A precision temperature control device

Abstract

The application discloses a precision temperature control device, and relates to the technical field of precision instrument testing, which comprises a cooling medium temperature control system, a temperature control module, a precision temperature control controller and a controlled temperature module. The cooling medium temperature control system is communicated with a cooling medium transmission pipeline. The temperature control module comprises a shell, and an electric connection mother board is installed in the shell. The cooling medium transmission pipeline is communicated with a micro-channel cold plate heat exchanger. The controlled temperature module is placed on the micro-channel cold plate heat exchanger. The controlled temperature module comprises a low-power density precision temperature control module, a high-power density precision temperature control module and a heat dissipation only module without temperature control. The precision temperature control controller is placed on the micro-channel cold plate heat exchanger. The application adopts a modular design concept, can realize secondary precision temperature control of the precision temperature control module on the basis of liquid cooling temperature control, has the advantages of simple implementation, low cost, plug-and-play and cable-free design of the functional modules, high temperature control precision, low energy consumption, simple system, strong adaptability and remote operation, and the like.

Description

Technical Field

[0001] This invention relates to the field of precision instrument testing technology, and in particular to a precision temperature control device. Background Technology

[0002] Traditional precision temperature control systems impose strong constraints on overall indicators of environmental variables affecting temperature, resulting in significant resource consumption. Current precision temperature control systems with fluid-based heat dissipation require manual valve closure for disassembly and maintenance, increasing the risk of leakage and contamination of electronic equipment. Consequently, their precision temperature control stability is typically low. Furthermore, traditional temperature control systems suffer from poor adaptability, often employing the same thermal control measures for modules with different temperature control requirements, wasting considerable control and energy resources. The overall temperature signal and control power cable layout is complex and messy, and remote operation is usually lacking.

[0003] Therefore, there is an urgent need to design a precision temperature control device based on the modular design concept, which can achieve secondary precision temperature control of the precision temperature control module on the basis of primary liquid cooling temperature control. Summary of the Invention

[0004] The purpose of this invention is to provide a precision temperature control device to solve the problems existing in the prior art, realize the plug-and-play and cableless design of the thermal control function module, and also have the advantages of high temperature control accuracy, low energy consumption, simple system, strong adaptability and remote operation.

[0005] To achieve the above objectives, the present invention provides the following solution: The present invention provides a precision temperature control device, comprising: The cooling medium temperature control system is connected to the cooling medium transmission pipeline; The temperature control module includes a housing; the housing has a pre-drilled mounting hole for the cooling medium transmission pipe; an electrical connection motherboard is installed inside the housing; the cooling medium transmission pipe is connected to a microchannel cold plate heat exchanger through the connector assembly to achieve the exchange of cooling medium. The temperature-controlled module is placed on a microchannel cold plate heat exchanger; the temperature-controlled module includes a low-power-density precision temperature control module, a high-power-density precision temperature control module, and a heat dissipation-only module without temperature control; the low-power-density precision temperature control module is placed on the microchannel cold plate heat exchanger via a low-power-density temperature control plate assembly; the high-power-density precision temperature control module is placed on the microchannel cold plate heat exchanger via a high-power-density temperature control plate assembly; the electrical connection motherboard is connected to the low-power-density temperature control plate assembly and the high-power-density temperature control plate assembly via a connector assembly; A precision temperature controller is placed on the microchannel cold plate heat exchanger and is electrically connected to a communication plug.

[0006] The cooling medium transmission pipeline includes an inlet pipe and an outlet pipe; a cooling medium inlet temperature measuring point is installed at the connection between the mounting hole and the inlet pipe; a cooling medium outlet temperature measuring point is installed at the connection between the mounting hole and the outlet pipe; and an ambient temperature monitoring point is also installed on the surface of the shell.

[0007] The low power density precision temperature control module is a temperature-sensitive module with a power density of no more than 3W / cm². 2 The high power density precision temperature control module is a temperature-sensitive module with a power density greater than 3W / cm². 2 The heat dissipation-only module is a temperature-insensitive module that only dissipates heat.

[0008] The low-power-density temperature control plate assembly has the same structure as the high-power-density temperature control plate assembly; both the low-power-density temperature control plate assembly and the high-power-density temperature control plate assembly have several temperature control points on their upper surfaces.

