Systematic design method, device and medium for multi-chip vehicle-mounted domain controller heat dissipation structure

Abstract

The application discloses a kind of multi-chip vehicle-mounted field controller heat dissipation structure systematic design method, device and medium, belong to PCBA board high-efficiency heat dissipation structure design technical field.The method includes: obtaining the basic parameters of vehicle-mounted field controller, the basic parameters are input into the first mathematical model for judging heat dissipation mode, obtain numerical value g;If g < g0, execute multi-chip vehicle-mounted field controller natural heat dissipation structure systematic design;If g >= g0, execute multi-chip vehicle-mounted field controller forced air cooling heat dissipation structure systematic design.The application carries out selective heat dissipation and concentrated heat dissipation to multi-chip PCBA board electronic components, can effectively reduce the uniform and indiscriminate heat dissipation of PCBA board, realize that heat dissipation resource is concentrated in the electronic component of higher heat dissipation demand, to reduce the waste of overall heat dissipation resource, realize the high-efficiency heat dissipation of multi-chip PCBA board.

Description

Technical Field

[0001] This invention relates to the field of high-efficiency heat dissipation structure design technology for PCBA boards, and in particular to a systematic design method, device and medium for heat dissipation structure of multi-chip automotive domain controllers. Background Technology

[0002] With the increasing number, miniaturization, and high integration of internal electronic components in multi-chip automotive domain controllers (≥50 chips), these components face severe heat dissipation challenges. Common heat dissipation methods for automotive domain controller PCBA boards include natural cooling and forced air cooling. For natural cooling of automotive domain controllers, traditional finned and pin-finned structures combined with uniform cooling methods that dissipate heat from all electronic components are insufficient due to limited cooling capacity and low efficiency, failing to meet the heat dissipation requirements of multi-chip automotive domain controller PCBA boards. Traditional natural cooling of multi-chip automotive domain controller PCBA boards is mainly achieved by adding finned structures to the front and rear covers of the heat sink. The heat dissipation protrusions on the front / rear covers of the heat sink, through a thermally conductive medium, make thermal contact with the electronic components on the PCBA board, transferring heat from the electronic components to the heat sink fins. This heat dissipation method relies on heat sinks to cool all electronic components on the automotive domain controller PCBA board. However, it fails to adequately consider the thermal dissipation of these components, their maximum allowable junction temperature, and the thermal effects between components, leading to a waste of heat dissipation capacity and resources. Furthermore, when a single electronic component in a multi-chip automotive domain controller PCBA board has a power exceeding 50W, natural heat dissipation is insufficient. A common approach is forced air cooling combined with a cooling fan. However, this method also suffers from the problem of insufficient consideration of component arrangement, power consumption, and the thermal effects between chips during the heat dissipation structure design. Using heat sinks and air coolers to cool all electronic components on a multi-chip automotive domain controller PCBA board results in a waste of the overall heatsink's cooling capacity and excessive aerodynamic noise during the cooling process. Summary of the Invention

[0003] In order to at least partially solve one of the technical problems existing in the prior art, the purpose of this invention is to provide a systematic design method, device and medium for the heat dissipation structure of a multi-chip vehicle domain controller.

[0004] The technical solution adopted in this invention is:

[0005] A systematic design method for the heat dissipation structure of a multi-chip automotive domain controller includes the following steps:

[0006] Obtain the basic parameters of the vehicle domain controller, input the basic parameters into the first mathematical model used to determine the heat dissipation method, and obtain the value g.

[0007] If g < g0, execute the systematic design of the natural heat dissipation structure for the multi-chip automotive domain controller; obtain the heat dissipation power and maximum allowable junction temperature of the electronic components, and input the second mathematical model used to determine whether the electronic components need to implement natural heat dissipation to obtain the numerical value f. Ni ;

[0008] When f Ni ≤f N0 At that time, it was determined that no heat dissipation was required for the electronic component;

[0009] When f Ni >f N0 When it is determined that heat dissipation is needed for the electronic component; if f Ni >f′ N0 >f N0 If the condition is not met, it is determined that centralized heat dissipation is required for the electronic component; otherwise, it is determined that centralized heat dissipation is not required for the electronic component.

[0010] If g ≥ g0, implement the systematic design of the forced air cooling structure for the multi-chip automotive domain controller; obtain the heat dissipation power of electronic components, the maximum allowable junction temperature, and the aerodynamic noise of the fan, and input them into the third mathematical model used to determine whether the electronic components need forced air cooling to obtain the numerical value f. Ak ;

[0011] When f Ak ≤f A0 At that time, it was determined that natural heat dissipation was required for the electronic component;

[0012] When f Ak >f A0 When it is determined that forced air cooling is required for the electronic component; if f Ak >f′ A0 >f A0 If the electronic component is deemed to require forced air cooling, then forced air cooling is deemed unnecessary.

