An automated edge sealing device for semiconductor thermoelectric chips

Abstract

This invention relates to the field of semiconductor technology, and in particular to an automated edge-sealing device for semiconductor thermoelectric chips. Addressing the current practice of manually wrapping semiconductor chips, which is labor-intensive and inefficient, this invention provides an automated edge-sealing device for semiconductor thermoelectric chips. The device includes an operating table with a movable I-beam support on its front upper side. A clamping and calibration mechanism, comprising multiple clamping pins, is located on the inner wall of the table. When the I-beam supports move backward, the clamping pins move upward and then inward to clamp and fix the semiconductor chip. When the I-beam supports continue to move backward, the table moves backward and upward simultaneously, moving the semiconductor chip to the center of the drive ring. This device can perform edge-sealing on semiconductor chips, replacing manual operation, increasing efficiency, reducing labor costs, and lowering overall costs.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to an automated edge sealing device for semiconductor thermoelectric chips. Background Technology

[0002] A thermoelectric semiconductor chip is a device that converts heat energy into electrical energy. It utilizes the thermoelectric effect, generating a voltage difference through a temperature difference, thereby achieving energy conversion and utilization. Thermoelectric semiconductor chips have advantages such as small size, light weight, and high reliability, making them significant in certain application areas. The working principle of a thermoelectric semiconductor chip is based on the Seebeck effect. The Seebeck effect refers to the potential difference generated when there is a temperature difference at the contact point of two different materials. Thermoelectric semiconductor chips utilize the properties of semiconductor materials; through the PN junction formed at the contact point of P-type and N-type semiconductors, electrons diffuse under the influence of the temperature difference, thus creating a potential difference. After forming the PN junction, the connection point of the thermoelectric semiconductor chip needs to be sealed to prevent moisture and humidity. Currently, edge sealing of thermoelectric semiconductor chips is done manually by winding the edges, a process that is labor-intensive and inefficient. Therefore, an automated edge sealing device for thermoelectric semiconductor chips is designed to solve the aforementioned problems. Summary of the Invention

[0003] This invention addresses the current practice of manually wrapping semiconductor thermoelectric chips during edge sealing, a process that is labor-intensive and inefficient. It provides an automated edge sealing device for semiconductor thermoelectric chips, capable of performing edge sealing on these chips. This device replaces manual operation, is highly efficient, reduces labor costs, and effectively solves the problems mentioned in the background section.

[0004] The technical solution adopted by the present invention to solve the above problems is as follows: An automated edge-sealing device for semiconductor thermoelectric chips includes an operating table. A movable I-beam is provided on the front upper side of the operating table. A support platform is provided on the upper end of the I-beam, on which a semiconductor thermoelectric chip is placed. A clamping and calibration mechanism is provided on the inner wall of the support platform, comprising multiple clamping pins. When the I-beam moves backward, the clamping pins move upward and then close inward to clamp and fix the semiconductor thermoelectric chip. An adhesive applicator is provided on the rear upper side of the operating table for edge-sealing the semiconductor thermoelectric chip. The adhesive applicator includes a drive ring. When the I-beam continues to move backward, the support platform moves backward and upward simultaneously, causing the semiconductor thermoelectric chip to move to the center of the drive ring.

[0005] The upper surface of the operating platform is fixedly connected to the left and right sides of the first guide rails respectively, and the I-beam is slidably connected to the upper surface of the two first guide rails respectively; the upper surface of the I-beam is fixedly connected to the front and rear ends of the left and right sides of the upper surface of the I-beam respectively, and the support is fixedly connected to the upper surface of the four telescopic rods.

[0006] The upper surface of the operating platform is fixedly connected to the left and right ends of the rear side of the platform. The output end of the first motor is fixedly connected to the long threaded rod. The outer surface of the long threaded rod is threadedly connected to the threaded seat that is slidably connected to the operating platform. The upper surface of the threaded seat is fixedly connected to the vertical plate. The inner wall of the vertical plate is slidably connected to the first slider. The inner wall of the first slider is fixedly connected to the long sliding pin. The lower surface of the platform is fixedly connected to the left and right sides of the platform. The long sliding pin is fixedly connected to the corresponding connecting plate. The upper surface of the operating platform is also fixedly connected to the left and right sides of the platform. The inner wall of the first track frame is provided with a first track groove that mates with the corresponding long sliding pin.

[0007] The lower end of the support platform is provided with a rotatable first disk. Four evenly distributed first connecting rods are hinged to the non-center part of the lower surface of the first disk. The outer ends of the first connecting rods are respectively hinged to connecting rods that are slidably connected to the support platform. First guide rods are fixed to the inner walls on both sides of the connecting rods. Multiple square sleeves are slidably connected to the inner walls of the outer periphery of the support platform. Square sliding rods are slidably connected to the inner walls of the square sleeves. The square sliding rods are respectively sleeved on the corresponding first guide rods. The clamping pins are respectively fixed to the upper surface of the corresponding square sliding rods. Short sliding pins are fixed to the lower side of the two end faces of the square sliding rods. Multiple second track frames are fixed to the lower surface of the support platform. Second track grooves that cooperate with the corresponding short sliding pins are opened on the second track frames.

[0008] A worm gear is coaxially fixed to the lower end of the first disk, a worm is meshed on the outer surface of the worm gear, and a first spur gear is fixed to the left and right ends of the outer surface of the worm. A spur rack that meshes with the corresponding first spur gear is fixed to the left and right sides of the upper surface of the operating table.

[0009] A suction cup is fixed to the inner wall of the middle part of the support platform. A suction tube is fixed to the lower surface of the suction cup. A piston plate is slidably connected to the inner wall of the suction tube. A piston rod is fixed to the lower surface of the piston plate. The bottom end of the piston rod is fixed to the I-beam base.

