A fabrication process for misalignment of CD rings in a 3D mobile phone battery cover
By designing a single-cavity texture mold and selecting precise PC sheet materials and processing technology, the problem of CD texture processing with a misalignment and concentricity of less than 0.45mm in the existing technology has been solved, realizing efficient and easy-to-implement CD ring preparation, and improving the yield of finished CD rings to 96.17%.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN GOLDENKEN OPTICS ELECTRONICS CO LTD
- Filing Date
- 2023-09-27
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies are insufficient for efficiently processing CD-patterned camera double rings with a concentricity deviation of less than 0.45mm, which fails to meet consumers' high demands for the appearance of 3D composite board cameras.
The design employs a single-cavity textured mold, selects 0.8mm thick PC sheets, and uses a machine with CCD recognition function for positioning, cutting, and mark point processing. Combined with physical positioning methods, the mold assembly accuracy and finished product quality are ensured. The CD ring is formed by high-pressure mold transfer and curing.
It has achieved efficient processing of CD rings with a concentricity deviation of less than 0.3mm, and the yield of finished CD rings has reached 96.17%, meeting the requirements for high-precision appearance.
Smart Images
Figure CN117382046B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a process for manufacturing a 3D mobile phone battery cover CD ring offset, belonging to the field of mobile phone battery cover manufacturing technology. Background Technology
[0002] As the requirements for smart mobile devices become increasingly sophisticated and consumers' aesthetic standards for electronic products become more professional and demanding, simply processing a single dual-ring effect for a camera on 3D composite panels is no longer sufficient to meet consumer needs. To enhance the appearance of the dual-ring camera, different textures, such as CD patterns, are often added. However, current technologies for processing dual-ring camera designs with CD patterns are limited, especially for CD patterns with a concentricity deviation of less than 0.45mm, which presents significant processing challenges and cannot meet the production requirements of small-sized CD rings. Summary of the Invention
[0003] To address the aforementioned issues, this invention proposes a 3D mobile phone battery cover CD ring offset fabrication process, which boasts high processing efficiency and ease of implementation, and is particularly suitable for processing CD rings with offset concentricity less than 0.3 mm.
[0004] The 3D mobile phone battery cover CD ring offset manufacturing process of the present invention includes the following steps:
[0005] The first step is to create the original texture model;
[0006] S1. Design a single-cavity texture mold, and the center distance between the two CD rings on the single-cavity texture mold meets the requirement of 22.5mm;
[0007] S2. Set the size of the single-cavity texture mold, and the size of the single-cavity texture mold should be 5mm larger than the effective size of the battery cover on one side; if the mold size is less than 5mm, after high pressure molding and heating, it is easy to cause variation and the finished product may have missing texture.
[0008] The second step is to assemble the template blocks;
[0009] S3. Select 0.8mm thick PC sheet as the main material for assembly; the selection method for the main material for assembly is as follows: PC sheets with thicknesses of 0.5mm, 0.64mm, 0.8mm and 1.0mm were subjected to multiple DQE verifications, and the optimal 0.8mm thick PC sheet was selected by comparing and analyzing yield, performance and other aspects.
[0010] S4. Design the opening frame of the PC sheet, define the single cavity opening position degree and the positioning post position degree with mold positioning characteristics according to the high pressure mold layout position degree, and take the opening position where the positioning post is located as the Mark point;
[0011] S5. Mark point machining, and specify the machining program drawing file according to the Mark points;
[0012] S6. For single-cavity mold processing, the standard value is the length and width of the design plus 10mm. Based on the center of the CD ring to the XY axis, and on the premise that the length and width of the incoming single-cavity texture mold are correct (OK), the center distance of the CD ring double rings is 22.5mm as the benchmark. The outer ring processing position is compensated for to meet the design standard.
[0013] S7. Assembly and Mold Assembly: The frame, Mark points, and single-cavity molds are manually assembled, with a tolerance of ±0.05mm. Before assembly, the kit is dusted using an ion fan to ensure no debris or burrs affect assembly accuracy (the mold appearance requirements are high; the assembly mold will infinitely replicate the sub-mold and production mold, so debris and burrs inside the holes will affect assembly accuracy and the primary mold, leading to defects in appearance). During assembly, the frame is placed on a non-deformable glass tabletop with a flatness of ±0.01mm and a tempered glass thickness exceeding 5mm. Mark points and single-cavity molds are inlaid, and measurements are taken before transfer curing to ensure an overall tolerance of ±0.05mm.