[0013] Among them, g0, f N0 f A0 f′ N0 f′ A0 All values ​​are preset values. (These preset values ​​are determined based on the relevant parameter values ​​for actual natural heat dissipation and forced air cooling application scenarios.)

[0014] Furthermore, the first mathematical model is constructed in the following manner:

[0015] Based on the actual radiator specifications, heat transfer coefficient, and maximum power, a mathematical model is constructed to determine the heat dissipation method:

[0016] g = w1H + w2W + w3L + w4P + w5h

[0017] In the formula, the length is L, the width is W, and the height is H in the radiator specifications, all in mm; the heat transfer coefficient is h, in W / (m²). 2 ·K); The highest power value is P, and the unit is W; w1, w2, w3, w4, and w5 are the influence weights of H, W, L, P, and h on g, respectively.

[0018] Furthermore, the expression for the second mathematical model is as follows:

[0019] f Ni =w N1 P i +w N2 (150℃-T ij-max )

[0020] Among them, P i Heat dissipation of electronic components, measured in W; T ii-max The maximum permissible junction temperature for electronic components, expressed in °C; w N1 w N2 P respectively i T ij-max The weight of influence in the selection of chips requiring heat dissipation; i represents different electronic components.

[0021] Furthermore, the expression for the third mathematical model is as follows:

[0022] f Ak =w A1 P k +w A2 (150℃-T kj-max )+w A3 N

[0023] Among them, P k For the heat dissipation of electronic components, T kj-max The maximum allowable junction temperature for electronic components is given by N, where N is the aerodynamic noise level and W is the noise level. A1 For P k The weight of influence in the selection of chips requiring heat dissipation, w a2 For T kj-max The weight of w in influencing the selection of chips requiring heat dissipation A3 N represents the weight of influence in the selection of chips requiring heat dissipation.

[0024] Furthermore, the step of systematically designing the forced air-cooling heat dissipation structure of the multi-chip automotive domain controller also includes a step of optimizing the structure of the air-cooling heat sink of the automotive domain controller, as follows:

[0025] Obtain the operating junction temperature of key electronic components under different fin widths and fan volumetric flow rates of air-cooled heat sinks, and construct the relationship between the operating junction temperature of electronic components and fin width and fan volumetric flow rate;

[0026] The optimal airflow and fin width are determined based on the established relationship.

[0027] Furthermore, the relationship is as follows:

[0028]

[0029] Among them, T j-soc For the operating junction temperature of key electronic components, W 肋 Q represents the width of the fins in the air-cooled radiator structure. 风扇 The volumetric flow rate of the fan is given by a0, a1, a2, a3, a4, and a5, which are coefficients.

[0030] Furthermore, the determination requires centralized heat dissipation of the electronic component, including:

[0031] Conduct centralized heat dissipation research on electronic components that require heat dissipation; among which, centralized heat dissipation research refers to the optimization of heat dissipation fins considering heat dissipation factors, as well as secondary optimization research on the heat dissipation structure of the front cover based on heat dissipation theory. Heat dissipation factors include chip layout, overall size, and chip junction temperature.

[0032] Furthermore, the determination requires forced air cooling for centralized heat dissipation of the electronic component, including:

[0033] The electronic device is cooled by a centralized heat dissipation structure, and heat is diffused by a heat spreader or air-cooled heat sink fins. The centralized heat dissipation structure includes a heat spreader + copper block + air-cooled heat sink or a heat pipe + air-cooled heat sink.

[0034] Another technical solution adopted in this invention is:

[0035] A systematic design device for heat dissipation structure of a multi-chip automotive domain controller includes:

[0036] At least one processor;

[0037] At least one memory for storing at least one program;

[0038] When the at least one program is executed by the at least one processor, the at least one processor performs the method as described above.

[0039] Another technical solution adopted in this invention is:

[0040] A computer-readable storage medium storing a processor-executable program, which, when executed by a processor, is used to perform the method described above.