[0009] The low power density temperature control plate assembly includes several TEC semiconductor coolers; the TEC semiconductor coolers are encased in an interface filling material; the heat dissipation surface of the TEC semiconductor cooler is disposed on the top surface of the microchannel cold plate heat exchanger, and the heat absorption surface of the TEC semiconductor cooler is disposed on the top surface of the low power density precision temperature control module.

[0010] The microchannel cold plate heat exchanger is equipped with a cold plate heat exchanger microchannel, and the two ends of the cold plate heat exchanger microchannel are connected to the liquid inlet pipe and the liquid outlet pipe respectively through a connector assembly.

[0011] The connector assembly includes an electrical quick-connect plug, a liquid cooling medium inlet self-sealing plug, and a liquid cooling medium outlet self-sealing plug; the microchannel of the cold plate heat exchanger is connected to the liquid inlet pipe through the liquid cooling medium inlet self-sealing plug; the microchannel of the cold plate heat exchanger is connected to the liquid outlet pipe through the liquid cooling medium outlet self-sealing plug. The electrical connection motherboard is blind-connected to the TEC semiconductor cooler via the electrical connection quick plug.

[0012] The precision temperature controller, the low power density precision temperature control module, the high power density precision temperature control module, the heat dissipation-only module, and several microchannel cold plate heat exchangers are all encased in a heat insulation layer.

[0013] A heat insulation board is fixedly installed on the inner surface of the shell, and the heat insulation board is made of flame-retardant foam material.

[0014] The present invention discloses the following technical effects: The present invention adopts a modular design concept, which can realize secondary precision temperature control on the basis of primary liquid cooling temperature control module. Theoretically, it can achieve ultra-high precision temperature stability control of ±0.05℃ / h in ground atmospheric environment. The system is simple to implement, low cost, and adopts a modular design method, which can realize plug-and-play and cableless design of functional modules; it is convenient for subsequent disassembly and maintenance of the whole equipment, and can realize rapid plug-and-play and operation of thermal control hardware. At the same time, the system also has the advantages of high temperature control accuracy, low energy consumption, system simplicity, strong adaptability and remote operation. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure; Figure 2 Top view of the temperature-controlled component; Figure 3 This is a schematic diagram of the temperature control algorithm; The components include: 1. Low power density precision temperature control module; 2. Low power density temperature control plate assembly; 3. Temperature control point; 4. Interface filling material; 5. TEC semiconductor cooler; 6. Insulation layer; 7. Microchannel cold plate heat exchanger; 8. Insulation plate; 9. Shell; 10. Cooling medium inlet temperature measuring point; 11. Cooling medium outlet temperature measuring point; 12. Ambient temperature monitoring point; 13. Cooling medium temperature control system; 14. High power density precision temperature control module; 15. High power density temperature control plate assembly; 16. Heat dissipation only, no temperature control module; 17. Cold plate heat exchanger microchannel; 20. Electrical connection motherboard; 21. Electrical connection quick connector; 22. Liquid cooling medium inlet self-sealing connector; 23. Liquid cooling medium outlet self-sealing connector; 24. Precision temperature controller; 25. Communication connector. Detailed Implementation The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0018] This invention provides a precision temperature control device, comprising: Cooling medium temperature control system 13 is connected to cooling medium transmission pipeline; The temperature control module includes a housing 9; the housing 9 has a pre-drilled mounting hole for a cooling medium transmission pipe; an electrical connection motherboard 20 is installed inside the housing 9; the cooling medium transmission pipe is connected to the microchannel cold plate heat exchanger 7 through a connector assembly to achieve the exchange of cooling medium. The temperature-controlled module is placed on the microchannel cold plate heat exchanger 7; the temperature-controlled module includes a low power density precision temperature control module 1, a high power density precision temperature control module 14, and a heat dissipation-only module 16; the low power density precision temperature control module 1 is placed on the microchannel cold plate heat exchanger 7 through the low power density temperature control plate assembly 2; the high power density precision temperature control module 14 is placed on the microchannel cold plate heat exchanger 7 through the high power density temperature control plate assembly 15; the electrical connection motherboard 20 is connected to the low power density temperature control plate assembly 2 and the high power density temperature control plate assembly 15 through the connector assembly; A precision temperature controller 24 is placed on the microchannel cold plate heat exchanger 7 and is electrically connected to a communication plug 25.

