Fan selection method and device, energy storage power supply and readable storage medium

Abstract

The application discloses a fan selection method, a fan selection device, an energy storage power supply and a nonvolatile computer readable storage medium. The fan selection method is applied to the energy storage power supply, and the energy storage power supply comprises electronic components, power devices and a radiator. The fan selection method comprises the following steps: calculating the working temperature of the electronic components based on a preset cooling air flow; calculating the junction temperature of the power devices based on the preset cooling air flow; obtaining a target cooling air flow according to the working temperature of the electronic components and the junction temperature of the power devices; obtaining a design air flow and calculating a flow resistance according to the target cooling air flow; and obtaining a first selection result according to the input number of fans, the design air flow, the calculated flow resistance, a wind pressure-flow relationship curve and a preset constraint. The first selection result comprises the structural parameters and performance parameters of the selected fan, and the preset constraint represents the constraint of the size of the radiator and the design air flow on the first selection result. The fan selection method provided by the application can screen out a fan that meets the cooling requirements of the electronic components and the power devices of the energy storage power supply.

Description

Technical Field

[0001] This application relates to the field of equipment selection technology, and in particular to a wind turbine selection method, a wind turbine selection device, an energy storage power supply, and a non-volatile computer-readable storage medium. Background Technology

[0002] Currently, energy storage power supplies have made significant progress in increasing capacity and improving maximum discharge power. Several energy storage power supplies with different capacities and discharge powers are available on the market to match the power consumption of various appliances with different durations and power consumption in environments without mains power. However, the application scenarios for energy storage power supplies are relatively limited. Environments without mains power often involve special weather conditions such as sandstorms and rain, requiring energy storage power supplies with high IP protection ratings to support power consumption in these environments.

[0003] High IP protection level energy storage power supplies are structurally sealed, and the internal inverters and battery packs also require waterproof enclosures. Internally, there are partitions for mounting the motherboard and other PCB components. For encapsulated inverters, heat dissipation cannot be directly applied to the component surfaces. Furthermore, the components on the inverter are densely packed and generate significant heat, making natural heat dissipation difficult. Therefore, solving the heat dissipation problem of inverters under these conditions is urgently needed. Summary of the Invention

[0004] This application provides a wind turbine selection method, a wind turbine selection device, an energy storage power supply, and a non-volatile computer-readable storage medium.

[0005] The fan selection method of this application is applied to an energy storage power source, which includes electronic components, power devices, and heat sinks. The fan selection method includes: calculating the operating temperature of the electronic components based on a preset heat dissipation airflow rate; calculating the junction temperature of the power devices based on the preset heat dissipation airflow rate; obtaining a target heat dissipation airflow rate based on the operating temperature of the electronic components and the junction temperature of the power devices; obtaining a design airflow rate and calculated flow resistance based on the target heat dissipation airflow rate; and obtaining a first selection result based on the input number of fans used, the design airflow rate, the calculated flow resistance, the air pressure-flow rate relationship curve, and preset constraints. The preset constraints characterize the constraints imposed by the heat sink size and the design airflow rate on the first selection result. The first selection result includes the structural parameters and performance parameters of the selected fan.

[0006] The fan selection device described in this application is applied to the selection of fans for energy storage power supplies. The energy storage power supply includes electronic components, power devices, and heat sinks. The fan selection device includes a first calculation module, a second calculation module, a third calculation module, a fourth calculation module, and a primary selection module. The first calculation module calculates the operating temperature of the electronic components based on a preset heat dissipation airflow rate. The second calculation module calculates the junction temperature of the power devices based on the preset heat dissipation airflow rate. The third calculation module obtains a target heat dissipation airflow rate based on the operating temperature of the electronic components and the junction temperature of the power devices. The fourth calculation module obtains a design airflow rate and a calculated flow resistance based on the target heat dissipation airflow rate. The primary selection module obtains a first selection result based on the input number of fans used, the calculated flow resistance, the design airflow rate, the air pressure-flow rate relationship curve, and preset constraints. The preset constraints represent the constraints imposed by the heat sink size and the design airflow rate on the first selection result. The first selection result includes the structural parameters and performance parameters of the selected fan.

[0007] The energy storage power supply according to this application includes stacked packaged inverters, heat dissipation components, and battery packs. The packaged inverters include electronic components and power devices, and the heat dissipation components include a heat sink and a fan. The size, quantity, and maximum available airflow of the fan conform to a first selection result, which is obtained by executing a fan selection method. The fan selection method includes: calculating the operating temperature of the electronic components based on a preset heat dissipation airflow; calculating the junction temperature of the power devices based on the preset heat dissipation airflow; obtaining a target heat dissipation airflow based on the operating temperature of the electronic components and the junction temperature of the power devices; obtaining a design airflow and calculated flow resistance based on the target heat dissipation airflow; and obtaining the first selection result based on the input number of fans used, the calculated flow resistance, the design airflow, the air pressure-flow rate relationship curve, and preset constraints. The preset constraints represent the constraints of the heat sink size and the design airflow on the first selection result. The first selection result includes the structural parameters and performance parameters of the selected fan.

[0008] The present application discloses a non-volatile computer-readable storage medium containing a computer program, comprising one or more processors. When the computer program is executed by the one or more processors, the processors implement a fan selection method. The fan selection method includes: calculating the operating temperature of the electronic component based on a preset heat dissipation airflow rate; calculating the junction temperature of the power device based on the preset heat dissipation airflow rate; obtaining a target heat dissipation airflow rate based on the operating temperature of the electronic component and the junction temperature of the power device; obtaining a design airflow rate and airflow resistance based on the target heat dissipation airflow rate; and obtaining a first selection result based on the input number of fans used, the design airflow rate, the calculated airflow resistance, the air pressure-flow rate relationship curve, and preset constraints. The preset constraints characterize the constraints imposed by the size of the heat sink and the design airflow rate on the first selection result. The first selection result includes the structural parameters and performance parameters of the selected fan.

