Offset measurement device and method of operation thereof

Abstract

An operation method of a shift measurement device includes: setting a first object to be measured between a first conductive pad and a second conductive pad, wherein two ends of an active region of the first object to be measured are electrically connected to a connecting region of the first conductive pad and a connecting region of the second conductive pad respectively, and the first object to be measured has a photoresist region covering a part of the active region, a first contact point electrically connected to the connecting region of the first conductive pad, and a second contact point electrically connected to the connecting region of the second conductive pad; providing a constant current through the active region of the first object to be measured via the first and second contact points; measuring a first resistance value of the first object to be measured on the first and second conductive pads; and determining a shift of the photoresist region of the first object to be measured according to the first resistance value and a predetermined resistance value of the first object to be measured. The shift measurement device can be applied to the first object to be measured with a surface having a height variation, and can increase the application scenarios of the shift measurement device and improve the operation sensitivity thereof.

Description

Technical Field

[0001] This invention relates to an operation method for an offset measurement device. Background Technology

[0002] Generally, offset measurement devices typically use an overlay box approach to measure the offset of the object under test. For example, the reference layer of the offset measurement device can surround the object under test. Furthermore, the device can calculate the distances between the reference layer and the object under test in a first direction (e.g., the x-direction) and a second direction (e.g., the y-direction) to determine if the object has shifted. However, this configuration limits the reference layer to a square design, which is disadvantageous when the reference layer is applied to objects with varying surface heights. Additionally, when the surface of the object under test has height variations, using the offset measurement device to determine if the object has shifted will introduce errors, reducing the device's operational sensitivity. Summary of the Invention

[0003] One technical aspect of the present invention is an operating method for an offset measurement device.

[0004] According to an embodiment of the present invention, an operation method of an offset measurement device includes: placing a first object under test (AUT) between a first conductive pad and a second conductive pad, wherein the two ends of the active region of the AUT are electrically connected to the connection region of the first conductive pad and the connection region of the second conductive pad, respectively, and the AUT has a photoresist region covering a portion of the active region, a first contact point electrically connected to the connection region of the first conductive pad, and a second contact point electrically connected to the connection region of the second conductive pad; providing a constant current through the active region of the AUT via the first contact point and the second contact point; measuring a first resistance value of the AUT on the first conductive pad and the second conductive pad; and determining the offset of the photoresist region of the AUT based on the first resistance value and a predetermined resistance value of the AUT.

[0005] In one embodiment of the present invention, the method further includes: placing a second test object between a second conductive pad and a third conductive pad, wherein the two ends of the active region of the second test object are electrically connected to the connection region of the second conductive pad and the connection region of the third conductive pad, respectively, and the second test object has a photoresist region covering a portion of the active region, a third contact point electrically connected to the connection region of the second conductive pad, and a fourth contact point electrically connected to the connection region of the third conductive pad.

[0006] In one embodiment of the present invention, the line connecting the first contact point and the second contact point is perpendicular to the line connecting the third contact point and the fourth contact point.

[0007] In one embodiment of the present invention, the method further includes: passing a constant current through the second test object via the third contact point and the fourth contact point; and measuring a second resistance value of the second test object on the second conductive pad and the third conductive pad.

[0008] In one embodiment of the present invention, the above method further includes: determining the offset of the photoresist region of the second test object based on the second resistance value and the predetermined resistance value of the second test object.

[0009] Another technical embodiment of the present invention is an offset measurement device.

[0010] According to an embodiment of the present invention, an offset measurement device includes a first conductive pad, a second conductive pad, a power supply, and a measurement unit. The first conductive pad has a connection area. The second conductive pad has a connection area. The connection areas of the first and second conductive pads are configured to electrically connect to the two ends of the active region of a first object under test (AUT). The AUT has a photoresist region covering a portion of the active region, a first contact point electrically connected to the connection area of ​​the first conductive pad, and a second contact point electrically connected to the connection area of ​​the second conductive pad. The power supply is electrically connected to the first and second conductive pads. The power supply is configured to provide a constant current through the AUT via the first and second contact points. The measurement unit is electrically connected to the power supply. The measurement unit is configured to measure a first resistance value of the AUT and determine the offset of the photoresist region of the AUT based on the first resistance value and a predetermined resistance value of the AUT.