[0041] The beneficial effects of this invention are: This invention provides selective and concentrated heat dissipation for electronic components on multi-chip PCBA boards, which can effectively reduce the uniform and indiscriminate heat dissipation of PCBA boards, and concentrate heat dissipation resources on electronic components with higher heat dissipation requirements, thereby reducing the waste of overall heat dissipation resources and achieving efficient heat dissipation of multi-chip PCBA boards. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following description is provided with accompanying drawings of the relevant technical solutions in the embodiments of the present invention or the prior art. It should be understood that the accompanying drawings described below are only for the purpose of clearly illustrating some embodiments of the technical solutions of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a flowchart illustrating a systematic design method for the heat dissipation structure of a multi-chip automotive domain controller according to an embodiment of the present invention. Detailed Implementation

[0044] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. The step numbers in the following embodiments are set only for ease of explanation, and there is no limitation on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0045] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0046] In the description of the present invention, "several" means one or more, "a plurality of" means two or more. Terms such as "greater than", "less than" and "exceeding" are understood to exclude the recited number, while terms such as "above", "below" and "within" are understood to include the recited number. If the first and second are described, they are only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features or the sequential relationship of the indicated technical features.

[0047] In addition, in the description of the present invention, unless otherwise specified, "a plurality of" means two or more. The expression "and / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can indicate: A exists alone, both A and B exist, and B exists alone. The character " / " generally indicates that the preceding and following associated objects are in an "or" relationship.

[0048] In the description of the present invention, unless otherwise explicitly defined, terms such as "arrangement", "installation" and "connection" should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0049] In view of the problem that the above-mentioned traditional heat dissipation methods cannot efficiently solve the heat dissipation problem of multi-chip PCBA boards of vehicle-mounted domain controllers, it is necessary to explore an efficient systematic natural / forced air cooling heat dissipation structure design method for multi-chip and multi-scenario applications, so as to improve the overall heat dissipation structure design efficiency of vehicle-mounted domain controllers and reduce the waste of heat dissipation resources.

[0050] As shown in Figure 1 , this embodiment provides a systematic design method for a heat dissipation structure of a multi-chip vehicle-mounted domain controller, comprising the following steps:

[0051] obtaining basic parameters of a vehicle-mounted domain controller, inputting the basic parameters into a first mathematical model for determining a heat dissipation method, and obtaining a value g;

[0052] if g < g0, performing systematic design of a natural heat dissipation structure for a multi-chip vehicle-mounted domain controller; obtaining the heating power and the maximum allowable operating junction temperature of an electronic component, inputting them into a second mathematical model for determining whether the electronic component needs natural heat dissipation, and obtaining a value f Ni ;

[0053] when f Ni ≤f N0 , it is determined that heat dissipation is not required for this electronic component;

[0054] when f Ni >f N0 , it is determined that heat dissipation is required for this electronic component; if f Ni >f′ N0 >f N0, it is determined that centralized heat dissipation is required for the electronic component; conversely, it is determined that centralized heat dissipation is not required for the electronic component;

[0055] If g≥g0, perform systematic design of forced air cooling heat dissipation structure for multi-chip on-board domain controllers; obtain the heating power, maximum allowable junction temperature and fan aerodynamic noise of the electronic component, input them into the third mathematical model for judging whether the electronic component needs forced air cooling heat dissipation, and obtain the value f Ak ;

[0056] When f Ak ≤f A0 , it is determined that natural heat dissipation is required for the electronic component;

[0057] When f Ak >f A0 , it is determined that forced air cooling heat dissipation is required for the electronic component; if f Ak >f′ A0 >f A0 , it is determined that centralized forced air cooling heat dissipation is required for the electronic component; conversely, it is determined that centralized forced air cooling heat dissipation is not required for the electronic component.

[0058] In this embodiment, a mathematical model for judging heat dissipation methods is first constructed to determine the heat dissipation method adopted by the on-board domain controller under different heat power consumptions. Specifically, the mathematical model for judging heat dissipation methods is constructed according to the actual specification size of the heat sink, heat convection heat transfer coefficient and maximum power value:

[0059] g=w1H+w2W+w3L+w4P+w5h (1)

[0060] In the formula, the length, width and height in the specification size of the heat sink are L, W and H respectively, with the unit of mm. The heat convection heat transfer coefficient is h, with the unit of W / (m 2 ·K); the maximum power value is P, with the unit of W. w1, w2, w3, w4 and w5 are the influence weights of H, W, L, P and h on g respectively.

[0061] Substitute the allowable specification size of the heat sink, the maximum chip power value and the heat convection heat transfer coefficient under the corresponding heat dissipation scenario into the corresponding formula, and determine the available heat dissipation method according to the obtained value g and the standard value g0. When g<g0, systematic natural heat dissipation and forced air cooling heat dissipation can be used; conversely, when g≥g0, systematic forced air cooling heat dissipation can be used.

