A vapor chamber heat spreader

Abstract

The present application relates to the technical field of uniform temperature plate, disclose a kind of uniform temperature plate radiator, including uniform temperature plate, the uniform temperature plate is welded by two substrates, two the working medium groove a is opened between substrate, and in the working medium groove a is equipped with lower capillary structure plate and upper capillary structure plate by support column, the end of uniform temperature plate is also provided with mouse tail pipe, the end of uniform temperature plate is connected with pressure guide zone, the other end of pressure guide zone is equipped with compensation piece, the outside of pressure guide zone is also sleeved with memory metal for extruding sealing pressure guide zone. In uniform temperature plate setting boiling chamber, when the temperature overload of uniform temperature plate leads to heat conduction to boiling chamber, the working medium of boiling point lower in boiling chamber boils and generates a large amount of steam, vibration generated when steam escapes boiling chamber will drive upper capillary structure plate to generate high-frequency vibration by vibration guide piece, improve the rate of working medium re-liquefied on upper capillary structure plate and flow back to the bottom of uniform temperature plate, and then improve the heat dissipation efficiency of uniform temperature plate.

Description

Technical Field

[0001] This invention relates to the technical field of vapor chambers, and in particular to a vapor chamber radiator. Background Technology

[0002] With the rapid development of electronic devices, their performance is becoming increasingly sophisticated, and the high integration of chips leads to significant heat generation. If the heat generated by electronic devices is not dissipated in a timely manner, the temperature of the chips inside the devices will rise. If the temperature continues to rise, it can affect the lifespan of the electronic devices, or even burn out the chips inside.

[0003] Currently, in order to reduce the local temperature of electronic devices, heat spreaders are used to conduct heat away, increase the heat dissipation area, and are combined with air cooling or water cooling to remove heat. However, when the heat source is overheated or the heat sink malfunctions, the heat spreader cannot dissipate its own heat in time, which will lead to increased internal pressure and cause the heat spreader to deform and crack. Summary of the Invention

[0004] The purpose of this invention is to provide a vapor chamber radiator that aims to solve the problem that existing vapor chambers will deform and crack when the heat source overheats or the radiator malfunctions.

[0005] The present invention is implemented as follows: a heat exchange plate radiator includes a heat exchange plate, which is welded from two substrates. A working fluid groove a is formed between the two substrates. A lower capillary structure plate and an upper capillary structure plate are installed in the working fluid groove a via support columns. A rat-tail tube is also provided at the end of the heat exchange plate. A pressure guiding strip is connected to the end of the heat exchange plate. A compensation component is installed at the other end of the pressure guiding strip. A shape memory metal for squeezing and sealing the pressure guiding strip is also sleeved on the outside of the pressure guiding strip. A heat dissipation fin b is attached to the top of the compensation component to assist the heat exchange plate in depressurization and heat dissipation. The heat spreader plate has a working fluid tank b on the inner side of the end near the pressure guide strip. The working fluid tank b has a boiling chamber inside. The top of the boiling chamber is provided with a vibration guide plate for transmitting vibration to the upper capillary structure plate. The boiling chamber is also used to conduct heat to the pressure guide strip to change the deformation of the shape memory metal.

[0006] Preferably, a through groove is provided between the working fluid tank b and the working fluid tank a, a sealing gasket is snapped into the through groove, the vibration guide is embedded in the sealing gasket, and a stop block acting below the upper capillary structure plate is provided above one end of the vibration guide in the working fluid tank a, and a cover plate covering the top of the boiling chamber is provided at one end of the vibration guide in the working fluid tank b.

[0007] Preferably, a temperature-conducting plate is sleeved on the outside of the pressure-conducting band, and a steam pipe extending into the working fluid tank b is connected to one side of the temperature-conducting plate, while a reflux pipe extending into the boiling chamber is connected to the bottom side of the temperature-conducting plate.

[0008] Preferably, the upper and lower inner walls of the shape memory metal are provided with extrusion blocks that act on the surface of the pressure guide strip, and the upper and lower inner walls of the pressure guide strip are provided with sealing gaskets.

[0009] Preferably, the compensation component is composed of two elastic sheets stacked and welded together, and the compensation component is placed above the end of the heat spreader plate. The pressure guide band is a spring metal tube.

[0010] Preferably, the heat dissipation fins a and a fan frame are installed around the heat dissipation plate via connecting column heads, and a fan is installed inside the fan frame.

