A bonding head and a chip bonding apparatus

Abstract

The application belongs to the technical field of chip production, and discloses a bonding head and a chip bonding device.The bonding head comprises a base piece, a bearing piece, an adjusting assembly, a bellows, a power piece and a suction accessory.The bellows in the application is an elastic mechanism.If the thickness of the substrate or the chip is too large, the bellows will be compressed, and the pressure caused by the compression of this part is negligible, so that the driving chip can quickly drop to the preset same height.Compared with the prior art, the setting of the bellows can realize high-speed output of the target pressure value without the need for feedback through the force sensor, that is, the driving chip does not need to search for the substrate height at low speed during the falling process, which helps to improve the efficiency of chip bonding and thus improve the production capacity.The chip bonding device comprising the above bonding head helps to improve the efficiency of chip bonding and thus improve the production capacity.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a bonding head and chip bonding equipment. Background Technology

[0002] Chip bonding is a crucial step in semiconductor packaging. It mainly involves bonding equipment taking each chip out of the pre-cut wafer and fixing it onto the substrate, while applying a specific amount of pressure during the bonding process.

[0003] Currently, most chip bonding systems on the market include force sensors and bonding components. The force sensor provides pressure feedback to precisely control the pressure output. The specific workflow is as follows: a motor drives the bonding component downwards. Then, when the bonding component is about to contact the substrate (the distance is manually set by the thickness tolerances of the substrate and chip), the motor decelerates, causing the bonding component to move downwards at a very low, constant speed until the chip contacts the substrate. Then, when the pressure reaches the required value, the motor immediately stops the bonding component from descending. The reason for the slow, constant descent is that there are tolerances in the thickness of the substrate and chip; the exact height needs to be determined by the force sensor feedback. A rapid descent could damage the chip.

[0004] However, due to the micron-level fluctuations in substrate thickness, the pressing component cannot descend to the same height every time. If the chip is too high, it may be damaged; if it is too low, it cannot be pressed down. As a result, the pressing component has to slow down after reaching a certain distance above the chip and then slowly press down until the force sensor reading reaches the required pressure. Then, it feeds back to the motor to stop moving downward, which in turn results in lower chip production capacity.

[0005] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0006] The purpose of this invention is to provide a bonding head and a chip bonding device to quickly achieve chip bonding and increase production capacity.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A bonding head, comprising:

[0009] Basic components;

[0010] The support component is movably mounted on the base component along a preset direction;

[0011] An adjustment component is disposed between the carrier and the base and configured to adjust the position of the carrier on the base;

[0012] A bellows includes an assembly, a telescopic body, and a connector, wherein the assembly is embedded at one end of the telescopic body, and the connector is disposed at the end of the telescopic body away from the assembly.

[0013] The assembly is disposed on the base component, the carrier can abut against the side of the connector opposite to the assembly, and the connector partially moves through the carrier;

[0014] A power component, disposed on the base component, is configured to drive the assembly to rotate about its axis; and

[0015] An adsorption element is disposed at one end of the connector opposite to the assembly, and the adsorption element is configured to absorb the chip.

[0016] Preferably, the adjustment component includes:

[0017] The first thread is provided on the base component;

[0018] A second thread is provided on the bearing member, and the first thread and the second thread are adapted to be screwed together.

[0019] Preferably, the carrier is a shell with an internal cavity, the bellows is located in the cavity, one end of the shell is connected to the base through the adjustment assembly, and the connector moves through the other end of the shell.

[0020] Preferably, the first thread is an external or internal thread arranged in a ring on the base component, and the second thread is an internal or external thread arranged in a ring on the outer wall of one end of the housing.

[0021] Preferably, the power component is a rotary motor, and the output shaft of the rotary motor is connected to the assembly in a transmission manner.

[0022] Preferably, a buffer is provided between the carrier and the connector, the buffer being configured to limit excessive stretching or contraction of the telescopic body.

[0023] Preferably, the buffer is a thrust bearing, which is disposed on the side of the carrier facing the assembly.

[0024] Preferably, the support member has a through hole, which is configured to allow the connector to pass through, and the thrust bearing is coaxial with the through hole.

[0025] A chip bonding apparatus, comprising the bonding head described above.

[0026] Preferably, the chip bonding device further includes a driving mechanism, which is connected to the base component to drive the base component to move along the preset direction.