[0009] The fan selection method, fan selection device, energy storage power supply, and non-volatile computer-readable storage medium provided in this application calculate the operating temperature of electronic components and the junction temperature of power devices based on a preset heat dissipation airflow rate. The target heat dissipation airflow rate, which characterizes the heat dissipation requirements of the energy storage power supply, is obtained based on the operating temperature of the electronic components and the junction temperature of the power devices. The design airflow rate and calculated flow resistance are obtained based on the target heat dissipation airflow rate. The design airflow rate, calculated flow resistance, and air pressure-flow rate relationship curve are combined with preset constraints to obtain a first selection result. The fan selected by the first selection result is adapted to the size of the radiator, and the maximum available airflow rate of the selected fan meets the design airflow rate requirement.

[0010] Additional aspects and advantages of the embodiments of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0011] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, wherein:

[0012] Figure 1 This is a schematic diagram of the structure of an energy storage power source according to certain embodiments of this application;

[0013] Figure 2 This is a schematic diagram of the structure of a packaged inverter according to certain embodiments of this application;

[0014] Figure 3 This is a flowchart illustrating the fan selection method according to certain embodiments of this application;

[0015] Figure 4 This is a schematic diagram of the structure of a fan selection device according to certain embodiments of this application;

[0016] Figure 5 This is a flowchart illustrating the fan selection method according to certain embodiments of this application;

[0017] Figure 6 This is a schematic diagram of the thermal resistance network model of a packaged inverter according to certain embodiments of this application;

[0018] Figure 7 This is a schematic diagram of the thermal resistance network model corresponding to the power device in some embodiments of this application;

[0019] Figure 8 This is a schematic diagram of the wind pressure-flow rate relationship curve and operating point coordinates of certain embodiments of this application;

[0020] Figure 9 This is a schematic diagram of the structure of a computer-readable storage medium according to certain embodiments of this application. Detailed Implementation

[0021] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting the embodiments of this application.

[0022] Please see Figure 1 and Figure 2 This application provides an energy storage power supply 100. The energy storage power supply 100 includes a housing 10, and a packaged inverter 20, a heat dissipation assembly 30, and a battery pack 40 stacked within the housing 10. The packaged inverter 20 includes electronic components and power devices. The heat dissipation assembly 30 includes an air duct 31, a heat sink 32, and a fan 33, with the heat sink 32 and fan 33 disposed within the air duct 31. The electronic components include transformers, inductors, capacitors, etc., which are not limited herein. The tops of the electronic components contact the housing of the air duct 31 through thermally conductive silicone pads to form a heat transfer path. The power devices include packaged MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), rectifier bridges, IGBTs (Insulated-Gate Bipolar Transistors), etc., which are not limited herein. The encapsulated inverter 20 is equipped with a heat dissipation extrusion component, which includes a longitudinal surface and a transverse surface. The longitudinal surface is substantially perpendicular to the transverse surface. The longitudinal surface is in contact with the power device, and the transverse surface is in contact with the outer shell of the air duct 31, so that the power device forms a heat transfer path through the contact between the heat dissipation extrusion component and the outer shell of the air duct 31. The heat dissipation extrusion component can be made of thermally conductive materials such as metals or alloys, for example, copper, aluminum, iron-aluminum alloys, copper-aluminum alloys, etc., without limitation.

[0023] The heat accumulated in the casing of the air duct 31 is conducted and diffused to the fins of the heat sink 32 through the substrate of the heat sink 32. The heat flow at the fins of the heat sink 32 is then dissipated by convection through the airflow generated by the fan 33. Thus, for the inverter packaged in the energy storage power supply 100, the heat accumulated in the packaged inverter 20 can be conducted to the heat dissipation assembly 30, where the heat sink 32 and fan 33 are used for heat dissipation. On the one hand, the heat dissipation assembly 30 can achieve heat dissipation without directly acting on the surface of the components of the packaged inverter 20, thereby minimizing the impact on the operation and lifespan of the components of the packaged inverter 20; on the other hand, the convection cooling method using the fan 33 has good heat dissipation performance and easily meets the heat dissipation requirements of the densely arranged and high-heat-generating components of the packaged inverter 20.

[0024] In order to enable the fan 33 to meet the heat dissipation requirements of the densely arranged and high-heat-generating components of the packaged inverter 20 as much as possible, this application also provides a fan selection method to select a suitable fan model based on the energy storage power supply 100 with the packaged inverter 20.

[0025] Please see Figure 3 The methods for selecting wind turbines include:

[0026] 01: Calculate the operating temperature of electronic components based on the preset heat dissipation airflow;

[0027] 02: Calculate the junction temperature of the power device based on the preset heat dissipation airflow rate;

[0028] 03: Obtain the target heat dissipation gas flow rate based on the operating temperature of electronic components and the junction temperature of power devices;

[0029] 04: Obtain the design airflow rate and calculate the flow resistance based on the target heat dissipation airflow rate; and

[0030] 05: Based on the input number of fans used, design airflow, calculated flow resistance, air pressure-flow relationship curve and preset constraints, obtain the first selection result. The preset constraints represent the constraints of the size of radiator 32 and design airflow on the first selection result. The first selection result includes the structural parameters and performance parameters of the selected fan.

[0031] Please see Figure 4This application also provides a fan selection device 200, which can automatically execute a fan selection method to improve the efficiency of fan selection and save manpower. The fan selection device 200 includes a first calculation module 201, a second calculation module 202, a third calculation module 203, a fourth calculation module 204, and a primary selection module 205. The first calculation module 201 executes the method in step 01, the second calculation module 202 executes the method in step 02, the third calculation module 203 executes the method in step 03, the fourth calculation module 204 executes the method in step 04, and the primary selection module 205 executes the method in step 05. Specifically, the first calculation module 201 calculates the operating temperature of electronic components based on a preset heat dissipation airflow rate. The second calculation module 202 calculates the junction temperature of power devices based on a preset heat dissipation airflow rate. The third calculation module 203 obtains the target heat dissipation airflow rate based on the operating temperature of the electronic components and the junction temperature of the power devices. The fourth calculation module 204 is used to obtain the design airflow rate and calculate the flow resistance based on the target heat dissipation airflow rate. The primary selection module 205 is used to obtain the first selection result based on the input number of fans used, design airflow rate, calculated flow resistance, air pressure-flow rate relationship curve, and preset constraints.

