A light emitting diode display and a manufacturing method thereof

Abstract

The application provides a light emitting diode display and a manufacturing method thereof. The light emitting diode display comprises a driving substrate, a main light emitting element and a redundant light emitting element corresponding to the main light emitting element arranged on the driving substrate. A device layer of the driving substrate is formed with a first driving control module and a second driving control module. The first driving control module is connected to and controls the main light emitting element, and the second driving control module is connected to and controls the redundant light emitting element, thereby realizing independent control of the two, improving the display brightness of the LED, and reducing power consumption. The gate of a first switch transistor of the first driving control module and the gate of a second switch transistor of the second driving control module can be connected to the same gate terminal. Alternatively, the source of the first switch transistor and the source of the second switch transistor can be connected to the same data terminal. Alternatively, the source of the first driving transistor and the source of the second driving transistor can be connected to the same power voltage terminal, thereby increasing the circuit design style and design flexibility of the light emitting diode display.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and in particular to a light-emitting diode display and its manufacturing method. Background Technology

[0002] LEDs, with their high luminous efficiency, long lifespan, safety, reliability, and energy efficiency, have garnered significant attention in the lighting and display fields. When used in displays, LED chips need to be soldered onto circuit boards to form the display panel. During the soldering process, due to the small size of the LED chips, chip misalignment can occur, causing the LED to fail to light up; alternatively, the LED may become damaged and unable to light up during use. Unlit LED chips severely impact the yield rate and display quality of the display panel, necessitating repair or replacement. Current technology typically sets a redundant position at each sub-pixel location. When the LED chip at a sub-pixel location fails to light up, an identical redundant LED chip is soldered to the redundant position to replace the damaged one. However, this redundant LED chip shares the same driving transistor (TFT) with the redundant LED chip, leading to increased power consumption and other issues.

[0003] Therefore, there is an urgent need for a rapid repair solution to improve the yield rate and display effect of the monitor. Summary of the Invention

[0004] In view of the deficiencies in LED chip repair in the prior art, the present invention provides a light-emitting diode display and a method for manufacturing the same. A main light-emitting element and a redundant light-emitting element are disposed on a driving substrate. The main light-emitting element and the redundant light-emitting element are respectively connected to a first driving control module and a second driving control module in the driving substrate, so as to realize the individual control of the main light-emitting element and the redundant light-emitting element. This can improve the display brightness of the LED and reduce power consumption to a certain extent.

[0005] According to one embodiment of the present invention, a light-emitting diode display is provided, comprising:

[0006] A driving substrate, the driving substrate including a device layer, wherein a first driving control module and a second driving control module are formed in the device layer;

[0007] A main light-emitting element and a redundant light-emitting element corresponding to the main light-emitting element are disposed on the driving substrate. The main light-emitting element is connected to the first driving control module, and the redundant light-emitting element is connected to the second driving control module.

[0008] Optionally, the first driving control module includes a first switching transistor and a first driving transistor, the first switching transistor being connected to the first driving transistor for controlling the first driving transistor, and the first driving transistor being connected to the main light-emitting element; the second driving control module includes a second switching transistor and a second driving transistor, the second switching transistor being connected to the second driving transistor for controlling the second driving transistor, and the second driving transistor being connected to the redundant light-emitting element.

[0009] Optionally, the light-emitting diode display includes a power supply voltage terminal and a ground terminal. The source of the first driving transistor is connected to the power supply voltage terminal, and the drain of the first driving transistor is connected to the anode of the main light-emitting element. The source of the second driving transistor is connected to the power supply voltage terminal, and the drain of the second driving transistor is connected to the anode of the redundant light-emitting element. The cathode of the main light-emitting element and the cathode of the redundant light-emitting element are both connected to the ground terminal.

[0010] Optionally, the light-emitting diode display includes a first power supply voltage terminal, a second power supply voltage terminal, and a ground terminal. The source of the first driving transistor is connected to the first power supply voltage terminal, and the drain of the first driving transistor is connected to the anode of the main light-emitting element. The source of the second driving transistor is connected to the second power supply voltage terminal, and the drain of the second driving transistor is connected to the anode of the redundant light-emitting element. The cathode of the main light-emitting element and the cathode of the redundant light-emitting element are both connected to the ground terminal.

[0011] Optionally, the light-emitting diode display further includes a first data terminal, a second data terminal, and a common gate terminal. The source of the first switching transistor is connected to the first data terminal, and the drain of the first switching transistor is connected to the gate of the first driving transistor. The source of the second switching transistor is connected to the second data terminal, and the drain of the second switching transistor is connected to the gate of the second driving transistor. The gates of the first switching transistor and the gates of the second switching transistor are connected to the common gate terminal.

[0012] Optionally, the light-emitting diode display further includes a first data terminal, a second data terminal, a first gate terminal, and a second gate terminal. The source of the first switching transistor is connected to the first data terminal, the drain of the first switching transistor is connected to the gate of the first driving transistor, and the gate of the first switching transistor is connected to the first gate terminal. The source of the second switching transistor is connected to the second data terminal, the drain of the second switching transistor is connected to the gate of the second driving transistor, and the gate of the second switching transistor is connected to the second gate terminal.

[0013] Optionally, the light-emitting diode display further includes a common data terminal, a first gate terminal, and a second gate terminal. The drain of the first switching transistor is connected to the gate of the first driving transistor, and the gate of the first switching transistor is connected to the first gate terminal. The drain of the second switching transistor is connected to the gate of the second driving transistor, and the gate of the second switching transistor is connected to the second gate terminal. The sources of the first switching transistor and the second switching transistor are connected to the common data terminal.

[0014] Optionally, the device layer further includes a first compensation transistor and a second compensation transistor, wherein the first compensation transistor is disposed between the main light-emitting element and the first driving transistor of the first driving control module, and the second compensation transistor is disposed between the redundant light-emitting element and the second driving transistor of the second driving control module.

[0015] Optionally, the light-emitting diode display further includes a first sensing terminal, a second sensing terminal, a first compensation gate terminal, and a second compensation gate terminal. The source of the first compensation transistor is connected to the first sensing terminal, the drain of the first compensation transistor is connected between the first driving transistor and the main light-emitting element, and the gate of the first compensation transistor is connected to the first compensation gate terminal. The source of the second compensation transistor is connected to the second sensing terminal, the drain of the second compensation transistor is connected between the second driving transistor and the redundant light-emitting element, and the gate of the second compensation transistor is connected to the second compensation gate terminal.

