A camera chip module one-shot injection packaging process

Abstract

The application provides a camera chip module packaging process, the chip module includes a plastic base, the plastic base includes a top layer and a bottom layer, the bottom layer and the bottom layer are provided with a first metal terminal and a second metal terminal, the center of the plastic base is provided with a through hole, the center of the first metal terminal is provided with a circular part, the periphery of the circular part is provided with a branch part, and the packaging process comprises the following steps: material belt blanking, terminal positioning injection molding and base forming, positioning plastic and terminal punching, through one-time injection molding, the first metal terminal is directly packaged in the plastic base, after the circuit terminal in the chip and the plastic base are all in the correct position, the first metal terminal position in the chip and the positioning plastic position are cut off at the same time through blanking, the circuit is broken at the position, the number of injection molding is reduced, and the product yield is improved.

Description

Technical Field

[0001] This invention relates to the field of metal circuit packaging for voice coil motors, and more particularly to a one-time injection molding packaging process for camera chip modules. Background Technology

[0002] Existing bases and voice coil motors with metal circuits typically employ flexible FPC surface mount technology to achieve circuit connectivity. Traditional voice coil motors have a reed structure (also known as a first metal terminal) welded onto the base assembly. However, some chips require that the terminal circuits at certain locations be disconnected. Therefore, the common packaging method in the prior art is to pre-cut the terminals and disconnect the circuits at those terminal locations. However, since voice coil motor products are extremely small, their terminals are even smaller. The cut terminals are divided into two parts, which need to be pre-positioned by injection molding. That is, the two terminals are injection molded once to connect them but not conduct electricity. Then, a second injection molding is performed to form the plastic base structure. Patent announcements such as CN113394940 A and CN 115733311 A disclose that the terminals are positioned by injection molding once, and then the plastic base is formed by injection molding a second time. However, this method has the following problems: 1. Multiple injection moldings are time-consuming; 2. After the first injection molding, the resulting terminal and plastic assembly has certain tolerances in the process of re-injection molding. With the product itself being extremely small, multiple injection moldings result in a final yield of about 80%, which is inefficient. Summary of the Invention

[0003] To address the aforementioned technical issues, this invention proposes a one-time injection molding packaging process for a camera chip module. The chip module includes a plastic base, which comprises a top layer and a bottom layer. A first metal terminal and a second metal terminal are disposed between the bottom layer and the bottom layer. A through hole is provided in the center of the plastic base. A circular portion is provided in the center of the first metal terminal, and branch portions are provided around the circular portion. The branch portions extend between the top layer and the bottom layer and are injection molded and positioned. The second metal terminal is embedded between the bottom layer and the top layer. The first metal terminal and the second metal terminal are partially stacked.

[0004] The top layer of the plastic base has several first solder joints, and the top layer also has positioning holes. Positioning plastic is placed in the positioning holes. The first metal terminal is exposed in the positioning holes and positioned by the positioning plastic. The first metal terminals between the positioning plastics have a disconnected structure. The first metal terminal and the second metal terminal are exposed in the first solder joints. The bottom layer has several pin holes and second solder joints, and the second metal terminal is partially exposed in the second solder joints.

[0005] The packaging process includes the following steps:

[0006] S1: The strip is punched out of the first metal terminal body and branch, and the second metal terminal by stamping.

[0007] S2: Place the first metal terminal and the second metal terminal into the injection mold and perform a single injection molding. A top layer and a bottom layer are formed on both sides of the plane where the first metal terminal and the second metal terminal are located. The first metal terminal and the second metal terminal are pressed together by inserts to form a first solder joint and a second solder joint, so that the first metal terminal and the second metal terminal are exposed at the first solder joint. The positioning hole is formed by setting inserts to form positioning plastic, which can position the first metal terminal.

[0008] S3: The first metal terminal is punched within the positioning point by the punching die. The cutting position is rectangular. The cutting position is located at both the first metal terminal and the positioning plastic end. The first metal terminal and the positioning plastic end are cut off at the same time, and the circuit formed by the first metal terminal is cut off.

[0009] Preferably, the second metal terminal includes a horizontal portion and a vertical portion, the horizontal portion being fitted between a top layer and a bottom layer, the vertical portion extending out of the second solder joint forming pin of the bottom layer, and the horizontal portion being exposed at the second solder joint.

[0010] Preferably, the positioning plastic includes at least two sets of U-shaped portions, which are arranged opposite to each other, and the distance between the U-shaped portions is 0.15mm.

[0011] Preferably, the punching die of the punching die includes a die body, and a cutting head is integrally formed on the lower part of the die body. The diameter of the cutting head gradually decreases from the die body, and the length of the cutting head is 5mm.

[0012] Preferably, the insert of the die includes a block structure, the block structure includes two sets of symmetrically arranged blocks, and a cavity is provided between the blocks, the cavity being consistent with the cutter head.

[0013] Preferably, the block structure is provided with an insert guide block, and the insert guide block is provided with a positioning hole.