[0010] The adhesive applicator also includes multiple support columns fixed to the operating table. A first ring is fixed to the inner end face of the multiple support columns. The drive ring is rotatably connected to the first ring. A second motor is also fixed to the rear side of the upper surface of the operating table. A drive spur gear is fixed to the output end of the second motor. A gear ring that meshes with the drive spur gear is fixed to the outer surface of the drive ring.

[0011] The upper surface of the drive ring is rotatably connected to a wire feeding shaft, and a film roll is sleeved on the outer surface of the wire feeding shaft. The upper surface of the drive ring is also hinged to a swingable arc-shaped connecting rod, and the upper surface of the arc-shaped connecting rod is rotatably connected to a first wire roller, a second wire roller, and a third wire roller. The arc-shaped connecting rod is also equipped with a movable extrusion roller, and the film roll is wound on the outer surface of the corresponding first wire roller, second wire roller, third wire roller, and extrusion roller.

[0012] The inner wall of the drive ring is provided with a long keyway, and a first sliding pin is slidably connected to the inner wall of the long keyway. A telescopic connecting rod is rotatably connected to the upper end of the outer surface of the first sliding pin. The other end of the telescopic connecting rod is hinged to the arc-shaped connecting rod. The upper surface of the first ring is provided with an annular protrusion that mates with the first sliding pin. The telescopic connecting rod includes an inner connecting rod and an outer connecting rod. The inner connecting rod is slidably connected to the inner wall of the outer connecting rod. A spring that mates with the inner connecting rod is fixed to the inner wall of the bottom end of the outer connecting rod. A U-shaped seat is fixed to the upper surface of the arc-shaped connecting rod. The extrusion roller is rotatably connected to the inner wall of the U-shaped seat.

[0013] The upper end of the drive ring is provided with a second ring that is fixedly connected to the support column. A cutter is also slidably connected to the upper surface of the drive ring. A second sliding pin is fixedly connected to the upper surface of the cutter. A circular groove that cooperates with the second sliding pin is opened on the lower surface of the second ring.

[0014] The present invention has a novel and ingenious structure, and has the following advantages compared with the prior art: In use, the PN junction thermoelectric chip to be sealed is placed onto the tray. Starting the first motor causes the tray and thermoelectric chip to move synchronously with the I-beam. A clamping and calibration mechanism is activated when the I-beam, tray, and thermoelectric chip move backward. This mechanism causes multiple clamping pins to move upward and then inward, calibrating and fixing the lower end of the thermoelectric chip. Normally, the clamping pins are located on the inner wall of the tray, preventing collisions between the thermoelectric chip and the clamping pins during placement. Starting the second motor... The device enables the drive ring to rotate, and through the installed adhesive applicator, it can seal the outer periphery of the semiconductor thermoelectric chip while the drive ring is rotating, thus giving the semiconductor moisture-proof and humidity-proof functions. As the I-beam continues to move backward, it forms a support platform that moves backward and upward simultaneously, moving the semiconductor thermoelectric chip to the center of the drive ring, where it is easy to apply adhesive for sealing. This equipment can seal the semiconductor thermoelectric chip, replacing manual operation, and is highly efficient, reducing the need for manpower and lowering costs. Attached Figure Description

[0015] Figure 1 This is an isometric view of an automated edge-sealing device for semiconductor thermoelectric chips according to the present invention.

[0016] Figure 2This is a schematic diagram of the support platform installation for an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0017] Figure 3 This is a schematic diagram of the installation of a long threaded rod in an automated edge-sealing device for semiconductor thermoelectric chips according to the present invention.

[0018] Figure 4 This is a schematic diagram of the installation of the first track frame of an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0019] Figure 5 This is a schematic diagram of the I-beam mounting of an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0020] Figure 6 This is a schematic diagram of the straight toothed rack installation of an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0021] Figure 7 This is a schematic diagram of the worm gear installation in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0022] Figure 8 This is a schematic diagram of the first disc installation in an automated edge-sealing device for semiconductor thermoelectric chips according to the present invention.

[0023] Figure 9 This is a schematic diagram of the suction cup installation in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0024] Figure 10 This is a cross-sectional view of the suction tube of an automated edge-sealing device for semiconductor thermoelectric chips according to the present invention.

[0025] Figure 11 This is a schematic diagram of the square sleeve installation of an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0026] Figure 12 This is a schematic diagram of the installation of a square slide bar in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0027] Figure 13 This is a schematic diagram of the toothed ring installation in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0028] Figure 14 This is a schematic diagram of the installation of the drive ring in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0029] Figure 15 This is a schematic diagram of the arc-shaped connecting rod installation of an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0030] Figure 16This is a cross-sectional view of the external connecting rod of an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0031] Figure 17 This is a schematic diagram of the cutter installation in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0032] Figure 18 This is a schematic diagram of the installation of the first sliding pin in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0033] Figure 19 This is a schematic diagram of the installation of the second sliding pin in an automated edge sealing device for semiconductor thermoelectric chips according to the present invention.

[0034] Numbering in the diagram: 1-Operating table, 2-Support column, 3-First motor, 4-Long threaded rod, 5-Threaded seat, 6-Upright plate, 7-First slider, 8-Long sliding pin, 9-First track frame, 10-Connecting plate, 11-Long horizontal groove, 12-Long inclined groove, 13-First guide rail, 14-I-beam seat, 15-Straight rack, 16-First spur gear, 17-Worm, 18-Worm wheel, 19-First disc, 20-First connecting rod, 21-Connecting rod, 22-Second guide rail, 23-Square sleeve, 24-Square slide rod, 25-First guide rod, 26-Clamping pin, 27-Short sliding pin, 28-Second track frame, 29-Short inclined groove, 30-Short horizontal groove, 31-Support platform, 32-Suction cup, 33-Piston Plate, 34-Piston rod, 35-Sticker, 36-Second motor, 37-Drive spur gear, 38-Gear ring, 39-Transmission cylinder, 40-Second ring, 41-First ring, 42-Drive ring, 43-Payout shaft, 44-Film roll, 45-Arc-shaped connecting rod, 46-First wire roller, 47-Second wire roller, 48-Third wire roller, 49-U-shaped seat, 50-Spring, 51-Inner connecting rod, 52-Extrusion roller, 53-Telescopic connecting rod, 54-First sliding pin, 55-Long keyway, 56-Inner ring groove, 57-Convex diameter changing groove, 58-Cutter, 59-Second sliding pin, 60-Outer ring groove, 61-Concave diameter changing groove, 62-Telescopic rod, 63-Semiconductor thermoelectric chip, 64-Outer connecting rod. Detailed Implementation