[0016] Optionally, the driving substrate further includes a circuit layer and a soldering area disposed above the device layer. The soldering area includes two mutually insulated first pads and second pads, and a common pad that is insulated from both the first pads and the second pads. The first pads are electrically connected to the first driving transistor via the circuit layer, and the second pads are electrically connected to the second driving transistor via the circuit layer. The first pads and the common pads are used to fix and electrically connect the main light-emitting element, and the second pads and the common pads are used to fix and electrically connect the redundant light-emitting elements.

[0017] Optionally, each main light-emitting element and the redundant light-emitting elements corresponding to the main light-emitting element are LED chips that emit light of the same color.

[0018] According to another embodiment of the present invention, a method for manufacturing a light-emitting diode display is provided, comprising the following steps:

[0019] A driving substrate is provided, and a first driving control module and a second driving control module are formed in the device layer of the driving substrate;

[0020] The main light-emitting element is transferred and fixed to the driving substrate to form a sub-pixel array, and the main light-emitting element is connected to the first driving control module.

[0021] The redundant light-emitting elements are transferred and fixed to the driving substrate to form a redundant sub-pixel array, and the redundant light-emitting elements are connected to the second driving control module. The redundant light-emitting elements are arranged in a one-to-one correspondence with the main light-emitting elements.

[0022] Optionally, the method for manufacturing the light-emitting diode display further includes:

[0023] Electroluminescence testing was performed on the main light-emitting element in the sub-pixel array;

[0024] Output the defect location data of the sub-pixel array;

[0025] Based on the aforementioned defect location data, determine the redundant light-emitting elements that need to be driven in the redundant pixel array.

[0026] Optionally, after determining the redundant light-emitting elements that need to be driven in the redundant pixel array based on the aforementioned defect location data, the method further includes:

[0027] Apply voltage to the main light-emitting element (excluding the defect location) and the redundant light-emitting element at the defect location;

[0028] Output the brightness of the main light-emitting element and the redundant light-emitting elements;

[0029] Determine whether the main light-emitting element and the redundant light-emitting element are lit normally.

[0030] As described above, the light-emitting diode display and its manufacturing method of the present invention have the following beneficial effects:

[0031] The light-emitting diode (LED) display includes a driving substrate and a main light-emitting element and a redundant light-emitting element corresponding to the main light-emitting element disposed on the driving substrate. The driving substrate includes a device layer, on which a first driving control module and a second driving control module are formed. The main light-emitting element is connected to the first driving control module, and the redundant light-emitting element is connected to the second driving control module. The above-mentioned arrangement of the main light-emitting element and the redundant light-emitting element enables independent control of the two, thereby improving the display brightness of the LED and reducing power consumption to a certain extent.

[0032] Furthermore, the gate of the first switching transistor in the first drive control module and the gate of the second switching transistor in the second drive control module can be connected to the same gate terminal; or, the source of the first switching transistor and the source of the second switching transistor can be connected to the same data terminal; or the source of the first drive transistor and the source of the second drive transistor can be connected to the same power supply voltage terminal. This increases the circuit design style and design flexibility of the LED display.

[0033] In addition, compensation transistors are added to the LED display. A first compensation transistor is placed between the main light-emitting element and the first driving transistor, and a second compensation transistor is placed between the redundant light-emitting element and the second driving transistor. The compensation transistors compensate for the driving current of the main light-emitting element and the redundant light-emitting element, enabling them to emit light normally and ensuring the display's brightness and yield.

[0034] In this invention, the main light-emitting element and the redundant light-emitting element are transferred and fixed to the driving substrate in stages and batches, thereby improving the yield of the main light-emitting element and the redundant light-emitting element during the transfer and welding process, effectively avoiding the situation where the main light-emitting element and its corresponding redundant light-emitting element have defects at the same time during the transfer stage, and improving the yield of the display.

[0035] After transferring the main light-emitting element and redundant light-emitting elements to form a sub-pixel array and a redundant sub-pixel array, the sub-pixel array is first subjected to photoluminescence testing to identify defective sub-pixels that cannot be lit normally. Then, a second driving transistor drives the corresponding redundant sub-pixel to replace the defective sub-pixel. This process avoids complex LED repair and transfer processes, saving costs. At the same time, the above method can achieve a high display yield. Attached Figure Description

[0036] Figure 1 The diagram shows the equivalent circuit diagram of sub-pixels and redundant sub-pixels in the prior art.

[0037] Figure 2 The diagram shown is a schematic diagram of the structure of a light-emitting diode display provided in Embodiment 1 of the present invention.

[0038] Figure 3a Displayed as Figure 2 An equivalent circuit diagram of the structure shown.

[0039] Figure 3b As shown in one optional embodiment, Figure 2 The equivalent circuit diagram of the structure shown.

[0040] Figure 3c As shown in another alternative embodiment, Figure 2 The equivalent circuit diagram of the structure shown is shown.

[0041] Figure 3d As shown in yet another optional embodiment, Figure 2 The equivalent circuit diagram of the structure shown is shown.

[0042] Figure 4 Displayed as Figure 2 A schematic diagram of the structure of the LED chip in Embodiment 1 of the present invention.

[0043] Figure 5 The diagram shown is a flowchart illustrating the manufacturing method of a light-emitting diode display provided in Embodiment 2 of the present invention.

[0044] Figure 6 The diagram shown is a structural schematic of the provided driving substrate.

[0045] Figure 7 The diagram shows the transfer of the first main light-emitting element.

[0046] Figure 8 The diagram shows the transfer of the first redundant light-emitting element array corresponding to the first main light-emitting element.

[0047] Figure 9 The diagram shows the structure after the transfer of the first main light-emitting element and the first redundant light-emitting element is completed.

[0048] Figure 10 The diagram shows a top view of a driving substrate with a fixed subpixel array and a redundant subpixel array.

