Adjustment correction system and method thereof

Abstract

This invention provides an adjustment and correction system and method. The system includes: an optical measurement unit; a glue dispensing control unit; and a calculation unit electrically connected to the optical measurement unit and the glue dispensing control unit. The optical measurement unit measures a glue and obtains an Nth three-dimensional glue signal, where N is a constant. The calculation unit receives the Nth three-dimensional glue signal and calculates the volume or weight of the glue. The calculation unit compares the volume or weight of the glue with a preset glue value. If the volume or weight of the glue does not match the preset value, the calculation unit sends an Nth glue quantity change signal to the glue dispensing control unit, so that the glue dispensing control unit adjusts the amount of glue supplied according to the Nth glue quantity change signal. This invention achieves the ability to adjust the current glue quantity based on feedback from the previous glue quantity through a closed loop, thereby solving the problems of glue overflow or insufficient glue, and thus improving the bonding quality.

Description

Technical Field

[0001] This invention relates to the field of chip bonding technology, and in particular to an adjustment and correction system and method thereof. Background Technology

[0002] Chip bonding technology, or substrate bonding technology, is a crucial technology or process in the semiconductor, electronics, and touch display industries. Existing bonding technologies selectively use a vision unit to visually locate the desired bonding areas on the substrates, or pre-program the desired bonding areas, apply adhesive to the desired bonding areas, and then perform a pressing process to bond the two substrates together or the chip to the substrate.

[0003] However, the aforementioned bonding technology still suffers from problems such as glue overflow or insufficient glue. The amount of glue applied to the bonding area is unpredictable due to numerous variables, including glue density, viscosity, ambient humidity, and temperature. When glue overflow or insufficient glue occurs, it cannot be detected during the bonding process and must be discovered during subsequent quality control. Therefore, the bonded products cannot achieve the required quality, resulting in cost losses.

[0004] In summary, the existing real-time feedback and adjustment of adhesive amount during the bonding process is an extremely important aspect of the industry. Summary of the Invention

[0005] In view of the various shortcomings of the prior art, those skilled in the art have provided the adjustment and correction system and method of the present invention.

[0006] This invention provides an adjustment and correction system, comprising: an optical measurement unit; a glue dispensing control unit; and a calculation unit electrically connected to the optical measurement unit and the glue dispensing control unit; wherein, the optical measurement unit measures a glue and obtains an Nth three-dimensional glue signal, where N is a constant; the calculation unit receives the Nth three-dimensional glue signal and calculates the volume or weight of the glue; the calculation unit compares the volume or weight of the glue with a preset glue value; if the volume or weight of the glue does not match the preset glue value, the calculation unit transmits an Nth glue quantity change signal to the glue dispensing control unit, so that the glue dispensing control unit adjusts the amount of glue supplied according to the Nth glue quantity change signal.

[0007] In one embodiment, the adhesive dispensing control unit provides adhesive to an adhesive dispensing unit so that the adhesive dispensing unit dispenses adhesive to the desired bonding area of ​​an N+1th substrate.

[0008] In one embodiment, the optical measurement unit is a combination of a laser measuring instrument, a triangular laser ranging device, an optical interferometer, a confocal laser scanning microscope, a femtosecond infrared laser, and a confocal microscope, or a conjugate laser.

[0009] In one embodiment, the optical measurement unit includes at least one upper vision module and at least one side vision module, wherein the upper vision module and the side vision module are a charge-coupled device camera or a charge-coupled device image sensor.

[0010] In one embodiment, the volume or weight of the adhesive provided is between 99% and 101% of a preset value for the adhesive.

[0011] The present invention also provides an adjustment and correction method, the steps of which include:

[0012] Obtaining the Nth three-dimensional adhesive signal: A conveying unit conveys an Nth substrate to a position below a dispensing unit, where N is a constant; the dispensing unit dispenses adhesive onto the desired bonding area of ​​the Nth substrate; an optical measurement unit measures the adhesive and obtains an Nth three-dimensional adhesive signal.

[0013] Obtaining the Nth adhesive quantity change signal: A calculation unit performs calculations based on the Nth three-dimensional adhesive signal to determine the volume or weight of the adhesive at the desired bonding location on the Nth substrate. The calculation unit compares the volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not match the default value, the calculation unit sends an Nth adhesive quantity change signal to a dispensing control unit; and

[0014] Applying adhesive to the (N+1)th substrate: The transport unit transports the Nth substrate away from below the dispensing unit and transports the (N+1)th substrate below the dispensing unit. The dispensing control unit adjusts the amount of adhesive provided based on the Nth adhesive amount change signal and supplies the adhesive to the dispensing unit. The dispensing unit then dispenses the adhesive from the dispensing control unit to the desired bonding area on the (N+1)th substrate. Returning to the step of obtaining the Nth three-dimensional adhesive signal...

