Motor assembly, camera module, electronic device, position detection method and device

Abstract

The application discloses a motor assembly, a camera module, an electronic device, a position detection method and device. The motor assembly comprises a first shell, a photosensitive chip arranged in the first shell, the photosensitive chip being capable of moving relative to the first shell, the photosensitive chip being provided with an imaging area, a position detection member arranged in the first shell, the position detection member comprising a second shell connected with the first shell, the second shell being provided with a light transmission part, a light emitter arranged in the second shell, the light emitter being provided with an emitting port, a diffraction grating arranged in the second shell, the diffraction grating being located between the emitting port and the light transmission part, and a pixel unit group arranged in the photosensitive chip, the pixel unit group comprising a first pixel unit and a second pixel unit, the first pixel unit being provided with a plurality of arrayed first light transmission ports, the second pixel unit being provided with a plurality of arrayed second light transmission ports, and the width of the first light transmission port being smaller than the width of the second light transmission port.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, specifically relating to a motor assembly, a camera module, an electronic device, a position detection method and apparatus. Background Technology

[0002] In related technologies, Hall effect sensors are mainly used to detect the position of the photosensitive chip in motors. However, the slope of the magnetic field change generated by the magnet cannot be made very steep, and it is easily affected by temperature, geomagnetic field, assembly deviations, etc., resulting in low detection accuracy of Hall effect sensors, which cannot meet the requirements of super-resolution applications in camera modules. Summary of the Invention

[0003] This application aims to provide a motor assembly, camera module, electronic device, position detection method and apparatus, which solves one of the problems in the related technology where the Hall sensor is used to detect the position of the photosensitive chip in the motor, but the detection accuracy of the Hall sensor is not high, which makes it impossible to meet the super-resolution requirements of the camera module.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application propose a motor assembly, including: a first housing; a photosensitive chip disposed within the first housing, the photosensitive chip being movable relative to the first housing, the photosensitive chip having an imaging area; a position detection element disposed within the first housing, the position detection element including: a second housing connected to the first housing, the second housing having a light-transmitting portion; a light emitter disposed within the second housing, the light emitter having an emission port; a diffraction grating disposed within the second housing, the diffraction grating being located between the emission port and the light-transmitting portion; a pixel unit group disposed within the photosensitive chip, and the pixel unit group being arranged opposite to the diffraction grating, the pixel unit group including a first pixel unit and a second pixel unit, the second pixel unit being located between the imaging area and the first pixel unit, the first pixel unit having a plurality of arrayed first light-transmitting ports, the second pixel unit having a plurality of arrayed second light-transmitting ports; along a direction perpendicular to the first pixel unit to the second pixel unit, the width of the first light-transmitting port is smaller than the width of the second light-transmitting port.

[0005] Secondly, embodiments of this application provide a camera module, including a motor assembly as described in the first aspect.

[0006] Thirdly, embodiments of this application provide an electronic device, including a motor assembly as described in the first aspect; or a camera module as described in the second aspect.

[0007] Fourthly, embodiments of this application propose a method for detecting the position of a photosensitive chip, used in the electronic device described in the third aspect. The method includes: acquiring first position data collected by a first pixel unit and second position data collected by a second pixel unit; and determining the position of the photosensitive chip based on the first position data, the second position data, and preset position data.

[0008] Fifthly, embodiments of this application propose a position detection device for a photosensitive chip, used in the electronic device of the third aspect. The position detection device for the photosensitive chip includes: an acquisition module for acquiring first position data collected by a first pixel unit and second position data collected by a second pixel unit; and a processing module for determining the position of the photosensitive chip based on the first position data, the second position data, and preset position data.

[0009] In a sixth aspect, embodiments of this application propose a readable storage medium having a program or instructions stored thereon, which, when executed by at least one processor, implement the steps of the position detection method for the photosensitive chip in the fourth aspect.

[0010] In embodiments of this application, the motor assembly includes a first housing, a photosensitive chip, and a position detection element. The position detection element includes a second housing, a light emitter, a diffraction grating, and a pixel unit group.

[0011] Both the photosensitive chip and the position detection device are located inside the first housing.

[0012] The second housing of the position detection component is connected to the first housing. The light emitter and diffraction grating are both located within the second housing. The photosensitive chip can move relative to the first housing, and the pixel unit group is disposed within the photosensitive chip. That is, the second housing, light emitter, and diffraction grating are all fixed within the first housing, and none of these components can move relative to the first housing. The pixel unit group can move relative to the first housing under the influence of the photosensitive chip.

[0013] The light emitter has an emission port. When the light emitter is working, the emission port can emit light (such as a laser beam), which serves as the light source. The diffraction grating can diffract the laser beam and adjust the amplitude of the incident light. The light after being diffracted by the diffraction grating has different light intensities at different angles. The light after being diffracted by the diffraction grating is transmitted to the pixel unit group.

[0014] The pixel unit group is located on the photosensitive chip and is positioned opposite to the diffraction grating. That is, the photosensitive chip serves as the mounting carrier for the pixel unit group, functioning to mount and fix it. When the photosensitive chip moves relative to the housing, the pixel unit group also moves accordingly. Furthermore, the pixel unit group and the diffraction grating are positioned opposite each other and spaced apart, thus defining the positional relationship between the pixel unit group and the diffraction grating, providing effective and reliable structural support for the position detection device to accurately detect the position of the photosensitive chip.

[0015] It is understood that the first pixel unit has multiple arrayed first light-transmitting openings, and the second pixel unit has multiple arrayed second light-transmitting openings. The first and second light-transmitting openings are used to allow light formed by the diffraction grating to pass through.

[0016] Under the influence of incident light, a diffraction grating produces a series of equally spaced diffraction orders. Each diffraction maximum corresponds to a graduation line on the vernier scale of a vernier caliper, and the graduation line on the fixed side of the caliper is formed by pixel units on the photosensitive chip. To achieve the mechanism of "detecting the alignment of the vernier graduation line with the fixed graduation line," a portion of the pixel units on the photosensitive chip are fabricated as first pixel units with a narrow light-transmitting surface (i.e., a first light-transmitting aperture). Light can only enter when the diffraction fringes overlap with the narrow light-transmitting surface, thus detecting the local maximum of the diffracted light intensity. Another portion of the pixel units on the photosensitive chip are fabricated as second pixel units with a wide light-transmitting surface (i.e., a second light-transmitting aperture) to detect the global maximum of the diffracted light intensity.