[0049] Component designation explanation

[0050] 1 LED chip 104, main light-emitting element

[0051] 2 Redundant LED Chip 1041 First Main Light Emitting Element

[0052] 100 Driving substrate 1041-1 First semiconductor layer

[0053] 101 Device Layer 1041-2 Second Semiconductor Layer

[0054] 1011 First driving transistor 1041-3 Active layer

[0055] 1012 Second driving transistor 1041-4 First electrode

[0056] 1013 First switching transistor 1041-5 Second electrode

[0057] 1014 Second switching transistor; 1042 Second main light-emitting element

[0058] 1015 First compensation transistor; 1043 Third main light-emitting element

[0059] 1016 Second compensation transistor 105 Redundant light-emitting element

[0060] 102 Planarization layer 1051 First redundant light-emitting element

[0061] 103 Line Layer 1052 Second Redundant Light Emitting Element

[0062] 1031 Welding Zone 1053 Third Redundant Light-Emitting Element

[0063] 1031-1 First pad 200 Transfer head substrate

[0064] 1031-2 Second pad 201 Transfer head

[0065] 1031-3 Shared pads Detailed Implementation

[0066] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0067] like Figure 1 As shown, in the prior art, in order to repair or replace LED chip 1 that cannot be lit normally in the LED display panel, a redundant position is usually set for each LED chip. When LED chip 1 cannot be lit normally, the same LED chip is soldered at the redundant position as a redundant LED chip 2 to replace the damaged LED chip. The redundant LED chip 2 shares the same electrode with LED chip 1 and is driven by the same driving transistor TFT. However, sharing the TFT to drive LED chip 1 and redundant LED chip 2 will cause problems such as increased power consumption.

[0068] Example 1

[0069] To address the aforementioned deficiencies in the prior art, this embodiment provides a light-emitting diode (LED) display. For example... Figure 2As shown, the light-emitting diode display includes a driving substrate 100 and main light-emitting elements 104 and redundant light-emitting elements 105 disposed on the driving substrate 100. The main light-emitting elements 104 constitute a sub-pixel array on the driving substrate, and the redundant light-emitting elements 105 constitute a redundant sub-pixel array. Each sub-pixel position in the sub-pixel array is provided with a main light-emitting element 104, and each redundant sub-pixel position in the redundant sub-pixel array is also provided with a redundant light-emitting element 105. Furthermore, the main light-emitting elements 104 in the sub-pixel array and the redundant light-emitting elements 105 in the redundant sub-pixel array are arranged in a one-to-one correspondence. Similarly, as... Figure 2 As shown, the driving substrate includes a device layer 101, in which a first driving control module and a second driving control module are formed. The main light-emitting element 104 in the sub-pixel array is connected to the first driving control module, which controls the switching of the main light-emitting element 104. A redundant light-emitting element 105, corresponding to the main light-emitting element 104, is connected to the second driving control module, which controls the switching of the redundant light-emitting element 105.

[0070] For reference Figures 3a-3d The first driving control module includes a first driving transistor 1011 and a first switching transistor 1013, and the first switching transistor 1013 is connected to the first driving transistor 1012 to control the conduction and turn-off of the first driving transistor 1011. The first driving transistor 1011 is connected to the main light-emitting element 104. The second driving control module includes a second driving transistor 1012 and a second switching transistor 1014, and the second switching transistor 1014 is connected to the second driving transistor 1012 to control the second driving transistor 1012. The second driving transistor 1012 is connected to the redundant light-emitting element 105.

[0071] The same can be referred to. Figures 3a-3d The LED display in this embodiment also includes a power supply voltage terminal and a ground terminal. The source of the first driving transistor 1011 is connected to the power supply voltage terminal, and the drain of the first driving transistor 1011 is connected to the anode of the main light-emitting element 104. The source of the second driving transistor 1012 is connected to the power supply voltage terminal, and the drain of the second driving transistor 1012 is connected to the anode of the redundant light-emitting element 105. The cathodes of the main light-emitting element 104 and the redundant light-emitting element 105 are both connected to the ground terminal.

[0072] Similarly, refer to Figure 2The driving substrate 100 also includes a circuit layer 103 and a planarization layer 102 disposed above the device layer 101. The circuit layer 103 is patterned with Vdd traces and Vss traces (not shown in detail). The Vdd traces include a Vdd1 trace that provides voltage to the main light-emitting element 104 and a Vdd2 trace that provides voltage to the redundant light-emitting element 105. The Vss traces constitute a common connection layer connecting the main light-emitting element 104 and the redundant light-emitting element 105. Meanwhile, referring to… Figure 6 The circuit layer 103 penetrates the planarization layer 102 and forms a soldering area 1031 above the planarization layer 102 for fixing the light-emitting element. For example... Figure 6 As shown, each soldering area 1031 includes two mutually insulated first pads 1031-1 and second pads 1031-2, and a common pad 1031-3 insulated from both first and second pads. The first pad 1031-1 is electrically connected to the first driving transistor 1011 via the circuit layer 103, the second pad 1031-2 is electrically connected to the second driving transistor 1012 via the circuit layer 103, the first driving transistor 1011 is electrically connected to the Vdd1 trace, the second driving transistor 1012 is electrically connected to the Vdd2 trace, and the common pad 1031-3 is connected to the Vss trace via the circuit layer 103. The first pads 1031-1 and the common pad 1031-3 are used to fix and electrically connect the main light-emitting element 104, and the second pads 1031-2 and the common pad 1031-3 are used to fix and electrically connect redundant light-emitting elements 105. Figure 2 As shown, the main light-emitting element 104 and the redundant light-emitting element 105 are connected to the common pad 1031-3 on the same side. As above, the main light-emitting element 104 and the redundant light-emitting element 105 are fixed to the driving substrate 100 and electrically connected via the soldering area 1031.

[0073] Figure 2 Only one main light-emitting element 104 and its corresponding redundant light-emitting element 105 are shown as an example. It can be understood that, see also Figure 10In a light-emitting diode (LED) display, a plurality of main light-emitting elements 104 form a sub-pixel array, and a plurality of redundant light-emitting elements 105 form a redundant sub-pixel array. The main light-emitting elements 104 include a first main light-emitting element 1041, a second main light-emitting element 1042, and a third main light-emitting element 1043. The first main light-emitting elements 1041 are arrayed on a driving substrate 100 to form a first sub-pixel array; the second main light-emitting elements 1042 are arrayed on the driving substrate 100 to form a second sub-pixel array; and the third main light-emitting elements 1043 are arrayed on the driving substrate 100 to form a third sub-pixel array. The redundant light-emitting elements 105 include a first redundant light-emitting element 1051, a second redundant light-emitting element 1052, and a third redundant light-emitting element 1053. The first redundant light-emitting element 1051 corresponds to the first main light-emitting element 1041, the second redundant light-emitting element 1052 corresponds to the second main light-emitting element 1042, and the third redundant light-emitting element 1053 corresponds to the third main light-emitting element 1043. The array of first redundant light-emitting elements 1051 is distributed on the driving substrate 100 to form a first redundant sub-pixel array, the array of second redundant light-emitting elements 1052 is distributed on the driving substrate 100 to form a second redundant sub-pixel array, and the array of third redundant light-emitting elements 1053 is distributed on the driving substrate 100 to form a third redundant sub-pixel array.

