A wafer-level MEMS-FPI tunable spectral filter chip screening method, system and medium

Abstract

This invention discloses a wafer-level MEMS-FPI tunable spectral filter chip screening method, system, and medium. The method includes fixing the spectral filter chip wafer on a worktable and dividing the wafer into four quadrants, with all spectral filter chips on the wafer connected in parallel; moving a robotic arm and aligning the center line of the camera system at the end of the robotic arm with the center point of the wafer; applying two sets of voltages to the wafer to induce double interference rings in the chips; moving the robotic arm from the center point of the wafer, quadrant by quadrant and chip by chip, according to a designed route, and acquiring state images under the two sets of voltages; and identifying the standard circular interference ring morphology and quantity based on a chip interference ring recognition algorithm and marking the chip as qualified or unqualified. This invention elevates the screening process from the chip level to the wafer level, avoiding the damage and positional changes that occur when handling individual chips on a worktable, thus improving the efficiency of the chip calibration process and the yield of chip packaging.

Description

Technical Field

[0001] This invention relates to the field of MEMS-FPI tunable spectral filter chip technology, and in particular to a wafer-level MEMS-FPI tunable spectral filter chip screening method, system and medium. Background Technology

[0002] The basic working principle of the MEMS-FPI tunable spectral filter chip is based on the Fabry-Perot interference principle. Its structure consists of two flat mirrors with semi-transparent and semi-reflective elements, one of which is fixed and the other movable. When a specific voltage is applied to the Fabry-Perot cavity, the cavity length changes, allowing incident light to enter and undergo stable multi-beam resonance. The light then exits the cavity with higher energy, while other wavelengths attenuate within the cavity. By driving the Fabry-Perot cavity with different voltages through an external circuit, the cavity length can be adjusted, thus achieving filtering effects across different wavelength bands.

[0003] Currently, the traditional testing methods for Fabry-Perot cavity filter chips mostly adopt the method of selecting several characteristic bands and calibrating the voltage band by band. That is, voltage scanning is performed under a specific band, and the chip is judged to be qualified when the ideal peak value appears under the corresponding voltage. This screening method has a large amount of calculation, low efficiency, and high professional requirements, which is not conducive to the screening and promotion of large-scale chips. Summary of the Invention

[0004] This invention provides a wafer-level MEMS-FPI tunable spectral filter chip screening method, system, and medium to solve the technical problems in the prior art.

[0005] The technical solution adopted in this invention is:

[0006] In a first aspect, the present invention provides a method for screening wafer-level MEMS-FPI tunable spectral filter chips, comprising:

[0007] The spectral filter chip wafer is fixed on the worktable. With the center point of the wafer as the origin of the coordinate system, the wafer is divided into four quadrants. The horizontal coordinate is kept at a set angle to each row of chips in the wafer. All the spectral filter chips in the wafer are connected in parallel.

[0008] Move the robotic arm and align the center line of the camera system at the end of the robotic arm with the center point of the wafer;

[0009] Two sets of voltages are applied to the wafer to enable the chips to exhibit double interference loops, thereby providing power to all chips in a unified manner. The robotic arm moves from the center of the wafer, quadrant by quadrant and chip by chip, according to the designed route. Image processing and recognition algorithms are used to detect whether a chip has entered the recognition area. When a chip enters the recognition area, an image extraction signal is triggered, and state images under the two sets of voltages are acquired respectively.

[0010] The acquired state images are used to identify the shape and number of standard circular interference rings based on the chip interference ring recognition algorithm. The recognition results are then transmitted to the judgment module to mark whether the chip is qualified or not. Finally, the marking results and corresponding position information are packaged and uploaded to the cloud platform or saved locally to complete the rapid screening of spectral filtering chips.

[0011] Furthermore, the wafer center point marking and chip arrangement on the wafer are added during the chip design phase and incorporated into the manufacturing process.

[0012] Furthermore, the camera system includes a near-infrared light source, a microscope, and a CCD imaging module.

[0013] Furthermore, the method for moving the robotic arm from the center point of the wafer, quadrant by quadrant and wafer by wafer, according to the designed route includes:

[0014] In a single quadrant, starting from the center point of the wafer, the robotic arm moves along an S-shaped path to take pictures. After taking pictures of one quadrant, the robotic arm returns to the center point of the wafer and then takes pictures of the chip recognition chip in the next quadrant, until all quadrants have been traversed.

