Dismantling device

Abstract

This application relates to the field of semiconductor testing technology, and in particular to a disassembly apparatus. The disassembly apparatus includes at least a grinding mechanism and a limiting mechanism. The grinding mechanism is used to grind the protrusions on the riveted part, and the limiting mechanism is used to limit the movement of the grinding mechanism. By providing a grinding mechanism to grind the protrusions on the target part of the riveted part, it is easier to disassemble the riveted part from the target part. Simultaneously, since the limiting mechanism can limit the grinding mechanism, it can improve the situation where the surface of the target part is scratched. Therefore, with the cooperation of the grinding mechanism and the limiting mechanism, not only is it easier to disassemble the riveted part, but it can also improve the situation of damaging related components or scratching the surface of the target part, reducing the cost of use.

Description

Technical Field

[0001] This application relates to the field of semiconductor testing technology, and in particular to disassembly apparatus. Background Technology

[0002] In related technologies, probe cards are typically used to electrically connect wafers to test equipment. A probe card mainly includes a printed circuit board (PCB), connectors, a substrate, and probes. The PCB is electrically connected to the test equipment, the substrate is connected to the PCB via connectors, and the probes are soldered onto the substrate. The probes contact corresponding test pads on the wafer to perform electrical performance testing.

[0003] In the above process, to facilitate installation and improve connection stability, the connector and the printed circuit board are fixed together using riveting. However, when removing the connector from the printed circuit board, it is easy to damage the connector or scratch the surface of the printed circuit board, resulting in low connector reusability and increased usage costs. Summary of the Invention

[0004] Therefore, it is necessary to provide a disassembly device to improve the situation of damaging the target part and reduce the cost of use.

[0005] This application provides a disassembly device for disassembling a rivet on a target part. The rivet has a protrusion extending beyond the target part. The disassembly device includes:

[0006] A polishing mechanism, configured to be operablely movable along a preset direction to polish protrusions; and

[0007] The limiting mechanism is engaged with the grinding mechanism in a preset direction to limit the movement of the grinding mechanism in the preset direction.

[0008] In one embodiment, the limiting mechanism includes a limiting member and a connecting member that are relatively movable along a preset direction;

[0009] The connector is connected to the grinding mechanism, and the connector can move relative to the limiting component in a preset direction under the drive of the grinding mechanism;

[0010] The limiting mechanism has an initial state in which the limiting component and the connecting component are separated, and a limiting state in which the limiting component and the connecting component are in contact.

[0011] In one embodiment, in the initial state, the distance between the limiting member and the connecting member along a preset direction is a preset distance.

[0012] In one embodiment, the limiting mechanism further includes a mounting component;

[0013] The mounting component is connected to one of the limiting component and the connecting component, and can be slidably connected to the other of the two components along a preset direction.

[0014] In one embodiment, the displacement of one of the mounting member and the limiting member and the connecting member that can slide relative to each other along a preset direction is configured as a preset distance.

[0015] In one embodiment, the mounting member is adjustable between the limiting member and the connecting member, and the mounting member is used to adjust the preset spacing.

[0016] In one embodiment, the mounting member has a connecting portion that connects to one of the limiting member and the connecting member;

[0017] The connecting part is configured to be adjustable in position or length along a preset direction to adjust the preset spacing.

[0018] In one embodiment, the connecting portion is threadedly connected to one of the limiting member and the connecting member in a predetermined direction.

[0019] In one embodiment, the mounting element also has a limiting portion;

[0020] The limiting part is configured to abut against one of the limiting member and the connecting member in a preset direction in the initial state to form a preset distance.

[0021] In one embodiment, in the initial state, the limiting portion abuts against the other of the limiting member and the connecting member on the side surface opposite to the other of the two.

[0022] In one embodiment, the other of the limiting member and the connecting member is provided with a first mounting hole; the mounting member is slidably inserted through the first mounting hole in a predetermined direction; and / or

[0023] One of the limiting member and the connecting member is provided with a second mounting hole; the mounting member is inserted into the second mounting hole in a preset direction.

[0024] In one embodiment, the limiting mechanism further includes an elastic element;

[0025] An elastic element is disposed between the limiting element and the connecting element, and the elastic element is used to provide a force that enables the limiting mechanism to be in its initial state.

[0026] In one embodiment, the limiting mechanism is used to abut against the target component.

[0027] In one embodiment, the disassembly device further includes an adjustment mechanism;

[0028] The adjusting mechanism is connected to the limiting mechanism, and the limiting mechanism can abut against the target part with the help of the adjusting mechanism;

[0029] The adjustment mechanism is configured to adjust the distance between the limiting member and the target member along a preset direction.

[0030] In one embodiment, the limiting mechanism has a channel that passes through the limiting mechanism in a preset direction;

[0031] The grinding mechanism has a grinding head that can be inserted into the channel in a preset direction.

[0032] In one embodiment, the limiting mechanism has multiple support portions;

[0033] The limiting mechanism can abut against the target part with the help of multiple support parts.

[0034] In one embodiment, all the support components are arranged at intervals around the central axis of the channel;

[0035] The direction of extension of the central axis is parallel to the preset direction.

[0036] In one embodiment, the disassembly device further includes a first detection element;

[0037] The first detection element is used to detect whether the displacement of the grinding mechanism along a preset direction is the target displacement. The grinding mechanism can stop grinding in response to the detection signal of the target displacement; or

[0038] The first detection component is used to detect the arrival signal of the grinding mechanism in the limit position. The grinding mechanism can stop grinding in response to the arrival signal. The limit position is the position where the grinding mechanism is limited by the limit mechanism.

[0039] In one embodiment, the polishing mechanism includes:

[0040] A grinding part, comprising a grinding head for grinding protrusions along a preset direction; and

[0041] A drive unit is connected to the grinding component, which drives the grinding component to rotate around a rotation axis, and is configured to move operablely in a preset direction.

[0042] The extension direction of the rotation axis is parallel to the preset direction.

[0043] In one embodiment, the polishing mechanism further includes a second detection element;

[0044] The second detection element is used to detect the torque generated by the rotary motion output by the drive element;

[0045] The drive unit can respond to the torque detected by the second detection unit to make the grinding part rotate at a preset speed.

[0046] In one embodiment, the disassembly device further includes an absorption mechanism;

[0047] The absorption mechanism is provided with an absorption port, which is oriented towards the protrusion.

[0048] In one embodiment, the target component is a printed circuit board.

