Sun visor and electronic component

Abstract

A sun shield and electronic component are disclosed, wherein the sun shield is used to protect a device housing from solar heat and to allow cooling from external airflow. The sun shield includes a main plate configured to cover a side of the device housing. A vent is located in the main plate to allow airflow through the main plate to the device housing. A shutter is rotatable between an open position to allow airflow through the vent and a closed position to block airflow through the vent. A biasing mechanism provides a force to bias the shutter in the closed position. This force is overcome by a predetermined level of external airflow on the shutter to rotate the shutter to the open position.

Description

Technical Field

[0001] This invention relates to cooling fanless components. More specifically, several aspects of the invention relate to a sunshade having a movable baffle for protecting the chassis of a fanless component. Background Technology

[0002] Fifth-generation wireless systems (5G) is the latest generation of mobile communication technology. 5G technology is an extension of the older 4G (LTE) mobile communication system. The recently launched 5G communication infrastructure requires the deployment of components that support 5G. Previous 4G systems required a baseband unit (BBU), a remote radio unit (RRU), and an antenna to allow communication between mobile devices. 5G systems for communication between mobile devices offer higher speeds, lower latency, and greater bandwidth, allowing for more connections and more data to be processed. This performance is made possible through fanless components such as radio units (RUs), centralized units (CUs), distributed units (DUs), and active antenna units (AAUs). In 5G systems, the functions of the baseband unit in 4G systems are performed by the distributed and centralized units, and the functions of the antenna and remote radio unit in 4G systems are performed by the active antenna units.

[0003] Compared to 4G, the increased transmission speeds of 5G require more components, and more components generate more heat. The area of ​​heat dissipation components (such as heat sinks and fins) in 5G equipment must be increased to allow 5G to operate. For example, the power consumption of a 5G base station is 2-3 times that of a 4G base station. Higher power consumption leads to more heat generation. If a 5G base station has poor heat dissipation, its efficiency will decrease and it may cause equipment problems (such as damage, crashes, and network connection drops), seriously affecting the user experience.

[0004] 5G distribution units and active antenna units are typically located outdoors. The outdoor electronic enclosures for these units need to be waterproof, dustproof, and corrosion-resistant. Therefore, enclosures for 5G outdoor components are designed as enclosed systems and often function as heat sinks to cool the electronics within. This thermal solution is therefore a fanless design.

[0005] These components are directly exposed to other external weather conditions, such as sunlight. Sunlight causes additional heat loads to be applied to the component surfaces. For example, general requirements for network equipment (e.g., GR-3108 Class 4) stipulate a solar loading of 1120 watts per square meter in a single direction. To prevent the solar loading from directly affecting the electronic devices inside the component housing, a sunshade is added to protect the component from solar heat.

[0006] Figure 1A This illustration shows an example 5G component 10 with a prior art sun visor 12 mounted on a chassis 14 having several external fins 16. The chassis 14 houses various electronic components for 5G communication operations. The chassis 14 includes a connector panel 18 comprising various connectors for cables, etc. The sun visor 12 prevents heat loads from the sun from being applied to the interior of the chassis 14. However, while the sun visor 12 blocks the sun, it also blocks airflow from external winds necessary for dissipating heat radiation from the components within the chassis 14 via the fins 16.

[0007] One attempt to solve this problem is to provide several ventilation holes in the sun visor. Figure 1B An example 5G component housing 50 is shown, featuring a prior art sunshade 52 of another type. The sunshade 52 encloses the chassis of the component housing 50 and thus provides protection against solar thermal load. The sunshade 52 includes several ventilation holes 54, providing airflow through the chassis of the component housing 50. However, such ventilation holes 54 result in the chassis being at least partially exposed to sunlight through the ventilation holes 54. Sunlight through the ventilation holes 54 can lead to solar load on the chassis.