[0035] The following are specific embodiments of the present invention, and the technical solutions of the present invention will be further described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0036] like Figure 1-19As shown, the present invention provides an automated edge sealing device for semiconductor thermoelectric chips, including an operating table 1. The upper front side of the operating table 1 is provided with a movable I-beam base 14. The upper end of the I-beam base 14 is provided with a support platform 31. A semiconductor thermoelectric chip 63 is placed on the support platform 31. The inner wall of the support platform 31 is provided with a clamping and calibration mechanism, which includes multiple clamping pins 26. When the I-beam base 14 moves backward, it can form a structure in which the clamping pins 26 move upward and then close inward to clamp and fix the semiconductor thermoelectric chip 63. The upper rear side of the operating table 1 is provided with an adhesive applicator for edge sealing the semiconductor thermoelectric chip 63. The adhesive applicator includes a drive ring 42. When the I-beam base 14 continues to move backward, it can form a structure in which the support platform 31 moves backward and upward at the same time, causing the semiconductor thermoelectric chip 63 to move to the center position of the drive ring 42.

[0037] like Figure 1-5 As shown in Figures 12 and 13, the operating table 1 supports the entire device, facilitating its movement or fixation in a designated position. By placing the PN junction thermoelectric chip 63 to be sealed onto the support 31, and by providing a movable I-beam 14, the support 31 and the thermoelectric chip 63 can move synchronously with the I-beam 14. Through the clamping and calibration mechanism, when the I-beam 14, the support 31, and the thermoelectric chip 63 move backward, the clamping and calibration mechanism operates, causing the corresponding multiple clamping pins 26 to move upward and then inward, calibrating and fixing the lower end of the thermoelectric chip 63. Under normal conditions, the clamping pins 26 are located on the inner wall of the support 31, preventing the chip from being placed... When the semiconductor thermoelectric chip 63 collides with the clamping pin 26, the drive ring 42 can rotate. Through the provided adhesive applicator, the outer periphery of the semiconductor thermoelectric chip 63 can be sealed with adhesive while the drive ring 42 rotates, giving the semiconductor moisture-proof and humidity-proof functions. As the I-beam 14 continues to move backward, it forms a support platform 31 that moves backward and upward simultaneously, moving the semiconductor thermoelectric chip 63 to the center position of the drive ring 42. At this point, it is convenient to apply adhesive to seal the semiconductor thermoelectric chip 63. This equipment can seal the semiconductor thermoelectric chip 63, replacing manual operation, and is highly efficient, reducing the need for manpower and lowering costs.

[0038] The upper surface of the operating table 1 is fixedly connected to the left and right sides of the first guide rails 13 respectively, and the I-beam base 14 is slidably connected to the upper surface of the two first guide rails 13 respectively; the upper surface of the I-beam base 14 is fixedly connected to the front and rear ends of the left and right sides of the upper surface ...

[0039] like Figure 5As shown, the I-beam base 14 can be slidably connected to the inner wall of the first guide rail 13, which supports and limits the I-beam base 14. The telescopic rod 62 supports and limits the support platform 31, so that the support platform 31 can only move up and down on the I-beam base 14. Furthermore, with the connection of the telescopic rod 62, the I-beam base 14 can drive the support platform 31 to move back and forth when it moves back and forth. The telescopic rod 62 is existing technology and will not be described in detail here.

[0040] The upper surface of the operating table 1 is fixedly connected to the left and right ends of the rear side of the upper surface. The output end of the first motor 3 is fixedly connected to the long threaded rod 4. The outer surface of the long threaded rod 4 is threadedly connected to the threaded seat 5 which is slidably connected to the operating table 1. The upper surface of the threaded seat 5 is fixedly connected to the vertical plate 6. The inner wall of the vertical plate 6 is slidably connected to the first slider 7. The inner wall of the first slider 7 is fixedly connected to the long sliding pin 8. The lower surface of the support 31 is fixedly connected to the left and right sides of the lower surface of the support 31. The long sliding pin 8 is fixedly connected to the corresponding connecting plate 10. The upper surface of the operating table 1 is also fixedly connected to the left and right sides of the upper surface of the operating table 1. The inner wall of the first track frame 9 is provided with the first track groove that cooperates with the corresponding long sliding pin 8.