[0015] Furthermore, it also includes the robotic arm step length correction and robotic arm direction correction processes;

[0016] The robotic arm step length correction process includes: determining the deviation value ΔL between the distance between the center points of two adjacent chips and the step length; when the deviation ΔL is greater than a set threshold, the current position of the robotic arm is readjusted to eliminate the cumulative error.

[0017] The robotic arm orientation correction process includes: determining the angle θ formed by the straight line formed by the center points of two adjacent chips and the coordinate axis; and correcting the angle of the robotic arm when θ is greater than a set threshold.

[0018] Furthermore, the image processing and recognition algorithm, upon identifying the electrode posts at the four corners of the chip, determines that the chip has entered the area that the microscope lens can recognize, and triggers the chip image extraction signal.

[0019] Furthermore, the method for identifying the shape and number of standard circular interference rings based on the acquired state images using a chip interference ring recognition algorithm includes:

[0020] When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to ε. When 2πR(1-ε)≤L≤2πR(1+ε), it is determined to be a standard ring and is included in the number of standard rings.

[0021] When four standard rings appear, the chip is marked as a qualified product. When three standard rings appear, impurity identification is performed. If impurities are found, a re-inspection signal is issued. If no impurities are found, the chip is marked as a defective product. If the number of standard rings is less than three, the chip is directly marked as a defective product.

[0022] Furthermore, the method for determining the presence of impurities includes: determining whether there is an irregular cluster of pixels in the state image that exceeds a set threshold; if such a cluster exists, then impurities are determined to exist; otherwise, they do not exist.

[0023] Secondly, a method for screening spectral filter chips is provided, including:

[0024] An external near-infrared light source is aligned with the center of the spectral filter chip. Two sets of voltages that can produce stable double interference rings on the spectral filter chip are selected respectively. Interference ring images under the two sets of voltages are acquired using a microscope system.

[0025] Based on the chip interference ring recognition algorithm, the standard circular interference ring morphology and number of interference rings were identified in the interference ring images under two different voltages.

[0026] When a total of 4 standard rings are detected, the chip is marked as a qualified product. When a total of 3 standard rings are detected, impurity identification is performed. If impurities are detected, a re-inspection signal is issued. If no impurities are detected, the chip is marked as a defective product. If the total number of standard rings is less than 3, the chip is directly marked as a defective product.

[0027] Furthermore, the method for determining the morphology of the standard circular interference ring includes:

[0028] When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to ε. When 2πR(1-ε)≤L≤2πR(1+ε), it is determined to be a standard ring and is included in the number of standard rings.

[0029] Thirdly, the present invention provides a wafer-level MEMS-FPI tunable spectral filter chip screening system, comprising:

[0030] The worktable is used to hold the wafer in place and maintain a set angle for each row of chips on the wafer.

[0031] The power supply module is used to apply two sets of voltages to the wafer, which can cause the chips to exhibit double interference rings. All spectral filter chips in the wafer are connected in parallel, thereby achieving unified power supply for all chips.

[0032] The robotic arm has a camera system at its end, which includes a near-infrared light source, a microscope, and a CCD imaging module; the CCD imaging module is used to acquire state images of the chips in the wafer.

[0033] The execution module is used to divide the wafer into four quadrants with the center point of the wafer as the origin of the coordinate system, and control the robotic arm to move from the center point of the wafer, quadrant by quadrant and chip by chip according to the designed route. It uses image processing and recognition algorithms to detect whether the chip has entered the recognition area. When the chip enters the recognition area, it triggers the image extraction signal and performs state image acquisition under two sets of voltages.

[0034] The interference ring morphology and quantity detection module is used to identify the morphology and quantity of standard circular interference rings in the state image based on the chip interference ring recognition algorithm.

[0035] The judgment module is used to mark the chip's pass / fail status based on the number of standard circular interference rings;

[0036] The storage module is used to package and upload the marking results and corresponding location information to the cloud platform or save them locally.

[0037] Fourthly, the present invention also provides a computer-readable storage medium storing computer-executable instructions, which, when invoked and executed by a processor, cause the processor to implement the spectral filter chip screening method described in the first or second aspect.

