Accommodation space; 22. Limiting groove; 3. Second base layer; 4. Bag; 5. Release film; 6. Heat-conducting plate; 7. Elastic element; 8. Clearance space. Detailed Implementation

[0026] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0027] It should be noted that in the description of this invention, terms such as "upper," "lower," "left," "right," "front," and "rear," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly, for example, referring to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] Background technology indicates that traditional thermal pads only provide heat dissipation for electrical components, but cannot prevent damage to these components due to bumps or collisions during vehicle operation. This invention provides a graphite foam thermal pad that, by adding a pouch 4 containing phase change paraffin wax within the thermally conductive layer 2, allows the phase change paraffin wax to absorb heat from the electrical components, changing from a solid to a liquid state, thus achieving a combination of heat dissipation and protection for the electrical components.

[0030] specifically refer to Figures 1 to 4 ,in, Figure 1 This is a schematic diagram of the present invention after removing the second layer 3; Figure 2 This is a cross-sectional view of the present invention; Figure 3 for Figure 2 Enlarged view of a portion of point A in the middle; Figure 4 This is a structural diagram of heat-conducting plate 6.

[0031] like Figures 1 to 4 As shown, the graphite foam thermal pad of the present invention includes a first base layer 1, a thermally conductive layer 2 and a second base layer 3 arranged sequentially, wherein an accommodating space 21 is formed in the thermally conductive layer 2 to connect the first base layer 1 and the second base layer 3;

[0032] The accommodating space 21 contains a bag 4 filled with phase change paraffin powder.

[0033] See Figure 1 , Figure 3 Both the first base layer 1 and the second base layer 3 are plate-shaped structures. Both the first base layer 1 and the second base layer 3 are made of thermally conductive graphite, and the thermally conductive layer 2 is made of foam. The first base layer 1 and the thermally conductive layer 2, and the second base layer 3 and the thermally conductive layer 2 are connected by high-strength adhesive, or by ball valve structure. The specific connection method is not limited.

[0034] See Figure 2 The heat-conducting layer 2 has a frame structure. The closed accommodating space 21 formed by the heat-conducting layer 2, the first base layer 1, and the second base layer 3 is used to accommodate the bag 4 containing phase change paraffin. The bag 4 is made of rubber material.

[0035] The graphite foam thermal pad of this application is attached to the electrical component. After the electrical component is working, it starts to heat up. The heat is conducted to the phase change paraffin powder through the first base layer 1 and the bag 4. The phase change paraffin absorbs heat and changes from solid to liquid. Thus, when the electrical component is subjected to bumps or collisions, the liquid phase change paraffin and the first base layer 1 and the second base layer 3 can form an effective protection for the electrical component, thereby ensuring the service life of the electrical component.

[0036] Furthermore, because phase change wax has a high latent heat of phase change, when solid phase change wax absorbs heat and transforms into a liquid state, it can store enough heat to provide a good environment for the heat dissipation of electrical components. When the electrical components stop working, the liquid phase change wax gradually dissipates heat at room temperature. Due to the properties of phase change wax itself, the problem of temperature rise during the liquid-solid state transition of phase change wax, which could damage electrical components, can be avoided.

[0037] This application combines the heat emitted by electrical components during operation with the absorption of solid phase change wax, thereby causing the phase change wax to transform into a liquid state. At the same time, the liquid phase change wax counteracts the external forces acting on the electrical components, thus forming a protective effect on the electrical components. The combination of these two working states achieves their respective effects and is practical.

[0038] In one or more embodiments, a heat-conducting plate 6 is provided in the accommodating space 21 above the pouch 4. The heat-conducting plate 6 has a corrugated structure. An elastic element 7 is provided on the top surface of the heat-conducting plate 6. The other end of the elastic element 7 abuts against the bottom surface of the second base layer 3. With the help of the elastic force of the elastic element 7, the heat-conducting plate 6 abuts against the pouch 4, and a clearance space 8 is formed between the heat-conducting plate 6 and the second base layer 3. The clearance space 8 is filled with heat-conducting material.

[0039] See Figure 1 , Figure 3 , Figure 4 The heat-conducting plate 6 can be a wave-shaped structure along the width of the accommodating space 21 or along the length of the accommodating space 21. The specific choice depends on the actual production needs and is not limited.