[0041] like Figure 3-4 As shown, the first motor 3 provides rotational power to the long threaded rod 4. A bearing seat is rotatably connected to the front end of the outer surface of the long threaded rod 4. The bottom ends of the bearing seats are fixed to the upper surface of the operating table 1. The bearing seats limit the rotation of the long threaded rod 4. The threaded seat 5 is slidably connected to the upper surface of the operating table 1. The first slider 7 is slidably connected to the inner wall of the vertical plate 6. The first track frame 9, the first track groove, and the long sliding pin 8 are installed and shaped as follows: Figure 4As shown, the connecting plate 10 is used to support the long sliding pin 8, so that the long sliding pin 8 is fixedly connected to the support platform 31. The first track groove includes a long horizontal groove 11 and a long inclined groove 12. When the long sliding pin 8 is engaged with the long horizontal groove 11, the height of the long sliding pin 8 will not change when the support platform 31 moves backward, that is, the height of the corresponding support platform 31 will not change. When the long sliding pin 8 is engaged with the long inclined groove 12, the support platform 31 moves backward, causing the long sliding pin 8 and the support platform 31 to move backward and upward at the same time. When the first motor 3 is started, it can drive the corresponding long threaded rod 4. When the long threaded rod 4 rotates, it will move backward through the threaded connection with the threaded seat 5. When the threaded seat 5 moves backward, it will drive the vertical plate 6, the first slider 7, the long sliding pin 8, and the connecting plate 6. Plate 10, telescopic rod 62, support platform 31, I-beam seat 14, etc. move backward synchronously. When the long sliding pin 8 engages with the long transverse groove 11 and moves backward, the corresponding support platform 31 will only move backward and not upward. When the long sliding pin 8 moves backward and engages with the long inclined groove 12, the long sliding pin 8 will move backward and upward at the same time through engagement with the long inclined groove 12. When the long sliding pin 8 moves upward, it will drive the corresponding support platform 31 to move upward, thereby moving the support platform 31 to the designated position. When the first motor 3 is started to reverse the long threaded rod 4, it can be reset to the initial state. Furthermore, under the threaded connection between the long threaded rod 4 and the threaded seat 5, it has a self-locking function. When the long threaded rod 4 does not rotate, it can limit and fix the corresponding threaded seat 5, support platform 31, etc.

[0042] The lower end of the support platform 31 is provided with a rotatable first disk 19. Four evenly distributed first connecting rods 20 are hinged to the non-center part of the lower surface of the first disk 19. The outer ends of the first connecting rods 20 are respectively hinged to connecting rods 21 that are slidably connected to the support platform 31. The inner walls on both sides of the connecting rods 21 are respectively fixed to first guide rods 25. Multiple square sleeves 23 are slidably connected to the inner walls of the outer periphery of the support platform 31. Square sliding rods 24 are slidably connected to the inner walls of the square sleeves 23. The square sliding rods 24 are respectively sleeved on the corresponding first guide rods 25. The clamping pins 26 are respectively fixed to the upper surface of the corresponding square sliding rods 24. Short sliding pins 27 are respectively fixed to the lower side of the two end faces of the square sliding rods. Multiple second track frames 28 are respectively fixed to the lower surface of the support platform 31. The second track frames 28 are respectively provided with second track grooves that cooperate with the corresponding short sliding pins 27.

[0043] like Figure 7-12 As shown, multiple second guide cabinets are also fixedly connected to the lower surface of the support platform 31. Connecting rods 21 are slidably connected to the lower surfaces of the corresponding two second guide rails 22. The limiting connecting rods 21 can only move inwards or outwards, which is equivalent to the connecting rods 21 being slidably connected to the lower surface of the support platform 31. The clamping pins 26, short sliding pins 27, square sleeves 23, square sliding rods 24, first guide rods 25, and second track frames 28 are installed and shaped as follows: Figure 11-12As shown, the square sleeve 23 can slide back and forth or left and right on the inner wall of the support platform 31, and the square slide rod 24 can move up and down on the inner wall of the square sleeve 23. By limiting the clamping pin 26 through the square slide rod 24 and the square sleeve 23, the clamping pin 26 can only move up and down or left and right. The square slide rod 24 is sleeved on the outer surface of the corresponding first guide rod 25. The square slide rod 24 can move up and down on the outer surface of the first guide rod 25, and when the first guide rod 25 moves left and right or back and forth, it can drive the corresponding square slide rod 24 to move left and right or back and forth. The second track groove includes two sections: a short horizontal groove 30 and a short inclined groove 29. When the short sliding pin 27 engages in the inner wall of the short inclined groove 29, the short sliding pin 27 moves inward and drives the corresponding square slide rod 24 to move. The block and clamping pin 26 move upward, causing the clamping pin 26 to move upward to the upper end face of the support platform 31. When the short sliding pin 27 moves on the inner wall of the short transverse groove 30, it will only drive the clamping pin 26 to move inward and no longer move upward. When the first disc 19 rotates, the hinge with the first connecting rod 20 will cause the inner end of the first connecting rod 20 to rotate circumferentially, and the outer end will drive the corresponding connecting rod 21 to move inward. The inward movement of the connecting rod 21 will drive the first guide rod 25, square sliding rod 24, short sliding pin 27, square sleeve 23, and clamping pin 26 to move inward. When the short sliding pin 27 moves inward, it will engage with the short inclined groove 29, causing the square sliding rod 24 and clamping pin 26 to move inward. As the clamping pin 26 moves upward while its inner side moves, it moves to the upper end face of the support platform 31. When the short sliding pin 27 moves inward and ends engagement with the short inclined groove 29 and enters the inner wall of the short transverse groove 30, the short sliding pin 27 stops moving upward. This means that the corresponding square sliding rod 24 and clamping pin 26 also stop moving upward. At this point, the clamping pin 26 will only continue to move inward. When the clamping pin 26 moves inward and contacts the semiconductor thermoelectric chip 63, it will drive the semiconductor thermoelectric chip 63 to move towards the center, thereby performing precise calibration of the semiconductor thermoelectric chip 63. Furthermore, the outer surface of the clamping pin 26 is a cylindrical curved surface, resulting in a small contact area with the semiconductor thermoelectric chip 63. When the semiconductor thermoelectric chip 63 is moved towards the center for calibration, friction can be reduced, thus better protecting the semiconductor thermoelectric chip 63. Two clamping pins 26 are provided in each direction of the support platform 31, that is, in the four directions of the semiconductor thermoelectric chip 63 (front, back, left, and right). After the clamping pins 26 move inward to the bottom position, they can clamp and fix the semiconductor thermoelectric chip 63. Thus, the semiconductor thermoelectric chip 63 is centered and fixed after calibration by means of the clamping pins 26. When the first disk 19 rotates in the opposite direction, the clamping pins 26 can be moved outward and lower to reset, so that the clamping pins 26 move into the support platform 31. At this time, it is convenient to put the semiconductor thermoelectric chip 63 onto the support platform 31. The principle is the same and will not be described again.

