Strip line combiner and its circuit board and multi-frequency antenna

Abstract

The application relates to a stripline combiner, a circuit board thereof and a multi-frequency antenna. The circuit board comprises a dielectric plate and two radio frequency transmission lines connected to two opposite sides of the dielectric plate, at least one metalized via hole is arranged on the dielectric plate, and the hole wall of the metalized via hole is electrically connected to the two radio frequency transmission lines. The side wall of the hollow opening is provided with a conductive layer, and the conductive layer is electrically connected to the two radio frequency transmission lines. Not only can the size of the stripline combiner be small, the weight be light, and the production be easy, but also because the area outside the radio frequency transmission line arranged on the dielectric plate is formed with at least one hollow opening, the side wall of the hollow opening is provided with a conductive layer, and the conductive layer is electrically connected to the two radio frequency transmission lines, so that the insertion loss is effectively improved, the antenna performance is improved, the antenna is miniaturized and integrated, the gain of the antenna is improved, and the signal coverage area of the antenna is increased.

Description

Technical Field

[0001] This application relates to the field of combiner technology, and in particular to a stripline combiner, its circuit board, and a multi-frequency antenna. Background Technology

[0002] In mobile communication systems, the 700MHz band is hailed as the "golden band" due to its low propagation loss and strong coverage capabilities. Nationwide coverage can be achieved with only 450,000 to 500,000 base stations. Therefore, developing base station antennas capable of covering the 700MHz band is a key research focus for antenna manufacturers. Combiners, as radio frequency devices that combine two or more radio frequency signals into a single output path, are crucial components of base station antennas. They include at least three types: stripline combiners, microstrip combiners, and cavity combiners. Microstrip combiners are small in size but have poor stability and high insertion loss, leading to reduced antenna gain and hindering signal coverage. Cavity combiners have low insertion loss but are large and heavy, making them unsuitable for miniaturization and integration. Stripline combiners, with their small size and low insertion loss, are widely used in base station antennas.

[0003] In related technologies, stripline combiners are typically designed as metal conductors. However, due to the extremely high requirements for the processing precision and assembly consistency of metal conductors, mass production is difficult. Therefore, more and more manufacturers are designing stripline combiners as circuit boards, comprising a dielectric substrate and metal layers printed on, for example, two opposing sides of the dielectric substrate. Electrical connections between the two metal layers are achieved through metallized vias on the dielectric substrate to ensure consistency. However, this increases the insertion loss of the stripline combiner, leading to a decrease in antenna performance. Summary of the Invention

[0004] Therefore, it is necessary to overcome the shortcomings of the existing technology and provide a stripline combiner and its circuit board and multi-frequency antenna, which can reduce losses and thus enhance antenna performance.

[0005] A circuit board for a stripline combiner, the circuit board of the stripline combiner comprising:

[0006] A dielectric substrate and two radio frequency (RF) transmission lines are respectively connected to two opposite sides of the dielectric substrate. The dielectric substrate has at least one metallized via, and the wall of the metallized via is electrically connected to the two RF transmission lines. The dielectric substrate includes a first region where the RF transmission lines are arranged and a second region connected to the first region. The second region has at least one cutout, and the sidewall of the cutout is provided with a conductive layer, which is electrically connected to the two RF transmission lines.

[0007] In one embodiment, the cutout is arranged adjacent to the radio frequency transmission line.

[0008] In one embodiment, the second region is provided with at least one support portion, which is connected to two opposite walls of the cutout, or the support portion is disposed on the periphery of the medium plate.

[0009] In one embodiment, the cutout is a long, narrow strip, and the support is connected to the middle part of the long, narrow strip along its length.

[0010] In one embodiment, the radio frequency transmission line includes a main line and at least one filter stub, the starting end of the filter stub being electrically connected to the main line, and the ending end of the filter stub being an open circuit.

[0011] In one embodiment, the filter stubs are arranged in a meandering pattern.

