Ball grid array packaging method and apparatus, storage medium, and electronic device

Abstract

Embodiments of the present application provide a ball grid array packaging method and device, a storage medium and an electronic device, wherein the ball grid array packaging method comprises: determining a packaging area corresponding to a ball grid array of a to-be-packaged element; for any rectangular sub-area in a plurality of rectangular sub-areas included in the packaging area, setting N soldering points at the vertices of the any rectangular sub-area, and setting spacers at all vertices of the any rectangular sub-area except the N soldering points, wherein N is an integer greater than 1 and less than 5, and at least two soldering points of the N soldering points correspond to a diagonal of the any rectangular sub-area; and performing soldering packaging on the any rectangular sub-area on which the N soldering points and the spacers are set. The above scheme can solve the problem of high packaging failure rate of ball grid array of large-size components in the related art, and improve the soldering packaging quality of large components and reduce the maintenance process of poor packaging.

Description

Technical Field

[0001] This application relates to the field of surface mount technology, and more specifically, to a packaging method and apparatus for ball grid arrays, a storage medium, and an electronic device. Background Technology

[0002] Currently, in the field of SMT (Surface Mount Technology), the technical difficulty of soldering is becoming increasingly complex, and the requirements for soldering quality are also becoming increasingly stringent. For large-sized components, if a good soldering method cannot be found, more defects such as open solder joints, short circuits, and pillow effects will occur. These large-sized ball grid array packaged components are even more difficult to repair, and improper repair can easily lead to the scrapping of PCBA (Printed Circuit Board Assembly).

[0003] There is still no effective solution to the technical problem of high defect rate in ball grid array packaging of large-size components in related technologies. Summary of the Invention

[0004] This application provides a packaging method and apparatus for ball grid arrays, a storage medium, and an electronic device, to at least solve the problem of high defect rate in ball grid array packaging of large-size components in related technologies.

[0005] According to one embodiment of this application, a method for packaging a ball grid array is provided, comprising: determining a packaging region corresponding to the ball grid array of the component to be packaged; for any rectangular sub-region among a plurality of rectangular sub-regions included in the packaging region, setting N solder points at the vertices of the any rectangular sub-region, and setting spacers at all vertices of the any rectangular sub-region except for the N solder points, wherein N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of the any rectangular sub-region; and performing soldering packaging on any rectangular sub-region after setting the N solder points and the spacers.

[0006] In an exemplary embodiment, after determining the encapsulation region corresponding to the ball grid array of the element to be encapsulated, the method further includes: determining the target area level of the encapsulation region; determining the number of target sub-regions corresponding to the target area level from a preset database, wherein the preset database includes: multiple sets of correspondences between area levels and the number of sub-regions; dividing the encapsulation region according to the number of target sub-regions to obtain multiple rectangular sub-regions, wherein the multiple rectangular sub-regions have equal areas.

[0007] In an exemplary embodiment, before setting shims at all vertices other than the N solder points in any rectangular sub-region, the method further includes: obtaining the solder size used for the solder points; and determining the target size of the shims based on the solder size and preset shim requirements, wherein the target size is smaller than the solder size.

[0008] In an exemplary embodiment, after determining the packaging area corresponding to the ball grid array of the component to be packaged, the method further includes: identifying the four corner regions corresponding to the packaging area; setting non-functional regions of a target size in the four corner regions according to the target area level of the packaging area, wherein the non-functional regions are used to reinforce the soldering of the component to be packaged.

[0009] In one exemplary embodiment, after setting non-functional regions of target size in the four corner regions according to the target area level of the packaging region, the method further includes: adjusting the solder joints in the non-functional regions into elliptical structures.

[0010] In an exemplary embodiment, the method further includes: adjusting the routing rules of the PCB inner layer corresponding to the non-functional area, wherein the routing rules include at least: allowing the routing of the PCB inner layer to complete the routing through the short side of the elliptical structure, and prohibiting the routing of the PCB inner layer to complete the routing through the long side of the elliptical structure.

[0011] In an exemplary embodiment, after performing soldering encapsulation on any rectangular sub-region of the N solder points and the gasket, the method further includes: when it is determined that the soldering encapsulation of the component to be encapsulated is completed, acquiring a soldering result image corresponding to the component to be encapsulated; performing deformation detection on the soldering result image, and determining whether to perform reflow soldering on the component to be encapsulated based on the deformation detection result.

[0012] According to another embodiment of this application, a packaging device for a ball grid array is provided, comprising: a determining module, configured to determine a packaging region corresponding to the ball grid array of the component to be packaged; a first setting module, configured to, for any rectangular sub-region among a plurality of rectangular sub-regions included in the packaging region, set N solder points at the vertices of the any rectangular sub-region, and set spacers at all vertices of the any rectangular sub-region except for the N solder points, wherein N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of the any rectangular sub-region; and a packaging module, configured to perform soldering packaging on any rectangular sub-region after the N solder points and the spacers have been set.