[0049] The aforementioned disassembly device includes at least a grinding mechanism and a limiting mechanism. The grinding mechanism grinds the protrusions on the riveted parts, and the limiting mechanism limits the movement of the grinding mechanism. By providing a grinding mechanism, the protrusions on the target part of the riveted parts are ground, facilitating the disassembly of the riveted parts from the target part. Simultaneously, because the limiting mechanism can limit the grinding mechanism, it can mitigate the damage to the surface of the target part. Therefore, the cooperation between the grinding mechanism and the limiting mechanism not only facilitates the disassembly of the riveted parts but also reduces the risk of damage to related components or scratches on the surface of the target part, thus lowering operating costs. Attached Figure Description

[0050] Figure 1 This is a three-dimensional structural diagram of the connection between the printed circuit board and the connector from one perspective in one embodiment of this application.

[0051] Figure 2 This is a three-dimensional structural diagram of the connection between the printed circuit board and the connector from another perspective in one embodiment of this application.

[0052] Figure 3 This is a three-dimensional structural diagram of the disassembly device from one perspective in one embodiment of this application.

[0053] Figure 4 for Figure 3 The disassembly device shown in the image is a three-dimensional structural diagram from another perspective.

[0054] Figure 5 for Figure 3 The diagram shows a partial exploded structure of the dismantling device.

[0055] Figure 6 for Figure 3 The diagram shows the structure of the limiting mechanism in the disassembly device in its initial state.

[0056] Figure 7 for Figure 3 The diagram shows the structure of the limiting mechanism in the limiting state of the disassembly device.

[0057] Figure 8 for Figure 3 The diagram shows the structure of the grinding mechanism in the disassembly device abutting against the protrusion.

[0058] Figure 9 for Figure 3 The diagram shows a partial structural design of the disassembly device.

[0059] Figure 10 for Figure 9 The schematic diagram shows the first cross-sectional view of the structure.

[0060] Figure 11 for Figure 9 The schematic diagram shows the second cross-sectional view of the structure.

[0061] Figure 12 for Figure 3 The diagram shows a cross-sectional view of part of the disassembly device.

[0062] Figure 13 for Figure 3 A schematic diagram of the disassembly device in its first operational state from one perspective.

[0063] Figure 14 for Figure 3 The diagram illustrates the disassembly device in its first operational state from another perspective.

[0064] Figure 15 for Figure 3 A schematic diagram of the disassembly device in its second usage state from one perspective.

[0065] Figure 16 for Figure 3 The diagram illustrates the third usage state of the disassembly device from one perspective.

[0066] Explanation of reference numerals in the attached figures:

[0067] Disassembly device 100;

[0068] Grinding mechanism 110, grinding component 111, grinding head 111a, rotary axis L2, driving component 112;

[0069] Limiting mechanism 120, limiting member 121, channel x, central axis L1, support part z, second mounting hole a2, connector 122, first mounting hole a1, first sub-connector 122a, second sub-connector 122b, fastener j, preset spacing h, mounting parts 123, 123a, 123b, mounting body e, first end e1, second end e2, connecting part b1, limiting part b2, elastic member 124;

[0070] Adjustment mechanism 130, support 131, mating part 132, flexible part 133;

[0071] First inspection item 140;

[0072] Absorption mechanism 150, absorption element 151, absorption port k, collection element 152, conveying power element 153;

[0073] Printed circuit board P;

[0074] Connector C;

[0075] Riveted part M, protrusion M1, dimension d;

[0076] Preset direction Y. Detailed Implementation

[0077] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0078] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0079] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0080] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0081] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0082] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0083] In wafer testing, the wafer under test is typically placed on a wafer carrier platform. The tester establishes electrical connections with the wafer through probes on a probe card. The probe card mainly consists of a printed circuit board (PCB), connectors, a substrate, and probes. The PCB is electrically connected to the tester, the substrate is connected to the PCB via connectors, and the probes are soldered to the substrate. The probes contact the corresponding test pads on the wafer to perform electrical performance testing.

[0084] In the aforementioned process, if soldering is used to connect the connector and the printed circuit board (PCB), defects such as cold solder joints, high-temperature desoldering, and soldering stress can easily occur, causing the connector to separate from the PCB and making wafer testing difficult. If screws are used, the small size of the screws makes disassembly and assembly difficult. To facilitate installation and improve connection stability, connectors and PCBs are often secured with riveting. However, removing the connector from the PCB can easily damage the connector or scratch the PCB surface, resulting in low connector reusability and increased operating costs.

[0085] Based on this, in order to improve at least some of the above-mentioned problems, embodiments of this application provide a disassembly device that improves the reusability of connectors and reduces the damage to printed circuit boards by changing the disassembly method, thereby reducing the cost of use.

[0086] It should be noted that the disassembly device provided in this application embodiment is used to disassemble the riveting parts on the target component. The target component includes, but is not limited to, a printed circuit board, and may also be other components equipped with riveting parts. When the target component is a printed circuit board, the riveting parts can be used to fix electronic components and the printed circuit board together. Electronic components include, but are not limited to, connectors, and may also be other electronic components. Connectors include, but are not limited to, LIF (Low Insertion Force) connectors, and may also include HIF (High Insertion Force) connectors and other types of connectors.

[0087] For example, please refer to Figure 1 and Figure 2 , Figure 1 This illustration shows a three-dimensional structural diagram of the connection between the printed circuit board P and the connector C from one perspective in one embodiment of this application. Figure 2 This diagram illustrates a perspective view of a printed circuit board P connected to a connector C in one embodiment of this application. The connector C is located on one side of the printed circuit board P, and a riveting member M passes through the printed circuit board P and the connector C from the other side of the printed circuit board P to rivet and fix the printed circuit board P and the connector C. On the other side of the printed circuit board P, the riveting member M has a protrusion M1 protruding from the target component.

[0088] The following is based on Figure 1 and Figure 2 The target component shown is a printed circuit board P. Taking the case where the printed circuit board P is fixedly connected to the connector C by means of a riveting member M as an example, the disassembly device 100 provided in the embodiments of this application is illustrated in conjunction with the relevant drawings and some embodiments.

[0089] Figure 3 A three-dimensional structural schematic diagram of the disassembly device 100 from one perspective is shown in one embodiment of this application; Figure 4 It shows Figure 3 A three-dimensional structural diagram of the disassembly device 100 shown in the image from another perspective; Figure 5 It shows Figure 3 The diagram shows a partial exploded structure of the dismantling device 100; for ease of explanation, only the content related to the embodiments of this application is shown.

