Wcn chip data interaction circuit
Patent Information
- Application Number
- CN202311437000.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-31
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2043-03-31
AI Technical Summary
[0005]本发明提供一种具有多种时间校准模式的WCN芯片数据交互电路,有效解决了现有的WCN芯片数据交互电路总体功耗较高的技术问题
[0014]在本发明所述的具有多种时间校准模式的WCN芯片数据交互电路中,所述加热电阻的阻值为9.5Ω-10.5Ω。
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Figure CN117353838B_ABST
Abstract
Description
[0001] This application is a divisional application. The original application has the application number "202310342553.4" and the application date "March 31, 2023". The invention title is "A WCN chip data interaction circuit with multiple time calibration modes". Technical Field
[0002] This invention relates to the field of circuits, and in particular to a WCN chip data interaction circuit. Background Technology
[0003] In modern mobile phone circuits, radio frequency (RF) chips all require a 26MHz reference clock. Therefore, transceivers need to calibrate the clock signal output from the crystal under set temperature conditions. In existing technology, the transceiver needs to establish communication with an external test instrument via the RF module, allowing the transceiver to calibrate the clock signal based on the test results. However, even if the WCN chip data interaction circuit does not require RF communication, it still requires the RF module to function properly. Due to the high power consumption of the RF module, existing WCN chip data interaction circuits suffer from high overall power consumption.
[0004] Therefore, it is necessary to provide a WCN chip data interaction circuit to solve the above-mentioned technical problems. Summary of the Invention
[0005] This invention provides a WCN chip data interaction circuit with multiple time calibration modes, which effectively solves the technical problem of high overall power consumption in existing WCN chip data interaction circuits.
[0006] This invention provides a WCN chip data interaction circuit with multiple time calibration modes, comprising: The baseband chip module is used to output drive signals and trigger signals; A crystal module is used to output a clock signal based on the drive signal; The transceiver chip module is used to output a calibration signal based on the clock signal, and to perform calibration operations on the clock signal based on the result signal output by the external comprehensive test instrument, so as to generate a standard clock signal. The radio frequency module is used to transmit the calibration signal to an external comprehensive tester and to the transceiver chip module. The radio frequency module is used to heat the transceiver chip module based on the trigger signal, so that the transceiver chip module outputs the calibration signal under a set temperature condition. The output circuit module is connected at one end to the transceiver chip module and at the other end to an external comprehensive test instrument. It is used to output the calibration signal to the external comprehensive test instrument, which is used to perform a detection operation on the calibration signal to generate the result signal. The input circuit module is connected at one end to the transceiver chip module and at the other end to an external comprehensive tester, and is used to output the result signal to the transceiver chip module. A heating circuit module is used to heat the transceiver chip module based on the trigger signal, so that the transceiver chip module outputs the calibration signal under a set temperature condition. The WCN chip module is used to receive the standard clock signal, and the WCN chip module transmits data signals bidirectionally with the baseband chip module based on the standard clock signal. When radio frequency communication is not required, the transceiver chip module, the output circuit module, the input circuit module, and the external comprehensive test instrument form a first clock signal calibration path for transmitting the calibration signal and the result signal. When radio frequency (RF) communication is required, the transceiver chip module, the RF module, and the comprehensive test instrument form a second clock signal calibration path for transmitting the calibration signal and the result signal. This is used when RF communication is not required, as the transceiver chip module, output circuit module, input circuit module, and external comprehensive test instrument form a signal transmission path to transmit the calibration signal and result signal, thereby calibrating the clock signal. Therefore, when RF communication is not required, the WCN chip data interaction circuit does not need to activate the RF module, thus reducing the overall power consumption of the WCN chip data interaction circuit.
[0007] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the characteristic is that when the WCN chip data interaction circuit with multiple time calibration modes is in the first working state, the heating circuit module heats the transceiver chip module, the transceiver chip module outputs the calibration signal under a set temperature condition, the output circuit module outputs the calibration signal to an external comprehensive tester, the external comprehensive tester performs a detection operation on the calibration signal to generate a result signal, the input circuit module outputs the result signal to the transceiver chip module, and the transceiver chip module performs a calibration operation on the clock signal based on the result signal.
[0008] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, when the WCN chip data interaction circuit with multiple time calibration modes is in the second working state, the radio frequency module heats the transceiver chip module, the transceiver chip module outputs the calibration signal under a set temperature condition, the radio frequency module modulates the calibration signal, and the radio frequency module transmits the calibration signal to an external comprehensive tester, the external comprehensive tester demodulates the modulated calibration signal, the external comprehensive tester performs a detection operation on the calibration signal to generate a result signal, the result signal is output to the transceiver chip module through the radio frequency module, and the transceiver chip module performs a calibration operation on the clock signal based on the result signal.
[0009] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, when the WCN chip data interaction circuit with multiple time calibration modes is in the third working state, the transceiver chip module, the radio frequency module, and the external comprehensive tester form a third clock signal calibration path for transmitting the calibration signal and the result signal. The heating circuit module is also used to heat the transceiver chip module, so that the transceiver chip module transmits the calibration signal under a set temperature condition. The heating circuit module heats the transceiver chip module, and the transceiver chip module outputs the calibration signal under heating conditions. The radio frequency module modulates the calibration signal. An external comprehensive test instrument receives the modulated calibration signal and demodulates it. The external comprehensive test instrument performs a detection operation on the calibration signal to generate a result signal. The result signal is output to the transceiver chip module through the radio frequency module. The transceiver chip module performs a calibration operation on the clock signal based on the result signal.