[0014] S8. Using a transfer curing device, place the mold obtained from the semi-finished product after the previous step on the edge of the glass tabletop. Use physical positioning, start the device to ensure the curing light source, and demold the mold normally. The 1.0mm thick PC sheet has a small stretching amount, and the finished mold size after demolding has no variation, meeting the finished product tolerance of ±0.05mm.
[0015] Further, the specific steps of S4 are as follows: A machine tool with CCD recognition function is used, along with a φ3.6mm cutter, for positioning and cutting; first, the single-cavity size of the frame is defined based on the product's single-cavity size plus 10mm for both length and width; then, based on the distance from the center distance of the high-pressure typesetting design to the XY axis, the distance between the single cavity and the center point is found and set as the standard, defining the positional tolerance of the 4-cavity opening of the frame; then, based on the design value, the relative positional tolerance of the positioning post is found through the XY axis, and the positioning post opening is a φ4mm diameter hole; next, the processing drawing is confirmed, and the processing tolerance in this step is ±0.03mm; during cutting, the PC sheet is placed horizontally on the machine tool plane, and a 0.1mm thick film is placed on the bottom surface of the PC sheet to prevent the cutter from damaging the machine tool plane; after processing according to the program, the actual value of the positional tolerance is measured using a two-dimensional method. This action needs to be repeated, and the actual value is measured to ensure that it meets the design value before compensation is made relative to the program to ensure that the relative position of the PC frame meets the requirements; where, the actual value = the standard design value.
[0016] Furthermore, in step S5, when processing the Mark points, the Mark point size includes the inner and outer diameters. The concentricity of the Mark points is less than the designed processing value, ensuring that the 2D measuring instrument can identify the actual distance from the center of the Mark point to the edge. Appropriate texture point types (φ3mm and φ2.5mm) are found to meet the processing conditions. Traditional screen-printed Mark points (formed by ink) cannot meet the accuracy requirements due to process limitations, with conventional stretching deformation around 0.1mm. The standard requires that φ4mm Mark points meet the requirement of inner diameter concentricity of 0±0.01mm and outer diameter control within 0.03mm, avoiding compatibility issues. A Mark point type meeting the requirements is found according to the processing plan, and the point is a standard circle + 0.1mm thick cut film. The CCD machine identifies the Mark center point according to the program and processes it, with a processing tolerance of ±0.03mm, which is judged as a correct (OK) actual test value. The outer diameter meets the requirement of φ4mm±0.02mm.
[0017] Further, the specific steps of S6 are as follows: Processing is performed using a machine tool with CCD recognition function. This process, while ensuring correct dimensions, focuses on preventing damage to the appearance. During processing, a 0.1mm cutting film is placed on the bottom of the PC sheet, and a 0.05mm thick anti-fouling film is placed on the upper surface of the PC sheet to prevent scratches during processing. A measurement program is simultaneously edited to measure the processed object; a tolerance of ±0.03mm is considered acceptable (OK); otherwise, it is considered unacceptable (NG). If unacceptable, the processing program is compensated. Compensation is based on the principle that the center distance between the two CD rings is 22.5mm, ensuring correct positional accuracy. The outer ring is then compensated for to achieve the design standard.
[0018] Furthermore, in S7, during measurement, the positional tolerance of the two holes in the Y-direction frame and the center distance to the Mark point in the X-direction are taken as the reference based on the design value center point. After meeting the design conditions, it is determined whether it meets the standard (OK). If the measured size exceeds the tolerance / actual value > ±0.05mm, the positional tolerance is evaluated based on the actual object to see if there is a 0.03mm margin for adjustment before completing the assembly.
[0019] Furthermore, in step S8, the finished product mold is transferred to obtain a master mold before production and use.