[0013] In an exemplary embodiment, the above-described apparatus further includes: a division module, configured to determine a target area level of the encapsulation area after determining the encapsulation region corresponding to the ball grid array of the element to be encapsulated; determine the number of target sub-regions corresponding to the target area level from a preset database, wherein the preset database includes: multiple sets of correspondences between area levels and the number of sub-regions; and divide the encapsulation region according to the number of target sub-regions to obtain multiple rectangular sub-regions, wherein the multiple rectangular sub-regions have equal areas.

[0014] In an exemplary embodiment, the above-described setting module further includes: a determining unit, configured to, before setting shims at all vertices in any rectangular sub-region except for the N solder points, obtain the solder size used at the solder points; and determine the target size of the shim based on the solder size and preset shim requirements, wherein the target size is smaller than the solder size.

[0015] In an exemplary embodiment, the above-described apparatus further includes: a second setting module, configured to identify four corner regions corresponding to the packaging region after determining the packaging region corresponding to the ball grid array of the component to be packaged; and to set non-functional regions of a target size in the four corner regions according to the target area level of the packaging region, wherein the non-functional regions are used to reinforce the soldering of the component to be packaged.

[0016] In an exemplary embodiment, the second setting module further includes: a first adjustment unit, configured to adjust the solder joints in the non-functional areas to an elliptical structure after setting the target size of the non-functional areas in the four corner regions according to the target area level of the packaging area.

[0017] In an exemplary embodiment, the second setting module further includes: a second adjustment unit, configured to adjust the routing rules of the PCB inner layer corresponding to the non-functional area, wherein the routing rules include at least: allowing the routing of the PCB inner layer to exit through the short side of the elliptical structure, and prohibiting the routing of the PCB inner layer to exit through the long side of the elliptical structure.

[0018] In an exemplary embodiment, the above apparatus further includes: a detection module, configured to perform welding encapsulation on any rectangular sub-region after the N welding points and the gasket have been set; the above method further includes: when it is determined that the welding encapsulation of the component to be encapsulated has been completed, acquiring a welding result image corresponding to the component to be encapsulated; performing deformation detection on the welding result image, and determining whether to perform reflow soldering on the component to be encapsulated based on the result of the deformation detection.

[0019] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored therein, and the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0020] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0021] This application determines the packaging area corresponding to the ball grid array of the component to be packaged. For any rectangular sub-region among multiple rectangular sub-regions included in the packaging area, N solder points are set at the vertices of any rectangular sub-region, and spacers are set at all vertices of any rectangular sub-region except for the N solder points. Here, N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region. Soldering packaging is performed on any rectangular sub-region after N solder points and spacers are set. That is, by determining the positions of solder points and spacers in the ball grid array during the packaging process of the component to be packaged, even if the component to be packaged is a large component, the spacers can support the large component and avoid deformation after soldering, thereby improving the yield of the component to be packaged during the packaging process. Therefore, the above solution can solve the problem of high defect rate of ball grid array packaging for large-size components in related technologies, and achieve the effect of improving the soldering packaging quality of large components and reducing defective packaging repair processes. Attached Figure Description

[0022] Figure 1 This is a hardware structure block diagram of a printed circuit board for a ball grid array packaging method according to an embodiment of this application;

[0023] Figure 2 This is a flowchart of a ball grid array packaging method according to an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of an optional ball grid array packaging region according to an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of an optional non-functional area according to an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of an optional non-functional area according to an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of a defective component slice according to an embodiment of this application;

[0028] Figure 7 This is a schematic diagram (a) of a welding defect according to an embodiment of this application;

[0029] Figure 8 This is a schematic diagram (II) of a welding defect according to an embodiment of this application;

[0030] Figure 9 This is a physical schematic diagram of an optional component welding according to an embodiment of this application;

[0031] Figure 10 This is a schematic diagram of the distribution of an optional pad material according to an embodiment of this application;

[0032] Figure 11 This is an optional gasket design intent of an embodiment of this application;

[0033] Figure 12 This is a schematic diagram of the parameters used for gasket welding and encapsulation in an optional embodiment of the present invention;

[0034] Figure 13 This is a physical schematic diagram of the gasket welding effect of an optional embodiment of the present invention;

[0035] Figure 14 This is a structural block diagram of a ball grid array packaging device according to an embodiment of this application. Detailed Implementation

