Pixel structure and display panel
Patent Information
- Application Number
- CN202311436162.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-31
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2043-10-31
AI Technical Summary
然而在实现彩色显示时,如果通过R、G、B混色得到白色光等任意颜色的光,则需要制备对应R、G、B三种颜色的子像素,工艺复杂
[0025]所述吸光结构设置于所述基板和所述像素结构之间,且所述吸光结构在所述像素结构上的垂直投影位于所述半透导电层的边缘区;
Smart Images

Figure CN117310968B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of display technology, and more particularly to a pixel structure and a display panel. Background Technology
[0002] An interferometric modulation display structure (IMOD) is an optical resonant cavity with a controllable cavity length, similar to a Fabry-Perot etalon. A monochrome IMOD display structure can display black and another color. The color rendering principle of a color IMOD is similar, except that each IMOD pixel contains sub-pixels of three colors: red, green, and blue, with each sub-pixel ranging in size from approximately 10μm to 200μm.
[0003] IMOD displays offer advantages such as energy saving, fast response speed, and wide operating temperature range. However, when achieving color display, if any color of light, such as white light, is obtained by mixing R, G, and B, it is necessary to fabricate sub-pixels corresponding to the three R, G, and B colors, which involves complex processes. Summary of the Invention
[0004] This invention provides a pixel structure and display panel to reduce manufacturing complexity while achieving color display.
[0005] According to one aspect of the present invention, a pixel structure is provided, comprising:
[0006] Semi-permeable conductive layer, supporting structure and movable reflective conductive layer;
[0007] The semi-permeable conductive layer includes a central region and an edge region, with the edge region surrounding the central region; the support structure is located between the semi-permeable conductive layer and the movable reflective conductive layer, and the support structure is located in the edge region; the support structure is used to support the movable reflective conductive layer, so that there is a gap between the movable reflective conductive layer and the semi-permeable conductive layer.
[0008] The central region includes at least two sub-regions. In different sub-regions, the optical path between the first surface of the semi-permeable conductive layer and the second surface of the movable reflective conductive layer is different. The first surface is the surface of the semi-permeable conductive layer adjacent to the movable reflective conductive layer, and the second surface is the surface of the movable reflective conductive layer adjacent to the semi-permeable conductive layer.
[0009] Optionally, the thickness of the support structure is a fixed value.
[0010] Optionally, the pixel structure may also include:
[0011] An insulating layer; the at least one insulating layer is located between the supporting structure and the semi-permeable conductive layer; the insulating layer covers the edge region and the central region;
[0012] The preset distance and the thickness of the insulating layer are different in different sub-regions;
[0013] The preset distance is the distance between the surface of the insulating layer away from the semi-permeable conductive layer and the second surface.
[0014] Optionally, the insulating layer includes a transparent insulating layer and an etching barrier layer;
[0015] The transparent insulating layer is disposed between the etching barrier layer and the semi-permeable conductive layer;
[0016] The different sub-regions have at least one different preset distance, thickness of transparent insulating layer, and thickness of etching barrier layer.
[0017] Optionally, the thickness of both the semi-permeable conductive layer and the movable reflective conductive layer is a fixed value, and the first surface and the second surface are planar.
[0018] Optionally, the thickness of both the semi-transparent conductive layer and the movable reflective conductive layer is a fixed value, and the distance between the first surface and the second surface is different in different sub-regions.
[0019] Optionally, the at least two sub-regions are arranged in an array.
[0020] Optionally, the semi-permeable conductive layer includes two sub-regions;
[0021] In the two sub-regions: one sub-region emits yellow light and the other sub-region emits blue light; or, one sub-region emits sky blue light and the other sub-region emits orange light.
[0022] According to another aspect of the present invention, a display panel is provided, comprising a plurality of pixel structures as described in any embodiment of the present invention.
[0023] Optionally, the display panel may also include:
[0024] Substrate, light-absorbing structure, and packaging structure;
[0025] The light-absorbing structure is disposed between the substrate and the pixel structure, and the vertical projection of the light-absorbing structure on the pixel structure is located in the edge region of the semi-transparent conductive layer.