[0011] In one embodiment of the present invention, the offset measuring device further includes a third conductive pad. The third conductive pad has a connection area and is electrically connected to a power supply. A second conductive pad is located between the first conductive pad and the third conductive pad.

[0012] In one embodiment of the present invention, the connection area of ​​the second conductive pad and the connection area of ​​the third conductive pad are configured to electrically connect the two ends of the active area of ​​the second test object. The second test object has a photoresist area covering a portion of the active area, a third contact point electrically connected to the connection area of ​​the second conductive pad, and a fourth contact point electrically connected to the connection area of ​​the third conductive pad.

[0013] In one embodiment of the present invention, the above-mentioned measurement unit is further configured to measure the second resistance value of the second test object, and to determine the offset of the photoresist region of the second test object based on the second resistance value and the predetermined resistance value of the second test object.

[0014] In one embodiment of the present invention, the line connecting the first contact point and the second contact point is perpendicular to the line connecting the third contact point and the fourth contact point.

[0015] In the above embodiments of the present invention, since the offset measuring device determines whether the photoresist region of the first test object has shifted by comparing the first resistance value of the first test object with a predetermined resistance value (that is, the offset measuring device determines whether the photoresist region of the first test object has shifted by measuring resistance), the offset measuring device can be applied to the first test object with a surface height variation, which can increase the probability of using the offset measuring device and improve its operational sensitivity. Furthermore, when the offset measuring device determines that the photoresist region of the first test object has shifted, it can record the shift data and transmit the data back to the front-end operator to facilitate the adjustment or maintenance of the process equipment. Attached Figure Description

[0016] An embodiment of the invention is best understood by reading in conjunction with the accompanying drawings and by the following detailed description. It should be emphasized that, according to standard industry practice, the various features are not drawn to scale and are for illustrative purposes only. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of explanation.

[0017] Figure 1 A block diagram of an offset measuring device according to an embodiment of the present invention is shown.

[0018] Figure 2 A schematic diagram illustrating the use of an offset measurement device according to an embodiment of the present invention is shown.

[0019] Figure 3 A schematic diagram illustrating the use of an offset measurement device according to another embodiment of the present invention is shown.

[0020] Figure 4 A flowchart illustrating the operation method of an offset measurement device according to an embodiment of the present invention is shown. Detailed Implementation

[0021] The following description of embodiments provides many different implementations, or examples, of various features for achieving the provided objectives. Specific examples of elements and arrangements are described below to simplify the subject matter. Of course, these examples are merely illustrative and are not intended to be limiting. Furthermore, element symbols and / or letters may be repeated in various examples. This repetition is for simplicity and clarity and does not, in itself, specify the relationship between the various embodiments and / or configurations discussed.

[0022] Spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for descriptive purposes to describe the relationship between one element or feature and another, as shown in the accompanying drawings. Spatial relative terms are intended to cover different orientations of the apparatus in use or operation other than those shown in the accompanying drawings. The apparatus may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein shall be interpreted accordingly.

[0023] Figure 1 A block diagram illustrating an offset measurement device 100 according to an embodiment of the present invention is shown. Figure 2 A schematic diagram illustrating the use of the offset measurement device 100 according to an embodiment of the present invention is shown. (See also...) Figure 1 and Figure 2 The offset measurement device 100 includes a first conductive pad 110, a second conductive pad 120, a power supply 140, and a measurement unit 150. The first conductive pad 110 of the offset measurement device 100 has a connection area 112. The second conductive pad 120 of the offset measurement device 100 has a connection area 122. The connection areas 112 of the first conductive pad 110 and 122 of the second conductive pad 120 are configured to electrically connect the two ends of the active area 210 of the first test object 200. Furthermore, the first test object 200 has a photoresist area 220 covering a portion of the active area 210, a first contact point 212 electrically connected to the connection area 112 of the first conductive pad 110, and a second contact point 214 electrically connected to the connection area 122 of the second conductive pad 120. For example, the photoresist area 220 of the first test object 200 may be symmetrically arranged on the active area 210, but is not limited thereto.

