Detection device and light emitting device detection method

CN117310424BActive Publication Date: 2026-10-27CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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Patent Information

Application Number
CN202210715184.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-06-23
Publication Date
2026-10-27
Estimated Expiration
2042-06-23

AI Technical Summary

Technical Problem

[0004]但是,不同型号发光器件的引脚的分布位置可能不同,单一的检测板的探针分布不能适配不同型号的发光器件,因此针对每种引脚分布不同的发光器件都需要制作与之适配的检测板,增加了生产成本

Benefits of technology

[0026]本申请提供一种检测装置及发光器件检测方法,通过设置具有多个探针活动区域的承载板,使探针可以在承载板上的探针活动区域内移动,并通过与探针的第一电磁部件连接的第一磁性控制组件配合,可以使所述第一磁性部件产生磁性以将各个探针吸引至与各待检测发光器件的引脚对应的位置。如此,针对不同引脚分布的发光器件进行检测时,可以在调整所述探针的位置后使用同一个承载板,如此,可以减少检测成本。

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Abstract

The detection device and the light emitting device detection method provided by the embodiments of the present application can attract each probe to a position corresponding to a pin of each light emitting device to be detected by setting a bearing plate with multiple probe active areas, enabling the probes to move in the probe active areas on the bearing plate and cooperating with a first magnetic control assembly connected with a first electromagnetic component of the probes. When detecting light emitting devices with different pin distributions, the same bearing plate can be used after adjusting the positions of the probes, thereby reducing the detection cost.
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Description

Technical Field

[0001] This application relates to the field of display device manufacturing technology, and more specifically, to a testing device and a testing method for light-emitting devices. Background Technology

[0002] With the development of display device manufacturing technology, Mini LEDs and Micro-LEDs are widely used due to their superior advantages in brightness, resolution, contrast, energy consumption, lifespan, response speed and thermal stability.

[0003] The fabrication process of Mini LEDs or Micro-LEDs typically involves forming multiple light-emitting devices (LED chips) on a sapphire wafer using semiconductor fabrication processes. After forming multiple light-emitting devices, a test board with probes is usually used to test each light-emitting device on the wafer. During testing, the probes on the test board are electrically connected to the pins of each light-emitting device on the wafer, and a test electrical signal is sent to the light-emitting device for detection.

[0004] However, the pin distribution of different types of light-emitting devices may be different. The probe distribution of a single detection board cannot be adapted to different types of light-emitting devices. Therefore, a detection board that can be adapted to each type of light-emitting device with different pin distribution needs to be made, which increases the production cost. Summary of the Invention

[0005] To overcome the technical problems mentioned in the above background, this application provides a detection device, the detection device comprising:

[0006] A support plate, the support plate including a first surface and a second surface, the first surface being provided with multiple probe activity areas;

[0007] Multiple probes are respectively disposed in the multiple probe active areas of the carrier plate, and the probes can move within the probe active areas; each probe includes a first electromagnetic component and a signal contact, the signal contact being located at the end of the probe away from the carrier plate, and the signal contact being used for electrical contact with the pin of the light-emitting device to be tested;

[0008] A first magnetic control component is electrically connected to a first electromagnetic component of each probe, and the first magnetic control component is used to control the first electromagnetic component to generate magnetism.

[0009] A signal transmission component is electrically connected to the signal contact of each of the probes, and the signal transmission component is used to transmit test electrical signals to the signal contacts of each of the probes.

[0010] In one possible implementation, the carrier plate includes a guide rail disposed in the probe's active area and extending in at least one direction, the probe being disposed on the guide rail and movable along the guide rail.

[0011] In one possible implementation, the plurality of probes includes a plurality of probe groups, each probe group including two adjacent probes; the guide rails in the two probe active areas corresponding to each probe group are axially symmetric or centrally symmetric.

[0012] Preferably, each probe group has two probe activity areas, each including at least two guide rails. The guide rails extend from a center point in different directions, and the guide rails in the two probe activity areas of each probe group are centrally symmetrical about the center point.

