Hybrid vertical package-on-package structure

Abstract

The disclosure provides a hybrid vertical package structure, which comprises a memory having signal particles for transmitting signals; an adapter plate having a first surface and a second surface arranged oppositely, the first surface facing the memory, and the second surface facing an SOC substrate, the second surface being provided with first type solder balls arranged along a first direction and second type solder balls arranged along a second direction, the first type solder balls being connected with the signal particles of the memory for signal fan-out of the memory, and the second type solder balls being used for supporting the adapter plate and the SOC substrate, the second type solder balls having a plurality of solder ball groups, the spacing between adjacent solder ball groups along the second direction being greater than the spacing between adjacent second solder balls within a solder ball group, and the first direction being different from the second direction; and the SOC substrate being connected with the first type solder balls in signal. The above scheme can support the adapter plate and the SOC substrate, improve the mold flow filling yield, and be conducive to the package layout design of the SOC substrate.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and more particularly to a hybrid vertical stacking packaging structure. Background Technology

[0002] In traditional vertical stacked packaging (Hybrid PoP), the signal outputs of the memory chips are located around the perimeter of the memory package, allowing for direct bonding to the SOC substrate. The memory chip can be Low Power Double Data Rate (LPDDR) SDRAM. Taking LPDDR as an example, as the number of signals from LPDDR chips increases and the LPDDR package size grows, the signals gradually originate inside the package, leading to the development of hybrid vertical stacked packaging (Hybrid PoP).

[0003] In Hybrid PoP packaging design and manufacturing processes, the solder ball layout design under the interposer substrate directly affects the chip routing strategy (fanout) of the SOC substrate and the packaging layout design. It can also directly impact the yield of the molding die (MD) process (e.g., voids appearing after MD molding) and the solder ball height (standoff) after reflow soldering between layers following thermal compression bond (TCB). The consistency of Height (SOH) values ​​is an issue. However, current Hybrid PoP packaging designs cannot effectively address these issues simultaneously. Summary of the Invention

[0004] The present invention addresses the problem that existing Hybrid PoP packaging designs cannot simultaneously solve the issues of packaging flow effect, SOC substrate packaging layout design, and solder ball height consistency after reflow soldering.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide a hybrid vertical stacked package structure, comprising: a memory having signal particles for transmitting signals; an adapter board having a first surface and a second surface disposed opposite to each other, the first surface facing the memory and the second surface facing a SOC substrate, the second surface having first type solder balls arranged along a first direction and second type solder balls arranged along a second direction, the first type solder balls being connected to the signal particles of the memory and used for signal fan-out of the memory, the second type solder balls being used to support the adapter board and the SOC substrate, the second type solder balls having multiple solder ball groups, each solder ball group including one or more second solder balls, the spacing between adjacent solder ball groups along the second direction being greater than the spacing between adjacent second solder balls within the solder ball group, wherein the first direction is different from the second direction; and the SOC substrate being signal-connected to the first type solder balls.

[0006] Optionally, the first direction is perpendicular to the second direction.

[0007] Optionally, the second surface of the adapter plate has opposing first edge regions and second edge regions, with the first type of solder ball located in the first edge regions and the second edge regions; and / or, the second surface of the adapter plate has opposing third edge regions and fourth edge regions, with the second type of solder ball located in the third edge regions and the fourth edge regions.

[0008] Optionally, the cross-section of the second type of solder ball along the direction parallel to the second surface is circular, waist-shaped, or elliptical.

[0009] Optionally, the first type of solder ball is spherical, and the second type of solder ball has an oblong cross-section along a direction parallel to the second surface, with the long side of the second type of solder ball extending along the second direction and the length of the long side of the second type of solder ball being greater than the diameter of the first type of solder ball; or, the second type of solder ball has an elliptical cross-section along a direction parallel to the second surface, with the long axis of the second type of solder ball extending along the second direction and the length of the long axis of the second type of solder ball being greater than the diameter of the first type of solder ball.