[0036] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0037] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0038] The methods and embodiments provided in this application can be executed on a printed circuit board or similar computing device. Taking operation on a printed circuit board as an example, Figure 1 This is a hardware structure block diagram of a printed circuit board for a ball grid array packaging method according to an embodiment of this application. For example... Figure 1 As shown, a printed circuit board may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The printed circuit board may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the printed circuit board described above. For example, the printed circuit board may also include components that are more... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0039] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the ball grid array packaging method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thus implementing the above-described method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to a printed circuit board via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0040] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the communication supplier of the printed circuit board. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0041] This embodiment provides a packaging method for a ball grid array. Figure 2 This is a flowchart of a ball grid array packaging method according to an embodiment of this application, as shown below. Figure 2 As shown, the process includes the following steps:

[0042] Step S202: Determine the packaging area corresponding to the ball grid array of the component to be packaged;

[0043] Step S204: For any rectangular sub-region among the multiple rectangular sub-regions included in the encapsulation area, N solder points are set at the vertices of any rectangular sub-region, and spacers are set at all vertices of any rectangular sub-region except for the N solder points, wherein N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region.

[0044] As an optional implementation, the packaging area is divided into multiple rectangular sub-regions, and solder points are set at the vertices of any set of diagonals corresponding to the rectangular sub-regions; after the solder points are set, spacers are set at all vertex positions corresponding to the rectangular sub-regions other than the solder points; and a soldering packaging operation is performed on the ball grid array of the component to be packaged based on the solder points and spacers.

[0045] Step S206: Perform soldering encapsulation on any rectangular sub-region after setting the N solder points and the gasket.

[0046] Through the above steps, the packaging area corresponding to the ball grid array of the component to be packaged is determined. For any rectangular sub-region among the multiple rectangular sub-regions included in the packaging area, N solder points are set at the vertices of any rectangular sub-region, and spacers are set at all vertices of any rectangular sub-region except for the N solder points. Here, N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region. Soldering packaging is then performed on any rectangular sub-region after N solder points and spacers are set. That is, by determining the positions of solder points and spacers in the ball grid array during the packaging process of the component to be packaged, even if the component to be packaged is a large component, the spacers can support the large component and prevent deformation after soldering, thereby improving the yield of the component to be packaged during the packaging process. Therefore, the above solution can solve the problem of high defect rate of ball grid array packaging for large-sized components in related technologies, and achieve the effect of improving the soldering packaging quality of large components and reducing defective packaging repair processes.

[0047] The entity performing the above steps can be a packaging device, but is not limited to this.

[0048] In an exemplary embodiment, after determining the encapsulation region corresponding to the ball grid array of the element to be encapsulated, the method further includes: determining the target area level of the encapsulation region; determining the number of target sub-regions corresponding to the target area level from a preset database, wherein the preset database includes: multiple sets of correspondences between area levels and the number of sub-regions; dividing the encapsulation region according to the number of target sub-regions to obtain multiple rectangular sub-regions, wherein the multiple rectangular sub-regions have equal areas.

[0049] For example, when the target area of ​​the package is 80mm*80mm, the corresponding ball grid array package area can be divided into 16 rectangular sub-regions of equal area. It should be noted that the relationship between the number of rectangular sub-regions and the target area can also be a set range, such as 16 rectangular sub-regions of equal area. This number of sub-regions is suitable for BGA ball grid array packages between 80mm*80mm and 100mm*100mm in size. Furthermore, when the size of the ball grid array package is larger than 100mm*100mm, the number of rectangular sub-regions needs to be increased appropriately.

[0050] Through the above embodiments, by determining the area size of the packaging region corresponding to the component to be packaged, the number of rectangular sub-regions that the current packaging region needs to be divided into is determined. This sub-region division ensures that every part of the component to be packaged can be accurately covered during the soldering process, avoiding missed soldering or insufficient soldering. Furthermore, by dividing the sub-regions, when an abnormality is found in a certain sub-region, reflow soldering can be performed only on that sub-region, greatly reducing production costs.

[0051] In an exemplary embodiment, before setting shims at all vertices other than the N solder points in any rectangular sub-region, the method further includes: obtaining the solder size used for the solder points; and determining the target size of the shims based on the solder size and preset shim requirements, wherein the target size is smaller than the solder size.

[0052] Optionally, the specific spacer size depends on the size of the solder balls corresponding to the BGA ball grid array package. The diameter of the spacer is designed to be 80% of the solder ball's diameter, and the height is designed to be 60% of the solder ball's height. According to a general design, a spacer spacer with a length and width of 0.5mm and a height of 0.4mm can be used.

[0053] Through the above embodiments, the size of the pad is designed to correspond to the size of the solder used in the solder joint of the ball grid array package. This ensures that the pad can stably support the component after the solder melts, avoiding deformation of the component after soldering due to unsuitable pad size, thereby ensuring the yield rate of large components after soldering.