[0038] The beneficial effects of this invention are as follows: This invention locks the correlation between the differences in the interference ring state of MEMS-FPI tunable spectral filter chips under power and the chip manufacturing process, proposes a screening method using intelligent image recognition, and upgrades the screening process from the chip level to the wafer level. This avoids the impact of easy damage and positional changes of individual chips when placed and handled on the workbench, and realizes batch fast screening of filter chips in a simple and efficient manner. It improves the efficiency of chip calibration process and chip packaging yield, and plays a positive and effective role in the entire chip process. It can greatly promote the industrialization of MEMS-FPI tunable spectral filter chips. Attached Figure Description

[0039] Figure 1 This is a schematic flowchart of the wafer-level MEMS-FPI tunable spectral filter chip screening method disclosed in Embodiment 1 of the present invention;

[0040] Figure 2 This is a flowchart of the filter chip selection method disclosed in Embodiment 2 of the present invention. Detailed Implementation

[0041] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0042] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0043] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0044] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrases "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0045] Example 1:

[0046] See Figure 1 This embodiment discloses a wafer-level MEMS-FPI tunable spectral filter chip screening method, including:

[0047] S1: Fix the spectral filter chip wafer on the worktable, and divide the wafer into 4 quadrants with the center point of the wafer as the origin of the coordinate system, ensuring that the horizontal coordinate is at a set angle to each row of chips in the wafer; all the spectral filter chips in the wafer are connected in parallel.

[0048] Specifically, in the chip fabrication process, conductive grooves are uniformly etched next to each chip, and each chip is connected to the adjacent conductive groove for conductivity, thus achieving a parallel arrangement of all spectral filter chips. Furthermore, the wafer center point marking and chip arrangement on the wafer are added during the chip design phase and incorporated into the fabrication process; that is, the screening method described in this embodiment belongs to the testing phase of the chip fabrication process, therefore, at this point, several chips are already arrayed on the wafer. It is important to note that after fixing the spectral filter chip wafer on the worktable, it is necessary to ensure that the horizontal axis maintains a set angle with each row of chips on the wafer. Preferably, the horizontal axis is parallel to each row of chips on the wafer, i.e., the chips are in a horizontally and vertically aligned state.

[0049] S2: Move the robotic arm to align the center line of the camera system at the end of the robotic arm with the center point of the wafer.

[0050] Specifically, starting from the center point of the wafer, before the robotic arm begins scanning and imaging, it needs to be moved to align the center line of the camera system at the end of the robotic arm with the center point of the wafer. The camera system includes a near-infrared light source, a microscope, and a CCD imaging module. The near-infrared light source illuminates the chip, and the microscope and CCD imaging module acquire images of the chip's state under voltage.

[0051] S3: Apply two sets of voltages to the wafer to enable the chips to exhibit double interference loops, thereby providing power to all chips in a unified manner; the robotic arm moves from the center point of the wafer, quadrant by quadrant and chip by chip, according to the designed route, and uses image processing and recognition algorithms to detect whether the chip has entered the recognition area. When it enters the recognition area, the image extraction signal is triggered, and the status images under the two sets of voltages are acquired respectively.

[0052] After applying voltage to the wafer, since all the chips on the wafer are connected in parallel, it is a unified power supply mode, and there is no need to power each chip individually. This can greatly improve the efficiency of chip image acquisition.

[0053] Specifically, taking a MEMS-FPI tunable spectral filter chip (hereinafter referred to as the chip or spectral chip) with a response wavelength of 1750nm~2150nm as an example, the selected loading voltages are V1=35V and V2=36.5V, which can produce stable double interference rings. In a single quadrant, starting from the wafer center point, the robot arm moves and captures images along an S-shaped path. After capturing an image in one quadrant, the robot arm returns to the wafer center point and then performs chip recognition and image capture for the next quadrant, until all quadrants have been traversed. Because the robot arm returns to its initial position after each quadrant scan, the cumulative error of the robot arm can be reduced.

[0054] Since errors accumulate during the scanning and imaging process of the robotic arm, in order to minimize the accumulation of errors, the screening method in this embodiment also includes robotic arm step length correction and robotic arm orientation correction processes:

[0055] Set the coordinates of the center points of two adjacent chips as (X1, Y1) and (X2, Y2), with a step size of L. The specific step size correction of the robotic arm is as follows:

[0056] The deviation between the distance between the two center points and the step length is ΔL. When the deviation ΔL is greater than the set threshold, the current position of the robotic arm is readjusted to eliminate the accumulated error.