[0017] Along the direction perpendicular to the first pixel unit to the second pixel unit, the width of the first light-transmitting aperture is smaller than the width of the second light-transmitting aperture. That is, the first light-transmitting aperture is narrower, its width being close to the width of a single bright fringe. When a bright fringe falls exactly within the first light-transmitting aperture, it is said that the vernier and pixel have "aligned." The second light-transmitting aperture is wider, and bright fringees are received by the second pixel unit during the movement of the photosensitive chip, without requiring alignment. The first pixel unit can transmit most of the light energy only when "aligned," while the second pixel unit can transmit most of the light energy at all times. The first and second pixel units form an array of multiple first and second light-transmitting apertures. The principle of the position detection device's detection accuracy is the same as that of a vernier caliper. The main scale corresponds to the photosensitive chip, and the vernier scale corresponds to the diffraction fringes. A slight difference appears between the period of the diffraction fringes and the period of the multiple first and second light-transmitting apertures arranged in the pixel unit array, producing an effect similar to that of a vernier caliper. This enables small-scale position detection and improves the detection accuracy of the position detection device.

[0018] Compared with related technologies that use Hall sensors to detect the position of photosensitive chips, the motor assembly of this application has the advantages of a very large detection range, no interference from external magnetic fields, little temperature influence, and no need for linear compensation, which improves detection accuracy, enhances product performance and market competitiveness.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the structure of a camera module according to an embodiment of this application;

[0022] Figure 2 This is a partial structural schematic diagram of a motor assembly according to one embodiment of this application;

[0023] Figure 3 This is an exploded view of a motor assembly according to an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of the first pixel unit and the second pixel unit according to an embodiment of this application;

[0025] Figure 5 This is a schematic diagram of the structure of the first pixel and the second pixel according to an embodiment of this application;

[0026] Figure 6 This is a schematic diagram of the structure of a photosensitive chip and pixel unit group according to an embodiment of this application;

[0027] Figure 7 This is a schematic diagram of the grating diffraction intensity distribution according to an embodiment of this application;

[0028] Figure 8 This is a schematic diagram of the vernier detection principle;

[0029] Figure 9 This is a schematic diagram of the first pixel and the bright stripe in an misaligned state according to an embodiment of this application;

[0030] Figure 10 This is a schematic diagram of the second pixel and the bright stripe in an misaligned state according to an embodiment of this application;

[0031] Figure 11 This is a schematic diagram of the first pixel and the bright stripe in an aligned state according to an embodiment of this application;

[0032] Figure 12 This is a schematic diagram of the second pixel and the bright stripe in an aligned state according to an embodiment of this application;

[0033] Figure 13 This is a schematic diagram of the detection signal of the second pixel unit in an embodiment of this application when the displacement is 0 μm;

[0034] Figure 14 This is a schematic diagram of the detection signal of the second pixel unit in an embodiment of this application when the displacement is 0.1 μm;

[0035] Figure 15 This is a schematic diagram of the detection signal of the second pixel unit in an embodiment of this application when the displacement is 0.2 μm;

[0036] Figure 16 This is a schematic diagram of the detection signal of the second pixel unit in an embodiment of this application when the displacement is 0.3 μm;

[0037] Figure 17 This is a schematic diagram of the detection signal of the first pixel unit in an embodiment of this application when the displacement is 0 μm;

[0038] Figure 18 This is a schematic diagram of the detection signal of the first pixel unit in an embodiment of this application when the displacement is 0.1 μm;

[0039] Figure 19 This is a schematic diagram of the detection signal of the first pixel unit in an embodiment of this application when the displacement is 0.2 μm;

[0040] Figure 20 This is a schematic diagram of the detection signal of the first pixel unit in an embodiment of this application when the displacement is 0.3 μm;

[0041] Figure 21 A flowchart illustrating a position detection method for a photosensitive chip according to some embodiments of this application is shown;

[0042] Figure 22 A structural block diagram of a photosensitive chip position detection device according to some embodiments of this application is shown.

[0043] Figure label:

[0044] Figures 1 to 6 , Figures 9 to 12 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0045] 10 Motor assembly, 100 First housing, 200 Photosensitive chip, 210 Imaging area, 2102 First side, 2104 Second side, 220 Isolation area, 300 Position detection component, 310 Second housing, 312 Light-transmitting part, 320 Light emitter, 322 Emission port, 330 Diffraction grating, 340 Pixel unit group, 342 First pixel unit, 3422 First light-transmitting port, 3424 First pixel, 344 Second pixel unit, 3442 Second light-transmitting port, 3444 Second pixel, 350 Lens, 360 Microlens, 370 Support, 40 Camera module, 400 Middle layer carrier, 500 First coil, 600 First steel sheet, 700 First magnet, 800 Second steel sheet, 900 Bottom layer carrier, 1000 Second magnet, 1100 Second coil. Detailed Implementation

[0046] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0047] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0048] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] The following is combined Figures 1 to 22 This application describes a motor assembly 10, a camera module 40, an electronic device, a position detection method, and an apparatus according to embodiments thereof.

[0051] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a motor assembly 10 according to some embodiments of this application includes: a first housing 100; a photosensitive chip 200 disposed within the first housing 100, the photosensitive chip 200 being movable relative to the first housing 100, the photosensitive chip 200 having an imaging area 210; a position detection element 300 disposed within the first housing 100, the position detection element 300 including: a second housing 310 connected to the first housing 100, the second housing 310 having a light-transmitting portion 312; a light emitter 320 disposed within the second housing 310, the light emitter 320 having an emission port 322; and a diffraction grating 330 disposed within the second housing 310, the diffraction grating 330 being located within the second housing 310. Between the emission port 322 and the light-transmitting portion 312; a pixel unit group 340 is disposed on the photosensitive chip 200, and the pixel unit group 340 is disposed opposite to the diffraction grating 330. The pixel unit group 340 includes a first pixel unit 342 and a second pixel unit 344. The second pixel unit 344 is located between the imaging area 210 and the first pixel unit 342. The first pixel unit 342 is provided with a plurality of arrayed first light-transmitting ports 3422, and the second pixel unit 344 is provided with a plurality of arrayed second light-transmitting ports 3442. Along the direction perpendicular to the first pixel unit 342 to the second pixel unit 344, the width of the first light-transmitting port 3422 is smaller than the width of the second light-transmitting port 3442.

[0052] In embodiments of this application, the motor assembly 10 includes a first housing 100, a photosensitive chip 200, and a position detection element 300. The position detection element 300 includes a second housing 310, a light emitter 320, a diffraction grating 330, and a pixel unit group 340.

[0053] The photosensitive chip 200 and the position detection component 300 are both located inside the first housing 100.