[0062] This paper proposes a systematic design method for the natural heat dissipation structure of multi-chip automotive domain controllers. Optimization will be carried out in different modules, including selective heat dissipation of electronic components and centralized heat dissipation optimization. First, the number, distribution, power consumption, thermal impact between electronic components, heat dissipation structure, and maximum allowable junction temperature of the electronic components on the automotive domain controller PCBA board will be considered. Based on the criteria for selective heat dissipation of electronic components, heat dissipation will be implemented for electronic components with high temperature requirements, while heat dissipation for electronic components with low temperature requirements will be reduced or eliminated to fully utilize heat dissipation resources.

[0063] Considering that the heat dissipation power and maximum allowable junction temperature of electronic components play a decisive role in whether heat dissipation is required, a mathematical model for determining whether natural heat dissipation is necessary for electronic components is constructed based on these two factors, as follows:

[0064] f Ni =w N1 P i +w N2 (150℃-T ij-max (i = 1, 2, 3…n) (2)

[0065] Among them, the heat dissipation of electronic components is defined as P. i The unit is W; the maximum allowable junction temperature for electronic components is defined as T. ij-max The unit is ℃. N1 w N2 P respectively i T ij-max The weight of influence in the selection of chips requiring heat dissipation. i represents different electronic components, and the value of n is determined by the total number of electronic components on the PCBA board.

[0066] When f Ni ≤f N0 When f is in a certain state, it indicates that heat dissipation is not required for the electronic component. Ni When the value is greater than fN0, heat dissipation is required for the electronic component. The choice of whether to select heat dissipation is achieved by adding or not adding heat dissipation bosses. That is, electronic components that do not require heat dissipation rely on the air inside the vehicle domain controller for heat dissipation.

[0067] Secondly, when f Ni >f′ N0 >f N0 At that time, we will carry out centralized heat dissipation research on electronic components that require heat dissipation. Centralized heat dissipation includes optimizing heat dissipation fins considering heat dissipation factors such as chip layout, overall size, and chip junction temperature, as well as conducting secondary optimization research on the front cover heat dissipation structure based on heat dissipation theory. That is, we will carry out centralized heat dissipation for electronic components on PCBA boards that have higher temperature requirements and more important functions.

[0068] For the forced air cooling structure design of multi-chip automotive domain controllers, it is also necessary to consider factors such as the actual arrangement of electronic components on the multi-chip PCBA board, power consumption, junction temperature, and overall aerodynamic noise of the domain controller. A corresponding selective heat dissipation judgment mathematical model is constructed to selectively dissipate heat from electronic components. The main approach is to use forced air cooling for electronic components with high heat dissipation requirements and natural cooling for those with lower requirements, thereby achieving full utilization of heat dissipation resources. For the selective forced air cooling judgment model, the heat dissipation power of the electronic components is defined as Pk (in W); and the maximum allowable junction temperature of the electronic components is defined as T. kj-max The unit is ℃; the aerodynamic noise value is defined as N, and the unit is dBA; then a mathematical model can be constructed to determine whether electronic components need forced air cooling:

[0069] f Ak =w A1 P k +w A2 (150℃-T kj-max )+w A3 N (k=1,2,3…n) (3)

[0070] In the formula, w A1 For P k The weight of influence in the selection of chips requiring heat dissipation, w A2 For T kj-max The weight of w in influencing the selection of chips requiring heat dissipation A3 N represents the weight of influence in the selection of chips requiring heat dissipation. k represents different electronic components, and the value of n is determined by the total number of electronic components on the PCBA board.

[0071] When f Ak ≤f A0 When f indicates that natural heat dissipation is required for the electronic component, Ak >f A0 When forced air cooling is applied to the electronic component, the corresponding electronic component is brought into contact with the air cooler through a heat dissipation boss, while other electronic components that are cooled naturally are not brought into contact with the air cooler.

[0072] When f Ak >f′ A0 >f A0 This indicates that the electronic component requires centralized forced air cooling, specifically through a centralized heat dissipation structure such as a heat spreader + copper block + air cooler or heat pipe + air cooler. The copper block and heat pipes enhance heat conduction, while the heat spreader or air cooler fins further facilitate heat diffusion and convection, thereby improving heat dissipation for electronic components with high temperature requirements.