[0015] In one embodiment, if the optical measurement unit is composed of a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope, the optical measurement unit measures the adhesive at the bonding point of the Nth substrate and obtains the Nth three-dimensional adhesive signal.

[0016] In one embodiment, if the optical measurement unit comprises at least one upper vision module and at least one side vision module; the upper vision module captures an upper image of the adhesive at the desired bonding point on the Nth substrate; the side vision module captures a side image of the adhesive at the desired bonding point on the Nth substrate; the upper image and the side image are provided to the calculation unit, and the calculation unit obtains the Nth three-dimensional adhesive signal based on the upper image and the side image.

[0017] The adjustment and correction system and method of the present invention are designed as a closed loop, comprising an optical measurement unit, a glue dispensing control unit, and a calculation unit. Therefore, after each glue dispensing, the calculation unit can calculate the volume or weight of the glue based on the three-dimensional information (three-dimensional glue signal) measured by the optical measurement unit. The calculation unit compares the volume or weight of the glue with a preset glue value. If the value is different, it provides a glue quantity change signal to the glue control unit, causing the glue dispensing control unit to adjust the amount of glue supplied to the glue dispensing unit. This invention, through a closed loop, enables the adjustment of the current glue quantity based on feedback from the previous glue quantity, thereby resolving glue overflow or insufficient glue, and ultimately improving the bonding quality. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the operation of the adjustment and correction system according to the first embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of another operation of the adjustment and correction system according to the first embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of another action of the adjustment and correction system according to the first embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the operation of the adjustment and correction system according to the second embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of another operation of the adjustment and correction system according to the second embodiment of the present invention.

[0023] Figure 6 This is a schematic diagram of another action of the adjustment and correction system according to the second embodiment of the present invention.

[0024] Explanation of reference numerals in the attached figures:

[0025] 10, 20: Optical measurement unit; 11, 21: Adhesive dispensing unit; 12, 22: Adhesive dispensing control unit; 13, 23: Calculation unit; 14, 24: Conveying unit; 15: First substrate; 16: Second substrate; 25: Third substrate; 26: Fourth substrate; 200: Upper vision module; 201: Side vision module. Detailed Implementation

[0026] In order to enable those skilled in the art to fully understand the technical features, content, advantages and effects of the present invention, the present invention is described in detail below with reference to the accompanying drawings and embodiments. The drawings used are for illustration and auxiliary purposes only, and may not be the actual proportions and precise configurations after the implementation of the present invention. Therefore, the proportions and configurations of the accompanying drawings should not be interpreted or used to limit the scope of the present invention in actual implementation.

[0027] Please see Figure 1 This is a schematic diagram illustrating the operation of the adjustment and correction system according to the first embodiment of the present invention. Figure 1 As shown, the adjustment and correction system includes: an optical measurement unit 10, a glue dispensing unit 11, a glue dispensing control unit 12, a calculation unit 13, and a conveying unit 14.

[0028] The optical measurement unit 10 is located above the transport unit 14. The optical measurement unit 10 is composed of a laser measuring instrument, a triangular laser ranging instrument, an optical interferometer, a confocal laser scanning microscope, a femtosecond infrared laser and a confocal microscope, or a conjugate laser.

[0029] The dispensing unit 11 is located above the conveying unit 14 and adjacent to the optical measurement unit 10. The dispensing unit 11 may be a dispensing needle.

[0030] The glue dispensing control unit 12 is coupled to the glue dispensing unit 11, and the glue dispensing control unit 12 can control the volume or weight of glue supplied to the glue dispensing unit 11.

[0031] The calculation unit 13 is electrically coupled to the glue dispensing control unit 12 and the optical measurement unit 10.

[0032] The conveying unit 14 conveys a substrate to be bonded (hereinafter referred to as the first substrate 15 for ease of reading) to the area below the dispensing unit 11, and the dispensing unit 11 dispenses adhesive onto the area to be bonded on the first substrate 15. The optical measurement unit 10 measures the adhesive at the area to be bonded on the first substrate 15 and obtains a three-dimensional adhesive signal (hereinafter referred to as the first three-dimensional adhesive signal for ease of reading).