[0010] Optionally, the cross-section of the second type of solder ball along the direction parallel to the second surface is waist-shaped, and the length of the short side of the second type of solder ball is less than the diameter of the first type of solder ball; or, the cross-section of the second type of solder ball along the direction parallel to the second surface is elliptical, and the length of the short axis of the second type of solder ball is less than the diameter of the first type of solder ball.

[0011] Optionally, the second type of solder ball is formed using an automated ball-planting process; or, the second type of solder ball is formed using an electroplating process.

[0012] Optionally, the solder ball parameters of the first type of solder ball and the solder ball parameters of the second type of solder ball are determined based on at least one of the following parameters: the number of signal particles in the memory, the signal particle layout of the memory, the trace width of the adapter board, the trace spacing of the adapter board, and the package size of the adapter board.

[0013] Optionally, the second type of solder balls are arranged in one or more columns along the second direction.

[0014] Optionally, when the second type of solder balls are distributed in multiple columns along the second direction, for two adjacent columns of second type solder balls, the distance between adjacent solder ball groups in the column closer to the center of the adapter plate is denoted as the first distance, and the distance between adjacent solder ball groups in the column closer to the edge of the adapter plate is denoted as the second distance. The projection of the first distance along the first direction is covered by the projection of the second distance along the first direction.

[0015] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:

[0016] The second side of the adapter board has a first type of solder balls arranged along a first direction and a second type of solder balls arranged along a second direction, which are different from the second direction. The first type of solder balls are connected to the signal particles of the memory and to the signal of the SOC substrate to fan out the memory signal to the SOC substrate. The second type of solder balls are used to support the adapter board and the SOC substrate. The second type of solder balls has multiple solder ball groups, and each solder ball group includes one or more second solder balls. The spacing between adjacent solder ball groups along the second direction is greater than the spacing between adjacent second solder balls within a solder ball group. Thus, the second type of solder balls not only support the adapter board and the SOC substrate, ensuring the consistency of solder ball height after reflow soldering, but also ensure the rapid passage of mold flow during molding, reducing resistance to mold flow, which is beneficial for mold flow filling, reducing the probability of voids, and improving the molding yield. In addition, the spacing between adjacent solder ball groups can also provide corresponding packaging layout space, which is helpful for SOC substrate packaging layout design. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of an existing adapter board;

[0018] Figure 2 This is a schematic diagram of another existing adapter board;

[0019] Figure 3 This is a schematic diagram of a hybrid vertical stacked packaging structure from one perspective in an embodiment of the present invention;

[0020] Figure 4This is a schematic diagram of a hybrid vertical stacked packaging structure from another perspective in an embodiment of the present invention;

[0021] Figure 5 This is a schematic diagram of an adapter board according to an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of another adapter board in an embodiment of the present invention;

[0023] Figure 7 This is a schematic diagram of another adapter board in an embodiment of the present invention;

[0024] Figure 8 This is a schematic diagram of another adapter board in an embodiment of the present invention;

[0025] Figure 9 This is a schematic diagram of the process for forming the second type of solder balls using an automated ball-planting process;

[0026] Figure 10 This is a schematic diagram of the process for forming the second type of solder balls using an automated ball-planting process;

[0027] Figure 11 This is a schematic diagram of the process for forming the second type of solder balls using the electroplating ball process;

[0028] Figure 12 This is a schematic diagram of the process for forming the second type of solder balls using electroplating ball technology;

[0029] Explanation of reference numerals in the attached figures:

[0030] 1-Memory; 11-Signal particle; 2-Adapter board; 21-First surface; 22-Second surface; 221-First edge region; 222-Second edge region; 223-Third edge region; 224-Fourth edge region; 23-First type solder ball; 231-First solder ball; 24-Second type solder ball; 240-Solder ball group; 241-Second solder ball; 3-SOC substrate; 4-Fluoride can; 5-Stencil; 51-Mesh opening; 6-Solder paste; 7-Fluoride; x-First direction; y-Second direction. Detailed Implementation

[0031] As mentioned above, in Hybrid PoP packaging design and process, the solder ball layout design under the adapter board directly affects the chip routing strategy planning (Fanout) of the SOC substrate and the packaging layout design. It may also directly affect the yield of the packaging molding process (MD) (e.g., voids appear after MD molding) and the consistency of the stand-off height (SOH) value of the solder balls after reflow soldering between the stacked layers after thermal compression bond (TCB).

