Display panel, manufacturing method and display device

Abstract

This disclosure provides a display panel, a manufacturing method, and a display device. The display panel includes an array substrate, a dam on one side of the array substrate, the dam at least partially surrounding the light-emitting area, a first barrier layer disposed on the array substrate, and the first barrier layer being located on the side of the dam from the light-emitting area towards the border area; a light-emitting functional layer stacked on the array substrate; and a second barrier layer disposed on the side of the light-emitting functional layer opposite to the array substrate. The orthographic projection of the second barrier layer on the array substrate covers the orthographic projection of the first barrier layer on the array substrate. This design reduces the thickness of the second barrier layer, preventing it from being too thick and unable to be fully exposed and cured in subsequent processes, thus avoiding peeling problems, and also enables an extremely narrow bezel.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a manufacturing method, and a display device. Background Technology

[0002] With the development of full-screen mobile phones, the narrow bezel technology of mobile phone display panels has received increasing attention. Display panels are usually equipped with a protective cover plate, and ink is applied around the perimeter of the cover plate to block light (side light leakage). The ink width is about 3mm. In actual bonding, the accuracy of the cover plate to the panel is about 0.3mm. This limitation of the cover plate bezel makes it impossible to achieve the ultimate display panel. Summary of the Invention

[0003] In view of this, the purpose of this disclosure is to provide a display panel with a reduced bezel.

[0004] For the purposes described above, this disclosure provides a display panel, which includes:

[0005] A light-emitting area and a border area, wherein the border area is disposed around at least a portion of the light-emitting area;

[0006] The display panel includes: an array substrate, a dam is provided on one side of the array substrate, the dam at least surrounds a portion of the light-emitting area, and a first blocking layer is provided on the array substrate, the first blocking layer being located on the side of the dam from the light-emitting area to the border area;

[0007] A light-emitting functional layer is stacked on the array substrate;

[0008] The second blocking layer is disposed on the side of the light-emitting functional layer opposite to the array substrate; the orthographic projection of the second blocking layer on the array substrate covers the orthographic projection of the first blocking layer on the array substrate.

[0009] In one embodiment, the display panel further includes a touch layer stacked on the light-emitting functional layer, wherein an adhesive layer is disposed on the touch layer away from the light-emitting functional layer, and a second barrier layer is disposed on the edge of the adhesive layer away from the touch layer, wherein the thickness of the second barrier layer is less than the thickness of the first barrier layer. This design reduces the thickness of the second barrier layer, preventing it from being too thick and unable to be fully exposed and cured in subsequent processes, thus avoiding peeling problems, and also allows for an extremely narrow bezel.

[0010] In one embodiment, a pressure-sensitive adhesive layer is further disposed on the adhesive layer, the second barrier layer surrounds the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is connected to a polarizing layer or a cover plate.

[0011] In one embodiment, the dam comprises a multi-layered structure with a height between 6 and 10 μm.

[0012] In one embodiment, the width of the dam is between 5 and 10 μm, and the height is between 6 and 10 μm.

[0013] In one embodiment, the display panel further includes a cover plate located on the side of the touch layer away from the array substrate, and an ink layer is disposed on one edge of the cover plate, wherein the difference between the OD value of the ink layer and the OD value of the combination of the first blocking layer and the second blocking layer is within a first threshold range.

[0014] In one embodiment, the second barrier layer is made of an organic material and has a thickness of less than 2 μm.

[0015] In one embodiment, the thickness of the first barrier layer is less than 6 μm.