[0033] In this embodiment, the optical measurement unit 10 is composed of a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope. The principle of confocal laser scanning microscopy (CLSM) is mainly to use a pinhole aperture to exclude light from non-focal surfaces. The technology of confocal laser scanning microscopy can remove light from non-focal surfaces in traditional fluorescence microscopy images, allowing for layer-by-layer observation of samples, greatly increasing image contrast, resolution, and fluorescence detection signal-to-noise ratio.

[0034] The first three-dimensional adhesive signal is transmitted to the calculation unit 13. The calculation unit 13 performs calculations based on the first three-dimensional adhesive signal to determine the volume or weight of the adhesive at the desired bonding location on the first substrate 15. The calculation unit 13 compares the calculated volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not conform to the preset adhesive value, i.e., the volume or weight of the adhesive exceeds or falls below the preset adhesive value, the calculation unit 13 transmits an adhesive quantity change signal (hereinafter referred to as the first adhesive quantity change signal) to the adhesive control unit 12. The adhesive dispensing control unit 12 adjusts the amount of adhesive provided to the dispensing unit 11 according to the first adhesive quantity change signal, so that the volume or weight of the adhesive at the desired bonding location on the substrate conforms to or approaches the preset adhesive value. This approach is between 99% and 101% of the preset adhesive value. In other words, the volume or weight of the provided adhesive is between 99% and 101% of the preset adhesive value.

[0035] Please see Figure 2 This is a schematic diagram illustrating another operation of the adjustment and correction system according to the first embodiment of the present invention. Figure 2 As shown, the conveying unit 14 conveys the first substrate 15 away from below the dispensing unit 11, and conveys another substrate to be bonded (hereinafter referred to as the second substrate 16 for ease of reading) to below the dispensing unit 11. The dispensing unit 11 dispenses adhesive from the dispensing control unit 12 onto the area to be bonded on the second substrate 16.

[0036] Please see Figure 3 This is a schematic diagram illustrating another action of the adjustment and correction system according to the first embodiment of the present invention. Figure 3 As shown, the optical measurement unit 10 measures the adhesive at the bonding point of the second substrate and obtains a three-dimensional adhesive signal (hereinafter referred to as the second three-dimensional adhesive signal for ease of reading). The second three-dimensional adhesive signal is transmitted to the calculation unit 13, which performs calculations based on the second three-dimensional adhesive signal to determine the volume or weight of the adhesive at the bonding point of the second substrate 16. The calculation unit 13 compares the calculated volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not conform to the default adhesive value, the calculation unit 13 transmits an adhesive quantity change signal (hereinafter referred to as the second adhesive quantity change signal for ease of reading) to the adhesive control unit 12. The adhesive dispensing control unit 12 adjusts the amount of adhesive provided to the dispensing unit 11 according to the second adhesive quantity change signal, so that the volume or weight of the adhesive at the bonding point of the substrate conforms to or approaches the preset adhesive value.

[0037] Please see Figure 4 This is a schematic diagram illustrating the operation of the adjustment and correction system according to the second embodiment of the present invention. Figure 4As shown, the adjustment and correction system includes: an optical measurement unit 20, a glue dispensing unit 21, a glue dispensing control unit 22, a calculation unit 23, and a conveying unit 24.

[0038] The optical measurement unit 20 includes at least one upper vision module 200 and at least one side vision module 201. The upper vision module 200 is disposed above the conveying unit 24, and the side vision module 201 is disposed on one side of the conveying unit 24. In this embodiment, the upper vision module 200 and the side vision module 201 may be a charge-coupled device (CCD) camera or a CCD image sensor.

[0039] The dispensing unit 21 is located above the conveying unit 24. The dispensing unit 21 can be a dispensing needle.

[0040] The glue dispensing control unit 22 is coupled to the glue dispensing unit 21, and the glue dispensing control unit 22 can control the volume or weight of glue supplied to the glue dispensing unit 21.

[0041] The calculation unit 23 is electrically coupled to the adhesive dispensing control unit 22 and the optical measurement unit 20.

[0042] The conveying unit 24 conveys a substrate to be bonded (hereinafter referred to as the third substrate 25 for ease of reading) to the area below the dispensing unit 21. The dispensing unit 21 dispenses adhesive onto the area to be bonded on the third substrate 25. The optical measurement unit 20 captures an image of the adhesive at the area to be bonded on the third substrate. The upper vision module 200 captures an image of the adhesive above the area to be bonded on the third substrate 25. The side vision module 201 captures a side image of the adhesive at the area to be bonded on the third substrate 25. The upper and side images are provided to the calculation unit 23, which obtains a three-dimensional adhesive signal (hereinafter referred to as the third three-dimensional adhesive signal for ease of reading) based on the upper and side images.