[0054] In an exemplary embodiment, after determining the packaging area corresponding to the ball grid array of the component to be packaged, the method further includes: identifying the four corner regions corresponding to the packaging area; setting non-functional regions of a target size in the four corner regions according to the target area level of the packaging area, wherein the non-functional regions are used to reinforce the soldering of the component to be packaged.

[0055] Understandably, to ensure the packaging effect of the components to be packaged, non-functional areas can be divided into the ball grid array packaging area according to its size, for example, such as... Figure 3 As shown, Figure 3 This is a schematic diagram of an optional ball grid array (BGA) package area according to an embodiment of this application. The four corners of the BGA package area can be designated as non-functional areas with four rows of solder balls. Figure 4 This is a schematic diagram of an optional non-functional area according to an embodiment of this application, such as... Figure 4 As shown, 1, 2, 3, and 4 are designed as non-functional solder balls, used only for reinforcing solder joints.

[0056] In one exemplary embodiment, after setting non-functional regions of target size in the four corner regions according to the target area level of the packaging region, the method further includes: adjusting the solder joints in the non-functional regions into elliptical structures.

[0057] Optionally, the four corners of the printed circuit board (PCB) corresponding to the spherical grid array packaged component can be designed as elliptical structures to increase the soldering area and thus increase the soldering strength.

[0058] Through the above embodiments, non-functional areas are divided in the ball grid array packaging area, and the shape of the solder joints in the non-functional areas is adjusted, thereby using the non-functional areas to reinforce the soldering packaging, ensuring that the components are not firmly fixed due to insufficient solder after soldering and preventing soldering cracks.

[0059] In an exemplary embodiment, the method further includes: adjusting the routing rules of the PCB inner layer corresponding to the non-functional area, wherein the routing rules include at least: allowing the routing of the PCB inner layer to complete the routing through the short side of the elliptical structure, and prohibiting the routing of the PCB inner layer to complete the routing through the long side of the elliptical structure.

[0060] For example, after determining the non-functional areas, to avoid abnormal PCB inner layer traces caused by changes in the shape of solder joints in the non-functional areas, the PCB inner layer traces should exit from the shorter side of the ellipse, and should not exit from the longer side of the ellipse, to prevent short circuits in the inner layer circuits. Figure 5 This is a schematic diagram of an optional non-functional area according to an embodiment of this application, such as... Figure 5 As shown, the line segment area corresponding to the check mark (√) is the area where wiring is allowed, and the line segment area corresponding to the wrong mark (×) is the area where wiring is prohibited.

[0061] Through the above embodiments, in order to ensure the line communication of the printed circuit board, the appearance route of the printed circuit board in the non-functional area is adjusted after the non-functional area is set up, thereby avoiding the occurrence of adverse situations.

[0062] In an exemplary embodiment, after performing soldering encapsulation on any rectangular sub-region of the N solder points and the gasket, the method further includes: when it is determined that the soldering encapsulation of the component to be encapsulated is completed, acquiring a soldering result image corresponding to the component to be encapsulated; performing deformation detection on the soldering result image, and determining whether to perform reflow soldering on the component to be encapsulated based on the deformation detection result.

[0063] As an alternative implementation, to better understand soldering defects in large-size ball grid array packaged components, some illustrated examples of defects are provided. Figure 6 This is a schematic diagram of a defective component slice according to an embodiment of this application. Due to different soldering methods or weak soldering, defects may occur after the component packaging is completed. Figure 6 The adverse situations shown are merely examples and do not limit the scope of this application.

[0064] To better understand defective products, we now illustrate defects caused by poor component soldering. (Optional) Figure 7 This is a schematic diagram (a) of a welding defect according to an embodiment of this application; Figure 8 This is a schematic diagram (II) of a welding defect according to an embodiment of this application;

[0065] like Figure 7 The schematic diagram of the component's smiley face defect shows deformation with the four corners curling up, and Figure 8 The "crying face" diagram of a defective component shows deformation with a bulge in the middle. These two situations are the main causes of poor component soldering. As these large-size ball grid array (BGA) packaged components take on more and more functions, their application is also increasing, and the defect rate remains high. The temperature during component soldering reaches above 245℃, and component manufacturers cannot completely avoid warping. Therefore, in order to promptly detect the above-mentioned defects caused by soldering after soldering and packaging, deformation detection is performed by acquiring the soldering result image to preliminarily determine whether a defect has occurred. Here, the deformation range of the component can be set. By determining the size of the deformation range corresponding to the current soldering result image and the preset range, when the deformation range is greater than or equal to the preset range, it indicates that the currently soldered and packaged component may have a soldering defect, which can be marked for repair in time, thereby completing the screening of defective products without affecting production.