[0008] In a sunshade 52 with ventilation holes 54, if there is no external airflow velocity, the chassis is exposed to sunlight through the ventilation holes 54. This will result in a higher system temperature compared to a system without ventilation. In other cases where the airflow velocity is greater than 0.2 m / s, the chassis and sunshade have a lower temperature due to the presence of ventilation holes 54. Therefore, Figures 1A to 1B The existing sunshade design in this system is not sufficient in all situations. When there is little or no external airflow, the heat load from sunlight enters the chassis through the ventilation holes 54. Figure 1B The sunshade 52 in the middle is actually more than Figure 1A The sun visor 12 is a worse solution. However, when there is airflow, the sun visor 12 blocks the external airflow from cooling the chassis. Figure 1A The sunshade in the middle is 12 times Figure 1B The sunshade in the middle is 52mm poor.

[0009] Therefore, a sunshade is needed for an outdoor unit enclosure that prevents heat load from sunlight but allows external airflow. Additionally, a sunshade with several mechanical mechanisms is needed to allow a baffle to move to block sunlight or allow external airflow. Summary of the Invention

[0010] One disclosed example is a sunshade used to protect a device housing from solar heat. The sunshade has a main plate configured to cover one side of the device housing. A vent is located in the main plate, allowing airflow through the main plate to the device housing. A baffle is rotatable between an open position and a closed position; the open position allows airflow through the vent, and the closed position blocks airflow through the vent. A biasing mechanism provides a force to bias the baffle in the closed position. This force is overcome by a pre-positioned external airflow on the baffle to rotate the baffle to the open position.

[0011] Another embodiment of the example sun visor is that the device housing includes a heatsink chassis with several cooling fins near the motherboard. Another embodiment is that the sun visor is made of stainless steel, aluminum, aluminum alloy, or plastic, and the baffle is made of plastic. Another embodiment is that the example sun visor includes a backplate that can be attached to the device housing. The attached backplate and motherboard enclose the heatsink chassis. Another embodiment is that the baffle is one of a plurality of baffles on the main board, and the vent is one of a plurality of vents on the main board. Another embodiment is that the biasing mechanism is a torsion spring having a first spring arm and a second spring arm, the first spring arm being attached to the motherboard and the second spring arm being attached to the baffle. Another embodiment is that the biasing mechanism is a tension spring having a first end and a second end, the first end being attached to the baffle and the second end being attached to the motherboard. The baffle rotates on a pivot at a bottom edge attached to the vent. Another embodiment is that the biasing mechanism is a counterweight attached to one arm of the baffle. The baffle rotates on a pivot attached to a bottom edge of a vent. In another embodiment, the vent has a bottom edge and an opposite top edge. The baffle rotates about the bottom edge away from the top edge. In yet another embodiment, the device housing includes several components for a fifth-generation mobile communication system.

[0012] Another disclosed example is an electronic component including a heatsink chassis enclosing several heat-generating electronic components. The electronic component includes a sun visor with a mainboard configured to be positioned to cover one side of the heatsink chassis. The sun visor has a vent located within the mainboard, allowing airflow through the mainboard to the heatsink chassis. The sun visor has a baffle rotatable between an open position and a closed position; the open position allows airflow through the vent, while the closed position blocks airflow through the vent. A biasing mechanism provides a force to bias the baffle in the closed position. This force is overcome by a pre-positioned external airflow on the baffle to rotate the baffle to the open position.

[0013] Another embodiment of the example electronic component is a heatsink chassis including several cooling fins extending from an external surface of the heatsink chassis near the motherboard. Another embodiment is a sun visor made of stainless steel, aluminum, aluminum alloy, or plastic, and a baffle made of plastic. Another embodiment is a sun visor including a backplate that can be attached to the electronic component. The attached backplate and motherboard enclose the heatsink chassis. Another embodiment is a baffle one of a plurality of baffles on a main board, and a vent hole one of a plurality of vent holes on a main board. Another embodiment is a biasing mechanism of a torsion spring having a first spring arm and a second spring arm, the first spring arm being attached to the motherboard and the second spring arm being attached to the baffle. Another embodiment is a biasing mechanism of a tension spring having a first end and a second end, the first end being attached to the baffle and the second end being attached to the motherboard. The baffle rotates on a pivot at a bottom edge attached to a vent hole. Another embodiment is a biasing mechanism of a counterweight attached to an arm of the baffle. The baffle rotates on a pivot attached to a bottom edge of a vent. In another embodiment, the vent has a bottom edge and an opposite top edge, and the baffle rotates about the bottom edge away from the top edge. In yet another embodiment, the heat-generating electronic component performs functions for a fifth-generation mobile communication system.