[0043] The calculation unit 23 performs calculations based on the third three-dimensional adhesive signal to determine the volume or weight of the adhesive at the desired bonding location on the third substrate 25. The calculation unit 23 compares the calculated volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not match the default adhesive value, the calculation unit 23 sends an adhesive quantity change signal (hereinafter referred to as the third adhesive quantity change signal for ease of reading) to the adhesive control unit 22.

[0044] Please see Figure 5 This is a schematic diagram illustrating another operation of the adjustment and correction system according to the second embodiment of the present invention. Figure 5As shown, the conveying unit 24 conveys the third substrate 25 away from below the dispensing unit 21 and conveys another substrate (hereinafter referred to as the fourth substrate 26 for ease of reading) to below the dispensing unit 21. The dispensing control unit 22 adjusts the amount of adhesive provided to the dispensing unit 21 according to the third adhesive amount change signal. The dispensing unit 21 dispenses the adhesive from the dispensing control unit 22 onto the desired bonding area of ​​the fourth substrate 26.

[0045] Please see Figure 6 This is a schematic diagram illustrating another action of the adjustment and correction system according to the second embodiment of the present invention. Figure 6 As shown, the optical measurement unit 20 captures images of the adhesive at the desired bonding location on the fourth substrate 26. The upper vision module 200 captures an image of the adhesive above the desired bonding location on the fourth substrate 26. The side vision module 201 captures a side image of the adhesive at the desired bonding location on the fourth substrate 26. The upper and side images are provided to the calculation unit 23, which obtains a three-dimensional adhesive signal (hereinafter referred to as the fourth three-dimensional adhesive signal for ease of reading) based on the upper and side images.

[0046] The calculation unit 23 performs calculations based on the fourth three-dimensional adhesive signal to determine the volume or weight of the adhesive at the desired bonding location on the fourth substrate 26. The calculation unit 23 compares the calculated volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not match the default adhesive value, the calculation unit 23 sends an adhesive quantity change signal (hereinafter referred to as the fourth adhesive quantity change signal for ease of reading) to the adhesive control unit 22.

[0047] The glue dispensing control unit 22 adjusts the amount of glue provided to the glue dispensing unit 21 according to the fourth glue amount change signal, so that the volume or weight of the glue at the desired bonding point on the substrate meets or approaches the preset glue value.

[0048] The adjustment and correction method of the present invention includes the following steps:

[0049] Step A: Obtain the Nth 3D glue signal: Please refer to [link / reference needed]. Figures 1 to 3 The conveying unit 14 conveys the Nth substrate to the area below the dispensing unit 11, where N is a constant. The dispensing unit 11 dispenses adhesive onto the desired bonding area of ​​the Nth substrate. If the optical measurement unit 10 is a combination of a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope, the optical measurement unit 10 measures the adhesive at the desired bonding area of ​​the Nth substrate and obtains an Nth three-dimensional adhesive signal.

[0050] Please refer to the following: Figures 3 to 6If the optical measurement unit 20 consists of an upper vision module 200 and a side vision module 201, the upper vision module 200 captures an image of the adhesive at the desired bonding point on the Nth substrate from above. The side vision module 201 captures an image of the adhesive at the desired bonding point on the Nth substrate from the side. The upper and side images are provided to the calculation unit 23, which obtains an Nth three-dimensional adhesive signal based on the upper and side images.

[0051] Step B, Obtain the Nth glue amount change signal: Please refer to [link / reference needed]. Figures 1 to 3 The calculation unit 13 performs calculations based on the Nth three-dimensional adhesive signal to obtain the volume or weight of the adhesive at the desired bonding location on the Nth substrate. The calculation unit 13 compares the calculated volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not match the default adhesive value, the calculation unit 13 sends an Nth adhesive quantity change signal to the adhesive control unit 12.

[0052] Step C: Dispensing adhesive to the (N+1)th substrate: The transport unit 14 transports the Nth substrate away from below the dispensing unit 11 and transports the (N+1)th substrate to below the dispensing unit 11. The dispensing control unit 12 adjusts the amount of adhesive supplied according to the Nth adhesive amount change signal and supplies the adhesive to the dispensing unit 11. The dispensing unit 11 dispenses the adhesive from the dispensing control unit 12 onto the desired bonding area of ​​the (N+1)th substrate. Then return to step A.

