Distributed two-in and one-out multi-channel heat sink and fiber coupled semiconductor laser

Abstract

This invention relates to a two-input, one-output distributed multi-channel heat sink and a fiber-coupled semiconductor laser. The heat sink includes a shunt step, and multiple stepped microchannel structures sealed above the shunt step and a transverse shunt channel structure below it. Multiple first steps are provided on the upper surface of the shunt step. Three connection ports are provided at one end of the shunt step: the middle one is a coolant outlet channel, and the two on either side are coolant inlet channels. Vertical shunt channel structures are provided on each of the multiple first steps, including three sets of vertical shunt channels. Three sets of transverse shunt channels extending along the X direction are provided on the transverse shunt channel structure. The three sets of vertical shunt channels and the three sets of transverse shunt channels are arranged side-by-side along the Y direction. This invention integrates existing single-row unidirectional heat sinks, resulting in a 30% reduction in volume, a 28.8% reduction in weight, and a 32% improvement in heat dissipation capacity.

Description

Technical Field

[0001] This invention relates to a heat sink structure for a laser chip, specifically to a two-input, one-output distributed multi-channel heat sink and a fiber-coupled semiconductor laser. Background Technology

[0002] Fiber-coupled semiconductor lasers (FCSlas) have advantages such as small size and high electro-optical conversion efficiency, and are often used directly in industrial, medical, and military fields. They are also commonly used as pump sources for fiber lasers. With the development of industry, there are higher requirements for the miniaturization, high power and high power density, high conversion efficiency, and wavelength diversity of FCSlas.

[0003] like Figure 1 As shown, a fiber-coupled semiconductor laser includes a base plate 01, two heat sinks 02 arranged side-by-side on the base plate, a protective layer 03, and a single-tube laser chip 04. The protective layer 03 is disposed on the heat sinks 02, and the single-tube laser chip 04 is disposed on the protective layer 01. The heat sinks 02 include a flow-diverting step 021, a coolant inlet channel 022 disposed within the flow-diverting step 021, a coolant outlet channel 023, and multiple stepped microchannel structures 024. This structure has the following disadvantages:

[0004] 1. Using two O2 heat sinks arranged in a unidirectional manner requires a large space and more materials, which is not conducive to the miniaturization and weight reduction of fiber-coupled semiconductor lasers;

[0005] 2. Both the coolant inlet channel 022 and the coolant outlet channel 023 use circular through holes that penetrate the entire flow divider step 021 without internal support, which makes the flow divider step 021 prone to bulging and deformation under the pressure of water flow.

[0006] 3. Insufficient heat dissipation capacity. Summary of the Invention

[0007] The purpose of this invention is to solve the technical problems of existing fiber-coupled semiconductor lasers, such as large size and weight, easy bulging and deformation under water flow driving pressure, and insufficient heat dissipation capacity, and to provide a two-input one-output distributed multi-channel heat sink and fiber-coupled semiconductor laser.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0009] A distributed multi-channel heat sink with two inputs and one output is special in that:

[0010] It includes a diversion step, as well as multiple stepped microchannel structures respectively sealed above the diversion step and a transverse diversion channel structure below it;

[0011] Definition: The length direction of the diversion step is the X direction, the height direction is the Z direction, and the direction perpendicular to both the X and Z directions is the Y direction;

[0012] The upper surface of the flow divider step is provided with multiple connecting steps along the X direction from one end to the other. The multiple connecting steps and the multiple step microchannel structures are arranged one-to-one. Three connection ports are provided on the YZ side of one end of the flow divider step. The three connection ports are arranged side by side along the Y direction. The connection port in the middle is the coolant outlet channel, and the two connection ports on both sides are coolant inlet channels.

[0013] Vertical diversion channel structures are provided on multiple connecting steps, and the vertical diversion channel structures include three sets of vertical diversion channels; the horizontal diversion channel structures are provided with three sets of horizontal diversion channels extending along the X direction; the three sets of vertical diversion channels and the three sets of horizontal diversion channels are arranged side by side along the Y direction;

[0014] The coolant outlet channel is connected to a set of horizontal branch channels in the middle. The set of horizontal branch channels in the middle is connected to multiple sets of vertical branch channels in the middle. The multiple sets of vertical branch channels in the middle are respectively connected to the outlets of multiple stepped microchannel structures to form an outlet path.