[0073] Finally, heat dissipation optimization needs to be carried out on the air-cooled heat sink structure of the vehicle domain controller, including optimization of fan parameters and heat dissipation structure parameters, to achieve heat dissipation optimization that considers multiple factors such as noise and heat dissipation. The optimization of heat dissipation structure parameters mainly involves determining the heat sink fin structure parameters and optimizing these parameters using optimization design methods. Specifically, the structural parameters are optimized using a common optimization method—response surface methodology. First, experimental data is collected through experimental design methods. Based on the collected data, a multiple quadratic regression equation is used to fit the functional relationship between multiple variables and the output quantity. Then, by analyzing this equation, the optimal structural parameters of the air-cooled heat sink are determined, enhancing the overall heat dissipation capacity of the air-cooled heat sink. Specifically, heat dissipation structure optimization is carried out by studying the relationship between heat sink fin structure parameters and the maximum allowable junction temperature of key electronic components. For this, the overall model needs to be simplified first to facilitate structural parameter adjustment. The simplification principle is to ensure that the simplified model has the same elements as the basic model. Furthermore, based on the degree of influence on the heat sink's heat dissipation capacity, the fin structure parameters—fin width and fan flow rate—are selected as input parameters in the simplified model, and the junction temperature of the key electronic components is selected as the output parameter. The width W of the air-cooled radiator fins can be defined. 肋 Fan volumetric flow rate Q 风扇 The output parameter is defined as the junction temperature T of the key electronic components. j-soc Experimental data were obtained using a reasonable experimental design, and the functional relationship between each factor and the response value was fitted using a multiple quadratic regression equation, resulting in the following relationship:

[0074]

[0075] Where a0, a1, a2, a3, a4, and a5 are the coefficients of different terms.

[0076] The obtained regression equation can be used to solve for the optimal airflow and fin width under the corresponding conditions, and then applied in the heat dissipation structure of the vehicle domain controller to improve the overall heat dissipation performance.

[0077] Based on a systematic forced air cooling design method, all electronic components on the PCBA board can meet the required specifications. Compared with traditional heat dissipation methods, this method can solve heat dissipation problems efficiently and quickly.

[0078] The above method will be explained in detail below with reference to specific embodiments. Specific Implementation Example 1

[0080] For a specific model of vehicle domain controller from a company in the field of intelligent driving, a heat dissipation solution meeting a 25W SOC thermal power requirement needs to be developed. Specific heat dissipation technical specifications are as follows:

[0081] Table 1 Heat dissipation technical index requirements for a certain type of vehicle-mounted domain controller

[0082]

[0083]

[0084] It can be known from Table 1 that the length in the specification dimension of the heat sink is L=300 mm, the width is W=200 mm, and the height is H=60 mm. The heat convection heat transfer coefficient is h=5~25 W / (m 2 ·K); the maximum power value is P=25 W. w1, w2, w3, w4, w5 can be determined according to the relationship diagram between heat flux density and temperature difference of natural heat dissipation and forced air cooling heat dissipation, and engineering experience, specifically w1=0.2, w2=0.3, w3=0.25, w4=0.15, w5=0.1. Substitute into the mathematical model for judging whether it is necessary to develop natural heat dissipation and active heat dissipation:

[0085] g N =w1H+w2W+w3L+w4P+w5h

[0086] =0.2×60+0.3×200+0.25×300+0.15×25+0.1×(5~25)

[0087] =151.25~153.25

[0088] Determine the actual standard value g0=160. It is found that g N <g0, which indicates that systematic natural heat dissipation structure design is required.

[0089] Table 2 is the information table of electronic components on the PCBA board of this type of vehicle-mounted domain controller, which includes the maximum junction temperature and corresponding power consumption of electronic components at different position numbers on the PCBA board.

[0090] Table 2 Information of electronic components on PCBA board

[0091]

[0092]

[0093]

[0094] Note: T j(max) is the maximum allowable working junction temperature of electronic components.

[0095] Define the heating power consumption of electronic components as P i , the unit is W; define the maximum allowable working junction temperature of electronic components as T ij-maxThe unit is °C. Therefore, a mathematical model can be constructed to determine whether natural cooling is necessary:

[0096] f Ni =w N1 P i +w N2 (150℃-T ij-max (i = 1, 2, 3…n) (4)

[0097] w N1 w N2 P respectively i T ij-max The weight of influence in the selection of chips requiring heat dissipation can be determined based on the actual situation. N1 =0.8, w N2 =0.2. i represents different electronic components, n=40. f can be determined based on engineering experience. N0 =5.

[0098] When f Ni ≤f N0 When f indicates that heat dissipation is not required for the electronic component, Ni >f N0 In such cases, natural heat dissipation is required for the electronic components. The choice between selecting or not selecting heat dissipation is achieved by adding or not adding heat dissipation bosses. That is, electronic components that do not require heat dissipation rely on the air inside the vehicle domain controller for heat dissipation.