[0026] The encapsulation structure is disposed on the side of the pixel structure away from the substrate.
[0027] This invention provides an embodiment where the central region of a semi-transparent conductive layer comprises at least two sub-regions. In these different sub-regions, the optical path between the first surface of the semi-transparent conductive layer and the second surface of the movable reflective conductive layer differs, resulting in different wavelengths of light emitted from each sub-region. By setting the optical path between the first and second surfaces in different sub-regions, the light emitted from at least two sub-regions can be mixed to produce light of any color. This embodiment, by setting different optical paths for different sub-regions of a pixel structure, allows a single pixel structure to emit light of any color, such as white light. Compared to existing technologies that require three sub-pixels (red, green, and blue) to emit white light or other colors, this embodiment eliminates the need to fabricate multiple support structures of different heights, reducing manufacturing complexity.
[0028] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description
[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0030] Figure 1 This is a schematic diagram of a pixel structure provided in an embodiment of the present invention;
[0031] Figure 2 This is a schematic diagram of yet another pixel structure provided in an embodiment of the present invention;
[0032] Figure 3 This is a schematic diagram of yet another pixel structure provided in an embodiment of the present invention;
[0033] Figure 4 This is a schematic diagram of yet another pixel structure provided in an embodiment of the present invention;
[0034] Figure 5 This is a schematic diagram of yet another pixel structure provided in an embodiment of the present invention;
[0035] Figure 6 This is a schematic diagram of yet another pixel structure provided in an embodiment of the present invention;
[0036] Figure 7 This is a top view schematic diagram of a pixel structure provided in an embodiment of the present invention;
[0037] Figure 8 This is a top view schematic diagram of another pixel structure provided in an embodiment of the present invention;
[0038] Figure 9 This is a top view schematic diagram of another pixel structure provided in an embodiment of the present invention;
[0039] Figure 10 This is a top view schematic diagram of another pixel structure provided in an embodiment of the present invention;
[0040] Figure 11 This is a schematic diagram of a display panel provided by the present invention.
[0041] Figure 12 This is a cross-sectional schematic diagram of a display panel provided by the present invention;
[0042] Figure 13 This is a partial enlarged view of a display panel provided by the present invention. Detailed Implementation
[0043] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.
[0044] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0045] This invention provides a pixel structure. Figure 1 This is a schematic diagram of a pixel structure provided in an embodiment of the present invention, for reference. Figure 1 The pixel structure 70 includes:
[0046] A semi-permeable conductive layer 10, a supporting structure 20, and a movable reflective conductive layer 30;
[0047] The semi-permeable conductive layer 10 includes a central region 100 and an edge region 200, with the edge region 200 surrounding the central region 100; a support structure 20 is located between the semi-permeable conductive layer 10 and the movable reflective conductive layer 30, and the support structure 20 is located in the edge region 200; the support structure 20 is used to support the movable reflective conductive layer 30, so that there is a gap between the movable reflective conductive layer 30 and the semi-permeable conductive layer 10.
[0048] The central region 100 includes at least two sub-regions 101. In different sub-regions 101, the optical path between the first surface 11 of the semi-permeable conductive layer 10 and the second surface 31 of the movable reflective conductive layer 30 is different. The first surface 11 is the surface of the semi-permeable conductive layer 10 adjacent to the movable reflective conductive layer 30, and the second surface 31 is the surface of the movable reflective conductive layer 30 adjacent to the semi-permeable conductive layer 10.
[0049] In this embodiment, a pixel structure 70 is a light-emitting unit. The pixel structure 70 can be applied in a display panel, which may include multiple pixel structures 70 arranged in an array. A pixel structure 70 is the smallest light-emitting unit in the display panel. The semi-transparent conductive layer 10 may be made of Mo / Al or NiAl material, and the movable reflective conductive layer 30 may be made of Al and / or Ni materials. For example, the movable reflective conductive layer 30 may include an Al layer and a Ni layer.