[0074] In an optional embodiment, the main light-emitting element 104 and the redundant light-emitting element 105 are both LED chips, and the corresponding main light-emitting element 104 and the redundant light-emitting element 105 are LED chips that emit light of the same color. For example, the first main light-emitting element 1041 and the first redundant light-emitting element 1051 are both red LED chips that emit red light, the second main light-emitting element 1042 and the second redundant light-emitting element 1052 are both green LED chips that emit green light, and the third main light-emitting element 1043 and the third redundant light-emitting element 1053 are both blue LED chips that emit blue light.

[0075] like Figure 4As shown, taking the first main light-emitting element 1041 as an example, the LED chip includes a first semiconductor 1041-1, a second semiconductor layer 1041-2 with a conductivity type opposite to that of the first semiconductor layer 1041-1, and an active layer 1041-3 located between the first semiconductor layer 1041-1 and the second semiconductor layer 1041-2. The first semiconductor layer 1041-1 can be an N-type semiconductor layer, and the second semiconductor layer 1041-2 can be a P-type semiconductor layer. Of course, it is also possible for the first semiconductor layer 1041-1 to be a P-type semiconductor layer and the second semiconductor layer 1041-2 to be an N-type semiconductor layer. In an optional embodiment, the first semiconductor layer 1041-1 can be an N-type GaN layer, the active layer 1041-3 can be a quantum well layer, and the second semiconductor layer 1041-2 can be a P-type GaN layer. Alternatively, the first semiconductor layer 1041-1 can be an N-type GaN layer, such as a Si-doped GaN layer; the active layer 1041-3 can be an InGaN / GaN multiple quantum well; and the second semiconductor layer 1041-2 is a p-type GaN layer, such as a Mg-doped GaN layer. This embodiment illustrates a semiconductor light-emitting element without a substrate. It should be understood that, depending on actual needs or process requirements, the semiconductor light-emitting element may include a substrate or a similar structure.

[0076] Similarly, refer to Figure 4 The LED chip in this embodiment also includes a first electrode 1041-4 and a second electrode 1041-5. The first electrode 1041-4 is connected to the first semiconductor layer 1041-1, and the second electrode 1041-5 is connected to the second semiconductor layer 1041-2. (See also...) Figure 2 The first semiconductor layer 1041-1 can have mesa surfaces, on which a metal material, such as Au, Ag, Al, Cu, Zn, etc., is deposited to form the first electrode 1041-4. Similarly, materials such as Au, Ag, Al, Cu, etc., are deposited on top of the second semiconductor layer 1041-2 to form the second electrode 1041-5. It is understood that a transparent conductive layer and a current blocking layer, etc., can also be formed on top of the second semiconductor layer 1041-2.

[0077] The LED chips (i.e., the main light-emitting element 104 and the redundant light-emitting element 105) are fixed to the soldering area 1031 of the driving substrate 101 via the first electrode 1041-4 and the second electrode 1041-5. In this embodiment, reference is made to... Figure 2 and Figure 4The second electrode 1041-5 of the main light-emitting element 104 is connected to the first pad 1031-1 of the soldering area 1031, and the first electrode 1041-4 is connected to the common pad 1031-3 of the soldering area 1031. Correspondingly, the second electrode of the redundant light-emitting element 105 is connected to the second pad 1031-2 of the soldering area 1031, and the first electrode is also connected to the common pad 1031-3 of the soldering area 1031. As described above, one side of the second electrode 1041-5 of the main light-emitting element 104 is electrically connected to the first driving transistor 1011 via the soldering area and electrically connected to the Vdd1 trace; one side of the second electrode of the redundant light-emitting element 105 is electrically connected to the second driving transistor 1012 via the soldering area and electrically connected to the Vdd2 trace; one side of the first electrode 1041-4 of the main light-emitting element 104 and the redundant light-emitting element 105 is connected to the Vss trace via the soldering area.

[0078] In this embodiment, taking the driving substrate 101 as a TFT substrate as an example, the first driving control module and the second driving control module include TFT elements formed in the driving substrate 100. In this embodiment, Figure 2 The equivalent circuit diagram of the structure shown is as follows: Figure 3a As shown, Figure 3a As shown, in the driving circuit of the main light-emitting element 104 and the redundant light-emitting element 105, the power supply voltage terminal Vdd is connected to the Vdd trace. The source of the first driving transistor 1011 and the source of the second driving transistor 1012 are both connected to the power supply voltage terminal Vdd, and the operating voltage is provided to the main light-emitting element 104 and the redundant light-emitting element 105 through the Vdd trace. Similarly, as... Figure 3aAs shown, the LED display also includes a first data terminal Vdata1, a second data terminal Vdata2, and a common gate terminal Vgate. The source of the first switching transistor 1013 is connected to the first data terminal Vdata1, and its drain is connected to the gate of the first driving transistor 1011. The source of the second switching transistor 1014 is connected to the second data terminal Vdata2, and its drain is connected to the gate of the second driving transistor 1012. The sources of the first driving transistor 1011 and the second driving transistor 1012 are connected to the power supply voltage terminal Vdd. The gates of the first switching transistor 1013 and the second switching transistor 1014 are connected to the common gate terminal Vgate. The drains of the first driving transistor 1011 and the second driving transistor 1012 are respectively connected to the anode of the main light-emitting element 104 and the anode of the redundant light-emitting element 105. The cathodes of the main light-emitting element 104 and the redundant light-emitting element 105 are both connected to the Vss terminal, which shares a common ground. When the main light-emitting element 104 is working normally, the power supply voltage terminal Vdd provides the operating voltage to the main light-emitting element 104. At this time, the common gate terminal Vgate inputs a high-level scan signal to the first switching transistor 1013. A data signal is then input via the first data terminal Vdata1, controlling the first driving transistor 1011 to conduct, thereby driving the main light-emitting element 104 to light up. At this time, the second data terminal Vdata2 stops inputting data signals to the second switching transistor 1014, causing the second driving transistor 1012 to turn off. The redundant light-emitting element 105 is in an open-circuit state, generating no power consumption and not affecting the brightness of the main light-emitting element 104. However, when the main light-emitting element 104 fails to light up normally, the power supply voltage terminal Vdd provides the operating voltage to the redundant light-emitting element 105, and the common gate terminal Vgate inputs a high-level scan signal to the second switching transistor 1014. At this time, a data signal is input via the second data terminal Vdata2, controlling the second driving transistor 1012 to conduct, thereby driving the redundant light-emitting element 105 to light up. At this time, the first data terminal Vdata1 stops inputting data signals to the first switching transistor 1013, causing the first driving transistor 1011 to turn off. The main light-emitting element 104 is in an open-circuit state, generating no power consumption and not affecting the brightness of the redundant light-emitting elements. As shown above, regardless of whether the main light-emitting element is working properly, normal brightness at this location can be guaranteed, without affecting the overall display effect of the monitor.

