A semiconductor refrigerator with self-evaporation

Abstract

The application discloses a semiconductor refrigeration refrigerator with self-evaporation, which comprises a box body and a box door installed in front of the box body, a cold-guiding aluminum block is installed at the upper end of the box body, the box body comprises an inner box, a semiconductor chip is placed above the cold-guiding aluminum block, an outer box heat dissipation fin is placed above the semiconductor chip, the outer box heat dissipation fin is fixedly installed with the cold-guiding aluminum block, an opening part is formed at the upper end of the box body and at the position of one side of the cold-guiding aluminum block, a water-absorbing cloth is penetrated through the opening part, one end of the water-absorbing cloth is wrapped outside the outer box heat dissipation fin, the other end of the water-absorbing cloth extends into the inner box, an outer box heat dissipation fan is installed above the water-absorbing cloth wrapped outside the outer box heat dissipation fin, an inner box refrigeration fin is installed on the inner top wall of the inner box and at the position below the cold-guiding aluminum block, a water pan is installed in the inner box and at the position below the inner box refrigeration fin, and the end of the water-absorbing cloth extending into the inner box is laid in the water pan.

Description

Technical fields:

[0001] This invention relates to a semiconductor refrigerator with self-evaporation, which belongs to the field of household appliance technology. Background technology:

[0002] In existing semiconductor refrigerators, condensate is collected in a condensate drain pan inside the refrigerator. When the condensate drain pan is full, the condensate overflows and flows into the refrigerator. Therefore, after a period of use, semiconductor refrigerators need to be manually cleaned of the condensate in the condensate drain pan.

[0003] In existing semiconductor refrigerators, the condensate collected inside the refrigerator needs to be manually removed every once in a while, which is very inconvenient. If the user forgets to remove the condensate, the condensate drip tray will overflow into the refrigerator, causing the items inside to become damp or soaked.

[0004] Therefore, it is indeed necessary to improve existing technologies to address their shortcomings. Summary of the Invention:

[0005] The present invention provides a semiconductor refrigerator with self-evaporation technology to solve the problems existing in the prior art. It can automatically remove the condensate generated inside the refrigerator without the need for manual removal, thereby improving the user experience.

[0006] The technical solution adopted in this invention is as follows: a semiconductor refrigerator with self-evaporation, comprising a cabinet and a door installed at the front of the cabinet, a cooling aluminum block installed at the upper end of the cabinet, the cabinet comprising an inner liner, a semiconductor chip placed above the cooling aluminum block, and an external heat dissipation fin placed above the semiconductor chip, the external heat dissipation fin being fixed together with the cooling aluminum block to fix the semiconductor chip between the cooling aluminum block and the external heat dissipation fin, an opening being provided at the upper end of the cabinet and on one side of the cooling aluminum block, through which a water-absorbing cloth passes, one end of the water-absorbing cloth covering the outside of the external heat dissipation fin, and the other end extending into the inner liner, an external heat dissipation fan being installed above the water-absorbing cloth covering the outside of the external heat dissipation fin, internal cooling fins being installed on the inner top wall of the inner liner and below the cooling aluminum block, a water collection tray being installed in the inner liner below the internal cooling fins, and the end of the water-absorbing cloth extending into the inner liner being laid in the water collection tray.

[0007] Furthermore, a heating wire is placed above the absorbent cloth in the water receiving tray.

[0008] Furthermore, the box body includes a top outer shell installed at the upper end of the inner liner. A first opening is provided on the top wall of the inner liner, and a second opening is provided on the top outer shell at a position aligned vertically with the first opening. The cooling aluminum block passes through the first and second openings.

[0009] Furthermore, a first screw hole is formed on the left and right side walls of the cooling aluminum block, and a first through hole is formed on the heat dissipation fins outside the box at a position opposite to the first screw hole. A bolt is inserted into the first through hole, and the lower end of the bolt is tightened into the first screw hole.

[0010] Furthermore, one end of the absorbent cloth is U-shaped and covers the outside of the heat dissipation fins on the outside of the box.

[0011] Furthermore, the absorbent cloth is made of polyvinyl alcohol.

[0012] Furthermore, bolts are installed on the external cooling fan of the box, and the lower end of the bolts pierces the absorbent cloth and is tightened onto the external cooling fins.

[0013] Furthermore, the cooling fins inside the box have several through holes spaced apart, and the cooling aluminum block has second screw holes at positions aligned vertically with the through holes. Bolts are installed in the through holes, and the upper ends of the bolts are tightened into the second screw holes.

[0014] Furthermore, a water receiving groove is formed on the water receiving tray, and the end of the absorbent cloth extending into the inner liner of the box is laid in the water receiving groove.