[0010] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the heating circuit module includes a MOS transistor and a heating resistor. The gate of the MOS transistor is used to receive the trigger signal, the drain of the MOS transistor is connected to the power supply, the source of the MOS transistor is grounded, and the heating resistor is connected between the power supply and the drain of the MOS transistor. The heating resistor is used to heat the transceiver chip module.
[0011] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the transceiver chip module includes a transceiver chip, the transceiver chip includes an output pin, the output pin is used to output a calibration signal, the output circuit module includes a first current limiting unit, one end of the first current limiting unit is connected to the output pin, the other end of the first current limiting unit is connected to an external comprehensive tester, and the first current limiting unit is used to perform current limiting operation on the calibration signal.
[0012] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the transceiver chip includes an input pin for inputting a result signal. The input circuit module includes a second current limiting unit, one end of which is connected to the input pin, and the other end of which is connected to an external comprehensive tester. The second current limiting unit is used to perform current limiting on the result signal.
[0013] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the first current limiting unit includes a first current limiting resistor and a second current limiting resistor, and the first current limiting resistor and the second current limiting resistor are connected in series; the second current limiting unit includes a third current limiting resistor and a fourth current limiting resistor, and the third current limiting resistor and the fourth current limiting resistor are connected in series.
[0014] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the resistance of the heating resistor is 9.5Ω-10.5Ω.
[0015] In the WCN chip data interaction circuit with multiple time calibration modes described in this invention, the transceiver chip is model MT6357.
[0016] Compared to existing technologies, the advantages of this invention are as follows: This invention provides a WCN chip data interaction circuit with multiple time calibration modes. The baseband chip module outputs a drive signal and a trigger signal. The crystal module outputs a clock signal based on the drive signal, and the transceiver chip module outputs a calibration signal based on the clock signal. When RF communication is not required, the transceiver chip module, output circuit module, input circuit module, and external test instrument form a first clock signal calibration path for transmitting calibration and result signals. The heating circuit module heats the transceiver chip module based on the trigger signal, allowing the transceiver chip module to output a calibration signal under a set temperature condition. The output circuit module outputs this calibration signal to the external test instrument, which detects the calibration signal to generate a result signal. The input circuit module outputs the result signal to the transceiver chip module, thus enabling the transceiver chip module to perform clock signal calibration under a set temperature condition.
[0017] When radio frequency (RF) communication is required, the transceiver chip module, the RF module, and the comprehensive test instrument form a second clock signal calibration path for transmitting calibration signals and the result signals. The RF module heats the transceiver chip module based on a trigger signal, allowing the transceiver chip module to output a calibration signal under a set temperature condition. The RF module transmits the calibration signal to the external comprehensive test instrument, and can also transmit the result signal output by the comprehensive test instrument back to the transceiver chip module, thus enabling the transceiver chip module to perform clock signal calibration under the set temperature condition.
[0018] Furthermore, the transceiver chip module can generate a standard clock signal after calibrating the clock signal, and the WCN chip module can transmit data signals bidirectionally with the baseband chip module based on this standard clock signal.
[0019] The WCN chip data interaction circuit features a design compatible with the above-mentioned circuits. When RF communication is not required, the WCN chip data interaction circuit can calibrate the clock signal through a first clock signal calibration path. When RF communication is required, the WCN chip data interaction circuit can calibrate the clock signal through a second clock signal calibration path. Therefore, users can choose the appropriate clock signal calibration path as needed to save power consumption and cost. Moreover, when RF communication is not required, the WCN chip data interaction circuit does not need to use an RF module, thus reducing the overall power consumption of the WCN chip data interaction circuit. This effectively solves the technical problem of high overall power consumption in existing WCN chip data interaction circuits. Attached Figure Description
[0020] Figure 1 This is a block diagram of an embodiment of the WCN chip data interaction circuit with multiple time calibration modes of the present invention.
[0021] Figure 2 This is a circuit diagram of a crystal module according to an embodiment of the WCN chip data interaction circuit with multiple time calibration modes of the present invention.
[0022] Figure 3 This is a circuit diagram of a transceiver chip module according to an embodiment of the WCN chip data interaction circuit with multiple time calibration modes of the present invention.
[0023] Figure 4 This is a circuit diagram of an RF module of an embodiment of the WCN chip data interaction circuit with multiple time calibration modes of the present invention.
[0024] Figure 5 This is a circuit diagram of a heating circuit module according to an embodiment of the WCN chip data interaction circuit with multiple time calibration modes of the present invention.
[0025] Figure 6 The waveform diagram of the APC signal required for controlling the operation of the 2G RF power amplifier in an embodiment of the WCN chip data interaction circuit with multiple time calibration modes of the present invention.
[0026] In the diagram, 10 is the WCN chip data interaction circuit; 11 is the baseband chip module; 12 is the crystal module; 121 is the first connection terminal; 122 is the second connection terminal; 13 is the transceiver chip module; 14 is the radio frequency module; 141 is the first input terminal; 142 is the first output terminal; 143 is the second input terminal; 15 is the heating circuit module; 16 is the WCN chip module; 17 is the input circuit module; and 18 is the output circuit module. Detailed Implementation
[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0028] The directional terms mentioned in this invention, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom", are only for reference to the orientation of the accompanying drawings. The directional terms used are for the purpose of explaining and understanding this invention, and are not intended to limit this invention.