[0099] The final judgment results are shown in Table 3 below.

[0100] Table 3 Results of the assessment of whether electronic components need natural heat dissipation

[0101]

[0102]

[0103] The above method can quickly identify electronic components that require natural heat dissipation without the need for simulation analysis. This allows for selective heat dissipation of electronic components, improving the heat dissipation efficiency of the heat dissipation structure and reducing the waste of heat dissipation resources.

[0104] To further improve the heat dissipation efficiency of electronic components, the f-value of electronic components requiring natural heat dissipation can be adjusted accordingly. N The value when f Ni A score greater than 8 indicates a need for centralized heat dissipation research on electronic components. The purpose of centralized heat dissipation is to improve the utilization rate of heat dissipation resources by concentrating them on electronic components with high heat dissipation requirements. The specific electronic components requiring centralized heat dissipation are shown in Table 4 below.

[0105] Table 4 Results of the assessment of whether centralized heat dissipation is required for electronic components

[0106]

[0107]

[0108] Centralized heat dissipation is achieved by adding corresponding heat dissipation structures to enhance the heat conduction of electronic components requiring centralized heat dissipation. Specifically, this enhancement can be achieved by increasing the volume of the actual heat dissipation path. For example, natural heat dissipation can be achieved by combining radial heat dissipation structures, extended bosses, and expanded bosses to increase the volume of the heat conduction path, thereby enhancing heat conduction.

[0109] This method enables the acquisition of a natural heat dissipation solution for the PCBA board corresponding to the above-mentioned heat dissipation technical indicators. Compared with the traditional natural heat dissipation structure design method, this systematic design method can ensure that all electronic components on the PCBA board meet the requirements. Specific Implementation Example 2

[0111] For a certain type of automotive domain controller, a heat dissipation solution is required to meet the main chip's thermal dissipation of 57W. Specific performance requirements are shown in Table 5.

[0112] Table 5 Heat dissipation technical indicators

[0113]

[0114] The following values ​​can be calculated using formula (1):

[0115] g A = w1H + w2W + w3L + w4P + w5h

[0116] =0.2×60+0.3×190+0.25×250+0.15×57+0.1×200=12+57+62.5+8.55+20=160.05>160

[0117] This indicates that, given the current thermal performance requirements of automotive domain controllers, forced air cooling and other methods with higher heat dissipation capabilities are necessary to address the heat dissipation issues of the PCBA board. Table 6 below shows the electronic information of the electronic components on the internal PCBA board of this automotive domain controller model.

[0118] Table 6 Electronic Information of a Certain Model of Vehicle Domain Controller PCBA Board

[0119]

[0120]

[0121]

[0122] For the selective forced air cooling heat dissipation judgment model, the heat dissipation power of electronic components is also defined as P. k The unit is W; the maximum allowable junction temperature for electronic components is defined as T. kj-max The unit is ℃; the aerodynamic noise value is defined as N, and the unit is dBA; then a mathematical model can be constructed to determine whether electronic components need forced air cooling:

[0123] f Ak =w A1 P k +w A2 (150-T kj-max )+w A3 N(k=1,2,3…n)

[0124] Based on the actual radiator size, basic parameters of the air-cooled radiator, and other factors affecting heat dissipation, determine w. A1 w A2 w A3 The values ​​are 0.19, 0.8, and 0.01 respectively, and f is determined. A0 =30. Substituting the above values ​​into the calculation yields the results shown in Table 7 below:

[0125] Table 7 Results of the judgment on heat dissipation methods of electronic components

[0126]

[0127]

[0128]

[0129] For electronic components requiring forced air cooling, a boss is added. This boss connects all the corresponding bosses of the electronic components requiring forced air cooling. By adding a heat dissipation boss of appropriate height on the front of the heat sink, the thermal influence between electronic components requiring forced air cooling and natural heat dissipation is reduced. The heat dissipation boss on the front of the front cover will contact the air cooling heat sink to achieve forced air cooling for the electronic components corresponding to the boss, while the other electronic components not thermally connected to the boss will undergo natural heat dissipation. This achieves selective heat dissipation of the PCBA board from a structural perspective.

[0130] Additionally, for f A0 Electronic components with a temperature greater than 40 require centralized forced air cooling. According to Table 7, the electronic component with location number UA01 requires centralized forced air cooling.