[0019] In one embodiment of the present invention, the microchannel cold plate heat exchanger 7 is designed with personalized thermal control according to the size, heat consumption and power density of the temperature-controlled module. Its fluid cold medium is connected to the cooling medium pipeline of the whole machine through a blind-plug sealing joint. The flow rate of the cooling medium flowing through the microchannels 17 of each cold plate heat exchanger is adjusted by flow resistance design or by adjusting the valve opening, which has better adjustment adaptability. The cooling medium of the whole machine is subjected to primary temperature control by an external refrigeration unit.

[0020] Furthermore, the microchannel 17 of the cold plate heat exchanger is made of stainless steel or other metals. The internal cooling medium flow channel is designed according to the heat source distribution of the temperature-controlled module. The density of the microchannel is adjusted according to the power density. The microchannel cold plate structure material should have good compatibility with the cooling medium.

[0021] The cooling medium transmission pipeline includes an inlet pipe and an outlet pipe; a cooling medium inlet temperature measuring point 10 is installed at the connection between the mounting hole and the inlet pipe; a cooling medium outlet temperature measuring point 11 is installed at the connection between the mounting hole and the outlet pipe; an ambient temperature monitoring point 12 is also installed on the surface of the shell 9.

[0022] Low power density precision temperature control module 1 is a temperature change sensitive module with a power density of no more than 3W / cm². 2 The high-power-density precision temperature control module 14 is a temperature-sensitive module with a power density greater than 3W / cm². 2 The heat dissipation-only module 16 is a temperature-insensitive module that only dissipates heat.

[0023] The low power density temperature control plate assembly 2 and the high power density temperature control plate assembly 15 have the same structure; both the low power density temperature control plate assembly 2 and the high power density temperature control plate assembly 15 have several temperature control points 3 on their upper surfaces.

[0024] The low power density temperature control plate assembly 2 includes several TEC semiconductor coolers 5; the TEC semiconductor coolers 5 are wrapped in the interface filling material 4; the heat dissipation surface of the TEC semiconductor coolers 5 is set on the top surface of the microchannel cold plate heat exchanger 7, and the heat absorption surface of the TEC semiconductor coolers 5 is set on the top surface of the low power density precision temperature control module 1.

[0025] In one embodiment of the present invention, the low power density temperature control plate assembly 2 and the high power density temperature control plate assembly 15 have the function of adjustable heat dissipation thermal resistance. Furthermore, the low power density temperature control plate assembly 2 and the high power density temperature control plate assembly 15 are also equipped with one or more temperature measuring devices. The temperature measuring position can be set at the center of the upper surface of the temperature control plate assembly according to the requirements of the temperature control module, or it can be distributed in various parts of the temperature control plate assembly according to the temperature control requirements. The position of the temperature measuring device should have a thermal response relationship with the TEC semiconductor cooler 5.

[0026] The microchannel cold plate heat exchanger 7 is equipped with a cold plate heat exchanger microchannel 17. The two ends of the cold plate heat exchanger microchannel 17 are connected to the liquid inlet pipe and the liquid outlet pipe respectively through a connector assembly.

[0027] The connector assembly includes an electrical quick-connect plug 21, a liquid cooling medium inlet self-sealing plug 22, and a liquid cooling medium outlet self-sealing plug 23; the cold plate heat exchanger microchannel 17 is connected to the liquid inlet pipe through the liquid cooling medium inlet self-sealing plug 22; the cold plate heat exchanger microchannel 17 is connected to the liquid outlet pipe through the liquid cooling medium outlet self-sealing plug 23. The electrical connection motherboard 20 is blind-connected to the TEC semiconductor cooler 5 via the electrical connection quick connector 21.

[0028] The precision temperature controller 24, the low power density precision temperature control module 1, the high power density precision temperature control module 14, the heat dissipation-only module 16, and several microchannel cold plate heat exchangers 7 are all enclosed in the insulation layer 6.