[0015] The two coolant inlet channels are connected to two sets of lateral diversion channels on both sides. The two sets of lateral diversion channels on both sides are connected to multiple sets of vertical diversion channels on both sides. The multiple sets of vertical diversion channels on both sides are connected to two inlets of multiple stepped microchannel structures, forming inlet paths.

[0016] Furthermore, the stepped microchannel structure includes a confluence layer, a jet and return layer, a main cooling layer, and an upper sealing layer arranged sequentially from bottom to top along the Z direction;

[0017] Three flow-collecting zones are arranged side by side along the Y direction on the flow-collecting layer. Each of the three flow-collecting zones has multiple flow-collecting channels extending along the Y direction. The flow-collecting zone in the middle serves as the outlet of the stepped microchannel structure and is connected to a set of vertical flow-diverting channels in the middle. The two flow-collecting zones on both sides serve as the two inlets of the stepped microchannel structure and are connected to the two sets of vertical flow-diverting channels on both sides.

[0018] Two jet zones and one recirculation zone are arranged side by side along the Y direction on the jet and recirculation layer; the recirculation zone is located in the middle, and the two jet zones are located on both sides of the recirculation zone; the jet zone has a hollow structure, and the recirculation zone has multiple recirculation channels extending along the Y direction; the two jet zones are respectively connected to the two confluence zones located on both sides, and the recirculation zone is connected to the confluence zone located in the middle.

[0019] The main cooling layer has multiple cooling channels extending along the Y direction, which are connected to two spray zones and one recirculation zone.

[0020] The top seal is used to seal the upper part of the main cooling layer.

[0021] Furthermore, the width of the confluence channel is 0.1mm-0.5mm, and the interval is 0.1mm-0.5mm; the width and interval of the return channel and the cooling channel are respectively equal to the width and interval of the confluence channel.

[0022] Furthermore, the lateral diversion channel structure includes a lower sealing layer and a lateral diversion channel layer arranged sequentially from bottom to top along the Z direction;

[0023] The lateral diversion channel is located within the lateral diversion channel layer;

[0024] The lower sealing layer is used to seal the lower part of the transverse diversion channel layer.

[0025] Furthermore, the middle set of vertical diversion channels includes two vertical diversion channels, and the two sets of vertical diversion channels on both sides each include three vertical diversion channels;

[0026] The middle set of lateral diversion channels includes two lateral diversion channels, while the two sets of lateral diversion channels on both sides each include three lateral diversion channels.

[0027] Furthermore, the dimensions of the multiple connecting steps are the same in the X and Y directions, while the dimensions in the Z direction decrease sequentially from one end to the other along the X direction;

[0028] The stepped microchannel structures set on multiple connecting steps have the same dimensions in the X, Y, and Z directions.

[0029] Furthermore, the width of the lateral diversion channel is 1.5mm-2.0mm, and the height is 1.0mm-3.0mm;

[0030] The height of the vertical diversion channel is 5.0mm-8mm, and the width is the same as that of the horizontal diversion channel;

[0031] The intervals between two adjacent horizontal and vertical diversion channels are equal, ranging from 0.3mm to 1.0mm.

[0032] Meanwhile, the present invention also provides a fiber-coupled semiconductor laser, which is characterized by:

[0033] This includes the aforementioned two-input, one-output distributed multi-channel heat sink, as well as multiple sets of secondary heat sinks and multiple sets of single-tube laser chips;

[0034] Multiple sets of secondary heat sinks, multiple sets of stepped microchannel structures, and multiple sets of single-tube laser chips are respectively set up;

[0035] Each of the multiple sets of secondary heat sinks includes two secondary heat sinks arranged side by side along the Y direction, and each of the multiple sets of single-tube laser chips includes two single-tube laser chips; the two single-tube laser chips of each set are respectively arranged on the two secondary heat sinks of each set along the Y direction, forming a unit laser chip array.

[0036] Furthermore, one end of each of the two single-tube laser chips in each group is flush with the other end of each of the two secondary heat sinks in each group, while the other end is spaced apart from the other end of each of the two secondary heat sinks in each group.