[0011] Preferably, a lower screw is connected to the bottom of the connecting column head, the lower screw passes through the heat exchange plate, and a nut is screwed onto the lower screw below the heat exchange plate.

[0012] Preferably, the fan frame is provided with a fixing cylinder on all four sides, the fixing cylinder is connected to an upper screw rod by an internal bearing, and the inner wall of the top of the fixing cylinder is provided with a threaded groove corresponding to the upper screw rod; A washer is also provided between the fixed cylinder and the connecting column head.

[0013] Preferably, a silicone pad is glued to the bottom of the temperature distribution plate.

[0014] The beneficial effects of the vapor chamber radiator disclosed in this invention are: 1. A boiling chamber is set inside the heat spreader. When the temperature of the heat spreader is overloaded, heat is conducted to the boiling chamber. The working fluid with a lower boiling point in the boiling chamber boils and produces a large amount of steam. The vibration generated when the steam escapes from the boiling chamber will drive the upper capillary plate to generate high-frequency vibration through the vibration guide plate. This increases the rate at which the reliquefied working fluid on the upper capillary plate flows back to the bottom of the heat spreader, thereby improving the heat dissipation efficiency of the heat spreader, reducing the internal air pressure, and preventing the heat spreader from deforming and cracking due to excessive internal pressure. 2. The steam heat generated in the boiling chamber will be conducted to the shape memory metal. The shape memory metal deforms under heat and squeezes the two sides of the pressure guide band, opening the channel between the heat spreader and the compensation component. This allows the pressure inside the heat spreader to be released into the compensation component, which helps to relieve pressure and dissipate heat from the heat spreader, reducing the pressure inside the heat spreader and preventing it from deforming and cracking. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a heat exchanger provided in an embodiment of the present invention; Figure 2This is an exploded structural diagram of a heat exchanger provided in an embodiment of the present invention; Figure 3 This is a heat exchanger provided in an embodiment of the present invention. Figure 2 A magnified view of the structure at point A in the middle; Figure 4 This is a schematic diagram of the internal structure of the substrate of a heat exchanger provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of a partial cross-sectional structure of the pressure guide strip of a heat exchanger provided in an embodiment of the present invention.

[0016] Legend 1. Heat spreader; 2. Heat dissipation fins a; 3. Fan frame; 4. Fan; 5. Pressure guide strip; 6. Compensating component; 7. Heat dissipation fins b; 8. Connecting post; 9. Silicone gasket; 11. Substrate; 12. Rat-tail tube; 13. Lower capillary structure plate; 14. Upper capillary structure plate; 15. Support column; 16. Working fluid tank a; 17. Working fluid tank b; 51. Shape memory metal; 52. Extruded block; 53. Sealing gasket; 81. Lower screw; 82. Nut; 83. Washer; 84. Retaining sleeve; 85. Upper screw; 171. Boiling chamber; 172. Sealing septum; 173. Vibration guide plate; 174. Abutment block; 175. Cover plate; 176. Temperature guide plate; 177. Steam pipe; 178. Return pipe. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0018] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0019] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0020] In this embodiment Reference Figure 1-2 The diagram shows a preferred embodiment of the present invention.

[0021] The heat exchanger of this embodiment includes a heat exchange plate 1, which is welded from two substrates 11. A working fluid groove a16 is formed between the two substrates 11. A lower capillary plate 13 and an upper capillary plate 14 are installed in the working fluid groove a16 through a support column 15. A rat tail tube 12 is also provided at the end of the heat exchange plate 1. A pressure guide strip 5 is connected to the end of the heat exchange plate 1. A compensation member 6 is installed at the other end of the pressure guide strip 5. A shape memory metal 51 for squeezing and sealing the pressure guide strip 5 is also sleeved on the outside of the pressure guide strip 5. A heat dissipation fin b7 is attached to the top of the compensation member 6. The shape memory metal 51 is deformed by heat and squeezes the two sides of the pressure guide strip 5, so that the channel between the heat exchange plate 1 and the compensation member 6 is opened, allowing the pressure in the heat exchange plate 1 to be released into the compensation member 6, which is used to assist the heat exchange plate 1 in depressurization and heat dissipation. The heat spreader 1 has a working fluid tank b17 on the inner side of the end near the pressure guide band 5. The working fluid tank b17 has a boiling chamber 171 inside. The top of the boiling chamber 171 is provided with a vibration guide plate 173 for transmitting vibration to the upper capillary structure plate 14. The boiling chamber 171 is also used to conduct heat to the pressure guide band 5 to change the deformation of the shape memory metal 51. After the heat in the heat spreader 1 is conducted to the boiling chamber 171, the working fluid in the boiling chamber 171 boils and generates a large amount of steam, which continuously generates vibration. The vibration guide plate 173 drives the upper capillary structure plate 14 to vibrate at high frequency, which increases the rate at which the reliquefied working fluid on the upper capillary structure plate 14 flows back to the bottom of the heat spreader 1, thereby improving the heat dissipation efficiency of the heat spreader 1.