[0032] Based on the preceding text, fan 33 is primarily used to provide convective heat dissipation at the fins of heat sink 32. To meet the heat dissipation requirements of the components in the packaged inverter 20, it is necessary to ensure that the target heat dissipation airflow provided by fan 33 meets the requirements. After obtaining the target heat dissipation airflow, the design airflow and calculated flow resistance can be obtained based on the target heat dissipation airflow. The design airflow is the design requirement for the airflow provided by fan 33 while meeting the heat dissipation requirements. The calculated flow resistance is the gas flow resistance based on the heat transfer model of the packaged inverter 20 components of the energy storage power supply 100 while meeting the heat dissipation requirements. The calculated flow resistance and design airflow correspond to the operating point of fan 33, that is, the calculated flow resistance corresponds to the operating air pressure of fan 33, and the design airflow corresponds to the operating airflow of fan 33. The air pressure-flow rate relationship curve is the performance curve of fan 33. Based on the calculated flow resistance and design airflow corresponding to the operating point of fan 33, the fan 33 with better performance corresponding to the operating point can be selected by combining the air pressure-flow rate relationship curve. Since the fan 33 is used to provide convective heat dissipation at the fins of the radiator 32, when selecting the fan 33 by combining the design airflow rate, calculated flow resistance, and air pressure-flow rate relationship curve, preset constraints can be introduced as constraints for selecting the fan 33. These preset constraints characterize the constraints of the radiator 32 size and design airflow rate on the first selection result, ensuring that the selected fan 33 adapts to the size of the radiator 32 and that the maximum available airflow rate of the selected fan 33 meets the design airflow rate requirement. Thus, the obtained first selection result for the fan 33 includes the structural and performance parameters of the selected fan. Specifically, the first selection result includes parameters such as the size, quantity, and maximum available airflow rate of the fan 33. The fan 33 selected based on the parameters of the first selection result is well-suited to the heat dissipation requirements of the energy storage power supply 100 with the encapsulated inverter 20. Please refer to... Figure 1 The fan 33 in the energy storage power supply 100 can be selected based on the first selection result, so that the size, quantity and maximum air supply flow of the fan 33 in the energy storage power supply 100 can meet the heat dissipation requirements of the encapsulated inverter of the energy storage power supply 100.

[0033] The target heat dissipation airflow rate is related to the heat source temperature in the packaged inverter 20. The calculation of the heat source temperature in the packaged inverter 20 can be converted into the calculation of the operating temperature of the electronic components and the junction temperature of the power devices. Under different convective heat dissipation environments in the packaged inverter 20, the corresponding operating temperatures of the electronic components and the junction temperatures of the power devices also change accordingly. Therefore, it can be determined whether the corresponding heat dissipation airflow rate can meet the heat dissipation requirements based on whether the operating temperatures of the electronic components and the junction temperatures of the power devices are within their normal operating temperature ranges.

[0034] The preset cooling airflow rate is a parameter set in advance to obtain the target cooling airflow rate. If the operating temperature of the electronic component and the junction temperature of the power device calculated based on the preset cooling airflow rate are both within the temperature range that meets their normal operating requirements, it indicates that the current preset cooling airflow rate can meet the cooling requirements, and the current preset cooling airflow rate can be used as the target cooling airflow rate. If the operating temperature of the electronic component or the junction temperature of the power device calculated based on the preset cooling airflow rate are not within the temperature range that meets their normal operating requirements, the value of the preset cooling airflow rate can be adjusted and the corresponding operating temperature of the electronic component and the junction temperature of the power device can be recalculated until the calculated operating temperature of the electronic component and the junction temperature of the power device corresponding to a certain preset cooling airflow rate are both within the temperature range that meets their normal operating requirements.

[0035] Based on this, please refer to Figure 5 In some implementations, an initial preset heat dissipation airflow rate can be set based on the maximum operating temperature of the electronic components and power devices and the measured ambient temperature. The initial preset heat dissipation airflow rate can be calculated according to the following formula.

[0036] Initial preset heat dissipation airflow formula: q v0 =(T max -T a ) / (Cp f ·ρ f ).

[0037] Where, q v0 The initial preset cooling airflow rate is T. max The highest operating temperature of electronic components and power devices, T a For ambient temperature, Cp f ρ is the specific heat capacity of the airflow. f This refers to the airflow density. If the operating temperature of the electronic component or the junction temperature of the power device, calculated based on the preset heat dissipation airflow, does not meet the operating temperature range, the value of the preset heat dissipation airflow is adjusted in reverse according to the judgment result until the judgment results of both the electronic component and the power device can be met. Then, the current preset heat dissipation airflow is output as the target heat dissipation airflow.

[0038] Accordingly, 03: The target heat dissipation gas flow rate is obtained based on the operating temperature of the electronic components and the junction temperature of the power devices; it also includes:

[0039] 031: When the operating temperature of the electronic component is in the first temperature range and the junction temperature of the power device is in the second temperature range, the current preset heat dissipation gas flow rate is used as the target heat dissipation gas flow rate.

[0040] 032: When the operating temperature of an electronic component is not within the first temperature range, the preset heat dissipation gas flow rate is updated based on the highest operating temperature of the electronic component. The new operating temperature of the electronic component is calculated based on the updated preset heat dissipation gas flow rate, and the new junction temperature of the power device is calculated based on the updated preset heat dissipation gas flow rate; and

[0041] 033: When the operating temperature of the power device is not within the second temperature range, update the preset heat dissipation gas flow rate based on the highest junction temperature of the power device, calculate the new operating temperature of the electronic component based on the updated preset heat dissipation gas flow rate, and calculate the new junction temperature of the power device based on the updated preset heat dissipation gas flow rate.