[0029] The terms "first" and "second" used in the terminology of this invention are for descriptive purposes only and should not be construed as indicating or implying relative importance, nor as limiting the order of events.
[0030] In the diagram, units with similar structures are represented by the same labels.
[0031] Please refer to Figure 1 This invention provides a WCN chip data interaction circuit with multiple time calibration modes. The WCN chip data interaction circuit 10 is applied in an electronic device and includes a baseband chip module 11, a crystal module 12, a transceiver chip module 13, an RF module 14, an output circuit module 18, an input circuit module 17, a heating circuit module 15, and a WCN chip module 16. The baseband chip module 11 outputs drive signals and trigger signals, and the crystal module 12 outputs a clock signal based on the drive signals.
[0032] Please refer to Figure 1 , Figure 2 and Figure 3Crystal module 12 includes a quartz crystal oscillator Y500, a first resistor R508, a first capacitor C520, and a second capacitor C519. Transceiver chip module 13 includes a transceiver chip U500-C, model MT6357. The quartz crystal oscillator Y500 includes a VCC pin, an OUT pin, a GND1 pin, and a GND2 pin. The transceiver chip U500-C includes AVDD18_AUXADC pin, AVSS18_AUXADC pin, and an AUXADC_VIN pin. Crystal module 12 also includes a first connection terminal 121 and a second connection terminal 122, both connected to the VCC pin. The AVDD18_AUXADC pin is connected to the first connection terminal 121. The AUXADC_VIN pin is connected to the second connection terminal 122. The transceiver chip U500-C includes an XTAL1 pin and an XTAL2 pin, with the XTAL2 pin connected to the OUT pin. The OUT pin is used to output the clock signal. The XTAL1 pin is connected to the GND1 pin, and the GND2 pin is connected to the AVSS18_AUXADC pin. One end of the first resistor R508 is connected to the VCC pin, and the other end of the first resistor R508 is connected to the AVSS18_AUXADC pin. The resistance of the first resistor R508 is 100KΩ. One end of the first capacitor C520 is connected to the VCC pin, and the other end of the first capacitor C520 is grounded. The capacitive reactance of the first capacitor is 100pF. One end of the second capacitor C519 is connected to the GND2 pin, and the other end of the second capacitor C519 is grounded. The capacitive reactance of the second capacitor is 100pF.
[0033] Please refer to Figure 1 and Figure 3 The transceiver chip module 13 is used to output a calibration signal based on a clock signal. The transceiver chip U500-C includes an output pin CS_P, which is used to output the calibration signal. One end of the output circuit module 18 is connected to the output pin CS_P, and the other end is connected to an external comprehensive test instrument. The output circuit module 18 can output the calibration signal to the external comprehensive test instrument. The output circuit module 18 includes a first current limiting unit, one end of which is connected to the output pin. The other end of the first current limiting unit is connected to the external comprehensive test instrument. A first current unit is used to limit the current of the calibration signal. The first current limiting unit includes a first current resistor and a second current limiting resistor, which are connected in series.
[0034] Please refer to Figure 1 and Figure 3The transceiver chip U500-C includes an input pin CS_N, which is used to input the result signal. One end of the input circuit module 17 is connected to the input pin CS_N, and the other end of the input circuit module 17 is connected to an external comprehensive test instrument. The input circuit module 17 can be used to output the result signal from the external comprehensive test instrument to the transceiver chip module 13. The input circuit module 17 includes a second current limiting unit, one end of which is connected to the input pin. The other end of the second current limiting unit is connected to the external comprehensive test instrument. The second current unit is used to limit the current of the result signal. The second current limiting unit includes a third current-limiting resistor and a fourth current-limiting resistor, which are connected in series.
[0035] Please refer to Figure 4 The heating circuit module 15 can heat the transceiver chip module 13 based on a trigger signal, thereby enabling the transceiver chip module 13 to output a calibration signal under a set temperature condition. The heating circuit module 15 includes a MOSFET Q1002 and a heating resistor R596. The gate of the MOSFET Q1002 is connected to the baseband chip module 11, and the gate of the MOSFET Q1002 is used to receive the trigger signal. The drain of the MOSFET Q1002 is connected to the power supply, and the source of the MOSFET Q1002 is grounded. The heating resistor R596 is connected between the power supply and the drain of the MOSFET Q1002, and is used to heat the transceiver chip module 13. The resistance of the heating resistor R596 is 9.5Ω-10.5Ω. The heating circuit module 15 also includes a second resistor R594 and a third resistor R595. The second resistor R594 is connected to the gate of the MOSFET Q1002, and the resistance of the second resistor R594 is 4.7kΩ. One end of the third resistor R595 is connected to the gate of the MOSFET Q1002, and the other end is grounded. The resistance of the third resistor R595 is 47kΩ. When the gate of the MOSFET Q1002 receives a trigger signal, the MOSFET turns on. This allows the power supply to power the heating resistor R596, causing it to heat up. Consequently, the heating circuit module 15 can heat the transceiver chip module 13.
[0036] Please refer to Figure 3The transceiver chip module 13 also includes a transceiver chip U500-C, model number MT6357. The transceiver chip U500-C includes a PWRKEY pin, an FCHR_ENB pin, and a UVLO_VTH pin. The transceiver chip module 13 includes a fourth resistor R589, a fifth resistor R511, a sixth resistor R503, and a first Zener diode D501. The fourth resistor R589 is connected to the PWRKEY pin, and the fifth resistor R511 is connected to the FCHR_ENB pin. The resistance values of both the fourth resistor R589 and the fifth resistor R511 are 1KΩ. The first Zener diode D501 is connected in parallel with the fourth resistor R589. One end of the sixth resistor R503 is connected to the UVLO_VTH pin, and the other end of the sixth resistor R503 is grounded.