[0012] In one embodiment, the filter branches are configured as multiple branches and arranged sequentially along the extension direction of the main line.

[0013] In one embodiment, the length of the filter stub is 1 / 4 wavelength or 3 / 4 wavelength of its corresponding zero frequency.

[0014] In one embodiment, the radio frequency transmission line further includes a short-circuit stub electrically connected to at least one of the filter stubs, the short-circuit stub also serving as a grounding configuration.

[0015] In one embodiment, when the radio frequency transmission line is used to transmit high-frequency signals, the length between the connection point of the short-circuit stub and the filter stub and the starting end of the filter stub is 1 / 4 to 1 / 2 of the length of the filter stub.

[0016] When the radio frequency transmission line is used to transmit low frequency signals, the length between the connection point of the short-circuit stub and the filter stub and the starting end of the filter stub is 1 / 2 to 4 / 5 of the length of the filter stub.

[0017] A stripline combiner includes at least one of the aforementioned circuit boards and a metallized cavity, wherein the circuit board is disposed within the metallized cavity.

[0018] In one embodiment, the metallized cavity has two chambers, and the circuit board is provided in two separate chambers; the radio frequency transmission line has a first connection end and a second connection end, and the metallized cavity has two input connectors and an output connector. Each input connector is electrically connected to each of the first connection ends, and the two second connection ends are electrically connected to each other. One of the second connection ends is a common terminal and is electrically connected to the output connector.

[0019] In one embodiment, the metallized cavity is provided with a partition that divides the metallized cavity into two chambers;

[0020] At least one boss is provided on the inner wall of the metallized cavity, and the circuit board is detachably mounted on the boss by means of a mounting component.

[0021] In one embodiment, the stripline combiner further includes a docking component disposed between the two second connection terminals, the two second connection terminals being electrically connected through the docking component.

[0022] In one embodiment, the docking component includes a pin and an insulating sleeve fitted over the pin. The partition plate has mounting holes corresponding to the insulating sleeve, and the insulating sleeve is fitted into the mounting holes. The pin is directly electrically connected to the two second connection ends respectively.

[0023] A multi-frequency antenna, the multi-frequency antenna including the stripline combiner described above.

[0024] The aforementioned stripline combiner, its circuit board, and multi-frequency antenna not only achieve small size, light weight, and ease of manufacturing, but also feature at least one cutout in the area outside the RF transmission lines on the dielectric substrate. The sidewalls of the cutout are provided with conductive layers, which are electrically connected to the two RF transmission lines respectively. This effectively improves insertion loss, reducing it to less than or equal to, for example, 0.8 dB, thereby enhancing antenna performance, facilitating miniaturized antenna integration, improving antenna gain, and increasing antenna signal coverage area. Attached Figure Description

[0025] Figure 1 This is an exploded structural diagram of a stripline combiner according to an embodiment of this application.

[0026] Figure 2 for Figure 1 The diagram shows a top view of the circuit board used for transmitting low-frequency signals in the structure shown.

[0027] Figure 3 for Figure 2 The diagram shows the structure of the radio frequency transmission line and the dielectric substrate.

[0028] Figure 4 for Figure 3 The diagram shows a top view of the dielectric substrate in the structure shown.

[0029] Figure 5 for Figure 1 The diagram shows a top view of the circuit board used for transmitting high-frequency signals in the structure shown.

[0030] Figure 6 for Figure 5 The diagram shows the structure of the radio frequency transmission line and the dielectric substrate.

[0031] Figure 7 for Figure 6 The diagram shows a top view of the dielectric substrate in the structure shown.

[0032] Figure 8 This is a graph showing the S-parameters of a multi-frequency antenna according to an embodiment of this application.