[0042] Accordingly, the third calculation module 203 can also be used to execute the methods in steps 031, 032, and 033. That is, the third calculation module 203 can also be used to: when the operating temperature of the electronic component is in a first temperature range and the junction temperature of the power device is in a second temperature range, use the current preset heat dissipation gas flow rate as the target heat dissipation gas flow rate; when the operating temperature of the electronic component is not in the first temperature range, update the preset heat dissipation gas flow rate according to the highest operating temperature of the electronic component, calculate the new operating temperature of the electronic component based on the updated preset heat dissipation gas flow rate, and calculate the new junction temperature of the power device based on the updated preset heat dissipation gas flow rate; and when the operating temperature of the power device is not in the second temperature range, update the preset heat dissipation gas flow rate according to the highest junction temperature of the power device, calculate the new operating temperature of the electronic component based on the updated preset heat dissipation gas flow rate, and calculate the new junction temperature of the power device based on the updated preset heat dissipation gas flow rate.

[0043] Step 031 corresponds to the case where the judgment results for both electronic components and power devices are satisfied. In this case, the current preset heat dissipation airflow rate is output as the target heat dissipation airflow rate. Step 032 corresponds to the case where the judgment result for electronic components is not satisfied. In this case, the heat dissipation airflow rate can be updated based on the highest operating temperature of the electronic components. Step 033 corresponds to the case where the judgment result for power devices is not satisfied. In this case, the heat dissipation airflow rate can be updated based on the highest junction temperature of the power devices.

[0044] Please see Figure 6 , Figure 6 yes Figure 2 The thermal resistance network model of the packaged inverter is shown. It is assumed that the outer casing of the air duct 31 and the substrate of the heat sink 32 are in close contact without gaps. Assume that the number of power devices on the inverter is 2, forming heat flow region 1 and heat flow region 2 on the substrate of the heat sink 32. Several heat sources correspond to the tops of several electronic components, constituting heat flow region 3. The temperature of the heat source region in the thermal resistance network model can be calculated using the following heat source temperature formula.

[0045] Heat source temperature calculation formula 1:

[0046]

[0047]

[0048] Formula 2 for heat source temperature: Formula 3 for heat source temperature: Heat source temperature calculation formula four: Formula 5 for heat source temperature: Formula 6 for heat source temperature: Formula 7 for heat source temperature: Formula 8 for heat source temperature: Heat source temperature calculation formula nine: Heat source temperature calculation formula ten: Heat source temperature calculation formula eleven: Formula 12 for heat source temperature:

[0049] Formula 13 for heat source temperature:

[0050] Formula 14 for heat source temperature:

[0051] Formula 15 for heat source temperature:

[0052] Formula 16 for heat source temperature calculation:

[0053] Formula 17 for heat source temperature:

[0054] Formula 18 for heat source temperature:

[0055] Formula 19 for heat source temperature calculation:

[0056] Heat source temperature calculation formula 20:

[0057] Formula 21 for heat source temperature:

[0058] Formula 22 for heat source temperature:

[0059] In the above formula, the superscript k can be 1 or 2, used to represent the parameters of heat flow region 1 and heat flow region 2 respectively, and the subscript i can be 1, 2, ..., N, used to represent the parameters belonging to the i-th element heat source. In the heat source temperature formula one, and The average temperature of the top surface of the heat-conducting extrusion component corresponding to the power devices in heat flow region 1 and heat flow region 2 is used as... T i Let Q be the temperature of the i-th heat source, and Q1 and Q2 be the heat flows of heat flow region 1 and heat flow region 2, respectively. i Let be the heat flow of the i-th electronic component.

[0060] In the formula for heat source temperature, R c R represents the thermal resistance of the heat sink substrate. c It can be calculated using formula two for the heat source temperature. In formula two, D is the sum of the substrate thickness of the inverter and the outer shell thickness of the air duct 31, L and W are the length and width of the heat sink 32, respectively, and λs is the thermal conductivity of the heat dissipation extrusion component.

[0061] In the formula for heat source temperature, This indicates the thermal resistance of the silicone pads in heat flow regions 1 and 2. It can be calculated using formula three for the heat source temperature. In formula three, δ is the thickness of the thermally conductive silicone pad on the top surface of the heat-conducting extrusion component, Ak is the surface area of ​​the thermally conductive silicone pad corresponding to the heat flow region k, and λg is the thermal conductivity of the thermally conductive silicone.

[0062] In the formula for heat source temperature, R gi R represents the thermal resistance of the silicone pad corresponding to the heat source of each component. gi It can be calculated using formula four for the heat source temperature. In formula four for the heat source temperature, δ i A represents the thickness of the silicone pad for the heat source of the i-th component. i This represents the area of ​​the heat source of the i-th element.

[0063] In the formula for heat source temperature, This indicates the diffusion thermal resistance of heat flow regions 1 and 2 on the substrate of heat sink 32. It can be calculated using formula five for the heat source temperature. In formula five for the heat source temperature, C... k The correction factor, characterizing the effect of the distance between the heat source location and the center of the substrate surface on the diffusion thermal resistance, can be calculated using heat source temperature formula six. In heat source temperature formula six, dx and dy represent the lateral and longitudinal distances between the center of the heat source and the center of the heat sink 32 substrate, respectively. ξ k It is the area factor, which is related to the area of ​​the heat source and the surface area of ​​the heat sink 32 substrate, and can be calculated by formula seven for the heat source temperature.

[0064] In the formula for heat source temperature, R si R represents the diffusion thermal resistance of the heat sink substrate 32 corresponding to the heat source of each component. si It can be calculated using formula eight for the heat source temperature. In formula eight for the heat source temperature, C′ i and ξ′ iThe correction factor and area factor corresponding to the heat source diffusion thermal resistance of the i-th element can be calculated using heat source temperature formulas nine and ten. In heat source temperature formula nine, d xi and d yi This represents the distance in the horizontal and vertical directions between the center point of the heat source of the i-th element and the center point of the heat sink 32 substrate.

[0065] In the formula for heat source temperature, R h R represents the thermal resistance of the 32-fin radiator. h It can be calculated using formula eleven for the heat source temperature. In formula eleven, h is the convective heat transfer coefficient on the 32 fins of the radiator, which can be calculated using formula fifteen for the heat source temperature. f The number of fins in radiator 32 can be calculated using formula thirteen for heat source temperature. In formula thirteen, s is the fin thickness of radiator 32, H is the fin height of radiator 32, η is the fin heat transfer efficiency, defined as the ratio of the actual heat dissipation of the fins to the heat dissipation assuming the entire fin surface is at the fin root temperature, which can be calculated using formula t for heat source temperature.