[0024] The power supply 140 of the offset measurement device 100 is electrically connected to the first conductive pad 110 and the second conductive pad 120. The power supply 140 is configured to provide a constant current through the first test object 200 via the first contact point 212 and the second contact point 214 of the first test object 200. The measurement unit 150 of the offset measurement device 100 is electrically connected to the power supply 140. The measurement unit 150 is configured to measure a first resistance value of the first test object 200 and determine the offset of the photoresist region 220 of the first test object 200 based on the first resistance value and a predetermined resistance value of the first test object 200.

[0025] In detail, the active region 210 of the first device under test (DUT) 200 not covered by the photoresist region 220 can undergo an injection process, making the active region 210 not covered by the photoresist region 220 conductive, while the active region 210 covered by the photoresist region 220 will not conduct electricity. Furthermore, the power supply 140 can provide a constant current by inserting probes into the first conductive pad 110 and the second conductive pad 120, and this constant current can pass through the first DUT 200 via the first contact point 212 and the second contact point 214. When the constant current passes through the first DUT 200, the active region 210 covered by the photoresist region 220 will generate resistance. Multiple resistors can be connected in series to give the first DUT 200 a first resistance value. The measurement unit 150 can measure the voltage of the first DUT 200 based on the constant current provided by the power supply 140, and obtain the first resistance value of the first DUT 200 based on the constant current value and the voltage value of the first DUT 200. After obtaining the first resistance value of the first test object 200, the measurement unit 150 can compare the first resistance value with the predetermined resistance value of the first test object 200. When the measurement unit 150 determines that the first resistance value is the same as the predetermined resistance value, it can be known that the photoresist area 220 of the first test object 200 has not shifted. When the measurement unit 150 determines that the first resistance value is different from the predetermined resistance value, it can be known that the photoresist area 220 of the first test object 200 has shifted. The measurement unit 150 can send the shift data back to the front-end operator, so that the operator can adjust the parameters of the photoresist area 220 covering the active area 210 (such as position and direction correction) on the relevant process equipment, or maintain / replace the machine parts that caused the shift of the photoresist area 220.

[0026] Specifically, the offset measurement device 100 can determine whether the photoresist region 220 of the first test object 200 has shifted by comparing the first resistance value of the first test object 200 with a predetermined resistance value. When the offset measurement device 100 determines that the photoresist region 220 of the first test object 200 has shifted, it can record the shift data and send the data back to the front-end operator. In addition, since the offset measurement device 100 uses the method of comparing the first resistance value of the first test object 200 with a predetermined resistance value to determine whether the photoresist region 220 of the first test object 200 has shifted (that is, the offset measurement device 100 uses the method of measuring resistance to determine whether the photoresist region 220 of the first test object 200 has shifted), the offset measurement device 100 can be applied to the first test object 200 with a surface height variation, which can increase the usage probability of the offset measurement device 100 and improve its operational sensitivity.

[0027] In some embodiments, the offset measurement device 100 further includes a third conductive pad 130. The third conductive pad 130 has a connection area 132 and is electrically connected to a power supply 140. Furthermore, a second conductive pad 120 is located between the first conductive pad 110 and the third conductive pad 130. The connection area 122 of the second conductive pad 120 and the connection area 132 of the third conductive pad 130 are configured to electrically connect the two ends of the active region 310 of the second test object 300. The second test object 300 has a photoresist region 320 covering a portion of the active region 310, a third contact point 312 electrically connected to the connection area 122 of the second conductive pad 120, and a fourth contact point 314 electrically connected to the connection area 132 of the third conductive pad 130.