[0022] A silicone pad 9 is glued to the bottom of the heat spreader 1. The heat spreader 1 contacts the heat source through the silicone pad 9, which increases the contact area between the heat source and the heat spreader 1 and improves the heat conduction efficiency.

[0023] See attached document Figure 3As shown, a through groove is formed between the working fluid tank b17 and the working fluid tank a16. A sealing gasket 172 is snapped into the through groove. The vibration guide plate 173 is embedded in the sealing gasket 172. Above one end of the vibration guide plate 173 in the working fluid tank a16, a stop block 174 acting below the upper capillary structure plate 14 is provided. At one end of the vibration guide plate 173 in the working fluid tank b17, a cover plate 175 is provided covering the top of the boiling chamber 171. The boiling chamber 171 is filled with a low-boiling-point working fluid. When heat overload occurs, the working fluid will preferentially reach its boiling point and boil. During boiling, the internal pressure of the boiling chamber 171 gradually increases, and steam will continuously escape outward through the cover plate 175. During this process, the cover plate 175 will drive the guide plate 173 to generate high-frequency vibration. Since the guide plate 173 is fixed by the sealing gasket 172, the vibration of the guide plate 173 will be transmitted to the other side and the abutment 174 will impact the upper capillary plate 14 at high frequency, which will accelerate the reflux of the working fluid that has been recondensed on the upper capillary plate 14.

[0024] It is worth noting that, referring to the appendix Figure 4-5 As shown, in order to relieve pressure when the internal pressure of the heat spreader 1 increases due to overheating, a pressure-conducting plate 176 is sleeved on the outside of the pressure-conducting band 5. One side of the pressure-conducting plate 176 is connected to a steam pipe 177 extending into the working fluid tank b17, and the bottom side of the pressure-conducting plate 176 is connected to a return pipe 178 extending into the boiling chamber 171. The upper and lower inner walls of the shape memory metal 51 are provided with extrusion blocks 52 acting on the surface of the pressure-conducting band 5, and the upper and lower inner walls of the pressure-conducting band 5 are provided with sealing gaskets 53. The boiling chamber 171 boils... The large amount of escaped steam generated during the process will enter the interior of the temperature-conducting plate 176 through the steam pipe 177, thereby raising the temperature of the temperature-conducting plate 176. When the internal temperature of the temperature-conducting plate 176 approaches 40°C, the shape memory metal 51 will deform and be arranged in a rhomboid shape. The distance between the two ends of the shape memory metal 51 will decrease, while the distance between the upper and lower parts will increase, thereby squeezing the two sides of the pressure-conducting band 5 and opening the sealing gasket 53 inside the pressure-conducting band 5, thereby reducing the pressure of the heat-dissipating plate 1. In addition, the heat dissipation fins b7 on the top of the compensation component 6 can also assist in the heat dissipation inside the compensation component 6.

[0025] The compensation component 6 is composed of two elastic sheets stacked and welded together. It allows pressure to enter the compensation component 6 and cause it to deform to a certain extent. When the pressure in the heat exchange plate 1 decreases, the compensation component 6 can return to its original shape. The compensation component 6 is placed above the end of the heat exchange plate 1. The pressure guiding band 5 is a spring metal tube. This allows the compensation component 6 to be flipped outward from the top end of the heat exchange plate 1 when the pressure guiding band 5 is opened. This allows the steam that enters the compensation component 6 through the pressure guiding band 5 in the heat exchange plate 1 to liquefy and flow back into the heat exchange plate 1, preventing the loss of the working fluid in the heat exchange plate 1.