[0131] For centralized heat dissipation using forced air cooling, a centralized heat dissipation structure such as a heat spreader + copper block + air cooler or heat pipe + air cooler can be used to centrally dissipate heat from the device. The copper block and heat pipes enhance heat conduction, while the heat spreader or air cooler fins further enhance heat diffusion and convection, thereby improving heat dissipation for electronic components with high temperature requirements.

[0132] After completing the centralized heat dissipation of electronic components, a structural optimization study of the air-cooled heat sink for the vehicle domain controller will be conducted. Based on the degree of impact on heat dissipation capacity, the simplified model will select fin structure parameters (fin width), fan flow rate, and number of fins as input parameters, and UA01 junction temperature as the output parameter. Specific data collection is shown in Table 8 below.

[0133] Table 8 Data Collection Records

[0134]

[0135] N=30 experimental schemes were determined through general rotating combination design and BOX design. Based on the data collected in Table 8 above, a quadratic regression equation was constructed using response surface methodology, and the optimal solution was obtained. The reference conclusion is that the UA01 junction temperature is the lowest when the fin thickness is 0.8 mm, and this parameter will be used as a premise for subsequent optimization.

[0136] Using the above method, all required electronic components can meet the heat dissipation requirements, ensuring that the actual PCBA board can work normally.

[0137] In summary, compared with the prior art, the present invention has at least the following advantages and beneficial effects:

[0138] (1) Traditional heat dissipation methods rely on the relationship between temperature rise and heat flux density, combined with volumetric heat flux density and surface heat flux density, to determine the available heat dissipation methods. This method has a large error and cannot accurately determine the available heat dissipation methods. However, the systematic heat dissipation method judgment mathematical model of the present invention can quickly determine whether systematic natural heat dissipation or systematic forced air cooling is required.

[0139] (2) Compared with the traditional method of using simulation analysis to determine the electronic components that need to be cooled, the present invention can quickly determine the electronic components that need to be cooled by using a selective heat dissipation mathematical model, which greatly reduces the time and operation required for the determination.

[0140] (3) Using a systematic design method can make full use of the overall heat dissipation resources under the same conditions and improve the overall heat dissipation efficiency.

[0141] This embodiment also provides a systematic design device for the heat dissipation structure of a multi-chip automotive domain controller, including:

[0142] At least one processor;

[0143] At least one memory for storing at least one program;

[0144] When the at least one program is executed by the at least one processor, the at least one processor performs the following: Figure 1 The method shown.

[0145] This embodiment of the device provides a systematic design apparatus for the heat dissipation structure of a multi-chip vehicle domain controller. It can execute the systematic design method for the heat dissipation structure of a multi-chip vehicle domain controller provided in the method embodiment of the present invention, and can execute any combination of the implementation steps of the method embodiment. It has the corresponding functions and beneficial effects of the method.

[0146] This application also discloses a computer program product or computer program, which includes computer instructions stored in a computer-readable storage medium. A processor of a computer device can read the computer instructions from the computer-readable storage medium and execute the computer instructions, causing the computer device to perform... Figure 1 The method shown.

[0147] This embodiment also provides a storage medium storing instructions or programs that can execute the systematic design method for heat dissipation structure of a multi-chip vehicle domain controller provided in the method embodiment of the present invention. When the instructions or programs are run, any combination of implementation steps of the method embodiment can be executed, and the method has the corresponding functions and beneficial effects.

[0148] In some alternative embodiments, the functions / operations mentioned in the block diagrams may not occur in the order shown in the operation diagrams. For example, depending on the functions / operations involved, two consecutively shown blocks may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order. Furthermore, the embodiments presented and described in the flowcharts of this invention are provided by way of example to provide a more comprehensive understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is altered and sub-operations described as part of a larger operation are executed independently.

[0149] Furthermore, although the invention has been described in the context of functional modules, it should be understood that, unless otherwise stated, one or more of the described functions and / or features may be integrated into a single physical device and / or software module, or one or more functions and / or features may be implemented in a separate physical device or software module. It is also understood that a detailed discussion of the actual implementation of each module is unnecessary for understanding the invention. Rather, given the properties, functions, and internal relationships of the various functional modules in the apparatus disclosed herein, the actual implementation of the module will be understood within the scope of conventional skill of an engineer. Therefore, those skilled in the art can implement the invention as set forth in the claims using ordinary techniques without excessive experimentation. It is also understood that the specific concepts disclosed are merely illustrative and not intended to limit the scope of the invention, which is determined by the full scope of the appended claims and their equivalents.