[0016] Based on the same inventive concept, this disclosure also discloses a method for manufacturing the above-mentioned display panel, which includes the following steps:

[0017] A dam is formed on one side of an array substrate, the array substrate including a light-emitting area and a border area, the border area being disposed around at least a portion of the light-emitting area, and the dam surrounding the light-emitting area on the array substrate;

[0018] A first barrier layer is prepared, wherein the first barrier layer is located on the side of the dam from the light-emitting area to the frame area, and the first barrier layer is disposed on the side of the dam on the substrate away from the light-emitting area;

[0019] A light-emitting functional layer is fabricated on the array substrate, and the light-emitting functional layer is located on the side of the first blocking layer away from the array substrate;

[0020] A second blocking layer is prepared, which is located on the side of the light-emitting functional layer away from the array substrate, and the orthogonal projection of the second blocking layer on the array substrate covers the orthogonal projection of the first blocking layer on the array substrate.

[0021] In one embodiment, the step of fabricating a dam on one side of the array substrate includes the following steps: fabricating a thin-film transistor structure on the substrate using a thin-film transistor process; fabricating a planarization layer and a first dam layer on the thin-film transistor structure; fabricating a pixel definition layer and a second dam layer on the planarization layer and the first dam layer, respectively; and fabricating spacers and a third dam layer on the pixel definition layer and the second dam layer, respectively.

[0022] Preferably, the step of preparing the planarization layer and the first dam layer includes: preparing a first planarization layer and a first portion of the first dam layer on the thin-film transistor structure by a planarization process; preparing power lines on the first planarization layer by a power line wiring process; and preparing a second planarization layer and a second portion of the first dam layer on the power lines and the first portion, respectively, by a planarization process.

[0023] Preferably, before the step of preparing the pixel definition layer, the method further includes: preparing a pixel electrode layer on the planarization layer.

[0024] Preferably, the materials used to prepare the dam include organic materials.

[0025] In one embodiment, the step of preparing the light-emitting functional layer includes: preparing a light-emitting layer on the array substrate, the light-emitting layer being located on the side of the first blocking layer away from the array substrate; and preparing an encapsulation layer on the side of the light-emitting layer away from the array substrate.

[0026] Preferably, after the step of preparing the light-emitting functional layer, the method further includes: preparing a touch layer on the side of the light-emitting functional layer away from the array substrate and away from the light-emitting layer, and preparing an adhesive layer on the side of the touch layer away from the light-emitting functional layer.

[0027] Preferably, the step of preparing the second barrier layer includes: coating a black organic adhesive on a surface of the adhesive layer away from the touch layer, curing it by exposure, and removing the black organic adhesive corresponding to the light-emitting area to obtain the second barrier layer.

[0028] Preferably, after the step of preparing the second barrier layer, the method further includes preparing a pressure-sensitive adhesive layer on the side of the adhesive layer away from the touch layer, with the second barrier layer surrounding the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer connected to a polarizing layer or a cover plate. Based on the same inventive concept, this disclosure also discloses a display device including the above-described display panel. This display device can be mounted on devices such as mobile phones, AR / VR devices, computers, and automotive displays.

[0029] Compared with existing technologies, the display panel provided in this disclosure optimizes the structure by placing the BM black adhesive portion above the touch layer onto the substrate. This portion does not increase the thickness of the subsequent light-emitting functional layer. The requirements for blocking side light are met by a combination of a first blocking layer and a second blocking layer, or a combination of a first blocking layer, a second blocking layer, and frame adhesive. In this embodiment, the second blocking layer is thinner, can be fully exposed, avoids the risk of peeling, and can also achieve an extremely narrow bezel. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the existing display panel's stacked structure;

[0032] Figure 2 This is a cross-sectional schematic diagram of an existing display panel;

[0033] Figures 3-5 A cross-sectional schematic diagram of a display panel provided in a preferred embodiment of this disclosure;

[0034] Figure 6 A schematic flowchart illustrating a method for manufacturing a display panel according to a preferred embodiment of this disclosure;

[0035] Figure 7 This is a schematic flowchart of a method for preparing a dam according to a preferred embodiment of the present disclosure. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0037] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar words used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects. Words such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly. Existing patents employ photolithography processes with high alignment and patterning precision.