[0066] The above-described ball grid array packaging method can be applied to, for example... Figure 9 During the soldering of the components shown, Figure 9 This is a physical schematic diagram of an optional component soldering according to an embodiment of this application, including: a PCB printed circuit board and a square component in the middle.

[0067] Optionally, this application provides an optional ball grid array packaging design method, including the following steps:

[0068] Step 1: Design the four corners of the ball grid array packaged component as non-functional areas;

[0069] Step 2: Design the solder balls in the non-functional areas to be slightly larger than those in the functional areas; for example, design the PCB PAD corresponding to the ball grid array package component to be elliptical; the solder balls corresponding to the functional areas are circular. The above is just one example.

[0070] Step 3: Run the traces from the shorter side of the ellipse, and do not run them from the longer side of the ellipse;

[0071] Optionally, this application provides an optional ball grid array package soldering method, including the following:

[0072] The spherical grid array packaging area is divided into multiple rectangular sub-regions of equal area; one of the two sets of diagonal vertices of each sub-region is set as a solder point; spacers of equal size are set at the vertices of the sub-regions other than the solder points; solder balls are set at the solder points for soldering.

[0073] Furthermore, the spherical grid array packaging area is divided into multiple rectangular sub-regions of equal area, including: dividing the spherical grid array packaging area into 16 rectangular sub-regions of equal area.

[0074] Furthermore, the spherical grid array encapsulation area is divided into multiple rectangular sub-regions of equal area, including: pre-setting the number of sub-regions corresponding to the area level of the spherical grid array encapsulation area; and allocating the corresponding number of rectangular sub-regions to the target spherical grid array encapsulation area according to the area level to which the area value of the target spherical grid array encapsulation area belongs.

[0075] Furthermore, the size of the ball grid array packaging area is between 80mm*80mm and 100mm*100mm.

[0076] Furthermore, providing spacers of equal size at the vertices of sub-regions other than the solder joints includes: soldering the spacers to the corresponding positions on the substrate according to the positions of the vertices where the spacers are provided.

[0077] Furthermore, the diameter of the spacer is 80% of the diameter of the solder ball.

[0078] Furthermore, the height of the spacer is 60% of the diameter of the solder ball.

[0079] Furthermore, the length and width of the gasket are both 0.5mm, and the height is 0.4mm.

[0080] Through the above-described implementation methods, the ball grid array (BGA) packaging design and soldering method effectively solve a series of problems caused by warpage due to excessive BGA size, as well as the problem of poor soldering quality and the associated repair and labor costs. This significantly increases the output of high-quality products, thereby improving production efficiency and bringing substantial economic benefits. Furthermore, the design principles are reliable, the structure is simple, and it has a very broad range of application prospects.

[0081] As an optional implementation method, the specific implementation process of the above-mentioned ball grid array packaging soldering method is as follows:

[0082] S1. Divide the ball grid array package area into multiple rectangular sub-regions of equal area. In this embodiment, the ball grid array package area is divided into 16 rectangular sub-regions of equal area. This number of sub-regions is suitable for BGAs with sizes between 80mm*80mm and 100mm*100mm.

[0083] In other embodiments of this application, the number of sub-regions corresponding to the area level of the ball grid array (BGA) packaging region is preset; based on the area level to which the area value of the target BGA packaging region belongs, the corresponding number of rectangular sub-regions is allocated to the target BGA packaging region. That is, if the BGA size is greater than 100mm*100mm, the number of partitions can be appropriately increased according to this rule.

[0084] S2. Set one of the two sets of diagonal vertices in each sub-region as the welding point. Adjacent sub-regions share a welding point.

[0085] S3. Place spacers of equal size S at the vertices of all sub-regions except for the solder joints. The specific spacer dimensions depend on the size of the BGA solder balls. The spacer diameter is designed to be 80% of the solder ball's diameter, and the height is designed to be 60% of the solder ball's height. According to current common designs, a spacer with a length and width of 0.5mm and a height of 0.4mm can be used, as shown below. Figure 10 As shown.

[0086] S4. Place solder balls at the soldering point for soldering.

[0087] Solder balls are placed at each soldering point for soldering, and the solder pad P is as follows. Figure 10 As shown, Figure 10 This is a schematic diagram of the distribution of an optional pad material according to an embodiment of this application. The circles represent solder joints, and the squares correspond to spacers. The chip is soldered to the substrate using the aforementioned material. After soldering, the spacers S can effectively support the chip, achieving a good soldering effect, which can effectively improve yield and reduce costs.