[0013] In one possible implementation, each of the probe active areas includes a fixing part, a probe mounting part, and an elastic connecting part. The fixing part and the probe mounting part are connected through the elastic connecting part. The probe mounting part is used to mount the probe and can move relative to the fixing part in a direction parallel to the first surface under the action of the elastic connecting part.

[0014] In one possible implementation, the detection device further includes:

[0015] A positioning plate is detachably connected to the second side of the carrier plate; the positioning plate includes multiple magnetic positioning points corresponding to the pin positions of the light-emitting device to be tested, so that the first electromagnetic component, after generating magnetism, drives the probe to move to the position corresponding to the corresponding magnetic positioning point.

[0016] In one possible implementation, the probe active area is provided with a reset component, which is used to restore or hold the probe in a predetermined initial position in the probe active area when the positioning plate is disconnected from the carrier plate.

[0017] In one possible implementation, the detection device includes multiple positioning plates, with the magnetic positioning points on the different positioning plates having different positional distributions.

[0018] In one possible implementation, the detection device further includes a second magnetic control component, wherein the magnetic positioning point of the positioning plate includes a second electromagnetic component, the second magnetic control component is electrically connected to each of the second electromagnetic components, and the second magnetic control component is used to control the second electromagnetic components to generate magnetism so that the second electromagnetic components attract the first electromagnetic components at the corresponding positions.

[0019] In one possible implementation, the positioning plate further includes a plurality of magnetic reset points, each magnetic reset point including a third electromagnetic component. The second magnetic control component is electrically connected to each of the third electromagnetic components. The second magnetic control component is also used to control the third electromagnetic components to generate magnetism, so that the third electromagnetic components attract the first electromagnetic components at corresponding positions to a set initial position in the probe activity area.

[0020] Another object of this application is to provide a method for detecting light-emitting devices, wherein the detection device provided in this application is used to detect the light-emitting device to be tested, and the method includes:

[0021] The positioning plate is determined to have the same distribution pattern of the magnetic positioning points as the pin distribution pattern of the light-emitting device to be tested;

[0022] By controlling the first electromagnetic component of each probe to generate magnetism, the first electromagnetic component drives the probe to move to a position corresponding to the pin of the corresponding light-emitting device to be tested;

[0023] Move the carrier plate so that the signal contacts of each probe make electrical contact with the pins of each light-emitting device to be tested;

[0024] The test electrical signal is transmitted to the light-emitting device under test through the signal transmission component via each of the signal contacts.

[0025] Compared with the prior art, this application has the following beneficial effects:

[0026] This application provides a detection device and a method for detecting light-emitting devices. By setting a carrier plate with multiple probe active areas, the probes can move within these active areas on the carrier plate. A first magnetic control component connected to a first electromagnetic component of the probes can generate magnetism to attract each probe to a position corresponding to the pin of each light-emitting device to be tested. Thus, when detecting light-emitting devices with different pin distributions, the same carrier plate can be used after adjusting the probe positions, thereby reducing detection costs.

[0027] Furthermore, by setting a positioning plate with multiple magnetic points, each of the first magnetic parts can be accurately attracted to the position corresponding to each magnetic positioning point, thereby aligning with the pins of each light-emitting device to be tested. Thus, when testing light-emitting devices with different pin distributions, only the corresponding positioning plate needs to be prepared, and the same carrier plate and probes mounted on the carrier plate can be reused, reducing testing costs and improving production efficiency. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is one of the schematic diagrams of the wafer containing the light-emitting device to be tested;

[0030] Figure 2 This is the second schematic diagram of the wafer containing the light-emitting device to be tested;

[0031] Figure 3 This is a schematic diagram of the detection method using a detection board in the prior art;

[0032] Figure 4 One of the schematic diagrams of the detection device provided in the embodiments of this application;

[0033] Figure 5 A schematic diagram of the carrier plate provided in an embodiment of this application;