[0020] Compared with the prior art, the 3D mobile phone battery cover CD ring misalignment preparation process of the present invention has high processing efficiency and is easy to implement, especially suitable for processing CD rings with misalignment concentricity of less than 0.3mm; the splicing size of the mold is 202*160mm, and the splicing tolerance can reach 0.03mm; and the misalignment yield of the prepared CD ring has reached 96.17%. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the texture template measurement results in Embodiment 1 of the present invention.
[0022] Figure 2 This is a schematic diagram showing the statistical results of the finished CD ring misalignment yield produced using conventional processes in Embodiment 2 of the present invention.
[0023] Figure 3 This is a schematic diagram showing the statistical results of the CD ring misalignment yield of the finished product prepared by the preparation process of the present invention in Example 2 of the present invention. Detailed Implementation
[0024] The 3D mobile phone battery cover CD ring offset manufacturing process of the present invention includes the following steps:
[0025] The first step is to create the original texture model;
[0026] S1. Design a single-cavity texture mold, and the center distance between the two CD rings on the single-cavity texture mold meets the requirement of 22.5mm;
[0027] S2. Set the size of the single-cavity texture mold, and the size of the single-cavity texture mold should be 5mm larger than the effective size of the battery cover on one side; if the mold size is less than 5mm, after high pressure molding and heating, it is easy to cause variation and the finished product may have missing texture.
[0028] The second step is to assemble the template blocks;
[0029] S3. Select 0.8mm thick PC sheet as the main material for assembly; the selection method for the main material for assembly is as follows: PC sheets with thicknesses of 0.5mm, 0.64mm, 0.8mm and 1.0mm were subjected to multiple DQE verifications, and the optimal 0.8mm thick PC sheet was selected by comparing and analyzing yield, performance and other aspects.
[0030] S4. Design the opening frame of the PC sheet, define the single cavity opening position degree and the positioning post position degree with mold positioning characteristics according to the high pressure mold layout position degree, and take the opening position where the positioning post is located as the Mark point; specifically, use a machine with CCD recognition function and a φ3.6mm cutter for positioning and cutting; first, define the single cavity size of the frame according to the single cavity size of the product plus 10mm for length and width as the standard, then find the distance between the single cavity and the center point according to the high pressure layout design center distance to the XY axis distance and set it as the standard, and define the 4 cavity opening position degree of the frame; Then, based on the design values, the relative position of the positioning pins is found using the XY axes, and the positioning pin openings are φ4mm in diameter. Next, the machining drawings are confirmed, and the machining tolerance in this step is ±0.03mm. During cutting, the PC sheet is placed horizontally on the machine tool plane, and a 0.1mm thick film is placed on the bottom surface of the PC sheet to prevent the cutting tool from damaging the machine tool plane. After machining according to the program, the actual position value is measured using a two-dimensional measurement tool. This action needs to be repeated, and the actual value needs to be measured to see if it meets the design value before compensation is made relative to the program to ensure that the relative position of the PC frame meets the requirements.
[0031] S5. Mark point processing, and processing program drawings specified for the Mark points; specifically, the Mark point size includes the inner and outer diameter dimensions, and the concentricity of the Mark points is less than the design processing value, ensuring that the 2D measuring instrument can identify the actual position distance from the center of the Mark point to the edge; find suitable texture point types (φ3mm and φ2.5mm) to meet the processing conditions; traditional screen printing dots (formed by ink) cannot meet the accuracy requirements of Mark points due to process limitations, with a conventional stretching deformation of about 0.1mm; while the standard requires that the finished φ4mm Mark points meet the requirement of inner diameter concentricity of 0±0.01mm, and the outer diameter dimension controlled within 0.03mm, avoiding compatibility obstacles; find the Mark point type that meets the requirements according to the processing plan + 0.1mm thickness cutting film; the CCD machine finds the Mark center point for processing according to the program identification, and the processing tolerance must meet ±0.03mm, which is judged as the correct (OK) actual test value; the outer diameter size φ4mm±0.02mm meets the requirements.