[0054] The second housing 310 of the position detection unit 300 is connected to the first housing 100. The light emitter 320 and the diffraction grating 330 are both located within the second housing 310. The photosensitive chip 200 is movable relative to the first housing 100, and the pixel unit group 340 is disposed within the photosensitive chip 200. That is, the second housing 310, the light emitter 320, and the diffraction grating 330 are all fixed within the first housing 100, and none of these three components can move relative to the first housing 100. The pixel unit group 340 can move relative to the first housing 100 under the influence of the photosensitive chip 200.

[0055] The light emitter 320 is equipped with an emission port 322. When the light emitter 320 is working, the emission port 322 can emit a laser beam, which serves as a light source. The diffraction grating 330 can diffract the laser beam and adjust the amplitude of the incident light. The light diffracted by the diffraction grating 330 has different light intensities at different angles. The light diffracted by the diffraction grating 330 is transmitted to the pixel unit group 340.

[0056] Pixel unit group 340 is disposed on photosensitive chip 200, and pixel unit group 340 is disposed opposite to diffraction grating 330. That is, photosensitive chip 200 serves as a mounting carrier for pixel unit group 340, and has the function of mounting and fixing pixel unit group 340. When photosensitive chip 200 moves relative to the housing, pixel unit group 340 also moves accordingly. In addition, the pixel unit group and diffraction grating 330 are disposed opposite to each other and spaced apart, that is, the positional relationship between pixel unit group 340 and diffraction grating 330 is defined, providing effective and reliable structural support for position detection element 300 to accurately detect the position of photosensitive chip 200.

[0057] It is understood that the first pixel unit 342 has multiple arrayed first light-transmitting ports 3422, and the second pixel unit 344 has multiple arrayed second light-transmitting ports 3442. The first light-transmitting ports 3422 and the second light-transmitting ports 3442 are used to allow light formed by the diffraction grating 330 to pass through.

[0058] like Figure 7 and Figure 8As shown, the diffraction grating 330 generates a series of equally spaced diffraction orders under the action of incident light. Each diffraction maximum point corresponds to a graduation line on one side of the vernier scale on a vernier caliper, and the graduation line on the fixed side of the vernier caliper is composed of pixel unit groups 340 on the photosensitive chip 200. In order to realize the mechanism of "detecting the alignment of the vernier graduation line with the fixed graduation line", a portion of the pixel units on the photosensitive chip 200 is made into a first pixel unit 342 with a narrow light-transmitting surface (i.e., a first light-transmitting aperture 3422). Light can only enter when the diffraction fringes overlap with the narrow light-transmitting surface, that is, to detect the local maximum point of diffraction light intensity. Another portion of the pixel units on the photosensitive chip 200 is made into a second pixel unit 344 with a wide light-transmitting surface (i.e., a second light-transmitting aperture 3442) to detect the global maximum point of diffraction light intensity.

[0059] like Figure 5 , Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, along the direction perpendicular to the first pixel unit 342 to the second pixel unit 344, the width d1 of the first light-transmitting aperture 3422 is smaller than the width d2 of the second light-transmitting aperture 3442. That is, the width of the first light-transmitting aperture 3422 is narrower, close to the width of a single bright stripe. When a bright stripe falls exactly within the first light-transmitting aperture 3422, it is said that the cursor and pixel have "aligned". The width of the second light-transmitting aperture 3442 is wider, and the bright stripe is received by the second pixel unit 344 during the movement of the photosensitive chip 200, without the need for alignment. The first pixel unit 342 can transmit most of the light energy only when "alignment" occurs, while the second pixel unit 344 can transmit most of the light energy at all times. The first pixel unit 342 and the second pixel unit 344 form an array of multiple first light-transmitting ports 3422 and multiple second light-transmitting ports 3442. The principle of the detection accuracy of the position detection element 300 is the same as that of a vernier caliper. The main scale corresponds to the photosensitive chip 200, and the vernier scale corresponds to the diffraction fringes. This can cause a slight difference between the diffraction fringes interval and the period of the multiple first light-transmitting ports 3422 and multiple second light-transmitting ports 3442 arranged in the pixel unit group 340 array, producing an effect similar to that of a vernier caliper. This enables small-scale position detection and improves the detection accuracy of the position detection element 300.

[0060] The direction perpendicular to the first pixel unit 342 to the second pixel unit 344 can be understood as the direction of movement of the photosensitive chip 200.

[0061] Compared with related technologies that use Hall sensors to detect the position of photosensitive chips, the motor assembly 10 of this application has the advantages of a very large detection range, no interference from external magnetic fields, little temperature influence, and no need for linear compensation, which improves detection accuracy and enhances the performance and market competitiveness of the product.

[0062] Optionally, d1 ≤ 0.1 × d2. This allows for the vernier effect, ensuring detection accuracy. If d1 > 0.1 × d2, the detection accuracy is significantly reduced. Examples of such values ​​include d1 = 0.02 × d2, d1 = 0.04 × d2, d1 = 0.06 × d2, d1 = 0.08 × d2, etc., which will not be listed here.

[0063] Optionally, the light emitter 320 includes a laser emitter.

[0064] In some embodiments, such as Figure 6 As shown, the imaging area 210 has a first side 2102 and a second side 2104 arranged adjacent to each other, with the first side 2102 perpendicular to the second side 2104; there are two pixel unit groups 340, one pixel unit group 340 is located on the first side 2102 of the imaging area 210, and the other pixel unit group 340 is located on the second side 2104 of the imaging area 210.

[0065] In this embodiment, the number of pixel unit groups 340 is defined as two. The imaging region 210 has a first side 2102 and a second side 2104, the first side 2102 and the second side 2104 of the imaging region 210 are arranged adjacent to each other, and the first side 2102 of the imaging region 210 is perpendicular to the second side 2104 of the imaging region 210.

[0066] In this configuration, one of the two pixel unit groups 340 is located on the first side 2102 of the imaging area 210, and the other pixel unit group 340 is located on the second side 2104 of the imaging area 210. That is, the two pixel unit groups 340 are located on different sides of the imaging area 210. Regardless of whether the pixel unit group 340 is located on the first side 2102 or the second side 2104, the second pixel unit 344 of the pixel unit group 340 is located between the imaging area 210 and the first pixel unit 342.

[0067] This configuration allows the position detection component 300 to detect the position of the photosensitive chip 200 from multiple dimensions and directions, providing effective and reliable structural support to ensure the detection accuracy of the product.

[0068] It is understandable that, such as Figure 6 As shown, the photosensitive chip 200 can move along the X-axis and also along the Y-axis.

[0069] In some other embodiments, the imaging region 210 further has a third side and a fourth side, with the first side 2102 and the third side disposed opposite to each other, and the second side 2104 and the fourth side disposed opposite to each other. At least one of the first side 2102 and the third side of the imaging region 210 is provided with a pixel unit group 340, and / or at least one of the second side 2104 and the fourth side of the imaging region 210 is provided with a pixel unit group 340. The third side is parallel to the first side 2102, and the second side 2104 is parallel to the fourth side.