[0050] Each sub-pixel structure 70 includes a semi-transparent conductive layer 10, a support structure 20, and a movable reflective conductive layer 30. The support structure 20 creates a gap between the movable reflective conductive layer 30 and the semi-transparent conductive layer 10. The gap between the central region 100 of the semi-transparent conductive layer 10 and the movable reflective layer 30 forms an optical microcavity. The optical microcavity selects ambient light incident through the semi-transparent conductive layer 10, allowing only light of a specific wavelength to exit from the semi-transparent conductive layer 10. Depending on the cavity length of the optical microcavity, the pixel structure 70 displays different colors, and the cavity length of the pixel structure 70 can be set as needed. When the movable reflective conductive layer 30 and the semi-transparent conductive layer 10 are attracted together, the pixel structure 70 displays black when the cavity length is 0; when the movable reflective conductive layer 30 and the semi-transparent conductive layer 10 are separated, the pixel structure 70 displays the color corresponding to its cavity length. The movable reflective conductive layer 30 and the semi-transparent conductive layer 10 can be energized or de-energized, causing the movable reflective conductive layer 30 to move up and down, thus controlling the switching of the pixel structure. For example, when an electrical signal is applied to the movable reflective conductive layer 30 and the semi-transparent conductive layer 10, the movable reflective conductive layer 30 deforms or moves, attracting the movable reflective conductive layer 30 to the semi-transparent conductive layer 10, eliminating the gap between the movable reflective conductive layer 30 and the semi-transparent conductive layer 10, thereby stopping the pixel structure from emitting light and turning it off. When the pixel structure needs to emit light, no electrical signal is applied to the movable reflective conductive layer 30 and the semi-transparent conductive layer 10, leaving a gap between them, allowing the pixel structure to emit light. Alternatively, the pixel structure can emit light when energized and be attracted to the semi-transparent conductive layer 10 when de-energized, thus turning the pixel structure off.
[0051] In this embodiment, the central region 100 includes at least two sub-regions 101. In different sub-regions 101, the optical path length between the first surface 11 of the semi-transparent conductive layer 10 and the second surface 31 of the movable reflective conductive layer 30 is different. That is, the cavity length of the microcavity formed by the movable reflective conductive layer 30 and the semi-transparent conductive layer 10 in different sub-regions 101 is different, resulting in different wavelengths of light emitted from different sub-regions 101. By setting the optical path length between the first surface 11 and the second surface 31 in different sub-regions 101, the light emitted from at least two sub-regions 101 can be mixed to produce light of any color. For example, the light emitted from at least two sub-regions 101 can be mixed to produce white light.
[0052] In this embodiment of the invention, the central region 100 of the semi-transparent conductive layer 10 includes at least two sub-regions 101. In different sub-regions 101, the optical path between the first surface of the semi-transparent conductive layer 10 and the second surface of the movable reflective conductive layer 30 is different, so that the wavelength of the light emitted from different sub-regions 101 is different. By setting the optical path between the first surface and the second surface in different sub-regions 101, the light emitted from at least two sub-regions 101 can be mixed to produce light of any color. In this embodiment, by setting different optical paths for different sub-regions of a pixel structure, a single pixel structure can emit light of any color, such as white light. Compared with the prior art, which requires three sub-pixels (red, green, and blue) to achieve the emission of white light and other arbitrary light, this embodiment does not require the fabrication of multiple support structures 20 of different heights, thus reducing the difficulty of the process.
[0053] Optionally, the light emitted from different sub-regions 101 can be mixed to produce white light.
[0054] In this embodiment, the pixel structure 70 can emit white light through a single pixel structure 70. Compared with the prior art, which requires the fabrication of multiple different sub-pixels to achieve the emission of white light or other arbitrary light, this embodiment does not require the fabrication of multiple support structures of different heights, thus simplifying the pixel structure 70 and reducing the difficulty of the manufacturing process.
[0055] Optionally, the thickness of the support structure 20 is a fixed value. That is, the thickness of the support structure 20 in the same pixel structure 70 remains unchanged and is the same value, which further reduces the difficulty of the process.