[0033] 10. Circuit board; 11. Dielectric board; 111. Metallized via; 112. Cutout; 113. Support; 12. RF transmission line; 121. Main line; 122. Filter stub; 1221. First stub; 1222. Second stub; 1223. Third stub; 1224. Fourth stub; 1225. Fifth stub; 1226. Sixth stub; 123. First connection terminal; 124. Second connection terminal; 125. Short-circuit stub; 20. Metallized cavity; 21. Chamber; 22. Partition; 23. Boss; 24. Main structure; 25. Cover plate; 30. Input connector; 40. Output connector; 50. Connecting component; 51. Pin; 52. Insulating sleeve. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] As mentioned in the background art, the problem of increased insertion loss when the stripline combiner is configured as a circuit board in the related art has been discovered by the inventors to be caused by the introduction of the dielectric substrate, which increases the insertion loss of the stripline combiner.

[0036] For the reasons mentioned above, this application provides a stripline combiner, its circuit board, and a multi-frequency antenna, which can reduce losses and thus enhance antenna performance.

[0037] See Figure 1 , Figure 1 An exploded view of a stripline combiner according to an embodiment of this application is shown. An embodiment of this application provides a stripline combiner including at least one circuit board 10 and a metallized cavity 20, with the circuit board 10 disposed within the metallized cavity 20.

[0038] Please see Figures 2 to 4Or refer to Figures 5 to 7 , Figure 2 It shows Figure 1 The diagram shows a top view of the circuit board 10 used for transmitting low-frequency signals in the structure shown. Figure 3 It shows Figure 2 The diagram shows the structure of the radio frequency transmission line 12 and the dielectric substrate 11. Figure 4 It shows Figure 3 The diagram shows a top view of the dielectric substrate 11 in the structure shown. Furthermore, Figure 5 It shows Figure 1 The diagram shows a top view of the circuit board 10 used for transmitting high-frequency signals in the structure shown. Figure 6 It shows Figure 5 The diagram shows the structure of the radio frequency transmission line 12 and the dielectric substrate 11. Figure 7 It shows Figure 6 The diagram shows a top view of the dielectric substrate 11 in the structure shown. In one embodiment, the circuit board 10 includes a dielectric substrate 11 and two radio frequency transmission lines 12. The two radio frequency transmission lines 12 are respectively connected to two opposite sides of the dielectric substrate 11, wherein... Figure 3 and Figure 6 The exploded view shown only illustrates one RF transmission line 12; the other RF transmission line 12, having the same shape, is hidden and not shown. The dielectric substrate 11 has at least one metallized via 111, the walls of which are electrically connected to the two RF transmission lines 12. The dielectric substrate 11 includes a first region where the RF transmission lines 12 are arranged and a second region connected to the first region. The second region has at least one cutout 112, the sidewall of which is provided with a conductive layer. The conductive layer is electrically connected to two RF transmission lines 12 on two opposite sides of the dielectric substrate 11.

[0039] The aforementioned circuit board 10 not only enables the stripline combiner to be small in size, light in weight, and easy to manufacture, but also has at least one cutout 112 formed in the area of ​​the dielectric substrate 11 other than where the radio frequency transmission lines 12 are arranged. The sidewall of the cutout 112 is provided with a conductive layer, and the conductive layer is electrically connected to the two radio frequency transmission lines 12 respectively, which effectively improves the insertion loss and can reduce it to less than or equal to, for example, 0.8dB. This can improve the antenna performance, facilitate the miniaturization and integration of the antenna, and further improve the antenna gain and increase the antenna signal coverage area.

[0040] It should be noted that the sidewall of the cutout 112 refers to the boundary wall surface on the medium plate 11 where the cutout 112 is formed.

[0041] It should be noted that the first area is used to arrange the radio frequency transmission line 12, which is the orthogonal projection of the radio frequency transmission line 12 on the dielectric substrate 11.

[0042] Specifically, the radio frequency transmission lines 12 connected to the two opposite sides of the dielectric substrate 11 have the same shape and are positioned accordingly. After being electrically connected to each other through at least one metallized via 111, they can ensure high stability of signal transmission.