[0026] In the appendix Figure 2 In this assembly, heat dissipation fins a2 and a fan frame 3 are mounted on the periphery of the heat spreader 1 via connecting posts 8. A fan 4 is installed inside the fan frame 3. A lower screw 81 is connected to the bottom of the connecting posts 8, and the lower screw 81 passes through the heat spreader 1. A nut 82 is screwed onto the lower screw 81 below the heat spreader 1. Fixing cylinders 84 are provided around the fan frame 3. An upper screw 85 is connected to the bearing inside the fixing cylinder 84. A threaded groove corresponding to the upper screw 85 is opened on the inner top wall of the fixing cylinder 84. A washer 83 is also provided between the fixing cylinder 84 and the connecting posts 8, allowing for quick assembly and disassembly of the fan frame 3 and the heat spreader 1 via the connecting posts 8.

[0027] A boiling chamber 171 is set inside the heat spreader 1. When the temperature of the heat spreader 1 is overloaded, heat is conducted to the boiling chamber 171. The working fluid with a lower boiling point in the boiling chamber 171 boils and generates a large amount of steam. The vibration generated when the steam escapes from the boiling chamber 171 will drive the upper capillary plate 14 to generate high-frequency vibration through the guide plate 173, thereby increasing the rate at which the reliquefied working fluid on the upper capillary plate 14 flows back to the bottom of the heat spreader 1, and thus improving the heat dissipation efficiency of the heat spreader 1. The steam heat generated in the boiling chamber 171 is conducted to the shape memory metal 51. The shape memory metal 51 deforms under heat and squeezes the two sides of the pressure guide band 5, opening the channel between the heat spreader 1 and the compensation component 6, allowing the pressure in the heat spreader 1 to be released into the compensation component 6, which is used to assist the heat spreader 1 in depressurization and heat dissipation.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A heat exchanger with a vapor chamber, comprising a vapor chamber formed by welding two substrates together, a working fluid groove a being formed between the two substrates, and a lower capillary plate and an upper capillary plate being mounted in the working fluid groove a via support columns, wherein a rat-tail tube is also provided at the end of the vapor chamber, characterized in that: The end of the heat spreader is connected to a pressure guide strip, and the other end of the pressure guide strip is equipped with a compensation component. The outside of the pressure guide strip is also fitted with a shape memory metal for squeezing and sealing the pressure guide strip. The top of the compensation component is attached with heat dissipation fins b to assist the heat spreader in depressurization and heat dissipation. The heat spreader plate has a working fluid tank b on the inner side of the end near the pressure guide strip. The working fluid tank b has a boiling chamber inside. The top of the boiling chamber is provided with a vibration guide plate for transmitting vibration to the upper capillary structure plate. The boiling chamber is also used to conduct heat to the pressure guide strip to change the deformation of the shape memory metal. A through groove is provided between the working fluid tank b and the working fluid tank a. A sealing gasket is snapped into the through groove. The vibration guide is embedded in the sealing gasket. A stop block acting below the upper capillary structure plate is provided above one end of the vibration guide in the working fluid tank a. A cover plate covering the top of the boiling chamber is provided at one end of the vibration guide in the working fluid tank b. The boiling chamber is filled with a low-boiling-point working fluid.

2. The heat exchanger as described in claim 1, characterized in that, The pressure guide belt is fitted with a temperature guide plate. One side of the temperature guide plate is connected to a steam pipe extending into the working fluid tank b, and the bottom side of the temperature guide plate is connected to a reflux pipe extending into the boiling chamber.

3. The heat exchanger as described in claim 1, characterized in that, The upper and lower inner walls of the shape memory metal are provided with extrusion blocks that act on the surface of the pressure guide strip, and the upper and lower inner walls of the pressure guide strip are provided with sealing gaskets.

4. A heat exchanger as described in claim 1, characterized in that, The compensation component is composed of two elastic sheets stacked and welded together. The compensation component is placed above the end of the heat spreader. The pressure guide band is a spring metal tube.

5. A heat exchanger as described in claim 1, characterized in that, The temperature distribution plate is surrounded by heat dissipation fins a and a fan frame, which are located above the temperature distribution plate and are connected by column heads. A fan is installed inside the fan frame.

6. A heat exchanger as described in claim 5, characterized in that, The bottom of the connecting column is connected to a lower screw rod, which passes through the heat exchange plate, and a nut is screwed onto the lower screw rod below the heat exchange plate.

7. A heat exchanger as described in claim 6, characterized in that, The fan frame is provided with fixed cylinders on all four sides. The upper screw is connected to the bearing inside the fixed cylinder. The inner wall of the top of the fixed cylinder is provided with a threaded groove corresponding to the upper screw. A washer is also provided between the fixed cylinder and the connecting column head.

8. A heat exchanger as described in claim 1, characterized in that, A silicone gasket is glued to the bottom of the temperature distribution plate.

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