[0037] Please refer to Figure 3 The transceiver chip U500-C includes VSYSSNS, BATSNS, and ISENSE pins. The transceiver chip module 13 includes a third capacitor C500, a fourth capacitor C501, a fifth capacitor C503, and a second Zener diode V501. One end of the third capacitor C500 is connected to the VSYSSNS pin, and the other end is grounded; the capacitive reactance of the third capacitor C500 is 1μF. One end of the fourth capacitor C501 is connected to the BATSNS pin, and the other end is grounded; the capacitive reactance of the fourth capacitor C501 is 100nF. One end of the fifth capacitor C503 is connected to the ISENSE pin, and the other end is grounded; the capacitive reactance of the fifth capacitor C503 is 100nF. The negative terminal of the second Zener diode V501 is connected to the VSYSSNS pin, and the positive terminal of the VSYSSNS pin is grounded.
[0038] Please refer to Figure 3 The transceiver chip U500-C includes a VCDT pin and a CHRLDO pin. Transceiver chip module 13 includes a seventh resistor R500, an eighth resistor R501, a ninth resistor R502, and a sixth capacitor C502. The seventh resistor R500 is connected to the VCDT pin. One end of the eighth resistor R501 is connected between the seventh resistor R500 and the VCDT pin, and the other end of the eighth resistor R501 is grounded. The resistance of the seventh resistor R500 is 330KΩ, and the resistance of the eighth resistor R501 is 39KΩ. The ninth resistor R502 is connected to the CHRLDO pin, and its resistance is 7.5KΩ. One end of the sixth capacitor C502 is connected to the CHRLDO pin, and the other end of the sixth capacitor C502 is grounded. The capacitive reactance of the sixth capacitor C502 is 1μF.
[0039] Please refer to Figure 3The transceiver chip U500-C includes a VRTC28 pin. Transceiver chip module 13 includes a tenth resistor R509, a seventh capacitor C504, an eighth capacitor C528, and a battery CAP501. The tenth resistor R509 is connected to the VRTC28 pin and has a resistance of 1KΩ. One end of the seventh capacitor C504 is connected between the tenth resistor R509 and the VRTC28 pin, and the other end of the seventh capacitor C504 is grounded. The capacitive reactance of the seventh capacitor C504 is 100nF. One end of the eighth capacitor C528 is connected to the tenth resistor R509, and the other end of the eighth capacitor C528 is grounded. The capacitive reactance of the eighth capacitor C528 is 47μF. The battery CAP501 is connected in parallel with the eighth capacitor C528.
[0040] Please refer to Figure 3 The transceiver chip U500-C includes the XO_SOC pin, XO_CEL pin, and XO_WCN pin. The XO_WCN pin is connected to the WCN chip module 16, and the XO_SOC pin is used to output the standard clock signal to the WCN chip module 16. The transceiver chip module 13 includes an eleventh resistor R504, a twelfth resistor R506, a thirteenth resistor R505, a ninth capacitor C507, a tenth capacitor C509, and an eleventh capacitor C510. The eleventh resistor R504 is connected to the XO_SOC pin, the twelfth resistor R506 is connected to the XO_CEL pin, and the thirteenth resistor R505 is connected to the XO_CEL pin. One end of the ninth capacitor C507 is connected to the ground, and the other end of the ninth capacitor C507 has a capacitive reactance of 22pF. One end of the tenth capacitor C509 is connected to the BATSNS pin, and the other end of the tenth capacitor C509 is grounded. The capacitive reactance of the tenth capacitor C509 is also 22pF. One end of the eleventh capacitor C510 is connected to the ISENSE pin, and the other end of the eleventh capacitor C510 is grounded. The capacitive reactance of the eleventh capacitor C510 is 22pF.
[0041] Please refer to Figure 3 The transceiver chip module 13 includes a fourteenth resistor R510, a twelfth capacitor C501, and a thirteenth capacitor C503. The fourteenth resistor R510 is connected to the AVDD18_AUXADC pin. One end of the twelfth capacitor C501 is connected to the AVDD18_AUXADC pin, and the other end is connected to the AVSS18_AUXADC pin. The capacitive reactance of the twelfth capacitor C501 is 100nF. One end of the thirteenth capacitor C503 is connected to the AVSS18_AUXADC pin, and the other end is connected to the AUXADC_VIN pin. The capacitive reactance of the thirteenth capacitor C503 is also 100nF.
[0042] Please refer to Figure 1 and Figure 5The RF module 14 transmits the calibration signal to an external test instrument. Furthermore, the RF module 14 transmits the result signal to the transceiver chip module 13. The RF module 14 can heat the transceiver chip module 13 based on a trigger signal, causing the transceiver chip module 13 to output a calibration signal under a set temperature condition. The external test instrument can detect the calibration signal, thereby generating a result signal. Based on the result signal output by the external test instrument, the transceiver chip module 13 can calibrate the clock signal, thereby generating a standard clock signal. The WCN chip module 16 receives the standard clock signal and can bidirectionally transmit data signals with the baseband chip module 11 based on this standard clock signal. The WCN chip module 16 is the chip module responsible for Bluetooth in the mobile phone. Therefore, the WCN chip data interaction circuit can perform automatic frequency calibration and Co-TMS calibration on the clock signal. Automatic frequency calibration refers to an automatic control method that maintains a definite relationship between the output signal frequency and a given frequency. In short, it involves synchronizing the mobile terminal's operating frequency with the external network to enable communication. The clock signal also needs to maintain good accuracy during temperature changes, requiring Co-TMS calibration. Co-TMS calibration works by heating the crystal to calibrate its temperature characteristics, calculating the relationship between the clock and temperature changes, and then storing the result in the phone's memory.
