Semiconductor chip packaging device and method of operation thereof

Abstract

The application discloses a kind of semiconductor chip packaging device and its working method, it is related to diode production equipment technical field, semiconductor chip packaging device includes workbench and the conveying mechanism being arranged between workbench, conveying mechanism surface interval arrangement multiple groups of bearing groove, bearing groove is used to carry out bearing storage to be packaged diode, conveying mechanism is used to the diode being arranged in bearing groove is conveyed;It further includes: glue dispensing component, the glue dispensing component includes glue storage cylinder and the glue feeding mechanism being connected with glue storage cylinder, and packaging component, diode is conveyed to chip positioning mechanism directly below after glue dispensing by conveying component, push mechanism pushes the chip being arranged in chip positioning mechanism and diode is pasted, and then realize the packaging processing of diode and chip, before diode and chip packaging, diode top is pre-glued and handled, so that diode and chip packaging stability is higher, and pasting is more stable.

Description

Technical Field

[0001] This invention relates to the field of diode manufacturing equipment technology, and more specifically to a semiconductor chip packaging device and its operating method. Background Technology

[0002] A diode is a common electronic component. It is a device with two electrodes that allows current to flow in only one direction. Diode packaging refers to connecting the electron pins on the silicon wafer to external terminals with wires so that they can be connected to other devices. Diode packaging not only serves to install, fix, seal, protect the chip, and enhance its electrothermal properties, but also enables the connection between external circuits and internal chips through the package pins. Furthermore, packaged diodes are easier to install and transport.

[0003] In the packaging process, adhesive is usually applied to the chip surface and then bonded together. This process is generally done manually or semi-manually to bond the chip to the diode. Traditionally, this process is mostly done manually or semi-manually. The first worker uses a dispensing machine to apply adhesive to the die, and then the die is handed over to the next worker. This greatly restricts the packaging efficiency of diodes and is also prone to errors during packaging, resulting in unsatisfactory packaging results. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor chip packaging device and its operating method, thereby solving the following technical problems: Diode packaging typically involves applying adhesive to the chip surface and then bonding it together. This process is usually done manually or semi-manually, which significantly limits the packaging efficiency and can easily introduce errors, resulting in unsatisfactory packaging outcomes.

[0005] The objective of this invention can be achieved through the following technical solutions: A semiconductor chip packaging apparatus includes a worktable and a conveying mechanism arranged between the worktables. Multiple sets of carrier grooves are arranged at intervals on the surface of the conveying mechanism. The carrier grooves are used to carry and store diodes to be packaged, and the conveying mechanism is used to transport the diodes arranged in the carrier grooves. It also includes: a dispensing assembly, which includes a glue reservoir and a glue delivery mechanism connected to the glue reservoir.

[0006] The packaging assembly includes a chip positioning mechanism and a pushing mechanism. The chip positioning mechanism is used to position and store the chip to be packaged, and the pushing mechanism is arranged above the chip positioning mechanism to push the chip in the chip positioning mechanism to bond and package with the diode.

[0007] The glue delivery mechanism includes a glue delivery cylinder, one end of which is connected to a glue storage cylinder via a glue extraction tube, and the other end of the glue extraction tube is equipped with a glue dispensing tube. A sealing mechanism is provided between the glue delivery cylinders to seal the glue delivery cylinders.

[0008] Preferably, the sealing mechanism includes a sealing sheet connected to a first incomplete gear, rack plates are disposed opposite to each other at both ends of the glue delivery cylinder, and the top of the glue delivery cylinder is connected to a pushing mechanism that drives it to reciprocate in the vertical direction.

[0009] Preferably, a first U-shaped frame and a second U-shaped frame are provided on the top of the workbench, and the glue storage cylinder is fixedly installed on the surface of the first U-shaped frame.

[0010] Preferably, the driving mechanism includes a rotating shaft, which is connected to a worm gear drive via a belt, and the worm gear is connected to a drive motor; A first cam is installed at one end of the rotating shaft, the glue dispensing cylinder is connected to the first push rod, a horizontal plate is installed at the bottom of the first U-shaped frame, a rack plate is installed on the surface of the horizontal plate, the glue dispensing tube passes through the horizontal plate, and a first return spring is set on the outside of the glue dispensing tube.