[0057] ΔL = ||X2 - X1| - L|……(when moving along the x-axis)

[0058] or

[0059] ΔL = ||Y2 - Y1| - L| ... (when moving along the y-axis)

[0060] The specific process of robotic arm orientation correction is as follows:

[0061] Let θ be the angle between the line formed by (X1,Y1) and (X2,Y2) and the coordinate axes. When θ is greater than a set threshold, the robot arm's angle is corrected; where:

[0062]

[0063] The image processing and recognition algorithm, once it identifies the electrode posts at the four corners of the chip, determines that the chip has entered the area that the microscope lens can recognize, and triggers the chip image extraction signal.

[0064] S4: The acquired status image is used to identify the shape and number of standard circular interference rings based on the chip interference ring recognition algorithm. The recognition result is then transmitted to the judgment module to mark whether the chip is qualified or not. Finally, the marking result and the corresponding position information are packaged and uploaded to the cloud platform or saved locally to complete the fast screening of spectral filtering chips.

[0065] Specifically, the method for identifying the shape and number of standard circular interference rings based on the acquired state images using a chip interference ring recognition algorithm includes:

[0066] When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to ε. When 2πR(1-ε)≤L≤2πR(1+ε), it is determined to be a standard ring and is included in the number of standard rings.

[0067] When four standard rings appear, the chip is marked as a qualified product. When three standard rings appear, impurity identification is performed. If impurities are found, a re-inspection signal is issued. If no impurities are found, the chip is marked as a defective product. If the number of standard rings is less than three, the chip is directly marked as a defective product.

[0068] The method for determining the presence of impurities includes: determining whether there is an irregular cluster of pixels in the state image that exceeds a set threshold; if so, it is determined that there are impurities, otherwise, they are not present.

[0069] It should be noted that the impurities described in this embodiment are substances located on the wafer surface. For a qualified chip, both sets of voltages can produce double interference rings, and due to the inconsistency of voltages, the diameters of the interference rings will differ (the larger the voltage, the larger the diameter of the interference ring). When two sets of voltages are applied to the chip, the appearance of four standard circular interference rings means that the chip is stable under both sets of voltages, and the chip is qualified. The appearance of three standard circular interference rings means that the chip is normal under one set of voltages. The reason for the missing standard circular interference ring may be that there are impurities on the chip surface, causing the rings to be obstructed or incomplete. Therefore, it is not included in the standard ring count when judging the standard circular interference ring morphology. When fewer than three standard circular interference rings appear, it means that no double interference ring phenomenon occurs under either set of voltages, and therefore it can be directly judged as a defective chip.

[0070] This embodiment focuses on the correlation between the differences in the interference ring states of MEMS-FPI tunable spectral filter chips under power and the chip manufacturing process. It proposes a screening method using intelligent image recognition, and upgrades the screening process from the chip level to the wafer level. This avoids the impact of easy damage and positional changes of individual chips when placed and handled on the workbench. It realizes batch rapid screening of filter chips in a simple and efficient manner, improves the efficiency of chip calibration process and chip packaging yield, and plays a positive and effective role in the entire chip process. It can greatly promote the industrialization of MEMS-FPI tunable spectral filter chips.

[0071] Example 2:

[0072] See Figure 2 This embodiment discloses a method for screening spectral filter chips, including:

[0073] An external near-infrared light source is aligned with the center of the spectral filter chip. Two sets of voltages that can produce stable double interference rings on the spectral filter chip are selected respectively. Interference ring images under the two sets of voltages are acquired using a microscope system.

[0074] Based on the chip interference ring recognition algorithm, the standard circular interference ring morphology and number of interference rings were identified in the interference ring images under two different voltages.

[0075] When a total of 4 standard rings are detected, the chip is marked as a qualified product. When a total of 3 standard rings are detected, impurity identification is performed. If impurities are detected, a re-inspection signal is issued. If no impurities are detected, the chip is marked as a defective product. If the total number of standard rings is less than 3, the chip is directly marked as a defective product.

[0076] Furthermore, the method for determining the morphology of the standard circular interference ring includes:

[0077] When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to ε. When 2πR(1-ε)≤L≤2πR(1+ε), it is determined to be a standard ring and is included in the number of standard rings.

[0078] Example 3:

[0079] This embodiment discloses a wafer-level MEMS-FPI tunable spectral filter chip screening system, including:

[0080] The worktable is used to hold the wafer in place and maintain a set angle for each row of chips on the wafer.

[0081] The power supply module is used to apply two sets of voltages to the wafer, which can cause the chips to exhibit double interference rings. All spectral filter chips in the wafer are connected in parallel, thereby achieving unified power supply for all chips.