[0056] Optional, see reference Figure 1 The pixel structure 70 also includes:
[0057] Insulating layer 40; insulating layer 40 is located between supporting structure 20 and semi-permeable conductive layer 10; insulating layer 40 covers edge region 200 and central region 100;
[0058] At least one of the following is different among the different sub-regions 101: the preset distance s2 and the thickness s1 of the insulating layer 40;
[0059] The preset distance s2 is the distance between the surface of the insulating layer 40 away from the semi-permeable conductive layer 10 and the second surface 31.
[0060] Specifically, Figure 2 This is a schematic diagram of another pixel structure provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of another pixel structure provided in an embodiment of the present invention. Figure 4 This is a schematic diagram of another pixel structure provided in an embodiment of the present invention. Figure 5 This is a schematic diagram of another pixel structure provided in an embodiment of the present invention. Figure 6 This is a schematic diagram of yet another pixel structure provided in an embodiment of the present invention. (Reference) Figures 1-6 At least one of the following is different among different sub-regions 101: the preset distance s2 and the thickness s1 of the insulating layer 40: the preset distance s2 and the thickness s1 of the insulating layer 40 may both be different among different sub-regions 101. Figure 1 and Figure 2 Alternatively, different sub-regions 101 may correspond to different preset distances s2, while the thickness s1 of the insulating layer 40 remains the same. Figure 3 and Figure 4 Alternatively, the thickness s1 of the insulating layer 40 in different sub-regions 101 may be different, while the preset distance s2 may be the same. Figure 5 and Figure 6 ).
[0061] refer to Figure 3 and Figure 4 The thickness of the insulating layer 40 in different sub-regions 101 can be set to be the same. The distance s between the first surface 11 and the second surface 31 in different sub-regions 101 can be adjusted by changing the shape of the first surface of the semi-permeable conductive layer 10, and the preset distance s2 of different sub-regions 101 can be adjusted. In addition, refer to Figure 5 and Figure 6 Alternatively, the shape of the second surface of the movable reflective layer 30 in different sub-regions 101 can be adjusted to adjust the distance s between the first surface 11 and the second surface 31 in different sub-regions 101, and to adjust the preset distance s2 of the different sub-regions 101. For example, refer to... Figure 3 This allows the surface of the semi-permeable conductive layer 10 away from the supporting structure 20 to remain planar. By setting different thicknesses of the semi-permeable conductive layer 10 in different sub-regions 101, the height of the first surface 11 of the semi-permeable conductive layer 10 in different sub-regions becomes different, thereby adjusting the preset distance s2 between the different sub-regions 101. Furthermore, referring to… Figure 4 Alternatively, the thickness of the semi-permeable conductive layer 10 can be kept constant, and the semi-permeable conductive layer 10 can be set in a stepped shape, so that the height of the first surface 11 of the semi-permeable conductive layer 10 is different.
[0062] The space between the surface of the insulating layer 40 away from the semi-permeable conductive layer 10 and the second surface 31 is air. The refractive index of air is different from that of the insulating layer 40. By setting different sub-regions 101, and setting at least one of the preset distance s2 and the thickness s1 of the insulating layer 40 to be different, the optical path between the first surface 11 and the second surface 31 of the different sub-regions 101 can be better achieved.
[0063] Optionally, the insulating layer 40 includes a transparent insulating layer 41 and an etching barrier layer 42;
[0064] A transparent insulating layer 41 is disposed between an etch barrier layer 42 and a semi-permeable conductive layer 10;
[0065] Different sub-regions 101 have at least one different preset distance, thickness of transparent insulating layer 41, and thickness of etching barrier layer 42.
[0066] Specifically, in different sub-regions 101, at least one of the following is different: the preset distance, the thickness of the transparent insulating layer 41, and the thickness of the etching barrier layer 42. This can be achieved by having different thicknesses of the transparent insulating layer 41 in different sub-regions 101. Figure 2 Alternatively, the thickness of the etching barrier layer 42 may differ in different sub-regions 101. Figure 1 Alternatively, the preset distance s2 corresponding to different sub-regions 101 may be different. Figure 3 and Figure 4 Alternatively, the preset distance s2 of different sub-regions 101, the thickness of the transparent insulating layer 41, and the thickness of the etching barrier layer 42 may all be different.