[0011] Preferably, the chip positioning mechanism includes a turntable, with three sets of positioning frames arranged on the outer side of the turntable. Slide grooves are provided on both sides of the positioning frames, and positioning plates are installed in the slide grooves. A tapered part is provided at the end of the two positioning plates that are close to each other. A positioning rod is provided on the outer side of the positioning frame, and a telescopic spring is provided on the outer side of the positioning rod. One end of the telescopic spring is connected to a movable seat, and the movable seat is connected to the positioning plate.

[0012] Preferably, a second cam is provided on the other side of the rotating shaft, a support plate is provided between the second U-shaped frame, a push column is provided between the support plates, a push head is provided at one end of the push column, a second return spring is provided on the outside of the push column, and the end of the push column away from the support plate contacts the outer circular surface of the second cam.

[0013] Preferably, a limiting plate is installed on one side of the second U-shaped frame, a second incomplete gear is installed on the surface of the limiting plate, a gear is connected to the top of the turntable, a worm gear is installed on the top of the second incomplete gear, and the worm gear meshes with the worm.

[0014] Preferably, a drying mechanism is also provided between the second U-shaped frames. The drying mechanism includes an air cavity, an air outlet is provided on one side of the air cavity, a cylinder is provided between the second U-shaped frames, a piston is provided inside the cylinder, an air inlet pipe is provided on one side of the cylinder, an exhaust pipe is provided on the other side, the exhaust pipe is connected to the air cavity, and a heater is provided between the exhaust pipes.

[0015] Preferably, the second incomplete gear connects to the disc, a locking pin is provided on one side of the disc surface edge, a push plate is provided on the outside of the locking pin, and piston rods are fixedly installed on both sides of the push plate, with the piston rods connected to the piston.

[0016] A method for operating a semiconductor chip packaging device specifically includes the following steps: 1) Place the diode in the carrier groove on the surface of the conveying mechanism and clamp and fix the diode through the carrier groove; 2) The conveying mechanism conveys the diode. When the diode is conveyed to the bottom of the dispensing tube, the sealing mechanism separates in the dispensing tube, so that the dispensing tube is connected to the suction tube through the dispensing tube. The glue in the storage tube falls into the dispensing tube through the suction tube under the action of gravity. The glue in the dispensing tube falls onto the surface of the diode through the dispensing tube to perform dispensing treatment on the diode. 3) The drive motor drives the worm gear to rotate, and the worm gear drives the rotating shaft to rotate via the belt. During the rotation of the rotating shaft, the second cam rotates. The second cam pushes the chip located in the positioning frame toward the conveying mechanism via the push post, so that the chip is bonded and packaged with the diode. 4) During the rotation of the second incomplete gear, the disc is driven to rotate. The disc moves back and forth in the cylinder through the locking pin, push plate and piston rod. The cylinder delivers air to the air chamber through the air inlet pipe and the air outlet pipe. The air in the exhaust pipe is heated by the heater. The heated air is blown through the air outlet to the diode after the glue is applied, and the glue is dried.

[0017] The beneficial effects of this invention are: (1) After the diode is dispensing glue, it is conveyed to the chip positioning mechanism directly below the chip positioning mechanism through the conveying component. The pushing mechanism pushes the chip arranged in the chip positioning mechanism to bond with the diode, thereby realizing the encapsulation process of the diode and the chip. Before encapsulating the diode and the chip, the top of the diode is pre-dispensed glue to make the diode and chip encapsulation more stable and the bonding more stable. (2) The second incomplete gear drives the disc to rotate during the rotation process. The disc moves back and forth in the cylinder through the locking pin, push plate and piston rod. The cylinder delivers air to the air chamber through the air inlet pipe and the air outlet pipe. The air in the air outlet pipe is heated by the heater. The heated air is blown to the diode after the glue is applied through the air outlet to dry the glue and improve the bonding efficiency. Attached Figure Description