[0034] Figure 6 This is a circuit connection diagram of the detection device provided in the embodiments of this application;

[0035] Figure 7 A second schematic diagram of the detection device provided in the embodiments of this application;

[0036] Figure 8 One of the schematic diagrams of the positioning plate provided in the embodiments of this application;

[0037] Figure 9 A second schematic diagram of the positioning plate provided in an embodiment of this application;

[0038] Figure 10 This is a schematic diagram illustrating the working principle of different positioning plates provided in the embodiments of this application;

[0039] Figure 11 One of the schematic diagrams of the probe activity area provided in the embodiments of this application;

[0040] Figure 12 This is a second schematic diagram of the probe activity area provided in the embodiments of this application;

[0041] Figure 13 This is the third schematic diagram of the probe activity area provided in the embodiments of this application. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0045] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0046] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0047] Please see Figure 1 and Figure 2 Generally speaking, the manufacturing process of Mini LED or Micro-LED usually involves forming multiple light-emitting devices 200 to be tested on a sapphire wafer 100 using semiconductor manufacturing processes. The relative distribution of the pins 210 of different models of light-emitting devices 200 to be tested may be different.

[0048] Please refer to Figure 3After multiple light-emitting devices 200 to be tested are formed on wafer 100, a test board 800 is usually used to test each light-emitting device. The test board 800 is provided with multiple probes 400, which are connected to a signal providing device. During the test, the probes 400 on the test board 800 need to be electrically contacted with the pins 210 of each light-emitting device 200 to be tested on wafer 100, and then test electrical signals are sent to the light-emitting device 200 through the probes 400 for testing.

[0049] The inventors discovered that the pin 210 distribution positions of different models of light-emitting devices 200 to be tested may differ. Therefore, the probe distribution of the aforementioned detection board 800 may not be compatible with different models of light-emitting devices 200. Consequently, a corresponding detection board 800 needs to be fabricated for each type of light-emitting device 200 with a different pin distribution. However, fabricating the detection board 800 requires creating numerous traces connecting to each probe 400 and installing multiple probes 400. The need to fabricate a corresponding detection board 800 for each type of light-emitting device 200 with a different pin distribution significantly increases testing costs and reduces product manufacturing efficiency.

[0050] In view of the above-mentioned problems, this embodiment provides a solution to reduce the detection cost of light-emitting devices. The solution provided in this embodiment will be described in detail below.

[0051] Please see Figure 4 , Figure 4 The detection device provided in this embodiment may include a carrier plate 300 and a plurality of probes 400.

[0052] The support plate 300 includes a first surface and a second surface facing each other. Please refer to... Figure 5 The first surface is provided with a plurality of probe activity areas 310. A plurality of probes 400 can be respectively disposed in the plurality of probe activity areas 310, and the probes 400 can move within the probe activity areas 310 in a direction parallel to the first surface. For example, the plurality of probes 400 can extend in a direction perpendicular to the first surface, and the probe activity areas 310 can restrict the movement direction of the probes 400, so that each probe 400 can move relatively independently within its corresponding probe activity area 310 in a direction parallel to the first surface.

[0053] Please refer to this again. Figure 4Each probe 400 includes a first electromagnetic component 410 and a signal contact 420. The signal contact 420 is located at the end of the probe 400 away from the carrier plate 300 and is used for electrical contact with the pin 210 of the light-emitting device 200 to be tested. In one example, the first electromagnetic component 410 may include an electromagnetic coil that is magnetic when energized, and the signal contact 420 may be a needle-like structure.

[0054] Please refer to Figure 6 The detection device provided in this embodiment may further include a first magnetic control component 600 and a signal transmission component 700.

[0055] The first magnetic control component 600 can be electrically connected to the first electromagnetic component 410 of each probe 400. The first magnetic control component 600 is used to control the first electromagnetic component 410 to generate magnetism so that the first electromagnetic component 410 drives the probe 400 to move to the position corresponding to the pin 210 of the light-emitting device 200 to be tested.

