Control method and device of beam energy adjusting apparatus, and wafer processing apparatus

Abstract

The present disclosure provides a control method and device of a light beam energy adjusting apparatus, a medium and a wafer processing apparatus. The light beam energy adjusting apparatus comprises a light beam energy variable attenuation mechanism. The control method comprises: obtaining state information of the light beam energy variable attenuation mechanism; and adjusting a light beam energy variable attenuation related parameter of the light beam energy variable attenuation mechanism to adjust the energy of a light beam passing through the light beam energy variable attenuation mechanism when it is determined according to the state information that the light beam energy variable attenuation mechanism belongs to a preset state. The control method of the light beam energy adjusting apparatus in the present disclosure can improve the utilization rate of the light beam energy variable attenuation mechanism, save equipment cost, reduce the replacement frequency, improve production efficiency, and reduce the increase in time cost caused by equipment maintenance.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor lithography technology, and in particular to a control method, apparatus, medium, and wafer processing equipment for a beam energy adjustment device. Background Technology

[0002] In related technologies, wafer processing equipment is often equipped with beam energy adjustment devices. These devices regulate laser energy by using an attenuator mirror (also known as a Variable Attenuator mirror, VA mirror) to attenuate and adjust the laser energy to obtain a usable laser beam. This usable laser beam is then transmitted to the exposure unit of the wafer processing equipment for wafer processing. However, attenuator mirrors are very expensive and may become unusable due to burn-in. Replacing these attenuator mirrors is extremely costly, and the process of replacing them in a beam energy adjustment device is relatively cumbersome, further increasing time costs. Summary of the Invention

[0003] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0004] This disclosure provides a control method, apparatus, medium, and wafer processing equipment for a beam energy conditioning device.

[0005] According to a first aspect of the present disclosure, a control method for a beam energy adjustment device is provided, the beam energy adjustment device including a beam energy variable attenuation mechanism.

[0006] The control method includes:

[0007] Obtain the state information of the variable beam energy attenuation mechanism;

[0008] When the state information determines that the variable beam energy attenuation mechanism is in a preset state, the variable beam energy attenuation parameter of the variable beam energy attenuation mechanism is adjusted to adjust the energy of the beam passing through the variable beam energy attenuation mechanism.

[0009] According to some exemplary embodiments of this disclosure, the state information of the variable beam energy attenuation mechanism includes at least one of the following:

[0010] The rotation angle of the variable beam energy attenuation mechanism and the burn status of the variable beam energy attenuation mechanism.

[0011] According to some exemplary embodiments of this disclosure, the variable beam energy attenuation parameter includes at least one of the following:

[0012] The angle of the variable beam energy attenuation mechanism relative to the beam incident direction, and the variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism.

[0013] According to some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a plurality of beam energy variable attenuation regions for receiving beams;

[0014] The adjustment of the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism includes:

[0015] The current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism is adjusted to a preset variable beam energy attenuation region, and the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0016] According to some exemplary embodiments of this disclosure, the control method further includes:

[0017] According to preset rules, the beam energy variable attenuation mechanism is divided into multiple beam energy variable attenuation regions.

[0018] According to some exemplary embodiments of this disclosure, the method for adjusting the current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism to a preset variable beam energy attenuation region includes:

[0019] Drive the variable beam energy attenuation mechanism to move along the X-axis and Y-axis directions in the preset coordinate system, so as to adjust the current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism to the preset variable beam energy attenuation region.

[0020] A method for adjusting the angle of the preset beam energy variable attenuation region relative to the beam incident direction to a preset angle includes:

[0021] Adjust the angle of the variable beam energy attenuation mechanism so that the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0022] According to some exemplary embodiments of this disclosure, the preset state includes an abnormality of the beam energy variable attenuation mechanism.

[0023] According to some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a beam energy variable attenuation lens;

[0024] The abnormality of the variable beam energy attenuation mechanism includes at least one of the following:

[0025] The variable beam energy attenuation area of ​​the variable beam energy lens was burned.

[0026] The loss of the variable attenuation mechanism for beam energy;

[0027] The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

[0028] According to a second aspect of the present disclosure, a control device for a beam energy adjustment device is provided, the beam energy adjustment device including a beam energy variable attenuation mechanism, the control device comprising:

[0029] The acquisition module is configured to acquire the status information of the variable beam energy attenuation mechanism;

[0030] The adjustment module is configured to adjust the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism when the beam energy variable attenuation mechanism is determined to be in a preset state based on the state information, so as to adjust the energy of the beam passing through the beam energy variable attenuation mechanism.

[0031] In some exemplary embodiments of this disclosure, the acquisition module is configured as follows:

[0032] The rotation angle and failure location of the variable beam energy attenuation mechanism are obtained using an image acquisition device; and / or

[0033] The burn status of the variable beam energy attenuation mechanism is obtained by the burn status acquisition device.

[0034] In some exemplary embodiments of this disclosure, the variable beam energy attenuation parameter includes at least one of the following:

[0035] The angle of the variable beam energy attenuation mechanism relative to the beam incident direction, and the variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism.

[0036] In some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a plurality of beam energy variable attenuation regions for receiving beams;

[0037] The adjustment module is configured as follows:

[0038] The current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism is adjusted to a preset variable beam energy attenuation region, and the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0039] In some exemplary embodiments of this disclosure, the control device further includes:

[0040] The division module is configured to divide the beam energy variable attenuation mechanism into multiple beam energy variable attenuation regions according to preset rules.

[0041] In some exemplary embodiments of this disclosure, the adjustment module is configured to:

[0042] Drive the variable beam energy attenuation mechanism to move along the X-axis and Y-axis directions in the preset coordinate system, so as to adjust the current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism to the preset variable beam energy attenuation region.

[0043] Adjust the angle of the variable beam energy attenuation mechanism so that the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0044] In some exemplary embodiments of this disclosure, the preset state includes an anomaly in the variable beam energy attenuation mechanism.

[0045] In some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a beam energy variable attenuation lens;

[0046] The abnormality of the variable beam energy attenuation mechanism includes at least one of the following:

[0047] The variable beam energy attenuation area of ​​the variable beam energy lens was burned.