[0043] like Figure 6 As shown in the figure, this diagram illustrates the waveform of the APC signal required to control the operation of the 2G RF power amplifier. The rising edge of the APC signal triggers the heating circuit, and this process, combined with the calibration procedure, calibrates the temperature characteristic curve of the crystal. The APC signal is the signal requiring automatic frequency calibration, i.e., the calibration signal mentioned above. Because the WCN chip's data interaction circuit has the above-mentioned compatible circuit design, users can reasonably select the clock signal calibration path as needed to achieve the purpose of saving power consumption and cost.
[0044] Please refer to Figure 5The RF module 14 includes an RF chip U1405, which has a power supply pin VCC and a VBATT pin. The RF chip U1405 is model RF-PA-179250474. The WCN chip data interaction circuit 10 includes a power supply VBAT_RF. The power supply pin VCC is connected to the power supply VBAT_RF, which can supply power to the RF chip U1405 through the power supply pin VCC. The RF module 14 also includes a fourteenth capacitor C1433, a fifteenth capacitor C1434, and a sixteenth capacitor C1435. One end of the fourteenth capacitor C1433 is connected to the VBATT pin, and the other end is grounded. The capacitive reactance of the fourteenth capacitor C1433 is 1nF. The fifteenth capacitor C1434 and the sixteenth capacitor C1435 are both connected in parallel with the fourteenth capacitor C1433. The capacitive reactance of the fifteenth capacitor C1434 is 22μF, and the capacitive reactance of the sixteenth capacitor C1435 is 56pF.
[0045] Please refer to Figure 5 The RF chip U1405 includes HB_IN and LB_IN pins. The RF module 14 also includes a fifteenth resistor R1413, a sixteenth resistor R1414, a seventeenth capacitor C1437, an eighteenth capacitor C1438, and a nineteenth capacitor C1443. The fifteenth resistor R1413 is connected to the HB_IN pin, and the seventeenth capacitor C1437 is connected to the fifteenth resistor R1413. The sixteenth resistor R1414 is connected to the LB_IN pin, and the eighteenth capacitor C1438 is connected to the sixteenth resistor R1414. The RF module 14 also includes a first input terminal 141. One end of the nineteenth capacitor C1443 is connected to the first input terminal 141, and the other end of the nineteenth capacitor is also connected to the first input terminal 141. The first input terminal 141 is connected to the output pin CS_P, and the RF module 14 can input a calibration signal through the first input terminal 141. Furthermore, the capacitive reactance of the seventeenth capacitor C1437, the eighteenth capacitor C1438, and the nineteenth capacitor C1443 is 33pF.
[0046] Referring to Figure 5, the RF module 14 also includes a seventeenth resistor R1409, an eighteenth resistor R1410, a nineteenth resistor R1488, and a twentieth resistor R1489. The resistance values of all four resistors are 470Ω. One end of the seventeenth resistor R1409 is connected to the fifteenth resistor R1413, and the other end is grounded. One end of the eighteenth resistor R1410 is connected to the HB_IN pin, and the other end is grounded. One end of the nineteenth resistor R1488 is connected to the LB_IN pin, and the other end is grounded. One end of the twentieth resistor R1489 is connected to the sixteenth resistor R1414, and the other end of the seventeenth resistor R1409 is grounded.
[0047] Please refer to Figure 5 The RF chip U1405 includes a VRAMP pin and a VIO pin. The VRAMP pin is connected to the baseband chip module 11 and is used to receive trigger signals. When the VRAMP pin receives a trigger signal, the RF chip U1405 can heat the transceiver chip module 13. The RF module 14 also includes a 21st resistor R1415, a 20th capacitor C1439, and a 21st capacitor C1440. The 21st resistor R1415 is connected to the VRAMP pin and has a resistance of 6.81KΩ. One end of the 20th capacitor C1439 is connected between the 21st resistor R1415 and the VRAMP pin, and the other end of the 20th capacitor C1439 is grounded. The capacitive reactance of the 20th capacitor C1439 is 220pF. One end of the 21st capacitor C1440 is connected to the VIO pin, and the other end of the 21st capacitor C1440 is grounded. The capacitive reactance of the 21st capacitor C1440 is 100nF.
[0048] Please refer to Figure 5The RF chip U1405 includes an ANT pin. The RF module 14 also includes a twentieth capacitor C1444, a twenty-first capacitor C1445, a twenty-second capacitor C1446, and an inductor C1436. The RF module 14 also includes a first output terminal 142, through which the calibration signal can be output to an external test instrument. One end of the twentieth capacitor C1444 is connected to the ANT pin, and the other end is connected to the first output terminal 142; the capacitive reactance of the twentieth capacitor C1444 is 33pF. One end of the twenty-first capacitor C1445 is connected to the ANT pin, and the other end is grounded; the capacitive reactance of the twenty-first capacitor C1445 is 0.5pF. The inductor C1436 is connected to the ANT pin, and the inductive reactance of the inductor is 1nH. One end of the 22nd capacitor C1446 is connected to the inductor C1436, and the other end of the 22nd capacitor C1446 is grounded. The capacitive reactance of the 22nd capacitor C1446 is 0.5pF.