[0056] The signal transmission component 700 is electrically connected to the signal contact 420 of each probe 400, and is used to transmit test electrical signals to the signal contacts 420 of each probe 400. When the signal contacts 420 of each probe 400 make electrical contact with the pins 210 of each light-emitting device 200 under test, the test electrical signals can be transmitted to each light-emitting device 200 under test through the signal contacts 420 via the signal transmission component 700. For example, an image acquisition device can be used to acquire the light-emitting effect of each light-emitting device 200 under test on the wafer 100 after obtaining the test electrical signal, and the light-emitting effect can be used to determine whether each light-emitting device 200 under test is working properly.

[0057] Based on the above design, by setting a carrier plate 300 with multiple probe active areas 310, the probes 400 can move within the probe active areas 310 on the carrier plate 300. In cooperation with the first magnetic control component 600 connected to the first electromagnetic component 410 of the probes 400, each probe 400 can be attracted to a position corresponding to the pin 210 of each light-emitting device 200 to be tested. Thus, when testing light-emitting devices 200 with different pin distributions, the same carrier plate 300 and multiple probes 400 on it can be used after adjusting the position of the probes 400, thereby reducing testing costs.

[0058] In one possible implementation, please refer to Figure 7 The detection device may further include the positioning plate 500, which is detachably connected to the support plate 300. Please refer to... Figure 8 and Figure 9 The positioning plate 500 includes a plurality of magnetic positioning points 510 corresponding to the positions of the pins 210 of the light-emitting device 200 to be tested. After the first electromagnetic component 410 generates magnetism, it drives the probe 400 to move to the position corresponding to the magnetic positioning point 510, thereby aligning it with the pins 210 of the light-emitting device 200 to be tested.

[0059] For example, the first magnetic control component 600 can provide electrical energy to the first electromagnetic components 410 of each probe 400, so that the end of each first electromagnetic component 410 facing the positioning plate 500 has the opposite polarity to the magnetic positioning point 510, so that the magnetic positioning point 510 can attract the first electromagnetic component 410 to move closer to the magnetic positioning point 510, thereby driving the entire probe 400 to move to the position corresponding to the corresponding magnetic positioning point 510.

[0060] It should be noted that, in this embodiment, by setting the relative positions of the probe active area 310 and the magnetic positioning point 510, after each of the first electromagnetic components 410 generates magnetism, a magnetic positioning point 510 will only attract the nearest probe 400.

[0061] Optionally, in this embodiment, the detection device includes multiple positioning plates 500, and the magnetic positioning points 510 on different positioning plates 500 have different positional distributions. Thus, for light-emitting devices 200 under test with different pin 210 positions, positioning plates 500 with different magnetic positioning point 510 arrangement methods can be set. Compared to the prior art of manufacturing test plates with different probe arrangement methods, the manufacturing process of the positioning plates 500 with different magnetic positioning point 510 arrangement methods in this embodiment is simpler and the manufacturing cost is lower.

[0062] Based on the above design, by setting a support plate 300 with multiple probe active areas 310, the probe 400 can move within the probe active areas 310 on the support plate 300. Through the cooperation of a positioning plate 500 with multiple magnetic positioning points 510 and a first magnetic control component 600 connected to the first electromagnetic component 410 of the probe 400, each probe 400 can be attracted to a position corresponding to its respective magnetic positioning point 510. Please refer to... Figure 10When testing light-emitting devices with different pin distributions, only corresponding positioning plates 500 need to be prepared. After the first electromagnetic component 410 acquires magnetism, due to the different distribution positions of the magnetic positioning points 510 on different positioning plates 500, different positioning plates 500 can attract the probe 400 to different positions so that it corresponds to the pin 210 position of the light-emitting device 200 to be tested. In this way, the same carrier plate 300 and the probe 400 set on the carrier plate 300 can be reused to test different types of light-emitting devices 200 to be tested, thereby reducing testing costs and improving production efficiency.