[0070] In some embodiments, such as Figure 4 and Figure 5 As shown, the first pixel unit 342 includes a plurality of first pixels 3424 arranged in an array, each first pixel 3424 having a first light-transmitting opening 3422. The second pixel unit 344 includes a plurality of second pixels 3444 arranged in an array, each second pixel 3444 having a second light-transmitting opening 3442.

[0071] In this embodiment, the structures of the first pixel unit 342 and the second pixel unit 344 are further defined such that the first pixel unit 342 includes a plurality of first pixels 3424, which are arranged in an array, and each first pixel 3424 is provided with a first light-transmitting opening 3422. Similarly, the second pixel unit 344 includes a plurality of second pixels 3444, which are arranged in an array, and each second pixel 3444 is provided with a second light-transmitting opening 3442.

[0072] In some embodiments, such as Figure 6 As shown, the photosensitive chip 200 also has an isolation region 220, which is located between the second pixel unit 344 and the imaging region 210.

[0073] In this embodiment, the photosensitive chip 200 also includes an isolation region 220, which is located between the second pixel unit 344 and the imaging region 210. The isolation region 220 can also be referred to as an invalid region. The function of the isolation region 220 is to isolate the second pixel unit 344 and the imaging region 210, thereby preventing light crosstalk and ensuring detection accuracy. Optionally, the isolation region 220 is provided with a light-shielding layer.

[0074] Optionally, the isolation zone 220 can receive light, but cannot perform photoelectric conversion and cannot generate a corresponding electrical signal, thus ensuring detection accuracy.

[0075] In some embodiments, such as Figure 6 As shown, the isolation zone 220 is a ring-shaped zone, which surrounds the imaging zone 210.

[0076] In this embodiment, the cooperative structure of the isolation region 220 and the imaging region 210 is further defined such that the isolation region 220 is a ring-shaped region, surrounding the imaging region 210. This allows for effective isolation of the imaging region 210 and the second pixel unit 344 in all directions and at all angles, providing structural support to avoid signal interference.

[0077] In some embodiments, such as Figure 2 and Figure 3 As shown, the position detection device 300 also includes a lens 350 located between the emission port 322 and the diffraction grating 330.

[0078] In this embodiment, the structure of the position detection element 300 is further defined such that the position detection element 300 also includes a lens 350, which is located between the emission port 322 and the diffraction grating 330. The lens 350 is used to convert the light emitted by the light emitter 320 from divergent light into parallel light, so that the light can be transmitted parallel to the diffraction grating 330.

[0079] In some embodiments, the light emitter 320 is a vertical-cavity surface-emitting light emitter, and the light emitted by the vertical-cavity surface-emitting light emitter is parallel light that can be transmitted parallel to the diffraction grating 330. That is, when the light emitter 320 is a vertical-cavity surface-emitting light emitter, the position detection element 300 may not include the lens 350.

[0080] In this embodiment, the lens 350 protrudes toward the direction of the diffraction grating 330.

[0081] In some other embodiments, the lens 350 protrudes toward the light emitter 320.

[0082] In some embodiments, such as Figure 2 and Figure 3 As shown, the position detection device 300 also includes a microlens 360, which is disposed between the diffraction grating 330 and the photosensitive chip 200.

[0083] In this embodiment, the structure of the position detection element 300 is further defined such that the position detection element 300 also includes a microlens 360, which is located between the diffraction grating 330 and the photosensitive chip 200. The microlens 360 is used to converge the diffracted light onto the surface of the photosensitive chip 200 to form diffraction fringes. That is, the microlens 360 has the function of focusing light onto the photosensitive chip 200 to form bright fringes.

[0084] Optionally, along the direction of movement of the photosensitive chip 200, the width of the first light-transmitting aperture 3422 is greater than or equal to the width of a bright stripe.

[0085] In some embodiments, such as Figure 3As shown, the position detection component 300 also includes a bracket 370, which is disposed within the second housing 310. The bracket 370 is located between the diffraction grating 330 and the photosensitive chip 200, and the microlens 360 is disposed on the bracket 370.

[0086] In this embodiment, the position detection element 300 further includes a bracket 370 located within the second housing 310. The bracket 370 cannot move relative to the first housing 100. The bracket 370 is located between the diffraction grating 330 and the photosensitive chip 200, and a microlens 360 is disposed on the bracket 370. The bracket 370 supports and fixes the microlens 360, ensuring the proper fit between the microlens 360, the diffraction grating 330, and the photosensitive chip 200, so that the diffracted light can be focused onto the surface of the photosensitive chip 200 to form diffraction fringes.

[0087] like Figure 1 As shown, a camera module 40 according to some embodiments of this application includes a motor assembly 10 as described in any of the above embodiments.

[0088] The camera module 40 provided in this application includes the motor assembly 10 as described in any of the above embodiments, and therefore has all the beneficial effects of the motor assembly 10, which will not be described in detail here.

[0089] Optionally, such as Figure 1 As shown, the camera module 40 also includes a lens, and the motor assembly 10 includes a middle carrier 400, a first coil 500, a first steel sheet 600, a first magnet 700, a second steel sheet 800, a bottom carrier 900, a second magnet 1000, and a second coil 1100. The first coil 500 is an automatic focus (AF) coil, and it works in conjunction with the first magnet 700. The second coil 1100 is an optical image stabilizer (OIS) coil, and it works in conjunction with the second magnet 1000.

[0090] like Figure 1 As shown, an electronic device according to some embodiments of this application includes: a motor assembly 10 as in any embodiment; or a camera module 40 as in the above embodiments.

[0091] The electronic device provided in this application includes the motor assembly 10 or the camera module 40 as described in any of the above embodiments, and therefore has all the beneficial effects of the motor assembly 10 or the camera module 40, which will not be described in detail here.

[0092] Alternatively, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR device), a virtual reality device (also known as a VR device), and a handheld game console, etc.

[0093] Optionally, this application provides a light source (i.e., a light emitter 320) and a diffraction grating 330 on the stator (i.e., the second housing 310) of the motor assembly 10, and provides two pixel unit groups 340 on the photosensitive chip 200 that is moving in translation, so that a vernier effect is generated between the grating diffraction fringes and the pixel unit groups 340, thereby achieving position detection at a scale of 0.1μm or even smaller.

[0094] Compared with the Hall sensor detection scheme in related technologies, the motor assembly 10 of this application has the advantages of large detection range, no interference from external magnetic field, little temperature influence, and no need for linear compensation.