[0088] As an optional implementation method, Figure 11This is an optional spacer design intent of an embodiment of this application. The spacer spacer material is brass (copper + zinc), with an anti-oxidation treatment or gold plating on the surface, which is more conducive to the soldering of the spacer spacer; the placement method is machine mounting, with coordinates set and the machine automatically mounting, and solder paste needs to be printed on the corresponding positions before mounting; the fixing method is to use the Reflow soldering process for soldering.

[0089] Optional, Figure 12 This is a schematic diagram of the parameters used for gasket welding and encapsulation in an optional embodiment of the present invention. Figure 13 This is a schematic diagram of the gasket welding effect according to an optional embodiment of the present invention. After reflow, the component can be well supported, achieving a good welding effect, which can effectively improve yield and reduce costs.

[0090] It should be noted that the above implementation method is applicable to all PCBA boards designed using large-size ball grid array packaged components. It effectively solves a series of problems caused by warping due to excessively large components, as well as the problem of poor soldering quality, and the maintenance costs, labor costs and other costs caused by defects. It also more effectively increases the output of good products, thereby increasing production capacity and bringing good economic benefits.

[0091] In summary, this application proposes a ball grid array (BGA) packaging design and soldering method. This method, through the formulation of component packaging, PCB packaging, and the design of a spacer, supports large-size components during the soldering process as the solder balls melt, reducing deformation of the component substrate and PCBA.

[0092] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0093] This embodiment also provides a ball grid array packaging device for implementing the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, hardware implementations, or a combination of software and hardware, are also possible and contemplated.

[0094] Figure 14 This is a structural block diagram of a ball grid array packaging device according to an embodiment of this application, such as... Figure 14 As shown, the device includes

[0095] The determination module 1402 is used to determine the packaging area corresponding to the ball grid array of the component to be packaged;

[0096] The first setting module 1404 is used to set N solder points at the vertices of any rectangular sub-region among the plurality of rectangular sub-regions included in the encapsulation area, and to set gaskets at all vertices of any rectangular sub-region except for the N solder points, wherein N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region.

[0097] The encapsulation module 1406 is used to perform soldering encapsulation on any rectangular sub-region after the N solder points and the gasket have been set.

[0098] The above-described apparatus determines the packaging area corresponding to the ball grid array of the component to be packaged. For any rectangular sub-region among the multiple rectangular sub-regions included in the packaging area, N solder points are set at the vertices of any rectangular sub-region, and spacers are set at all vertices of any rectangular sub-region except for the N solder points. Here, N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region. Soldering packaging is then performed on any rectangular sub-region after N solder points and spacers are set. That is, by determining the positions of solder points and spacers in the ball grid array during the packaging process of the component to be packaged, even if the component to be packaged is a large component, the spacers can support the large component, avoiding deformation of the large component after soldering, thereby improving the yield of the component to be packaged during the packaging process. Therefore, the above-described scheme can solve the problem of high defect rate of ball grid array packaging for large-sized components in related technologies, achieving the effect of improving the soldering packaging quality of large components and reducing defective packaging repair processes.

[0099] In an exemplary embodiment, the above-described apparatus further includes: a division module, configured to determine a target area level of the encapsulation area after determining the encapsulation region corresponding to the ball grid array of the element to be encapsulated; determine the number of target sub-regions corresponding to the target area level from a preset database, wherein the preset database includes: multiple sets of correspondences between area levels and the number of sub-regions; and divide the encapsulation region according to the number of target sub-regions to obtain multiple rectangular sub-regions, wherein the multiple rectangular sub-regions have equal areas.

[0100] For example, when the target area of ​​the package is 80mm*80mm, the corresponding ball grid array package area can be divided into 16 rectangular sub-regions of equal area. It should be noted that the relationship between the number of rectangular sub-regions and the target area can also be a set range, such as 16 rectangular sub-regions of equal area. This number of sub-regions is suitable for BGA ball grid array packages between 80mm*80mm and 100mm*100mm in size. Furthermore, when the size of the ball grid array package is larger than 100mm*100mm, the number of rectangular sub-regions needs to be increased appropriately.

[0101] Through the above embodiments, by determining the area size of the packaging region corresponding to the component to be packaged, the number of rectangular sub-regions that the current packaging region needs to be divided into is determined. This sub-region division ensures that every part of the component to be packaged can be accurately covered during the soldering process, avoiding missed soldering or insufficient soldering. Furthermore, by dividing the sub-regions, when an abnormality is found in a certain sub-region, reflow soldering can be performed only on that sub-region, greatly reducing production costs.

[0102] In an exemplary embodiment, the first setting module further includes: a determining unit, configured to, before setting shims at all vertices in any rectangular sub-region except for the N solder points, obtain the solder size used at the solder points; and determine the target size of the shim based on the solder size and preset shim requirements, wherein the target size is smaller than the solder size.