[0063] In one possible implementation, please refer to Figure 11 The carrier plate 300 includes a guide rail 311 extending in at least one direction within the probe activity area 310. The probe 400 can be disposed on and moved along the guide rail 311. For example, the guide rail 311 can extend in a direction parallel to the first surface. When the probe 400 is located at different positions on the guide rail 311, it can correspond to the pin 210 position of different types of light-emitting devices 200 to be tested. Optionally, in this embodiment, after the positioning plate 500 is disposed on the second surface of the carrier plate 300, the position of the magnetic positioning point 510 can correspond to one end position of the guide rail 311.

[0064] Since the light-emitting device 200 to be tested typically has two pins 210, and the two pins 210 are usually symmetrically distributed, please refer to... Figure 12 In this embodiment, the plurality of probes 400 may include a plurality of probe groups, each probe group including two adjacent probes 400, and the guide rails 311 in the two probe activity areas 310 corresponding to each probe group are axially symmetrical or centrally symmetrical.

[0065] Furthermore, please refer to again Figure 12 Each probe group corresponds to two probe activity areas 310, each including at least two guide rails 311. The guide rails 311 extend from a center point in different directions, and the guide rails 311 in the two probe activity areas 310 of each probe group are centrally symmetrical about the center point; for example, they can be arranged in a star shape. This allows the two probes 400 in the probe group to move in multiple different directions to adapt to various types of light-emitting devices 200 under test.

[0066] In some possible implementations, the probe active area 310 is provided with a reset component, which is used to restore or hold the probe 400 in a predetermined initial position within the probe active area 310 when the positioning plate 500 is disconnected from the support plate 300. For example, in Figure 12 In the probe activity area 310 shown, the reset component can restore or hold the probe 400 at the center position of the star-shaped guide rail while the positioning plate 500 is disconnected from the support plate 300. Thus, when different positioning plates 500 are set, the probe 400 can be attracted from the initial position to the position corresponding to the magnetic positioning point 510. After removing the positioning plate 500, the reset component restores the probe 400 to the initial position, so that the probe 400 can smoothly start moving from the initial position when other positioning plates 500 are set next.

[0067] In another possible implementation, please refer to Figure 13 Each probe active area 310 may further include a fixing part 312, a probe mounting part 314, and an elastic connecting part 313. The fixing part 312 and the probe mounting part 314 are connected by the elastic connecting part 313. The probe mounting part 314 is used to mount the probe 400. The probe mounting part 314 can move relative to the fixing part 312 in a direction parallel to the first surface under the action of the elastic connecting part 313. For example, the elastic connecting part 313 may include a spring or a deformable spring sheet. When the positioning plate 500 is not provided on the second surface of the support plate 300, the elastic connecting part 313 can hold the probe mounting part 314 in an initial position. After the positioning plate 500 is provided on the second surface of the support plate 300, the magnetic positioning point 510 attracts the probe 400. At this time, the elastic connecting part 313 can undergo a certain deformation, causing the probe 400 to move in a direction parallel to the first surface to approach the magnetic positioning point 510.

[0068] In one possible implementation, the positioning plate 500 can be obtained by etching a magnetic functional film layer.

[0069] In another possible implementation, the detection device may further include a second magnetic control component, wherein the magnetic positioning point 510 of the positioning plate 500 includes a second electromagnetic component, and the second magnetic control component is electrically connected to each of the second electromagnetic components. The second magnetic control component is used to control the second electromagnetic components to generate magnetism so that the second electromagnetic components attract the first electromagnetic component 410 at the corresponding position.

[0070] Furthermore, the positioning plate 500 also includes a plurality of magnetic reset points, each magnetic reset point including a third electromagnetic component. The second magnetic control component is electrically connected to each of the third electromagnetic components. The second magnetic control component is also used to control the third electromagnetic component to generate magnetism, so that the third electromagnetic component attracts the first electromagnetic component 410 at the corresponding position to a set initial position in the probe activity area 310.