[0032] Reference Figure 1 This paper presents a schematic diagram of an existing adapter board. Specifically, the solder balls at the 3 and 9 o'clock positions (also known as interlayer solder balls) primarily support the adapter board and the SOC substrate, while the solder balls at the 6 and 12 o'clock positions are used for signal fanout. In existing technologies, the solder balls at the 3 and 9 o'clock positions are typically spaced the same as those at the 6 and 12 o'clock positions and arranged in multiple rows. Research has shown that if there are too many interlayer solder balls at the 3 and 9 o'clock positions, it will obstruct the fanout layout of other module signals on the SOC chips in these directions, limiting the quality and quantity of signal output from the SOC chips in these directions. Furthermore, it will obstruct the encapsulation molding process during packaging, easily leading to void phenomena. Figure 2 As shown, removing the solder balls at the 3 o'clock and 9 o'clock positions will compromise the total solder ball height (SOH) between layers, affecting the consistency of solder ball height. In summary, current Hybrid PoP packaging designs cannot effectively address all of these issues simultaneously.

[0033] To address the aforementioned issues, in this embodiment of the invention, the second surface of the adapter board is provided with a first type of solder balls arranged along a first direction and a second type of solder balls arranged along a second direction, the first and second directions being different. The first type of solder balls are connected to the signal particles of the memory and to the signal of the SOC substrate, thereby fanning out the memory signal to the SOC substrate. The second type of solder balls are used to support the adapter board and the SOC substrate. The second type of solder balls has multiple solder ball groups, each solder ball group including one or more second solder balls. The spacing between adjacent solder ball groups along the second direction is greater than the spacing between adjacent second solder balls within a solder ball group. Thus, the second type of solder balls not only support the adapter board and the SOC substrate and ensure the consistency of solder ball height after reflow soldering, but also ensure the rapid passage of the mold flow during molding, reducing resistance to the mold flow, facilitating mold flow filling, reducing the probability of voids, and improving the molding yield. In addition, the spacing between adjacent solder ball groups can also provide corresponding packaging layout space, which is helpful for SOC substrate packaging layout design.

[0034] To make the above-mentioned objectives, features and beneficial effects of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0035] This invention provides a hybrid vertical stacked packaging structure, referring to... Figures 3 to 8 The hybrid vertical stacked package structure includes: a memory 1, an adapter board 2, and a SOC substrate 3. The memory 1 has signal particles 11 for transmitting signals.

[0036] The adapter board 2 has a first surface 21 and a second surface 22 disposed opposite to each other. The first surface 21 faces the memory 1. The second surface 22 faces the SOC substrate 3. The second surface 22 is provided with first type solder balls 23 arranged along a first direction x and second type solder balls 24 arranged along a second direction y. The first type solder balls 23 are connected to the signal particles 11 of the memory 1 and are used for signal fan-out of the memory 1. The second type solder balls 24 are used to support the adapter board 2 and the SOC substrate 3. The second type solder balls 24 have multiple solder ball groups 240, and each solder ball group 240 includes one or more second solder balls 241. Along the second direction y, the spacing D between adjacent solder ball groups 240 is greater than the spacing d between adjacent second solder balls 241 within the solder ball group 240. Wherein, the first direction x is different from the second direction y. The SOC substrate is signal connected to the first type solder balls 23. It should be noted that the spacing D between adjacent solder ball groups 240 and the spacing d between adjacent second solder balls 241 are... Figure 8 The example shown is illustrated here, but not in the other diagrams.