[0027] The beneficial effects of this invention are:

[0028] The bellows in this invention is an elastic mechanism. If the substrate or chip thickness is too large, the bellows will be compressed, and the pressure caused by this compression is negligible. This allows the chip to be driven to descend quickly to the same preset height. Compared with the prior art, the bellows configuration can achieve high-speed output of the target pressure value without the need for force sensor feedback. That is, the chip does not need to search for the substrate height at a low speed during descent, which helps to improve the efficiency of chip bonding and thus increase production capacity.

[0029] Furthermore, adjusting the relative positions of the carrier and the base component using an adjustment assembly ensures that the carrier and the telescopic body are in perfect contact. At this point, the elasticity of the telescopic body and the gravity of the adsorption component cancel each other out, ensuring a minimum output pressure of zero. This avoids the chip being limited by the weight of the adsorption component during the pressing process, allowing the bonding head to output a smaller force and improving its applicability. Adjusting the relative positions of the carrier and the base component also avoids errors caused by the processing or assembly of the bellows. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the bonding head provided by the present invention;

[0031] Figure 2 This is a cross-sectional view of the bonding head provided by the present invention.

[0032] In the picture:

[0033] 1. Base component; 2. Bearing component; 3. Adjustment component; 31. First thread; 32. Second thread; 4. Bellows; 41. Assembly; 42. Telescopic body; 43. Connecting component; 5. Power component; 6. Adsorption component; 7. Buffer component. Detailed Implementation

[0034] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0035] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0036] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0037] In the description of this embodiment, the terms "upper," "lower," "left," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0038] Based on the foregoing, most chip bonding systems on the market currently include force sensors and bonding components. The force sensor provides pressure feedback to precisely control the pressure output. The specific workflow is as follows: a motor drives the bonding component downwards. Then, when the bonding component is about to contact the substrate (the distance is manually set by the thickness tolerances of the substrate and chip), the motor decelerates, causing the bonding component to move downwards at a very low, constant speed until the chip contacts the substrate. Then, when the required pressure is reached, the motor immediately stops the bonding component from descending. The reason for the slow, constant descent is that there are tolerances in the thickness of the substrate and chip; the exact height needs to be determined by the force sensor feedback. A rapid descent could damage the chip.

[0039] However, due to the micron-level fluctuations in substrate thickness, the pressing component cannot descend to the same height every time. If the chip is too high, it may be damaged; if it is too low, it cannot be pressed down. As a result, the pressing component has to slow down after reaching a certain distance above the chip and then slowly press down until the force sensor reading reaches the required pressure. Then, it feeds back to the motor to stop moving downward, which in turn results in lower chip production capacity.

[0040] Please see Figure 1 and Figure 2 To address the aforementioned problems, this embodiment provides a bonding head, which includes a base component 1, a carrier component 2, an adjusting component 3, a bellows 4, a power component 5, and an adsorption component 6. The carrier component 2 is movably disposed on the base component 1 along a preset direction. In this embodiment, the preset direction is vertical. The adjusting component 3 is disposed between the carrier component 2 and the base component 1 and configured to adjust the position of the carrier component 2 on the base component 1. The bellows 4 includes an assembly 41, a telescopic body 42, and a connector 43. The assembly 41 is embedded at one end of the telescopic body 42, and the connector 43 is disposed at the end of the telescopic body 42 away from the assembly 41. The assembly 41 is disposed on the base component 1, and the carrier component 2 can abut against the side of the connector 43 opposite to the assembly 41, with the connector 43 partially moving through the carrier component 2. The power component 5 is disposed on the base component 1 and configured to drive the assembly 41 to rotate around its axis; that is, in this embodiment, the power component 5 is used to drive the assembly 41 to rise and fall. The adsorption element 6 is disposed at one end of the connector 43 away from the assembly 41, and the adsorption element 6 is configured to absorb the chip.

[0041] In practical applications, the relative positions of the carrier 2 and the base 1 are first adjusted by adjusting component 3, so that the carrier 2 and the telescopic body 42 are in contact, ensuring that the elastic force of the telescopic body 42 and the gravity of the adsorption component 6 cancel each other out. Then, the assembly 41 is rotated by the power component 5 to rotate the chip to a preset position. Finally, an external device drives the bonding head to descend and press the chip onto the substrate. It should be noted that the adsorption component 6 can be a vacuum adsorption disk as used in existing technology, which will not be elaborated upon.