[0043] The radio frequency transmission line 12 of the circuit board 10 can be used to transmit high-frequency signals, low-frequency signals, or signals of other frequency bands. It can be flexibly adjusted and set according to actual needs, and is not limited here.

[0044] As an example, there are two circuit boards 10, one of which is as follows: Figures 5 to 7 The circuit board shown is used to transmit high-frequency signals, with the operating frequency band of the high-frequency signals being, for example, 880MHz-960MHz; another circuit board 10 is shown... Figures 2 to 4 The circuit boards 10 are used to transmit low-frequency signals, with operating frequencies ranging from 698MHz to 862MHz. The RF transmission lines 12 of the two circuit boards 10 have similar general structures, each including a main line 121 and at least one filter stub 122 connected to the main line 121. The difference between the two circuit boards 10 lies in the size and shape of the main line 121, which can be flexibly adjusted and set according to the actual impedance and electrical length. Furthermore, the size and shape of the filter stubs 122 on the two circuit boards 10 are different, and can also be flexibly adjusted and set according to the actual impedance and electrical length.

[0045] In some embodiments, the radio frequency transmission line 12 and the conductive layer are each independently made of various metal materials such as copper, silver, tin, gold, aluminum, and iron, and the specific formation methods on the dielectric substrate 11 include, but are not limited to, obtaining by printing process, electroplating process, sputtering process or 3D printing process.

[0046] Please see Figure 2 or Figure 5 In one embodiment, the cutout 112 is arranged adjacent to the radio frequency transmission line 12. In this way, on the one hand, the conductive layer on the sidewall of the cutout 112 can be connected to the radio frequency transmission lines 12 on the two opposite sides of the dielectric substrate 11, achieving electrical connection between the two radio frequency transmission lines 12 and improving insertion loss. On the other hand, this allows almost all the dielectric material in the second region to be cut out, thereby reducing weight, saving materials, and lowering costs.

[0047] Please see Figures 2 to 4In one embodiment, the second region is provided with at least one support portion 113, which is connected to two opposite walls of the cutout 112, or the support portion 113 is disposed on the periphery of the dielectric plate 11. Thus, since the formation of the cutout 112 in the second region weakens the strength of the dielectric plate 11, providing at least one support portion 113 at the cutout 112 prevents the dielectric plate 11 from becoming too weak and easily damaged.

[0048] In one embodiment, the support portion 113 can be reserved during the processing of the medium plate 11 to form the cutout 112, or it can be added to the cutout 112 in the subsequent process by various means such as bonding or snap-fitting.

[0049] It should be noted that the “support part 113” can be a “part of the medium plate 11”, that is, the “support part 113” is integrally formed with the “other parts of the medium plate 11”; or it can be an independent component that can be separated from the “other parts of the medium plate 11”, that is, the “support part 113” can be manufactured independently and then combined with the “other parts of the medium plate 11” to form a whole.

[0050] In some embodiments, the shape of the support portion 113 includes, but is not limited to, regular shapes such as rectangle, triangle, pentagon, hexagon, circle, ellipse, and other irregular shapes, as long as it is set at the cutout 112 to enhance the structural strength of the medium plate 11.

[0051] The support portion 113 is made of the same material as the dielectric plate 11. No metal layer needs to be provided on the surface of the support portion 113, thereby avoiding short-circuit defects.

[0052] Please see Figures 2 to 4 In one embodiment, the cutout 112 is a long and narrow strip, and the support portion 113 is connected to the middle part of the long and narrow strip along its length.

[0053] Please see Figures 2 to 4 In one embodiment, the support portion 113 may also be disposed on the periphery of the medium plate 11. When the support portion 113 is disposed on the periphery of the medium plate 11, it can increase the structural strength of the medium plate 11 and prevent the medium plate 11 from bending and being damaged by force.