[0048] The loss of the variable attenuation mechanism for beam energy;

[0049] The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

[0050] According to a third aspect of the present disclosure, a control device for a beam energy adjustment device is provided, the beam energy adjustment device including a beam energy variable attenuation mechanism, the control device comprising:

[0051] The acquisition unit is configured to acquire the state information of the beam energy variable attenuation mechanism.

[0052] The adjustment mechanism is configured to adjust the variable beam energy attenuation parameter of the variable beam energy attenuation mechanism;

[0053] The control unit is configured to receive status information sent by the acquisition unit and determine whether the beam energy variable attenuation mechanism belongs to a preset state based on the status information; if it belongs to the preset state, it generates an adjustment command to instruct the adjustment mechanism to adjust the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism, thereby adjusting the energy of the beam passing through the beam energy variable attenuation mechanism.

[0054] According to some exemplary embodiments of this disclosure, the acquisition unit includes: an image acquisition device and a burn status acquisition device.

[0055] The image acquisition device is positioned above the variable beam energy attenuation mechanism and is used to monitor the rotation angle and failure location of the variable beam energy attenuation mechanism.

[0056] The burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the VA curve automatically generated by the lithography machine, or the burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the beam energy adjustment result of the variable beam energy attenuation mechanism.

[0057] According to some exemplary embodiments of this disclosure, the variable beam energy attenuation parameter includes at least one of the following:

[0058] The angle of the variable beam energy attenuation mechanism relative to the beam incident direction, and the variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism.

[0059] According to some embodiments of this disclosure, the beam energy variable attenuation mechanism includes a plurality of beam energy variable attenuation regions for receiving beams;

[0060] The adjustment mechanism includes a position driving mechanism configured to drive the beam energy variable attenuation mechanism to adjust from the current beam energy variable attenuation region of the received beam to a preset beam energy variable attenuation region.

[0061] According to some exemplary embodiments of this disclosure, the position driving mechanism includes:

[0062] The first moving mechanism is configured to drive the beam energy variable attenuation mechanism to move along the X-axis direction in a preset coordinate system;

[0063] The second moving mechanism is configured to drive the beam energy variable attenuation mechanism to move along the Y-axis direction in the preset coordinate system;

[0064] A driving mechanism is configured to receive the adjustment command and drive the first moving mechanism and / or the second moving mechanism to drive the beam energy variable attenuation mechanism to adjust from the current beam energy variable attenuation region of the received beam to a preset beam energy variable attenuation region.

[0065] According to some exemplary embodiments of this disclosure, the adjustment mechanism includes a rotation drive mechanism configured to drive the beam energy variable attenuation mechanism to rotate, so as to adjust the angle of the preset beam energy variable attenuation region relative to the beam incident direction to a preset angle.

[0066] According to some exemplary embodiments of this disclosure, the preset state includes an abnormality of the beam energy variable attenuation mechanism.

[0067] According to some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a beam energy variable attenuation lens;

[0068] The abnormality of the variable beam energy attenuation mechanism includes at least one of the following:

[0069] The variable beam energy attenuation area of ​​the variable beam energy lens was burned.

[0070] The loss of the variable attenuation mechanism for beam energy;

[0071] The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

[0072] According to a fourth aspect of the present disclosure, a control device for a beam energy adjustment device is provided, the control device comprising:

[0073] processor;

[0074] Memory used to store processor-executable instructions;

[0075] The processor is configured to execute a control method for a beam energy adjustment device provided according to embodiments of the present disclosure.

[0076] According to a fifth aspect of the present disclosure, a non-transitory computer-readable storage medium is provided, wherein when instructions in the storage medium are executed by a processor of a control device for a beam energy adjustment device, the control device for the beam energy adjustment device is enabled to perform a control method for a beam energy adjustment device provided according to an embodiment of the present disclosure. Alternatively, when instructions in the storage medium are executed by a processor, the processor is enabled to perform a control method for a beam energy adjustment device provided according to an embodiment of the present disclosure.

[0077] According to a sixth aspect of the present disclosure, a wafer processing apparatus is provided, the wafer processing apparatus including a control device for a beam energy adjustment device provided according to an embodiment of the present disclosure.

[0078] After reading and understanding the accompanying diagrams and detailed descriptions, other aspects can be understood. Attached Figure Description

[0079] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of these embodiments. In these drawings, similar reference numerals are used to denote similar elements. The drawings described below are some embodiments of the present disclosure, but not all embodiments. Other drawings will be readily available to those skilled in the art based on these drawings without inventive effort.

[0080] Figure 1 This is a flowchart illustrating a control method for a beam energy adjustment device according to an exemplary embodiment;

[0081] Figure 2a This is a schematic diagram illustrating the attenuation principle of a variable beam energy attenuation mechanism in a beam energy adjustment device according to an exemplary embodiment, with the beam energy incident at an angle α1.

[0082] Figure 2b This is a schematic diagram illustrating the attenuation principle of a variable beam energy attenuation mechanism in a beam energy adjustment device according to an exemplary embodiment, with the beam energy incident at an angle α2.

[0083] Figure 3 This is a schematic diagram of the variable beam energy attenuation region divided by the variable beam energy attenuation mechanism according to an exemplary embodiment.

[0084] Figure 4 This is a structural block diagram of a control device for a beam energy adjustment device according to an exemplary embodiment;

[0085] Figure 5 This is a structural block diagram of a control device for a beam energy adjustment device according to an exemplary embodiment;

[0086] Figure 6 This is a schematic diagram of a display unit of a beam energy adjustment device according to an exemplary embodiment;

[0087] Figure 7 This is a schematic diagram of a drive mechanism for a variable beam energy attenuation mechanism according to an exemplary embodiment;

[0088] Figure 8 This is a structural block diagram of a control device for a beam energy adjustment device according to an exemplary embodiment. Detailed Implementation

[0089] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0090] In related technologies, when processing wafers using wafer processing equipment, the laser beam energy needs to be adjusted by a variable energy attenuation lens in the beam energy adjustment device of the wafer processing equipment. After attenuation, the laser beam is transmitted to the exposure machine for wafer processing through corresponding optical lenses and other devices. During the use of the attenuation lens, the laser beam may burn the attenuation lens. Replacing the burned variable energy attenuation lens will incur significant time costs, and the variable energy attenuation lens (i.e., VA lens) is expensive. Incomplete utilization of the attenuation lens also results in material waste.