[0014] The foregoing description is not intended to present every embodiment or feature of the invention. Rather, it provides only examples of some novel features and characteristics set forth herein. The above features and advantages, as well as other features and advantages, will become apparent from the following detailed description of representative embodiments and modes for carrying out the invention, taken in conjunction with the accompanying drawings and appended claims. Additional features of the invention will be apparent to those skilled in the art from the following brief description of various embodiments with reference to the accompanying drawings and the provided symbols. Attached Figure Description

[0015] The invention will be better understood from the following description of exemplary embodiments, taken in conjunction with the accompanying drawings, wherein:

[0016] Figure 1A A perspective view of a telecommunications component enclosure having a prior art sunshade;

[0017] Figure 1B A perspective view of a telecommunications component enclosure having a prior art sunshade of another type, which has ventilation holes;

[0018] Figure 2A For certain aspects of the invention, a front perspective view of a telecommunications component chassis having an example adjustable sunshade is provided;

[0019] Figure 2B For certain aspects of the invention, a cross-sectional perspective view of a telecommunications component chassis having an example adjustable sunshade is provided.

[0020] Figure 2C For certain aspects of the invention, a front perspective view of a chassis having an example adjustable sun visor is provided;

[0021] Figure 2D For certain aspects of the invention, a top perspective view of a chassis having an example adjustable sunshade is provided;

[0022] Figure 3 For certain aspects of the invention, an exploded perspective view of the chassis and components of an adjustable sun visor is provided.

[0023] Figure 4A For certain aspects of the present invention, Figure 2A Example of a front perspective view of the mainboard of an adjustable sun visor;

[0024] Figure 4B For certain aspects of the present invention, Figure 2A A rear perspective view of the mainboard of an example adjustable sun visor;

[0025] Figure 5A For certain aspects of the invention, one of the baffles of the sun visor has a torsion spring biasing mechanism, and a side view of an example of the baffle being in a closed position;

[0026] Figure 5B For certain aspects of the invention, one of the baffles of the sun visor has a torsion spring biasing mechanism, and a side view of an example of the baffle being in an open position;

[0027] Figure 5C For certain aspects of the invention, a perspective view of an example of a sun visor having one of its several baffles having a torsion spring biasing mechanism, with the baffle in an open position;

[0028] Figure 6A For some aspects of the invention, one of the baffles of the sun visor has a tension spring biasing mechanism, and another example of the baffle being in a closed position is shown in a side view.

[0029] Figure 6B For some aspects of the invention, one of the baffles of the sun visor has a tension spring biasing mechanism, and another example of the baffle being in an open position is shown in a side view.

[0030] Figure 7A For some aspects of the invention, another example of a sun visor having one of its baffles in a closed position is shown in the side view.

[0031] Figure 7B For some aspects of the invention, one of the baffles of the example sun visor has a counterweight biasing mechanism, and the baffle is in an open position (cross-sectional view).

[0032] Figure 8 For certain aspects of the present invention, Figure 5A The diagram shows the parameters of the torque biasing mechanism of the example adjustable sun visor, along with a table of test results based on the parameters.