[0014] The one-time injection molding packaging process for camera chip modules proposed in this invention has the following beneficial effects: This packaging process directly encapsulates the first metal terminal in the plastic base through one injection molding. After all the circuit terminals inside the chip and the plastic base are in the correct positions, the positions of the first metal terminal inside the chip and the positioning plastic positions are simultaneously cut off by punching, thereby breaking the circuit at that point, reducing the number of injection molding cycles, and improving the product yield. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below.

[0016] Figure 1 This is a top-level schematic diagram of the chip product of the present invention;

[0017] Figure 2 This is a three-dimensional schematic diagram of the chip product of the present invention;

[0018] Figure 3 This is a schematic diagram of the positioning hole in the present invention;

[0019] Figure 4 This is a schematic diagram of the positioning hole after cutting according to the present invention;

[0020] Figure 5 A schematic diagram of the block structure of the invention;

[0021] Figure 6 This is a side view of the concave mold insert of the present invention;

[0022] Figure 7 This is a schematic diagram of the die-cutting mold and the insert that enters the die cavity according to the present invention;

[0023] Figure 8 for Figure 1 Enlarged view of point A in the middle;

[0024] Figure 9 This is a schematic diagram of the process flow of the present invention;

[0025] Among them, 1. Plastic base; 11. Top; 12. First welding point; 2. First metal terminal; 21. Circular part; 22. Branch part; 3. Second metal terminal; 4. Positioning plastic; 5. Cutting position; 6. Block; 7. Cavity; 8. Insert guide block; 9. Die body; 10. Cutting head. Detailed Implementation

[0026] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0027] This invention proposes a one-time injection molding packaging process for camera chip modules. First, as follows: Figure 1 As shown, the chip module includes a plastic base 1, which includes a top layer and a bottom layer, with a first metal terminal 2 disposed between the bottom layer and the bottom layer. Figure 1 The position of the diagonal line in the middle) and the second metal terminal 3 ( Figure 1(The location of the hole without the diagonal line) Of course, the terminal structure can be different depending on the requirements of different chips. The plastic base 1 has a through hole in the center. The first metal terminal 2 has a circular part 21 in the center. The circular part 21 has branch parts 22 around it. The branch parts 22 extend between the top layer and the bottom layer and are injection molded and positioned. The second metal terminal 3 is embedded between the bottom layer and the top layer. The first metal terminal 2 and the second metal terminal 3 are partially stacked. The top layer of the plastic base 1 has a number of first solder points 12. The top layer also has positioning holes. Positioning plastic 4 is placed in the positioning holes. The first metal terminal 2 is exposed in the positioning holes and is positioned by the positioning plastic 4. The positioning plastic 4 is used to position the first metal terminal 2, which is disconnected, while the second metal terminal 3 is exposed within the first solder joint 12. Both the first metal terminal 2 and the second metal terminal 3 are exposed at the first solder joint 12 and the second solder joint, facilitating subsequent chip circuit soldering. The bottom layer has several pin holes and a second solder joint. By using the positioning plastic 4, the two disconnected parts of the first metal terminal 2 can be positioned. The positioning plastic 4 includes at least two sets of U-shaped portions, which are arranged opposite each other and located above and below the first metal terminal 2. Since the first metal terminal 2 is injection molded for positioning, the positioning effect of the first metal terminal 2 is relatively stable. The second metal terminal 3 includes a horizontal portion and a vertical portion. The horizontal portion is fitted between the top and bottom layers, and the vertical portion extends out of the second solder joint forming pin of the bottom layer. The horizontal portion is exposed at the second solder joint.

[0028] The packaging process includes the following steps:

[0029] S1: The strip is punched out from the body of the first metal terminal 2 and the branch 22, as well as the second metal terminal, by stamping. The shape of the body and the branch 22 of the metal terminal is punched according to the requirements of the chip circuit, and the structure of the body is circular.

[0030] S2: Place the first metal terminal 2 and the second metal terminal 3 into the injection mold and perform one injection molding. The top layer and the bottom layer are formed by injection molding on both sides of the plane where the first metal terminal 2 and the second metal terminal 3 are located. The first metal terminal 2 and the second metal terminal 3 are pressed together by inserts to form the first solder point 12 and the second solder point, so that the first metal terminal 2 and the second metal terminal are exposed at the first solder point 12. The positioning hole is formed by setting inserts to form positioning plastic 4. The positioning plastic 4 can position the first metal terminal 2. The first metal terminal 2 is positioned at the positioning hole by the positioning plastic 4. At this time, the first metal terminal 2 and the second metal terminal 3 inside the base can be injection molded and positioned without displacement. However, at this time, the positioning hole where the first metal terminal 2 is located forms a loop.