[0095] Under perpendicularly incident light, the diffraction grating 330 produces a series of equally spaced diffraction orders. These orders, after passing through the lens 350, transmit extremely fine fringes. By carefully designing the parameters of the diffraction grating 330, a slight difference can be created between the diffraction fringe spacing and the pixel array period on the photosensitive chip 200, producing an effect similar to a vernier caliper. If the pixel size is 1μm and the grating fringe spacing is 0.9μm, the position detection accuracy can be improved tenfold, reaching 0.1μm. If the difference between the grating fringe and the pixel size is further reduced, the position detection accuracy will be further improved.

[0096] The position detection component 300 of this application includes a light emitter 320, a lens 350, a diffraction grating 330, a support 370, a microlens 360, and a pixel unit group 340.

[0097] like Figure 3 As shown, the second housing 310, light emitter 320, lens 350, diffraction grating 330, support 370, and microlens 360 are all disposed on the stator of the motor assembly 10, and the pixel unit group 340 is disposed on the mover (i.e., photosensitive chip 200) of the motor assembly 10. For the motor assembly 10, the mover includes the photosensitive chip 200 and its adhered plastic and / or ceramic structural components.

[0098] The second housing 310 is the outer shell of the light emitter 320, lens 350, diffraction grating 330, support 370 and microlens 360. The second housing 310 is attached to the inner wall of the first housing 100. The second housing 310 can also be used as an injection-molded insert.

[0099] Light emitter 320: Light emitter 320 includes a laser emitter for emitting a laser beam downward as a light source.

[0100] Lens 350: After passing through lens 350, the laser light changes from divergent light to parallel light and is transmitted parallel to the diffraction grating 330.

[0101] Diffraction grating 330: The diffraction grating 330 diffracts the laser beam. The light diffracted by the diffraction grating 330 has different light intensities at different angles. It needs to be focused onto the imaging area 210 of the photosensitive chip 200 by the microlens 360 to form stripes.

[0102] Support 370: Used to support microlens 360.

[0103] Microlens 350 (i.e., microlens 360): focuses the diffracted light onto the surface of the photosensitive chip 200 to form diffraction fringes.

[0104] Pixel unit group 340: The special receiving area on the photosensitive chip 200 includes a vernier detection pixel (i.e., the first pixel 3424) and a peak detection pixel (i.e., the second pixel 3444). The peak detection pixel is used for coarse positioning to find the maximum value point in the center of the entire diffraction pattern. The vernier detection pixel is responsible for fine positioning. As the photosensitive chip 200 moves, the peak point received by the vernier detection pixel will move at a speed many times faster than the moving speed of the photosensitive chip 200, thereby achieving ultra-high precision position detection.

[0105] like Figure 7 As shown, each diffraction maximum point in the diagram corresponds to a graduation line on one side of the vernier scale on a vernier caliper, while the graduation line on the fixed side of the vernier caliper is formed by pixels on the photosensitive chip 200. To achieve the mechanism of "detecting the alignment of the vernier graduation line with the fixed graduation line," a portion of the pixels on the photosensitive chip 200 need to be fabricated with narrow light-transmitting surfaces (i.e., the first light-transmitting aperture 3422). Light can only enter when the grating diffraction fringes overlap with the narrow light-transmitting surface, thus detecting the local maxima of diffracted light intensity. Additionally, a set of pixels with wide light-transmitting surfaces (i.e., the second light-transmitting aperture 3442) is needed to detect the global maximum point of diffracted light intensity.

[0106] Figure 9 This is a schematic diagram showing the first pixel 3424 and the bright stripe in an misaligned state. Figure 10 This is a schematic diagram showing the second pixel 3444 and the bright stripe in an misaligned state. Figure 11 This is a schematic diagram showing the alignment of the first pixel 3424 with the bright stripe. Figure 12 This is a schematic diagram showing the second pixel 3444 aligned with the bright stripe. Figures 9 to 12 The arrows in the diagram indicate the path of light propagation.

[0107] Pixel detection by the vernier: The first light-transmitting aperture 3422 should be as narrow as possible. The width of the first light-transmitting aperture 3422 is close to the width of a single bright fringe of the diffraction pattern. When a bright fringe falls exactly into the first light-transmitting aperture 3422, it is said that the vernier and the pixel have been "aligned".

[0108] Peak detection pixel: The second light-transmitting aperture 3442 should be as wide as possible. Bright stripes will be received by the peak detection pixel for most of the time when the photosensitive chip 200 is moving, so alignment is not required.

[0109] Vernier detection array (i.e., first pixel unit 342): an array composed of vernier detection pixels.

[0110] Peak detection array (i.e., second pixel unit 344): an array composed of peak detection pixels.

[0111] The density of light rays represents relative illuminance; see [link to documentation] for the case of light passing through two types of pixels. Figures 9 to 12 Vernier detection pixels transmit most of the light energy only when "alignment" occurs, while peak detection pixels transmit most of the light energy at all times. The principle of using an array of these two types of pixels to improve position detection accuracy is the same as that of a vernier caliper. Figure 8 As shown, the main scale corresponds to the photosensitive chip 200, and the vernier scale corresponds to the diffraction fringes.

[0112] X-axis vernier detection array: accurately detects X-axis motion.

[0113] X-axis peak detection array: performs coarse detection of X-axis position.

[0114] Y-axis vernier detection array: accurately detects Y-axis motion.

[0115] Y-axis peak detection array: performs coarse detection of the Y-axis position.

[0116] Invalid region (i.e., isolation region 220): isolates the peak detection array from the imaging region 210 to prevent cross-lighting.

[0117] Compared with the Hall sensor detection scheme in related technologies, this application has the following advantages:

[0118] 1. Extremely large detection range: The detection range of a Hall sensor is limited by the length of the linear region of the magnetic field. The change curve of the magnetic field generated by the magnet along the direction of motion is approximately S-shaped, and only the linear monotonic region in the middle can be used for position detection. However, the detection range of the position detection element 300 is unlimited; it can detect any position covered by the pixel unit group 340.

[0119] 2. Unaffected by external magnetic fields: Hall sensors are highly susceptible to interference from external magnetic fields. Even a weak magnetic field like the Earth's magnetic field can cause position detection errors at the 1µm level. This application is unaffected by external magnetic fields.

[0120] 3. Less affected by temperature: Since the magnetic field of a magnet is related to temperature, the ambient temperature will affect the position detection results, but this application is not affected by temperature.

[0121] 4. No linear compensation required: Hall sensors require linear compensation of the S-shaped magnetic field change curve to obtain accurate position coordinates. The accuracy of position detection is affected by the accuracy of linear compensation, which in turn is affected by many process factors. This application, however, does not require linear compensation.