[0044] A worm gear 18 is coaxially fixed to the lower end of the first disk 19. A worm 17 meshes with the outer surface of the worm gear 18. A first spur gear 16 is fixed to the left and right ends of the outer surface of the worm 17. A spur rack 15 that meshes with the corresponding first spur gear 16 is fixed to the left and right sides of the upper surface of the operating table 1.

[0045] like Figure 6-7 As shown, bearing seats are rotatably connected to the left and right ends of the outer surface of the worm 17, and the bottom ends of the bearing seats are fixed to the lower end surface of the support 31, limiting the worm 17 to rotate only at the lower end of the support 31. Through the meshing of the first spur gear 16 and the rack 15, the support 31 can drive the corresponding worm wheel 18, worm 17, and first spur gear 16 to move when it moves. When the first spur gear 16 moves, it will drive the corresponding first spur gear 16 to rotate through meshing with the rack 15. The rotation of the first spur gear 16 will drive the corresponding worm 17 to rotate. The rotation of the worm 17 will cause the worm wheel 18 and the first disc 19 to rotate synchronously through meshing with the worm wheel 18. When the first disc 19 rotates, it will cause the corresponding clamping... Pin 26 moves inward or outward to clamp or release the semiconductor thermoelectric chip 63. When the support 31 moves backward and upward at the same time, it drives the first spur gear 16 to move upward and backward at the same time. When the first spur gear 16 moves upward, it will disengage from the rack 15. At this time, the corresponding clamping pin 26 moves to the designated position to completely clamp and fix the semiconductor thermoelectric chip 63. Furthermore, it has a self-locking function under the meshing of the worm gear 18 and the worm 17. That is, when the first spur gear 16 and the worm 17 do not rotate, the corresponding positions of the worm gear 18, the first disk 19, and the clamping pin 26 are fixed. At this time, the clamping pin 26 can stably clamp and fix the semiconductor thermoelectric chip 63.

[0046] A suction cup 32 is fixedly connected to the inner wall of the middle part of the support platform 31. A suction tube 35 is fixedly connected to the lower surface of the suction cup 32. A piston plate 33 is slidably connected to the inner wall of the suction tube 35. A piston rod 34 is fixedly connected to the lower surface of the piston plate 33. The bottom end of the piston rod 34 is fixedly connected to the I-beam base 14.

[0047] like Figure 9-10As shown, a transmission cylinder 39 is fixedly connected to the inner wall of the center of the worm gear 18 and the first disk 19. The transmission cylinder 39 is rotatably connected to the outer surface of the suction tube 35, which is equivalent to the first disk 19 being coaxially fixed to the worm gear 18. When the semiconductor thermoelectric chip 63 is placed on the upper surface of the support 31 and the suction cup 32, when the piston plate 33 moves downward, it can generate a negative pressure state at the upper end of the suction cup 32. At this time, the suction cup 32 can adsorb and fix the semiconductor thermoelectric chip 63, which can further strengthen the semiconductor thermoelectric chip 63, fix the upper and lower coordinates of the semiconductor thermoelectric chip 63, prevent it from moving during sealing, and improve the sealing accuracy. By fixing the bottom of the piston rod 34 to the I-beam 14, when the support 31 moves horizontally backward, the corresponding I-beam 14 will also move horizontally backward. At this time, the clamping pin 26 will move inward under the rotation of the first spur gear 16 to the semiconductor thermoelectric chip. After the chip 63 is calibrated in the front-back or left-right direction, it is clamped and fixed. After the clamping pin 26 clamps and fixes the semiconductor thermoelectric chip 63, the corresponding support 31 will move backward and upward at the same time. At this time, the I-beam 14 will continue to move backward with the support 31, but will not move upward. When the support 31 moves upward, it will drive the corresponding suction cup 32, suction tube 35, etc. to move upward synchronously. At this time, the piston rod 34 and piston plate 33 will not move upward under the limit of the I-beam 14. Therefore, the piston plate 33 moves downward relative to the suction tube 35. That is, at this time, the upper end of the suction cup 32 is in a negative pressure state, which is to adsorb and fix the semiconductor thermoelectric chip 63. When the support 31 and I-beam 14 move forward to reset, that is, when the corresponding suction cup 32 and suction tube 35 move downward to reset, the semiconductor thermoelectric chip 63 can be released and no longer adsorbed and fixed. It can be used repeatedly.

[0048] The adhesive applicator also includes multiple support columns 2 fixedly connected to the operating table 1. A first ring 41 is fixedly connected to the inner end face of the multiple support columns 2. The drive ring 42 is rotatably connected to the first ring 41. A second motor 36 is also fixedly connected to the rear side of the upper surface of the operating table 1. A drive spur gear 37 is fixedly connected to the output end of the second motor 36. A gear ring 38 that meshes with the drive spur gear 37 is fixedly connected to the outer surface of the drive ring 42.

[0049] like Figure 13-14 As shown, the support column 2 is used to support the first ring 41, the drive ring 42, etc. The function of the second motor 36 is to indirectly provide rotational power to the drive ring 42. The drive ring 42 is rotatably connected to the upper surface of the first ring 41, limiting the drive ring 42 to only rotate. When the second motor 36 is started, it can drive the corresponding active spur gear 37 to rotate. The rotation of the active spur gear 37, through meshing with the gear ring 38, will cause the gear ring 38 and the drive ring 42 to rotate. When the drive ring 42 rotates, it can make the adhesive applicator work.

[0050] The upper surface of the drive ring 42 is rotatably connected to a wire feeding shaft 43. A film roll 44 is sleeved on the outer surface of the wire feeding shaft 43. The upper surface of the drive ring 42 is also hinged to a swingable arc-shaped connecting rod 45. The upper surface of the arc-shaped connecting rod 45 is rotatably connected to a first wire roller 46, a second wire roller 47, and a third wire roller 48. A movable extrusion roller 52 is also provided on the arc-shaped connecting rod 45. The film roll 44 is wound on the outer surfaces of the corresponding first wire roller 46, second wire roller 47, third wire roller 48, and extrusion roller 52.