[0090] In some embodiments, please refer to Figures 3 to 5 and in conjunction with reference Figure 1 and Figure 2 This application provides a disassembly device 100, which includes a grinding mechanism 110 and a limiting mechanism 120.

[0091] The grinding mechanism 110 is used to grind the protrusion M1 of the rivet M by grinding. The grinding mechanism 110 is configured to be operably movable along a preset direction Y. The grinding mechanism 110 can be moved by means of an operator's grip or by means of a drive component; no specific limitation is made here. The grinding mechanism 110 moves along the preset direction Y, meaning that in the preset direction Y, the grinding mechanism 110 can move away from or closer to the protrusion M1 of the rivet M. The preset direction Y can be determined according to the placement orientation of the printed circuit board P. Figure 1 and Figure 2 When the printed circuit board P is placed in the corresponding position in a roughly horizontal manner, the rivet M is set roughly in the vertical direction. At this time, the preset direction Y can be roughly in the vertical direction.

[0092] The limiting mechanism 120 is a mechanism that can limit the movement of the grinding mechanism 110. Specifically, the limiting mechanism 120 is relatively movable to the grinding mechanism 110 in a preset direction Y, and is used to limit the movement of the grinding mechanism 110 in the preset direction Y.

[0093] "Relative motion engagement" means that at least a portion of the limiting mechanism 120 can move relative to the polishing mechanism 110 along a preset direction Y, and can engage in this relative motion. During the engagement between the limiting mechanism 120 and the polishing mechanism 110, the limiting mechanism 120 can limit the polishing mechanism 110 in the preset direction Y, thereby preventing the polishing mechanism 110 from moving further toward the printed circuit board P along the preset direction Y.

[0094] It is understandable that the limiting mechanism 120 can limit the grinding mechanism 110 when it is engaged with the grinding mechanism 110, or the limiting mechanism 120 can limit the grinding mechanism 110 after one part of it is engaged with the grinding mechanism 110 and the other part of it continues to move relative to the grinding mechanism 110 along a preset direction Y. As long as the limiting mechanism 120 can limit the grinding mechanism 110 through a relative movement engagement, and the usage requirements are met, no specific restrictions are imposed here.

[0095] Therefore, by setting up a grinding mechanism 110 to grind the protrusion M1 on the rivet M that protrudes from the printed circuit board P, it is easier to remove the rivet M from the printed circuit board P, thus improving the situation of damaging the connector C. At the same time, since the limiting mechanism 120 can limit the grinding mechanism 110, it can control the displacement of the grinding mechanism 110 along the preset direction Y, thereby improving the situation of scratches on the surface of the printed circuit board P.

[0096] Thus, with the cooperation of the polishing mechanism 110 and the limiting mechanism 120, it is not only easy to disassemble the connector C, but also to improve the situation of damaging the connector C or scratching the surface of the printed circuit board P, thereby increasing the reusability of the connector C and reducing the cost of use.

[0097] Figure 6 It shows Figure 3 A schematic diagram of the limiting mechanism 120 in the disassembly device 100 in its initial state; Figure 7 It shows Figure 3 The diagram shows the structure of the limiting mechanism 120 in the limiting state of the disassembly device 100; for ease of explanation, only the content related to the embodiments of this application is shown.

[0098] In some embodiments, please continue to refer to Figures 3 to 5 The limiting mechanism 120 includes a limiting member 121 and a connecting member 122 that are relatively movable along a preset direction Y. The connecting member 122 is connected to the grinding mechanism 110, and the connecting member 122 can move relatively with the limiting member 121 along the preset direction Y under the drive of the grinding mechanism 110. During the process of the limiting member 121 and the connecting member 122 engaging and disengaging, there are situations where the limiting member 121 and the connecting member 122 abut and separate. (Refer to reference) Figure 6 The limiting mechanism 120 has an initial state in which the limiting member 121 and the connecting member 122 are separated; that is, in the initial state, the limiting member 121 and the connecting member 122 are separated from each other. (Refer to reference...) Figure 7 The limiting mechanism 120 also has a limiting state in which the limiting member 121 and the connecting member 122 abut against each other. That is, in the limiting state, the limiting member 121 and the connecting member 122 abut against each other. During the relative movement between the connecting member 122 and the limiting member 121 along the preset direction Y, the limiting mechanism 120 can switch from the initial state to the limiting state. It can be understood that when the connecting member 122 and the limiting member 121 move relative to each other in the opposite direction of the preset direction Y, the limiting mechanism 120 can switch from the limiting state to the initial state.

[0099] Since the connecting member 122 is connected to the grinding mechanism 110, when the grinding mechanism 110 moves along the preset direction Y, the connecting member 122 will also move along the preset direction Y along with the grinding member 111. During the process of the connecting member 122 moving along the preset direction Y, the connecting member 122 and the limiting member 121 generate relative movement. When the limiting member 121 and the connecting member 122 abut against each other, the grinding mechanism 110 is limited.

[0100] Thus, when the limiting mechanism 120 is configured as a structure of limiting member 121 and connecting member 122, the movement of the grinding mechanism 110 can be limited by the cooperation of the limiting member 121 and connecting member 122 in a relative motion along a preset direction Y.

[0101] Furthermore, since the grinding mechanism 110 is connected to the connector 122, it is convenient to replace the grinding mechanism 110 or the connector 122 according to the usage of the grinding mechanism 110 and the connection, as well as the structure of the protrusion M1 of the rivet M, to adapt to different usage scenarios.

[0102] For specific embodiments, please refer to... Figures 3 to 7 The connector 122 includes a first sub-connector 122a and a second sub-connector 122b. The first sub-connector 122a is connected to the grinding mechanism 110, and the second sub-connector 122b is detachably connected to the first sub-connector 122a by means of a fastener j. The fastener j can be a bolt assembly or screw assembly or other components capable of fastening the connection. The second sub-connector 122b and the limiting member 121 are engaged relative to each other in a preset direction Y. Furthermore, the connection method between the first sub-connector 122a and the grinding mechanism 110 can be a detachable connection method such as a snap-fit ​​connection.

[0103] Thus, by configuring the connector 122 as a mechanism in which two parts (i.e., the first sub-connector 122a and the second sub-connector 122b) are detachably connected, the replacement cost can be reduced while making it easy to replace the corresponding sub-connector 122.