[0033] While the invention is readily adaptable to various modifications and alternatives, specific embodiments have been illustrated by way of example in the accompanying drawings and will be described in further detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

[0034] Symbol Explanation

[0035] 10:5G components

[0036] 12: Sunshade

[0037] 14: Chassis

[0038] 16: External fins

[0039] 18: Connector Panel

[0040] 50:5G component shell

[0041] 52: Sunshade

[0042] 54: Ventilation holes

[0043] 100: Telecommunications equipment components / distributed unit components

[0044] 110: Sunshade assembly

[0045] 120: Outer shell

[0046] 122: CPU Cooler Case

[0047] 124: Bottom connector panel

[0048] 126: Top Panel

[0049] 128: Handle

[0050] 130: External fins / Vertical fins / Fins

[0051] 140: Motherboard / Main Protection Board / Protection Board

[0052] 142: Backplate

[0053] 150: Ventilation hole

[0054] 152: Rotating baffle / baffle

[0055] 160, 162: Side panels

[0056] 164: Screw

[0057] 166: Screw hole

[0058] 170, 172: Side plate

[0059] 174: Screw

[0060] 176: Screw hole

[0061] 510, 520: Torsion springs

[0062] 522: Coil

[0063] 524: Spring Arm

[0064] 526: Second Spring Arm

[0065] 530, 540: Arrows

[0066] 610: Pivot

[0067] 620: Tension Spring

[0068] 622: First Ring

[0069] 624: Second Ring

[0070] 710: Pivot

[0071] 720: Extending Arm

[0072] 722: Counterweight

[0073] 800: Table

[0074] λ: Angle

[0075] W p Air force Detailed Implementation

[0076] This invention can be embodied in many different forms. Representative embodiments are shown in the accompanying drawings and will be described in detail herein. The summary of this invention is an example or illustration of the principles of the summary and is not intended to limit the broad aspects of the summary to the embodiments shown. In this regard, elements and limitations disclosed, for example, in the abstract, summary and description sections but not expressly set forth in the claims should not be incorporated into the claims individually or collectively by implication, inference, or otherwise. For the purposes of this embodiment, unless expressly stated otherwise, the singular includes the plural and vice versa. The term "comprising" means "including but not limited to". Furthermore, approximate words such as "about," "almost," "substantially," and "approximately," and similar words, may be meant herein as, for example, "at," "near," "within 3-5% of," "within acceptable manufacturing tolerances," or any logical combination thereof.

[0077] This invention relates to an example adjustable sunshade that provides thermal protection for a fanless component in both still and non-still air conditions. The adjustable sunshade has a series of baffles that are positioned to cover the chassis and protect it from solar heat when there is little or no external airflow. The baffles of the adjustable sunshade move with external airflow to allow airflow into the chassis when the external airflow is relatively high. In this way, when there is little or no external airflow, the baffles are closed by a biasing mechanism to prevent solar heat load. When there is relatively high airflow, the example adjustable sunshade allows external airflow to overcome the biasing mechanism and open the baffles for cooling. A first type of biasing mechanism includes a torsion spring that positions the baffles of the sunshade. A second type of biasing mechanism includes a tension spring that positions the baffles of the sunshade. A third type of biasing mechanism includes a counterweight that positions the baffles of the sunshade.

[0078] Figure 2A Showing a front perspective view of a telecommunications equipment component 100 having an example sun visor assembly 110. Figure 2B A cross-sectional perspective view of an exemplary chassis of a telecommunications component 100 having an example sunshade assembly 110 is shown. Figure 2C Showing a rear perspective view of the assembled device component 100 and the example sunshade assembly 110. Figure 2D The image shows an upper perspective view of the assembled device component 100 and the example sunshade assembly 110. Figure 3 An exploded perspective view of the components of the display device component 100 and the example sun visor assembly 110.

[0079] General reference Figures 2A to 2D as well as Figure 3 Telecommunications equipment component 100 is a fanless electronic device. In this example, telecommunications equipment component 100 is a 5G distribution unit (DU) including a housing 120 that houses a printed circuit board for performing 5G communication functions and other electronic components. As will be explained, an example sunshade assembly 110 is attached to housing 120 to protect the housing from sunlight. The example sunshade assembly 110 can be used in any device designed for outdoor use, such as other 5G telecommunications components (e.g., a radio unit (RU) or an active antenna unit (AAU)) that rely on a fanless cooling system to cool their internal electronics. In this example, distribution unit component 100 is part of a 5G mobile communication system that relies on electronic components that require heat dissipation to function properly.