[0029] A heat insulation board 8 is fixedly installed on the inner surface of the shell 9. The heat insulation board 8 is made of flame-retardant foam material.

[0030] In one embodiment of the present invention, the cooling medium temperature control system 13 serves as a heat sink for the thermal control system, ensuring that the cooling medium inlet temperature measuring point 10 has a low temperature level and good temperature stability. Simultaneously, it also functions as a reflux storage and cooling system at the cooling medium outlet temperature measuring point 11.

[0031] In one embodiment of the present invention, the heat insulation layer 6 is used to reduce the impact of ambient temperature changes on the temperature of the precision temperature control module, while the inner surface of the overall housing 9 is covered with a polyurethane heat insulation board for secondary heat insulation design.

[0032] In one embodiment of the present invention, multiple sets of TEC semiconductor coolers 5 are arranged according to the different heating areas and heat flux densities of the low power density precision temperature control module 1) and the high power density temperature control plate assembly 15; the multiple sets of TEC semiconductor coolers 5 are connected in parallel, and one or more sets of TEC semiconductor coolers 5 are turned on according to the heat dissipation requirements.

[0033] In one embodiment of the present invention, the temperature measurement and power output signal cables of both the low power density temperature control plate assembly 2 and the high power density temperature control plate assembly 15 are connected to the electrical connection motherboard 20 via quick-connect plugs 21 using a blind-plug design. That is, the electrical connection of the thermal control system is made conductive after the load module is installed, and the electrical connection of the thermal control system is automatically blocked when the load module is pulled out. Similarly, the liquid cooling medium of each microchannel cold plate heat exchanger 7 is connected to the main liquid cooling medium pipeline of the whole machine via the liquid cooling medium inlet self-sealing plug 22 and the liquid cooling medium outlet self-sealing plug 23, thereby realizing the blind-plug operation of the liquid cooling fluid medium. A positioning pin is set near the self-sealing plug for guidance and positioning.

[0034] Furthermore, the signal acquisition and power control cables of each precision temperature control module and the TEC semiconductor cooler 5 are all connected to the precision temperature controller 24 via the electrical connection motherboard 20. The precision temperature controller 24 is the core device for the hardware and software control of the whole machine's thermal control system. Its external communication plug 25 can be a serial port or a network port to meet the needs of remote control and remote operation. The precision temperature controller 24 is installed on the microchannel cold plate heat exchanger 7.

[0035] like Figure 3 As shown, the initialization process of the precision temperature controller 24 includes CPU timer, interrupt and input / output initialization, UART serial communication initialization, AD acquisition initialization, SPI interface initialization, FPGA configuration initialization, and PID control parameter initialization; then, all parameters are acquired, the software reads data from each acquisition unit, and completes data filtering; through UART communication processing: remote control command reception, parsing and execution, telemetry parameter packaging and transmission; realizing the scheduling of the software operation cycle; generating control signals (cooling or heating) for the TEC semiconductor cooler 5, completing a closed-loop process; Furthermore, based on design constraints and thermal control characteristics, the temperature control algorithm uses a TEC semiconductor cooler 5 as the active temperature control device and a negative temperature coefficient thermistor as the temperature control point 3. The MCU calculates the error between the target temperature value and the current acquired value, and a high-precision temperature control algorithm calculates the TEC cooling power. The TEC operating voltage is adjusted through a MOS bridge circuit to achieve power regulation of the TEC semiconductor cooler 5. Temperature changes are manifested as changes in the thermistor resistance. The output signal is conditioned by a matching circuit, multiple analog switches, and operational amplifiers, and then the AD976 chip controlled by the FPGA is used for data acquisition. The MCU calculates the output power value based on the acquired temperature value using the control algorithm, and sends the control parameters to the FPGA via the SPI bus. The FPGA then implements a PWM controller to control the output power signal of the back-end power circuit.

[0036] Furthermore, the telemetry parameters described in the temperature control algorithm of this invention include: temperature data of each precision temperature control module's temperature control point, inlet and outlet temperature data of the cooling medium, ambient temperature data, power output parameters and duty cycle of each heater and TEC semiconductor cooler; engineering parameters include: switching status of each heater and TEC semiconductor cooler, PID parameters of each temperature control loop, and temperature control cycle of the temperature control loop.