[0122] Furthermore, this application can improve the sharpness of the diffraction fringes by optimizing the grating parameters and the shape of the lens 350. This application does not require the fabrication of an ultra-high flatness interference cavity, nor does it use a high-precision interference cavity, thus improving the feasibility of the process. At the same time, since there is no need for an interference cavity, the light source side and the receiving side are completely separable, and the assembly error requirements for the tilt angle between each stage of the optical path are not strict, high-precision assembly or limiting between the mover and stator of the motor assembly 10 is not required, allowing for greater freedom in structural design.

[0123] In some embodiments of this application, a method for detecting the position of a photosensitive chip is provided for use in the electronic devices described above. Figure 21 Flowcharts of position detection methods for photosensitive chips according to some embodiments of this application are shown, such as... Figure 21 As shown, the position detection method for the photosensitive chip includes:

[0124] Step 2102: Obtain the first position data collected by the first pixel unit and the second position data collected by the second pixel unit;

[0125] Step 2104: Determine the position of the photosensitive chip based on the first position data, the second position data, and the preset position data.

[0126] In this embodiment, the pixel unit group includes a first pixel unit and a second pixel unit. The first pixel unit has a plurality of first light-transmitting openings arranged in an array, and the second pixel unit has a plurality of second light-transmitting openings arranged in an array. The first and second light-transmitting openings are used to allow light formed by the diffraction grating to pass through.

[0127] Under the influence of incident light, a diffraction grating produces a series of equally spaced diffraction orders. Each diffraction maximum corresponds to a graduation line on the vernier scale of a vernier caliper, and the graduation line on the fixed side of the caliper is formed by pixel units on the photosensitive chip. To achieve the mechanism of "detecting the alignment of the vernier graduation line with the fixed graduation line," a portion of the pixel units on the photosensitive chip are fabricated as first pixel units with a narrow light-transmitting surface (i.e., a first light-transmitting aperture). Light can only enter when the diffraction fringes overlap with the narrow light-transmitting surface, thus detecting the local maximum of the diffracted light intensity. Another portion of the pixel units on the photosensitive chip are fabricated as second pixel units with a wide light-transmitting surface (i.e., a second light-transmitting aperture) to detect the global maximum of the diffracted light intensity.

[0128] Along the direction perpendicular to the first pixel unit to the second pixel unit, the width of the first light-transmitting aperture is smaller than the width of the second light-transmitting aperture. That is, the first light-transmitting aperture is narrower, its width being close to the width of a single bright stripe. When a bright stripe falls exactly within the first light-transmitting aperture, it is said that the cursor and pixel have "aligned." The second light-transmitting aperture is wider, and bright stripes are received by the second pixel unit during the movement of the photosensitive chip, without requiring alignment. The first pixel unit can transmit most of the light energy only when "alignment" occurs, while the second pixel unit can transmit most of the light energy at all times.

[0129] The first pixel unit and the second pixel unit form an array of multiple first light-transmitting ports and multiple second light-transmitting ports. The principle of the position detection accuracy is the same as that of a vernier caliper. The main scale corresponds to the photosensitive chip, and the vernier scale corresponds to the diffraction fringes. This can cause a slight difference between the diffraction fringes interval and the period of the multiple first light-transmitting ports and multiple second light-transmitting ports arranged in the pixel unit array, producing an effect similar to that of a vernier caliper.

[0130] In other words, the position of the photosensitive chip can be determined based on the first position data collected by the first pixel unit, the second position data collected by the second pixel unit, and the preset position data, which enables small-scale position detection and improves the detection accuracy of position detection.

[0131] In some embodiments, determining the position of the photosensitive chip based on first position data, second position data, and preset position data specifically includes: fitting a first data distribution map based on the first position data, wherein each first data in the first data distribution map corresponds to a first pixel of a first pixel unit; fitting a second data distribution map based on the second position data, wherein each second data in the second data distribution map corresponds to a second pixel of a second pixel unit; the preset position data corresponds to a third data distribution map; and determining the position of the photosensitive chip based on the first data distribution map, the second data distribution map, and the third data distribution map.

[0132] In this embodiment, the step of determining the position of the photosensitive chip based on the first position data, the second position data, and the preset position data is further defined.

[0133] A first data distribution map is formed by fitting data from a first location. The first data distribution map includes multiple first data points, and each first data point in the first data distribution map corresponds to a first pixel of a first pixel unit. A second data distribution map is formed by fitting data from a second location. The second data distribution map includes multiple second data points, and each second data point in the second data distribution map corresponds to a second pixel of a second pixel unit.

[0134] Figure 13 This is the second data distribution diagram when the displacement is equal to 0 μm. Figure 14 This is the second data distribution plot when the displacement is equal to 0.1 μm. Figure 15 This is the second data distribution diagram when the displacement is equal to 0.2 μm. Figure 16 This is the second data distribution diagram when the displacement is equal to 0.3 μm. Figure 17 This is the first data distribution diagram when the displacement is equal to 0 μm. Figure 18 This is the second data distribution plot when the displacement is equal to 0.1 μm. Figure 19 This is the second data distribution diagram when the displacement is equal to 0.2 μm. Figure 20 This is the second data distribution diagram when the displacement is equal to 0.3 μm.

[0135] Understandably, the special receiving area on the photosensitive chip includes a vernier detection pixel (i.e., the first pixel) and a peak detection pixel (i.e., the second pixel). The peak detection pixel is used for coarse positioning to find the maximum value point in the center of the entire diffraction pattern. The vernier detection pixel is responsible for fine positioning. As the photosensitive chip moves, the peak point received by the vernier detection pixel will move at a speed many times faster than the moving speed of the photosensitive chip, thereby achieving ultra-high precision position detection.

[0136] In other words, the location of the photosensitive chip can be accurately determined based on the first data distribution map, the second data distribution map, and the third data distribution map.

[0137] In some embodiments, acquiring first position data collected by the first pixel unit and second position data collected by the second pixel unit specifically includes: acquiring first position data collected by the first pixel unit on the first side of the imaging area of ​​the photosensitive chip, first position data collected by the first pixel unit on the second side of the imaging area of ​​the photosensitive chip, second position data collected by the second pixel unit on the first side of the imaging area of ​​the photosensitive chip, and second position data collected by the second pixel unit on the second side of the imaging area of ​​the photosensitive chip.

[0138] In this embodiment, the steps of acquiring the first position data collected by the first pixel unit and the second position data collected by the second pixel unit are further defined.

[0139] The imaging area has a first side and a second side, the first side and the second side of the imaging area are arranged adjacent to each other, and the first side of the imaging area is perpendicular to the second side of the imaging area.

