An enhanced interfacial bonding friction stir deposition repair apparatus and method
CN117381135BActive Publication Date: 2026-08-28NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Patent Information
- Application Number
- CN202311533318.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-17
- Publication Date
- 2026-08-28
- Estimated Expiration
- 2043-11-17
AI Technical Summary
Technical Problem
但上述方法均未涉及对外部基板的改造,各自方法适应性有限,缺乏一个既可增加修复界面结合强度,又可对搅拌头和芯料辅助加热的一个简单的集成装置及方法
Benefits of technology
[0034]1、本发明使电火花减材加工的工具电极和搅拌摩擦增材工具头同轴配合,集成一体,将基板待修复区刻蚀出相应的微结构阵列界面后,再搅拌摩擦形成新的沉积层,微结构增加了界面接触面积,对修复层具有钉扎作用,使基材和修复之间的界面结合强度得到显著提升。
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Figure CN117381135B_ABST
Abstract
The application discloses a kind of enhanced interface bonding's friction stir deposition repair device and method, including stir head (2), processing cylinder (6) and direct current pulse power (7), the tool electrode of electric spark machining and friction stir tool head are integrated on the stir head (2), tool electrode and friction stir tool head are coaxial concentric integration between the two by linear bearing (204), friction stir tool head is located inside, tool electrode is located outside, the relative sliding of two can go up and down, friction stir tool head can rotate freely, but tool electrode cannot rotate;The application makes the tool electrode of electric spark machining and friction stir additive tool head coaxial cooperation, integration, after corresponding microstructure array interface is etched out to the substrate to be repaired area, new deposition layer is formed by friction stir, microstructure increases interface contact area, has pinning effect to repair layer, the interface bonding strength between substrate and repair is significantly improved.
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Citation Information
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