[0082] The robotic arm has a camera system at its end, which includes a near-infrared light source, a microscope, and a CCD imaging module; the CCD imaging module is used to acquire state images of the chips in the wafer.

[0083] The execution module is used to divide the wafer into four quadrants with the center point of the wafer as the origin of the coordinate system, and control the robotic arm to move from the center point of the wafer, quadrant by quadrant and chip by chip according to the designed route. It uses image processing and recognition algorithms to detect whether the chip has entered the recognition area. When the chip enters the recognition area, it triggers the image extraction signal and performs state image acquisition under two sets of voltages.

[0084] The interference ring morphology and quantity detection module is used to identify the morphology and quantity of standard circular interference rings in the state image based on the chip interference ring recognition algorithm.

[0085] The judgment module is used to mark the chip's pass / fail status based on the number of standard circular interference rings;

[0086] The storage module is used to package and upload the marking results and corresponding location information to the cloud platform or save them locally.

[0087] Furthermore, the interference ring morphology and quantity detection module executes the following method during operation:

[0088] When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to ε. When 2πR(1-ε)≤L≤2πR(1+ε), it is determined to be a standard ring and is included in the number of standard rings.

[0089] When four standard rings appear, the chip is marked as a qualified product. When three standard rings appear, impurity identification is performed. If impurities are found, a re-inspection signal is issued. If no impurities are found, the chip is marked as a defective product. If the number of standard rings is less than three, the chip is directly marked as a defective product.

[0090] The method for determining the presence of impurities includes: determining whether there is an irregular cluster of pixels in the state image that exceeds a set threshold; if so, it is determined that there are impurities, otherwise, they are not present.

[0091] Example 4:

[0092] This embodiment provides a storage medium containing computer-executable instructions, which, when executed by a computer processor, are used to perform the spectral filter chip screening method described in Embodiment 1 or Embodiment 2.

[0093] The computer storage medium of this invention can be any combination of one or more computer-readable media. A computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of computer-readable storage media include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0094] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.

[0095] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including—but not limited to—wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.

[0096] Computer program code for performing the operations of embodiments of the present invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0097] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for screening wafer-level MEMS-FPI tunable spectral filter chips, characterized in that, include: The spectral filter chip wafer is fixed on the worktable. With the center point of the wafer as the origin of the coordinate system, the wafer is divided into four quadrants. The horizontal coordinate is kept at a set angle to each row of chips in the wafer. All the spectral filter chips in the wafer are connected in parallel. Move the robotic arm and align the center line of the camera system at the end of the robotic arm with the center point of the wafer; Two sets of voltages are applied to the wafer to enable the chips to exhibit double interference loops, thereby providing power to all chips in a unified manner. The robotic arm moves from the center of the wafer, quadrant by quadrant and chip by chip, according to the designed route. Image processing and recognition algorithms are used to detect whether a chip has entered the recognition area. When a chip enters the recognition area, an image extraction signal is triggered, and state images under the two sets of voltages are acquired respectively. The acquired state images are used to identify the shape and number of standard circular interference rings based on a chip interference ring recognition algorithm, including: When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to... ,when If the condition is met, it is determined to be a standard ring and counted in the number of standard rings; When four standard rings appear, the chip is marked as a qualified product; when three standard rings appear, impurity identification is performed. If impurities are detected, a re-inspection signal is issued; if no impurities are detected, the chip is marked as a defective product; if the number of standard rings is less than three, it is directly marked as a defective product. The identification results are then transmitted to the judgment module to mark whether the chip is qualified or not. Finally, the marking results and corresponding location information are packaged and uploaded to the cloud platform or saved locally to complete the rapid screening of spectral filtering chips.

2. The wafer-level MEMS-FPI tunable spectral filter chip screening method according to claim 1, characterized in that, The wafer center point marking and chip arrangement on the wafer are both added during the chip design phase and incorporated into the manufacturing process.

3. The wafer-level MEMS-FPI tunable spectral filter chip screening method according to claim 1, characterized in that, The camera system includes a near-infrared light source, a microscope, and a CCD imaging module.