[0049] Please refer to Figure 5 The RF module 14 also includes a 23rd capacitor C1446, a 24th capacitor C1447, and a 22nd resistor R1401. The RF module 14 also includes a second input terminal 143, which is connected to an external test instrument. The RF module 14 can input result signals through this first input terminal 143. The 22nd resistor R1401 is connected to the ANT pin. One end of the 24th capacitor C1447 is connected to the 22nd resistor R1401. The other end of the 24th capacitor C1447 is connected to the second input terminal 143. The capacitive reactance of the 24th capacitor C1447 is 33pF. One end of the 23rd capacitor C1446 is connected between the 24th capacitor C1447 and the 22nd resistor R1401. The other end of the 23rd capacitor C1446 is grounded. The capacitive reactance of the 23rd capacitor C1446 is 33pF.
[0050] Please refer to Figure 5The RF module 14 also includes a 25th capacitor C1460, a 26th capacitor C1461, a 23rd resistor R1425, and a test unit T1401. This test unit includes an IN pin and an OUT pin. The IN pin is connected to an inductor C1436, and the OUT pin is connected to the 23rd resistor R1425. One end of the 25th capacitor C1460 is connected between the OUT pin and the 23rd resistor R1425, and the other end of the 25th capacitor C1460 is grounded. The capacitive reactance of the 25th capacitor C1460 is 0.5pF. One end of the 26th capacitor C1461 is connected to the 23rd resistor R1425, and the other end of the 26th capacitor C1461 is grounded. The capacitive reactance of the 26th capacitor C1461 is 0.5pF. The RF chip U1405 also includes an NC1 pin, which is used to output the result signal. The CS_N pin is connected to the NC1 pin and is used to input the result signal.
[0051] Please refer to Figure 5 The RF chip U1405 also includes a TRX1 pin, which is connected to the filter. The RF chip U1405 also includes a TRX3 pin, which is connected to the filter. The RF chip U1405 also includes a TRX4 pin, which is connected to the filter. The RF chip U1405 also includes a TRX5 pin, which is connected to the filter. The RF chip U1405 also includes a TRX6 pin, which is connected to the filter. The RF chip U1405 also includes a TRX7 pin, which is connected to the filter. The RF chip U1405 also includes a TRX8 pin, which is connected to the filter. The RF chip U1405 also includes a TRX9 pin, which is connected to the filter. The RF chip U1405 also includes a TRX10 pin, which is connected to the filter. The RF chip U1405 also includes a TRX11 pin, which is connected to the filter. The RF chip U1405 also includes a TRX12 pin, which is connected to a filter. The RF chip U1405 also includes a TRX13 pin, which is also connected to a filter.
[0052] Please refer to Figure 1When radio frequency (RF) communication is not required, the transceiver chip module 13, output circuit module 18, and input circuit module 17 form a first clock signal calibration path with the external comprehensive test instrument to transmit calibration and result signals. This first clock signal calibration path allows the transceiver chip module 13 to calibrate the clock signal. When RF communication is required, the transceiver chip module 13, RF module 14, and the comprehensive test instrument form a second clock signal calibration path to transmit calibration and result signals. During RF communication, the transceiver chip module 13, RF module 14, and the external comprehensive test instrument form a signal transmission path to transmit calibration and result signals, thereby calibrating the clock signal. Therefore, when RF communication is not required, the WCN chip data interaction circuit 10 does not need to use the RF module 14, reducing the overall power consumption of the WCN chip data interaction circuit 10.
[0053] Please refer to Figure 1 When the WCN chip data interaction circuit 10 is in its first operating state, the heating circuit module 15 heats the transceiver chip module 13, and the transceiver chip module 13 outputs a calibration signal under a set temperature condition. The output circuit module 18 outputs the calibration signal to an external comprehensive tester, which performs a detection operation on the calibration signal to generate a result signal. The input circuit module 17 outputs the result signal to the transceiver chip module 13, and the transceiver chip module 13 performs a calibration operation on the clock signal based on the result signal. This first operating state is a state where the WCN chip data interaction circuit 10 does not require radio frequency communication.
[0054] Please refer to Figure 1 When the WCN chip data interaction circuit 10 is in the second operating state, this second operating state is a state where radio frequency communication is not required. The radio frequency module 14 heats the transceiver chip module 13, and the transceiver chip module 13 outputs a calibration signal under a set temperature condition. The radio frequency module 14 modulates the calibration signal and transmits it to an external test instrument. The external test instrument demodulates the modulated calibration signal and performs a detection operation on the calibration signal to generate a result signal. The result signal is output to the transceiver chip module 13 through the radio frequency module 14, and the transceiver chip module 13 performs a calibration operation on the clock signal based on the result signal.