[0079] In an optional embodiment of this example, with Figure 3a The equivalent circuit shown is different, as... Figure 3bAs shown, the equivalent circuit includes a first power supply voltage terminal Vdd1 and a second power supply voltage terminal Vdd2, a first gate terminal Vgate1 and a second gate terminal Vgate2. The first power supply voltage terminal Vdd1 provides operating voltage to the main light-emitting element 104 via the Vdd1 trace, and the second power supply voltage terminal Vdd2 provides operating voltage to the redundant light-emitting element 105 via the Vdd2 trace. Figure 3bAs shown, the source of the first switching transistor 1013 is connected to the first data terminal Vdata1, the gate is connected to the first gate terminal Vgate1, and the drain is connected to the gate of the first driving transistor 1011. The source of the first driving transistor 1011 is connected to the first power supply voltage terminal Vdd1. The source of the second switching transistor 1014 is connected to the second data terminal Vdata2, the gate is connected to the second gate terminal Vgate2, and the drain is connected to the gate of the second driving transistor 1012. The source of the second driving transistor 1012 is connected to the second power supply voltage terminal Vdd2. The drains of the first driving transistor 1011 and the second driving transistor 1012 are respectively connected to the anode of the main light-emitting element 104 and the anode of the redundant light-emitting element 105. The cathodes of the main light-emitting element 104 and the redundant light-emitting element 105 are both connected to the ground terminal Vss. When the main light-emitting element 104 is working normally, the first power supply voltage terminal Vdd1 provides the operating voltage to the main light-emitting element 104. A high-level scan signal is input to Vgate1 of the first switching transistor 1013. At this time, a data signal is input through the first data terminal Vdata1, controlling the first driving transistor 1011 to turn on, thereby driving the main light-emitting element 104 to light up. At this time, a low-level scan signal is input to Vgate2, the second switching transistor 1014 is turned off, and the second driving transistor 1012 is turned off. The redundant light-emitting element 105 is in an open circuit state, and no power consumption is generated, while the brightness of the main light-emitting element 104 is not affected. Alternatively, the second data terminal Vdata2 stops inputting data signals to the second switching transistor 1014, and the second driving transistor 1012 is turned off. The redundant light-emitting element 105 is in an open circuit state, and no power consumption is generated, while the brightness of the main light-emitting element 104 is not affected. When the main light-emitting element 104 fails to light up normally, the second power supply voltage terminal Vdd2 provides operating voltage to the redundant light-emitting element 105. At this time, a high-level scan signal is input to Vgate2 of the second switching transistor 1014, and a data signal is input via the second data terminal Vdata2, controlling the second driving transistor 1012 to conduct, thereby driving the redundant light-emitting element 105 to light up. Simultaneously, a low-level scan signal is input to Vgate1 of the first switching transistor 1013, causing the first switching transistor 1013 to turn off, thus turning off the first driving transistor 1011. The main light-emitting element 104 is in an open-circuit state and does not generate power. Alternatively, the first data terminal Vdata1 stops inputting data signals to the first switching transistor 1013, causing the first driving transistor 1011 to turn off, and the main light-emitting element 104 is in an open-circuit state, generating no power. The main light-emitting element 104 is in a completely off state, generating no power and not affecting the brightness of the redundant light-emitting element. As shown above, regardless of whether the main light-emitting element works normally, normal brightness at that location is guaranteed, without affecting the overall display effect of the monitor.Of course, in this optional embodiment, the same power supply voltage terminal Vdd can be connected to the Vdd trace, and the operating voltage can be provided to the main light-emitting element 104 and the redundant light-emitting element 105 through the Vdd trace.

[0080] In another optional embodiment of this example, with Figure 3b The equivalent circuit shown is different, as... Figure 3c As shown, the first switching transistor 1013 and the second switching transistor 1014 share a common data terminal, that is, the source of the first switching transistor 1013 and the source of the second switching transistor 1014 are connected to the common data terminal Vdata. When the main light-emitting element 104 is working normally, the first power supply voltage terminal Vdd1 provides the working voltage to the main light-emitting element 104. At this time, a high-level scan signal is input to Vgate1 of the first switching transistor 1013. At this time, a data signal is input to the first switching transistor 1013 via the common data terminal Vdata, controlling the first driving transistor 1011 to conduct, thereby driving the main light-emitting element 104 to light up. At this time, a low-level scan signal is input to Vgate1 of the first switching transistor 1013, the first switching transistor 1013 is turned off, and the second driving transistor 1012 is turned off. The redundant light-emitting element 105 is in an open-circuit state, and no power consumption is generated, while the brightness of the main light-emitting element 104 is not affected. When the main light-emitting element 104 fails to light up normally, the second power supply voltage terminal Vdd2 provides operating voltage to the redundant light-emitting element 105. At this time, a high-level scan signal is input to Vgate2 of the second switching transistor 1014, and a data signal is input to the second switching transistor 1014 via the common data terminal Vdata, controlling the second driving transistor 1012 to turn on, thereby driving the redundant light-emitting element 105 to light up. At this time, a low-level scan signal is input to Vgate1 of the first switching transistor 1013, and the first switching transistor 1013 is turned off, causing the first driving transistor 1011 to turn off as well. The main light-emitting element 104 is in a completely off state, generating no power consumption and not affecting the brightness of the redundant light-emitting element. As shown above, regardless of whether the main light-emitting element can work normally, the normal brightness at that location can be guaranteed, without affecting the overall display effect of the monitor. Of course, in this optional embodiment, the same power supply voltage terminal Vdd can also be connected to a Vdd trace, and operating voltage can be provided to the main light-emitting element 104 and the redundant light-emitting element 105 via the Vdd trace.