[0015] Furthermore, a lamp embedding box and a lamp cover installed together with the lamp embedding box are installed on the inner top wall of the inner liner of the box and in front of the cooling fins inside the box. An LED light is installed in the lamp embedding box.

[0016] The present invention has the following beneficial effects: The semiconductor refrigerator with self-evaporation can realize the function of automatically removing the condensate generated inside the refrigerator, which solves the problem of users having to manually remove the condensate inside the refrigerator every once in a while, and improves the user experience. Attached image description:

[0017] Figure 1 This is a schematic diagram of the assembly of the self-evaporating semiconductor refrigerator of the present invention.

[0018] Figure 2 This is an exploded schematic diagram of the self-evaporating semiconductor refrigerator of the present invention.

[0019] Figure 3 This is a partial schematic diagram of the self-evaporating semiconductor refrigerator of the present invention.

[0020] Figure 4This is another partial schematic diagram of the self-evaporating semiconductor refrigerator of the present invention.

[0021] Figure 5 This is another partial schematic diagram of the self-evaporating semiconductor refrigerator of the present invention.

[0022] Figure 6 This is a front view of the self-evaporating semiconductor refrigerator of the present invention. Detailed implementation method:

[0023] The invention will now be further described with reference to the accompanying drawings.

[0024] The present invention provides a self-evaporating semiconductor refrigerator, comprising a cabinet body 15 and a door 16 installed at the front of the cabinet body. The cabinet body 15 includes an inner liner 8, a top outer shell 11 installed at the upper end of the inner liner 8, a bottom outer shell 10 installed at the lower end of the inner liner 8, and an outer shell 9 installed on the rear surface of the inner liner 8.

[0025] A first opening 80 is provided on the top wall of the inner liner 8, and a second opening 110 is provided on the top outer shell 11, aligned vertically with the first opening 80. A cooling aluminum block 6 is installed in the first opening 80 and the second opening 110. A semiconductor chip 7 is placed on the upper surface of the cooling aluminum block 6. First screw holes (not shown) are formed on the left and right side walls of the cooling aluminum block 6, respectively. An external heat dissipation fin 1 is installed on the top outer shell 11, above the semiconductor chip 7. A first through hole (not shown) is formed on the external heat dissipation fin 1, opposite to the first screw hole. A bolt passes through the first through hole, and the lower end of the bolt is screwed into the first screw hole to fix the external heat dissipation fin 1, the semiconductor chip 7, and the cooling aluminum block 6 together.

[0026] A first opening 111 extending in the left and right direction and penetrating the top outer shell 11 is formed on one side of the heat dissipation fins 1 outside the box. A second opening (not shown) is provided on the top wall of the inner liner 8 at a position aligned vertically with the first opening 111. A water-absorbing cloth 2 passes through the first opening 111 and the second opening. One end of the water-absorbing cloth 2 is U-shaped and covers the outside of the heat dissipation fins 1 outside the box, while the other end extends into the inner liner 8.

[0027] In this invention, the absorbent cloth 2 is made of polyvinyl alcohol. To improve the absorbency, a heating wire (not shown) can be placed on the absorbent cloth 2.

[0028] An external cooling fan 3 is installed above the absorbent cloth 2 covering the outside of the heat dissipation fins 1. A bolt is installed on the external cooling fan 3. The lower end of the bolt pierces the absorbent cloth 2 and is tightened onto the external cooling fins 1, thereby installing the external cooling fan 3 and the external cooling fins 1 together.

[0029] On the inner top wall of the inner liner 8, below the cooling aluminum block 6, there are internal cooling fins 5. Four through holes 50 are formed on the internal cooling fins 5 at intervals. Second screw holes (not shown) are formed on the cooling aluminum block 6 at positions aligned with the through holes 50. Bolts are installed in the through holes 50. The upper end of the bolts is screwed into the second screw holes to install the internal cooling fins 5 and the cooling aluminum block 6 together.

[0030] A water collection tray 4 is installed in the inner liner 8 below the cooling fins 5. A water collection groove (not shown) is formed on the water collection tray 4, and the end of the absorbent cloth 2 extending into the inner liner 8 is laid in the water collection groove.

[0031] A lamp embedding box 14 and a lamp cover 12 installed together with the lamp embedding box 14 are installed on the inner top wall of the inner liner 8 and in front of the cooling fins 5. An LED light is installed in the lamp embedding box 14.