[0018] The invention will now be further described with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the present invention; Figure 2 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the present invention, viewed from the left side. Figure 3 This is a schematic diagram of the structure of a semiconductor chip packaging device according to the present invention, viewed from the right side. Figure 4 This is a rear view structural schematic diagram of a semiconductor chip packaging device according to the present invention; Figure 5 This is a schematic diagram of the positioning frame in a semiconductor chip packaging device according to the present invention; Figure 6 This is a schematic diagram of the positioning plate in a semiconductor chip packaging device according to the present invention; Figure 7 This is a schematic diagram of the rack plate in a semiconductor chip packaging device according to the present invention; Figure 8 This is a schematic diagram of the adhesive delivery cylinder in a semiconductor chip packaging device according to the present invention; Figure 9 This is a schematic diagram of the structure of a disk in a semiconductor chip packaging device according to the present invention.

[0020] In the diagram: 1. Workbench; 2. Air chamber; 3. Conveying mechanism; 4. Air outlet; 5. Mounting bracket; 6. Counter; 7. First U-shaped frame; 8. Glue storage cylinder; 9. First cam; 10. Rotating shaft; 11. Second cam; 12. Limiting plate; 13. Belt; 14. Turbine; 15. Worm gear; 16. Gear; 17. Second U-shaped frame; 18. Second incomplete gear; 19. Exhaust pipe; 20. Air inlet pipe; 21. Heater; 22. Cylinder; 23. Horizontal plate; 24. Glue delivery cylinder; 25. 26. Second return spring; 27. Push column; 28. Push head; 29. ​​Support plate; 30. Bearing groove; 31. Support column; 32. Detector; 33. Telescopic spring; 34. First push rod; 35. Slide groove; 36. Positioning plate; 37. Positioning rod; 38. Movable seat; 39. Positioning frame; 40. Glue extraction tube; 41. Rack plate; 42. First return spring; 43. Glue dispensing tube; 44. Sealing plate; 45. Disc; 46. Push plate; 47. Piston rod; 48. First incomplete gear; 49. Turntable. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-4As shown, the present invention is a semiconductor chip packaging device, including a worktable 1 and a conveying mechanism 3 arranged between the worktables 1. The surface of the conveying mechanism 3 is arranged with multiple sets of carrier grooves 29 at intervals. The carrier grooves 29 are used to carry and store diodes to be packaged. The conveying mechanism 3 is used to transport the diodes arranged in the carrier grooves 29. Before the diodes to be packaged are packaged, the diodes are placed in the carrier grooves 29 on the surface of the conveying mechanism 3 in advance. The diodes are clamped and fixed by the carrier grooves 29, thereby preventing the diodes from loosening during the transportation and packaging process. It also includes a dispensing assembly and an encapsulation assembly. The dispensing assembly includes a glue reservoir 8 and a glue delivery mechanism connected to the glue reservoir 8. The glue delivery mechanism is used to extract the glue liquid in the glue reservoir 8 to perform glue dispensing on the diode. During the process of transporting the diode, when it is transported to the bottom of the dispensing assembly, the glue delivery mechanism extracts the glue liquid in the glue reservoir 8 and performs glue dispensing on the top of the diode. The packaging assembly includes a chip positioning mechanism and a pushing mechanism. The chip positioning mechanism is used to position and store the chip to be packaged. The pushing mechanism is arranged above the chip positioning mechanism and is used to push the chip in the chip positioning mechanism to bond and package with the diode. After the diode is dispensed with adhesive, it is transported to the bottom of the chip positioning mechanism by a conveying component. The pushing mechanism pushes the chip arranged in the chip positioning mechanism to bond with the diode, thereby realizing the packaging process of the diode and the chip. In this embodiment of the invention, adhesive is pre-dispensed on the top of the diode before packaging the diode and the chip, which makes the packaging stability of the diode and the chip higher and the bonding more stable.