[0103] Optionally, the specific spacer size depends on the size of the solder balls corresponding to the BGA ball grid array package. The diameter of the spacer is designed to be 80% of the solder ball's diameter, and the height is designed to be 60% of the solder ball's height. According to a general design, a spacer spacer with a length and width of 0.5mm and a height of 0.4mm can be used.

[0104] Through the above embodiments, the size of the pad is designed to correspond to the size of the solder used in the solder joint of the ball grid array package. This ensures that the pad can stably support the component after the solder melts, avoiding deformation of the component after soldering due to unsuitable pad size, thereby ensuring the yield rate of large components after soldering.

[0105] In an exemplary embodiment, the above-described apparatus further includes: a second setting module, configured to identify four corner regions corresponding to the packaging region after determining the packaging region corresponding to the ball grid array of the component to be packaged; and to set non-functional regions of a target size in the four corner regions according to the target area level of the packaging region, wherein the non-functional regions are used to reinforce the soldering of the component to be packaged.

[0106] Understandably, to ensure the packaging effect of the components to be packaged, non-functional areas can be divided into the ball grid array packaging area according to its size, for example, such as... Figure 3 As shown, Figure 3 This is a schematic diagram of an optional ball grid array (BGA) package area according to an embodiment of this application. The four corners of the BGA package area can be designated as non-functional areas with four rows of solder balls. Figure 4 This is a schematic diagram of an optional non-functional area according to an embodiment of this application, such as... Figure 4 As shown, 1, 2, 3, and 4 are designed as non-functional solder balls, used only for reinforcing solder joints.

[0107] In an exemplary embodiment, the second setting module further includes: a first adjustment unit, configured to adjust the solder joints in the non-functional areas to an elliptical structure after setting the target size of the non-functional areas in the four corner regions according to the target area level of the packaging area.

[0108] Optionally, the four corners of the printed circuit board (PCB) corresponding to the spherical grid array packaged component can be designed as elliptical structures to increase the soldering area and thus increase the soldering strength.

[0109] Through the above embodiments, non-functional areas are divided in the ball grid array packaging area, and the shape of the solder joints in the non-functional areas is adjusted, thereby using the non-functional areas to reinforce the soldering packaging, ensuring that the components are not firmly fixed due to insufficient solder after soldering and preventing soldering cracks.

[0110] In an exemplary embodiment, the second setting module further includes: a second adjustment unit, configured to adjust the routing rules of the PCB inner layer corresponding to the non-functional area, wherein the routing rules include at least: allowing the routing of the PCB inner layer to exit through the short side of the elliptical structure, and prohibiting the routing of the PCB inner layer to exit through the long side of the elliptical structure.

[0111] For example, after determining the non-functional areas, to avoid abnormal PCB inner layer traces caused by changes in the shape of solder joints in the non-functional areas, the PCB inner layer traces should exit from the shorter side of the ellipse, and should not exit from the longer side of the ellipse, to prevent short circuits in the inner layer circuits. Figure 5 This is a schematic diagram of an optional non-functional area according to an embodiment of this application, such as... Figure 5 As shown, the line segment area corresponding to the check mark (√) is the area where wiring is allowed, and the line segment area corresponding to the wrong mark (×) is the area where wiring is prohibited.

[0112] Through the above embodiments, in order to ensure the line communication of the printed circuit board, the appearance route of the printed circuit board in the non-functional area is adjusted after the non-functional area is set up, thereby avoiding the occurrence of adverse situations.

[0113] In an exemplary embodiment, the above apparatus further includes: a detection module, configured to perform welding encapsulation on any rectangular sub-region after the N welding points and the gasket have been set; the above method further includes: when it is determined that the welding encapsulation of the component to be encapsulated has been completed, acquiring a welding result image corresponding to the component to be encapsulated; performing deformation detection on the welding result image, and determining whether to perform reflow soldering on the component to be encapsulated based on the result of the deformation detection.

[0114] As an alternative implementation, to better understand soldering defects in large-size ball grid array packaged components, some illustrated examples of defects are provided. Figure 6 This is a schematic diagram of a defective component slice according to an embodiment of this application. Due to different soldering methods or weak soldering, defects such as those observed after component packaging may occur. Figure 6 The adverse situations shown are merely examples and do not limit the scope of this application.