[0037] As can be seen from the above, the second surface 22 of the adapter board 2 is provided with first-type solder balls 23 arranged along the first direction x and second-type solder balls 24 arranged along the second direction y, where the first direction x and the second direction y are different. The first-type solder balls 23 are connected to the signal particles 11 of the memory 1 and to the signal of the SOC substrate 3 to fan out the signal of the memory 1 to the SOC substrate 3. The second-type solder balls 24 are used to support the adapter board 2 and the SOC substrate 3. The second-type solder balls 24 have multiple solder ball groups 240, each solder ball group 240 including one or more second solder balls 241. The spacing between adjacent solder ball groups 240 along the second direction y is greater than the spacing between adjacent second solder balls 241 within the solder ball group 240. Thus, the second-type solder balls 24 not only support the adapter board 2 and the SOC substrate 3 to ensure the consistency of solder ball height after reflow soldering, but also ensure the rapid passage of the mold flow during the molding process, reducing the resistance to the mold flow, which is beneficial for mold flow filling, reducing the probability of voids, and improving the molding yield. In addition, the spacing between adjacent solder ball groups 240 can provide corresponding packaging layout space, which is helpful for SOC substrate packaging layout design.

[0038] In some embodiments, the number of second solder balls 241 within each solder ball group 240 may be the same or different. For example... Figure 5As shown, some solder ball groups 240 include one second solder ball 241, some solder ball groups 240 include two second solder balls 241, and some solder ball groups 240 include three second solder balls 241. In practice, the number of second solder balls 241 included in a solder ball group 240 can also be four or more. Examples and illustrations will not be provided here.

[0039] like Figures 5 to 8 As shown, the spacing between adjacent solder ball groups 240 can be the same, wherein, Figure 6 and Figure 7 In this configuration, each solder ball group 240 includes only one second solder ball 241, and the solder ball groups 240 are arranged at equal intervals along the second direction y. For example... Figure 8 As shown, the spacing between adjacent solder ball groups 240 can also be different, and the solder ball groups 240 are arranged at unequal intervals along the second direction y.

[0040] The second type of solder balls 24 are arranged in a column along the second direction y, such as Figures 5 to 7 As shown. The second type of solder balls 24 can also be arranged in multiple columns along the second direction y, such as... Figure 8 The two columns shown can actually be three or more columns in practice.

[0041] When the second type of solder balls 24 are arranged in multiple columns along the second direction y, for two adjacent columns of second type of solder balls 24, the distance between adjacent solder ball groups 240 in the column closer to the center of the adapter plate 2 is denoted as the first distance, and the distance between adjacent solder ball groups 240 in the column closer to the edge of the adapter plate 2 is denoted as the second distance. The projection of the first distance along the first direction x is covered by the projection of the second distance along the first direction x. In this way, during the molding process, the resistance of the second solder balls 241 in the solder ball groups 240 near the edge of the column to the molding flow can be minimized, allowing the molding flow to enter the adjacent solder ball groups 240 and improving the molding yield.

[0042] In specific implementation, the first direction x is perpendicular to the second direction y.

[0043] In some non-limiting embodiments, memory 1 may be dynamic random access memory (DRAM). DRAM may include low-power double data rate memory (LPDDR), etc.

[0044] In practical implementation, according to the JEDEC (Joint Electron Components Industry Association) standard, for hybrid vertically stacked DRAM packages, the signal output directions of the DRAM chips (e.g., LPDDR) are two face-to-face directions, and the other two directions are ground. For ease of explanation, the signal output directions of the DRAM chips can be defined as the 12 o'clock and 6 o'clock directions, and the other two directions, which are ground, can be defined as the 3 o'clock and 9 o'clock directions.

[0045] In some embodiments, the second surface 22 of the adapter plate 2 has opposing first edge regions 221 and second edge regions 222, and the first type of solder ball 23 is located in the first edge region 221 and the second edge region 222. And / or, the second surface 22 of the adapter plate 2 has opposing third edge regions 223 and fourth edge regions 224, and the second type of solder ball 24 is located in the third edge region 223 and the fourth edge region 224.

[0046] In some embodiments, the first edge region 221, the second edge region 222, the third edge region 223 and the fourth edge region 224 are distributed around the second surface 22 of the adapter plate 2.