[0091] This disclosure exemplarily provides a control method for a beam energy adjustment device. This method, by combining the state information of the variable beam energy attenuation mechanism within the beam energy adjustment device, determines whether the variable beam energy attenuation mechanism is in a preset state. For the variable beam energy attenuation mechanism in the preset state, its variable beam energy attenuation parameters can be adjusted to regulate the energy of the beam passing through the mechanism. This control method improves the utilization rate of the variable beam energy attenuation mechanism, reduces replacement frequency, and saves corresponding time and equipment costs.

[0092] The present disclosure will now be described in conjunction with the accompanying drawings and specific embodiments.

[0093] Exemplary embodiments of this disclosure provide a control method for a beam energy adjustment device, wherein the beam energy adjustment device includes a beam energy variable attenuation mechanism.

[0094] like Figure 1 As shown, Figure 1 This is a flowchart illustrating a control method for a beam energy conditioning device according to an exemplary embodiment. The control method for the beam energy conditioning device includes:

[0095] Step S101: Obtain the state information of the variable beam energy attenuation mechanism;

[0096] Step S102: When the beam energy variable attenuation mechanism is determined to be in a preset state based on the state information, adjust the beam energy variable attenuation related parameters of the beam energy variable attenuation mechanism to adjust the energy of the beam passing through the beam energy variable attenuation mechanism.

[0097] In this exemplary embodiment, considering that the variable beam energy attenuation mechanism needs adjustment if it is in a preset state during use to meet the energy requirements of downstream equipment or processed devices, such as the laser beam energy requirements in wafer manufacturing, this control method can acquire the state information of the variable beam energy attenuation mechanism in the beam energy adjustment device and determine whether the variable beam energy attenuation parameters of the mechanism need to be adjusted based on this state information. For example, if the state information determines that the variable beam energy attenuation mechanism is in a preset state, the energy of the beam passing through the mechanism can be adjusted by adjusting the variable beam energy attenuation parameters. This control method can improve the utilization rate of the variable beam energy attenuation mechanism, save equipment costs, and reduce the number of replacements, thereby improving production efficiency and reducing the time cost increase caused by equipment maintenance.

[0098] In some exemplary embodiments, the state information of the variable beam energy attenuation mechanism includes at least one of the following: the rotation angle of the variable beam energy attenuation mechanism, and the burn status of the variable beam energy attenuation mechanism.

[0099] In some exemplary embodiments, the method for obtaining state information of a variable beam energy attenuation mechanism includes: acquiring the rotation angle and failure position of the variable beam energy attenuation mechanism using an image acquisition device; and / or

[0100] The burn state of the variable attenuation mechanism of the beam energy is obtained by the burn state acquisition device.

[0101] To ensure the comprehensiveness of the status information acquisition for the variable beam energy attenuation mechanism, the monitoring can be conducted on aspects such as the working position, rotation angle, and burn status of the mechanism during its operation.

[0102] In an exemplary embodiment of this disclosure, the image acquisition device includes a camera, a still camera, or other image acquisition device capable of acquiring the rotation angle and failure position of the variable beam energy attenuation mechanism. The failure position refers to the location where the variable beam energy attenuation mechanism stops rotating at a certain angle, causing the machine to malfunction. By adding the image acquisition device, image data of the variable beam energy attenuation mechanism can be acquired in real time. The image acquisition device can be positioned at any location capable of acquiring the rotation angle and failure position information of the variable beam energy attenuation mechanism, for example, it can be positioned above or diagonally above the variable beam energy attenuation mechanism to clearly and accurately acquire its image data. Combining this image data, the rotation angle and failure position of the variable beam energy attenuation mechanism can be analyzed and determined.

[0103] In exemplary embodiments of this disclosure, the burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the VA curve automatically generated by the lithography machine; or the burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the beam energy adjustment result of the variable beam energy attenuation mechanism; or the burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on a strong light irradiation tool (such as a strong light flashlight) and manual observation (such as naked eye observation). Specifically, the following methods are included in determining the burn status of the variable beam energy attenuation mechanism:

[0104] It can be observed by combining strong light irradiation with manual observation;

[0105] The lithography machine will automatically generate the VA curve. The smoothness of the VA curve is used to judge its smoothness. Normally, it is smooth.

[0106] If adjusting the variable attenuation mechanism of the beam energy cannot obtain the preset energy, it indicates that the beam has been burned.

[0107] Furthermore, in this exemplary embodiment, after acquiring image data using the image acquisition device, the status information of the variable beam energy attenuation mechanism can be displayed using a corresponding display device. Workers in front of the display device can also observe and analyze whether the variable beam energy attenuation mechanism has been burned, its rotational state, and whether it is in a burned (failed) position. The image acquisition device can be positioned above or diagonally above the variable beam energy attenuation mechanism to accurately acquire the angular information of the mechanism after rotation. After displaying this information on the display device of the beam energy adjustment equipment, workers can clearly see the rotation angle of the variable beam energy attenuation mechanism. If the variable beam energy attenuation mechanism rotates to a certain angle and stops, causing the beam energy adjustment equipment to malfunction, workers can also clearly see this.

[0108] In this exemplary embodiment, buttons can be added to the interface of the beam energy adjustment device for manual adjustment, or the beam energy adjustment device can be in automatic control mode, and the position can be automatically adjusted to work normally according to the degree of burn of the variable attenuation mechanism of the attenuated beam energy.