[0023] The glue delivery mechanism includes a glue delivery cylinder 24. One end of the glue delivery cylinder 24 is connected to a glue storage cylinder 8 via a glue extraction tube 39, and the other end of the glue delivery cylinder 24 is provided with a glue dispensing tube 42. A sealing mechanism is provided between the glue delivery cylinders 24 to seal the glue delivery cylinder 24, so that the glue in the glue storage cylinder 8 is output intermittently, which is adapted to the delivery frequency of the diodes to be packaged in each bearing groove 29 of the delivery component. Specifically, when the diode is delivered directly below the glue dispensing tube 42, the sealing mechanism separates inside the glue delivery cylinder 24, so that the glue dispensing tube 42 is connected to the glue extraction tube 39 through the glue delivery cylinder 24. Under the action of gravity, the glue in the glue storage cylinder 8 falls into the glue delivery cylinder 24 through the glue extraction tube 39, and the glue in the glue delivery cylinder 24 falls onto the surface of the diode through the glue dispensing tube 42, thereby realizing the glue dispensing process of the diode. Please see Figure 5-7As a further embodiment of the present invention, the sealing mechanism includes sealing plates 43 arranged opposite to each other between the glue delivery cylinders 24. The sealing plates 43 on both sides are fixedly connected to the first incomplete gear 47. The first incomplete gear 47 is rotatably mounted on both sides of the glue delivery cylinder 24. The glue delivery cylinder 24 is provided with rack plates 40 opposite to each other at both ends. The top of the glue delivery cylinder 24 is connected to a pushing mechanism that drives it to move back and forth in the vertical direction. In actual operation, the two sealing plates 43 are in a horizontal state inside the glue delivery cylinder 24. The two ends of the sealing plates 43 that are close to each other are in contact, sealing the glue delivery cylinder 24. The pushing mechanism pushes the glue delivery cylinder 24 to move in the vertical direction. When the glue delivery cylinder 24 moves toward the diode, the first incomplete gear 47 meshes with the rack plate 40 and rotates. The first incomplete gear 47 then drives the sealing plates 43 to rotate at a certain angle, so that the two sealing plates 43 separate. The glue dispensing tube 42 is connected to the glue extraction tube 39 to realize glue dispensing. When the first incomplete gear 47 is installed on the side wall of the glue delivery cylinder 24, sealing gaskets are provided on both sides of it and the inner wall of the glue delivery cylinder 24 to seal the gap and prevent glue from seeping through the installation gap between the first incomplete gear 47 and the glue delivery cylinder 24.

[0024] The top of the workbench 1 is provided with a first U-shaped frame 7 and a second U-shaped frame 17, and the glue storage cylinder 8 is fixedly installed on the surface of the first U-shaped frame 7; The pushing mechanism includes a rotating shaft 10 arranged between the first U-shaped frame 7 and the second U-shaped frame 17. One end of the rotating shaft 10 facing the second U-shaped frame 17 is connected to a worm gear 15 via a belt 13. The end of the worm gear 15 is fixedly connected to a drive motor. A first cam 9 is installed at the end of the rotating shaft 10 away from the belt 13. One side of the glue delivery cylinder 24 is fixedly connected to a first push rod 33. A horizontal plate 23 is fixedly installed at the bottom of the first U-shaped frame 7. A rack plate 40 is fixedly installed on the surface of the horizontal plate 23. A glue dispensing tube 42 passes through the horizontal plate 23. A first composite cam is provided on the outside of the glue dispensing tube 42. The first return spring 41 has one end fixedly connected to the horizontal plate 23 and the other end fixedly connected to the dispensing tube 42. The end of the first push rod 33 contacts the outer surface of the first cam 9. Specifically, the worm gear 15 is driven to rotate by the drive motor, and the worm gear 15 drives the rotating shaft 10 to rotate by the belt 13. During the rotation of the rotating shaft 10, the first cam 9 is driven to rotate. The first cam 9 pushes the glue delivery cylinder 24 and the dispensing tube 42 to move vertically by the first push rod 33. The first return spring 41 is set to reset the glue delivery cylinder 24 and the dispensing tube 42.