[0038] Currently, smartphone display panels typically integrate touch functionality. This requires setting a touch layer on the display panel, then placing a protective cover on the touch layer, and applying ink around one side of the cover to prevent light leakage from the sides when the display panel is lit.

[0039] To improve the display effect of smartphones, ultra-narrow bezel display panels have emerged. The existing display panel structure is as follows: Figure 1 and Figure 2 As shown, the display panel includes a stacked support film 10, an OLED light-emitting functional layer 20, a polarizing layer 30, an OCA optical adhesive layer 40, and a cover plate 50. The OLED light-emitting functional layer 20 includes a touch layer (containing M1 and M2 metal lines). BM black adhesive 80 is applied to the entire surface of the adhesive layer 90 on the upper side of the touch layer (closer to the user side during use). Then, the middle part of the entire BM black adhesive 80 coating (filled with PSA pressure-sensitive adhesive 81) is removed by exposure and development, leaving only a black border of a preset width. This BM black adhesive (i.e., the black border) or the combination of BM black adhesive and sealant 70 (the perimeter sealant of the panel is also called the four-sided sealant, which is black) serves to block light. In practice, when the display panel is lit, side light leakage occurs.

[0040] The applicant's research found that the thickness of the BM black glue prepared by the coating and developing process is about 5 μm. The bottom of the BM black glue with this thickness cannot be fully exposed (cured), that is, there is a phenomenon of incomplete curing (semi-curing) of the BM black glue near the touch layer. This semi-cured BM black glue is easily washed away by the developing solution in the subsequent cleaning process, resulting in unreliable adhesion of the BM black glue and the risk of peeling (i.e., causing side light leakage when lit).

[0041] To address this, the applicant proposed a display panel that reduces the bezel size while avoiding the risk of peeling.

[0042] To address the aforementioned problems, one embodiment of this disclosure provides a display panel, such as... Figure 3 As shown,

[0043] The display panel includes:

[0044] Array substrate 110, dam 112, light-emitting functional layer 120, touch layer 130, and cover plate 180,

[0045] The dam 112 is disposed on the array substrate 110 and surrounds the light-emitting area (also called AA area) 111 thereon. A first blocking layer 191 is disposed on the side of the dam 112 away from the light-emitting area 111.

[0046] The light-emitting functional layer 120 includes an encapsulation layer (e.g., TFE, Thin Film Encapsulation), meaning the light-emitting functional layer 120 includes both a light-emitting layer and an encapsulation layer. In one embodiment, the encapsulation layer integrates a polarizing function.

[0047] A touch layer 130 is disposed on the light-emitting functional layer 120, and a cover plate 180 is disposed on the side of the touch layer 130 away from the light-emitting layer. Preferably, an adhesive layer 140 (also called a planarization layer) is disposed on the side of the touch layer 130 away from the light-emitting functional layer 120, and a second barrier layer 192 and a pressure-sensitive adhesive layer (PSA) 150 are disposed on the adhesive layer 140. The second barrier layer 192 is located at the edge of the adhesive layer 140, and the thickness of the second barrier layer is less than 2μm (e.g., if the thickness of the second barrier layer is 1μm, its OD value is about 1 (OD, optical density, represents the light density absorbed by the detected object, also called absorbance)). This design can reduce the thickness of the second barrier layer, avoiding the problem of peeling caused by an excessively thick BM black adhesive layer that cannot be fully exposed and cured in subsequent processes. This method can also reduce the bezel width (achieving an extremely narrow bezel). Preferably, the width of the dam (Dam) is between 5 and 10 μm, and the thickness / height of the dam (Dam) is between 6 and 10 μm. The thickness / height is perpendicular to the plane of the display panel. In one embodiment, the dam adopts a multi-layer stacked structure (such as a combination of 2, 3, 4 or more layers), for example, the dam is composed of a combination of PLN2 / PLN3 / PDL and SPC (spacer column) organic adhesive. PLN2 / PLN3 / PDL are insulating layers made of different materials. The thickness of the first barrier layer is less than 6 μm (such as 3 μm, 4 μm, 5 μm), and its OD (optical density) is ≥4. The thickness of the second barrier layer is less than 2 μm, and the orthographic projection of the second barrier layer on the array substrate covers the orthographic projection of the first barrier layer on the array substrate. Preferably, a sealant 193 is also provided on the substrate, the sealant 193 is provided in the bezel area of ​​the display panel, the bezel area surrounding the light-emitting area 111. Through this design, the BM black adhesive portion is placed on the array substrate via structural optimization (this portion does not increase the thickness of the subsequent light-emitting functional layer 120), and the thickness of the second blocking layer is less than that of the first blocking layer. The requirements for blocking side light are met by combining the first and second blocking layers, or by combining the first and second blocking layers with the frame adhesive. The thinner second blocking layer allows for sufficient exposure, avoiding the risk of peeling. Preferably, the display panel employs a polarizer-free design, where the polarizer's function can be integrated into the encapsulation layer. Both the first and second blocking layers can be made of organic materials (also known as organic adhesives).