[0028] In some embodiments, the measurement unit 150 is further configured to measure the second resistance value of the second test object 300, and determine the offset of the photoresist region 320 of the second test object 300 based on the second resistance value and a predetermined resistance value of the second test object 300. Specifically, the arrangement of the first conductive pad 110 and the second conductive pad 120 can detect the offset of the photoresist region 220 of the first test object 200 in the vertical direction (e.g., the y-direction), and the arrangement of the second conductive pad 120 and the third conductive pad 130 can detect the offset of the photoresist region 320 of the second test object 300 in the horizontal direction (e.g., the x-direction). Furthermore, the line direction D1 connecting the first contact point 212 and the second contact point 214 of the first test object 200 is perpendicular to the line direction D2 connecting the third contact point 312 and the fourth contact point 314 of the second test object 300. In some embodiments, the first test object 200 may be detected between the first conductive pad 110 and the second conductive pad 120 and then moved to be detected between the second conductive pad 120 and the third conductive pad 130 to ensure that the offset in the x and y directions is within specifications.

[0029] The component connections and materials already described will not be repeated here; they will be stated separately. Other forms of offset measurement equipment will be described in the following description.

[0030] Figure 3 A schematic diagram illustrating the use of the offset measuring device 100a according to another embodiment of the present invention is shown. (See also...) Figure 1 and Figure 3 , Figure 3 The implementation methods shown are the same as Figure 2The difference in the illustrated implementation is that the first test object 200a has multiple active regions 210a, and the second test object 300a has multiple active regions 310a. The first test object 200a has a photoresist region 220a covering a portion of the active regions 210a, a first contact point 212a electrically connected to a connection region 112 of the first conductive pad 110, and a second contact point 214a electrically connected to a connection region 122 of the second conductive pad 120. The second test object 300a has a photoresist region 320a covering a portion of the active regions 310a, a third contact point 312a electrically connected to a connection region 122 of the second conductive pad 120, and a fourth contact point 314a electrically connected to a connection region 132 of the third conductive pad 130.

[0031] When the power supply 140 provides a constant current through the first device under test 200a, the active region 210a covered by the photoresist region 220a will generate resistance. Multiple resistors can be connected in parallel to give the first device under test 200a a smaller first resistance value, thus improving the sensitivity of the measurement unit 150 in comparing the first resistance value with a predetermined resistance value. Similarly, when the power supply 140 provides a constant current through the second device under test 300a, the active region 310a covered by the photoresist region 320a will generate resistance. Multiple resistors can be connected in parallel to give the second device under test 300a a smaller second resistance value, thus improving the sensitivity of the measurement unit 150 in comparing the second resistance value with a predetermined resistance value.

[0032] The following description will explain how to operate the offset measurement equipment.

[0033] Figure 4 A flowchart illustrating an operation method of an offset measurement device according to an embodiment of the present invention is shown. The operation method of the offset measurement device includes the following steps. First, in step S1, a first object to be tested is placed between a first conductive pad and a second conductive pad, wherein the two ends of the active region of the first object to be tested are electrically connected to the connection region of the first conductive pad and the connection region of the second conductive pad, respectively, and the first object to be tested has a photoresist region covering a portion of the active region, a first contact point electrically connected to the connection region of the first conductive pad, and a second contact point electrically connected to the connection region of the second conductive pad. Next, in step S2, a constant current is provided through the active region of the first object to be tested via the first contact point and the second contact point. Next, in step S3, a first resistance value of the first object to be tested is measured on the first conductive pad and the second conductive pad. Then, in step S4, the offset of the photoresist region of the first object to be tested is determined based on the first resistance value and a predetermined resistance value of the first object to be tested. The above steps will be described in detail below.

[0034] Please refer to Figure 1 and Figure 2First, the first test object 200 can be placed between the first conductive pad 110 and the second conductive pad 120. The two ends of the active region 210 of the first test object 200 are electrically connected to the connection region 112 of the first conductive pad 110 and the connection region 122 of the second conductive pad 120, respectively. Furthermore, the first test object 200 has a photoresist region 220 covering a portion of the active region 210, a first contact point 212 electrically connected to the connection region 112 of the first conductive pad 110, and a second contact point 214 electrically connected to the connection region 122 of the second conductive pad 120.