[0066] In heat source temperature formula 15, Nu is the ratio of the convective heat transfer coefficient multiplied by the fluid's characteristic size to its thermal conductivity. Nu can be calculated using heat source temperature formula 14. In heat source temperature formula 14, Re is the fluid Reynolds number, which is the ratio of the fluid velocity multiplied by its characteristic size to its kinematic viscosity. Pr is the fluid Prandtl number, which is the ratio of the fluid's kinematic viscosity to its thermal conductivity. The thermal conductivity is the ratio of thermal conductivity to density multiplied by specific heat. The fluid velocity can be calculated using heat source temperature formula 16. In heat source temperature formula 16, q... v The preset heat dissipation airflow rate is given. In formula 15 for heat source temperature, τ = 2H·t / (H+t).

[0067] In the formula for heat source temperature, This represents the diffusion thermal resistance between the i-th element heat source and the k-th heat flow region, used to characterize the heat transfer caused by the temperature difference between the heat flow region k and each heat source. It can be calculated using formula seventeen for the heat source temperature. In formula seventeen for the heat source temperature, and These represent the corresponding correction factor and area factor, respectively, which can be calculated using heat source temperature formulas nine, eighteen, and nineteen. In heat source temperature formula nineteen, x i and y i L represents the length and width of the heat source of the i-th element, respectively. k and W k This represents the length and width of the heat flow region k. This represents the lateral distance between the center of the heat source of the i-th element and the center of the heat flow region k. This represents the longitudinal distance between the center of the heat source of the i-th element and the center of the heat flow region k.

[0068] In the formula for heat source temperature, This represents the diffusion thermal resistance between heat source i and heat source j. When i = j, it is defined as follows: It can be calculated using formula twenty for the temperature of the heat source. In formula twenty for the temperature of the heat source, C... ij The correction factor, representing the distance between elements i and j relative to their geometric dimensions, can be calculated using formula twenty-two for the heat source temperature. ij This is the area coefficient, related to the area of ​​the two heat sources, and can be calculated using formula twenty-one for heat source temperature. In formula twenty-two for heat source temperature, d... xij and d yij These represent the horizontal and vertical distances between the centers of heat source i and heat source j, respectively. l and w represent the length and width of the heat source, respectively.

[0069] After solving for the temperature Ti of each heat source according to the above heat source temperature formula, for several heat sources Ti formed by electronic components, this temperature Ti corresponds to the temperature of the top of the electronic component, which is also the operating temperature of the electronic component. In one embodiment, the over-temperature verification of all electronic components can be performed sequentially on the solved Ti to determine whether the operating temperature of the electronic component is within the first temperature range. For any electronic component i (i = 1, 2, ..., N), if 1.2 * Ti < the maximum temperature limit value of electronic component i, it indicates that the temperature of N electronic components meets the requirements.

[0070] For power devices, the heat source is concentrated on the internal wafer. The heat flow of the power device first reaches the longitudinal plane of the heat-conducting extrusion component through the thermal resistance of its own packaging substrate and the external ceramic pad. On the longitudinal plane of the heat-conducting extrusion component, the heat flow of each power device passes through the thermal resistance of the longitudinal plane of the heat-conducting extrusion component and the thermal resistance of diffusion, as well as the thermal resistance of diffusion between the power devices based on the temperature difference, until it reaches the top surface of the heat-conducting extrusion component. Finally, the heat flow on the top surface of the heat-conducting extrusion component is further conducted and diffused by the fan 33, thereby reaching the heat source temperature state calculated by the above heat source temperature formula.

[0071] Please see Figure 7 , Figure 7 It is a thermal resistance network model corresponding to power devices, and the junction temperature of each power device can be calculated through the junction temperature formula.

[0072] Junction temperature calculation formula 1:

[0073]

[0074] Junction temperature calculation formula 2: Junction temperature calculation formula 3: Junction temperature calculation formula four: Junction temperature calculation formula five: Junction temperature calculation formula six: Formula 7 for junction temperature calculation: Formula 8 for junction temperature calculation: Formula 9 for junction temperature calculation: Formula 10 for junction temperature calculation:

[0075] Formula 11 for junction temperature calculation:

[0076] Formula 12 for junction temperature calculation:

[0077] Formula 13 for junction temperature calculation:

[0078] Formula 14 for junction temperature calculation:

[0079] In the first formula for junction temperature calculation Let i represent the junction temperature of the i-th power device, where i = 1, 2, 3, ..., N. This indicates the thermal resistance of the power device package. The value of the package thermal resistance can be obtained by referring to the junction temperature - package thermal resistance in the power device datasheet. The thermal resistance of the ceramic pads for each power device can be calculated using Equation 2 for junction temperature. In Equation 2 for junction temperature, δ tc The thickness of the ceramic pad at the bottom of the power device. Let λ be the area of ​​the substrate at the bottom of each power device. tc denoted as , where is the thermal conductivity of the ceramic gasket.

[0080] In the first formula for junction temperature calculation The thermal resistance of each power device on the vertical surface of the heat dissipation extrusion component can be calculated using equation three for junction temperature. In equation three, p is the height of the vertical surface of the heat dissipation extrusion component, l is the length of the heat dissipation extrusion component, and D... p The thickness of the vertical surface of the heat dissipation extrusion component. The correction factor characterizes the effect of the distance between the wafer position of the i-th power device and the center of the vertical surface of the heat dissipation extrusion component on the diffusion thermal resistance, and can be calculated by the junction temperature formula four. R is the area factor, which is related to the area of ​​the substrate at the bottom of the i-th power device and the area of ​​the vertical surface of the heat dissipation extrusion component. It can be calculated using the junction temperature formula. p The thermal resistance of the longitudinal plane of the heat dissipation extrusion component in the thickness direction can be calculated using formula six for junction temperature.