[0054] Please see Figures 2 to 4In one embodiment, the radio frequency transmission line 12 includes a main line 121 and at least one filter stub 122. The starting end of the filter stub 122 is electrically connected to the main line 121, and the ending end of the filter stub 122 is set as an open circuit. Thus, the circuit formed by the filter stubs 122 is a series resonant circuit connected in parallel to the main line 121, and each filter stub 122 can generate a transmission zero. When there are more filter stubs 122 and the lengths of each filter stub 122 are different, more transmission zeros are generated, which can help improve the isolation, achieving an isolation of, for example, greater than or equal to 30dB. The specific number of filter stubs 122 is flexibly adjusted and set according to the isolation index of the port. When the isolation index requirement is high, the number of filter stubs 122 is more; conversely, when the isolation index requirement is lower, the number of filter stubs 122 is smaller.

[0055] In addition, the Q value of the filter stub 122 makes a significant contribution to the insertion loss. In order to improve the Q value, the cutout 112 is arranged in the part adjacent to the filter stub 122, that is, most of the dielectric material next to the filter stub 122 is removed, leaving a small part of the dielectric material as the support part 113 to support and increase the connection strength.

[0056] In addition, the open end refers to the end of the filter stub 122 being set as a free end, and not electrically connected to the metallized cavity 20 or the main line 121.

[0057] Please see Figures 2 to 4 In one embodiment, the filter stubs 122 are arranged in a meandering pattern. Specifically, the filter stubs 122 include, but are not limited to, various regular and irregular shapes such as S-shape, Z-shape, W-shape, and square waveform, which can be flexibly adjusted and set according to actual needs. In this way, the filter stubs 122 are compactly arranged on the dielectric substrate 11, which can reduce the product size and thus reduce costs.

[0058] Please see Figures 2 to 4 In one specific embodiment, the portion of the dielectric substrate 11 corresponding to the filter branch 122 is in a meandering shape and has a cutout 112. A support portion 113 is provided at the cutout 112 to ensure that the structural strength of the dielectric substrate 11 is sufficiently large.

[0059] Please see Figures 2 to 4 In one embodiment, multiple filter branches 122 are provided and arranged sequentially along the extension direction of the main line 121.

[0060] Specifically, the main line 121 has a first connection end 123 and a second connection end 124 at its opposite ends. The connection positions of each filter stub 122 to the main line 121 are arranged sequentially along the direction from the first connection end 123 to the second connection end 124. Each filter stub 122 has a different electrical length, which enables different resonant frequencies and generates different transmission zeros.

[0061] In one embodiment, the length of the filter stub 122 is 1 / 4 wavelength or 3 / 4 wavelength of its corresponding zero frequency.

[0062] Specifically, please refer to Figures 5 to 7 For the circuit board 10 transmitting high-frequency signals, the RF transmission line 12 has three filtering stubs 122, designated as a first stub 1221, a second stub 1222, and a third stub 1223. Specifically, the first stub 1221 corresponds to 1 / 4 wavelength of its corresponding zero-point frequency, the second stub 1222 corresponds to 1 / 4 wavelength of its corresponding zero-point frequency, and the third stub 1223 corresponds to 3 / 4 wavelength of its corresponding zero-point frequency. Furthermore, please refer to... Figures 2 to 4 For the circuit board 10 that transmits low-frequency signals, the filter stubs 122 of the radio frequency transmission line are, for example, three stubs, namely the fourth stub 1224, the fifth stub 1225 and the sixth stub 1226. Specifically, the fourth stub 1224 is 3 / 4 wavelength of its corresponding zero frequency, the fifth stub 1225 is 3 / 4 wavelength of its corresponding zero frequency, and the sixth stub 1226 is 3 / 4 wavelength of its corresponding zero frequency.