[0035] After the first device under test (DUT) 200 is placed between the first conductive pad 110 and the second conductive pad 120, the power supply 140 can provide a constant current through the active region 210 of the first DUT 200 via the first contact point 212 and the second contact point 214. The power supply 140 can provide the constant current by inserting a probe into the first conductive pad 110 and the second conductive pad 120, and the constant current can pass through the first DUT 200 via the first contact point 212 and the second contact point 214. After the power supply 140 provides a constant current through the active region 210 of the first DUT 200, the measurement unit 150 can measure the first resistance value of the first DUT 200 on the first conductive pad 110 and the second conductive pad 120. In detail, the measurement unit 150 can measure the voltage of the first device under test 200 based on the constant current provided by the power supply 140, and obtain the first resistance value of the first device under test 200 based on the constant current value and the voltage value of the first device under test 200. Furthermore, the measurement unit 150 can determine the offset of the photoresist region 220 of the first device under test 200 based on the first resistance value and a predetermined resistance value. When the measurement unit 150 determines that the first resistance value is the same as the predetermined resistance value, it can be determined that the photoresist region 220 of the first device under test 200 has not shifted. When the measurement unit 150 determines that the first resistance value is different from the predetermined resistance value, it can be determined that the photoresist region 220 of the first device under test 200 has shifted.

[0036] Furthermore, the operation method also includes: placing the second test object 300 between the second conductive pad 120 and the third conductive pad 130. The two ends of the active region 310 of the second test object 300 are electrically connected to the connection region 122 of the second conductive pad 120 and the connection region 132 of the third conductive pad 130, respectively. The second test object 300 has a photoresist region 320 covering a portion of the active region 310, a third contact point 312 electrically connected to the connection region 122 of the second conductive pad 120, and a fourth contact point 314 electrically connected to the connection region 132 of the third conductive pad 130. The line direction D1 connecting the first contact point 212 and the second contact point 214 of the first test object 200 is perpendicular to the line direction D2 connecting the third contact point 312 and the fourth contact point 314 of the second test object 300.

[0037] In some embodiments, the operation method further includes: passing a constant current through the second test object 300 via the third contact point 312 and the fourth contact point 314; measuring a second resistance value of the second test object 300 on the second conductive pad 120 and the third conductive pad 130; and determining the offset of the photoresist region 320 of the second test object 300 based on the second resistance value and a predetermined resistance value of the second test object 300. When the measurement unit 150 determines that the second resistance value is the same as the predetermined resistance value, it can be known that the photoresist region 320 of the second test object 300 has not shifted. When the measurement unit 150 determines that the second resistance value is different from the predetermined resistance value, it can be known that the photoresist region 320 of the second test object 300 has shifted. The arrangement of the first conductive pad 110 and the second conductive pad 120 can detect the offset of the photoresist region 220 of the first test object 200 in the y direction (e.g., the vertical direction), and the arrangement of the second conductive pad 120 and the third conductive pad 130 can detect the offset of the photoresist region 320 of the second test object 300 in the x direction (e.g., the horizontal direction).

[0038] In summary, the offset measurement device 100 can determine the offset in the x-direction by comparing the first resistance value of the first test object 200 with a predetermined resistance value, and can determine the offset in the y-direction by comparing the second resistance value of the second test object 300 with a predetermined resistance value. Furthermore, the offset measurement device 100 uses resistance measurement to determine whether the photoresist area 220 of the first test object 200 and the photoresist area 320 of the second test object 300 are offset. Therefore, the offset measurement device 100 can be applied to the first test object 200 and the second test object 300, which have surfaces with varying heights, increasing the frequency of use and improving its operational sensitivity.

[0039] The foregoing outlines the features of several embodiments, enabling those skilled in the art to better understand the nature of the invention. Those skilled in the art will understand that they can readily use this invention as the basis for designing or modifying other processes and structures to achieve the same objectives and / or advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the invention, and that various changes, substitutions, and modifications can be made to them without departing from the spirit and scope of the invention.