[0109] In some exemplary embodiments, the preset state may include an abnormality in the variable beam energy attenuation mechanism. When the variable beam energy attenuation mechanism is abnormal, adjusting the beam energy using the beam energy adjustment device will cause defects in the wafer. In this exemplary embodiment, an abnormality in the variable beam energy attenuation mechanism includes: the variable beam energy attenuation mechanism being burned. Burning of the variable beam energy attenuation mechanism will result in insufficient energy when the beam reaches the wafer surface, which will cause defects in the wafer and reduce the yield. An abnormality in the variable beam energy attenuation mechanism may also include: wear of the variable beam energy attenuation mechanism, the rotation angle of the variable beam energy attenuation mechanism exceeding the preset range, or burning of the current variable beam energy attenuation area of ​​the variable beam energy attenuation lens. Excessive wear of the variable beam energy attenuation mechanism will also result in insufficient energy when the beam reaches the wafer surface, which will cause defects in the wafer and reduce the yield. The rotation angle of the variable beam energy attenuation mechanism exceeding the preset range will cause the machine tool to malfunction, which may lead to production accidents and reduce production efficiency.

[0110] In some exemplary embodiments, the variable beam energy attenuation mechanism includes a variable beam energy attenuation lens; correspondingly, anomalies in the variable beam energy attenuation mechanism include the wear state of the variable beam energy attenuation lens, burns to the variable beam energy attenuation lens, etc.

[0111] When the beam energy variable attenuation mechanism includes a beam energy variable attenuation lens, the rotation angle and failure location of the beam energy variable attenuation lens can be obtained by an image acquisition device and / or the burn status of the beam energy variable attenuation lens can be obtained by a burn status acquisition device, thereby determining whether the status information of the beam energy attenuation lens is in an abnormal state (preset state), so as to determine whether the beam energy variable attenuation parameter of the beam energy attenuation lens needs to be adjusted.

[0112] In some exemplary embodiments, considering that when a beam energy variable attenuation mechanism attenuates the beam in a fixed state for wafer processing, insufficient energy may occur when the beam reaches the wafer surface, leading to wafer defects and ultimately reducing product yield. Therefore, in this exemplary embodiment, the beam energy variable attenuation related parameters include at least one of the following: the angle of the beam energy variable attenuation mechanism relative to the beam incident direction, the beam energy variable attenuation region where the beam is received by the beam energy variable attenuation mechanism, etc.

[0113] In this exemplary embodiment, considering that the angle of the variable beam energy attenuation mechanism relative to the beam incident direction can affect the energy intensity of the beam passing through the variable beam energy attenuation mechanism, when the beam energy is insufficient when it reaches the wafer surface or when the beam energy required to process the wafer changes, the energy of the beam can be controlled by adjusting the angle of the variable beam energy attenuation mechanism relative to the beam incident direction.

[0114] like Figures 2a-2b As shown, Figure 2a and Figure 2b An exemplary diagram illustrates the beam reception and attenuation process of a variable beam energy attenuation mechanism. For example, a laser beam, the energy of the beam after passing through the attenuation lens 201 varies depending on the angle at which it is incident on the lens. The diagram shows laser beams incident at two angles: α1 and α2. M represents the incident region M on the attenuation lens, where the incident angle α1 is greater than α2. L1 is the incident beam, L2 is the reflected beam, and L3 is the transmitted beam. The energy of the beam transmitted through the attenuation lens at incident angle α1 is less than the energy of the beam transmitted through the attenuation lens at incident angle α2. That is, the larger the incident angle of the laser beam at the attenuation lens 201, the lower the energy of the laser beam transmitted through the attenuation lens, and the reflected laser beam is collected by the beam collector 202; conversely, the lower the incident angle, the higher the energy of the laser beam transmitted through the attenuation lens, and the reflected laser beam is collected by the beam collector 202. Based on this, a variable beam energy attenuation lens can be used to attenuate laser beams.

[0115] Considering that the variable beam energy attenuation mechanism will experience some loss during use—that is, before obvious burning occurs—if the beam is attenuated in the same fixed state, the energy of the resulting beam may decrease. In this case, during wafer processing, if the required beam energy is a fixed value, continuing to process the laser beam using the variable beam energy attenuation mechanism relative to the beam incident direction will not meet the actual energy requirements. Therefore, during wafer processing, if the required beam energy is a fixed value, when attenuating the beam using the variable beam energy attenuation mechanism, the angle of the variable beam energy attenuation mechanism relative to the beam incident direction can be gradually adjusted according to a preset adjustment direction. If the required beam energy is not a fixed value, the angle of the variable beam energy attenuation mechanism relative to the beam incident direction corresponding to the required beam energy can be corrected first, and then adjusted according to the corrected angle. Alternatively, the angle of the variable beam energy attenuation mechanism relative to the beam incident direction can be left unchanged, and the duration of beam irradiation on the wafer can be directly adjusted. In this exemplary embodiment, when correcting the angle of the beam energy variable attenuation mechanism relative to the beam incident direction, the degree of loss of the beam energy variable attenuation mechanism is used; similarly, when adjusting the duration of the beam irradiation on the wafer, the degree of loss of the beam energy variable attenuation mechanism can also be used for adjustment.

[0116] In this exemplary embodiment, the inventors of this disclosure creatively contribute the following: Considering that when the variable beam energy attenuation area of ​​the beam receiving mechanism is burned or damaged for other reasons, making beam adjustment impossible, the variable beam energy attenuation area of ​​the beam receiving mechanism can be switched. For example, the currently used variable beam energy attenuation mechanism can be divided into several variable beam energy attenuation areas that can be used to receive the beam. In actual use, these several variable beam energy attenuation areas can be used according to preset usage rules. In this case, it is not necessary to replace the entire variable beam energy attenuation mechanism when the currently used variable beam energy attenuation area for receiving the beam is burned or damaged for other reasons.