[0071] Based on the same inventive concept, this embodiment also provides a method for detecting light-emitting devices. The method mainly uses the detection device described in this embodiment to detect the light-emitting device to be tested, and the method may include the following steps.

[0072] Step S110: Determine the positioning plate 500 whose distribution pattern of the magnetic positioning points 510 is the same as the pin distribution pattern of the light-emitting device 200 to be tested.

[0073] In this embodiment, a positioning plate 500 with the same magnetic positioning point 510 distribution pattern can be selected or manufactured according to the pin distribution pattern of the light-emitting device under test.

[0074] In this embodiment, the determined positioning plate 500 can be set on the second side of the support plate 300 and fixedly connected to the support plate 300 by means of threads, snaps, etc.

[0075] In step S120, the first electromagnetic component 410 of each probe 400 is controlled by the first magnetic control component 600 to generate magnetism, so that the first electromagnetic component 410 drives the probe 400 to move to the position corresponding to the pin 210 of the light-emitting device 200 to be tested.

[0076] Step S130: Move the carrier plate 300 so that the signal contacts 420 of each probe 400 make electrical contact with the pins 210 of each light-emitting device 200 to be tested.

[0077] In this embodiment, after each probe 400 is moved to the corresponding position, the side of the entire carrier plate 300 with the probes 400 can be facing the wafer 100 where each light-emitting device 200 to be tested is located, and close to the wafer 100, so that the signal contacts 420 of each probe 400 make electrical contact with the pins 210 of each light-emitting device 200 to be tested.

[0078] In step S140, test electrical signals are transmitted to the light-emitting device 200 under test via the signal transmission component 700 through each of the signal contacts 420.

[0079] In this embodiment, after the signal contacts 420 of each probe 400 make electrical contact with the pins 210 of each light-emitting device 200 under test, a test electrical signal can be transmitted to the light-emitting device 200 under test via the signal contacts 420 through the signal transmission component 700, causing each light-emitting device 200 under test to emit light. Additionally, an image acquisition device can be used to acquire the luminous emission effect of each light-emitting device 200 under test on the wafer 100 after obtaining the test electrical signal, and the luminous emission effect can be used to determine whether each light-emitting device 200 under test is working properly.

[0080] In some possible implementations, step S200 may be included before step S120.

[0081] Step S200: The positioning plate 500 is placed on the second side of the support plate 300.

[0082] In step S120, the first electromagnetic component 410 of each probe 400 can be controlled by the first magnetic control component 600 to generate magnetism, so that the first electromagnetic component 410 drives the probe 400 to move to the position corresponding to each magnetic positioning point 510, thereby aligning with the pin 210 of the light-emitting device 200 to be tested.

[0083] For example, the first magnetic control component 600 can control each of the first electromagnetic components 410 to generate magnetism opposite to that of the magnetic positioning point 510, thereby attracting the first electromagnetic component 410 to the magnetic positioning point 510. This, in turn, causes the entire probe 400 to move in a direction parallel to the first surface toward the magnetic positioning point 510 until it reaches the position corresponding to the corresponding magnetic positioning point 510. In this state, the position of each probe 400 corresponds to the position of the pin 210 of each light-emitting device 200 to be tested.