[0047] The first edge region 221 and the second edge region 222 correspond to the regions of the signal particles 11 of the DRAM, that is, to the 12 o'clock and 6 o'clock directions of the signal particles used by the DRAM for signal output, so as to realize that the first type of solder balls 23 fan out the signal of the memory 1. The signal output of the memory 1 only needs to occupy the first type of solder balls 23 in the first edge region 221 and the second edge region 222 of the adapter board 2.

[0048] The third edge region 223 and the fourth edge region 224 correspond to the 3 o'clock and 9 o'clock directions of the DRAM, respectively. The second type of solder balls 24 disposed in the third edge region 223 and the fourth edge region 224 serve to support the SOC substrate 3 and the adapter board 2.

[0049] In some embodiments, the second type of solder ball 24 has a waist-shaped cross-section (also referred to as a racetrack shape or an oblong shape) along a direction parallel to the second surface 22, such as... Figure 6 As shown.

[0050] In other embodiments, the second type of solder ball 24 has an elliptical cross-section along a direction parallel to the second surface 22, such as... Figure 7 and Figure 8 As shown.

[0051] It should be noted that the cross-section of the second type solder ball 24 along the direction parallel to the second surface 22 can all be waist-shaped. The cross-section of the second type solder ball 24 along the direction parallel to the second surface 22 can also all be elliptical. Furthermore, the cross-section of the second type solder ball 24 along the direction parallel to the second surface 22 can also be partially waist-shaped and partially elliptical.

[0052] In some other embodiments, the second type of solder ball 24 has a circular cross-section along a direction parallel to the second surface 22, such as... Figure 5 As shown.

[0053] In a specific implementation, the first type of solder ball 23 is spherical, that is, the cross-section along the direction parallel to the second surface 22 is circular.

[0054] In some embodiments, the cross-section of the second type solder ball 24 along the direction parallel to the second surface 22 is waist-shaped, the long side of the second type solder ball 24 extends along the second direction y, and the length of the long side of the second type solder ball 24 is greater than the diameter of the first type solder ball 23.

[0055] The length of the short side of the second type of solder ball 24 is less than the diameter of the first type of solder ball 23.

[0056] It should be noted that, along the direction perpendicular to the second surface 22, the lengths of the long side and / or short side of the cross section of the second type solder ball 24 at different distances from the second surface 22 may be different. It is only necessary to satisfy that the length of the maximum long side of the second type solder ball 24 is greater than the diameter of the first type solder ball 23, and / or the length of the maximum short side of the second type solder ball 24 is less than the diameter of the first type solder ball 23.

[0057] In other embodiments, the cross-section of the second type solder ball 24 along a direction parallel to the second surface 22 is elliptical, the major axis of the second type solder ball 24 extends along the second direction y, and the length of the major axis of the second type solder ball 24 is greater than the diameter of the first type solder ball 23.

[0058] The length of the minor axis of the second type of solder ball 24 is less than the diameter of the first type of solder ball 23.

[0059] It should be noted that, along the direction perpendicular to the second surface 22, the lengths of the major axis and / or minor axis of the cross section of the second type solder ball 24 at different distances from the second surface 22 may be different. It is only necessary to satisfy that the length of the maximum major axis of the second type solder ball 24 is greater than the diameter of the first type solder ball 23, and / or the length of the maximum minor axis of the second type solder ball 24 is less than the diameter of the first type solder ball 23.

[0060] In specific implementation, the solder ball parameters of the first type of solder ball 23 and the solder ball parameters of the second type of solder ball 24 are determined based on at least one of the following parameters: the number of signal particles in the memory, the signal particle layout of the memory, the trace width of the adapter board, the trace spacing of the adapter board, and the package size of the adapter board.

[0061] The first type of solder ball 23 may include a plurality of first solder balls 231, and the plurality of first solder balls 231 may be arranged in an array along the first direction.

[0062] The solder ball parameters of the first type of solder ball 23 may include the diameter of the first solder ball and the spacing between adjacent first solder balls 231. The spacing between adjacent first solder balls 231 may include the spacing of the first solder balls 231 along a first direction x, or it may include the spacing along a second direction y.