[0117] In some exemplary embodiments, considering that the shape of the variable beam energy attenuation mechanism may be square, rectangular, or other polygonal structures, when using the variable beam energy attenuation mechanism in sections, it is necessary to avoid reusing the same position of the variable beam energy attenuation mechanism. Therefore, it is necessary to reasonably divide the variable beam energy attenuation mechanism into multiple corresponding variable beam energy attenuation regions. In this exemplary embodiment, the control method further includes: dividing the variable beam energy attenuation mechanism into multiple variable beam energy attenuation regions according to preset rules. Figure 3 As shown, Figure 3 This is a schematic diagram of a beam energy variable attenuation mechanism according to an exemplary embodiment of the present disclosure, including multiple beam energy variable attenuation regions for receiving beams. The beam energy variable attenuation mechanism is a beam energy variable attenuation lens, which is rectangular. The circular beam energy variable attenuation mechanism is divided into four beam energy variable attenuation regions: region A, region B, region C, and region D. Further division along a crosshair around the center of the beam energy variable attenuation mechanism yields four sub-beam energy variable attenuation mechanisms similar in shape to the original beam energy variable attenuation mechanism. In other exemplary embodiments, the division of the beam energy variable attenuation mechanism into beam energy variable attenuation regions can be determined based on the shape of the attenuation mechanism and the number of beam energy variable attenuation regions to be divided, which will not be elaborated further here.

[0118] When the beam energy variable attenuation mechanism is divided into multiple beam energy variable attenuation regions, any one of these regions can be used as the beam incident region. Combined with... Figure 2a and Figure 2b It can be seen that the incident region M on the attenuating lens can be any region among the variable attenuation regions A, B, C and D of the beam energy.

[0119] In some exemplary embodiments of this disclosure, a method for adjusting the current variable beam energy attenuation region of the received beam of a variable beam energy attenuation mechanism to a preset variable beam energy attenuation region may include: driving the variable beam energy attenuation mechanism to move along the X-axis and Y-axis directions of a preset coordinate system to adjust the current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism to the preset variable beam energy attenuation region. The variable beam energy attenuation mechanism can be driven by an adjustment mechanism to achieve adjustment of the variable beam energy attenuation mechanism along the X-axis and Y-axis directions of the preset coordinate system. Figure 7 The adjustment mechanism shown may include a position driving mechanism and a beam energy variable attenuation mechanism 702 to adjust the beam energy variable attenuation mechanism from the current beam energy variable attenuation region to a preset beam energy variable attenuation region. The position driving mechanism includes a first moving mechanism 703 and a second moving mechanism 704. The first moving mechanism 703 drives the beam energy variable attenuation mechanism 702 to move along the X-axis direction of the preset coordinate system; the second moving mechanism 704 drives the beam energy variable attenuation mechanism 702 to move along the Y-axis direction of the preset coordinate system. The position driving mechanism may also include a driving mechanism (not shown) to drive the first moving mechanism 703 and the second moving mechanism 704 to move along the X-axis and Y-axis directions of the preset coordinate system, respectively.

[0120] A method for adjusting the angle of a preset beam energy variable attenuation region relative to the beam incident direction to a preset angle includes: adjusting the angle of the beam energy variable attenuation mechanism so that the angle of the preset beam energy variable attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0121] In this exemplary embodiment, the beam energy can also be adjusted by combining the angle of the beam energy variable attenuation mechanism relative to the beam incident direction and the attenuation region of the beam energy variable attenuation mechanism that receives the beam. For example, if the beam energy of the beam energy variable attenuation mechanism is still insufficient to meet the beam energy required for wafer processing when the beam energy variable attenuation mechanism is adjusted to its limit rotation angle, the beam energy variable attenuation region currently used to receive the beam of the beam can be replaced to adjust the beam energy.

[0122] Considering the high cost of variable beam energy attenuation mechanisms and the significant time cost of replacing them, the mechanisms can be used in sections. In this exemplary embodiment, since the variable beam energy attenuation mechanism in the beam energy adjustment device includes multiple variable beam energy attenuation regions, adjusting the variable beam energy attenuation parameters of the mechanism includes: adjusting the current variable beam energy attenuation region of the received beam of the mechanism to a preset variable beam energy attenuation region. In this exemplary embodiment, by using the variable beam energy attenuation mechanism in sections, its utilization is significantly improved, equipment costs are saved, and the frequency of replacement is reduced.

[0123] This disclosure provides an exemplary embodiment of a control device for a beam energy adjustment device, which includes a beam energy variable attenuation mechanism. For example... Figure 4 As shown, Figure 4 A structural block diagram of a control device for a beam energy adjustment device is shown. The control device 400 includes:

[0124] The acquisition module 401 is configured to acquire the status information of the beam energy variable attenuation mechanism;

[0125] The adjustment module 402 is configured to adjust the beam energy variable attenuation related parameters of the beam energy variable attenuation mechanism when the beam energy variable attenuation mechanism is determined to be in a preset state based on the status information, so as to adjust the energy of the beam passing through the beam energy variable attenuation mechanism.

[0126] In some exemplary embodiments of this disclosure, the acquisition module 401 is configured to;

[0127] The rotation angle and failure location of the variable beam energy attenuation mechanism are obtained through an image acquisition device; and / or

[0128] The burn state of the variable attenuation mechanism of the beam energy is obtained by the burn state acquisition device.

[0129] In some exemplary embodiments of this disclosure, the variable beam energy attenuation parameter includes at least one of the following:

[0130] The angle of the variable beam energy attenuation mechanism relative to the beam incident direction, and the variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism.

[0131] In some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a plurality of beam energy variable attenuation regions for receiving beams;

[0132] The adjustment module 402 is configured to:

[0133] The current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism is adjusted to a preset variable beam energy attenuation region, and the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0134] In some exemplary embodiments of this disclosure, the control device further includes:

[0135] The dividing module 403 is configured to divide the beam energy variable attenuation mechanism into multiple beam energy variable attenuation regions according to preset rules.

[0136] In some exemplary embodiments of this disclosure, the adjustment module 402 is configured to:

[0137] Drive the variable beam energy attenuation mechanism to move along the X-axis and Y-axis directions in the preset coordinate system, so as to adjust the current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism to the preset variable beam energy attenuation region.

[0138] Adjust the angle of the variable beam energy attenuation mechanism so that the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

[0139] In some exemplary embodiments of this disclosure, the preset state includes an anomaly in the variable beam energy attenuation mechanism.

[0140] In some exemplary embodiments of this disclosure, the beam energy variable attenuation mechanism includes a beam energy variable attenuation lens;

[0141] The abnormality of the variable beam energy attenuation mechanism includes any one or more of the following:

[0142] The variable beam energy attenuation area of ​​the variable beam energy lens was burned.