[0025] The chip positioning mechanism includes a turntable 48 rotatably mounted at the bottom of the second U-shaped frame 17. Three sets of positioning frames 38 are evenly arranged in a circular array on the outer side of the turntable 48. The positioning frames 38 are fixedly connected to the turntable 48 through the support column 30. The positioning frames 38 are provided with sliding grooves 34 on both sides. Positioning plates 35 are slidably installed in the sliding grooves 34. The two sides of the positioning plates 35 are provided with tapered portions at their close ends. Positioning rods 36 are provided on the outer side of the positioning frames 38. Telescopic springs 32 are provided on the outer side of the positioning rods 36. One end of the telescopic spring 32 is fixedly connected to the positioning frame 38, and the other end is fixedly connected to a movable seat 37. The movable seat 37 is slidably connected to the positioning rods 36 and fixedly connected to the positioning plates 35. When positioning the chip, the chip to be packaged is placed above the two positioning plates 35, and the chip is supported by the tapered portions at both ends of the positioning plates 35. The rotating shaft 10 has a second cam 11 on the other side, a support plate 28 between the second U-shaped frame 17, and a push column 26 between the support plates 28. The push column 26 is slidably connected to the support plate 28. A push head 27 is provided at one end of the push column 26 facing the conveying mechanism 3. A second return spring 25 is provided on the outside of the push column 26. One end of the second return spring 25 is fixedly connected to the support plate 28, and the other end is fixedly connected to the push column 26. The end of the push column 26 away from the support plate 28 contacts the outer surface of the second cam 11. During the rotation of the rotating shaft 10, the second cam 11 is driven to rotate. The second cam 11 pushes the chip located in the positioning frame 38 towards the conveying mechanism 3 through the push column 26, so that the chip is bonded and packaged with the diode. The chip pushes the positioning plates 35 on both sides to slide outward in the slide groove 34. The positioning rod 36 and the telescopic spring 32 on the outside of the positioning frame 38 are used to drive the positioning plate 35 to return to its original position.

[0026] A limiting plate 12 is fixedly installed on one side of the second U-shaped frame 17. A second incomplete gear 18 is fixedly installed on the surface of the limiting plate 12. A gear 16 is fixedly connected to the top of the turntable 48. The gear ratio of the second incomplete gear 18 to the gear 16 is 1:3. A turbine 14 is fixedly installed on the top of the second incomplete gear 18. The turbine 14 meshes with a worm gear 15. The drive motor drives the worm gear 15 to rotate. During the rotation of the worm gear 15, the turbine 14 rotates. The turbine 14 drives the second incomplete gear 18 to rotate. The second incomplete gear 18 drives the gear 16 to rotate 120°, thereby realizing the transport of the chip. During the chip transport process, the operator continuously places chips into the positioning frame 38.

[0027] Please see Figures 8-9A drying mechanism is also provided between the second U-shaped frame 17 for drying the diodes after dispensing. The drying mechanism includes air chambers 2 arranged opposite to each other on both sides of the workbench 1. An air outlet 4 is provided on the side of the air chambers 2 that are close to each other. A cylinder 22 is arranged opposite to each other between the second U-shaped frame 17. A piston is provided inside the cylinder 22. An air inlet pipe 20 is provided on one side of the cylinder 22. A one-way valve limited to air intake is provided between the air inlet pipe 20 and the cylinder 22. An exhaust pipe 19 is provided on the other side of the cylinder 22. A one-way valve limited to exhaust is provided between the exhaust pipe 19 and the cylinder 22. The end of the exhaust pipe 19 away from the cylinder 22 is connected to the air chamber 2. A heater 21 is provided between the exhaust pipe 19. The bottom end of the second incomplete gear 18 extends and is fixedly connected to a disc 44. A locking pin is provided on one side of the surface edge of the disc 44. A push plate 45 is provided on the outside of the locking pin. A through groove is provided between the push plates 45 and is movably connected to the locking pin. Piston rods 46 are fixedly installed on both sides of the push plates 45. A piston extends and is fixedly connected to the end of the piston rods 46. Specifically, in this embodiment, the second incomplete gear 18 drives the disk 44 to rotate during rotation. The disk 44 is pushed to move back and forth in the cylinder 22 by the locking pin, the push plate 45, and the piston rod 46. The cylinder 22 supplies air to the air chamber 2 through the air inlet pipe 20 and the exhaust pipe 19. The air in the exhaust pipe 19 is heated by the heater 21. The heated air is blown to the diode after glue application through the air outlet 4 to dry the glue.