[0032] S6. Single-cavity mold processing: The standard value is the design length and width + 10mm. Based on the CD ring center to the XY axis, and assuming the incoming single-cavity textured mold has the correct (OK) length and width, the outer ring processing position is compensated for accuracy, with the CD ring double rings meeting a center distance of 22.5mm as the benchmark, to achieve the design standard. Specifically, a machine tool with CCD recognition function is used for processing. This process, while ensuring dimensional accuracy, focuses on preventing damage to the appearance. During processing, a 0.1mm cutting film is placed on the bottom of the PC sheet, and a 0.05mm thick anti-fouling film is placed on the upper surface of the PC sheet to prevent scratches during processing. A measurement program is simultaneously edited to measure the processed object. A measurement within ±0.03mm is considered acceptable (OK); otherwise, it is unacceptable (NG). If unacceptable, the processing program is compensated. Compensation is based on the principle of the CD ring double rings meeting a center distance of 22.5mm to ensure correct positional accuracy, and the outer ring processing accuracy is compensated to achieve the design standard.
[0033] S7. Assembly and Molding: Manually assemble the frame, Mark points, and single-cavity molds, ensuring a tolerance of ±0.05mm. Before assembly, use an ion fan to remove dust from the kit, ensuring no debris or burrs affect assembly accuracy (mold appearance requirements are high; assembling the mold will infinitely replicate the sub-mold and production mold, so debris and burrs inside the holes will affect assembly accuracy and the primary mold, leading to defects in appearance). During assembly, place the frame on a non-deformable glass tabletop with a flatness of ±0.01mm and a tempered glass thickness exceeding 5mm. Inlay the Mark points and single-cavity molds, and after completion, measure the overall tolerance before transfer curing to ensure it is ±0.05mm. Key measurement dimensions: Using the design center point as a reference, measure the position of each of the two cavities in the Y-direction frame and the center distance to the Mark point in the X-direction. If the design conditions are met, determine if it meets the standard (OK). If the measured dimensions exceed the tolerance / actual value > ±0.05mm, assess the position based on the actual object to see if there is a 0.03mm margin for adjustment before completing the assembly and molding.
[0034] S8. The finished mold is transferred to the master mold before production. The mold is placed on the edge of the glass table using the transfer curing equipment. The physical positioning method is adopted. The equipment is started to ensure the curing light source. The mold is demolded normally. The 1.0mm thick PC sheet has a small stretching amount, and the finished mold size after demolding has no variation, meeting the finished product tolerance of ±0.05mm.
[0035] Example 1:
[0036] Using the above-mentioned 3D mobile phone battery cover CD ring offset manufacturing process, a finished mold was prepared, and measurements were performed. The measurement results are as follows: Figure 1 As shown, and by Figure 1It can be seen that the mold assembly size of 202*160mm can achieve a mold assembly tolerance of 0.03mm. Among them, the mold assembly size of 202*160mm is the required size for high-pressure mold layout. Since the larger the size, the greater the variation and the greater the stretch, the more difficult it is to control the tolerance. However, the mold assembly size of this invention reaches a maximum of 202mm, and the mold assembly tolerance can be within 0.03mm, which is a new technical high in the entire industry.
[0037] Example 2:
[0038] CD rings were produced using both conventional processes and the 3D mobile phone battery cover CD ring misalignment preparation process of this invention. The yield of the produced CD rings was statistically analyzed for CD ring misalignment. The statistical results are as follows: Figure 2 and Figure 3 As shown, and by Figure 2 and Figure 3 It can be seen that when the CD ring misalignment is less than 0.3 mm, the finished CD ring misalignment yield obtained by the preparation process of this invention has reached 96.17%, while the conventional method only reaches 39.32%, which can no longer meet the production requirements.
[0039] The above embodiments are merely preferred embodiments of the present invention. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of this patent application are included within the scope of this patent application.