[0063] Please see Figure 1 , Figure 2 and Figure 4 In one embodiment, the RF transmission line 12 further includes a short-circuit stub 125 electrically connected to at least one filter stub 122, and the short-circuit stub 125 is also used for grounding. Thus, by adding the short-circuit stub 125 electrically connected to the filter stub 122, extensive simulation experiments have shown that a strong zero point can be generated, improving near-end out-of-band rejection and significantly increasing isolation, thereby achieving intermodulation stability, high power capacity, and good consistency. Furthermore, due to the presence of the short-circuit stub 125, the filter stub 122 does not require excessively high impedance to generate a strong zero point; in other words, the length of the filter stub 122 can be correspondingly shortened, thereby simplifying the structural design of the RF transmission line 12. The width of the filter stub 122 does not need to be too thin, thus reducing manufacturing difficulty, increasing power capacity, and improving stability.

[0064] The short-circuit stub 125 can be configured as one, two, three, or other quantities. When there is one short-circuit stub 125, it can be connected to any one of the filter stubs 122 of the RF transmission line 12. When there are two short-circuit stubs 125, they can be connected to any two of the filter stubs 122 of the RF transmission line 12. Furthermore, each filter stub 122 of the RF transmission line 12 is connected to a corresponding short-circuit stub 125.

[0065] Specifically, one end of the short-circuit stub 125 is electrically connected to the middle part of the filter stub 122, and the other end of the short-circuit stub 125 is used for grounding.

[0066] In one embodiment, the grounding configuration of the short-circuit stub 125 is, for example, that the end of the short-circuit stub 125 is connected to the wall of the metallized cavity 20 using metal fasteners such as metal screws, metal pins, metal rivets, and metal clips.

[0067] Please see Figures 5 to 7 In one embodiment, when the radio frequency transmission line 12 is used to transmit high-frequency signals, the length between the connection position of the short-circuit stub 125 and the filter stub 122 and the starting end of the filter stub 122 is 1 / 4 to 1 / 2 of the length of the filter stub 122. Specifically, it can be any value such as 1 / 4, 1 / 3 or 1 / 2 of the length of the filter stub 122. In this way, the connection position of the short-circuit stub 125 and the filter stub 122 is set reasonably, which can improve the performance of the antenna.

[0068] Please see Figures 2 to 4 In one embodiment, when the radio frequency transmission line 12 is used to transmit low-frequency signals, the length between the connection position of the short-circuit stub 125 and the filter stub 122 and the starting end of the filter stub 122 is 1 / 2 to 4 / 5 of the length of the filter stub 122. Specifically, it can be any value such as 1 / 2, 3 / 4 or 4 / 5 of the length of the filter stub 122. In this way, the connection position of the short-circuit stub 125 and the filter stub 122 is set reasonably, which can improve the performance of the antenna.

[0069] Please see Figure 1 In one embodiment, the metallized cavity 20 has two chambers 21, and the circuit board 10 is provided in two separate chambers 21. The radio frequency transmission line 12 has a first connection terminal 123 and a second connection terminal 124, which are specifically provided at opposite ends of the main line 121. The metallized cavity 20 has two input connectors 30 and an output connector 40. Each input connector 30 is electrically connected to each corresponding first connection terminal 123. The output connector 40 can be electrically connected to each of the two second connection terminals 124, or the two second connection terminals 124 can be electrically connected to each other and then electrically connected to the output connector 40. Specifically, both the input connector 30 and the output connector 40 are, for example, SAM connectors. Thus, the two radio frequency signals, specifically a high-frequency signal and a low-frequency signal, are respectively transmitted to the two first connection terminals 123 through the two input connectors 30, transmitted to the second connection terminal 124 through the two radio frequency transmission lines 12, and output to the outside through the output connector 40, thereby realizing the combining of the two radio frequency signals.

[0070] The two chambers 21 are arranged in an upper and lower layer. For example, the circuit board 10 for transmitting low-frequency signals is arranged in the upper chamber 21, and the circuit board 10 for transmitting high-frequency signals is arranged in the lower chamber 21; conversely, the circuit board 10 for transmitting low-frequency signals is arranged in the lower chamber 21, and the circuit board 10 for transmitting high-frequency signals is arranged in the upper chamber 21.