[0040] [Symbol Explanation]

[0041] 100, 100a: Offset measurement equipment

[0042] 110: First conductive pad

[0043] 112: Connection Area

[0044] 120: Second conductive pad

[0045] 122: Connecting Area

[0046] 130: Third conductive pad

[0047] 132: Connector

[0048] 140: Power Supply

[0049] 150: Measurement Unit

[0050] 200,200a: First analyte

[0051] 210, 210a: Active region

[0052] 212, 212a: First contact point

[0053] 214, 214a: Second contact point

[0054] 220, 220a: Optical resist region

[0055] 300, 300a: Second analyte

[0056] 310, 310a: Active region

[0057] 312, 312a: Third contact point

[0058] 314, 314a: Fourth contact point

[0059] 320, 320a: Optical resist region

[0060] S1: Steps

[0061] S2: Steps

[0062] S3: Steps

[0063] S4: Steps

[0064] D1: Direction of the connection line

[0065] D2: Direction of the line.

Claims

1. An operating method for an offset measuring device, characterized in that, Include: A first test object is placed between a first conductive pad and a second conductive pad, wherein the two ends of the active region of the first test object are electrically connected to the connection region of the first conductive pad and the connection region of the second conductive pad, respectively, and the first test object has multiple photoresist regions covering a portion of the active region, a first contact point electrically connected to the connection region of the first conductive pad, and a second contact point electrically connected to the connection region of the second conductive pad. The second test object is placed between the second conductive pad and the third conductive pad, wherein the two ends of the active area of ​​the second test object are electrically connected to the connection area of ​​the second conductive pad and the connection area of ​​the third conductive pad, respectively, and the second test object has multiple photoresist areas covering a portion of the active area, a third contact point electrically connected to the connection area of ​​the second conductive pad, and a fourth contact point electrically connected to the connection area of ​​the third conductive pad. A constant current is provided through the first contact point and the second contact point to pass through the active region of the first test object, and the constant current is provided through the third contact point and the fourth contact point to pass through the active region of the second test object. The direction of the line connecting the first contact point and the second contact point is perpendicular to the direction of the line connecting the third contact point and the fourth contact point. The first resistance value of the first test object is measured on the first conductive pad and the second conductive pad, and the second resistance value of the second test object is measured on the second conductive pad and the third conductive pad; The offset of the plurality of photoresistive regions of the first test object is determined based on the first resistance value and the predetermined resistance value of the first test object; as well as The offset of the plurality of photoresistive regions of the second test object is determined based on the second resistance value and the predetermined resistance value of the second test object.

2. The operating method as described in claim 1, wherein the second conductive pad is located between the first conductive pad and the third conductive pad.

3. An offset measurement device, characterized in that, Include: The first conductive pad has a connection area; The second conductive pad has a connection area, wherein the connection area of ​​the first conductive pad and the connection area of ​​the second conductive pad are configured to electrically connect the two ends of the active area of ​​the first test object, and the first test object has a plurality of photoresist areas covering a portion of the active area, a first contact point electrically connected to the connection area of ​​the first conductive pad, and a second contact point electrically connected to the connection area of ​​the second conductive pad. The third conductive pad has a connection area. The connection areas of the second conductive pad and the third conductive pad are configured to electrically connect the two ends of the active area of ​​the second test object. The second test object has multiple photoresist areas covering a portion of the active area, a third contact point electrically connected to the connection area of ​​the second conductive pad, and a fourth contact point electrically connected to the connection area of ​​the third conductive pad. The line connecting the first contact point and the second contact point is perpendicular to the line connecting the third contact point and the fourth contact point. A power supply is electrically connected to the first conductive pad, the second conductive pad, and the third conductive pad, and is configured to provide a constant current through the first test object via the first contact point and the second contact point, and to provide the constant current through the second test object via the third contact point and the fourth contact point. as well as The measurement unit is electrically connected to the power supply and configured to measure the first resistance value of the first test object and the second resistance value of the second test object, and to determine the offset of the plurality of photoresistive regions of the first test object based on the first resistance value and a predetermined resistance value of the first test object, and to determine the offset of the plurality of photoresistive regions of the second test object based on the second resistance value and a predetermined resistance value of the second test object.

4. The offset measuring device as claimed in claim 3, wherein the second conductive pad is located between the first conductive pad and the third conductive pad.

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