用于超镜面抛光的抛光装置
By combining the sample fixing part, base, polishing part and polishing liquid delivery part, the sample can move and rotate in multiple directions, which solves the problem of low polishing accuracy of existing devices, improves the uniformity and accuracy of polishing, and is suitable for ultra-mirror polishing of vacuum semiconductor equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HEFEI NATIONAL LABORATORY
- Filing Date
- 2023-11-20
- Publication Date
- 2026-07-17
AI Technical Summary
Existing polishing equipment cannot precisely control the polishing slurry composition, polishing slurry delivery volume, polishing medium material, and polishing pressure in vacuum semiconductor equipment, resulting in low polishing accuracy and failing to guarantee the uniformity and precision of ultra-mirror polishing of precision parts.
By designing a combination of sample fixing part, base, polishing part and polishing liquid delivery part, the sample can move and rotate in multiple directions, and the polishing liquid composition, delivery volume, polishing medium material and polishing pressure can be controlled to form working conditions with different polishing coefficients.
It improves the uniformity and precision of polishing, meeting the ultra-mirror polishing requirements of different precision parts in vacuum semiconductor equipment.
Smart Images
Figure CN117340768B_ABST