[0143] The loss of the variable attenuation mechanism for beam energy;

[0144] The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

[0145] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0146] This disclosure provides an exemplary embodiment of a control device for a beam energy adjustment device, wherein the beam energy adjustment device includes a variable beam energy attenuation mechanism. In this exemplary embodiment, as... Figure 5 As shown, Figure 5 A structural block diagram of a control device for a beam energy adjustment device is shown. The control device 500 includes:

[0147] Acquisition unit 501 is configured to acquire the state information of the beam energy variable attenuation mechanism;

[0148] The control unit 502 is configured to receive status information sent by the acquisition unit and determine whether the beam energy variable attenuation mechanism is in a preset state based on the status information; if it is in a preset state, it generates an adjustment command to instruct the adjustment mechanism to adjust the beam energy variable attenuation related parameters of the beam energy variable attenuation mechanism and adjust the energy of the beam passing through the beam energy variable attenuation mechanism.

[0149] The adjustment mechanism 503 is configured to adjust the beam energy variable attenuation related parameters of the beam energy variable attenuation mechanism.

[0150] In this exemplary embodiment, considering that the variable beam energy attenuation mechanism needs adjustment if it is in a preset state during use to meet the capability requirements of the laser beam, the acquisition unit in the control device can acquire the status information of the variable beam energy attenuation mechanism in the beam energy adjustment device. The control unit determines whether the variable beam energy attenuation parameters of the variable beam energy attenuation mechanism need to be adjusted based on the status information, and controls the adjustment mechanism 503 to adjust the variable beam energy attenuation parameters. This control device can improve the utilization rate of the variable beam energy attenuation mechanism, save equipment costs, and reduce the number of replacements, thereby improving production efficiency and reducing the time cost increase caused by equipment maintenance.

[0151] When the control unit determines from the status information that the variable beam energy attenuation mechanism is in a preset state, it generates an adjustment command. The control unit then sends the adjustment command to the adjustment mechanism, which adjusts the variable beam energy attenuation parameters to regulate the energy of the beam passing through the mechanism. Alternatively, the adjustment command can be displayed as a prompt on the control screen of the beam energy adjustment device. The operator selects the parameters to be adjusted, and the control unit sends the adjustment command to the adjustment mechanism, which then adjusts the parameters to regulate the energy of the beam passing through the mechanism. Figure 6 The diagram illustrates a schematic of the display unit of a beam energy adjustment device. This display unit includes a screen for displaying the current attenuation angle and / or the currently used beam energy variable attenuation area detected by an image acquisition device. Figure 6 As shown, staff can use the area button 601 to select the variable beam energy attenuation area of ​​the variable beam energy attenuation mechanism.

[0152] In some exemplary embodiments, the acquisition unit 501 includes an image acquisition device and a burn status acquisition device; the image acquisition device is disposed above the variable beam energy attenuation mechanism and is used to monitor the rotation angle and failure position of the variable beam energy attenuation mechanism.

[0153] The burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the VA curve automatically generated by the lithography machine, or the burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the beam energy adjustment result of the variable beam energy attenuation mechanism.

[0154] In some exemplary embodiments, considering that when a beam energy variable attenuation mechanism attenuates the beam in a fixed state for wafer processing, insufficient energy may occur when the beam reaches the wafer surface, leading to wafer defects and ultimately reducing product yield. Therefore, in this exemplary embodiment, the beam energy variable attenuation related parameters include at least one of the following: the angle of the beam energy variable attenuation mechanism relative to the beam incident direction, the beam energy variable attenuation region where the beam is received by the beam energy variable attenuation mechanism, etc.

[0155] In some exemplary embodiments, considering the high cost of the variable beam energy attenuation mechanism and the significant time cost of replacing it, the variable beam energy attenuation mechanism can be used in sections. Therefore, the variable beam energy attenuation mechanism is designed to include multiple variable beam energy attenuation regions for receiving the beam. In this exemplary embodiment, the adjustment mechanism 503 includes a position driving mechanism configured to drive the variable beam energy attenuation mechanism to adjust from the current variable beam energy attenuation region for receiving the beam to a preset variable beam energy attenuation region. In this exemplary embodiment, by using the variable beam energy attenuation mechanism in sections, the utilization of the variable beam energy attenuation mechanism is greatly improved, equipment costs are saved, and the number of times the variable beam energy attenuation mechanism needs to be replaced is reduced.

[0156] In some exemplary embodiments, considering that the variable beam energy attenuation mechanism needs to adjust its planar position on its plane, in order to achieve this adjustment function, in this exemplary embodiment, the adjustment mechanism includes a position driving mechanism configured to drive the variable beam energy attenuation mechanism from the current variable beam energy attenuation region of the received beam to a preset variable beam energy attenuation region. For example... Figure 7 As shown, the position and / or angle of the beam energy variable attenuation mechanism can be monitored in conjunction with the acquisition unit 701, and the beam energy variable attenuation mechanism can be adjusted using a corresponding position driving mechanism. In this exemplary embodiment, the position driving mechanism includes: a first moving mechanism 703 configured to drive the beam energy variable attenuation mechanism 702 to move along the X-axis direction of a preset coordinate system; a second moving mechanism 704 configured to drive the beam energy variable attenuation mechanism 702 to move along the Y-axis direction of the preset coordinate system; and a driving mechanism (not shown) configured to receive an adjustment command to drive the first moving mechanism and / or the second moving mechanism to adjust the beam energy variable attenuation mechanism from the current beam energy variable attenuation region of the received beam to the preset beam energy variable attenuation region. The driving mechanism can be any driving mechanism capable of driving the first moving mechanism 703 and the second moving mechanism 704 to move along the X-axis and Y-axis directions of the preset coordinate system, respectively. For example, it can include a linear motor.

[0157] The variable beam energy attenuation mechanism can move along the X and Y axes, enabling it to move forward, backward, left, and right on its plane, maximizing its utilization. By adjusting the current variable beam energy attenuation area to the preset variable beam energy attenuation area, the required energy for the product can be restored.