[0080] Housing 120 includes a heatsink enclosure 122, a bottom connector panel 124, and an opposing top panel 126 with a handle 128. Connecting cables and connectors can be attached to connectors on the connector panel 124 to provide power and electrical signals to components on a printed circuit board and other electronic devices within housing 120. Electronic components typically include a processor, such as a central processing unit, double data rate (DDR) memory, physical layer key generation circuitry, a network interface, a power supply, and other components. Connectors may include small form factor (SFP) optical and RJ45 type connectors. Components within housing 120 generate heat, which is absorbed by the heatsink enclosure 122.

[0081] The heatsink enclosure 122 allows heat generated by the internal electronics of component 100 to be transferred to the surrounding external environment. The heatsink enclosure 122 includes a series of external fins 130 that help dissipate ambient heat to the external environment. However, because the heatsink enclosure 122 is constructed of a heat-absorbing material such as aluminum or an aluminum alloy, it readily absorbs heat from sunlight and draws it back into the enclosure 120. As will be explained, the example sunshade assembly 110 prevents sunlight from providing an undesirable solar heat load to the heatsink enclosure 122.

[0082] The heatsink chassis 122 has a generally flat internal surface that absorbs heat transferred through internal electronic components of the component 100. A portion of the internal surface of the heatsink chassis 122 serves as a thermal contact surface for heat transfer with components on a circuit board (e.g., a central processing unit). Heat is injected from the internal surface into an opposing external surface of the heatsink chassis 122. Several vertical fins 130 extend from the external surface. The vertical fins 130 increase the surface area capable of dissipating heat from the heatsink chassis 122 to the surrounding environment.

[0083] Example sun visor assembly 110 is shown in Figure 2A , Figure 2B ,as well as Figure 3 The sun visor assembly 110 is attached to component 100 to protect the radiator chassis 122. The sun visor assembly 110 includes a main board 140 and a back plate 142. The main board 140 and back plate 142 can be attached to the housing 120, respectively. In this example, the main board 140 and back plate 142 are attached to the housing 120 by screws. Other attachment mechanisms can also be used to attach the main board 140 and back plate 142 to the housing 120.

[0084] Figure 4A This is a front perspective view of the mainboard 140 of the sun visor assembly 110. Figure 4B This is a 3D view of the motherboard 140. (See image below.) Figure 2A , Figure 2B , Figure 3 , Figure 4A ,as well as Figure 4B As shown, the motherboard 140 includes a series of rectangular vents 150 and corresponding rotating baffles 152. The vents 150 allow airflow through the motherboard 140. In this example, the motherboard 140 may be made of stainless steel, plastic, aluminum, or an aluminum alloy. The rotating baffles 152 may be made of a lightweight material such as plastic. The rotating baffles 152 rotate between a closed position that blocks the vents 150 and an open position that allows airflow through the vents 150. If additional external cooling from the backplate 142 is possible, similar vents and rotating baffles may be formed on the backplate 142.

[0085] The motherboard 140 is attached to two side plates 160 and 162. Side plates 160 and 162 are engaged at individual opposite side edges of the motherboard 140. In this example, the motherboard 140 and side plates 160 and 162 are manufactured as a single piece. The main shield 140 and side plates 160 and 162 are inserted into and attached to the heatsink chassis 122, thus the main shield 140 protects the heatsink chassis 122, as... Figure 2A as well as Figure 2B As shown, side plates 160 and 162 are at a perpendicular angle to the motherboard 140. Several screws 164 are inserted into several screw holes 166 in each side plate 160 and 162 to allow the motherboard 140 to be attached to the side plates 160 and 162 to the housing 120. In this example, each of the side plates 160 and 162 has three equidistant screw holes 166. Other screw hole arrangements and numbers can be used.

[0086] The backplate 142 also includes two side panels 170 and 172 at a perpendicular angle to the backplate 142. The ends of the side panels 170 and 172 are angled to allow airflow through gaps formed with the individual side panels 160 and 162 to the sides of the device housing 120. A series of screws 174 are inserted into screw holes 176, allowing the backplate 142 and the side panels 170 and 172 to be attached to the housing 120. In this example, the backplate 142 has four screw holes 176 in the middle and four screw holes 176 at each corner. Other arrangements and numbers of screw holes can be used. The main protective plate 140 is attached to the housing 120 to align the positions of the side panels 160 and 170, and to align the positions of the side panels 162 and 172.