[0051] like Figure 14-15 As shown, the pay-off shaft 43 is used to limit and fix the film roll 44. A detachable pressure cap is provided at the upper end of the pay-off shaft 43. The pressure cap can be removed for easy replacement of the film roll 44. The pressure cap is installed on the pay-off shaft 43 by thread or interference fit, and can compress and limit the film roll 44 to prevent it from detaching from the pay-off shaft 43. The winding method of the first roller 46, the second roller 47, the third roller 48, and the compression roller 52 with the film roll 44 is as follows: Figure 15 As shown, when the semiconductor thermoelectric chip 63 reaches the designated position, that is, the center of the drive ring 42, the swingable arc-shaped connecting rod 45 swings forward, allowing the extrusion roller 52 to contact the outer end face of the semiconductor, that is, the edge to be sealed. When the drive ring 42 rotates, the extrusion roller 52 extrudes the outer end face of the semiconductor thermoelectric chip 63, allowing the film roll 44 to be attached to the outer surface of the semiconductor thermoelectric chip 63, thereby sealing the edge of the semiconductor thermoelectric chip 63. Furthermore, the chip of the extrusion roller 52 can move, and can be changed at any time according to the position of the outer end face of the semiconductor thermoelectric chip 63 when the drive ring 42 and the extrusion roller 52 rotate in a circle, thereby uniformly applying adhesive to the outer periphery of the semiconductor thermoelectric chip 63.

[0052] The inner wall of the drive ring 42 is provided with a long keyway 55, and a first sliding pin 54 is slidably connected to the inner wall of the long keyway 55. A telescopic connecting rod 53 is rotatably connected to the upper end of the outer surface of the first sliding pin 54. The other end of the telescopic connecting rod 53 is hinged to the arc-shaped connecting rod 45. The upper surface of the first ring 41 is provided with an annular protrusion that cooperates with the first sliding pin 54. The telescopic connecting rod 53 includes an inner connecting rod 51 and an outer connecting rod 64. The inner connecting rod 51 is slidably connected to the inner wall of the outer connecting rod 64. A spring 50 that cooperates with the inner connecting rod 51 is fixedly connected to the inner wall of the bottom end of the outer connecting rod 64. A U-shaped seat 49 is fixedly connected to the upper surface of the arc-shaped connecting rod 45. The extrusion roller 52 is rotatably connected to the inner wall of the U-shaped seat 49.

[0053] like Figure 15-18 As shown, the first sliding pin 54 can slide back and forth on the inner wall of the long keyway 55, as... Figure 17As shown, when the first sliding pin 54 moves back and forth on the inner wall of the long keyway 55, it can drive one end of the telescopic connecting rod 53 to move back and forth, and the other end of the telescopic connecting rod 53 will drive the corresponding arc-shaped connecting rod 45 to swing inward or outward; the installation and shape of the first sliding pin 54, the first ring 41, and the ring protrusion are as follows Figure 18 As shown, the annular groove includes a variable diameter groove 57 and an inner annular groove 56. When the first sliding pin 54 rotates circumferentially and engages with the variable diameter groove 57, the corresponding first sliding pin 54 will reciprocate back and forth for one cycle. When the first sliding pin 54 reciprocates back and forth, it will drive the corresponding arc-shaped connecting rod 45 to swing inward or move outward. When the first sliding pin 54 rotates circumferentially and engages with the inner annular groove 56, the arc-shaped connecting rod 45 can swing inward to a designated position and then intermittently stop for a period of time, thereby allowing the extrusion roller 52 to contact the semiconductor thermoelectric chip 63 for stable adhesive application. The inner connecting rod 51, outer connecting rod 64, and spring 50 are installed and shaped as follows... Figure 16As shown, the inner connecting rod 51 can slide back and forth on the inner wall of the outer connecting rod 64, and the spring 50 always has a backward driving force on the inner connecting rod 51, so that the telescopic connecting rod 53 is in its longest state under normal conditions.When the drive ring 42 rotates, it drives the corresponding first sliding pin 54, telescopic connecting rod 53, arc-shaped connecting rod 45, film roll 44, and pressing roller 52 to rotate synchronously. When the first sliding pin 54 rotates, it moves forward due to engagement with the convex diameter groove 57. This forward movement of the first sliding pin 54 drives the corresponding telescopic connecting rod 53 to move forward. The forward movement of the telescopic connecting rod 53 then drives the corresponding arc-shaped connecting rod 45 and pressing roller 52 to swing forward synchronously. When the pressing roller 52 swings forward to contact the outer end face of the semiconductor thermoelectric chip 63, the corresponding first sliding pin 54 continues to move forward, compressing the spring 50 and shortening the telescopic connecting rod 53. After the first sliding pin 54 enters the inner wall of the inner annular groove 56, it will cause the corresponding arc-shaped connecting rod 45 to flip to the innermost position, that is, the corresponding pressing roller 52 will press and contact the outer end face of the semiconductor thermoelectric chip 63, so that the film roll 44 is attached to the outer surface of the semiconductor. When the drive ring 42, the first sliding pin 54, the arc-shaped connecting rod 45, the film roll 44, and the pressing roller 52 continue to rotate, since the first sliding pin 54 no longer moves inward under the engagement with the inner annular groove 56, the corresponding pressing roller 52 will continuously change position under the contact with the outer surface of the semiconductor thermoelectric chip 63. When the pressing roller 52 continuously changes position, it will drive the arc-shaped connecting rod 45 to swing. The swing of the arc-shaped connecting rod 45 will drive the corresponding The telescopic link 53 continuously extends or shortens. Since the inner link 51 of the telescopic link 53 is hinged to the first sliding pin 54, and the position of the first sliding pin 54 is relatively stationary relative to the drive ring 42, when the arc-shaped link 45 swings, it will drive the corresponding outer link 64 to slide on the outer surface of the inner link 51, that is, continuously compress or extend the spring 50. By setting the action of the spring 50, that is, the telescopic link 53 is in its longest state under normal conditions, which can make the corresponding extrusion roller 52 always contact the outer surface of the semiconductor thermoelectric chip 63 for rolling movement, so that the film 44 adheres to the outer surface of the semiconductor thermoelectric chip 63 for sealing. When the drive ring 42, the first sliding pin 54, the arc-shaped link 45, etc. rotate to When the first sliding pin 54 re-encounters the end of the convex diameter groove 57, the first sliding pin 54, under the engagement of the convex diameter groove 57, will move backward, that is, move outward. Driven by the telescopic connecting rod 53, the arc-shaped connecting rod 45 will swing outward. When the arc-shaped connecting rod 45 swings outward, the corresponding pressing roller 52 will swing outward towards the semiconductor thermoelectric chip 63. At this time, one rotation applies adhesive to the outer periphery of the semiconductor thermoelectric chip 63, and then stops. That is, one working cycle is completed. At this time, the corresponding arc-shaped connecting rod 45, the first sliding pin 54, the pressing roller 52, etc. are in the outermost, initial state, which facilitates the removal or re-entry of the semiconductor thermoelectric chip 63.