[0140] There are two pixel unit groups. One pixel unit group is located on the first side of the imaging area, and the other pixel unit group is located on the second side of the imaging area. That is, the two pixel unit groups are located on different sides of the imaging area. Regardless of whether the pixel unit group is located on the first side or the second side, the second pixel unit of the pixel unit group is located between the imaging area and the first pixel unit.

[0141] By acquiring the first position data collected from the first pixel unit on both sides of the imaging area, and acquiring the second position data collected from the second pixel unit on both sides of the imaging area, the position of the photosensitive chip can be detected from multiple dimensions and multiple directions (such as the X-axis direction and the Y-axis direction) to ensure the detection accuracy of the product.

[0142] In some embodiments of this application, a position detection device 2200 for a photosensitive chip is provided. Figure 22 Structural block diagrams of position detection devices for photosensitive chips according to some embodiments of this application are shown, such as... Figure 22 As shown, the electronic device includes a position detection device 2200 for a photosensitive chip, and the position detection device 2200 for the photosensitive chip includes:

[0143] The acquisition module 2202 is used to acquire the first position data collected by the first pixel unit and the second position data collected by the second pixel unit;

[0144] The processing module 2204 is used to determine the position of the photosensitive chip based on the first position data, the second position data and the preset position data.

[0145] The photosensitive chip position detection device 2200 of this application embodiment includes an acquisition module 2202 and a processing module 2204.

[0146] The pixel unit group includes a first pixel unit and a second pixel unit. The first pixel unit has multiple first light-transmitting openings arranged in an array, and the second pixel unit has multiple second light-transmitting openings arranged in an array. The first and second light-transmitting openings are used to allow light rays formed by the diffraction grating to pass through.

[0147] Under the influence of incident light, a diffraction grating produces a series of equally spaced diffraction orders. Each diffraction maximum corresponds to a graduation line on the vernier scale of a vernier caliper, and the graduation line on the fixed side of the caliper is formed by pixel units on the photosensitive chip. To achieve the mechanism of "detecting the alignment of the vernier graduation line with the fixed graduation line," a portion of the pixel units on the photosensitive chip are fabricated as first pixel units with a narrow light-transmitting surface (i.e., a first light-transmitting aperture). Light can only enter when the diffraction fringes overlap with the narrow light-transmitting surface, thus detecting the local maximum of the diffracted light intensity. Another portion of the pixel units on the photosensitive chip are fabricated as second pixel units with a wide light-transmitting surface (i.e., a second light-transmitting aperture) to detect the global maximum of the diffracted light intensity.

[0148] Along the direction perpendicular to the first pixel unit to the second pixel unit, the width of the first light-transmitting aperture is smaller than the width of the second light-transmitting aperture. That is, the first light-transmitting aperture is narrower, its width being close to the width of a single bright stripe. When a bright stripe falls exactly within the first light-transmitting aperture, it is said that the cursor and pixel have "aligned." The second light-transmitting aperture is wider, and bright stripes are received by the second pixel unit during the movement of the photosensitive chip, without requiring alignment. The first pixel unit can transmit most of the light energy only when "alignment" occurs, while the second pixel unit can transmit most of the light energy at all times.

[0149] The first pixel unit and the second pixel unit form an array of multiple first light-transmitting ports and multiple second light-transmitting ports. The principle of the position detection accuracy is the same as that of a vernier caliper. The main scale corresponds to the photosensitive chip, and the vernier scale corresponds to the diffraction fringes. This can cause a slight difference between the diffraction fringes interval and the period of the multiple first light-transmitting ports and multiple second light-transmitting ports arranged in the pixel unit array, producing an effect similar to that of a vernier caliper.

[0150] In other words, the processing module 2204 can determine the position of the photosensitive chip based on the first position data, the second position data and the preset position data obtained by the acquisition module 2202, thereby achieving small-scale position detection and improving the detection accuracy of position detection.

[0151] In some embodiments, the processing module 2204 is configured to: fit a first data distribution map based on first location data, wherein each first data in the first data distribution map corresponds to a first pixel of a first pixel unit; fit a second data distribution map based on second location data, wherein each second data in the second data distribution map corresponds to a second pixel of a second pixel unit; a third data distribution map corresponds to preset location data; and determine the location of the photosensitive chip based on the first data distribution map, the second data distribution map, and the third data distribution map.

[0152] In this embodiment, the function of the processing module 2204 is further defined.

[0153] A first data distribution map is formed by fitting data from a first location. The first data distribution map includes multiple first data points, and each first data point in the first data distribution map corresponds to a first pixel of a first pixel unit. A second data distribution map is formed by fitting data from a second location. The second data distribution map includes multiple second data points, and each second data point in the second data distribution map corresponds to a second pixel of a second pixel unit.

[0154] Figure 13 This is the second data distribution diagram when the displacement is equal to 0 μm. Figure 14 This is the second data distribution plot when the displacement is equal to 0.1 μm. Figure 15 This is the second data distribution diagram when the displacement is equal to 0.2 μm. Figure 16 This is the second data distribution diagram when the displacement is equal to 0.3 μm. Figure 17 This is the first data distribution diagram when the displacement is equal to 0 μm. Figure 18 This is the second data distribution plot when the displacement is equal to 0.1 μm. Figure 19 This is the second data distribution diagram when the displacement is equal to 0.2 μm. Figure 20 This is the second data distribution diagram when the displacement is equal to 0.3 μm.

[0155] Understandably, the special receiving area on the photosensitive chip includes a vernier detection pixel (i.e., the first pixel) and a peak detection pixel (i.e., the second pixel). The peak detection pixel is used for coarse positioning to find the maximum value point in the center of the entire diffraction pattern. The vernier detection pixel is responsible for fine positioning. As the photosensitive chip moves, the peak point received by the vernier detection pixel will move at a speed many times faster than the moving speed of the photosensitive chip, thereby achieving ultra-high precision position detection.

[0156] In other words, the location of the photosensitive chip can be accurately determined based on the first data distribution map, the second data distribution map, and the third data distribution map.

[0157] In some embodiments, the acquisition module 2202 is configured to: acquire first position data collected by a first pixel unit on a first side of the imaging area of ​​the photosensitive chip, first position data collected by a first pixel unit on a second side of the imaging area of ​​the photosensitive chip, second position data collected by a second pixel unit on a first side of the imaging area of ​​the photosensitive chip, and second position data collected by a second pixel unit on a second side of the imaging area of ​​the photosensitive chip.

[0158] In this embodiment, the function of the acquisition module 2202 is further defined. The imaging region has a first side and a second side, the first side and the second side of the imaging region are arranged adjacent to each other, and the first side of the imaging region is perpendicular to the second side of the imaging region.