[0150] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0151] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0152] More specific examples of computer-readable media (a non-exhaustive list) include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable media can even be paper or other suitable media on which the program can be printed, since the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0153] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0154] In the foregoing description of this specification, references to terms such as "one embodiment," "another embodiment," or "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0155] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

[0156] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A systematic design method for the heat dissipation structure of a multi-chip automotive domain controller, characterized in that, Includes the following steps: Obtain the basic parameters of the vehicle domain controller, input these parameters into the first mathematical model used to determine the heat dissipation method, and obtain the numerical values. ; like The system implements a systematic design for the natural heat dissipation structure of a multi-chip automotive domain controller; it obtains the heat dissipation power and maximum allowable junction temperature of electronic components, and inputs these into a second mathematical model to determine whether natural heat dissipation is required for the electronic components, thus obtaining numerical values. ; when At that time, it was determined that no heat dissipation was required for the electronic component; when When it is determined that heat dissipation is needed for the electronic component; if If the condition is not met, it is determined that centralized heat dissipation is required for the electronic component; otherwise, it is determined that centralized heat dissipation is not required for the electronic component. like The system implements a forced air cooling structure design for a multi-chip automotive domain controller; it acquires the heat dissipation power of electronic components, the maximum allowable junction temperature, and the aerodynamic noise of the fan, and inputs these into a third mathematical model to determine whether forced air cooling is necessary for the electronic components, obtaining numerical values. ; when At that time, it was determined that natural heat dissipation was required for the electronic component; when At that time, it was determined that forced air cooling was required for the electronic component; if If the electronic component is deemed to require forced air cooling, then forced air cooling is deemed unnecessary. in, , , , , All are preset values; The first mathematical model was obtained by constructing it in the following way: Based on the actual radiator specifications, heat transfer coefficient, and maximum power, a mathematical model is constructed to determine the heat dissipation method: In the formula, the length in the radiator specification dimensions is Width is Height is The heat transfer coefficient for heat convection is The highest power value is ; , , , , They are respectively , , , , right Influence weight; The expression for the second mathematical model is as follows: in, For the heat dissipation of electronic components; This refers to the maximum allowable junction temperature for electronic components. , They are respectively , The weight of influence in the selection of chips requiring heat dissipation; Representing different electronic components; The expression for the third mathematical model is as follows: in, For the heat dissipation of electronic components, N represents the maximum allowable junction temperature for the electronic component, and N represents the aerodynamic noise. for The weight of influence in the selection of chips requiring heat dissipation for The weight of influence in the selection of chips requiring heat dissipation. N represents the weight of influence in the selection of chips requiring heat dissipation.

2. The systematic design method for heat dissipation structure of a multi-chip automotive domain controller according to claim 1, characterized in that, The step of systematically designing the forced air-cooling heat dissipation structure of the multi-chip automotive domain controller also includes optimizing the structure of the air-cooling heat sink of the automotive domain controller, as follows: Obtain the operating junction temperature of key electronic components under different fin widths and fan volumetric flow rates of air-cooled heat sinks, and construct the relationship between the operating junction temperature of electronic components and fin width and fan volumetric flow rate; The optimal airflow and fin width are determined based on the established relationship.

3. The systematic design method for the heat dissipation structure of a multi-chip automotive domain controller according to claim 2, characterized in that, The relationship is as follows: in, The junction temperature of key electronic components. The width of the fins in the air-cooled radiator structure. For fan volumetric flow rate, is a coefficient.

4. The systematic design method for heat dissipation structure of a multi-chip automotive domain controller according to claim 1, characterized in that, The determination requires centralized heat dissipation for the electronic component, including: Conduct centralized heat dissipation research on electronic components that require heat dissipation; among which, centralized heat dissipation research refers to the optimization of heat dissipation fins considering heat dissipation factors, as well as secondary optimization research on the heat dissipation structure of the front cover based on heat dissipation theory. Heat dissipation factors include chip layout, overall size, and chip junction temperature.

5. The systematic design method for heat dissipation structure of a multi-chip automotive domain controller according to claim 1, characterized in that, The determination requires forced air cooling for the electronic component, including: The electronic component is cooled by a centralized heat dissipation structure, and heat is diffused by a heat spreader or air-cooled heat sink fins. The centralized heat dissipation structure includes a heat spreader + copper block + air-cooled heat sink or a heat pipe + air-cooled heat sink.

6. A systematic design device for heat dissipation structure of a multi-chip vehicle domain controller, characterized in that, include: At least one processor; At least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the method of any one of claims 1-5.

7. A computer-readable storage medium storing a processor-executable program, characterized in that, The processor-executable program, when executed by the processor, is used to perform the method as described in any one of claims 1-5.

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