[0054] The upper end of the drive ring 42 is provided with a second ring 40 that is fixedly connected to the support column 2. A cutter 58 is also slidably connected to the upper surface of the drive ring 42. A second sliding pin 59 is fixedly connected to the upper surface of the cutter 58. A circular groove that cooperates with the second sliding pin 59 is opened on the lower surface of the second ring 40.

[0055] like Figure 18-19 As shown, the cutter 58 can slide inward or outward on the upper surface of the drive ring 42. The annular groove includes a concave variable diameter groove 61 and an outer annular groove 60, as shown. Figure 19 As shown, when the second sliding pin 59 engages with the concave diameter groove 61, the corresponding second sliding pin 59 will move inward and then outward. When the second sliding pin 59 engages with the outer annular groove 60, the position of the second sliding pin 59 relative to the drive ring 42 will not change, that is, the cutter 58 is stationary relative to the drive ring 42. Under normal conditions, i.e., when the second sliding pin 59 is engaged with the outer annular groove 60, the cutter 58 is at a distance of [missing information - likely related to distance from the semiconductor thermoelectric chip 63]. A certain distance does not affect the loading or unloading of the semiconductor thermoelectric chip 63; when the drive ring 42 rotates, that is, when the corresponding arc-shaped connecting rod 45 swings inward to apply adhesive to the edge of the semiconductor thermoelectric chip 63, the rotation of the drive ring 42 will drive the cutter 58 and the second sliding pin 59 to rotate circumferentially. When the second sliding pin 59 rotates circumferentially, it will first engage with the outer annular groove 60. Under the engagement of the second sliding pin 59 and the outer annular groove 60, the corresponding second sliding pin 59 and the cutter 58 will start to move. The drive ring 42 remains stationary and always keeps away from the thermoelectric chip 63, never contacting it. When the drive ring 42 rotates to nearly one revolution, that is, after the adhesive applicator completes the adhesive sealing of the thermoelectric chip 63, the second sliding pin 59 moves into the inner wall of the concave diameter groove 61. Under the engagement of the concave diameter groove 61 and the second sliding pin 59, the cutter 58 moves inward. When the second sliding pin 59 moves to the bottom of the concave diameter groove 61, the cutter 58 contacts the outer end face of the thermoelectric chip 63. Under the pressure of the cutter 58, the film roll 44 is cut. At this time, the drive ring 42 continues to rotate a short distance, and under the engagement of the concave diameter groove 61 and the second sliding pin 59, the cutter 58 moves outward to reset, that is, keeping away from the thermoelectric chip 63. At this time, the edge sealing, adhesive application and cutting of the thermoelectric chip 63 are completed, forming a cycle that can be cyclically processed.

[0056] In use, the present invention involves placing the PN junction thermoelectric chip 63 to be sealed onto the support platform 31. Activating the first motor 3 causes the support platform 31 and the thermoelectric chip 63 to move synchronously with the I-beam 14. A clamping and calibration mechanism is provided; when the I-beam 14, support platform 31, and thermoelectric chip 63 move backward, the clamping and calibration mechanism operates, causing multiple clamping pins 26 to move upward and then inward, calibrating and fixing the lower end of the thermoelectric chip 63. The clamping pins 26 are normally located on the inner wall of the support platform 31, preventing collisions between the thermoelectric chip 63 and the clamping pins 26 during placement. Activating the first motor 3... The second motor 36 enables the drive ring 42 to rotate. Through the attached adhesive device, the outer periphery of the semiconductor thermoelectric chip 63 is sealed with adhesive while the drive ring 42 rotates, providing moisture-proof and humidity-resistant properties. As the I-beam 14 continues to move backward, it forms a support platform 31 that moves backward and upward simultaneously, moving the semiconductor thermoelectric chip 63 to the center of the drive ring 42. This facilitates the application of adhesive to seal the semiconductor thermoelectric chip 63. This equipment can seal the semiconductor thermoelectric chip 63, replacing manual operation, increasing efficiency, reducing manpower requirements, and lowering costs.