[0084] In summary, the detection device and light-emitting device detection method provided in this application, by setting a carrier plate 300 with multiple probe active areas 310, allows the probes 400 to move within the probe active areas 310 on the carrier plate 300. Furthermore, through the cooperation of a positioning plate 500 with multiple magnetic positioning points 510 and a first magnetic control component 600 connected to the first electromagnetic component 410 of the probes 400, each probe 400 can be attracted to a position corresponding to its respective magnetic positioning point 510. When detecting light-emitting devices with different pin distributions, only the corresponding positioning plate 500 needs to be fabricated, and the same carrier plate 300 and probes 400 set on the carrier plate 300 can be reused. This reduces detection costs and improves production efficiency.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A detection device, characterized in that, The detection device includes: A carrier plate, the carrier plate including a first surface and a second surface, the first surface being provided with multiple probe activity areas; Multiple probes are respectively disposed in the multiple probe active areas of the carrier plate, and the probes can move within the probe active areas; each probe includes a first electromagnetic component and a signal contact, the signal contact being located at the end of the probe away from the carrier plate, and the signal contact being used for electrical contact with the pin of the light-emitting device to be tested; A first magnetic control component is electrically connected to a first electromagnetic component of each probe, and the first magnetic control component is used to control the first electromagnetic component to generate magnetism. A signal transmission component is electrically connected to the signal contact of each of the probes, and the signal transmission component is used to transmit the test electrical signal to the signal contact of each of the probes; A positioning plate is detachably connected to the second side of the carrier plate; the positioning plate includes multiple magnetic positioning points corresponding to the pin positions of the light-emitting device to be tested, so that the first electromagnetic component, after generating magnetism, drives the probe to move to the position corresponding to the corresponding magnetic positioning point.

2. The detection device according to claim 1, characterized in that, The support plate includes a guide rail disposed in the probe's active area and extending in at least one direction, the probe being disposed on the guide rail and movable along the guide rail.

3. The detection device according to claim 2, characterized in that, The plurality of probes includes a plurality of probe groups, each probe group including two adjacent probes; the guide rails in the two probe active areas corresponding to each probe group are axially symmetric or centrally symmetric.

4. The detection device according to claim 3, characterized in that, Each probe group corresponds to two probe activity areas, each including at least two guide rails. The guide rails extend from a center point in different directions, and the guide rails in the two probe activity areas of each probe group are centrally symmetrical about the center point.

5. The detection device according to claim 1, characterized in that, Each of the probe active areas includes a fixing part, a probe mounting part, and an elastic connecting part. The fixing part and the probe mounting part are connected through the elastic connecting part. The probe mounting part is used to mount the probe. The probe mounting part can move relative to the fixing part in a direction parallel to the first surface under the action of the elastic connecting part.

6. The detection device according to claim 1, characterized in that, The probe active area is provided with a reset component, which is used to restore or maintain the probe in a set initial position in the probe active area when the positioning plate is disconnected from the support plate.

7. The detection device according to claim 1, characterized in that, The detection device includes multiple positioning plates, and the magnetic positioning points on the different positioning plates have different positional distributions.

8. The detection device according to claim 1, characterized in that, The detection device further includes a second magnetic control component. The magnetic positioning point of the positioning plate includes a second electromagnetic component. The second magnetic control component is electrically connected to each of the second electromagnetic components. The second magnetic control component is used to control the second electromagnetic components to generate magnetism so that the second electromagnetic components attract the first electromagnetic components at the corresponding positions.

9. The detection device according to claim 8, characterized in that, The positioning plate also includes multiple magnetic reset points, each magnetic reset point including a third electromagnetic component. The second magnetic control component is electrically connected to each of the third electromagnetic components. The second magnetic control component is also used to control the third electromagnetic components to generate magnetism, so that the third electromagnetic components attract the first electromagnetic components at the corresponding positions to a set initial position in the probe activity area.

10. A method for detecting a light-emitting device, characterized in that, The method of testing the light-emitting device under test using the detection device according to any one of claims 1-9 includes: The positioning plate is determined to have the same distribution pattern of the magnetic positioning points as the pin distribution pattern of the light-emitting device to be tested; The first magnetic control component controls the first electromagnetic component of each probe to generate magnetism, so that the first electromagnetic component drives the probe to move to the position corresponding to the pin of the corresponding light-emitting device to be tested. Move the carrier plate so that the signal contacts of each probe make electrical contact with the pins of each light-emitting device to be tested; The test electrical signal is transmitted to the light-emitting device under test through the signal transmission component via each of the signal contacts.

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