[0042] Understandably, because the bellows 4 is an elastic mechanism, if the substrate or chip thickness is too large, the bellows 4 will be compressed. The pressure caused by this compression is negligible, allowing the driven chip to quickly descend to the preset height. Compared to existing technologies, the bellows 4 configuration enables high-speed output of the target pressure value without the need for force sensor feedback. That is, the driven chip does not need to search for the substrate height at low speed during descent, which helps improve chip bonding efficiency and thus increases production capacity. It should be noted that the bellows 4 is existing technology. Specifically, the bellows 4 has two pressure output modes: spring-loaded and non-spring-loaded. Due to these two pressure output modes, the bonding head using the bellows 4 can provide a wide range of output pressures to meet the process requirements of more chips.

[0043] It should also be noted that, taking the design target of 0.5N-50N as an example, the bellows 4 needs to have a small elastic coefficient to ensure that errors in the compression amount of the bellows 4 will not cause too much force fluctuation and damage the chip. Assuming a large elastic coefficient (e.g., 15N / mm), achieving a pressure of 0.5N requires 0.0333mm. If there is a 0.1mm error, the output pressure will be 2N, which is four times the target pressure value, completely failing to meet the process requirements. Assuming a pressure of 0.3N is to be achieved, the 1.5N / mm bellows 4 needs to be compressed by 0.2mm. If there is a 0.1mm compression error, the output force may reach 0.45N, exceeding the rated value by 50%, which is also unacceptable in the process. In the existing technology, the bellows 4 with a small elastic coefficient is 1.5N / mm. Achieving a pressure of 0.5N requires compressing the bellows 4 by approximately 0.333mm (pressure = elastic coefficient * compression amount). If there is a 0.1mm compression error, the actual maximum pressure can reach 0.65N. It should be noted that, due to the weight of the adsorption component 6, the actual pressure exerted on the chip during the pressing process is equal to the sum of the elastic force of the bellows 4 and the weight of the adsorption component 6.

[0044] Understandably, adjusting the relative positions of the carrier 2 and the base 1 using the adjusting component 3 ensures that the carrier 2 and the telescopic body 42 are in contact. At this point, the elasticity of the telescopic body 42 and the gravity of the adsorption component 6 cancel each other out, ensuring that the minimum output pressure is zero. This avoids the chip being limited by the weight of the adsorption component 6 during the pressing process, allowing the bonding head to output a smaller force and improving its applicability. It is also understandable that adjusting the relative positions of the carrier 2 and the base 1 using the adjusting component 3 can avoid errors caused by the processing or assembly of the bellows 4.

[0045] The adjusting component 3 includes a first thread 31 and a second thread 32. The first thread 31 is disposed on the base component 1, and the second thread 32 is disposed on the bearing component 2. The first thread 31 and the second thread 32 are adapted to be screwed together. It can be understood that by adjusting the position of the engagement of the first thread 31 and the second thread 32, the relative position of the bearing component 2 and the base component 1 can be adjusted, which is easier to operate and has a simple structure.

[0046] Furthermore, the carrier 2 is a shell, and a receiving cavity is formed inside the shell. The bellows 4 is located in the receiving cavity. One end of the shell is connected to the base 1 through the adjusting component 3, and the connecting component 43 moves through the other end of the shell. It can be understood that placing the bellows 4 in the receiving cavity can provide a certain degree of protection for the bellows 4 and help extend the service life of the bonding head.

[0047] To further improve ease of operation, the first thread 31 is an external or internal thread arranged in a ring on the base component 1, and the second thread 32 is an internal or external thread arranged in a ring on the outer wall of one end of the housing. In this embodiment, the first thread 31 is an external thread, and the second thread 32 is correspondingly set as an internal thread. It can be understood that turning the housing can change the relative position between the housing and the base component 1, and the housing is easier for the operator to grip.

[0048] The power component 5 is a rotary motor, and the output shaft of the rotary motor is connected to the assembly 41 for transmission. It is understood that driving the assembly 41 to move via the rotary motor helps improve the automation level of the bonding head. It should be noted that the rotary motor is existing technology, and the connection method between the rotary motor and the assembly 41 is also existing technology; therefore, it will not be elaborated upon in this embodiment.