[0067] Optional, see reference Figure 1 and Figure 2 The thicknesses of the semi-permeable conductive layer 10 and the movable reflective conductive layer 30 are both constant, and the first surface 11 and the second surface 31 are planar.
[0068] Specifically, the thickness of the semi-permeable conductive layer 10 and the movable reflective conductive layer 30 are both constant values, that is, the thickness of the semi-permeable conductive layer 10 at each position is the same, and the thickness of the movable reflective conductive layer 30 at each position is the same, and the thickness of the movable reflective conductive layer 30 at each position is the same, and the thickness of the movable reflective conductive layer 30 at each position is the same.
[0069] The thicknesses of the semi-transparent conductive layer 10 and the movable reflective conductive layer 30 are both constant. The first surface 11 and the second surface 31 are planar, meaning that the thicknesses of the semi-transparent conductive layer 10 and the movable reflective conductive layer 30 are the same in different sub-regions 101. The fact that the first surface 11 and the second surface 31 are planar ensures that the light transmittance of the semi-transparent conductive layer 101 is the same in different sub-regions 101 of the pixel structure, ensuring that the pixel structure has a good light emission effect. It also ensures that the movable reflective conductive layer 30 in different sub-regions 101 can be well attracted to the semi-transparent conductive layer 101, ensuring that the pixel structure can be accurately switched on and off. Furthermore, the fabrication of the semi-transparent conductive layer 10 and the movable reflective conductive layer 30 is simple, which can further reduce the difficulty of the process.
[0070] Optionally, the thickness of the semi-transparent conductive layer 10 and the movable reflective conductive layer 30 are both constant values, and the distance s between the first surface 11 and the second surface 31 is different in different sub-regions.
[0071] For details, please refer to Figure 4 By keeping the thickness of the semi-permeable conductive layer 10 constant and setting it in a stepped shape, the height of the first surface 11 of the semi-permeable conductive layer 10 can be different. The semi-permeable conductive layer 10 can be fabricated on the surface of the stepped film layer to achieve the fabrication of a stepped semi-permeable conductive layer.
[0072] refer to Figure 6 Alternatively, the movable reflective layer 30 can be set in a stepped shape to achieve different heights of the second surface 31 of the movable reflective layer 30 in different sub-regions 101, and to achieve different distances s between the first surface 11 and the second surface 31 in different sub-regions 101.
[0073] By setting different distances 's' between the first surface 11 and the second surface 31, the adjustable range of the optical path difference between them is expanded, allowing for better adjustment of the emitted light color in different sub-regions 101. Furthermore, by setting the thicknesses of the semi-transparent conductive layer 10 and the movable reflective conductive layer 30 to constant values, the transmittance of the semi-transparent conductive layer 10 in different sub-regions 101 of the pixel structure is ensured to be the same, guaranteeing a good light emission effect for the pixel structure. Additionally, different sub-regions can ensure that the movable reflective conductive layer 30 can be well attracted to the semi-transparent conductive layer 101, ensuring accurate switching of the pixel structure.
[0074] Figure 7 This is a top view schematic diagram of a pixel structure provided in an embodiment of the present invention. Figure 8 This is a top view schematic diagram of another pixel structure provided in an embodiment of the present invention. Figure 9 This is a top view schematic diagram of another pixel structure provided in an embodiment of the present invention. Figure 10 This is a top view schematic diagram of another pixel structure provided in an embodiment of the present invention. (Reference) Figures 7-10 Optional, at least two sub-regions can be arranged in a 101 array.
[0075] For details, please refer to Figure 7 When a pixel structure includes two sub-regions 101, the two sub-regions 101 are arranged sequentially along a preset direction. The size and shape of the two sub-regions 101 can be the same or different. The light emitted from the two sub-regions 101 is mixed to produce white light or other colors of light.
[0076] When a pixel structure includes three sub-regions 101, the three sub-regions 101 can be arranged sequentially along a preset direction, as shown in the reference. Figure 8 The line connecting the geometric centers of the three sub-regions 101 can also form a triangle.