[0104] Of course, in other embodiments, a component that can be moved relative to the limiting mechanism 120 may be provided on the grinding mechanism 110, as long as it can limit the grinding mechanism 110, and no specific limitation is made here.

[0105] Figure 8 It shows Figure 3 The diagram shows the structure of the grinding mechanism 110 in the disassembly device 100 abutting against the protrusion M1; for ease of explanation, only the content related to the embodiments of this application is shown.

[0106] In some embodiments, please continue to refer to Figure 6 In the initial state, the distance between the limiting member 121 and the connecting member 122 along the preset direction Y is a preset distance h. Specifically, please refer to... Figure 8 The preset spacing h is configured to be determined at least based on the dimension d of the protrusion M1 along the preset direction Y.

[0107] For example, in conjunction with reference Figure 8When the grinding mechanism 110 abuts against the protrusion M1, the distance that the grinding mechanism 110 moves along the preset direction Y during the grinding process is defined as the target distance, which is the dimension d of the protrusion M1 along the preset direction Y. In the limited state, if the protrusion M1 has been completely ground by the grinding mechanism 110, then the preset distance h is the target distance, which is also the dimension d of the protrusion M1 along the preset direction Y.

[0108] It should be noted that the protrusion M1 may or may not be completely ground, as long as it facilitates the disassembly of the rivet M after grinding; no specific restrictions are imposed here. It is understood that it is more convenient to remove the rivet M from the printed circuit board P if the protrusion M1 is completely ground.

[0109] In this way, the preset spacing h can be set according to the movement of each component in the disassembly device 100 during the polishing process and the dimension d of the protrusion M1 along the preset direction Y, so as to achieve the polishing requirements.

[0110] In some embodiments, please continue to refer to Figures 3 to 5 The limiting mechanism 120 also includes a mounting member 123. The mounting member 123 is connected to one of the limiting member 121 and the connecting member 122, and is slidably connected to the other of the two along a preset direction Y. That is, the mounting member 123 can be connected to the limiting member 121 and slidably connected to the connecting member 122 along the preset direction Y. Alternatively, the mounting member 123 can also be connected to the connecting member 122 and slidably connected to the limiting member 121 along the preset direction Y.

[0111] It should be noted that the sliding connection can be a method in which the mounting member 123 passes through a hole in one of the limiting member 121 and the connecting member 122 along a preset direction Y, or it can be a method in which the mounting member 123 cooperates with one of the limiting member 121 and the connecting member 122 through a sliding groove and a slider. This application embodiment does not impose specific limitations on this.

[0112] Thus, since the mounting component 123 is slidably connected to the limiting component 121 and the connecting component 122 along the preset direction Y, the relative movement of the limiting component 121 and the connecting component 122 along the preset direction Y can be guided by the mounting component 123, which helps to improve the stability of the grinding mechanism 110 moving along the preset direction Y, thereby obtaining a better grinding effect.

[0113] In some embodiments, please continue to refer to Figures 3 to 5 The displacement of one of the mounting component 123a, the limiting component 121, and the connecting component 122 that can slide relative to each other along the preset direction Y is configured as a preset distance h.

[0114] Thus, since the mounting part 123a is fitted between the limiting part 121 and the connecting part 122, by setting the relative sliding displacement of the mounting part 123a, it is convenient to control the displacement of the grinding mechanism 110 along the preset direction Y.

[0115] Of course, in other embodiments, the preset distance h between the limiting member 121 and the connecting member 122 can also be controlled by other additional adjusting or limiting members. It is understood that controlling the preset distance h by using the mounting member 123a makes the overall structure simpler.

[0116] Figure 9 It shows Figure 3 A structural schematic diagram of a portion of the disassembly device 100 shown in the figure; Figure 10 It shows Figure 9 The schematic diagram shows a first cross-sectional view of the structure; for ease of explanation, only the content related to the embodiments of this application is shown.

[0117] In some embodiments, please continue to refer to Figures 3 to 5 and in conjunction with reference Figure 9 and Figure 10 The mounting component 123a is adjustable between the limiting component 121 and the connecting component 122, and is used to adjust the preset distance h. That is, the mounting component 123a is configured to have an adjustment function.

[0118] Thus, when the mounting part 123a has an adjustment function, the size of the preset distance h can be adjusted according to the size of the protrusion M1 of the corresponding rivet M that needs to be ground and the matching situation of each component in the disassembly device 100, so as to meet the needs of different usage scenarios.

[0119] In some embodiments, please continue to refer to Figure 9 and Figure 10 The mounting member 123a has a connecting portion b1. The connecting portion b1 is connected to one of the limiting member 121 and the connecting member 122. The connecting portion b1 is configured to be adjustable in position or length along a preset direction Y to adjust a preset distance h. For example, the connecting portion b1 can be configured as a telescopic structure, i.e., the length of the connecting portion b1 along the preset direction Y is adjustable, or it can be configured as a threaded structure, i.e., the position of the connecting portion b1 along the preset direction Y is adjustable. Figure 10 For example, it is shown that the connecting part b1 is adjustablely connected to the connector 122. The connecting part b1 is threaded to the connector 122 in a preset direction Y.

[0120] Thus, by making the connecting part b1 of the mounting part 123a adjustable, the preset distance h can be adjusted. When the connecting part b1 is configured with a threaded structure, more precise adjustment can be achieved by means of the threaded engagement.

[0121] Of course, in other embodiments, please continue to refer to Figure 9 and Figure 10 The mounting component 123a includes a mounting body e, which has a first end e1 and a second end e2 disposed opposite to each other along a preset direction Y. The connecting portion b1, illustrated in some of the foregoing embodiments, is located at the first end e1 of the mounting body e. For example, the mounting body e can be configured to be telescopic along the preset direction Y to achieve adjustment of the preset distance h.

[0122] Thus, the adjustment method of the mounting component 123a illustrated in the above embodiments can be flexibly selected to adapt to the required usage scenario, without making specific limitations here.

[0123] In some embodiments, please continue to refer to Figure 9 and Figure 10 The mounting member 123a also has a limiting part b2, which is configured to abut against one of the limiting member 121 and the connecting member 122 in a preset direction Y in the initial state to form a preset distance h.