[0031] S3: The positioning point of the first metal terminal 2 is punched using a punching die. The cutting position 5 is rectangular and is located at both the ends of the first metal terminal 2 and the positioning plastic 4. The ends of the first metal terminal 2 and the positioning plastic 4 are cut off simultaneously, breaking the circuit formed by the first metal terminal 2. Through subsequent cutting, the position of the first metal terminal 2 is disconnected, resulting in a finished product. In this way, the entire process only requires one injection molding to position the intermediate terminal and simultaneously form the base. Compared with existing technologies, this greatly reduces injection molding costs and achieves a high yield.

[0032] However, it should be noted that since both the metal and plastic parts need to be cut off, the die-cut shape should be as follows: Figure 5 As shown, due to the difference in density between the two and the small size of the entire product structure, it is extremely easy for the product to crack during punching. Therefore, the distance between the two U-shaped parts of the positioning plastic 4 is first set to about 0.15mm. Figure 8 At position h, this allows for punching a smaller area of ​​plastic during the punching process, reducing the punching force. Simultaneously, to improve the strength of the punch, the punching die includes a die body 9, with a cutter head 10 integrally formed at the lower part of the die body 9. Figure 7 As shown, the diameter of the cutting head 10 gradually decreases from the die body 9, and the length of the cutting head 10 is 5mm. When the length of the cutting head 10 is controlled at 5mm, the width of the blade is large, maintaining the strength of the blade body, so as to facilitate punching.

[0033] The structure of a punching die includes a lower punch and a lower die, such as... Figure 5 , Figure 6 , Figure 7 The lower die insert is designed as a block structure, comprising two sets of symmetrically arranged blocks 6, with a cavity 7 between the blocks 6. The cavity 7 corresponds to the cutter head 10, increasing the strength of the part and facilitating maintenance. Furthermore, to ensure the accuracy of the cutter head 10 entering the lower die, the block structure is equipped with an insert guide block 8. The insert guide block 8 has a positioning hole corresponding to the cavity 7 of the lower block structure, used to guide the cutter head 10, as the small cutter head 10 is prone to misalignment, leading to die entry failure or even breakage.

Claims

1. A one-time injection molding packaging process for a camera chip module, characterized in that, The chip module includes a plastic base, which includes a top layer and a bottom layer. A first metal terminal and a second metal terminal are provided between the top layer and the bottom layer. The plastic base has a through hole in the center. The first metal terminal has a circular part in the center and a branch part around the circular part. The branch part extends between the top layer and the bottom layer and is injection molded and positioned. The second metal terminal is embedded between the bottom layer and the top layer. The first metal terminal and the second metal terminal are partially stacked. The top layer of the plastic base has several first solder joints, and the top layer also has positioning holes. Positioning plastic is placed in the positioning holes. The first metal terminal is exposed in the positioning holes and positioned by the positioning plastic. The first metal terminals between the positioning plastics have a disconnected structure. The first metal terminal and the second metal terminal are exposed in the first solder joints. The bottom layer has several pin holes and second solder joints, and the second metal terminal is partially exposed in the second solder joints. The packaging process includes the following steps: S1: The strip is punched out of the first metal terminal body and branch, and the second metal terminal by stamping. S2: Place the first metal terminal and the second metal terminal into the injection mold and perform a single injection molding. A top layer and a bottom layer are formed on both sides of the plane where the first metal terminal and the second metal terminal are located. The first metal terminal and the second metal terminal are pressed together by inserts to form a first solder joint and a second solder joint, so that the first metal terminal and the second metal terminal are exposed at the first solder joint. The positioning hole is formed by setting inserts to form positioning plastic, which can position the first metal terminal. S3: The first metal terminal is punched within the positioning point by the punching die. The cutting position is rectangular. The cutting position is located at both the first metal terminal and the positioning plastic end. The first metal terminal and the positioning plastic end are cut off at the same time, and the circuit formed by the first metal terminal is cut off.

2. The one-time injection molding packaging process for the camera chip module according to claim 1, characterized in that, The second metal terminal includes a horizontal portion and a vertical portion, the horizontal portion being fitted between a top layer and a bottom layer, the vertical portion extending out of the second solder joint forming pin of the bottom layer, and the horizontal portion being exposed at the second solder joint.

3. The one-time injection molding packaging process for the camera chip module according to claim 1, characterized in that, The positioning plastic includes at least two sets of U-shaped parts, which are arranged opposite to each other, and the distance between the U-shaped parts is 0.15mm.

4. The one-time injection molding packaging process for the camera chip module according to claim 1, characterized in that, The punching die of the punching die includes a die body, and a cutting head is integrally formed on the lower part of the die body. The diameter of the cutting head gradually decreases from the die body, and the length of the cutting head is 5mm.

5. The one-time injection molding packaging process for the camera chip module according to claim 4, characterized in that, The punching die includes a lower punch and a lower die. The die insert includes a block structure, which includes two sets of symmetrically arranged blocks. A cavity is provided between the blocks, and the cavity is consistent with the cutting head.

6. The one-time injection molding packaging process for the camera chip module according to claim 5, characterized in that, The block structure is provided with an insert guide block, and the insert guide block is provided with a positioning hole.

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