[0055] The second operating state is the state in which the WCN chip data interaction circuit 10 needs to perform radio frequency (RF) communication. The WCN chip data interaction circuit 10 provides multiple clock signal calibration paths, allowing the user to select the appropriate path to transmit calibration signals as needed. If RF communication is not required, the user does not need to use the RF module 14 and can use the first clock signal calibration path to calibrate the clock signal. This effectively saves power consumption of the WCN chip data interaction circuit 10. When RF communication is required, the user can also use the second clock signal calibration path to calibrate the clock signal. In the prior art, the WCN chip data interaction circuit 10 can only transmit signals through the RF module 14. Even when RF communication is not required, the user still needs to use the RF module 14, resulting in high overall power consumption for the existing WCN chip data interaction circuit 10. In the WCN chip data interaction circuit 10 of this invention, the user can select the appropriate clock signal calibration path based on whether RF communication is required, thus effectively reducing the overall power consumption of the WCN chip data interaction circuit 10. Simultaneously, calibrating the clock signal using the WCN chip data interaction circuit 10 is also more convenient for the user.
[0056] Please refer to Figure 1 When the WCN chip data interaction circuit 10 is in its third operating state, the transceiver chip module 13, the radio frequency module 14, and the external comprehensive tester form a third clock signal calibration path for transmitting calibration and result signals. The heating circuit module 15 is also used to heat the transceiver chip module 13, so that the transceiver chip module 13 outputs a calibration signal under a set temperature condition. Furthermore, the radio frequency module 14 can modulate the calibration signal, and the external comprehensive tester receives and demodulates the modulated calibration signal. The external comprehensive tester then performs a detection operation on the calibration signal, thereby generating a result signal. The result signal is output to the transceiver chip module 13 through the radio frequency module 14, and the transceiver chip module 13 performs a clock signal calibration operation based on the result signal.
[0057] In this embodiment, the heating circuit module 15 can first heat the transceiver chip module 13, and then the transceiver chip module 13 can output a calibration signal under the set temperature condition. Because when the WCN chip data interaction circuit 10 is in the second working state, it needs to heat the transceiver chip module entirely through the radio frequency module 14. However, heating the transceiver chip module 13 solely through the radio frequency module 14 would result in an excessively long heating operation time. In the third working state, the WCN chip data interaction circuit 10 uses the heating circuit module to heat the transceiver chip module 13, which is more efficient and allows the transceiver chip module 13 to output a calibration signal more quickly under the set temperature condition.
[0058] To further improve the heating efficiency of the transceiver chip module 13, the RF module 14 and the heating circuit module 15 can be used simultaneously to heat the transceiver chip module 13, allowing it to reach the set temperature more quickly. Compared to heating the transceiver chip module 13 only through the heating circuit module 15, the time required to heat the transceiver chip module 13 can be further reduced. Therefore, the simultaneous heating of the RF module 14 and the heating circuit module 15 can further improve the clock signal calibration efficiency.
[0059] In the event of a failure in either the input circuit module 17 or the output circuit module 18, the user can select a third clock signal calibration path to calibrate the clock signal. Therefore, even if either the input circuit module 17 or the output circuit module 18 fails, the WCN chip data interaction circuit 10 can maintain a stable operating state. This effectively improves the operating efficiency of the WCN chip data interaction circuit 10.
[0060] The working principle of this invention is as follows: When the WCN chip data interaction circuit 10 is working, the baseband chip module 11 outputs a drive signal and a trigger signal. Then, the crystal module 12 outputs a clock signal based on the drive signal, and the transceiver chip module 13 can output a calibration signal based on the clock signal. When the WCN chip data interaction circuit 10 is in the first working state, the transceiver chip module 13, the output circuit module 18, the input circuit module 17, and the external comprehensive tester form a first clock signal calibration path for transmitting calibration signals and result signals. Next, the heating circuit module 15 heats the transceiver chip module 13, so that the transceiver chip module 13 outputs a calibration signal under a set temperature condition. The output circuit module 18 outputs the calibration signal to the external comprehensive tester, which can perform a detection operation on the calibration signal, thereby generating a result signal. Subsequently, the input circuit module 17 outputs the result signal to the transceiver chip module 13. The transceiver chip module 13 performs a calibration operation on the clock signal based on the result signal, thereby generating a standard clock signal. Furthermore, the transceiver chip module 13 transmits the standard clock signal to the WCN chip module 16. Subsequently, the WCN chip module 16 transmits data signals bidirectionally with the baseband chip module 11 based on the standard clock signal.
[0061] When the WCN chip data interaction circuit 10 is in its second operating state, the transceiver chip module 13, the RF module 14, and the comprehensive tester form a second clock signal calibration path for transmitting calibration and result signals. First, the RF module 14 heats the transceiver chip module based on a trigger signal, allowing the transceiver chip module 13 to output a calibration signal under a set temperature condition. The RF module 14 then modulates the calibration signal and transmits it to the external comprehensive tester. The external comprehensive tester then demodulates the modulated calibration signal and performs a detection operation on the calibration signal, generating a result signal. This result signal is then output to the transceiver chip module 13 via the RF module 14, allowing the transceiver chip module 13 to calibrate the clock signal based on this result signal. This transceiver chip module 13 then generates a standard clock signal, which it transmits to the WCN chip module 16. Subsequently, the WCN chip module 16 transmits data signals bidirectionally with the baseband chip module 11 based on the standard clock signal.
[0062] When the WCN chip data interaction circuit 10 is in its third operating state, the transceiver chip module 13, the RF module 14, and the external test instrument form a third clock signal calibration path for transmitting calibration and result signals. First, the heating circuit module 15 heats the transceiver chip module 13, causing it to output a calibration signal at a set temperature. The RF module 14 then modulates the calibration signal. The external test instrument receives and demodulates the modulated calibration signal and performs detection on it, generating a result signal. This result signal is then output to the transceiver chip module 13 via the RF module 14, allowing the transceiver chip module 13 to calibrate the clock signal based on the result signal. This transceiver chip module 13 then generates a standard clock signal, which it transmits to the WCN chip module 16. Subsequently, the WCN chip module 16 transmits data signals bidirectionally with the baseband chip module 11 based on the standard clock signal.