[0124] For example, in the initial state, the limiting part b2 abuts against the surface of one of the limiting member 121 and the connecting member 122 that is opposite to the other. Alternatively, a corresponding mating structure can be provided on the other of the limiting member 121 and the connecting member 122 to achieve abutment with the limiting part b2 in a preset direction Y. For example, with... Figure 9 and Figure 10 For example, the limiting part b2 can be provided at the second end e2 of the mounting body e shown in some of the aforementioned embodiments, and in the initial state, it abuts against the side surface of the limiting member 121 opposite to the connecting member 122. As another example, when the mounting body e passes through the limiting member 121, the aforementioned mating structure can be provided inside the limiting member 121, with the limiting part b2 located between the first end e1 and the second end e2 of the mounting body e. Inside the limiting member 121, the mating structure and the limiting part b2 can abut against each other in a preset direction Y.

[0125] Thus, by setting the limiting part b2, the limiting member 121 and the connecting member 122 can be connected by means of the mounting member 123a in the initial state, which is beneficial to make the limiting member 121 and the connecting member 122 form the aforementioned preset distance h more stably by means of the limiting part b2.

[0126] Figure 11 It shows Figure 9 The schematic diagram shows a second cross-sectional view of the structure; for ease of explanation, only the content related to the embodiments of this application is shown.

[0127] In some embodiments, please continue to refer to Figure 9 and in conjunction with reference Figure 11 One of the limiting member 121 and the connecting member 122 is provided with a first mounting hole a1, and the mounting member 123b is slidably inserted through the first mounting hole a1 along a preset direction Y; and / or, one of the limiting member 121 and the connecting member 122 is provided with a second mounting hole a2, and the mounting member 123b is inserted into the second mounting hole a2 along a preset direction Y.

[0128] by Figure 11 For example, the second sub-connector 122b has a first mounting hole a1 along the preset direction Y, and the limiting member 121 has a second mounting hole a2 along the preset direction Y. In this case, the mounting member 123b can be configured as a pin structure. Of course, the mounting member 123b can also be located on the side surface of the limiting member 121 facing the connector 122, with the first mounting hole a1 only on the connector 122, and the mounting member 123b can slide through the first mounting hole a1 along the preset direction Y.

[0129] Thus, the guiding function of the mounting component 123b can be achieved by setting the first mounting hole a1 and / or the second mounting hole a2.

[0130] It is understandable that, in conjunction with the situations illustrated in the foregoing embodiments, Figures 9 to 11 The illustration shows the configuration of mounting parts 123a and 123b. When mounting parts 123a and 123b are in cooperation, the relative movement of the limiting member 121 and the connecting member 122 along the preset direction Y can be further improved while the preset distance h can be adjusted.

[0131] In some embodiments, please continue to refer to Figures 9 to 11 The limiting mechanism 120 also includes an elastic element 124. The elastic element 124 is disposed between the limiting member 121 and the connecting member 122, and provides a force that allows the limiting mechanism 120 to be in its initial state. The elastic element 124 can be connected between the limiting member 121 and the connecting member 122, or one end can be connected to one of the limiting member 121 and the connecting member 122, and the other end can abut against the other of the limiting member 121 and the connecting member 122; no specific limitation is made here. In the initial state, the force of the elastic element 124 can cause the limiting member 121 and the connecting member 122 to tend to move away from each other. The elastic element 124 can be a spring or other elastic components.

[0132] For example, with Figure 10For example, based on the illustrations in some of the aforementioned embodiments, the elastic member 124 can be sleeved outside the mounting body e and disposed between the limiting member 121 and the second sub-connector 122b. Correspondingly, the limiting member 121 and the second sub-connector 122b can have corresponding receiving holes (not shown in the illustrations), and at least a portion of the elastic member 124 can be accommodated within the corresponding receiving holes. This not only facilitates the installation of the elastic member 124 but also facilitates the adjustment of the aforementioned preset distance h.

[0133] Thus, by setting the elastic element 124, it is beneficial to improve the stability of the limiting mechanism 120 in the initial state.

[0134] In some embodiments, please continue to refer to Figures 9 to 11 The limiting mechanism 120 is used to abut against the printed circuit board P. Before grinding the protrusion M1 of the riveting member M, the limiting mechanism 120 can be abutted against the printed circuit board P. Then, the grinding mechanism 110 can move along a preset direction Y in response to an external force to perform the grinding process. The external force can be the driving force provided by the relevant driving components or the driving force provided by the operator.

[0135] This design allows the limiting mechanism 120 to provide support, enabling grinding not only through pressing but also simplifying the overall structure. Furthermore, when the grinding mechanism 110 is driven by gripping, it facilitates operation by the user.

[0136] In some embodiments, please continue to refer to Figures 9 to 11 The disassembly device 100 also includes an adjustment mechanism 130. The adjustment mechanism 130 is connected to the limiting mechanism 120, and the limiting mechanism 120 can abut against the printed circuit board P by means of the adjustment mechanism 130. The adjustment mechanism 130 is configured to adjust the distance between the limiting member 121 and the printed circuit board P along a preset direction Y.

[0137] Thus, by setting the adjustment mechanism 130, not only can the posture of the limiting mechanism 120 be adjusted according to the corresponding space that can be abutted on the printed circuit board P, but also the distance between the limiting member 121 and the printed circuit board P along the preset direction Y can be adjusted according to the size of the protrusion M1 of the riveting member M, thereby adjusting the minimum distance between the grinding mechanism 110 and the printed circuit board P along the preset direction Y.

[0138] Figure 12 It shows Figure 3 The diagram shows a cross-sectional view of a portion of the disassembly device 100; for ease of explanation, only the content relevant to the embodiments of this application is shown.

[0139] In some embodiments, please continue to refer to Figures 9 to 11 and in conjunction with reference Figure 12 The limiting mechanism 120 has a channel x that passes through it along a preset direction Y. The grinding mechanism 110 has a grinding head 111a, which can pass through the channel x along the preset direction Y. Specifically, with Figures 9 to 12 For example, channel x can pass through the first sub-connector 122a, the second sub-connector 122b, and the limiting member 121. The first sub-connector 122a, the second sub-connector 122b, and the limiting member 121 can be constructed into a roughly ring-shaped structure. Of course, the specific position of channel x can be set according to the specific structure of the limiting mechanism 120.

[0140] Thus, with the channel x provided on the limiting mechanism 120, the internal space of the limiting mechanism 120 can be utilized to obtain a more compact structure, reducing the overall space occupied by the disassembly device 100.

[0141] In some embodiments, please continue to refer to Figures 9 to 11 and in conjunction with reference Figure 12 The limiting mechanism 120 has multiple support parts z, and the limiting mechanism 120 can abut against the printed circuit board P by means of the multiple support parts z.