[0081] In another optional embodiment of this example, with Figure 3bUnlike the equivalent circuit shown, in this optional embodiment, the main light-emitting element 104 and the redundant light-emitting element 105 are respectively provided with compensation transistors. It is understood that in LED driving, the driving transistor typically has a threshold voltage Vth, which may change, for example, due to stress and aging of the device during manufacturing or operation. At the same voltage, the current delivered by the driving transistor may vary significantly due to this change in threshold voltage. Therefore, for a given voltage value, uneven brightness may occur among the pixels in the display. To address this phenomenon, in this optional embodiment, as... Figure 3d As shown, a first compensation transistor 1015 is disposed between the main light-emitting element 104 and the first driving transistor 1011, and a second compensation transistor 1016 is disposed between the redundant light-emitting element 105 and the second driving transistor 1012. The source of the first compensation transistor 1015 is connected to the first sensing terminal Vsensing1, the drain is connected between the first driving transistor 1011 and the main light-emitting element 104, and the gate is connected to the first compensation gate terminal Vgate1'; the source of the second compensation transistor 1016 is connected to the second sensing terminal Vsensing2, the drain is connected between the second driving transistor 1012 and the redundant light-emitting element 105, and the gate is connected to the second compensation gate terminal Vgate2'.

[0082] When the main light-emitting element 104 can be lit, in order to compensate for the threshold voltage Vth1 of the first driving transistor 1011, a high-level signal is applied to the first compensation gate terminal Vgate1' of the first compensation transistor 1015, causing the first compensation transistor 1015 to conduct. A compensation data voltage signal is then input to the main light-emitting element 104 through the first sensing terminal Vsensing1, thereby compensating the driving current of the main light-emitting element 104 so that it can maintain normal light emission and avoid insufficient brightness. Similarly, if the main light-emitting element 104 cannot be lit, but the redundant light-emitting element 105 is lit, in order to compensate for the threshold voltage Vth2 of the second driving transistor 1012, a high-level signal is applied to the second compensation gate terminal Vgate2' of the second compensation transistor 1016, causing the second compensation transistor 1016 to conduct. A compensation data voltage signal is then input to the redundant light-emitting element 105 through the second sensing terminal Vsensing2, thereby compensating the driving current of the redundant light-emitting element 105 so that it can maintain normal light emission and avoid insufficient brightness.

[0083] Of course, in this optional embodiment, the gate of the first switching transistor 1013 and the gate of the second switching transistor 1014 can be connected to the same gate terminal, such as... Figure 3a As shown; or, the source of the first switching transistor 1013 and the source of the second switching transistor 1014 can be connected to the same data terminal, as shown. Figure 3c As shown; or, the source of the first driving transistor 1011 and the source of the second driving transistor 1012 can be connected to the same power supply voltage terminal, such as... Figure 3a As shown.

[0084] As shown above, in this embodiment, the main light-emitting element 104 and the redundant light-emitting element 105 are controlled by different drive control modules (switching transistor and driving transistor). When the main light-emitting element 104 is working normally, the redundant light-emitting element 105 is in an open-circuit state, generating no power consumption and not affecting the brightness of the main light-emitting element 104. When the main light-emitting element 104 fails to light up normally, the redundant light-emitting element 105 is lit. At this time, the main light-emitting element 104 is completely disconnected, generating no power consumption and not affecting the brightness of the redundant light-emitting element. As shown above, regardless of whether the main light-emitting element is working normally, the normal brightness at that location is guaranteed, ensuring the overall display effect of the monitor and not increasing the power consumption of the monitor.

[0085] Example 2

[0086] This embodiment provides a method for manufacturing a light-emitting diode (LED) display, such as... Figure 5 As shown, the method includes the following steps:

[0087] S101: A driving substrate is provided, and a first driving control module and a second driving control module are formed in the device layer of the driving substrate;

[0088] like Figure 6As shown, the driving substrate 100 includes a device layer 101, in which a first driving control module and a second driving control module are formed. The driving substrate 100 can be a TFT substrate or the like. Taking a TFT substrate as an example, the first and second driving control modules include TFT elements formed in the driving substrate 100. For example, the first driving control module includes a first driving transistor 1011 and a first switching transistor 1013, and the second driving control module includes a second driving transistor 1012 and a second switching transistor 1014. The driving substrate 100 also includes a circuit layer 103 and a planarization layer 102 disposed above the device layer 101. The circuit layer 103 penetrates the planarization layer 102 and forms a bonding area 1031 for fixing pixels above the planarization layer 102. This bonding area is used to fix LED chips. Each bonding area 1031 includes two mutually insulated first pads 1031-1 and second pads 1031-2, and a common pad 1031-3 insulated from both of the first and second pads. The first pad 1031-1 is electrically connected to the first driving transistor 1011 via the circuit layer 103, the second pad 1031-2 is electrically connected to the second driving transistor 1012 via the circuit layer 103, the first driving transistor 1011 is electrically connected to the Vdd1 trace, the second driving transistor 1012 is electrically connected to the Vdd2 trace, and the common pad 1031-3 is connected to the Vss trace via the circuit layer 103.

[0089] S102: Transfer the main light-emitting element, fix the main light-emitting element to the driving substrate to form a sub-pixel array, and connect the main light-emitting element to the first driving control module;

[0090] In this embodiment, the main light-emitting element 104 is an LED chip. The main light-emitting element 104 is transferred in batches according to the different colors of the light emitted by the LED chips. For example, the LED chip emitting red light serves as the first main light-emitting element 1041, the LED chip emitting green light serves as the second main light-emitting element 1042, and the LED chip emitting blue light serves as the third main light-emitting element 1043. First, the red LED chip used as the first main light-emitting element 1041 is transferred, then the green LED chip used as the second main light-emitting element 1042 is transferred, and finally the blue LED chip used as the third main light-emitting element 1043 is transferred.