[0071] Please see Figure 1 In one embodiment, the metallized cavity 20 is provided with a partition 22, which divides the metallized cavity 20 into two chambers 21.

[0072] Please see Figure 1 In one embodiment, at least one boss 23 is provided on the inner wall of the metallized cavity 20, and the circuit board 10 is detachably mounted on the boss 23 by means of a mounting member.

[0073] The mounting components include, but are not limited to, screws, pins, rivets, bolts, and snap-fit ​​components.

[0074] In one embodiment, the number of bosses 23 is, for example, multiple, and they are arranged circumferentially around the metallized cavity 20, so that the circuit board 10 is stably mounted inside the metallized cavity 20.

[0075] In some embodiments, the "partition 22, boss 23" can be a part of the "metallized cavity 20", that is, the "partition 22, boss 23" and the "other parts of the metallized cavity 20" are integrally formed; or it can be a separate component that can be separated from the "other parts of the metallized cavity 20", that is, the "partition 22, boss 23" can be manufactured independently and then combined with the "other parts of the metallized cavity 20" to form a whole.

[0076] Please see Figure 1 In some embodiments, the metallized cavity 20 includes a main structure 24 and a cover plate 25 that can be opened and disposed on the main structure 24. Thus, by opening the cover plate 25, the circuit board 10 can be installed in and removed from the cavity 21. The main structure 24 and the cover plate 25 are each disposed independently, for example, as integrally formed sheet metal parts, or they can include a dielectric carrier and a metal layer disposed on the dielectric carrier.

[0077] Please see Figure 1In one embodiment, the stripline combiner further includes a mating component 50 disposed between two second connection terminals 124, the two second connection terminals 124 being electrically connected via the mating component 50. One of the second connection terminals 124 is configured as a common terminal, which is electrically connected to the output connector 40. Thus, the mating component 50 enables the two second connection terminals 124 to be connected in parallel to the output connector 40, facilitating the mating and combination of the output connector 40 and the two second connection terminals 124.

[0078] Please see Figure 1 In one embodiment, the docking component 50 includes a pin 51 and an insulating sleeve 52 sleeved over the pin 51. The partition plate 22 has mounting holes corresponding to the insulating sleeve 52, and the insulating sleeve 52 is installed in the mounting holes. The pin 51 is directly electrically connected to two second connecting ends 124. Specifically, each second connecting end 124 has a welding hole, and the pin 51 is inserted into the welding hole and welded to the second connecting end 124.

[0079] Please see Figures 1 to 4 In one embodiment, a multi-frequency antenna is provided, which includes the stripline combiner of any of the above embodiments.

[0080] The aforementioned multi-frequency antenna not only achieves a small size, light weight, and ease of manufacturing for the stripline combiner, but also features at least one cutout 112 formed in the area of ​​the dielectric substrate 11 other than where the RF transmission lines 12 are arranged. The sidewall of the cutout 112 is provided with a conductive layer, which is electrically connected to the two RF transmission lines 12 respectively. This effectively improves the insertion loss, reducing it to less than or equal to, for example, 0.8 dB, thereby enhancing antenna performance, facilitating miniaturized integration of the antenna, improving antenna gain, and increasing the antenna signal coverage area.

[0081] Please see Figure 8 , Figure 8 The S-parameter curves of a multi-frequency antenna according to an embodiment of this application are shown. As can be seen from curves S21 and S31, the insertion loss is effectively improved and reduced to less than or equal to, for example, 0.8 dB. As can be seen from curve S23, three transmission zeros are generated out of band in both the high-frequency band and the low-frequency band, which effectively improves the isolation, which is greater than or equal to 30 dB. As can be seen from curve S11, the combiner has a wide combining bandwidth, for example, 698 MHz-960 MHz.