[0040] See Figure 1 , Figure 3 , Figure 4An elastic element 7 is installed at the trough of the upper surface of the heat-conducting plate 6. Installing the elastic element 7 at the trough can reduce the volume of the clearance space 8, thereby increasing the storage capacity of the phase change paraffin in the bag 4. The other end of the elastic element 7 is installed on the bottom surface of the second base layer 3. With the help of the elastic force of the elastic element 7, the wave-shaped heat-conducting plate 6 presses against the top of the bag 4, thereby coupling the bag 4 with the heat-conducting plate 6, and the bag 4 presents a wave-shaped structure. Correspondingly, within the accommodating space 21, the heat-conducting plate 6, the heat-conducting layer 2, and the second base layer 3 enclose and form the clearance space 8, which is filled with heat-conducting material. Combined with the wave-shaped structure of the heat-conducting plate 6 and the bag 4, the contact area between the liquid phase change paraffin in the bag 4 and the heat-conducting material can be increased, further improving the heat dissipation effect on the liquid phase change paraffin and electrical components, and effectively improving the use effect of this application.

[0041] In other possible implementations, tension threads are formed at the lower interior of the pouch 4; the tension threads are at most 2 / 3 of the height of the pouch 4.

[0042] Understandably, when the liquid phase change paraffin in the pouch 4 transforms into solid phase change paraffin, the tension wire can be confined within the solid phase change paraffin. When the phase change paraffin absorbs heat from the electrical components again, the solid phase change paraffin transforms back into liquid phase change paraffin. Due to the confinement of the solid phase change paraffin by the tension wire, the solid phase change paraffin is positioned relatively closer to the electrical components, while the liquid phase change paraffin is positioned relatively away from the electrical components. This allows the solid phase change paraffin to continuously absorb heat from the electrical components, while the liquid phase change paraffin continuously dissipates heat to the outside under the action of the heat-conducting material and the second base layer 3 within the clearance space 8. This further improves the heat dissipation effect of this application on the electrical components and enhances the usability of this application.

[0043] In one or more embodiments, the heat-conducting plate 6 is divided into multiple parts within the accommodating space 21 and arranged sequentially, and a limiting groove 22 is vertically formed on the inner wall of the heat-conducting layer 2, with the top end of the heat-conducting plate 6 extending into the limiting groove 22.

[0044] See Figure 1 Multiple heat-conducting plates 6 are arranged along the length of the accommodating space 21, and each heat-conducting plate 6 is continuous. Through this arrangement, the elastic element 7 can abut against the bags 4 at different positions through the heat-conducting plates 6. After the phase change paraffin wax inside the bag 4 turns into a liquid state, the bag 4 is pressed by the heat-conducting plates 6 at different positions, so that the phase change paraffin wax in the bag 4, which exists in both solid and liquid states, can move to a certain extent, thereby accelerating the absorption of heat dissipated by electrical components by the solid phase change paraffin wax and improving the use effect of this application.

[0045] Correspondingly, by vertically opening a limiting groove 22 on the inner wall of the heat-conducting layer 2 along its length, the top end of the heat-conducting plate 6 extends into the limiting groove 22, so that the heat-conducting plate 6 moves only in the vertical direction, thereby avoiding the problem of interference between the heat-conducting plates 6.

[0046] Alternatively, the heat-conducting plate 6 can also be set discontinuously, that is, multiple heat-conducting plates 6 are set at intervals.

[0047] In one or more embodiments, the heat-conducting plate 6 is made of copper or aluminum. The copper or aluminum heat-conducting plate 6 has a good thermal conductivity, which can effectively conduct and dissipate the heat stored in the liquid phase change paraffin inside the bag 4.

[0048] In one or more embodiments, the elastic element 7 is a spring made of Ni-Ti shape memory alloy.

[0049] See Figure 1 , Figure 3 While solid phase change paraffin wax transforms into liquid phase change paraffin wax, the spring made of Ni-Ti shape memory alloy deforms due to heat. The elastic element 7 pushes the bag 4 through the heat-conducting plate 6, thereby causing the solid-liquid phase change paraffin wax inside the bag 4 to move. This achieves the displacement of solid phase change paraffin wax at different positions, thus avoiding the problem of only some solid phase change paraffin wax absorbing heat due to local heat dissipation of electronic components, and effectively improving the heat dissipation effect of this application for electrical components.