[0063] In some embodiments, the spacing between adjacent first solder balls 231 refers to the spacing between the edges of the first solder balls 231. In this case, the spacing between solder ball groups 240 in the second type of solder balls 24 refers to the spacing between the edges of the two closest second solder balls 241 in two adjacent solder ball groups 240. For example, two adjacent solder ball groups are denoted as the first solder ball group and the second solder ball group. Along the second direction y, the spacing between the first solder ball group and the second solder ball group refers to the spacing between the edges of the second solder balls 241 in the first solder ball group and the second solder ball group that are closest to each other.

[0064] In other embodiments, the spacing between adjacent first solder balls 231 refers to the spacing between the centers of the first solder balls 231. In this case, the spacing between solder ball groups 240 in the second type of solder balls 24 refers to the spacing between the centers of the two closest second solder balls 241 in two adjacent solder ball groups 240. For example, two adjacent solder ball groups are referred to as the first solder ball group and the second solder ball group. Along the second direction y, the spacing between the first solder ball group and the second solder ball group refers to the spacing between the centers of the second solder balls 241 in the first solder ball group and the second solder ball group that are closest to each other.

[0065] In some embodiments, the solder ball parameters of the first type of solder ball 23 and the solder ball parameters of the second type of solder ball 24 may be determined in the following manner.

[0066] Specifically, based on the determined packaging form as a hybrid vertical stacked package, the solder ball parameters of the first type of solder ball 23, as well as the ball pad size and ball pad opening size of the first type of solder ball 23 on the adapter board 2, are determined according to one or more of the following: the number of signal particles of the memory 1, the signal particle layout of the memory 1, the trace width of the adapter board 2, the trace spacing of the adapter board 2, and the package size of the adapter board 2.

[0067] Obtain the chip data information (such as datasheet) of memory 1 and the design requirements of the SOC chip (Die) to determine the package size (PKG Size) of the adapter board 2.

[0068] Based on the lead direction, number and layout of the particle signals on the memory 1, the layout of the first type of solder balls 23 in the first edge region 221 and the second edge region 222 of the adapter board 2, as well as the spacing between adjacent first solder balls 231 in the first type of solder balls 23, are determined.

[0069] The spacing D between adjacent solder ball groups 240 in the second type of solder ball 24 in the second direction y is determined based on the spacing between adjacent first solder balls 231 in the first type of solder ball 23, and the spacing d between adjacent second solder balls 241 in the solder ball group 240 in the second direction y. The spacing D between adjacent solder ball groups 240 is greater than the spacing d between adjacent second solder balls 241 within the solder ball group 240.

[0070] In this case, the spacing between adjacent first solder balls 231 in the first type of solder balls 23 can be the same as the spacing between second solder balls 241 in the solder ball group 240. The spacing between adjacent first solder balls 231 in the first type of solder balls 23 can also be smaller than the spacing between second solder balls 241 in the solder ball group 240.

[0071] In some non-limiting embodiments, the arrangement of the second type of solder balls 241 can be simulated by means of simulation, and the optimal spacing between solder ball groups 240 and the optimal spacing between adjacent second solder balls 241 within solder ball groups 240 can be determined based on the simulation results.

[0072] Based on engineering requirements and Outsourced Semiconductor Assembly and Testing (OSAT) capabilities, the solder ball types for Type I solder ball 23 and Type II solder ball 24 are determined. Solder ball types may include planted balls and electroplated balls. That is, Type I solder ball 23 and Type II solder ball 24 can be formed using an automated planted ball process or an electroplated ball process.

[0073] Combination Figure 9 and Figure 10 Taking the second type of solder ball as an example, the specific process of forming the second type of solder ball using the automatic ball-planting process can include the following steps 91 to 94.

[0074] Step 91: After obtaining the solder ball parameters of the first type of solder ball and the solder ball parameters of the second type of solder ball, design and manufacture the adapter board based on the solder ball parameters of the first type of solder ball and the solder ball parameters of the second type of solder ball.

[0075] Specifically, the ball pad size and ball pad opening size of the first type of solder ball on the adapter plate 2 are determined according to the solder ball parameters, as well as the ball pad size and ball pad opening size of the second type of solder ball.