[0087] In this example, when the external airflow has a speed below a predetermined rate, the baffle 152 covers the vent 150. When the speed of the external airflow exceeds a predetermined rate (e.g., 2 m / s), the external airflow pushes the baffle 152 to rotate toward the interior of the motherboard 140, thereby allowing the external airflow to be guided through the vent 150 to the fins 130 of the heatsink chassis 122.

[0088] When the airflow is still or low, various biasing mechanisms can keep the baffle 152 closed. When the airflow exceeds a certain velocity, it overcomes the force applied by the biasing mechanisms, thereby rotating the baffle 152 open. This allows external airflow to be guided through the vent 150. Figure 5A The image shows a side view of one of the baffles 152 relative to the guard plate 140 when the baffle 152 is closed from a biasing mechanism based on a torsion spring. Figure 5B The image shows a side view of one of the baffles 152 relative to the main board 140 when the baffle 152 is forced open by an external airflow that overcomes the force of the torsion spring biasing mechanism. Figure 5C This shows a perspective view of one of the baffles 152 relative to the protective plate 140 when the baffle 152 is opened due to external airflow.

[0089] like Figure 5C As shown, two individual torsion springs 510 and 520 are attached to the side of the baffle 152. External airflow, overcoming the force of the torsion spring biasing mechanism, forces the baffle 152 open. This allows external airflow to enter through the vent 150. In this example, the torsion spring 520 has a coil 522 with a spring arm 524 attached to the baffle 152 and a second spring arm 526 attached to the inner surface of the main plate 140. The other torsion spring 510 has similar components to the torsion spring 520. The spring force of the torsion springs 510 and 520 forces the baffle 152 to cover the vent 150, as... Figure 5A As shown.

[0090] When airflow passes through vent 150, baffle 152 is subjected to the force of airflow pushing, as indicated by arrow 530, to overcome the spring force. Baffle 152 is thus moved to allow airflow into vent 150 and for airflow to dissipate system heat from the radiator housing 122. Conversely, if the airflow is still, the baffle remains in its original position due to the spring force, and it helps to block solar radiation. Because baffle 152 is positioned at an angle to a point of rotation at the bottom edge of vent 150, as... Figure 5B As shown, the angle at which the baffle 152 is open helps to block sunlight, indicated by arrow 540, from entering through the vent 150. This arrangement also prevents direct exposure to solar radiation, even when external airflow keeps the baffle 152 open.

[0091] Figure 6A The image shows a side view of one of the baffles 152 relative to the guard plate 140 when the baffle 152 is closed from a biasing mechanism based on a tension spring. Figure 6B This shows a side view of one of the baffles 152 relative to the main board 140 when the baffle 152 is forced open by an external airflow overcoming the force of the tension spring biasing mechanism. In this example, the baffle 152 is mounted on a pivot 610 at the bottom edge of the vent 150. The pivot 610 allows the baffle 152 to rotate away from the top edge of the vent 150. One end of a tension spring 620 has a first loop 622 attached to the main board 140. The opposite end of the tension spring 620 has a second loop 624 attached to the opposite end of the baffle 152 and the pivot 610. Thus, the tension spring 620 applies a spring force to bias the baffle 152 to block the vent 150, as... Figure 6A As shown.

[0092] As airflow flows toward baffle 152, the force of the airflow overcomes the spring force of tension spring 620. Baffle 152 thus rotates on pivot 610 to allow access to vent 150, and airflow dissipates system heat from radiator housing 122, such as... Figure 6B As shown. When the airflow is still, due to the elastic force of the tension spring 620, the baffle 152 blocks the ventilation hole 150, thereby blocking solar radiation. Since the baffle 152 is positioned at an angle to the pivot 610 at the bottom edge of the ventilation hole 150, as... Figure 6B As shown, the angle at which the baffle 152 is open helps to block sunlight from entering through the vent 150 and prevents direct solar radiation even when the airflow keeps the baffle 152 open.