4. The wafer-level MEMS-FPI tunable spectral filter chip screening method according to claim 1, characterized in that, The method for moving the robotic arm from the center point of the wafer, quadrant by quadrant and wafer by wafer, according to the designed route includes: In a single quadrant, starting from the center point of the wafer, the robotic arm moves along an S-shaped path to take pictures. After taking pictures of one quadrant, the robotic arm returns to the center point of the wafer and then takes pictures of the chip recognition chip in the next quadrant, until all quadrants have been traversed.

5. The wafer-level MEMS-FPI tunable spectral filter chip screening method according to claim 1 or 4, characterized in that, It also includes robotic arm step length correction and robotic arm orientation correction processes; The robotic arm step length correction process includes: determining the deviation value ∆L between the distance between the center points of two adjacent chips and the step length; when the deviation ∆L is greater than a set threshold, the current position of the robotic arm is readjusted to eliminate the cumulative error. The robotic arm orientation correction process includes: determining the angle between the straight line formed by the center points of two adjacent chips and the coordinate axis. ,when When the angle exceeds the set threshold, the robotic arm is angled.

6. The wafer-level MEMS-FPI tunable spectral filter chip screening method according to claim 1, characterized in that, The image processing and recognition algorithm, once it identifies the electrode posts at the four corners of the chip, determines that the chip has entered the area that the microscope lens can recognize, and triggers the chip image extraction signal.

7. The wafer-level MEMS-FPI tunable spectral filter chip screening method according to claim 1, characterized in that, The method for determining the presence of impurities includes: determining whether there is an irregular cluster of pixels in the state image that exceeds a set threshold; if so, it is determined that there are impurities, otherwise, they are not present.

8. A method for screening spectral filter chips, characterized in that, include: An external near-infrared light source is aligned with the center of the spectral filter chip. Two sets of voltages that can produce stable double interference rings on the spectral filter chip are selected respectively. Interference ring images under the two sets of voltages are acquired using a microscope system. Based on a chip interference ring recognition algorithm, the standard circular interference ring morphology and number were identified in two sets of interference ring images under two voltage conditions; including: When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to... ,when If the condition is met, it is determined to be a standard ring and counted in the number of standard rings; When four standard rings appear, the chip is marked as a qualified product; when three standard rings appear, impurity identification is performed. If impurities are detected, a re-inspection signal is issued; if no impurities are detected, the chip is marked as a defective product; if the number of standard rings is less than three, it is directly marked as a defective product. When a total of 4 standard rings are detected, the chip is marked as a qualified product. When a total of 3 standard rings are detected, impurity identification is performed. If impurities are detected, a re-inspection signal is issued. If no impurities are detected, the chip is marked as a defective product. If the total number of standard rings is less than 3, the chip is directly marked as a defective product.

9. A wafer-level MEMS-FPI tunable spectral filter chip screening system, characterized in that, include: The worktable is used to hold the wafer in place and maintain a set angle for each row of chips on the wafer. The power supply module is used to apply two sets of voltages to the wafer, which can cause the chips to exhibit double interference rings. All spectral filter chips in the wafer are connected in parallel, thereby achieving unified power supply for all chips. The robotic arm has a camera system at its end, which includes a near-infrared light source, a microscope, and a CCD imaging module; the CCD imaging module is used to acquire state images of the chips in the wafer. The execution module is used to divide the wafer into four quadrants with the center point of the wafer as the origin of the coordinate system, and control the robotic arm to move from the center point of the wafer, quadrant by quadrant and chip by chip according to the designed route. It uses image processing and recognition algorithms to detect whether the chip has entered the recognition area. When the chip enters the recognition area, it triggers the image extraction signal and performs state image acquisition under two sets of voltages. The interference ring morphology and quantity detection module is used to identify the morphology and quantity of standard circular interference rings in the state image based on the chip's interference ring recognition algorithm; it includes: When a suspected ring with radius R is identified, edge detection is performed on the ring, its perimeter L is calculated, and the deviation is set to... ,when If the condition is met, it is determined to be a standard ring and counted in the number of standard rings; When four standard rings appear, the chip is marked as a qualified product; when three standard rings appear, impurity identification is performed. If impurities are detected, a re-inspection signal is issued; if no impurities are detected, the chip is marked as a defective product; if the number of standard rings is less than three, it is directly marked as a defective product. The judgment module is used to mark the chip's pass / fail status based on the number of standard circular interference rings; The storage module is used to package and upload the marking results and corresponding location information to the cloud platform or save them locally.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when invoked and executed by a processor, cause the processor to implement the spectral filter chip screening method according to any one of claims 1-8.

Images