[0077] When a pixel structure includes four sub-regions 101, the four sub-regions 101 can be arranged sequentially along a preset direction, as shown in the reference. Figure 9 It can also be arranged in a 2x2 array.
[0078] In addition, refer to Figure 10A pixel structure can also include four or more sub-regions 101, which are arranged in an m*n array, where m and n are both integers greater than or equal to 2. The optical path between the first surface and the second surface can be different for different sub-regions 101.
[0079] Optional, see reference Figure 7 The semi-permeable conductive layer 10 includes two sub-regions 101;
[0080] In the two sub-regions 101: one sub-region emits yellow light, and the other sub-region emits blue light; or, one sub-region emits sky blue light, and the other sub-region emits orange light. This configuration allows the pixel structure to achieve white light display with fewer sub-regions 101.
[0081] This invention also provides a display panel. Figure 11 This is a schematic diagram of a display panel provided by the present invention, for reference. Figure 11 The display panel includes a plurality of pixel structures 70 as described in any embodiment of the present invention.
[0082] The display panel is designed to display black and white images. Each pixel structure 70 is an independent light-emitting unit, and each pixel structure 70 is the smallest light-emitting unit in the display panel. When ambient light shines on the display panel, each pixel structure 70 can emit white light or not emit light, thus appearing black. By controlling the switching of multiple pixel structures 70, the display panel can display any black and white image.
[0083] Figure 12 This is a cross-sectional schematic diagram of a display panel provided by the present invention, for reference. Figure 12 The display panel also includes a substrate 60 and a packaging structure 50. Multiple pixel structures 70 are disposed on the substrate 60, and the packaging structure 50 is disposed on the side of the pixel structures 70 away from the substrate 60. The packaging structure 50 is used to encapsulate the pixel structures 70.
[0084] Optionally, an encapsulation support structure 51 is also provided between the encapsulation structure 50 and the pixel structure 70.
[0085] Figure 13 This is a partially enlarged view of a display panel provided by the present invention, for reference. Figure 13 Optionally, the display panel may also include:
[0086] Substrate 60, light-absorbing structure 80, and encapsulation structure 50;
[0087] The light-absorbing structure 80 is disposed between the substrate 60 and the pixel structure 70, and the vertical projection of the light-absorbing structure 80 on the pixel structure 70 is located at the edge region 200 of the semi-transparent conductive layer 10.
[0088] The encapsulation structure 50 is disposed on the side of the pixel structure 70 away from the substrate 60.
[0089] The light-absorbing structure 80 absorbs ambient light, preventing incident ambient light from escaping. The light-absorbing structure 80 surrounds the central area 100 and defines the boundaries of the pixel structures, separating adjacent pixel structures. The light-absorbing structure 80 can be fabricated using Mo / Al. A second transparent insulating layer 110 is also included between the light-absorbing structure 80 and the semi-transparent conductive layer 10. To increase the conductivity of the semi-transparent conductive layer 10, a conductive layer 90 can also be fabricated on the surface of the semi-transparent conductive layer 10. For example, the vertical projection of the conductive layer 90 onto the semi-transparent conductive layer 10 can be positioned within the vertical projection of the support structure 20 onto the surface of the semi-transparent conductive layer 10. The encapsulation structure 50 may include an encapsulation support structure 51 and an encapsulation layer 52.
[0090] It should be noted that, Figure 13 The display panel shown in the image is merely an example illustrating a single pixel structure and is not intended to limit the scope of the invention.
[0091] For details, please refer to Figure 13 The specific manufacturing process of the display panel may include:
[0092] A Mo / Al layer is deposited on a glass or plastic substrate 60, and this layer is fabricated into a grid layer as a light-absorbing structure 80. A second transparent insulating layer 110 (which can be an insulating material such as silicon oxide or silicon nitride) is deposited on the above pattern. A semi-transparent metal layer is then deposited on the second transparent insulating layer 110 to form a semi-transparent conductive layer 10. This layer can be made of Mo / Al or NiAl material, and the metal layer is fabricated into a strip extending along the row direction.
