一种化学机械抛光终点的检测装置及检测方法
By generating an alternating magnetic field on the polishing pad and detecting temperature changes in real time, the problem of inaccurate polishing endpoint detection in existing technologies is solved, achieving high-precision polishing endpoint determination and ensuring polishing quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING SEMICORE MICROELECTRONICS EQUIPMENT CO LTD
- Filing Date
- 2023-11-07
- Publication Date
- 2026-07-17
AI Technical Summary
Existing methods for detecting the endpoint of chemical mechanical polishing are inaccurate, leading to over-polishing. This is especially problematic in optical inspection where noise interference is severe, and temperature detection has a large lag, making it difficult to accurately determine the polishing endpoint.
An alternating magnetic field is generated on the polishing pad using a high-frequency alternating magnetic field generator. The temperature of the polishing surface is monitored in real time by a temperature detector. The polishing endpoint is determined by the temperature change caused by eddy currents. The data processing module determines whether the endpoint has been reached based on the temperature.
It improves the accuracy of polishing endpoint detection, avoids the effects of environmental noise and hysteresis, ensures polishing quality, and simplifies the judgment process.
Smart Images
Figure CN117300884B_ABST