[0081] In the first formula for junction temperature, r xij This represents the diffusion thermal resistance between the i-th and j-th devices. Defined when i = j, It can be calculated using formula seven for junction temperature. In formula seven, d xij and d yij These represent the horizontal and vertical distances between wafers i and j, respectively. pij The correction factor, representing the distance between power devices i and j relative to their geometric dimensions, can be calculated using junction temperature formula nine. In formula nine, ap and bp represent the length and width of the substrate at the bottom of the device, respectively. ξ pij It is the area factor, which is related to the area of ​​the substrates at the bottom of the two devices, and can be calculated using the junction temperature formula.

[0082] In the first formula for junction temperature calculation The thermal resistance of the i-th power device on the vertical surface of the heat dissipation component can be calculated using the junction temperature formula. sw The thermal resistance representing diffusion on the top surface of the heat dissipation extrusion component can be calculated using junction temperature formula eleven. In junction temperature formula eleven, C... w The correction factor, representing the influence of the distance between the center of the initial region corresponding to the heat flow of the power device on the top surface of the heat dissipation extrusion component and the overall center of the top surface of the heat dissipation extrusion component on the diffusion thermal resistance, can be calculated using junction temperature formula 12. ξ w This is the area factor, which is related to the area of ​​the initial region corresponding to the heat flow of the power device on the top surface of the heat dissipation extrusion component and the overall area of ​​the top surface of the heat dissipation extrusion component. It can be calculated using formula thirteen for junction temperature. D w The thickness of the top surface of the heat dissipation extrusion component. w The thermal resistance of the top surface of the heat dissipation extrusion component can be calculated using formula fourteen for junction temperature.

[0083] The junction temperature of each power device is calculated based on the above heat source temperature formula. Then, by analyzing the solution... Over-temperature verification is performed on the power devices sequentially to determine whether their junction temperatures fall within the second temperature range. For any power device (i = 1, 2, ..., N), if all conditions are met... If the temperature of power device i is less than the maximum temperature limit, then the temperature of the power device meets the requirements.

[0084] In some implementations, when the operating temperature of the electronic component is not within the first temperature range, or when the junction temperature of the power device is not within the second temperature range, the updated preset heat dissipation airflow can be calculated according to the updated formula.

[0085] Update equation 1: qvnew =Δq+q vold ;

[0086] Update formula two:

[0087] Where, q vnew The updated preset heat dissipation airflow rate, q vold The preset cooling airflow rate before the update is represented, Δq represents the update amount of the preset cooling airflow rate, i represents the electronic component number, and T represents the refresh rate of the preset cooling airflow rate. i T′ represents the operating temperature of the i-th electronic component. i T represents the highest operating temperature of an electronic component. e1 Characterizing the first temperature range, Cp f ρ represents the specific heat capacity of the airflow. f The gas flow density is represented by j, and the power device number is represented by j. Characterizing the junction temperature of the j-th power device, T represents the highest junction temperature of a power device. e2 Characterizes the second temperature range.

[0088] The preset heat dissipation airflow rate is calculated iteratively by sequentially traversing each electronic component and power device until the operating temperature of each electronic component is within the first temperature range and the junction temperature of each power device is within the second temperature range. At this point, the current preset heat dissipation airflow rate is output as the target heat dissipation airflow rate for subsequent calculations. After obtaining the target heat dissipation airflow rate, the design airflow rate and flow resistance in step 04 can be calculated based on the target heat dissipation airflow rate. The design airflow rate can be calculated using the design airflow rate formula.

[0089] Design airflow rate calculation formula:

[0090] In the formula for calculating airflow rate, q f Characterizing the design gas flow rate, q v Characterizes the target heat dissipation airflow rate.

[0091] Flow resistance can be calculated using the flow resistance calculation formula.

[0092] Formula 1 for calculating flow resistance:

[0093] Formula 2 for calculating flow resistance:

[0094] Formula 3 for calculating flow resistance:

[0095] Formula 4 for calculating flow resistance:

[0096] Formula 5 for calculating flow resistance:

[0097] In the formula for calculating flow resistance, ΔP represents the calculated flow resistance, and K... in K represents the inlet drag loss coefficient of the airflow. out The airflow outlet drag loss coefficient is represented by L, the length of radiator 32 is represented by τ, and the characteristic dimension of the airflow in the fins of radiator 32 is represented by ρ. air V represents air density. f The design airflow velocity is represented by H, the height of the fins of the radiator 32 is represented by t, the fin spacing of the radiator 32 is represented by W, the width of the radiator 32 is represented by s, and the fin thickness of the radiator 32 is represented by n. f The number of fins in radiator 32 is represented by f, and the apparent coefficient of friction is represented by Re. f The Reynolds number is used to characterize the flow resistance.

[0098] The calculated design airflow rate and calculated flow resistance are used in the subsequent calculation of the first selection result.

[0099] In some implementations, 05: Obtain the first selection result based on the design airflow rate, calculated flow resistance, air pressure-flow rate relationship curve, and preset constraints, including:

[0100] 051: Based on preset constraints and the input number of fans to be used, obtain 33 candidate fans;

[0101] 052: Obtain the operating point coordinates of each candidate fan 33 based on the design airflow rate and calculated flow resistance. The operating point coordinates represent the fan pressure and fan flow rate of the candidate fan 33; and

[0102] 053: Obtain the first selection result based on the positional relationship between the working point coordinates and the wind pressure-flow rate curve in the wind pressure-flow rate coordinate system.

[0103] Accordingly, the primary selection module 205 can also be used to execute the methods in steps 051, 052, and 053. That is, the primary selection module 205 can also be used to obtain the candidate fans 33 according to preset constraints; obtain the operating point coordinates of each candidate fan 33 according to the design airflow and calculated flow resistance, where the operating point coordinates represent the fan pressure and fan flow of the candidate fan 33; and obtain the first selection result according to the positional relationship between the operating point coordinates and the air pressure-flow curve in the air pressure-flow coordinate system.

[0104] In one embodiment, the fan selection manual is first invoked, and fans 33 of various sizes and airflow specifications in the manual are screened according to preset constraints to obtain candidate fans 33. The preset constraints include a first constraint type, a second constraint type, and a third constraint type.

