低介电线性聚磷腈阻燃剂及其在双马来酰亚胺复合材料制备中的应用
By introducing linear polyphosphazene flame retardant into bismaleimide resin, the problems of brittleness and insufficient dielectric properties are solved, and a composite material with high impact strength, low dielectric constant and excellent flame retardant properties is realized, which is suitable for 5G electronic packaging materials.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- UNIV OF SCI & TECH OF CHINA
- Filing Date
- 2023-11-21
- Publication Date
- 2026-07-17
AI Technical Summary
Bismaleimide resins suffer from brittleness and poor processing characteristics, and their dielectric properties are insufficient to meet the requirements of 5G electronic packaging materials. In addition, the introduction of existing toughening agents reduces fire safety.
By using linear polyphosphazene flame retardant as a modifier, and blending it with bismaleimide prepolymer, a low dielectric, flame retardant and toughened composite material was prepared. The halogen-free, elastomer properties and reactive double bonds of linear polyphosphazene were utilized to improve interfacial compatibility and dielectric properties.
It significantly improves the impact strength and flame retardant properties of bismaleimide composite materials, reduces the dielectric constant, meets the dielectric performance requirements of 5G electronic packaging materials, and maintains good thermal stability and environmental friendliness.
Smart Images
Figure CN117327286B_ABST