[0158] In this exemplary embodiment, both the first and / or second moving mechanisms can be driven by linear motors. When adjusting the beam energy attenuation mechanism along the X and Y axes, the first and second moving mechanisms in the position drive mechanism can be movably connected to corresponding fixed mechanisms in the beam energy adjustment device, such as a laser energy measurement unit, or they can be movably mounted on a separate mounting frame. The drive mechanism can be wired or wirelessly connected to the first moving mechanism 703 and the second moving mechanism 704. Alternatively, one drive mechanism can be provided, simultaneously controlling the first moving mechanism 703 and the second moving mechanism 704 to move along the X and Y axes of a preset coordinate system, respectively; or two drive mechanisms can be provided, each controlling the first moving mechanism 703 and the second moving mechanism 704 to move along the X and Y axes of a preset coordinate system, respectively.

[0159] The linear motor is controlled and connected to the first drive mechanism and the second drive mechanism. Driven by the linear motor, it moves along the X-axis and / or the Y-axis respectively, so as to drive the beam energy variable attenuation mechanism to move along the X-axis and / or the Y-axis, so as to adjust the incident area of ​​the beam to the preset beam energy variable attenuation area of ​​the beam energy variable attenuation mechanism.

[0160] In some exemplary embodiments, considering the need to adjust the angle of the variable beam energy attenuation mechanism relative to the beam incident direction, in this exemplary embodiment, the adjustment mechanism includes a rotation drive mechanism. This rotation drive mechanism is configured to drive the variable beam energy attenuation mechanism to rotate to a preset attenuation angle, i.e., configured to drive the variable beam energy attenuation mechanism to rotate, thereby adjusting the angle of the preset variable beam energy attenuation region relative to the beam incident direction to a preset angle.

[0161] When the variable beam energy attenuation mechanism malfunctions, adjusting the beam energy using the beam energy adjustment device will cause defects in the wafer. In this exemplary embodiment, malfunctions of the variable beam energy attenuation mechanism include: loss of the variable beam energy attenuation mechanism, burning of the variable beam energy attenuation mechanism, etc. Loss of the variable beam energy attenuation mechanism, burning of the variable beam energy attenuation mechanism, etc., will result in insufficient energy of the beam when it reaches the wafer surface, which will in turn cause defects in the wafer and reduce the yield.

[0162] In some exemplary embodiments, the beam energy variable attenuation mechanism includes a beam energy variable attenuation lens; correspondingly, the beam energy variable attenuation mechanism abnormally includes at least one of the following:

[0163] The variable beam energy attenuation area of ​​the variable beam energy lens was burned.

[0164] The loss of the variable attenuation mechanism for beam energy;

[0165] The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

[0166] Exemplary embodiments of this disclosure provide a wafer processing apparatus that includes a control device for a beam energy adjustment device provided according to exemplary embodiments of this disclosure.

[0167] Figure 8 This is a block diagram illustrating a control device, namely a computer device 800, for a beam energy adjustment apparatus according to an exemplary embodiment. For example, the computer device 800 can be provided as a positioning device. (Refer to...) Figure 8 The computer device 800 includes a processor 801, the number of which can be set to one or more as needed. The computer device 800 also includes a memory 802 for storing instructions executable by the processor 801, such as application programs. The number of memories can be set to one or more as needed. The stored application programs can be one or more. The processor 801 is configured to execute instructions to perform the methods described above.

[0168] Those skilled in the art will understand that embodiments of this disclosure can be provided as methods, apparatus (devices), or computer program products. Therefore, this disclosure can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this disclosure can take the form of a computer program product implemented on one or more computer-usable storage media containing computer-usable program code. Computer storage media include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data), including but not limited to RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible by a computer. Furthermore, it is known to those skilled in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and can include any information delivery medium.

[0169] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is provided, such as a memory 802 including instructions, which can be executed by a processor 801 of the device 800 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0170] In an exemplary embodiment of this disclosure, a control device for a beam energy adjustment device includes:

[0171] processor;

[0172] Memory used to store processor-executable instructions;

[0173] The processor is configured to execute the control method for a beam energy adjustment device provided in the exemplary embodiments of this disclosure. In the exemplary embodiments of this disclosure, a non-transitory computer-readable storage medium is provided, enabling the control device for the beam energy adjustment device to execute the control method for the beam energy adjustment device provided in the exemplary embodiments of this disclosure.

[0174] This disclosure is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (devices), and computer program products according to embodiments of this disclosure. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create a machine for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0175] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0176] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0177] In this disclosure, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase “comprising…” does not exclude the presence of additional identical elements in the article or device that includes said element.

[0178] Although preferred embodiments of the present disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0179] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, the intent of this disclosure also includes these modifications and variations.

Claims

1. A control method for a beam energy adjustment device, wherein the beam energy adjustment device includes a beam energy variable attenuation mechanism, characterized in that, The control method includes: Obtain the state information of the variable beam energy attenuation mechanism; When the beam energy variable attenuation mechanism is determined to be in a preset state based on the state information, the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism is adjusted to adjust the energy of the beam passing through the beam energy variable attenuation mechanism. The variable beam energy attenuation parameter includes a variable beam energy attenuation region for receiving the beam by the variable beam energy attenuation mechanism, and the variable beam energy attenuation mechanism includes a plurality of such variable beam energy attenuation regions for receiving the beam. The adjustment of the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism includes: In response to damage to the variable beam energy attenuation region currently used to receive the beam, the current variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism is adjusted to a preset variable beam energy attenuation region according to a preset usage rule.

2. The control method for the beam energy adjustment device according to claim 1, characterized in that, The status information of the variable beam energy attenuation mechanism includes at least one of the following: The rotation angle of the variable beam energy attenuation mechanism and the burn status of the variable beam energy attenuation mechanism.

3. The control method for the beam energy adjustment device according to claim 1, characterized in that, The variable attenuation parameter of the beam energy also includes: The angle of the variable beam energy attenuation mechanism relative to the beam incident direction.

4. The control method for the beam energy adjustment device according to claim 3, characterized in that, The adjustment of the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism includes: The angle of the preset beam energy variable attenuation region relative to the beam incident direction is adjusted to a preset angle.