[0115] To better understand defective products, we now illustrate defects caused by poor component soldering. (Optional) Figure 7 This is a schematic diagram (a) of a welding defect according to an embodiment of this application; Figure 8 This is a schematic diagram (II) of a welding defect according to an embodiment of this application;

[0116] like Figure 7 The schematic diagram of the component's smiley face defect shows the deformation with the four corners curling up. Figure 8 The "crying face" diagram of a defective component shows deformation with a bulge in the middle. These two situations are the main causes of poor component soldering. As these large-size ball grid array (BGA) packaged components take on more and more functions, their application is also increasing, and the defect rate remains high. The temperature during component soldering reaches above 245℃, and component manufacturers cannot completely avoid warping. Therefore, in order to promptly detect the above-mentioned defects caused by soldering after soldering and packaging, deformation detection is performed by acquiring the soldering result image to preliminarily determine whether a defect has occurred. Here, the deformation range of the component can be set. By determining the size of the deformation range corresponding to the current soldering result image and the preset range, when the deformation range is greater than or equal to the preset range, it indicates that the currently soldered and packaged component may have a soldering defect, which can be marked for repair in time, thereby completing the screening of defective products without affecting production.

[0117] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0118] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0119] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0120] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0121] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0122] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0123] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0124] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A packaging method for a ball grid array, characterized in that, include: Determine the packaging area corresponding to the ball grid array of the component to be packaged; For any rectangular sub-region among the multiple rectangular sub-regions included in the encapsulation area, N solder points are set at the vertices of any rectangular sub-region, and spacers are set at all vertices of any rectangular sub-region except for the N solder points, wherein N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region. Perform soldering encapsulation on any rectangular sub-region after setting the N solder points and the gasket; The gasket is a gasket of equal size, and the gasket is welded to the substrate at a position corresponding to the vertex position where the gasket is set; After determining the packaging region corresponding to the ball grid array of the component to be packaged, the method further includes: Identify the four corner regions corresponding to the encapsulation area; According to the target area level of the packaging area, non-functional areas of target size are set in the four corner areas, wherein the non-functional areas are used to reinforce the soldering of the components to be packaged; The solder joints in the non-functional area are adjusted to an elliptical structure, and the routing rules of the PCB inner layer corresponding to the non-functional area are adjusted. The routing rules include at least: allowing the PCB inner layer routing to exit through the short side of the elliptical structure, and prohibiting the PCB inner layer routing to exit through the long side of the elliptical structure.

2. The method according to claim 1, characterized in that, After determining the packaging region corresponding to the ball grid array of the component to be packaged, the method further includes: Determine the target area level of the encapsulation region; The number of target sub-regions corresponding to the target area level is determined from a preset database, wherein the preset database includes: multiple sets of correspondences between area levels and the number of sub-regions; The encapsulation area is divided according to the number of target sub-regions to obtain multiple rectangular sub-regions, wherein the multiple rectangular sub-regions have equal areas.

3. The method according to claim 1, characterized in that, Before setting shims at all vertices in any rectangular sub-region except for the N welding points, the method further includes: Obtain the solder dimensions used for the welding joint; The target size of the spacer is determined based on the solder size and the preset spacer requirements, wherein the target size is smaller than the solder size.

4. The method according to claim 1, characterized in that, After performing soldering encapsulation on any rectangular sub-region of the N solder points and the gasket, the method further includes: If it is determined that the welding and packaging of the component to be packaged has been completed, obtain the welding result image corresponding to the component to be packaged; Deformation detection is performed on the welding result image, and based on the deformation detection result, it is determined whether to perform reflow soldering on the component to be packaged.

5. A packaging device for a ball grid array, characterized in that, include: The determination module is used to determine the packaging area corresponding to the ball grid array of the component to be packaged; The first setting module is used to set N solder points at the vertices of any rectangular sub-region among the multiple rectangular sub-regions included in the encapsulation area, and to set gaskets at all vertices of any rectangular sub-region except for the N solder points, wherein N is an integer greater than 1 and less than 5, and at least two of the N solder points correspond to the diagonal of any rectangular sub-region. The encapsulation module is used to perform soldering encapsulation on any rectangular sub-region after the N solder points and the gasket have been set; The gasket is a gasket of equal size, and the gasket is welded to the substrate at a position corresponding to the vertex position where the gasket is set; The device further includes: a second setting module, used to identify the four corner regions corresponding to the ball grid array of the component to be packaged after determining the packaging area; and to set non-functional regions of a target size in the four corner regions according to the target area level of the packaging area, wherein the non-functional regions are used to reinforce the soldering of the component to be packaged. The second setting module also includes: The first adjustment unit is used to adjust the solder joints in the non-functional areas to an elliptical structure after setting the target size of the non-functional areas in the four corner areas according to the target area level of the packaging area. The second adjustment unit is used to adjust the routing rules of the PCB inner layer corresponding to the non-functional area. The routing rules include at least: allowing the routing of the PCB inner layer to complete the routing through the short side of the elliptical structure, and prohibiting the routing of the PCB inner layer to complete the routing through the long side of the elliptical structure.

6. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method described in any one of claims 1 to 4.

7. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method described in any one of claims 1 to 4.

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