[0037] Compared with the prior art, the beneficial effects of the present invention are:

[0038] 1. This invention integrates the existing single-row unidirectional heat sink by adopting a multi-channel structure with two inlets and one outlet, thereby reducing the volume of the heat sink by 30% and the weight by 28.8%. At the same time, this invention also designs horizontal and vertical diversion channels to divert the coolant input from the coolant inlet channel twice, and then increases the flow rate by converging and spraying, thereby improving the heat dissipation capacity by 32%.

[0039] 2. The connection port in this invention does not need to run through the entire flow divider step. Instead, the coolant input from the coolant inlet channel is first divided by the set horizontal flow divider channel structure. Then, multiple vertical flow divider channels are connected in parallel by the horizontal flow divider channel structure. This not only reduces the height and volume of the entire flow divider step, but also improves the mechanical properties of the flow divider step, making it less prone to bulging and deformation. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the structure of an existing fiber-coupled semiconductor laser;

[0041] Figure 1 In the middle: 01-base plate, 02-heat sink, 021-diversion step, 022-coolant inlet channel, 023-coolant outlet channel, 024-stepped microchannel structure; 03-protective layer, 04-single tube laser chip.

[0042] Figure 2 This is an exploded structural diagram of an embodiment of a two-input, one-output distributed multi-channel heat sink according to the present invention;

[0043] Figure 3 This is an exploded structural diagram of an embodiment of a fiber-coupled semiconductor laser according to the present invention;

[0044] Figure 4 This is a schematic diagram of an embodiment of a fiber-coupled semiconductor laser according to the present invention.

[0045] Figure 2-4 In the middle: 1-flow divider step, 2-step microchannel structure, 21-flow merger layer, 211-flow merger channel; 22-jet and return layer, 221-jet zone, 222-return zone; 23-main cooling layer, 231-cooling channel; 24-upper sealing layer; 3-lateral flow divider channel structure, 31-lower sealing layer, 32-lateral flow divider channel layer; 4-coolant outlet channel, 5-coolant inlet channel, 6-vertical flow divider channel, 7-lateral flow divider channel, 8-secondary heat sink, 9-single tube laser chip. Detailed Implementation

[0046] To make the objectives, advantages, and features of this invention clearer, the following detailed description of a two-input, one-output distributed multi-channel heat sink and fiber-coupled semiconductor laser proposed by this invention, in conjunction with the accompanying drawings and specific embodiments, will be provided. The advantages and features of this invention will become clearer according to the following specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, only used to conveniently and clearly assist in illustrating the objectives of the embodiments of this invention; furthermore, the structures shown in the drawings are often part of the actual structure.

[0047] This embodiment provides a two-input, one-output distributed multi-channel heat sink. See [link / reference] Figure 2 The heat sink includes a flow-diverting step 1, and multiple step microchannel structures 2 and a transverse flow-diverting channel structure 3 respectively sealed above the flow-diverting step 1 and below it. In this embodiment, the flow-diverting step 1 is made of an alloy, such as a copper-based, aluminum-based or magnesium-based alloy, so that the flow-diverting step 1 has good thermal conductivity.

[0048] For ease of description, in this embodiment, the length direction of the diversion step 1 is defined as the X direction, the height direction as the Z direction, and the direction perpendicular to both the X and Z directions as the Y direction.

[0049] The upper surface of the diversion step 1 is provided with multiple connecting steps along the X direction from one end to the other, and the multiple connecting steps and multiple step microchannel structures 2 are arranged one-to-one. Three connection ports are provided on the YZ side of one end of the diversion step 1. The three connection ports are arranged side by side along the Y direction. The connection port in the middle is the coolant outlet channel 4, and the two connection ports on both sides are coolant inlet channels 5. By adopting this two-inlet-one-outlet multi-channel structure, the two existing heat sinks can be combined into one, thereby reducing the volume and weight. Compared with the existing heat sinks, the heat sink of the present invention is 28.8% lighter and 30% smaller in volume. Furthermore, the coolant outlet channel 4 and the two sets of coolant inlet channels 5 are separate and independently connected to the step microchannel structures 2, forming a parallel water channel. This avoids the inconsistency of coolant temperature and pressure flowing into each step microchannel structure 2, improves the junction temperature consistency of each single-tube laser chip 9, and reduces wavelength drift. The coolant can be water, Freon, pentafluoropropane, or liquid metal, etc., with water being preferred.