[0048] As Figure 3 Variations of the implementation method are as follows Figure 4 The image shown is a cross-sectional schematic of a display panel according to an embodiment of this application.

[0049] In this display panel, an adhesive layer (planarization layer) 140 is disposed on the touch layer 130. A second barrier layer 192 is disposed on the edge of the adhesive layer 140 away from the touch layer 130. The thickness of the second barrier layer is less than 2 μm (e.g., 1 μm). A PSA layer (pressure-sensitive adhesive layer) 150 is also disposed on the side of the adhesive layer 140 away from the touch layer 130. A polarizing film layer 160 (e.g., a circular polarizer, which is an anti-reflective film formed by combining a 1 / 4 wavelength phase film with a conventional polarizer) is disposed on the PSA layer 150. A cover plate 180 is attached to the polarizing film layer 160. Preferably, the cover plate 180 is attached to the polarizing film layer 160 by an adhesive 170. The adhesive 170 can be an OCA (Optically Clear Adhesive) optical adhesive. In this embodiment, an ink (black ink) is disposed on one edge of the cover plate (not shown in the figure, see reference). Figure 1 (In the embodiment described above), this method of application can block light leakage from the sides. The cover plate can be made of transparent glass or high-strength resin. In this embodiment, the combined OD value of the first blocking layer 191 and the second blocking layer 192 is close to 5, and the OD value of the cover plate ink is also close to 5, thus satisfying the light-blocking requirement. The ratio of the thickness of the second blocking layer to the thickness of the first blocking layer is between 0.2 and 0.5 (e.g., ratios of 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, and 0.5).

[0050] In one embodiment, the array substrate is provided with a driving layer, a dam, a light-emitting layer, an encapsulation layer, a touch layer, and a cover plate. The driving layer includes a driving circuit (corresponding to the light-emitting area), which can be any one of a 6T1C circuit, a 6T2C circuit, a 7T1C circuit, a 7T2C circuit, or a 9T1C circuit, etc., and is not limited herein.

[0051] like Figure 5 The image shown is a cross-sectional schematic of a display panel according to an embodiment of this application.

[0052] A dam 212 is disposed on an array substrate 210 and surrounds a light-emitting area (also called AA area) 211. A first blocking layer 291 is disposed on the side of the dam 212 away from the light-emitting area 211.

[0053] The light-emitting functional layer 220 includes a light-emitting layer and an encapsulation layer. The light-emitting layer is disposed on the array substrate, and the encapsulation layer is disposed on the side of the light-emitting layer away from the array substrate.

[0054] A touch layer is provided on the light-emitting functional layer 120. The touch layer includes M1 metal layer 231 and M2 metal layer 232 traces and an insulating layer 233 (such as SiNX).