[0159] There are two pixel unit groups: one located on the first side of the imaging area, and the other on the second side. That is, the two pixel unit groups are located on different sides of the imaging area. Regardless of whether the pixel unit group is on the first or second side, the second pixel unit of each group is located between the imaging area and the first pixel unit. By acquiring the first position data from the first pixel units on both sides of the imaging area, and the second position data from the second pixel units on both sides of the imaging area, the position of the photosensitive chip can be detected from multiple dimensions and directions (e.g., the X-axis and Y-axis directions), ensuring the product's detection accuracy.

[0160] This application also provides a readable storage medium storing a program or instructions. When the program or instructions are executed by a processor, they implement the various processes of the above method embodiments and achieve the same technical effect. To avoid repetition, they will not be described again here.

[0161] This application also provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor. The processor is used to run programs or instructions to implement the various processes of the above method embodiments and achieve the same technical effect. To avoid repetition, it will not be described again here.

[0162] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0163] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0164] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A motor assembly, characterized in that, include: First shell; A photosensitive chip is disposed within the first housing, the photosensitive chip is movable relative to the first housing, and the photosensitive chip is provided with an imaging area; A position detection element is disposed within the first housing, the position detection element comprising: A second housing is connected to the first housing, and the second housing is provided with a light-transmitting portion; A light emitter is disposed within the second housing, and the light emitter is provided with an emission port; A diffraction grating is disposed inside the second housing. The diffraction grating is located between the emission port and the light-transmitting part and is used to diffract the light emitted by the light emitter to form multiple diffraction orders with equal spacing. A pixel unit group is disposed on the photosensitive chip, and the pixel unit group is disposed opposite to the diffraction grating. The pixel unit group includes a first pixel unit and a second pixel unit. The second pixel unit is located between the imaging area and the first pixel unit. The first pixel unit is provided with a plurality of first light-transmitting ports arranged in an array, and the second pixel unit is provided with a plurality of second light-transmitting ports arranged in an array. Along the direction perpendicular to the first pixel unit to the second pixel unit, the width of the first light-transmitting aperture is smaller than the width of the second light-transmitting aperture, and the diffraction fringe spacing generated by the diffraction grating produces a vernier effect with the array period of the pixel unit group.

2. The motor assembly according to claim 1, characterized in that, The imaging area has a first side and a second side arranged adjacent to each other, with the first side perpendicular to the second side; The number of pixel unit groups is two, with one pixel unit group located on the first side of the imaging area and the other pixel unit group located on the second side of the imaging area.

3. The motor assembly according to claim 1 or 2, characterized in that, The first pixel unit includes a plurality of first pixels arranged in an array, each first pixel having a first light-transmitting port. The second pixel unit includes a plurality of second pixels arranged in an array, each second pixel having a second light-transmitting port.

4. The motor assembly according to claim 1 or 2, characterized in that, The photosensitive chip also has an isolation area, which is located between the second pixel unit and the imaging area.

5. The motor assembly according to claim 4, characterized in that, The isolation zone is a ring-shaped area, which surrounds the imaging area.

6. The motor assembly according to claim 1 or 2, characterized in that, The position detection device further includes: A lens is located between the emission port and the diffraction grating.

7. The motor assembly according to claim 1 or 2, characterized in that, The position detection component further includes: A microlens is disposed between the diffraction grating and the photosensitive chip.

8. The motor assembly according to claim 7, characterized in that, The position detection device further includes: A bracket is disposed within the second housing, the bracket being located between the diffraction grating and the photosensitive chip, and the microlens is disposed on the bracket.

9. A camera module, characterized in that, include: The motor assembly as described in any one of claims 1 to 8.

10. An electronic device, characterized in that, include: The motor assembly as described in any one of claims 1 to 8; or The camera module as described in claim 9.

11. A method for position detection of a photosensitive chip, characterized in that, The position detection method for the electronic device of claim 10 includes: Acquire the first position data collected by the first pixel unit and the second position data collected by the second pixel unit; The position of the photosensitive chip is determined based on the first position data, the second position data, and the preset position data.

12. The position detection method for a photosensitive chip according to claim 11, characterized in that, Determining the position of the photosensitive chip based on the first position data, the second position data, and the preset position data specifically includes: A first data distribution map is formed by fitting the first location data, and each first data in the first data distribution map corresponds to a first pixel of the first pixel unit; A second data distribution map is formed by fitting the second location data, and each second data in the second data distribution map corresponds to a second pixel of the second pixel unit; The preset location data corresponds to a third data distribution map; The location of the photosensitive chip is determined based on the first data distribution map, the second data distribution map, and the third data distribution map.

13. The position detection method for a photosensitive chip according to claim 11 or 12, characterized in that, Acquiring the first position data collected by the first pixel unit and the second position data collected by the second pixel unit specifically includes: The first position data collected by the first pixel unit on the first side of the imaging area of ​​the photosensitive chip, the first position data collected by the first pixel unit on the second side of the imaging area of ​​the photosensitive chip, the second position data collected by the second pixel unit on the first side of the imaging area of ​​the photosensitive chip, and the second position data collected by the second pixel unit on the second side of the imaging area of ​​the photosensitive chip are acquired.

14. A position detection device for a photosensitive chip, characterized in that, The position detection device for the photosensitive chip in the electronic device of claim 10 includes: The acquisition module is used to acquire the first position data collected by the first pixel unit and the second position data collected by the second pixel unit; The processing module is used to determine the position of the photosensitive chip based on the first position data, the second position data, and the preset position data.

15. The position detection device for a photosensitive chip according to claim 14, characterized in that, The processing module is used for: A first data distribution map is formed by fitting the first location data, and each first data in the first data distribution map corresponds to a first pixel of the first pixel unit; A second data distribution map is formed by fitting the second location data, and each second data in the second data distribution map corresponds to a second pixel of the second pixel unit; The preset location data corresponds to a third data distribution map; The location of the photosensitive chip is determined based on the first data distribution map, the second data distribution map, and the third data distribution map.

16. The position detection device for a photosensitive chip according to claim 14 or 15, characterized in that, The acquisition module is used for: The first position data collected by the first pixel unit on the first side of the imaging area of ​​the photosensitive chip, the first position data collected by the first pixel unit on the second side of the imaging area of ​​the photosensitive chip, the second position data collected by the second pixel unit on the first side of the imaging area of ​​the photosensitive chip, and the second position data collected by the second pixel unit on the second side of the imaging area of ​​the photosensitive chip are acquired.

17. A readable storage medium having a program or instructions stored thereon, characterized in that, When the program or instructions are executed by at least one processor, they implement the steps of the position detection method for the photosensitive chip as described in any one of claims 11 to 13.

Images