[0037] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0038] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A precision temperature control device, characterized in that, include: The cooling medium temperature control system (13) is connected to the cooling medium transmission pipeline; The temperature control module includes a housing (9); the housing (9) has a reserved mounting hole for the cooling medium transmission pipe; an electrical connection motherboard (20) is installed inside the housing (9); the cooling medium transmission pipe is connected to the microchannel cold plate heat exchanger (7) through a connector assembly to realize the exchange of cooling medium; The temperature-controlled module is placed on the microchannel cold plate heat exchanger (7); the temperature-controlled module includes a low power density precision temperature control module (1), a high power density precision temperature control module (14), and a heat dissipation-only module (16); the low power density precision temperature control module (1) is placed on the microchannel cold plate heat exchanger (7) through a low power density temperature control plate assembly (2); the high power density precision temperature control module (14) is placed on the microchannel cold plate heat exchanger (7) through a high power density temperature control plate assembly (15); the electrical connection motherboard (20) is connected to the low power density temperature control plate assembly (2) and the high power density temperature control plate assembly (15) through a connector assembly; A precision temperature controller (24) is placed on the microchannel cold plate heat exchanger (7) and is electrically connected to a communication plug (25). The low power density temperature control plate assembly (2) includes several TEC semiconductor coolers (5). The microchannel cold plate heat exchanger (7) is provided with a cold plate heat exchanger microchannel (17). The connector assembly includes an electrical quick-connect plug (21), a liquid cooling medium inlet self-sealing plug (22), and a liquid cooling medium outlet self-sealing plug (23); the cold plate heat exchanger microchannel (17) is connected to the liquid inlet pipe through the liquid cooling medium inlet self-sealing plug (22); the cold plate heat exchanger microchannel (17) is connected to the liquid outlet pipe through the liquid cooling medium outlet self-sealing plug (23); The electrical connection motherboard (20) is blind-connected to the TEC semiconductor cooler (5) via the electrical connection quick plug (21).

2. The precision temperature control device according to claim 1, characterized in that: The cooling medium transmission pipeline includes an inlet pipe and an outlet pipe; a cooling medium inlet temperature measuring point (10) is installed at the connection between the mounting hole and the inlet pipe; a cooling medium outlet temperature measuring point (11) is installed at the connection between the mounting hole and the outlet pipe; an ambient temperature monitoring point (12) is also installed on the surface of the housing (9).

3. The precision temperature control device according to claim 1, characterized in that: The low power density precision temperature control module (1) is a temperature-sensitive module with a power density per unit area of ​​no more than 3W / cm². 2 The high power density precision temperature control module (14) is a temperature-sensitive module with a power density greater than 3W / cm². 2 The heat dissipation-only module (16) is a temperature-insensitive module that only dissipates heat.

4. The precision temperature control device according to claim 1, characterized in that: The low power density temperature control plate assembly (2) has the same structure as the high power density temperature control plate assembly (15); the upper surface of both the low power density temperature control plate assembly (2) and the high power density temperature control plate assembly (15) is provided with several temperature control points (3).

5. The precision temperature control device according to claim 4, characterized in that: The TEC semiconductor cooler (5) is enclosed in the interface filling material (4); the heat dissipation surface of the TEC semiconductor cooler (5) is disposed on the top surface of the microchannel cold plate heat exchanger (7), and the heat absorption surface of the TEC semiconductor cooler (5) is disposed on the top surface of the low power density precision temperature control module (1).

6. The precision temperature control device according to claim 5, characterized in that: The two ends of the microchannel (17) of the cold plate heat exchanger are connected to the inlet pipe and the outlet pipe respectively through the connector assembly.

7. The precision temperature control device according to claim 1, characterized in that: The precision temperature controller (24), the low power density precision temperature control module (1), the high power density precision temperature control module (14), the heat dissipation-only module (16) and several microchannel cold plate heat exchangers (7) are all wrapped in the insulation layer (6).

8. The precision temperature control device according to claim 1, characterized in that: A heat insulation board (8) is fixedly installed on the inner surface of the shell (9), and the heat insulation board (8) is made of flame-retardant foam material.

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