[0082] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0083] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0084] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0085] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0086] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0087] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A circuit board for a stripline combiner, characterized in that, The circuit board of the stripline combiner includes: A dielectric substrate and two radio frequency (RF) transmission lines are respectively connected to two opposite sides of the dielectric substrate. The dielectric substrate has at least one metallized via, and the wall of the metallized via is electrically connected to the two RF transmission lines. The dielectric substrate includes a first region where the RF transmission lines are arranged and a second region connected to the first region. The second region has at least one cutout, which is arranged adjacent to the RF transmission lines. The sidewall of the cutout is provided with a conductive layer, which is electrically connected to the two RF transmission lines.

2. The circuit board of the stripline combiner according to claim 1, characterized in that, The second region is provided with at least one support portion, which is connected to the two opposite walls of the cutout, or the support portion is provided on the periphery of the medium plate.

3. The circuit board of the stripline combiner according to claim 2, characterized in that, The cutout is a long and narrow strip, and the support is connected to the middle part of the long and narrow strip along its length.

4. The circuit board of the stripline combiner according to claim 1, characterized in that, The radio frequency transmission line includes a main line and at least one filter stub. The starting end of the filter stub is electrically connected to the main line, and the ending end of the filter stub is set as an open circuit.

5. The circuit board of the stripline combiner according to claim 4, characterized in that, The filter branches are arranged in a circuitous pattern.

6. The circuit board of the stripline combiner according to claim 4, characterized in that, The filter branches are configured in multiple ways and arranged sequentially along the extension direction of the main line.

7. The circuit board of the stripline combiner according to claim 4, characterized in that, The length of the filter stub is 1 / 4 wavelength or 3 / 4 wavelength of its corresponding zero frequency.

8. The circuit board of the stripline combiner according to any one of claims 4 to 7, characterized in that, The radio frequency transmission line also includes a short-circuit stub electrically connected to at least one of the filter stubs, the short-circuit stub also serving as a grounding configuration.

9. The circuit board of the stripline combiner according to claim 8, characterized in that, When the radio frequency transmission line is used to transmit high-frequency signals, the length between the connection position of the short-circuit stub and the filter stub and the starting end of the filter stub is 1 / 4 to 1 / 2 of the length of the filter stub. When the radio frequency transmission line is used to transmit low frequency signals, the length between the connection point of the short-circuit stub and the filter stub and the starting end of the filter stub is 1 / 2 to 4 / 5 of the length of the filter stub.

10. A stripline combiner, characterized in that, The stripline combiner includes at least one circuit board as described in any one of claims 1 to 9, and further includes a metallized cavity in which the circuit board is disposed.

11. The stripline combiner according to claim 10, characterized in that, The metallized cavity has two chambers, and the circuit board is provided in two separate chambers. The radio frequency transmission line has a first connection end and a second connection end. The metallized cavity has two input connectors and an output connector. Each input connector is electrically connected to each of the first connection ends. The two second connection ends are electrically connected to each other. One of the second connection ends is a common terminal and is electrically connected to the output connector.

12. The stripline combiner according to claim 11, characterized in that, The metallized cavity is provided with a partition, which divides the metallized cavity into two chambers; At least one boss is provided on the inner wall of the metallized cavity, and the circuit board is detachably mounted on the boss by means of a mounting component.

13. The stripline combiner according to claim 12, characterized in that, The stripline combiner further includes a docking component disposed between the two second connection ends, the two second connection ends being electrically connected through the docking component.

14. The stripline combiner according to claim 13, characterized in that, The docking component includes a pin and an insulating sleeve fitted over the pin. The partition plate has mounting holes corresponding to the insulating sleeve, and the insulating sleeve is fitted into the mounting holes. The pin is directly electrically connected to the two second connection ends respectively.

15. A multi-frequency antenna, characterized in that, The multi-frequency antenna includes a stripline combiner as described in any one of claims 10 to 14.

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