[0050] The dimensions of the multiple connecting steps are the same in the X and Y directions, and the dimensions in the Z direction decrease sequentially from one end of the X direction to the other. At the same time, the dimensions of the step microchannel structure 2 set on the multiple connecting steps are the same in the X, Y and Z directions. The uniformity and consistency of the temperature of each single-tube laser chip 9 are further improved by the step microchannel structure 2 with consistent dimensions.

[0051] Vertical diversion channels 6 are provided on multiple connecting steps, with intervals between vertical diversion channels 6 on adjacent connecting steps. The transverse diversion channel structure 3 includes a lower sealing layer 31 and a transverse diversion channel layer 32 arranged sequentially from bottom to top along the Z direction. Three sets of transverse diversion channels 7 extending along the X direction are provided on the transverse diversion channel layer 32, and the lower sealing layer 31 seals the lower part of the transverse diversion channel layer 32. The three sets of vertical diversion channels 6 and the three sets of transverse diversion channels 7 are arranged side by side along the Y direction. Specifically, the middle set of vertical diversion channels 6 includes two vertical diversion channels, and the two sets of vertical diversion channels 6 on both sides each include three vertical diversion channels; the middle set of transverse diversion channels 7 includes two transverse diversion channels, and the two sets of transverse diversion channels 7 on both sides each include three transverse diversion channels. The width of the horizontal diversion channel 7 is 1.5mm-2.0mm, and the height is 1.0mm-3.0mm; the height of the vertical diversion channel 6 is 5.0mm-8mm, and the width is the same as that of the horizontal diversion channel 7; the interval between two adjacent horizontal diversion channels 7 and vertical diversion channels 6 is equal, both being 0.3mm-1.0mm. Compared to the existing method of using a circular through-hole to directly penetrate the entire diversion step 1 as the coolant inlet and outlet channel, resulting in a large overall height of the step and a lack of mechanical support for the hollowed-out parts, this invention uses a connection port to divert the coolant to the horizontal diversion channel 7 in one step, connecting multiple vertical diversion channels 6 in parallel, resulting in better mechanical performance and less susceptibility to bulging deformation.

[0052] The coolant outlet channel 4 is connected to a set of transverse diversion channels 7 located in the middle. The set of transverse diversion channels 7 located in the middle is connected to multiple sets of vertical diversion channels 6 located in the middle. The multiple sets of vertical diversion channels 6 located in the middle are respectively connected to the outlets of multiple stepped microchannel structures 2. The two coolant inlet channels 5 are respectively connected to two sets of transverse diversion channels 7 located on both sides. The two sets of transverse diversion channels 7 located on both sides are connected to multiple sets of vertical diversion channels 6 located on both sides. The multiple sets of vertical diversion channels 6 located on both sides are respectively connected to the two inlets of multiple stepped microchannel structures 2. The stepped microchannel structure 2 includes a flow-collecting layer 21, a jet and return layer 22, a main cooling layer 23, and an upper sealing layer 24 arranged sequentially from bottom to top along the Z direction. Three flow-collecting zones are arranged side-by-side along the Y direction on the flow-collecting layer 21. Each of the three flow-collecting zones has multiple flow-collecting channels 211 extending along the Y direction. The width of the flow-collecting channels 211 is 0.1mm-0.5mm, and the interval is 0.1mm-0.5mm. The middle flow-collecting zone serves as the outlet of the stepped microchannel structure 2 and is connected to a set of vertical diversion channels 6 located in the middle. The two flow-collecting zones on both sides serve as the two inlets of the stepped microchannel structure 2 and are connected to the two sets of vertical diversion channels 6 located on both sides. The main cooling layer 22 has two spray zones 221 and one return zone 222 arranged side-by-side along the Y direction. The return zone 222 is located in the middle, and the two spray zones 221 are located on both sides of the return zone 222. The spray zones 221 have a hollow structure, and the return zone 222 has multiple return channels extending along the Y direction. The two spray zones 221 are connected to two confluence zones located on both sides, and the return zone 222 is connected to the confluence zone located in the middle. The main cooling layer 23 has multiple cooling channels 231 extending along the Y direction, and these channels are connected to both spray zones 221 and the return zone 222. The upper sealing layer 24 is used to seal the upper part of the main cooling layer 23. The width and spacing of the return channels and cooling channels 231 are equal to the width and spacing of the confluence channels 211. This multiple diversion and confluence, along with the spraying, increases the flow rate, resulting in a 32% improvement in heat dissipation capacity compared to existing technologies.