[0091] Taking the transfer of a red LED chip used as the first main light-emitting element 1041 as an example, such as Figure 7As shown, firstly, adhesive, such as solder paste or conductive silver paste, is applied to the first pad 1031-1 and the common pad 1031-3 arranged in the array of the soldering area of ​​the driving substrate 100. Then, the transfer head 201 of the transfer head substrate 200 picks up the red LED chip from the carrier substrate or the blue film and places the picked-up red LED chip on the first pad 1031-1 and the common pad 1031-3 to fix the red LED chip. Figure 8 As shown, the red LED chip forms an array of the first main light-emitting elements 1041, i.e., the first sub-pixel array. After the transfer of the red LED chip of the first main light-emitting element 1041 is completed, adhesive is applied to the first pad 1031-1 and the common pad 1031-3 of the array arrangement of the soldering area 1031 that fixes the second main light-emitting element 1042, and the green LED chip of the second main light-emitting element 1042 is transferred in the same way. Then, adhesive is applied to the first pad 1031-1 and the common pad 1031-3 of the array arrangement of the soldering area 1031 that fixes the third main light-emitting element 1043, and the blue LED chip of the third main light-emitting element 1043 is transferred in the same way, until all the main light-emitting elements 104 are transferred. The transferred main light-emitting elements are connected to the first driving transistor 1011 in the driving substrate 100 through the circuit layer 103 via the soldering area 1031, and the first driving transistor 1011 controls the lighting of the main light-emitting elements 104.

[0092] S103: Transfer redundant light-emitting elements, fix the redundant light-emitting elements to the driving substrate to form a redundant sub-pixel array, and connect the redundant light-emitting elements to the second driving control module. The redundant light-emitting elements are arranged in a one-to-one correspondence with the main light-emitting elements.

[0093] Similarly, refer to Figure 8 After transferring the LED chip of the main light-emitting element 104, the LED chip of the first redundant light-emitting element 1051 is transferred. Similarly, adhesive is first applied to the second pad 1031-2 and the common pad 1031-3 arranged in the array of the soldering area of ​​the driving substrate 100; for example, solder paste or conductive silver paste. Then, the transfer head 201 of the transfer head substrate 200 picks up the LED chip from the carrier substrate or blue film and places the picked-up LED chip on the first pad 1031-1 and the common pad 1031-3 to fix the LED chip. Figure 9 As shown, the LED chip forms an array of first redundant light-emitting elements 1051, and the first redundant light-emitting elements 1052 are correspondingly arranged with the first main light-emitting element 1041.

[0094] After transferring the LED chip of the first redundant light-emitting element 1051, adhesive is applied to the array of second pads 1031-2 and common pads 1031-3 of the soldering area 1031 that fixes the second redundant light-emitting element 1052. The same method is then used to transfer the LED chip of the second redundant common source 1052. Next, adhesive is applied to the array of second pads 1031-2 and common pads 1031-3 of the soldering area 1031 that fixes the third redundant light-emitting element 1053. The same method is then used to transfer the LED chip of the third redundant light-emitting element 1053 until all redundant light-emitting elements 105 are transferred. The transferred redundant light-emitting elements 105 are then connected to the second driving transistor 1012 in the driving substrate 100 via the circuit layer 103, and the second driving transistor 1012 controls the illumination of the redundant light-emitting elements 105. The main light-emitting element 104 and its corresponding redundant light-emitting element 105 are respectively connected to the first driving transistor and the second driving transistor to achieve independent control of the two, thereby improving the display brightness of the LED and reducing power consumption to a certain extent.

[0095] The driving substrate that fixes the main light-emitting element 104 and the redundant light-emitting element 105 is as follows: Figure 10 As shown, the main light-emitting element 104 includes a first main light-emitting element 1041, a second main light-emitting element 1042, and a third main light-emitting element 1043. The first main light-emitting element 1041 is arrayed on the driving substrate 100 to form a first sub-pixel array, the second main light-emitting element 1042 is arrayed on the driving substrate 100 to form a second sub-pixel array, and the third main light-emitting element 1043 is arrayed on the driving substrate 100 to form a third sub-pixel array. The redundant light-emitting element 105 includes a first redundant light-emitting element 1051, a second redundant light-emitting element 1052, and a third redundant light-emitting element 1053. The first redundant light-emitting element 1051 is correspondingly disposed to the first main light-emitting element 1041, the second redundant light-emitting element 1052 is correspondingly disposed to the second main light-emitting element 1042, and the third redundant light-emitting element 1053 is correspondingly disposed to the third main light-emitting element 1043. The array of first redundant light-emitting elements 1051 is distributed on the driving substrate 100 to form a first redundant sub-pixel array, the array of second redundant sub-light-emitting elements 1052 is distributed on the driving substrate 100 to form a second redundant sub-pixel array, and the array of third redundant light-emitting elements 1053 is distributed on the driving substrate 100 to form a third redundant sub-pixel array.

[0096] The above-mentioned batch transfer method is used to transfer different main light-emitting elements and different redundant light-emitting elements, which effectively avoids the simultaneous occurrence of defects in the main light-emitting element and its corresponding redundant light-emitting element due to insufficient welding during the transfer stage. This reduces the defect rate of the main light-emitting element and the redundant light-emitting element during the transfer process to a certain extent and improves the yield of pixel transfer.

[0097] In another optional embodiment of this example, after the LED chip transfer of the first main light-emitting element 1041 is completed in step S102, the LED transfer of the first redundant light-emitting element 1051 is performed first in step S103; then the LED chip transfer of the second main light-emitting element 1042 in step S102 is performed, and then the LED transfer of the second redundant light-emitting element 1052 in step S103 is performed; then the LED chip transfer of the third main light-emitting element 1043 in step S102 is performed, and then the LED transfer of the third redundant light-emitting element 1053 in step S103 is performed, until all main light-emitting elements 104 and redundant light-emitting elements 105 are transferred.

