一种微显示器结构及其生产工艺
By optimizing the manufacturing process of microdisplays and adopting full-surface dispensing and fan-in bonding processes, the problems of large chip size, high cost, low efficiency and low yield in traditional microdisplay structures have been solved, resulting in smaller chip size and higher production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
- Filing Date
- 2023-10-27
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional microdisplay structures suffer from problems such as large chip size, high production cost, low dispensing efficiency, glass cutting damage, and low yield.
The process involves first applying adhesive to the entire surface and then opening the PAD, combined with a fan-in bonding process. Through the optimized design of the overall substrate, including the step-by-step cutting and connection of the wafer layer, driver circuit layer, display unit layer, adhesive layer and glass cover, the influence of adhesive on the solder pads is avoided, the glass cutting process is simplified, and the PCB board size is reduced.
This technology has enabled the reduction of the overall size of microdisplays, lower production costs, improved dispensing efficiency, and increased yield, solving the problems of large chip size, complex dispensing, glass cutting damage, and low yield in traditional processes.
Smart Images
Figure CN117334716B_ABST