[0028] A counter 6 is provided on the top of the conveying mechanism 3. The counter 6 is installed on the top of the conveying mechanism 3 via the mounting bracket 5. It is used to count the diodes placed in the bearing groove 29. A detector 31 is provided at the bottom of the turntable 48. The detector 31 is used to detect the packaged diodes and detect whether the diodes are packaged with the chip. The detector 31 can be a camera or an infrared detector.

[0029] A method for operating a semiconductor chip packaging device specifically includes the following steps: 1) Place the diode in the carrier groove 29 on the surface of the conveying mechanism 3, and clamp and fix the diode through the carrier groove 29; 2) The conveying mechanism 3 conveys the diode. When the diode is conveyed to the bottom of the dispensing tube 42, the sealing mechanism separates in the dispensing cylinder 24, so that the dispensing tube 42 is connected to the suction tube 39 through the dispensing cylinder 24. The glue in the storage cylinder 8 falls into the dispensing cylinder 24 through the suction tube 39 under the action of gravity. The glue in the dispensing cylinder 24 falls onto the surface of the diode through the dispensing tube 42 to perform dispensing treatment on the diode. 3) The drive motor drives the worm gear 15 to rotate, and the worm gear 15 drives the rotating shaft 10 to rotate through the belt 13. During the rotation, the rotating shaft 10 drives the second cam 11 to rotate. The second cam 11 pushes the chip located in the positioning frame 38 towards the conveying mechanism 3 through the push column 26, so that the chip is bonded and packaged with the diode. 4) During the rotation of the second incomplete gear 18, the disk 44 is driven to rotate. The disk 44 is pushed to move back and forth in the cylinder 22 by the locking pin, the push plate 45, and the piston rod 46. The cylinder 22 supplies air to the air chamber 2 through the air inlet pipe 20 and the exhaust pipe 19. The air in the exhaust pipe 19 is heated by the heater 21. The heated air is blown to the diode after glue application through the air outlet 4 to dry the glue.