[0142] Specifically, with Figures 9 to 12 For example, the multiple support parts z can be provided on the side surface of the limiting member 121 opposite to the connecting member 122. Of course, the multiple support parts z can also be provided on the side of the limiting member 121. The support parts z and the limiting member 121 can be an integral structure or a separate structure. An integral structure refers to a structure that can be manufactured using an integral molding process, while a separate structure refers to a structure where two parts can be fixedly connected together using welding, bonding, or other fixing methods. It can be understood that when the support parts z are located on the side surface of the limiting member 121 opposite to the connecting member 122, the overall space occupied by the device can be further reduced.

[0143] In this way, the structure and position of the support part z can be flexibly set according to the usage requirements, without specific restrictions.

[0144] In some embodiments, please continue to refer to Figures 9 to 12 All support parts z are arranged at intervals around the central axis L1 of the channel x, and the extension direction of the central axis L1 is parallel to the preset direction Y. For example, there can be three support parts z, which can be arranged at equal intervals around the central axis L1 of the channel x. Of course, there can also be four, five, or other numbers of support parts z, which can also be arranged at unequal intervals around the central axis L1 of the channel x. No specific limitation is made here.

[0145] Thus, since all the support parts z are arranged around the central axis L1 of the channel x, the grinding head 111a is supported in the circumferential direction, thereby improving the support stability of the grinding mechanism 110 when the grinding head 111a grinds the protrusion M1 of the riveting part M, and thus further improving the grinding effect.

[0146] It is understood that multiple mounting members 123a and 123b illustrated in the foregoing embodiments may also be provided, and arranged in accordance with the arrangement of the support portion z. Referring to... Figure 5 The diagram illustrates a configuration with three mounting components 123a and two mounting components 123b. The three mounting components 123a are arranged around the central axis L1 of the channel x, and the two mounting components 123b are arranged around the central axis L1 of the channel x. This arrangement not only further enhances the guiding effect and facilitates adjustment according to different usage conditions, but also ensures more stable guidance in the circumferential direction of the grinding head 111a, thereby further improving the grinding effect.

[0147] In some embodiments, please continue to refer to Figures 9 to 12 The adjustment mechanism 130 can be configured to cooperate with the support part z. The adjustment mechanism 130 and the support part z are in one-to-one correspondence.

[0148] For example, with Figures 9 to 12 For example, the adjustment mechanism 130 may include a support 131, which may be threadedly connected to the side of the corresponding support z facing the printed circuit board P. To further improve the stability of the connection, the adjustment mechanism 130 may also include a mating part 132, which is used to fix the support 131 to the support z. For example, the mating part 132 may be a nut. To further reduce damage to the surface of the printed circuit board P, the adjustment mechanism 130 may also include a flexible part 133. The flexible part 133 is disposed on the support 131 and abuts against one end of the printed circuit board P. The flexible part 133 may be made of a flexible material, such as nylon or silicone.

[0149] Thus, through the cooperation of the adjustment mechanism 130 and the support part z, a more compact structure can be obtained while facilitating adjustment.

[0150] In some embodiments, please continue to refer to Figures 9 to 12The disassembly device 100 also includes a first detection element 140, which can be used to detect whether the displacement of the grinding mechanism 110 along a preset direction Y is the target displacement. The grinding mechanism 110 can stop grinding in response to the detection signal of the target displacement. For example, the first detection element 140 can be disposed between the limiting member 121 and the connecting member 122. Correspondingly, the limiting member 121 and the connecting member 122 can be provided with corresponding avoidance holes (not shown in the figure) for avoiding the first detection element 140. The first detection element 140 can be a displacement sensor.

[0151] Of course, in other embodiments, the first detection element 140 can be used to detect the arrival signal of the grinding mechanism 110 being in a limited position, and the grinding mechanism 110 can stop grinding in response to the arrival signal; the limited position is the position where the grinding mechanism 110 is limited by the limiting mechanism 120. For example, the first detection element 140 can be disposed at a position that can characterize the limited position, that is, depending on the specific structure of the disassembly device 100, the first detection element 140 can be disposed on the limiting member 121, or on the connecting member 122, or on the grinding mechanism 110. Correspondingly, a trigger structure that cooperates with the first detection element 140 can be provided. The first detection element 140 can be a trigger element such as a photoelectric switch.

[0152] Thus, by setting the first detection element 140, the polishing action of the polishing mechanism 110 can be controlled more accurately, further improving the surface damage of the printed circuit board P. The type and arrangement of the first detection element 140 can be set according to specific usage requirements, and no specific restrictions are imposed here.

[0153] In some embodiments, please continue to refer to Figure 5 and Figure 12 The grinding mechanism 110 includes a grinding component 111 and a driving component 112.

[0154] The grinding component 111 has a grinding head 111a, which is used to grind the protrusion M1 along a preset direction Y. The material of the grinding head 111a can be determined according to the material of the riveting component M, so as to facilitate grinding the protrusion M1 of the riveting component M. The specific configuration structure and size d of the grinding head 111a are not limited, and are set according to the size of the protrusion M1 of the riveting component M. For example, the side surface of the grinding head 111a facing the protrusion M1 of the riveting component M is configured to cover the protrusion M1 of the riveting component M along the preset direction Y.

[0155] The drive member 112 is connected to the grinding member 111 and drives the grinding member 111 to rotate around a rotation axis L2. The drive member 112 is configured to be operably moved along a preset direction Y. The drive member 112 is the component that outputs the rotational motion. This rotational motion is performed around the rotation axis L2. For example, the drive member 112 may have an output shaft, through which the drive member 112 can output the rotational motion. The output shaft rotates around a center line on the axial direction of the output shaft, which is the aforementioned rotation axis L2. The output shaft is connected to the grinding member 111. The drive member 112 may be a drive motor, or a component combining a drive member and a conversion member that converts the motion output by the drive member into rotational motion, or other components capable of outputting rotational motion. This application embodiment does not impose specific limitations on this. The drive motor may be a servo motor. The aforementioned output shaft may be the output shaft of the drive motor.

[0156] The overall structure of the drive unit 112 can be constructed as a longitudinally elongated structure extending along a preset direction Y, to facilitate gripping by the operator or connection to related drive structures. Of course, a gripping component can also be provided on the drive unit 112 for the operator to hold; no specific limitation is made here.

[0157] For example, the drive member 112 is connected to the connector 122. Specifically, the drive member 112 can pass through the connector 122 in a preset direction Y and engage with the connector 122. At least a portion of the drive member 112 can extend into the channel x.