[0093] Figure 7A The image shows a side view of one of the baffles 152 relative to the guard plate 140 when the baffle 152 is closed from a biasing mechanism based on a counterweight. Figure 7BThe image shows a side view of one of the baffles 152 relative to the main board 140 when the baffle 152 is forced open by an external airflow that overcomes the force of the counterweight biasing mechanism.

[0094] In this example, baffle 152 rotates about a pivot 710 on the bottom edge of vent 150. Baffle 152 is at a small angle in the closed position to block most of vent 150. Baffle 152 includes an extension arm 720 that holds a counterweight 722. Therefore, gravity pulls the counterweight 722 downward, thereby rotating the baffle about the pivot 710 to the closed position, thus blocking vent 150, as... Figure 7A As shown. When the external airflow exceeds a certain speed, the airflow generates sufficient force to overcome the gravity of the counterweight 722. Therefore, the baffle 152 is rotated about the pivot 710 to the open position by the airflow force, as shown. Figure 7B As shown.

[0095] Figure 8 Displays a table of 800, with... Figure 5A as well as Figure 5B Test results of an example sun visor assembly with a torsion spring biasing mechanism. Figure 8 Zhongyu Figure 5A Similar components are indicated by the same reference numerals. To demonstrate the feasibility of the example adjustable sunshade, the following scenario was tested to calculate wind speeds. Based on the calculations, the baffle 152 can be successfully opened when the airflow velocity exceeds 2 m / s. A thermal simulation tool was used to examine the thermal performance of this design.

[0096] In this test, the dimensions of baffle 152 are 300 × 30 mm. Torsion spring 520 is made of SUS304 stainless steel and has a coil with a diameter of 2 mm. Spring arms 524 and 526 are 15 mm long and 0.2 mm in diameter. The spring constant k is 0.95 g / mm / degree. Table 800 shows Beaufort scale B, airflow velocity ν (in m / s), and the aerodynamic force W applied to the baffle. p And the angle λ between the baffle 152 and the mainboard 140. In this example, the aerodynamic force from the external airflow is evaluated from dynamic pressure, expressed as... The angle λ between the baffle 152 and the main plate 140 varies according to the airflow velocity. The angle λ of the baffle 152 is calculated by the following equation:

[0097]

[0098] Arm 1 is the length of spring arm 524. As shown in Table 800, when the air speed is 2 m / s (4.5 mph), the baffle 152 opens to approximately 18 degrees. When the air speed is 3 m / s (6.7 mph), the baffle 152 opens to approximately 40 degrees.

[0099] The biasing mechanism can be adjusted to a specific airflow velocity using the above calculations. Therefore, springs with various spring constants can be provided to adjust the required wind speed for opening the baffle 152. Alternatively, the weight of the counterweight and / or the pivot position can be adjusted to adjust the required wind speed for opening the baffle 152. Furthermore, the biasing mechanism can be adjusted so that the baffles in different areas open at a specific air velocity. The aforementioned baffles and biasing mechanism are designed to block solar radiation under still air conditions and allow access to ventilation openings when there is wind force to overcome the biasing mechanism.

[0100] When the environment is not still air (airflow speeds exceed 2 to 3 m / s in most outdoor environments), the example adjustable sunshade with ventilation holes and a movable baffle can have the advantages of a ventilated sunshade. If the sunshade is in still air conditions, it blocks solar radiation. The example adjustable sunshade combines the advantages of both existing "ventilated" and "non-ventilated" types of sunshades.

[0101] As used herein, the terms "component," "module," "system," etc., generally refer to a computer-related entity, hardware (e.g., a circuit), a combination of hardware and software, software, or an entity associated with an operating machine having one or more specific functions. For example, a component can be, but is not limited to, a program, processor, object, executable file, thread, program, and / or computer running on a processor (e.g., a digital signal processor). By way of illustration, an application running on a controller and the controller itself can both be components. One or more components may reside within a program and / or thread, and components may be located on a single computer and / or distributed among two or more computers. Furthermore, a "device" can appear in the form of specially designed hardware; general-purpose hardware specialized by executing software thereon that enables the hardware to perform specific functions; software stored on a computer-readable medium; or a combination thereof.