5. The control method for the beam energy adjustment device according to claim 4, characterized in that, The control method further includes: According to preset rules, the beam energy variable attenuation mechanism is divided into multiple beam energy variable attenuation regions.

6. The control method for the beam energy adjustment device according to claim 4, characterized in that, The method for adjusting the current variable beam energy attenuation region of the received beam of the variable beam energy attenuation mechanism to a preset variable beam energy attenuation region includes: Drive the variable beam energy attenuation mechanism to move along the X-axis and Y-axis directions in the preset coordinate system to adjust the current variable beam energy attenuation region of the received beam to the preset variable beam energy attenuation region. A method for adjusting the angle of the preset beam energy variable attenuation region relative to the beam incident direction to a preset angle includes: Adjust the angle of the variable beam energy attenuation mechanism so that the angle of the preset variable beam energy attenuation region relative to the beam incident direction is adjusted to a preset angle.

7. The control method for the beam energy adjustment device according to any one of claims 1-6, characterized in that, The preset state includes an abnormality in the variable beam energy attenuation mechanism.

8. The control method for the beam energy adjustment device according to claim 7, characterized in that, The variable beam energy attenuation mechanism includes a variable beam energy attenuation lens; The abnormality of the variable beam energy attenuation mechanism includes at least one of the following: The variable beam energy attenuation area of ​​the variable beam energy lens was burned. The loss of the variable attenuation mechanism for beam energy; The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

9. A control device for a beam energy adjustment device, the beam energy adjustment device comprising a beam energy variable attenuation mechanism, characterized in that, The control device includes: The acquisition module is configured to acquire the status information of the variable beam energy attenuation mechanism; The adjustment module is configured to adjust the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism when the beam energy variable attenuation mechanism is determined to be in a preset state based on the state information, so as to adjust the energy of the beam passing through the beam energy variable attenuation mechanism. The variable beam energy attenuation parameter includes a variable beam energy attenuation region for receiving the beam by the variable beam energy attenuation mechanism, and the variable beam energy attenuation mechanism includes a plurality of such variable beam energy attenuation regions for receiving the beam. The adjustment module is also configured to: In response to damage to the variable beam energy attenuation region currently used to receive the beam, the current variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism is adjusted to a preset variable beam energy attenuation region according to a preset usage rule.

10. A control device for a beam energy adjustment device, the beam energy adjustment device comprising a beam energy variable attenuation mechanism, characterized in that, The control device includes: The acquisition unit is configured to acquire the state information of the beam energy variable attenuation mechanism. The adjustment mechanism is configured to adjust the variable beam energy attenuation parameter of the variable beam energy attenuation mechanism; The control unit is configured to receive status information sent by the acquisition unit and determine whether the beam energy variable attenuation mechanism belongs to a preset state based on the status information; if it belongs to the preset state, an adjustment command is generated to instruct the adjustment mechanism to adjust the beam energy variable attenuation parameter of the beam energy variable attenuation mechanism, thereby adjusting the energy of the beam passing through the beam energy variable attenuation mechanism. The variable beam energy attenuation parameter includes a variable beam energy attenuation region for receiving the beam by the variable beam energy attenuation mechanism, and the variable beam energy attenuation mechanism includes a plurality of such variable beam energy attenuation regions for receiving the beam. The adjustment mechanism includes a position driving mechanism, configured as follows: In response to damage to the variable beam energy attenuation region currently used to receive the beam, the current variable beam energy attenuation region of the beam received by the variable beam energy attenuation mechanism is adjusted to a preset variable beam energy attenuation region according to a preset usage rule.

11. The control device for the beam energy adjustment device according to claim 10, characterized in that, The acquisition unit includes: an image acquisition device and a burn status acquisition device. The image acquisition device is positioned above the variable beam energy attenuation mechanism and is used to monitor the rotation angle and failure location of the variable beam energy attenuation mechanism. The burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the VA curve automatically generated by the lithography machine, or the burn status acquisition device is used to acquire the burn status of the variable beam energy attenuation mechanism based on the beam energy adjustment result of the variable beam energy attenuation mechanism.

12. The control device for the beam energy adjustment device according to claim 10, characterized in that, The variable attenuation parameter of the beam energy also includes: The angle of the variable beam energy attenuation mechanism relative to the beam incident direction.

13. The control device for the beam energy adjustment equipment according to claim 12, characterized in that, The position driving mechanism includes: The first moving mechanism is configured to drive the beam energy variable attenuation mechanism to move along the X-axis direction in a preset coordinate system; The second moving mechanism is configured to drive the beam energy variable attenuation mechanism to move along the Y-axis direction in the preset coordinate system; A driving mechanism is configured to receive the adjustment command and drive the first moving mechanism and / or the second moving mechanism to drive the beam energy variable attenuation mechanism to adjust from the current beam energy variable attenuation region of the received beam to a preset beam energy variable attenuation region.

14. The control device for the beam energy adjustment device according to claim 13, characterized in that, The adjustment mechanism includes a rotation drive mechanism configured to drive the beam energy variable attenuation mechanism to rotate, so as to adjust the angle of the preset beam energy variable attenuation region relative to the beam incident direction to a preset angle.

15. The control device for the beam energy adjustment device according to any one of claims 9-14, characterized in that, The preset state includes an abnormality in the variable beam energy attenuation mechanism.

16. The control device for the beam energy adjustment equipment according to claim 15, characterized in that, The variable beam energy attenuation mechanism includes a variable beam energy attenuation lens; The abnormality of the variable beam energy attenuation mechanism includes at least one of the following: The variable beam energy attenuation area of ​​the variable beam energy lens was burned. The loss of the variable attenuation mechanism for beam energy; The rotation angle of the variable beam energy attenuation mechanism exceeds the preset range.

17. A control device for a beam energy adjustment device, characterized in that, The control device includes: processor; Memory used to store processor-executable instructions; The processor is configured to execute the control method according to any one of claims 1-8.

18. A computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the processor, the processor is able to perform the control method according to any one of claims 1-8.

19. A wafer processing apparatus, characterized in that, The wafer processing equipment includes a control device for the beam energy adjustment device as described in any one of claims 9-17.

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