[0158] The extension direction of the rotation axis L2 is parallel to the preset direction Y. Referring to the situations illustrated in some of the aforementioned embodiments, when a channel x is provided on the limiting mechanism 120, the central axis L1 of the channel x can be parallel to or coincide with the rotation axis L2. Figure 5 and Figure 12 For example, the central axis L1 of channel x coincides with the rotation axis L2. When channel x is used in conjunction with the grinding part 111, it is more conducive to reducing the overall volume of the device.

[0159] Thus, through the cooperation of the punch and the drive 112, as the drive 112 moves toward the printed circuit board P in response to the external force along the preset direction Y, the punch can move toward the protrusion M1 of the rivet M along the preset direction Y, and after abutting the protrusion M1 of the rivet M, the punch can grind the protrusion M1 of the rivet M as the rotational motion proceeds.

[0160] It is understood that, with the first detection element 140 provided, the drive element 112 can be configured to stop outputting rotational motion in response to the detection signal of the first detection element 140, so that the grinding element 111 can stop rotating, and thus the grinding element 111 stops grinding. In this way, in conjunction with the preset spacing h mentioned in some of the foregoing embodiments, the risk of the grinding head 111a of the grinding element 111 damaging the surface of the printed circuit board P can be further reduced.

[0161] In some embodiments, please continue to refer to Figure 5 and Figure 12 The grinding mechanism 110 also includes a second detection element (not shown in the figure). The second detection element is used to detect the torque generated by the rotary motion output by the drive member 112. The drive member 112 can rotate the grinding member 111 at a preset speed in response to the torque detected by the second detection element. For example, the second detection element can be disposed on the output shaft of the drive member 112 or on the drilling member. When the drive member 112 is configured as a servo motor, the torque sensor in the servo motor can be used as the second detection element.

[0162] Thus, by setting a second detection element, the rotation speed of the grinding element 111 can be adjusted according to the material and size of the protrusion M1 of the rivet M to be ground, so as to grind the protrusion M1 of the rivet M more quickly.

[0163] In some embodiments, please continue to refer to Figures 3 to 5 The disassembly device 100 also includes an absorption mechanism 150. The absorption mechanism 150 has an absorption port k, which is positioned facing the protrusion M1 of the riveting member M. The absorption port k is configured to generate a negative pressure, under which debris, dust, and other contaminants located near the protrusion M1 of the riveting member M can be drawn into the absorption mechanism 150 through the absorption port k. The specific position and orientation angle of the absorption port k can be set according to usage requirements and are not specifically limited here.

[0164] Thus, by setting up the absorption mechanism 150, the absorption port k of the absorption mechanism 150 can absorb impurities such as debris or dust generated during the polishing process, thereby improving the situation of contamination or damage to the printed circuit board P.

[0165] In some embodiments, please continue to refer to Figures 3 to 5The absorption mechanism 150 includes an absorption element 151, a collection element 152, and a conveying power element 153. The absorption element 151 is connected to the collection element 152, and the conveying power element 153 can be disposed on the absorption element 151. The conveying power element 153 provides power to allow fluid, liquid, or solid located in the absorption element 151 to flow into the collection element 152. The conveying power element 153 can be a pressure generating device, such as a drive pump. The absorption element 151 can be a tubular component, with an absorption port k disposed on the absorption element 151 and communicating with the interior of the absorption element 151. Figures 3 to 5 For example, the absorber 151 can be fixed relative to the limiter 121 by means of a limiting structure (not shown in the figure).

[0166] Thus, by configuring the absorption structure as an absorber 151, a collector 152, and a conveying power unit 153, collection can be performed simultaneously with absorption.

[0167] The following description, using the printed circuit board P as an example and in conjunction with the accompanying drawings, illustrates the disassembly process of the disassembly device 100 provided in this application, but is not limited thereto. This exemplary description is based on the operator holding the drive member 112.

[0168] Figure 13 It shows Figure 3 A schematic diagram of the disassembly device 100 in its first usage state from one viewpoint; Figure 14 It shows Figure 3 A schematic diagram of the disassembly device 100 in its first usage state from another perspective; Figure 15 It shows Figure 3 A schematic diagram of the second usage state of the disassembly device 100 from one viewpoint; Figure 16 It shows Figure 3 The schematic diagram of the disassembly device 100 in a third usage state is shown from one perspective; for ease of explanation, only the content related to the embodiments of this application is shown.

[0169] Only a portion of the structure of the printed circuit board P is shown. The first usage state is when the disassembly device 100 is in contact with the printed circuit board P; the second usage state is when the disassembly device 100 is in contact with the printed circuit board P and the limiting mechanism 120 is in its initial state; and the third usage state is when the disassembly device 100 is in contact with the printed circuit board P and the limiting mechanism 120 is in its limiting state.

[0170] Please refer to Figure 13 and Figure 14First, the operator determines the position of the protrusion M1 of the rivet M to be ground. Based on the material and size of the protrusion M1, the operator determines the preset rotation speed of the grinding tool 111 and controls the grinding tool 111 to rotate at the predetermined speed using a second detection device. Second, based on the condition of the printed circuit board P surface, the operator adjusts the position of the limiting member 121 relative to the printed circuit board P using the adjustment mechanism 130. Subsequently, based on the position of the limiting member 121 and the dimension d of the protrusion M1 along the preset direction Y, the operator adjusts the preset distance h using the mounting member 123a. This completes the preparation work.

[0171] Please refer to Figure 15 Based on the aforementioned preparatory work, the operator abuts the adjusting mechanism 130 against the printed circuit board P, and the grinding component 111 abuts against the protrusion M1 of the riveting component M. The operator holds the driving component 112 and drives it to move along the preset direction Y toward the printed circuit board P. Under the action of the driving component 112, the grinding component 111 moves along the preset direction Y toward the protrusion M1 of the riveting component M while simultaneously rotating around the rotation axis L2, thereby grinding the protrusion M1 of the riveting component M. The connecting component 122 moves toward the limiting component 121 under the drive of the grinding component 111. During this process, the mounting components 123a and 123b can guide the movement of the connecting component 122.

[0172] Please refer to Figure 16 With the limiting member 121 limiting the connecting member 122, the limiting mechanism 120 is in the limiting state, and the grinding is completed. At this time, the driving member 112 can stop outputting the rotary motion in response to the detection signal of the first detection member 140. Subsequently, the operator can hold the driving member 112 to remove the disassembly device 100 from the printed circuit board P. The limiting mechanism 120 switches to the initial state under the action of the elastic member 124.