[0055] A planarization layer 240 is disposed on the touch layer. A second barrier layer 292 is disposed on the edge of the adhesive layer 240 away from the touch layer. The thickness of the second barrier layer 292 is less than 2 μm (e.g., 1 μm, 1.5 μm). A pressure-sensitive adhesive layer 250 is disposed on the side of the adhesive layer 240 away from the touch layer. A polarizing film layer 260 is disposed on the PSA layer 250. A cover plate 280 is attached to the polarizing film layer 260. Preferably, the cover plate 280 is attached to the polarizing film layer 260 using an adhesive 270. The adhesive 270 can be an OCA (Optically Clear Adhesive) optical adhesive. The touch layer includes two metal layers with weak reflection, which reduces the thickness of the second barrier layer and avoids peeling problems caused by incomplete exposure at its bottom. Thinning the second barrier layer also reduces the screen bezel. The thickness of the second barrier layer is less than 2 μm (e.g., if the thickness of the second barrier layer is 1 μm, its OD value is around 1). Preferably, the width of the dam (Dam) is between 5 and 10 μm (in the x-direction), and the thickness / height is between 6 and 10 μm (in the y-direction). The dam adopts a multi-layered structure (e.g., a combination of 2, 3, 4, or more layers), such as a dam composed of PLN2 / PLN3 / PDL and SPC organic adhesive layers. The thickness of the second barrier layer is less than 2 μm. The thickness of the first barrier layer is less than 6 μm (e.g., 3 μm, 4 μm, 5 μm), and its OD (optical density) is ≥4. In one embodiment, the polarizing film layer 260 can be omitted from the display panel, and the function of the polarizing film layer 260 is integrated into the encapsulation layer.

[0056] This disclosure provides a method for manufacturing a display panel according to one embodiment. See also... Figure 6 The preparation method includes the following steps:

[0057] S1. A dam is fabricated at the edge of the light-emitting area (AA area) of the array substrate. The width of the dam is between 5 and 10 μm, and the height / thickness is between 6 and 10 μm (e.g., heights of 6 μm, 7 μm, 8 μm, 9 μm, 10 μm).

[0058] See Figure 7 This step includes:

[0059] S11. Fabrication of a thin-film transistor structure: A thin-film transistor structure is formed on a substrate using thin-film transistor technology. The thin-film transistor structure includes conductive film layers such as a semiconductor layer, a gate layer, and a source / drain layer, as well as an inorganic insulating film layer disposed between the above conductive film layers. The substrate can be a rigid substrate (such as LTPS glass or a ceramic substrate) or a flexible substrate, such as a PI material or a CPI material.

[0060] S12. Simultaneously fabricating a planarization layer and a first dam layer: A first planarization layer covering the source and drain layers is fabricated on the thin-film transistor structure using a planarization process. Simultaneously, a first portion of a first dam layer with a width between 5 and 10 μm is fabricated at the edge of the AA region. Power lines are fabricated on the first planarization layer using a power line wiring process. A second planarization layer covering the power lines is then fabricated on the first planarization layer using another planarization process. Simultaneously, a second portion of the first dam layer is fabricated on the first portion of the first dam layer. The first portion and the second portion are combined to form the first dam layer.

[0061] S13. Fabrication of pixel electrode layer: A conductive material layer is fabricated on the second planarization layer, and the conductive material layer is patterned to form the pixel electrode layer.

[0062] S14. Simultaneously prepare a pixel definition layer and a second dam layer: Prepare a pixel definition layer on the second planarization layer using a pixel definition layer process, and simultaneously prepare a second dam layer on the first dam layer.

[0063] S15. Simultaneously prepare spacers and a third dam layer: Prepare multiple spacers on the pixel definition layer using the spacer process, and simultaneously prepare a third dam layer on the second dam layer.

[0064] The dam is formed by sequentially stacking the first dam layer, the second dam layer, and the third dam layer. The dam height obtained by this method is between 6 and 10 μm. The dam, the planarization layer, the pixel definition layer, and the spacers can all be prepared using organic adhesives.