[0076] When the second type of solder ball has a waist-shaped cross section parallel to the second direction, the long side of the second type of solder ball extends along the second direction, that is, along the flow direction of the mold flow. The long side of the second type of solder ball is larger than the diameter of the first type of solder ball, and the short side of the second type of solder ball is smaller than the diameter of the first type of solder ball.

[0077] When the cross-section of the second type of solder ball is elliptical along the second direction, the major axis of the second type of solder ball extends along the second direction, that is, along the flow direction of the mold flow. The major axis of the second type of solder ball is larger than the diameter of the first type of solder ball, and the minor axis of the second type of solder ball is smaller than the diameter of the first type of solder ball.

[0078] Step 92: Dip the solder ball in flux and drop it onto the corresponding position on the adapter board. Place the solder ball on the corresponding ball pad opening on the adapter board.

[0079] The original shape of the solder ball can be circular, without the need for a special stencil design. Flux is taken from the flux pot 4 and dripped onto the corresponding position on the adapter plate 2, followed by reflow soldering, and then flux cleaning. Flux is then applied again to the corresponding position on the adapter plate 2. (Corresponding to...) Figure 10 Steps 1001 to 1006 in the process.

[0080] Place the solder ball on the solder ball pad opening. (Corresponding to...) Figure 10 Steps 1007 to 1008 in the process.

[0081] Step 93: The interlayer solder balls and the adapter board are reflow soldered at a set temperature to ensure that the interlayer solder balls melt and make complete contact with the copper leakage area corresponding to the adapter board, forming the shape of the second type of solder ball.

[0082] The temperature setting range can be 230℃~237℃.

[0083] Because the long side or major axis of the solder ball pad opening is larger than the diameter of the first type of solder ball, the solder expands along the long side or major axis under the action of surface tension during the reflow process, forming the shape of the second type of solder ball. Corresponding to... Figure 10 Step 1009.

[0084] Step 94: After Flux cleaning, complete the ball placement and check for consistency issues such as solder ball height (SOH) between layers as required.

[0085] Step 94 corresponds to Figure 10 Step 1010.

[0086] Combination Figure 11 and Figure 12 Taking the second type of solder ball as an example, the specific process of forming the second type of solder ball using the automatic ball-planting process can include the following steps 1101 to 1105.

[0087] Step 1101: After obtaining the solder ball parameters of the first type of solder ball and the solder ball parameters of the second type of solder ball, design and manufacture the adapter board based on the solder ball parameters of the first type of solder ball and the solder ball parameters of the second type of solder ball.

[0088] For the specific process of step 1101, please refer to step 91, which will not be repeated here.

[0089] Step 1102: Print "flux" on the adapter plate to facilitate the subsequent electroplating ball process.

[0090] Corresponding to Figure 12 Steps 1201 and 1202. Flux can be printed on the adapter plate 2 manually. For example, flux 7 can be printed through the mesh 51 on the stencil 5.

[0091] Step 1103: Print solder paste on the stencil. The solder paste falls onto the adapter board through the mesh of the stencil.

[0092] The stencil 5 has multiple mesh openings 51. The shape of the mesh openings 51 used to form the first type of solder balls is adapted to the shape of the first type of solder balls, and the shape of the mesh openings 51 used to form the second type of solder balls is adapted to the shape of the second type of solder balls. The solder paste 6 used to form the second type of solder balls is distributed in an oblong or elliptical shape. The solder paste 6 used to form the first type of solder balls is distributed in a circular shape. Corresponding to... Figure 12 Steps 1203 to 1204 in the process.

[0093] Step 1104: The solder paste and the adapter board are reflowed at high temperature. The solder paste is in a molten state and makes complete contact with the corresponding exposed copper area of ​​the adapter board to electroplate a second type of solder ball in the shape of a waist or an oval.

[0094] Because the long side or major axis of the solder ball pad opening is larger than the diameter of the first type of solder ball, during the reflow process, the solder paste 6 expands along the long side or major axis under the action of surface tension, forming the shape of the second type of solder ball. Corresponding to... Figure 12Step 1205 in the process.