[0032] The working principle of the self-evaporating semiconductor refrigerator of the present invention is as follows: the side of the semiconductor chip 7 that is in contact with the heat dissipation fins 1 outside the refrigerator is the heating end, and the side that is in contact with the cooling aluminum block 6 is the cooling end. The heating end of the semiconductor chip 7 generates heat, which is dissipated through the heat dissipation fins 1 outside the refrigerator and the cooling fan 3 outside the refrigerator. The cooling end of the semiconductor chip 7 generates cold air, which is conducted to the cooling fins 5 inside the refrigerator through the cooling aluminum block 6, so that cold air is generated inside the refrigerator. At the same time, condensation water is generated on the cooling fins 5 inside the refrigerator and drips into the water collection tray 4. One end of the absorbent cloth 2 is fixed to the water collection tray 4 containing condensate, and the other end is fixed to the heat dissipation fins 1 outside the box. Through the self-absorption function of the polyvinyl alcohol absorbent cloth 2, the condensate is drawn from the water collection tray 4 to the heat dissipation fins 1 outside the box. The moisture on the absorbent cloth 2 will be evaporated by the heat on the heat dissipation fins 1 outside the box and the air blown by the heat dissipation fan 3 outside the box. The polyvinyl alcohol absorbent cloth 2 absorbs water at one end and evaporates water at the other end, realizing the self-evaporation function of the condensate inside the box and improving the user experience.

[0033] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements without departing from the principle of the present invention, and these improvements should also be considered within the scope of protection of the present invention.

Claims

1. A semiconductor refrigerator with self-evaporation capability, characterized in that: The enclosure includes a housing (15) and a door (16) installed at the front of the housing. A cooling aluminum block (6) is installed at the upper end of the housing (15). The housing (15) includes an inner liner (8). A semiconductor chip (7) is placed above the cooling aluminum block (6). An external heat dissipation fin (1) is placed above the semiconductor chip (7). The external heat dissipation fin (1) is installed and fixed together with the cooling aluminum block (6) to fix the semiconductor chip (7) between the cooling aluminum block (6) and the external heat dissipation fin (1). An opening is provided at the upper end of the housing (15) on one side of the cooling aluminum block (6). The opening is permeated with an absorbent cloth (2). One end of the absorbent cloth (2) covers the outside of the heat dissipation fins (1) outside the box, and the other end extends into the inner liner (8). An external heat dissipation fan (3) is installed above the absorbent cloth (2) covering the outside of the heat dissipation fins (1) outside the box. An internal cooling fin (5) is installed on the inner top wall of the inner liner (8) below the cooling aluminum block (6). A water collection tray (4) is installed in the inner liner (8) below the internal cooling fins (5). The end of the absorbent cloth (2) extending into the inner liner (8) is laid in the water collection tray (4).

2. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: A heating wire is placed above the absorbent cloth (2) in the water receiving tray (4).

3. The semiconductor refrigerator with self-evaporation as described in claim 2, characterized in that: The box body (15) includes a top box shell (11) installed at the upper end of the inner box (8). A first opening (80) is provided on the top wall of the inner box (8), and a second opening (110) is provided on the top box shell (11) at a position aligned vertically with the first opening (80). The cooling aluminum block (6) passes through the first opening (80) and the second opening (110).

4. The semiconductor refrigerator with self-evaporation as described in claim 3, characterized in that: The cooling aluminum block (6) has first screw holes formed on its left and right side walls respectively. The heat dissipation fins (1) outside the box have first through holes formed at positions opposite to the first screw holes. A bolt is inserted into the first through hole and the lower end of the bolt is tightened into the first screw hole.

5. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: One end of the absorbent cloth (2) is U-shaped and covers the outside of the heat dissipation fins (1) outside the box.

6. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: The absorbent cloth (2) is made of polyvinyl alcohol.

7. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: The external cooling fan (3) is equipped with bolts. The lower end of the bolts pierces the absorbent cloth (2) and is then tightened onto the external cooling fins (1).

8. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: The cooling fins (5) inside the box have several through holes (50) spaced apart. The cooling aluminum block (6) has second screw holes at positions aligned with the through holes (50). Bolts are installed in the through holes (50), and the upper end of the bolts is tightened into the second screw holes.

9. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: A water-receiving groove is formed on the water-receiving tray (4), and the end of the absorbent cloth (2) extending into the inner liner (8) of the box is laid in the water-receiving groove.

10. The semiconductor refrigerator with self-evaporation as described in claim 1, characterized in that: A lamp embedding box (14) and a lamp cover (12) installed together with the lamp embedding box (14) are installed on the inner top wall of the inner liner (8) and in front of the cooling fins (5) inside the box. An LED light is installed in the lamp embedding box (14).

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