[0065] S2. A first barrier layer is prepared by applying black adhesive to the outer side of the dam (i.e., the side of the dam furthest from area AA). The first barrier layer is a black organic adhesive. This step can be performed by split coating (slit coating) or inkjet printing (IJP), followed by drying to obtain the first barrier layer. The thickness of the first barrier layer is less than 6 μm (e.g., 4 μm or 3 μm). Drying can be performed using conventional equipment and is not limited here.

[0066] S3. An OLED light-emitting layer is fabricated on the array substrate and the first barrier layer, wherein the OLED light-emitting layer is located on the side of the first barrier layer away from the array substrate. The OLED light-emitting layer is encapsulated on the side of the array substrate away from the array substrate to form an encapsulation layer. This step may employ one of existing OLED encapsulation, TFE encapsulation, or COE encapsulation methods, and is not limited thereto.

[0067] S4. Prepare the touch layer and prepare the adhesive layer on the touch layer.

[0068] In this step, the touch layer may include two metal layers, such as those obtained through M1 / M2 metal. The wiring of the M1 / M2 metal, as well as the SIN and OC, can all be achieved using conventional processes and are not limited here. In this embodiment, the touch layer includes two metal layers. The advantage of this design is that it avoids the peeling problem caused by the second barrier layer being too thick, and it can also reduce the screen bezel.

[0069] S5. Coat the adhesive layer with black organic adhesive. The thickness of the second barrier layer prepared in this step is less than 2μm (e.g., 1μm, 1.5μm), with an OD value of around 1, which can block metal reflections from the lower side. If the thickness of the second barrier layer is around 1μm, the black organic adhesive can be coated using split coating (slit coating) or inkjet printing (IJP) on the surface of the adhesive layer away from the touch layer, cured by exposure, and then the black organic adhesive corresponding to the AA area is removed (i.e., leaving the second barrier layer). By using this method, the OD value of the combination of the first and second barrier layers is close to 5 (e.g., 5.1, 5.0, 4.9), and the OD value of the cover ink is close to 5, thus satisfying the light-blocking requirement.

[0070] In one embodiment, a polarizer bonding process and / or a cover plate bonding process are further included after step S5.

[0071] Another embodiment of this disclosure discloses a display device that includes the display panel described in any of the above embodiments. This display device can be mounted on smart devices (such as mobile phones, AR / VR devices, computers, in-vehicle displays, etc.).

[0072] Although this disclosure has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0073] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

[0074] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0075] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display panel, characterized in that, include: A light-emitting area and a border area, wherein the border area is disposed around at least a portion of the light-emitting area; The display panel includes: an array substrate, a dam is provided on one side of the array substrate, the dam at least surrounds a portion of the light-emitting area, a first blocking layer is provided on the array substrate, and the first blocking layer is located on the side of the dam from the light-emitting area to the border area; A light-emitting functional layer is stacked on the array substrate; The second blocking layer is disposed on the side of the light-emitting functional layer opposite to the array substrate; the orthographic projection of the second blocking layer on the array substrate covers the orthographic projection of the first blocking layer on the array substrate.

2. The display panel as described in claim 1, characterized in that, It also includes a touch layer, which is stacked on the light-emitting functional layer, and an adhesive layer is disposed on the touch layer away from the light-emitting functional layer, and a second blocking layer is disposed on the edge of the adhesive layer away from the touch layer.

3. The display panel as described in claim 2, characterized in that... It also includes a cover plate located on the side of the touch layer away from the array substrate. An ink layer is provided on one edge of the cover plate, and the difference between the OD value of the ink layer and the OD value of the combination of the first blocking layer and the second blocking layer is within a first threshold range.

4. The display panel as described in claim 2, characterized in that, The thickness of the second barrier layer is less than the thickness of the first barrier layer.