[0173] It should be noted that when the adjusting mechanism 130 abuts against the printed circuit board P, the grinding member 111 may not abut against the protrusion M1 of the riveting member M. There is a certain distance between the grinding head 111a of the grinding member 111 and the protrusion M1 of the riveting member M along a preset direction Y. This distance can be adjusted according to the preset distance h, the adjustment method, and the corresponding action process; no specific limitations are imposed here. It is understood that when the adjusting mechanism 130 abuts against the printed circuit board P, and the grinding member 111 also abuts against the protrusion M1 of the riveting member M, the grinding process can be completed more quickly, improving grinding efficiency.

[0174] In summary, this embodiment of the application, by setting up a grinding mechanism 110, grinds the protrusion M1 on the rivet M that protrudes from the target part, facilitating the disassembly of the rivet M from the target part and improving the situation of damaging the connector C. Simultaneously, since the limiting mechanism 120 can limit the grinding mechanism 110, it can improve the situation of scratches on the surface of the target part. Furthermore, by setting the limiting mechanism 120 to a structure in which the limiting member 121 and the connecting member 122 are relatively movable along a preset direction Y, and supplemented by the mounting members 123a, 123b, and the adjusting mechanism 130, the relative movement between the limiting member 121 and the connecting member 122 is made more stable, while the preset distance h can be adjusted according to usage requirements. Subsequently, by utilizing the adjustable preset distance h and the cooperative use of the first detection member 140 and the second detection member, different grinding requirements are met while further reducing the risk of damaging the target part. During this process, since the disassembly device 100 is generally arranged longitudinally along the preset direction Y, it not only reduces the overall space occupied, but also facilitates the operator's gripping of the drive component 112 for polishing operations when the adjustment mechanism 130 is abutted against the target component. This is particularly advantageous for use in scenarios with limited operating space, especially when the target component is a printed circuit board P. Simultaneously, by cooperating with the absorption mechanism 150, the risk of contamination and damage to the target component is further reduced.

[0175] Therefore, with the cooperation of the various components of the disassembly device 100, it not only facilitates the disassembly of connector C, but also improves the situation of damaging connector C or scratching the surface of the target part, thereby increasing the reusability of connector C and reducing the cost of use. In addition, since the overall structure of the disassembly device 100 is simpler, it is easier for operators to operate in situations where space is limited.

[0176] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0177] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A disassembly device for disassembling a rivet on a target component, the rivet having a protrusion extending from the target component, the target component being a printed circuit board, characterized in that, The disassembly device includes: A grinding mechanism is configured to be operablely movable along a preset direction to grind the protrusion; the grinding mechanism includes a grinding element and a driving element, the grinding element having a grinding head, the driving element being tractively connected to the grinding element and driving it to rotate about a rotation axis parallel to the preset direction, and the side surface of the grinding head facing the protrusion covering the protrusion along the preset direction; and A limiting mechanism is provided, which is relatively movable to the grinding mechanism in a preset direction. The limiting mechanism includes a limiting member and a connecting member, which are relatively movable to each other in the preset direction, and a mounting member. The connecting member is connected to the grinding mechanism and is capable of relative movement with the limiting member in the preset direction under the drive of the grinding mechanism. The limiting mechanism has an initial state in which the limiting member and the connecting member are separated, and a limiting state in which the limiting member and the connecting member abut each other. In the initial state, the distance between the limiting member and the connecting member in the preset direction is a preset distance. The mounting member is connected to one of the limiting member and the connecting member, and is relatively slidably connected to the other of the two in the preset direction. The displacement of the mounting member relative to the other of the limiting member and the connecting member in the preset direction is configured as the preset distance. The limiting member has a channel extending along the preset direction, and the grinding head passes through the channel along the preset direction. The limiting member has multiple support parts arranged at intervals around the central axis of the channel on the side opposite to the connecting member. The support parts are used to abut against the target member. The central axis of the channel coincides with the rotation axis of the grinding head. The limiting mechanism further includes an elastic element disposed between the limiting element and the connecting element, the elastic element being used to provide a force that enables the limiting mechanism to be in the initial state; The disassembly device further includes a first detection element, which is used to detect whether the displacement of the grinding mechanism along the preset direction is the target displacement. The grinding mechanism can stop grinding in response to the detection signal of the target displacement.

2. The disassembly device according to claim 1, characterized in that, The mounting component is adjustable between the limiting component and the connecting component, and the mounting component is used to adjust the preset distance.

3. The disassembly device according to claim 2, characterized in that, The mounting component has a connecting portion that connects to one of the limiting member and the connecting member; The connecting part is configured to be adjustable in position or length along the preset direction to adjust the preset spacing.

4. The disassembly device according to claim 3, characterized in that, The connecting part is threadedly connected to one of the limiting member and the connecting member along the preset direction.

5. The disassembly device according to claim 1, characterized in that, The mounting component also has a limiting part; The limiting portion is configured to abut against one of the limiting member and the connecting member in the preset direction in the initial state to form the preset distance.

6. The disassembly device according to claim 5, characterized in that, In the initial state, the limiting portion abuts against the other of the limiting member and the connecting member on the side surface opposite to the other.

7. The disassembly device according to claim 1, characterized in that, One of the limiting member and the connecting member is provided with a first mounting hole; the mounting member is slidably inserted through the first mounting hole along the preset direction; and / or One of the limiting member and the connecting member is provided with a second mounting hole; the mounting member is inserted into the second mounting hole along the preset direction.

8. The disassembly device according to any one of claims 1-7, characterized in that, The limiting mechanism is used to abut against the target component.

9. The disassembly device according to claim 8, characterized in that, The disassembly device also includes an adjustment mechanism; The adjusting mechanism is connected to the limiting mechanism, and the limiting mechanism can abut against the target component by means of the adjusting mechanism; The adjustment mechanism is configured to adjust the distance between the limiting member and the target member along the preset direction.

10. The disassembly device according to any one of claims 1-7, characterized in that, The polishing mechanism also includes a second detection component; The second detection element is used to detect the torque generated by the rotary motion output by the drive element; The drive component is capable of rotating the grinding component at a preset speed in response to the torque detected by the second detection component.

11. The disassembly device according to any one of claims 1-7, characterized in that, The disassembly device also includes an absorption mechanism; The absorption mechanism is provided with an absorption port, which is positioned facing the protrusion.

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