[0057] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to replace them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. An automated edge-sealing device for semiconductor thermoelectric chips, comprising an operating table (1), characterized in that: The upper front side of the operating table (1) is provided with an I-shaped base (14) that can move back and forth. The upper end of the I-shaped base (14) is provided with a support platform (31). A semiconductor thermoelectric chip (63) is placed on the support platform (31). The inner wall of the support platform (31) is provided with a clamping calibration mechanism, which includes multiple clamping pins (26). When the I-shaped base (14) moves backward, it forms a structure in which the clamping pins (26) move upward and then close inward to clamp and fix the semiconductor thermoelectric chip (63). The upper rear side of the operating table (1) is provided with an adhesive applicator for sealing the edge of the semiconductor thermoelectric chip (63). The adhesive applicator includes a drive ring (42). When the I-shaped base (14) continues to move backward, it forms a structure in which the support platform (31) moves backward and upward at the same time, causing the semiconductor thermoelectric chip (63) to move to the center position of the drive ring (42). The lower end of the support platform (31) is provided with a rotatable first disk (19). Four evenly distributed first connecting rods (20) are hinged to the non-center part of the lower surface of the first disk (19). The outer ends of the first connecting rods (20) are respectively hinged to connecting rods (21) that are slidably connected to the support platform (31). The inner walls on both sides of the connecting rods (21) are respectively fixed with first guide rods (25). Multiple square sleeves (23) are slidably connected to the inner walls of the outer periphery of the support platform (31). The inner walls of the square sleeves (23) are respectively... Square slide rods (24) are slidably connected to each other, and the square slide rods (24) are respectively sleeved on the corresponding first guide rods (25). The clamping pins (26) are respectively fixed to the upper surface of the corresponding square slide rods (24). Short slide pins (27) are respectively fixed to the lower side of the two end faces of the square slide rods (24). Multiple second track frames (28) are respectively fixed to the lower surface of the support platform (31). The second track frames (28) are respectively provided with second track grooves that cooperate with the corresponding short slide pins (27). The lower end of the first disk (19) is coaxially fixed with a worm gear (18), and a worm (17) meshes on the outer surface of the worm gear (18). The left and right ends of the outer surface of the worm (17) are respectively fixed with a first spur gear (16). The left and right sides of the upper surface of the operating table (1) are respectively fixed with a spur rack (15) that meshes with the corresponding first spur gear (16).

2. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 1, characterized in that: The upper surface of the operating table (1) is fixed with first guide rails (13) on the left and right sides respectively, and the I-beam base (14) is slidably connected to the upper surface of the two first guide rails (13); the upper surface of the I-beam base (14) is fixed with telescopic rods (62) on the left and right sides and the front and rear ends respectively, and the support platform (31) is fixed to the upper surface of the four telescopic rods (62).

3. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 1, characterized in that: The upper surface of the operating table (1) is fixed with a first motor (3) on the left and right sides of the rear side. The output end of the first motor (3) is fixed with a long threaded rod (4). The outer surface of the long threaded rod (4) is threaded with a threaded seat (5) that is slidably connected to the operating table (1). The upper surface of the threaded seat (5) is fixed with a vertical plate (6). The inner wall of the vertical plate (6) is slidably connected with a first slider (7). The inner wall of the first slider (7) is fixed with a long sliding pin (8). The lower surface of the support (31) is fixed with a connecting plate (10) on the left and right sides. The long sliding pin (8) is fixed on the corresponding connecting plate (10). The upper surface of the operating table (1) is also fixed with a first track frame (9). The inner wall of the first track frame (9) is provided with a first track groove that cooperates with the corresponding long sliding pin (8).

4. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 1, characterized in that: A suction cup (32) is fixedly connected to the inner wall of the middle part of the support (31). A suction tube (35) is fixedly connected to the lower surface of the suction cup (32). A piston plate (33) is slidably connected to the inner wall of the suction tube (35). A piston rod (34) is fixedly connected to the lower surface of the piston plate (33). The bottom end of the piston rod (34) is fixedly connected to the I-beam (14).

5. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 1, characterized in that: The adhesive applicator also includes multiple support columns (2) fixed to the operating table (1). A first ring (41) is fixed to the inner end face of the multiple support columns (2). The drive ring (42) is rotatably connected to the first ring (41). A second motor (36) is also fixed to the rear side of the upper surface of the operating table (1). A drive spur gear (37) is fixed to the output end of the second motor (36). A gear ring (38) meshing with the drive spur gear (37) is fixed to the outer surface of the drive ring (42).

6. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 5, characterized in that: The upper surface of the drive ring (42) is rotatably connected to the wire feeding shaft (43), and the outer surface of the wire feeding shaft (43) is fitted with a film roll (44). The upper surface of the drive ring (42) is also hinged to a swingable arc-shaped connecting rod (45). The upper surface of the arc-shaped connecting rod (45) is rotatably connected to the first wire roller (46), the second wire roller (47), and the third wire roller (48). The arc-shaped connecting rod (45) is also provided with a movable extrusion roller (52). The film roll (44) is wound on the outer surface of the corresponding first wire roller (46), second wire roller (47), third wire roller (48), and extrusion roller (52).

7. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 6, characterized in that: The inner wall of the drive ring (42) is provided with a long keyway (55), and the inner wall of the long keyway (55) is slidably connected with a first sliding pin (54). The upper end of the outer surface of the first sliding pin (54) is rotatably connected with a telescopic connecting rod (53). The other end of the telescopic connecting rod (53) is hinged to the arc-shaped connecting rod (45). The upper surface of the first ring (41) is provided with an annular protrusion that cooperates with the first sliding pin (54). The telescopic connecting rod (53) includes an inner connecting rod (51) and an outer connecting rod (64). The inner connecting rod (51) is slidably connected to the inner wall of the outer connecting rod (64). The inner wall of the bottom end of the outer connecting rod (64) is fixedly connected with a spring (50) that cooperates with the inner connecting rod (51). The upper surface of the arc-shaped connecting rod (45) is fixedly connected with a U-shaped seat (49). The extrusion roller (52) is rotatably connected to the inner wall of the U-shaped seat (49).

8. The automated edge-sealing equipment for semiconductor thermoelectric chips as described in claim 5, characterized in that: The upper end of the drive ring (42) is provided with a second ring (40) fixedly connected to the support column (2). The upper surface of the drive ring (42) is also slidably connected with a cutter (58). The upper surface of the cutter (58) is fixedly connected with a second sliding pin (59). The lower surface of the second ring (40) is provided with a circular groove that cooperates with the second sliding pin (59).

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