[0049] A buffer 7 is provided between the carrier 2 and the connector 43. The buffer 7 is configured to limit the excessive expansion and contraction of the telescopic body 42, thereby providing a certain degree of protection for the bellows 4 and further helping to extend the service life of the key head. In this embodiment, the buffer 7 is a thrust bearing, which is located on the side of the carrier 2 facing the assembly 41. It is understood that thrust bearings are existing technology, with a simple structure and low cost.

[0050] To improve the ease of assembly of the bonding head, a through hole is provided on the carrier 2, which is configured to allow the connector 43 to pass through. The thrust bearing is coaxially arranged with the through hole.

[0051] This embodiment also provides a chip bonding apparatus, which includes the aforementioned bonding head. It is understood that the chip bonding apparatus including the bonding head helps improve chip bonding efficiency, thereby increasing production capacity. Furthermore, the chip bonding apparatus also includes a drive mechanism, which is connected to the base component 1 to drive the base component 1 to move along a preset direction, thereby causing the bonding head to rise and fall. It is understood that driving the bonding head to rise and fall via the drive mechanism can meet the space requirements of the adsorption component 6 when picking up the chip. It should be noted that the drive mechanism can be any linear drive mechanism in the prior art, such as a linear module, an electric cylinder, etc., without any requirements or limitations.

[0052] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A bonding head, characterized in that, include: Basic component (1); The support member (2) is movably mounted on the base member (1) in a preset direction; An adjustment component (3) is disposed between the support member (2) and the base member (1) and is configured to adjust the position of the support member (2) on the base member (1); The bellows (4) includes an assembly (41), a telescopic body (42), and a connector (43). The assembly (41) is embedded at one end of the telescopic body (42), and the connector (43) is disposed at the end of the telescopic body (42) away from the assembly (41). The assembly (41) is disposed on the base (1), the support member (2) can abut against the side of the connector (43) away from the assembly (41), and the connector (43) partially moves through the support member (2). A power component (5) is disposed on the base component (1), and the power component (5) is configured to drive the assembly (41) to rotate about its axis; as well as An adsorption element (6) is disposed at one end of the connector (43) away from the assembly (41), and the adsorption element (6) is configured to adsorb the chip; The adjustment component (3) includes: The first thread (31) is provided on the base component (1); The second thread (32) is provided on the bearing member (2), and the first thread (31) and the second thread (32) are adapted to be screwed together; The adjustment component (3) adjusts the relative position of the support member (2) and the base member (1) so that when the support member (2) and the telescopic body (42) are in contact, the elastic force of the telescopic body (42) and the gravity of the adsorption member (6) cancel each other out, ensuring that the minimum output pressure is zero.

2. A bonding head according to claim 1, characterized in that, The support member (2) is a shell with a cavity inside. The corrugated pipe (4) is located in the cavity. One end of the shell is connected to the base member (1) through the adjustment component (3), and the connector (43) moves through the other end of the shell.

3. A bonding head according to claim 2, characterized in that, The first thread (31) is an external or internal thread that is arranged in a ring on the base (1), and the second thread (32) is an internal or external thread that is arranged in a ring on the outer wall of one end of the housing.

4. A bonding head according to claim 1, characterized in that, The power component (5) is a rotary motor, and the output shaft of the rotary motor is connected to the assembly (41) for transmission.

5. A bonding head according to claim 1, characterized in that, A buffer (7) is provided between the carrier (2) and the connector (43), and the buffer (7) is configured to limit the excessive stretching of the telescopic body (42).

6. A bonding head according to claim 5, characterized in that, The buffer (7) is a thrust bearing, which is located on the side of the carrier (2) facing the assembly (41).

7. A bonding head according to claim 6, characterized in that, The bearing member (2) has a through hole, which is configured to allow the connector (43) to pass through. The thrust bearing is coaxial with the through hole.

8. A chip bonding apparatus, characterized in that, Includes the bonding head as described in any one of claims 1-7.

9. A chip bonding apparatus according to claim 8, characterized in that, The chip bonding device further includes a driving mechanism, which is connected to the base component (1) to drive the base component (1) to move along the preset direction.

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