Claims
1. A manufacturing process for offset CD rings in a 3D mobile phone battery cover, characterized in that, Includes the following steps: The first step is to create the original texture model; S1. Design a single-cavity texture mold, and the center distance between the two CD rings on the single-cavity texture mold meets the requirement of 22.5mm; S2. Set the size of the single-cavity texture mold, and the size of the single-cavity texture mold is 5mm larger than the effective size of the battery cover on one side; The second step is to assemble the template blocks; S3. 0.8mm thick PC sheet is selected as the main material for assembly; S4. Design the opening frame of the PC sheet, define the single cavity opening position degree and the positioning post position degree with mold positioning characteristics according to the high pressure mold layout position degree, and take the opening position where the positioning post is located as the Mark point; S5. Mark point machining, and specify the machining program drawing file according to the Mark points; S6. For single-cavity mold processing, the standard value is the length and width of the design plus 10mm. Based on the center of the CD ring to the XY axis, and on the premise that the incoming single-cavity texture mold has the correct length and width, the CD ring double ring meets the center distance of 22.5mm as the benchmark. The outer ring processing position is compensated for to meet the design standard. S7. Assembly and Molding: The frame, Mark points, and single-cavity molds are manually assembled, with a tolerance of ±0.05mm. Before assembly, the kit is dusted using an ion fan to ensure no debris or lint affects assembly accuracy. During assembly, the frame is placed on a non-deformable tempered glass tabletop with a flatness of ±0.01mm and a tempered glass thickness exceeding 5mm. Mark points and single-cavity molds are inlaid, and measurements are taken before transfer curing to ensure an overall tolerance of ±0.05mm. S8. Using a transfer curing device, place the mold obtained after the previous step of molding on the edge of the tempered glass tabletop. Use physical positioning to start the device to ensure the curing light source, and demold the mold normally. The dimensions of the finished mold after demolding should not vary and should meet the finished product tolerance of ±0.05mm.
2. The 3D mobile phone battery cover CD ring offset manufacturing process according to claim 1, characterized in that, The specific steps of S4 are as follows: A machine tool with CCD recognition function is used, along with a φ3.6mm cutter, for positioning and cutting. First, the single-cavity size of the frame is defined based on the product's single-cavity size plus 10mm for both length and width. Then, based on the distance from the center distance of the high-pressure typesetting design to the XY axis, the distance between the single cavity and the center point is found and set as the standard, defining the positional tolerance of the 4-cavity opening in the frame. Next, based on the design value, the relative positional tolerance of the positioning post is found through the XY axis, and the positioning post opening is a φ4mm diameter hole. Then, the processing drawings are confirmed; the processing tolerance in this step is ±0.03mm. During cutting, the PC sheet is placed horizontally on the machine tool plane, and a 0.1mm thick film is placed on the bottom surface of the PC sheet. After processing according to the program, the actual positional tolerance value is measured using a two-dimensional measurement system.
3. The 3D mobile phone battery cover CD ring offset manufacturing process according to claim 1, characterized in that, In step S5, when processing the Mark point, the size of the Mark point includes the inner and outer diameters, and the concentricity of the Mark point is less than the design processing value, ensuring that the two-dimensional measuring instrument can identify the actual position distance from the center of the Mark point to the edge.
4. The 3D mobile phone battery cover CD ring offset manufacturing process according to claim 1, characterized in that, The specific steps of S6 are as follows: Processing is performed using a machine tool with CCD recognition function. This process prioritizes ensuring the appearance is not damaged while maintaining accurate dimensions. During processing, a 0.1mm cutting film is placed on the bottom of the PC sheet, and a 0.05mm thick anti-fouling film is placed on the upper surface of the PC sheet. A measurement program is simultaneously edited to measure the processed object; a tolerance of ±0.03mm is considered acceptable, otherwise it is unacceptable. If unacceptable, the processing program is compensated. Compensation is based on the principle that the center distance between the two CD rings is 22.5mm, ensuring correct positioning. Then, the outer ring undergoes positional compensation to achieve the design standard.
5. The 3D mobile phone battery cover CD ring offset manufacturing process according to claim 1, characterized in that, In S7, during measurement, the positional accuracy of the two holes in the Y-direction frame and the center distance to the Mark point in the X-direction are taken as the reference value. After the design conditions are met, it is determined whether the standard is met. If the measured size exceeds the tolerance / actual value > ±0.05mm, the positional accuracy is evaluated based on the actual object to see if there is a margin within 0.03mm. After adjustment, the assembly mold is completed.
6. The 3D mobile phone battery cover CD ring offset manufacturing process according to claim 1, characterized in that, In step S8, the finished mold is transferred to obtain the master mold before production and use.