[0102] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms "a" and "the" as used herein are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "including," "having," or variations thereof, as used in embodiments and / or the claims of the patent application, are intended to be included in a manner similar to the word "comprising."

[0103] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as understood by one of ordinary skill in the art. Furthermore, terms (e.g., those defined in common dictionaries) should be interpreted as having the same meaning as they have in the relevant art, and will not be interpreted herein in an idealized or overly formal sense unless explicitly defined as such.

[0104] While various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limiting. Although embodiments of the invention have been shown and described with respect to one or more implementations, equivalents and modifications will arise in those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while specific features of the invention may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous for any given or particular application. Therefore, the breadth and scope of the invention should not be limited by any of the foregoing embodiments. Rather, the scope of the invention should be defined by the appended claims and their equivalents.

Claims

1. A sunshade for protecting an equipment housing, the equipment housing including a radiator chassis having a plurality of cooling fins, the sunshade comprising: The motherboard is configured to cover one side of the heatsink chassis that has the plurality of cooling fins; A backplate is configured to attach to the side of the device housing opposite the motherboard, the backplate and the motherboard together enclosing the heatsink chassis; Ventilation holes, located in the motherboard, allow airflow through the motherboard to the cooling fins on the device housing; The baffle can rotate between an open position and a closed position, the open position allowing airflow through the vent and the closed position blocking airflow through the vent; as well as A biasing mechanism provides a force to bias the baffle in the closed position, wherein the force is overcome by a predetermined level of external airflow on the baffle to rotate the baffle to the open position.

2. The sunshade as claimed in claim 1, wherein the baffle is one of a plurality of baffles on the main board, and wherein the ventilation hole is one of a plurality of ventilation holes on the main board.

3. The sunshade as claimed in claim 1, wherein the biasing mechanism is a torsion spring having a first spring arm and a second spring arm, the first spring arm being attached to the main board and the second spring arm being attached to the baffle.

4. The sunshade of claim 1, wherein the biasing mechanism is a tension spring having a first end and a second end, the first end being attached to the baffle and the second end being attached to the main plate, wherein the baffle rotates on a pivot attached to the bottom edge of the vent.

5. The sunshade of claim 1, wherein the biasing mechanism is a counterweight attached to an arm on the baffle, wherein the baffle rotates on a pivot attached to the bottom edge of the vent.

6. The sunshade of claim 1, wherein the vent has a bottom edge and an opposite top edge, wherein the baffle rotates about the bottom edge away from the top edge.

7. An electronic component, comprising: A heatsink enclosure that encloses several heat-generating electronic components; the heatsink enclosure has several cooling fins. as well as Sunshade, including: The motherboard is configured to be positioned to cover one side of the heatsink case, which has several cooling fins. A backplate is configured to be attached to the side of the electronic component opposite the motherboard, and the backplate and the motherboard together surround the heatsink chassis; Ventilation holes, located in the motherboard, allow airflow through the motherboard to the cooling fins on the heatsink chassis; A baffle, rotatable between an open position and a closed position, wherein the open position allows airflow through the vent and the closed position blocks airflow through the vent; and A biasing mechanism provides a force to bias the baffle in the closed position, wherein the force is overcome by a predetermined level of external airflow on the baffle to rotate the baffle to the open position.

8. The electronic component of claim 7, wherein the biasing mechanism is a torsion spring having a first spring arm and a second spring arm, the first spring arm being attached to the motherboard and the second spring arm being attached to the baffle.

9. The electronic component of claim 7, wherein the biasing mechanism is a tension spring having a first end and a second end, the first end being attached to the baffle and the second end being attached to the motherboard, wherein the baffle rotates on a pivot attached to the bottom edge of the vent.

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