一种制备银纳米线薄膜的方法与焊接处理用装置

By removing the coating layer of silver nanowire films using solvent welding and a combination of photo-induced plasma welding and Joule heating, the problems of poor conductivity and thermal damage were solved, achieving a highly efficient improvement in conductivity.

CN117334402BActive Publication Date: 2026-07-17BEIJING UNIV OF TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING UNIV OF TECH
Filing Date
2023-10-27
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies struggle to effectively control the conductivity of silver nanowire films, especially due to poor inter-contact caused by the polyvinylpyrrolidone coating layer. Furthermore, traditional post-processing methods suffer from high-temperature damage and chemical reagent contamination.

Method used

The solvent welding method is used to coat the substrate with the coated silver nanowire dispersion and then immerse it in a polar solvent to remove the coating layer. At the same time, photo-induced plasma welding and Joule heating can be used in combination to improve conductivity and avoid thermal damage.

Benefits of technology

It significantly improves the conductivity of silver nanowire films, is simple to operate, is suitable for temperature-sensitive materials, and does not require additional chemical reagents, thus reducing the risk of thermal damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明提供了一种制备银纳米线薄膜的方法与焊接处理用装置,属于导电薄膜制备技术领域。本发明提供包覆型银纳米线,其包括银纳米线与包覆在所述银纳米线表面的包覆层,形成所述包覆层采用的包覆剂包括聚乙烯吡咯烷酮;将所述包覆型银纳米线分散于溶剂中,得到包覆型银纳米线分散液;将所述包覆型银纳米线分散液涂覆于基板表面,干燥后在所述基板表面形成前驱薄膜;将负载有所述前驱薄膜的基板浸没于极性溶剂中进行焊接处理以去除所述包覆层,在所述基板表面得到所述银纳米线薄膜。本发明采用溶剂焊接法,仅需要将前驱薄膜浸泡于极性溶剂中即可实现包覆层的去除,从而可以大幅度提高银纳米线薄膜的导电性,且操作简单。
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