5. The display panel as described in claim 3, characterized in that, A pressure-sensitive adhesive layer is also provided on the side of the adhesive layer facing away from the array substrate, and the second barrier layer surrounds a portion of the pressure-sensitive adhesive layer.

6. The display panel as described in claim 5, characterized in that, The pressure-sensitive adhesive layer is connected to the polarizing layer or the cover plate.

7. The display panel as described in claim 1, characterized in that, The dam comprises a multi-layered structure; The height of the dam is between 6 and 10 μm.

8. The display panel as described in claim 1, characterized in that, The width of the dam is between 5 and 10 μm; The height of the dam is between 6 and 10 μm.

9. The display panel as described in any one of claims 1-8, characterized in that, The second barrier layer is made of organic material.

10. The display panel as claimed in claim 9, characterized in that, The thickness of the second barrier layer is less than 2 μm; The thickness of the first barrier layer is less than 6 μm.

11. A method for manufacturing a display panel, characterized in that, Includes the following steps: A dam is formed on one side of an array substrate, the array substrate including a light-emitting area and a border area, the border area being disposed around at least a portion of the light-emitting area, and the dam surrounding the light-emitting area on the array substrate; A first barrier layer is prepared, wherein the first barrier layer is located on the side of the dam from the light-emitting area to the border area; A light-emitting functional layer is fabricated on the array substrate, and the light-emitting functional layer is located on the side of the first blocking layer away from the array substrate; A second blocking layer is prepared, which is located on the side of the light-emitting functional layer away from the array substrate, and the orthographic projection of the second blocking layer on the array substrate covers the orthographic projection of the first blocking layer on the array substrate.

12. The preparation method according to claim 11, characterized in that, The step of fabricating a dam on one side of the array substrate includes the following steps: Fabrication of thin-film transistor structures on a substrate; A planarization layer and a first dam layer are fabricated on the thin-film transistor structure; A pixel definition layer and a second dam layer are respectively prepared on the planar layer and the first dam layer; Spacers and a third dam layer are respectively fabricated on the pixel definition layer and the second dam layer.

13. The preparation method according to claim 12, characterized in that, The steps of preparing the planarization layer and the first dam layer include: preparing a first planarization layer and a first portion of the first dam layer on the thin-film transistor structure by a planarization process; preparing power lines on the first planarization layer by a power line wiring process; and preparing a second planarization layer and a second portion of the first dam layer on the power lines and the first portion, respectively, by a planarization process.

14. The preparation method according to claim 12, characterized in that, The method further includes, prior to the step of preparing the pixel definition layer, preparing a pixel electrode layer on the planarization layer.

15. The preparation method according to claim 12, characterized in that, The materials used to construct the dam include organic materials.

16. The preparation method according to claim 11, characterized in that, The step of preparing the light-emitting functional layer includes: A light-emitting layer is fabricated on the array substrate, the light-emitting layer being located on the side of the first blocking layer away from the array substrate; An encapsulation layer is prepared on the side of the light-emitting layer away from the array substrate.

17. The preparation method according to claim 16, characterized in that, The process further includes, after the step of preparing the light-emitting functional layer, preparing a touch layer on the side of the light-emitting functional layer away from the array substrate and away from the light-emitting layer, and preparing an adhesive layer on the side of the touch layer away from the light-emitting functional layer.

18. The preparation method according to claim 17, characterized in that, The step of preparing the second barrier layer includes: coating a black organic adhesive on a surface of the adhesive layer away from the touch layer, curing it by exposure, and removing the black organic adhesive corresponding to the light-emitting area to obtain the second barrier layer.

19. The preparation method according to claim 17, characterized in that, The process further includes, after the step of preparing the second barrier layer, preparing a pressure-sensitive adhesive layer on the side of the adhesive layer away from the touch layer, the second barrier layer surrounding the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer being connected to a polarizing layer or a cover plate.

20. A display device, characterized in that, Includes the display panel as described in any one of claims 1-10.

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