[0063] This invention provides a WCN chip data interaction circuit with multiple time calibration modes. The baseband chip module outputs a drive signal and a trigger signal. The crystal module outputs a clock signal based on the drive signal, and the transceiver chip module outputs a calibration signal based on the clock signal. When RF communication is not required, the transceiver chip module, output circuit module, input circuit module, and external test instrument form a first clock signal calibration path for transmitting calibration and result signals. The heating circuit module heats the transceiver chip module based on the trigger signal, allowing the transceiver chip module to output a calibration signal under a set temperature condition. The output circuit module outputs this calibration signal to the external test instrument, which detects the calibration signal to generate a result signal. The input circuit module outputs the result signal to the transceiver chip module, thus enabling the transceiver chip module to perform clock signal calibration under a set temperature condition.
[0064] When radio frequency (RF) communication is required, the transceiver chip module, RF module, and test instrument form a second clock signal calibration path for transmitting calibration and result signals. The RF module heats the transceiver chip module based on a trigger signal, allowing it to output a calibration signal under a set temperature condition. The RF module transmits the calibration signal to the external test instrument, and can also transmit the result signal from the test instrument back to the transceiver chip module, thus enabling it to calibrate the clock signal under the set temperature condition. Furthermore, after calibrating the clock signal, the transceiver chip module generates a standard clock signal, which the WCN chip module uses for bidirectional data signal transmission with the baseband chip module.
[0065] The WCN chip data interaction circuit features a design compatible with the above-mentioned circuits. When RF communication is not required, the WCN chip data interaction circuit can calibrate the clock signal through a first clock signal calibration path. When RF communication is required, the WCN chip data interaction circuit can calibrate the clock signal through a second clock signal calibration path. Therefore, users can choose the appropriate clock signal calibration path as needed to save power consumption and cost. Moreover, when RF communication is not required, the WCN chip data interaction circuit does not need to use an RF module, thus reducing the overall power consumption of the WCN chip data interaction circuit. This effectively solves the technical problem of high overall power consumption in existing WCN chip data interaction circuits.
[0066] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the above preferred embodiments are not intended to limit the present invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the claims.
Claims
1. A WCN chip data interaction circuit, characterized in that, It includes: The baseband chip module is used to output drive signals and trigger signals; A crystal module is used to output a clock signal based on the drive signal; The transceiver chip module is used to output a calibration signal based on the clock signal, and to perform calibration operations on the clock signal based on the result signal output by the external comprehensive test instrument, so as to generate a standard clock signal. The radio frequency module is used to transmit the calibration signal to an external comprehensive tester and the result signal to the transceiver chip module. The radio frequency module is used to heat the transceiver chip module based on the trigger signal, so that the transceiver chip module outputs the calibration signal under a set temperature condition. The output circuit module is connected at one end to the transceiver chip module and at the other end to an external comprehensive test instrument. It is used to output the calibration signal to the external comprehensive test instrument, which is used to perform a detection operation on the calibration signal to generate the result signal. The input circuit module is connected at one end to the transceiver chip module and at the other end to an external comprehensive tester, and is used to output the result signal to the transceiver chip module. The WCN chip module is used to receive the standard clock signal, and the WCN chip module transmits data signals bidirectionally with the baseband chip module based on the standard clock signal. When radio frequency communication is not required, the transceiver chip module, the output circuit module, the input circuit module, and the external comprehensive test instrument form a first clock signal calibration path for transmitting the calibration signal and the result signal. When radio frequency communication is required, the transceiver chip module, the radio frequency module, and the comprehensive test instrument form a second clock signal calibration path for transmitting the calibration signal and the result signal.
2. The WCN chip data interaction circuit according to claim 1, characterized in that, When the WCN chip data interaction circuit is in a state where radio frequency communication is not required, the radio frequency module heats the transceiver chip module. Under a set temperature condition, the transceiver chip module outputs the calibration signal. The radio frequency module modulates the calibration signal and transmits it to an external test instrument. The external test instrument demodulates the modulated calibration signal and performs a detection operation on the calibration signal to generate a result signal. The result signal is output to the transceiver chip module through the radio frequency module. The transceiver chip module then performs a calibration operation on the clock signal based on the result signal.
3. The WCN chip data interaction circuit according to claim 1, characterized in that, The transceiver chip module includes a transceiver chip, which includes an output pin for outputting a calibration signal. The output circuit module includes a first current limiting unit, one end of which is connected to the output pin, and the other end of which is connected to an external comprehensive test instrument. The first current limiting unit is used to limit the current of the calibration signal.
4. The WCN chip data interaction circuit according to claim 3, characterized in that, The transceiver chip includes an input pin for inputting a result signal. The input circuit module includes a second current limiting unit, one end of which is connected to the input pin and the other end of which is connected to an external comprehensive tester. The second current limiting unit is used to limit the current of the result signal.
5. The WCN chip data interaction circuit according to claim 4, characterized in that, The first current limiting unit includes a first current limiting resistor and a second current limiting resistor, which are connected in series; the second current limiting unit includes a third current limiting resistor and a fourth current limiting resistor, which are connected in series.
6. The WCN chip data interaction circuit according to claim 3, characterized in that, The transceiver chip is model MT6357.
Citation Information
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