[0098] After the transfer of the main light-emitting element 104 and redundant light-emitting elements 105 is completed, an electroluminescence test is performed on the main light-emitting element 104 in the sub-pixel array. Based on the test results, defect location data of the main light-emitting element 104 is output. This data includes the location information of the first main light-emitting element 1041 and / or the second main light-emitting element 1042 and / or the third main light-emitting element 1043 that cannot be lit or has insufficient brightness in the first, second, and third sub-pixel arrays. Based on the above defect location data, a driving algorithm is used to determine the redundant light-emitting elements 105 that need to be lit, such as the first redundant light-emitting element 1051 and / or the second redundant light-emitting element 1052 and / or the third redundant light-emitting element 1053 that need to be lit in the first, second, and third redundant sub-pixel arrays. Based on the results determined by the driving algorithm, voltage is applied to the redundant light-emitting elements 105 that need to be lit and the main light-emitting elements 104 other than the main light-emitting elements 104 corresponding to these redundant light-emitting elements 105 that need to be lit. The brightness information of the lit main light-emitting elements 104 and redundant light-emitting elements 105 is output, and it is determined whether the main light-emitting elements 104 and redundant light-emitting elements 105 are lit normally, thereby determining the brightness and yield of the display.

[0099] As described above, this embodiment uses a photoluminescence testing and driving algorithm to identify defective main light-emitting elements and redundant light-emitting elements that need to be lit. The normally lit main light-emitting elements and redundant light-emitting elements are then driven by their respective driving transistors, enabling normal display. This method avoids complex LED repair and transfer processes, thus saving transfer and repair costs. Furthermore, the above method can achieve a high panel yield, maximizing the mass production yield of the display. For example, taking an 8.2” substrate with P = 0.5 mm and a resolution of 320*270 as an example, if the chip yield and transfer yield are 99.95%, and two independently driven Micro LEDs (i.e., the main light-emitting element and the redundant light-emitting element) are set at each sub-pixel position, then the theoretical yield of the 8.2” substrate is = [1-320*270*(1-99.95%)*(1-99.95%)]*[1-320*270*(1-99.95%)*(1-99.95%)][1-320*270*(1-99.95%)*(1-99.95%)] = 93.659%; if the chip and transfer yield is 99.95%, then the yield is 76.255%. Therefore, as long as the chip and transfer yields reach a certain level, the yield of the LED display manufactured by the method of this embodiment can fully meet the mass production yield requirements.

[0100] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A light-emitting diode display, characterized in that, include: A driving substrate, the driving substrate including a device layer, wherein a first driving control module and a second driving control module are formed in the device layer; A main light-emitting element and a redundant light-emitting element corresponding to the main light-emitting element are disposed on the driving substrate. The main light-emitting element is connected to the first driving control module, and the redundant light-emitting element is connected to the second driving control module. The first driving control module includes a first switching transistor and a first driving transistor. The first switching transistor is connected to the first driving transistor and is used to control the first driving transistor. The first driving transistor is connected to the main light-emitting element. The second drive control module includes a second switching transistor and a second drive transistor. The second switching transistor is connected to the second drive transistor and is used to control the second drive transistor. The second drive transistor is connected to the redundant light-emitting element. The first data terminal and the second data terminal are provided. The source of the first switching transistor is connected to the first data terminal, and the drain of the first switching transistor is connected to the gate of the first driving transistor. The source of the second switching transistor is connected to the second data terminal, and the drain of the second switching transistor is connected to the gate of the second driving transistor. The gate terminal is a common gate terminal, wherein the gate of the first switching transistor and the gate of the second switching transistor are connected to the common gate terminal; or the gate terminal includes a first gate terminal and a second gate terminal, wherein the gate of the first switching transistor is connected to the first gate terminal and the gate of the second switching transistor is connected to the second gate terminal.

2. The light-emitting diode display according to claim 1, characterized in that, The light-emitting diode display includes a power supply voltage terminal and a ground terminal. The source of the first driving transistor is connected to the power supply voltage terminal, and the drain of the first driving transistor is connected to the anode of the main light-emitting element. The source of the second driving transistor is connected to the power supply voltage terminal, and the drain of the second driving transistor is connected to the anode of the redundant light-emitting element; the cathode of the main light-emitting element and the cathode of the redundant light-emitting element are both connected to the ground terminal.

3. The light-emitting diode display according to claim 1, characterized in that, The light-emitting diode display includes a first power supply voltage terminal, a second power supply voltage terminal, and a ground terminal. The source of the first driving transistor is connected to the first power supply voltage terminal, and the drain of the first driving transistor is connected to the anode of the main light-emitting element. The source of the second driving transistor is connected to the second power supply voltage terminal, and the drain of the second driving transistor is connected to the anode of the redundant light-emitting element; the cathode of the main light-emitting element and the cathode of the redundant light-emitting element are both connected to the ground terminal.

4. The light-emitting diode display according to claim 1, characterized in that, The device layer also has a first compensation transistor and a second compensation transistor, the first compensation transistor being disposed between the main light-emitting element and the first driving transistor, and the second compensation transistor being disposed between the redundant light-emitting element and the second driving transistor.

5. The light-emitting diode display according to claim 4, characterized in that, The light-emitting diode display further includes a first sensing terminal, a second sensing terminal, a first compensation gate terminal and a second compensation gate terminal, the source of the first compensation transistor is connected to the first sensing terminal, the drain of the first compensation transistor is connected between the first driving transistor and the main light-emitting element, and the gate of the first compensation transistor is connected to the first compensation gate terminal. The source of the second compensation transistor is connected to the second sensing terminal, the drain of the second compensation transistor is connected between the second driving transistor and the redundant light-emitting element, and the gate of the second compensation transistor is connected to the second compensation gate terminal.

6. The light-emitting diode display according to claim 1, characterized in that, The driving substrate further includes a circuit layer and a soldering area disposed above the device layer. The soldering area includes two mutually insulated first pads and second pads, and a common pad that is insulated from both the first pads and the second pads. The first pads are electrically connected to the first driving transistor via the circuit layer, and the second pads are electrically connected to the second driving transistor via the circuit layer. The first pads and the common pads are used to fix and electrically connect the main light-emitting element, and the second pads and the common pads are used to fix and electrically connect the redundant light-emitting element.

7. The light-emitting diode display according to claim 1, characterized in that, Each main light-emitting element and the redundant light-emitting elements corresponding to the main light-emitting element are LED chips that emit light of the same color.

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