[0053] In summary, the adjustment and correction system and method of the present invention design the optical measurement unit, the glue dispensing control unit, and the calculation unit as a closed loop. Therefore, after each glue dispensing, the calculation unit can determine the volume or weight of the glue based on the three-dimensional information (three-dimensional glue signal) measured by the optical measurement unit. The calculation unit compares the volume or weight of the glue with a preset glue value. If it does not match the preset value, it provides a glue quantity change signal to the glue control unit, causing the glue dispensing control unit to adjust the amount of glue supplied to the glue dispensing unit. This invention, through a closed loop, enables the adjustment of the current glue quantity based on feedback from the previous glue quantity, thereby resolving glue overflow or insufficient glue, and ultimately improving the bonding quality.

[0054] The above description is merely illustrative, used to illustrate feasible specific embodiments of the technical content of the present invention, and is not intended to limit the present invention. Equivalent substitutions, modifications, or alterations made by those skilled in the art based on the teachings disclosed in the specification are all included within the scope of the patent application of the present invention and do not depart from the scope of the rights of the present invention.

Claims

1. An adjustment and correction system, characterized in that, include: One optical measurement unit; One glue dispensing control unit; as well as A calculation unit is electrically connected to the optical measurement unit and the adhesive dispensing control unit; The optical measurement unit measures a glue and obtains an Nth three-dimensional glue signal, where N is a constant. The calculation unit receives the Nth three-dimensional glue signal and calculates the volume or weight of the glue. The calculation unit compares the volume or weight of the glue with a preset glue value. If the volume or weight of the glue does not match the preset glue value, the calculation unit sends an Nth glue quantity change signal to the glue dispensing control unit so that the glue dispensing control unit adjusts the amount of glue supplied according to the Nth glue quantity change signal. The adhesive dispensing control unit provides adhesive to an adhesive dispensing unit so that the adhesive dispensing unit applies adhesive to the desired bonding area of ​​an N+1th substrate.

2. The adjustment and correction system according to claim 1, characterized in that, The optical measurement unit is composed of a laser measuring instrument, a triangular laser ranging device, an optical interferometer, a confocal laser scanning microscope, a femtosecond infrared laser, and a confocal microscope, or a conjugate laser.

3. The adjustment and correction system according to claim 1, characterized in that, The optical measurement unit includes at least one upper vision module and at least one side vision module, wherein the upper vision module and the side vision module are a charge-coupled device camera or a charge-coupled device image sensor.

4. The adjustment and correction system according to claim 1, characterized in that, The volume or weight of the provided adhesive is between 99% and 101% of the preset value of the adhesive.

5. An adjustment and correction method, characterized in that, include: Obtaining the Nth three-dimensional adhesive signal: A conveying unit conveys an Nth substrate to a position below a dispensing unit, where N is a constant; the dispensing unit dispenses adhesive onto the desired bonding area of ​​the Nth substrate; an optical measurement unit measures the adhesive and obtains an Nth three-dimensional adhesive signal. Obtaining the Nth adhesive quantity change signal: A calculation unit performs calculations based on the Nth three-dimensional adhesive signal to obtain the volume or weight of the adhesive at the desired bonding location on the Nth substrate. The calculation unit compares the volume or weight of the adhesive with a preset adhesive value. If the volume or weight of the adhesive does not conform to the preset adhesive value, the calculation unit transmits an Nth adhesive quantity change signal to a dispensing control unit. as well as Applying adhesive to the (N+1)th substrate: The conveying unit conveys the Nth substrate away from below the dispensing unit and conveys the (N+1)th substrate to below the dispensing unit. The dispensing control unit adjusts the amount of adhesive provided according to the Nth adhesive amount change signal and provides adhesive to the dispensing unit. The dispensing unit applies the adhesive from the dispensing control unit to the desired bonding area of ​​the N+1th substrate and then returns to the step of obtaining the Nth three-dimensional adhesive signal.

6. The adjustment and correction method according to claim 5, characterized in that, The volume or weight of the provided adhesive is between 99% and 101% of the preset value of the adhesive.

7. The adjustment and correction method according to claim 5, characterized in that, The optical measurement unit is composed of a confocal laser scanning microscope or a femtosecond infrared laser and a confocal microscope; wherein, the optical measurement unit measures the adhesive at the bonding point of the Nth substrate and obtains the Nth three-dimensional adhesive signal.

8. The adjustment and correction method according to claim 5, characterized in that, If the optical measurement unit comprises an upper vision module and a side vision module; wherein, the upper vision module captures an upper image of the adhesive at the desired bonding point on the Nth substrate; the side vision module captures a side image of the adhesive at the desired bonding point on the Nth substrate; the upper image and the side image are provided to the calculation unit, and the calculation unit obtains the Nth three-dimensional adhesive signal based on the upper image and the side image.

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