[0093] Based on the above pattern, a transparent insulating layer 41 (which can be an insulating material such as silicon oxide or silicon nitride) is deposited, and AlOx is deposited on the above layer as an etch stop layer 42. A partial opening is made in the etch stop layer 42, which is used to set up connection structures such as pads or connecting lines for bonding external circuit boards.
[0094] Based on the above layers, a sacrificial layer (e.g., Mo, Si, etc.) is deposited and etched; this layer is then patterned by etching. For color or multi-color screens (display devices include light-emitting units of at least two colors), this layer requires multiple depositions and etchings. A transparent insulating layer is deposited on the sacrificial layer, and the transparent insulating layer is patterned to obtain the support structure 20. Based on this layer, a deformable reflective conductive layer is deposited (the deformable reflective conductive layer can be Al, Ni, etc.).
[0095] Finally, a sacrificial layer etching is performed to form the support structure 20. At the corresponding positions of the support structure 20 at the four corners of the pixel structure, a packaging support structure 51 with a height >5µm is further fabricated using a process of adhesive coating, exposure, and etching. This packaging support structure 51 is responsible for attaching to the subsequent packaging layer, preventing the subsequent packaging layer film from scratching the deformable reflective conductive layer. Finally, the packaging layer 52 is attached to the support surface of the packaging support structure 51.
[0096] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.
[0097] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.
Claims
1. A pixel structure, characterized in that, include: Semi-permeable conductive layer, supporting structure and movable reflective conductive layer; The semi-permeable conductive layer includes a central region and an edge region, the edge region surrounding the central region; The support structure is located between the semi-permeable conductive layer and the movable reflective conductive layer, and the support structure is located in the edge region; the support structure is used to support the movable reflective conductive layer, so that there is a gap between the movable reflective conductive layer and the semi-permeable conductive layer; The central region includes at least two sub-regions. In different sub-regions, the optical path between the first surface of the semi-permeable conductive layer and the second surface of the movable reflective conductive layer is different. The first surface is the surface of the semi-permeable conductive layer adjacent to the movable reflective conductive layer, and the second surface is the surface of the movable reflective conductive layer adjacent to the semi-permeable conductive layer. The thickness of the support structure is a constant.
2. The pixel structure according to claim 1, characterized in that, Also includes: An insulating layer; the at least one insulating layer is located between the supporting structure and the semi-permeable conductive layer; The insulating layer covers the edge area and the central area; The preset distance and the thickness of the insulating layer are different in different sub-regions; The preset distance is the distance between the surface of the insulating layer away from the semi-permeable conductive layer and the second surface.
3. The pixel structure according to claim 2, characterized in that: The insulating layer includes a transparent insulating layer and an etching barrier layer; The transparent insulating layer is disposed between the etching barrier layer and the semi-permeable conductive layer; The different sub-regions have at least one different preset distance, thickness of transparent insulating layer, and thickness of etching barrier layer.
4. The pixel structure according to claim 2, characterized in that: The thicknesses of the semi-permeable conductive layer and the movable reflective conductive layer are both constant, and the first surface and the second surface are planar.
5. The pixel structure according to claim 2, characterized in that: The thickness of both the semi-transparent conductive layer and the movable reflective conductive layer is a constant value, and the distance between the first surface and the second surface is different in different sub-regions.
6. The pixel structure according to claim 1, characterized in that: The at least two sub-region arrays are arranged.
7. The pixel structure according to claim 1, characterized in that: The semi-permeable conductive layer comprises two sub-regions; In the two sub-regions: one sub-region emits yellow light and the other sub-region emits blue light; or, one sub-region emits sky blue light and the other sub-region emits orange light.
8. A display panel, characterized in that, It includes multiple pixel structures as described in any one of claims 1-7.
9. The display panel according to claim 8, characterized in that, Also includes: Substrate, light-absorbing structure, and packaging structure; The light-absorbing structure is disposed between the substrate and the pixel structure, and the vertical projection of the light-absorbing structure on the pixel structure is located at the edge region of the semi-transparent conductive layer. The encapsulation structure is disposed on the side of the pixel structure away from the substrate.
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