[0053] In use, the coolant enters the diversion step 1 through two coolant inlet channels 5. First, it enters the two sets of transverse diversion channels 7 on both sides, where the coolant is first diverted. Then, the coolant in the transverse diversion channels 7 enters the corresponding vertical diversion channel 6 for a second diversion. After being diverted by the vertical diversion channel 6, the coolant enters the corresponding confluence area on the confluence layer 21 for confluence, and then is accelerated by the corresponding spray area 221. After being accelerated by the spray, the coolant enters the main cooling layer 23 and flows along the main cooling channel 231, thereby carrying away the heat conducted by the single-tube laser chip 9 to the stepped microchannel structure 2. When the coolant flows from both sides to the middle, it gathers and turns downwards. Then, it passes sequentially through the return area 222 in the spray and return layer 22, the confluence area in the middle of the confluence layer 21, the vertical diversion channel 6 in the middle, and the transverse diversion channel 7 in the middle to the coolant outlet channel 4, thus being discharged outside the diversion step 1.

[0054] This embodiment provides a fiber-coupled semiconductor laser, reference... Figure 3-4 The laser includes the aforementioned two-input-one-output distributed multi-channel heat sink, as well as multiple sets of secondary heat sinks 8 and multiple sets of single-tube laser chips 9.

[0055] Multiple sets of secondary heat sinks 8, multiple sets of stepped microchannel structures 2, and multiple sets of single-tube laser chips 9 are respectively arranged. Each set of secondary heat sinks 8 includes two secondary heat sinks 8 arranged side by side along the Y direction, and each set of single-tube laser chips 9 includes two single-tube laser chips 9. The two single-tube laser chips 9 of each set are respectively arranged on the two secondary heat sinks 8 of each set along the Y direction, forming a unit laser chip array. One end of the two single-tube laser chips 9 of each set is flush with the two secondary heat sinks 8 of each set, away from each other, and the other end is spaced apart from the two secondary heat sinks 8 of each set, close to each other.

Claims

1. A distributed multi-channel heat sink with two inputs and one output, characterized in that: It includes a diversion step (1), and multiple step microchannel structures (2) and a transverse diversion channel structure (3) respectively sealed above the diversion step (1); Definition: The length direction of the diversion step (1) is the X direction, the height direction is the Z direction, and the direction perpendicular to both the X and Z directions is the Y direction; The upper surface of the diversion step (1) is provided with multiple connecting steps along the X direction from one end to the other, and the multiple connecting steps and multiple step microchannel structures (2) are provided in a one-to-one correspondence; the YZ side of one end of the diversion step (1) is provided with three connection ports, and the three connection ports are arranged side by side along the Y direction. The connection port in the middle is the coolant outlet channel (4), and the two connection ports on both sides are coolant inlet channels (5); Each of the connecting steps is provided with three sets of vertical diversion channels (6); the transverse diversion channel structure (3) is provided with three sets of transverse diversion channels (7) extending along the X direction; the three sets of vertical diversion channels (6) and the three sets of transverse diversion channels (7) are arranged side by side along the Y direction; The coolant outlet channel (4) is connected to a set of transverse diversion channels (7) located in the middle. The set of transverse diversion channels (7) located in the middle is connected to a set of vertical diversion channels (6) located in the middle. The set of vertical diversion channels (6) located in the middle are connected to the outlets of a set of stepped microchannel structures (2) respectively, forming an outlet path. The two coolant inlet channels (5) are respectively connected to the two sets of transverse diversion channels (7) located on both sides. The two sets of transverse diversion channels (7) located on both sides are respectively connected to the two sets of vertical diversion channels (6) located on both sides. The two sets of vertical diversion channels (6) located on both sides are respectively connected to the two inlets of the two sets of stepped microchannel structures (2) to form an inlet path. The stepped microchannel structure (2) includes a confluence layer (21), a jet and return layer (22), a main cooling layer (23), and an upper sealing layer (24) arranged sequentially from bottom to top along the Z direction; The flow layer (21) has three flow zones arranged side by side along the Y direction. Each of the three flow zones has multiple flow channels (211) extending along the Y direction. The flow zone in the middle serves as the outlet of the stepped microchannel structure (2) and is connected to a set of vertical diversion channels (6) in the middle. The two flow zones on both sides serve as the two inlets of the stepped microchannel structure (2) and are connected to the two sets of vertical diversion channels (6) on both sides. The jetting and recirculation layer (22) has two jetting zones (221) and one recirculation zone (222) arranged side by side along the Y direction; the recirculation zone (222) is located in the middle, and the two jetting zones (221) are respectively located on both sides of the recirculation zone (222); the jetting zone (221) has a hollow structure, and the recirculation zone (222) has multiple recirculation channels extending along the Y direction; the two jetting zones (221) are respectively connected to the two confluence zones located on both sides, and the recirculation zone (222) is connected to the confluence zone located in the middle; The main cooling layer (23) is provided with multiple cooling channels (231) extending along the Y direction, and is connected to two spray zones (221) and a return zone (222) respectively; The upper sealing layer (24) is used to seal the upper part of the main cooling layer (23).