[0095] Step 1105: After flux cleaning, complete the ball placement and check for consistency issues such as solder ball height according to the Package Outline Drawing (POD) requirements.

[0096] Step 1105 corresponds to Figure 12 Step 1206 in the process.

[0097] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0098] In the embodiments of this application, "multiple" refers to two or more.

[0099] The descriptions of "first," "second," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described. They have no order and do not indicate any special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0100] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A hybrid vertical stacked packaging structure, characterized in that, include: A memory having signal particles for transmitting signals; An adapter board has a first surface and a second surface disposed opposite to each other. The first surface faces the memory, and the second surface faces the SOC substrate. The second surface is provided with a first type of solder balls arranged along a first direction and a second type of solder balls arranged along a second direction. The first type of solder balls are connected to the signal particles of the memory and are used for signal fan-out of the memory. The second type of solder balls are used to support the adapter board and the SOC substrate. The second type of solder balls has multiple solder ball groups, and each solder ball group includes one or more second solder balls. The spacing between adjacent solder ball groups along the second direction is greater than the spacing between adjacent second solder balls within the solder ball group. The first direction is different from the second direction. The SOC substrate is connected to the first type of solder ball signal.

2. The hybrid vertical stacked packaging structure as described in claim 1, characterized in that, The first direction is perpendicular to the second direction.

3. The hybrid vertical stacked packaging structure as described in claim 1 or 2, characterized in that, The second surface of the adapter plate has opposing first edge regions and second edge regions, with the first type of solder ball located in the first edge regions and the second edge regions; and / or, the second surface of the adapter plate has opposing third edge regions and fourth edge regions, with the second type of solder ball located in the third edge regions and the fourth edge regions.

4. The hybrid vertical stacked packaging structure as described in claim 1, characterized in that, The second type of solder ball has a circular, waist-shaped, or elliptical cross-section along a direction parallel to the second surface.

5. The hybrid vertical stacked packaging structure as described in claim 4, characterized in that, The first type of solder ball is spherical, and the second type of solder ball has an oblong cross-section along the direction parallel to the second surface. The long side of the second type of solder ball extends along the second direction, and the length of the long side of the second type of solder ball is greater than the diameter of the first type of solder ball; or, the second type of solder ball has an elliptical cross-section along the direction parallel to the second surface. The long axis of the second type of solder ball extends along the second direction, and the length of the long axis of the second type of solder ball is greater than the diameter of the first type of solder ball.

6. The hybrid vertical stacked packaging structure as described in claim 5, characterized in that, The second type of solder ball has an oblong cross-section along the direction parallel to the second surface, and the length of the short side of the second type of solder ball is less than the diameter of the first type of solder ball; or, the second type of solder ball has an elliptical cross-section along the direction parallel to the second surface, and the length of the short axis of the second type of solder ball is less than the diameter of the first type of solder ball.

7. The hybrid vertical stacked packaging structure as described in claim 1, characterized in that, The second type of solder ball is formed using an automated ball-planting process; or, the second type of solder ball is formed using an electroplating process.

8. The hybrid vertical stacked packaging structure as described in claim 1, characterized in that, The solder ball parameters of the first type of solder ball and the solder ball parameters of the second type of solder ball are determined based on at least one of the following parameters: the number of signal particles in the memory, the signal particle layout of the memory, the trace width of the adapter board, the trace spacing of the adapter board, and the package size of the adapter board.

9. The hybrid vertical stacked packaging structure as described in claim 1, characterized in that, The second type of solder balls are arranged in one or more columns along the second direction.

10. The hybrid vertical stacked packaging structure as described in claim 9, characterized in that, When the second type of solder balls are distributed in multiple columns along the second direction, for two adjacent columns of second type of solder balls, the distance between adjacent solder ball groups in the column closer to the center of the adapter plate is denoted as the first distance, and the distance between adjacent solder ball groups in the column closer to the edge of the adapter plate is denoted as the second distance. The projection of the first distance along the first direction is covered by the projection of the second distance along the first direction.

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