[0105] First constraint: S≤D+H;

[0106] Second constraint: (Num+2)×S≤W;

[0107] Third constraint: Num×q max >q f ;

[0108] Where S represents the size of the candidate fan 33, D represents the thickness of the substrate of the radiator 32, H represents the height of the fins of the radiator 32, W represents the width of the radiator 32, Num represents the number of candidate fans 33, and q max q represents the maximum available air flow rate of the candidate fan 33. f Characterizes the design gas flow rate.

[0109] Based on the design airflow formula and the calculation flow resistance formula, for a given radiator 32 structure, the design airflow of the candidate fan 33 can be input to output the corresponding calculated flow resistance of the candidate fan 33. The design airflow and calculated flow resistance of the candidate fan 33 correspond to the operating point coordinates of the candidate fan 33. The operating point coordinates of the candidate fan 33 reflect the fan pressure and fan flow of the candidate fan 33.

[0110] Please see Figure 8 Next, a wind pressure-flow rate coordinate system is established with flow rate on the horizontal axis and wind pressure on the vertical axis. The operating point coordinates and wind pressure-flow rate relationship curves of each candidate fan 33 are input into this coordinate system. The operating point coordinates of the candidate fan 33 are (1 / Num·q) fan p fan ), Num is the number of candidate fans 33 input, q fan p is the flow rate of the fan 33 to be selected. fan The air pressure of the fan 33 to be selected is 33. For example... Figure 8 As shown, the wind pressure-flow rate relationship curve is the performance curve of fan 33. The parameters within the range enclosed by the wind pressure-flow rate relationship curve and the coordinate axes of the coordinate system are the parameters corresponding to the fan 33 with suitable performance. The candidate fan 33 corresponding to the coordinates of the working point within the range enclosed by the wind pressure-flow rate relationship curve and the coordinate axes of the coordinate system is the fan 33 selected in the first selection result.

[0111] In some implementations, the fan selection method further includes:

[0112] 06: Based on the first selection result and the objective function, obtain the objective function value, and then obtain the second selection result based on the objective function value.

[0113] Please combine Figure 4In some embodiments, the wind turbine selection device 200 further includes a secondary selection module 206, which is used to execute the method in step 06. That is, the secondary selection module 206 is used to obtain a target function value based on the first selection result and the target function, so as to obtain a second selection result based on the target function value.

[0114] The objective function takes into account the noise and cost of the fan 33 based on the first selection result, in order to select the fan 33 with the lowest possible noise and cost. The objective function is shown below.

[0115] Objective function:

[0116] Where OF represents the objective function value, Num′ represents the number of wind turbines (33) in the first selection result, and Z k Characterizing the noise of the k-th fan 33 in the first selection result, max(Z k The maximum noise level of fan 33, representing the first selection result, is in J. k The unit price of the k-th wind turbine 33 in the first selection result is max(J). k The highest unit price of wind turbine 33 represents the first selection result.

[0117] The objective function is calculated sequentially for each fan 33 in the first selection result. After comparison, one or more fans 33 with the smallest possible objective function value are selected as the second selection result. Thus, the fans 33 determined based on the second selection result not only meet the heat dissipation requirements of the energy storage power supply 100, but also have the lowest possible noise and cost, resulting in a high cost-performance ratio.

[0118] Please see Figure 1 In summary, the fan 33 configured in the energy storage power supply 100 proposed in this application can be the fan 33 selected by the first selection result in any of the above embodiments, to ensure that the fan 33 can meet the heat dissipation requirements of the energy storage power supply 100. The fan 33 configured in the energy storage power supply 100 can be the fan 33 selected by the second selection result in any of the above embodiments, so as to ensure that the fan 33 can meet the heat dissipation requirements of the energy storage power supply 100 while having the lowest possible noise and the lowest possible cost, thus having a high cost-performance ratio.

[0119] Please see Figure 9 This application also provides a non-volatile computer-readable storage medium 400 containing a computer program 401. When the computer program 401 is executed by one or more processors 402, the one or more processors 402 perform the wind turbine selection method of any of the above embodiments, for example, performing the wind turbine selection method in steps 01, 02, 03, 04, 05, and 06 of the above embodiments.

[0120] In the description of this specification, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0121] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.

[0122] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A method for selecting a fan, characterized in that, The wind turbine is used in an energy storage power supply, which includes electronic components, power devices, and a heat sink. The wind turbine selection method includes: The operating temperature of the electronic component is calculated based on a preset heat dissipation airflow rate. The junction temperature of the power device is calculated based on the preset heat dissipation airflow rate; The target heat dissipation gas flow rate is obtained based on the operating temperature of the electronic component and the junction temperature of the power device; The design airflow rate and calculated flow resistance are obtained based on the target heat dissipation airflow rate; and The first selection result is obtained based on the input number of fans used, the design airflow rate, the calculated flow resistance, the air pressure-flow rate relationship curve, and preset constraints. The preset constraints represent the constraints imposed by the radiator size and the design airflow rate on the first selection result. The first selection result includes the structural and performance parameters of the selected fan. Obtaining the target heat dissipation airflow rate based on the operating temperature of the electronic components and the junction temperature of the power devices includes: When the operating temperature of the electronic component is in a first temperature range and the junction temperature of the power device is in a second temperature range, the current preset heat dissipation gas flow rate is taken as the target heat dissipation gas flow rate. If the operating temperature of the electronic component is not within the first temperature range, the preset heat dissipation airflow rate is updated based on the highest operating temperature of the electronic component. A new operating temperature of the electronic component is calculated based on the updated preset heat dissipation airflow rate, and a new junction temperature of the power device is calculated based on the updated preset heat dissipation airflow rate. If the junction temperature of the power device is not within the second temperature range, the preset heat dissipation gas flow rate is updated based on the highest junction temperature of the power device. The new operating temperature of the electronic component is calculated based on the updated preset heat dissipation gas flow rate, and the new junction temperature of the power device is calculated based on the updated preset heat dissipation gas flow rate. The updated preset heat dissipation gas flow rate can be calculated using update formula one and update formula two. Update equation 1: ; Update formula two: ; in, Characterizing the updated preset heat dissipation air flow rate, The preset heat dissipation airflow rate before the update is represented. The update amount characterizing the preset heat dissipation airflow. The number that characterizes electronic components. Characterizing the operating temperature of the i-th electronic component, Characterizing the highest operating temperature of the electronic component, Characterizing the first temperature range, Characterizing the specific heat capacity of airflow, Characterizing airflow density, The designation that characterizes power devices. Characterizing the junction temperature of the j-th power device, Characterizing the highest junction temperature of the power device, Characterizes the second temperature range.