[0030] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0031] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A semiconductor chip packaging apparatus, comprising a worktable (1) and a conveying mechanism (3) arranged between the worktables (1), wherein a plurality of carrier grooves (29) are arranged at intervals on the surface of the conveying mechanism (3), and the carrier grooves (29) are used to carry and store diodes to be packaged. Its features are, Also includes: A dispensing assembly, comprising a glue reservoir (8) and a glue delivery mechanism connected to the glue reservoir (8), and The packaging assembly includes a chip positioning mechanism and a pushing mechanism. The chip positioning mechanism is used to position and store the chip to be packaged, and the pushing mechanism is arranged above the chip positioning mechanism to push the chip in the chip positioning mechanism to bond and package the diode. The glue delivery mechanism includes a glue delivery cylinder (24), one end of which is connected to a glue storage cylinder (8) via a glue extraction pipe (39), and the other end of the glue delivery cylinder (24) is provided with a glue dispensing pipe (42). A sealing mechanism is provided between the glue delivery cylinders (24). The sealing mechanism includes a sealing plate (43), which is connected to a first incomplete gear (47). The two ends of the glue delivery cylinder (24) are provided with rack plates (40) opposite to each other. The top of the glue delivery cylinder (24) is connected to a push mechanism that drives it to move back and forth in the vertical direction. The top of the workbench (1) is provided with a first U-shaped frame (7) and a second U-shaped frame (17), and the glue storage cylinder (8) is fixedly installed on the surface of the first U-shaped frame (7); The driving mechanism includes a rotating shaft (10), which is connected to a worm gear (15) via a belt (13), and the worm gear (15) is connected to a drive motor; A first cam (9) is installed at one end of the rotating shaft (10), the glue delivery cylinder (24) is connected to the first push rod (33), a horizontal plate (23) is installed at the bottom of the first U-shaped frame (7), a rack plate (40) is installed on the surface of the horizontal plate (23), a glue dispensing tube (42) passes through the horizontal plate (23), and a first return spring (41) is provided on the outside of the glue dispensing tube (42); The chip positioning mechanism includes a turntable (48), three sets of positioning frames (38) are arranged on the outside of the turntable (48), slide grooves (34) are provided on both sides of the positioning frames (38), positioning plates (35) are installed in the slide grooves (34), a tapered part is provided at one end of the positioning plate (35), a positioning rod (36) is provided on the outside of the positioning frame (38), and a telescopic spring (32) is provided on the outside of the positioning rod (36). A second cam (11) is provided on the other side of the rotating shaft (10), a support plate (28) is provided between the second U-shaped frame (17), a push column (26) is provided between the support plates (28), a push head (27) is provided at one end of the push column (26), a second return spring (25) is provided on the outside of the push column (26), and the end of the push column (26) contacts the outer circular surface of the second cam (11); A limiting plate (12) is installed on one side of the second U-shaped frame (17). A second incomplete gear (18) is installed on the surface of the limiting plate (12). A gear (16) is extended from the top of the turntable (48). A turbine (14) is installed on the top of the second incomplete gear (18). The turbine (14) meshes with the worm (15). A drying mechanism is also provided between the second U-shaped frame (17). The drying mechanism includes an air chamber (2), an air outlet (4) is provided on one side of the air chamber (2), a cylinder (22) is provided between the second U-shaped frame (17), a piston is provided inside the cylinder (22), an air inlet pipe (20) is provided on one side of the cylinder (22), an exhaust pipe (19) is provided on the other side, the exhaust pipe (19) is connected to the air chamber (2), and a heater (21) is provided between the exhaust pipes (19). The second incomplete gear (18) is connected to the disc (44). A locking pin is provided on one side of the surface edge of the disc (44). A push plate (45) is provided on the outside of the locking pin. Piston rods (46) are fixedly installed on both sides of the push plate (45). The piston rods (46) are connected to the piston.

2. A method of operating the semiconductor chip packaging apparatus as described in claim 1, characterized in that, Specifically, the steps include the following: 1) Place the diode in the carrier groove (29) on the surface of the conveying mechanism (3) and clamp and fix the diode through the carrier groove (29); 2) The conveying mechanism (3) conveys the diode. When the diode is conveyed to the bottom of the dispensing tube (42), the sealing mechanism separates in the dispensing cylinder (24), so that the dispensing tube (42) is connected to the suction tube (39) through the dispensing cylinder (24). The glue in the storage cylinder (8) falls into the dispensing cylinder (24) through the suction tube (39) under the action of gravity. The glue in the dispensing cylinder (24) falls onto the surface of the diode through the dispensing tube (42) to perform dispensing treatment on the diode. 3) The drive motor drives the worm (15) to rotate, and the worm (15) drives the rotating shaft (10) to rotate through the belt (13). During the rotation of the rotating shaft (10), the second cam (11) rotates. The second cam (11) pushes the chip located in the positioning frame (38) towards the conveying mechanism (3) through the push column (26), so that the chip is bonded and packaged with the diode. 4) During the rotation of the second incomplete gear (18), the disk (44) is driven to rotate. The disk (44) is pushed to move back and forth in the cylinder (22) by the pin, the push plate (45) and the piston rod (46). The cylinder (22) supplies air to the air chamber (2) through the air inlet pipe (20) and the exhaust pipe (19). The air in the exhaust pipe (19) is heated by the heater (21). The heated air is blown to the diode after glue application through the air outlet (4) to dry the glue.

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