[0050] Meanwhile, by setting Ni-Ti memory springs with different deformation temperatures, the solid-liquid phase change paraffin inside the capsule 4 is always in motion, thereby accelerating the intermolecular motion rate and improving the heat dissipation effect on electrical components, which is practical.

[0051] In other possible implementations, several elastic elements 7 can be connected by a silk rope; so that when a single elastic element 7 moves, the other elastic elements 7 can still be pulled by the silk rope and their corresponding phase change wax parts are pushed, thereby improving the movement of solid-liquid phase change wax inside the bag 4 and improving the heat absorption effect of solid phase change wax on electrical components.

[0052] In one or more embodiments, the thermally conductive material is graphene powder.

[0053] Graphene powder has good thermal conductivity, which can achieve thermal conductivity of the liquid phase change paraffin inside the capsule 4.

[0054] It should be noted that the graphene powder can be wrapped in an isolation bag to prevent the graphene powder from falling between the heat-conducting plate 6 and the bag 4 and obstructing the movement of the heat-conducting plate 6 when it moves up and down.

[0055] In one or more embodiments, within the accommodating space 21, the volume of the clearance space 8 is 0.5-1 times the volume of the space occupied by the pouch 4.

[0056] By setting the volume of the pouch 4 to be larger than the volume of the clearance space 8, the amount of phase change paraffin stored in the pouch 4 can be increased, thereby improving the heat dissipation effect of this application on electrical components.

[0057] In one or more embodiments, a release film 5 is provided on the bottom surface of the first base layer 1. The release film 5 described in this application is a thermally conductive release film 5.

[0058] In one or more embodiments, the thermal pad is any one of square, fan-shaped, or circular. This arrangement can improve the applicability of the thermal pad of this application.

[0059] It should be noted that, corresponding to the circular thermal pad, its first base layer 1, thermal conductive layer 2 and second base layer 3 are all circular, and the accommodating space 21 and thermal conductive plate 6 enclosed by the thermal conductive layer 2 are both circular structures. The specific structures can be changed according to actual production needs.

[0060] In one or more embodiments, the thickness of the thermal pad is 0.5-40 mm.

[0061] It is understandable that the overall thickness of the thermal pad refers to the thickness of the release film 5, the first base layer 1, the thermally conductive layer 2, and the second base layer 3 after they are stacked.

[0062] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A graphite foam thermal pad, characterized in that, It includes a first base layer, a heat-conducting layer and a second base layer arranged in sequence, wherein an accommodating space is formed within the heat-conducting layer that connects the first base layer and the second base layer; The accommodating space contains a bag filled with phase change paraffin powder; A heat-conducting plate is provided on the upper part of the bag within the accommodating space. The heat-conducting plate has a corrugated structure and an elastic element is provided on the top surface of the heat-conducting plate. The other end of the elastic element abuts against the bottom surface of the second base layer. With the help of the elastic force of the elastic element, the heat-conducting plate abuts against the bag and forms a clearance space between the heat-conducting plate and the second base layer. The clearance space is filled with heat-conducting material.

2. The graphite foam thermal pad according to claim 1, characterized in that: The heat-conducting plate is divided into multiple parts within the accommodating space and arranged sequentially. A limiting groove is vertically formed on the inner wall of the heat-conducting layer, and the top of the heat-conducting plate extends into the limiting groove.

3. The graphite foam thermal pad according to claim 2, characterized in that: The elastic element is a spring made of Ni-Ti shape memory alloy.

4. The graphite foam thermal pad according to claim 1, characterized in that: The thermally conductive material is graphene powder.

5. The graphite foam thermal pad according to claim 1, characterized in that: Within the accommodating space, the volume of the clearance space is 0.5-1 times the volume of the space occupied by the pouch.

6. The graphite foam thermal pad according to claim 1, characterized in that: The heat-conducting plate is made of copper or aluminum.

7. The graphite foam thermal pad according to claim 1, characterized in that: A release film is provided on the bottom surface of the first base layer.

8. The graphite foam thermal pad according to claim 1, characterized in that: The thermal pad can be square, fan-shaped, or round.

9. The graphite foam thermal pad according to claim 1, characterized in that: The thickness of the thermal pad is 0.5-40mm.

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