2. The distributed multi-channel heat sink with two inputs and one output as described in claim 1, characterized in that: The width of the confluence channel (211) is 0.1mm-0.5mm, and the interval is 0.1mm-0.5mm; the width and interval of the return channel and the cooling channel (231) are respectively equal to the width and interval of the confluence channel (211).

3. The dual-input, single-output distributed multi-channel heat sink according to claim 1 or 2, characterized in that: The transverse diversion channel structure (3) includes a lower sealing layer (31) and a transverse diversion channel layer (32) arranged sequentially from bottom to top along the Z direction; The transverse diversion channel (7) is disposed within the transverse diversion channel layer (32); The lower sealing layer (31) is used to seal the lower part of the transverse diversion channel layer (32).

4. The distributed multi-channel heat sink with two inputs and one output as described in claim 3, characterized in that: The middle set of vertical diversion channels (6) includes two vertical diversion channels, and the two sets of vertical diversion channels (6) on both sides each include three vertical diversion channels; The middle set of transverse diversion channels (7) includes two transverse diversion channels, and the two sets of transverse diversion channels (7) on both sides each include three transverse diversion channels.

5. The distributed multi-channel heat sink with two inputs and one output as described in claim 4, characterized in that: The dimensions of the multiple connecting steps are the same in the X and Y directions, and the dimensions in the Z direction decrease sequentially from one end to the other along the X direction. The stepped microchannel structures (2) arranged on the multiple connecting steps have the same dimensions in the X, Y and Z directions.

6. The distributed multi-channel heat sink with two inputs and one output as described in claim 5, characterized in that: The width of the transverse diversion channel (7) is 1.5mm-2.0mm, and the height is 1.0mm-3.0mm; The height of the vertical diversion channel (6) is 5.0mm-8mm, and the width is the same as that of the horizontal diversion channel (7); The intervals between two adjacent horizontal diversion channels (7) and vertical diversion channels (6) are equal, both ranging from 0.3mm to 1.0mm.

7. A fiber-coupled semiconductor laser, characterized in that: It includes a two-input one-output distributed multi-channel heat sink as described in any one of claims 1-6, as well as multiple sets of secondary heat sinks (8) and multiple sets of single-tube laser chips (9); Multiple sets of secondary heat sinks (8), multiple sets of stepped microchannel structures (2) and multiple sets of single-tube laser chips (9) are respectively set; Each of the multiple sets of secondary heat sinks (8) includes two secondary heat sinks (8) arranged side by side along the Y direction, and each of the multiple sets of single-tube laser chips (9) includes two single-tube laser chips (9); the two single-tube laser chips (9) of each set are respectively arranged on the two secondary heat sinks (8) of each set along the Y direction to form a unit laser chip array.

8. A fiber-coupled semiconductor laser according to claim 7, characterized in that: One end of each of the two single-tube laser chips (9) is flush with the two secondary heat sinks (8) of each group, and the other end is close to the two secondary heat sinks (8) of each group, with a gap at one end.

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