2. The fan selection method according to claim 1, characterized in that, The design gas flow rate can be calculated using the design gas flow rate formula, and the calculated flow resistance can be calculated using flow resistance formula one, flow resistance formula two, flow resistance formula three, flow resistance formula four, and flow resistance formula five. Design airflow rate calculation formula: ; Formula 1 for calculating flow resistance: ; Formula 2 for calculating flow resistance: ; Formula 3 for calculating flow resistance: ; Formula 4 for calculating flow resistance: ; Formula 5 for calculating flow resistance: ; in, Characterizing the design gas flow rate, Characterizing the target heat dissipation air flow rate, Characterizes the calculated flow resistance, Characterizing the airflow inlet drag loss coefficient, The airflow outlet drag loss coefficient is represented by L, which represents the length of the radiator. Characteristic dimensions representing airflow within the fins of the radiator. Characterizing air density, The design airflow velocity is represented by H, the height of the radiator fins is represented by t, the fin spacing of the radiator is represented by W, the width of the radiator is represented by s, and the fin thickness of the radiator is represented by s. The number of fins in the heat sink is used to characterize the heat sink. Characterizing the apparent coefficient of friction, The Reynolds number characterizes the calculated flow resistance.

3. The fan selection method according to claim 1, characterized in that, The process of obtaining the first selection result based on the input number of fans in use, the design airflow rate, the calculated flow resistance, the air pressure-flow rate relationship curve, and preset constraints includes: The candidate fans are obtained based on the preset constraints and the input number of fans to be used; The operating point coordinates of each candidate fan are obtained based on the design airflow rate and the calculated flow resistance, where the operating point coordinates represent the fan pressure and fan flow rate of the candidate fan; and The first selection result is obtained based on the positional relationship between the working point coordinates and the wind pressure-flow rate curve in the wind pressure-flow rate coordinate system.

4. The fan selection method according to any one of claims 1-3, characterized in that, The preset constraints include a first constraint, a second constraint, and a third constraint. First constraint: ; Second constraint: ; Third constraint: ; in, The dimensions of the candidate fans are represented by D, the thickness of the radiator's substrate is represented by H, the height of the radiator's fins is represented by W, and the width of the radiator is represented by Num. Characterizes the maximum available air flow rate of the selected fan. Characterizes the design gas flow rate.

5. The fan selection method according to claim 1, characterized in that, The fan selection method also includes: Based on the first selection result and the objective function, the objective function value is obtained, and the second selection result is obtained based on the objective function value; Objective function: ; in, Characterizes the value of the objective function. The number of wind turbines representing the first selection result. Characterize the noise of the k-th fan in the first selection result. The maximum noise level of the fan representing the first selection result. The unit price of the k-th wind turbine in the first selection result is represented by... The highest unit price of the wind turbine representing the first selection result.

6. A fan selection device, characterized in that, The fan selection device is used for selecting fans for energy storage power supplies. The energy storage power supply includes electronic components, power devices, and heat sinks. The fan selection device includes: A first calculation module is used to calculate the operating temperature of the electronic component based on a preset heat dissipation airflow rate. The second calculation module is used to calculate the junction temperature of the power device based on a preset heat dissipation airflow rate; The third calculation module is used to obtain the target heat dissipation gas flow rate based on the operating temperature of the electronic component and the junction temperature of the power device. The fourth calculation module is used to obtain the calculated flow resistance and the design airflow rate based on the target heat dissipation airflow rate; and A primary selection module is used to obtain a first selection result based on the input number of fans used, the design airflow rate, the calculated flow resistance, the air pressure-flow rate relationship curve, and preset constraints. The preset constraints represent the constraints imposed by the radiator size and the design airflow rate on the first selection result. The first selection result includes the structural parameters and performance parameters of the selected fan. The third calculation module is further used for: When the operating temperature of the electronic component is in a first temperature range and the junction temperature of the power device is in a second temperature range, the current preset heat dissipation gas flow rate is taken as the target heat dissipation gas flow rate. If the operating temperature of the electronic component is not within the first temperature range, the preset heat dissipation airflow rate is updated based on the highest operating temperature of the electronic component. A new operating temperature of the electronic component is calculated based on the updated preset heat dissipation airflow rate, and a new junction temperature of the power device is calculated based on the updated preset heat dissipation airflow rate. If the junction temperature of the power device is not within the second temperature range, the preset heat dissipation gas flow rate is updated based on the highest junction temperature of the power device. The new operating temperature of the electronic component is calculated based on the updated preset heat dissipation gas flow rate, and the new junction temperature of the power device is calculated based on the updated preset heat dissipation gas flow rate. The updated preset heat dissipation gas flow rate can be calculated using update formula one and update formula two. Update equation 1: ; Update formula two: ; in, Characterizing the updated preset heat dissipation air flow rate, The preset heat dissipation airflow rate before the update is represented. The update amount characterizing the preset heat dissipation airflow. The number that characterizes electronic components. Characterizing the operating temperature of the i-th electronic component, Characterizing the highest operating temperature of the electronic component, Characterizing the first temperature range, Characterizing the specific heat capacity of airflow, Characterizing airflow density, The designation that characterizes power devices. Characterizing the junction temperature of the j-th power device, Characterizing the highest junction temperature of the power device, Characterizes the second temperature range.

7. An energy storage power source, characterized in that, The energy storage power supply includes stacked packaged inverters, heat dissipation components and battery packs. The packaged inverters include electronic components and power devices. The heat dissipation components include heat sinks and fans. The size, quantity, and maximum available air flow of the fan conform to the first selection result, which is obtained by the fan selection method described in any one of claims 1 to 6.

8. A non-volatile computer-readable storage medium comprising a computer program, including one or more processors, wherein when the computer program is executed by the one or more processors, the processors cause the processors to implement the instructions of the wind turbine selection method according to any one of claims 1 to 6.

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