A radio frequency direction finding front-end module

Abstract

This invention relates to the field of microwave and millimeter-wave equipment technology, specifically disclosing a radio frequency direction-finding front-end module, including an antenna, a composite substrate connected to the antenna, multiple sets of front-end modules located on the side of the composite substrate away from the antenna and interlocked with the composite substrate, a radio frequency coaxial connector disposed between the antenna and the composite substrate for connecting the antenna and the composite substrate, and a positioning component for fixing the antenna and the composite substrate. This invention significantly reduces the size and weight of the front-end module, facilitates system integration, and effectively achieves lightweight and miniaturized design.

Description

Technical Field

[0001] This invention relates to the field of microwave and millimeter-wave equipment technology, and more specifically, to a radio frequency direction finding front-end module. Background Technology

[0002] The utility model patent with authorization number CN209232790U describes a radio frequency front-end module using SIP packaging. It employs a silicon substrate to support a bare chip and seals it via thermocompression. However, thermocompression sealing cannot guarantee airtightness. Furthermore, the silicon substrate used differs significantly in its coefficient of thermal expansion from that of a regular PCB board, limiting its area; otherwise, it risks cracking under extreme high and low temperature conditions. Therefore, as described in the background section, it is only suitable for applications with low environmental requirements, such as mobile phones and wearable devices.

[0003] The invention patent with application number CN113556869A introduces a tile-type front-end module non-ball-mounted vertical stacking structure, which is suitable for high-power application scenarios. The introduction of cooling plates and metal frames increases the volume, making it unsuitable for scenarios with lower power and strict volume requirements.

[0004] The invention patent with application number CN111929648A introduces a W-band highly integrated radar front-end module based on LTCC. The inventor focuses on the solution, which uses embedded devices in the LTCC substrate to improve the integration, but does not mention the external packaging.

[0005] The utility model patent with application number CN204258802U introduces a miniaturized MIMO radio frequency front-end module, which includes a transceiver channel antenna, a polarization converter, a transceiver channel filter, a receiving module and a transmitting module. The multi-channel shared housing reduces the size, but it is still implemented by a hybrid integration method, so there is still considerable room for improvement in size and weight. Summary of the Invention

[0006] The technical problem to be solved by this invention is to provide a radio frequency direction finding front-end module that greatly reduces the size and weight of the front-end module, is easy to integrate into the system, and effectively achieves lightweight and miniaturized design; The solution adopted by this invention to solve the technical problem is: A radio frequency direction finding front-end module includes an antenna, a composite substrate connected to the antenna, multiple front-end modules located on the side of the composite substrate away from the antenna and plugged into the composite substrate, a radio frequency coaxial connector disposed between the antenna and the composite substrate for connecting the antenna and the composite substrate, and a positioning component for fixing the antenna and the composite substrate.

[0007] In some possible implementations, multiple sets of radiating patches corresponding to each front-end module are provided on the side of the antenna away from the composite substrate, and radio frequency coaxial connectors are provided corresponding to each radiating patch. A substrate coupler is provided in the composite substrate, which corresponds one-to-one with the radiating patch.

[0008] In some possible implementations, an RF socket, a detector, a low-frequency connector, a driver, a self-test RF connector, and a power supply control low-frequency connector are provided on the side of the composite substrate near the front-end module; the RF socket, detector, and low-frequency connector are respectively connected to the front-end module and are provided in a one-to-one correspondence.

[0009] In some possible implementations, the front-end module includes a printed circuit board, a first front-end device and a second front-end device disposed on the same side or symmetrically on both sides of the printed circuit board, a port blind-mating connector disposed on the radio frequency interface of the printed circuit board and connected to the radio frequency socket, and a pad disposed corresponding to the low-frequency socket and disposed at the low-frequency interface of the printed circuit board. The radio frequency signals between the port blind-mating connector and the first front-end device, and between the first front-end device and the second front-end device, are all transmitted through the inner band line in the printed circuit board.

[0010] In some possible implementations, the port blind-mating connector includes an input port blind-mating connector and an output port blind-mating connector disposed on the same side; Both the input port blind-mating connector and the output port blind-mating connector are SMPM connectors. Their transmission interfaces are surface-mounted on the printed circuit board and then connected to the printed circuit board by soldering.

[0011] In some possible implementations, the first front-end device includes an input circuit connected to an input port and an output circuit connected to an output port; the input circuit, the second front-end device, and the output circuit are connected in sequence.

[0012] In some possible implementations, the input circuit includes a limiter, a high-pass filter, a first amplifier, a first digitally controlled attenuator, and a first equalizer connected in sequence; the first equalizer is connected to a second front-end device; and the limiter is connected to an input port.

[0013] In some possible implementations, the output circuit includes a temperature compensation circuit, a second equalizer, a third amplifier, a second fixed attenuator, a coupler, a fourth amplifier, and a detector connected in sequence; the temperature compensation circuit is connected to a second front-end device.

[0014] In some possible implementations, The second front-end device includes a first single-pole double-throw switch, a first-stage low-noise amplifier, a second single-pole double-throw switch, a low-pass filter, a third single-pole double-throw switch, a second-stage low-noise amplifier, a fourth single-pole double-throw switch, and a second amplifier, which are connected in sequence to the first equalizer; the second amplifier is connected to a temperature compensation circuit. The first single-pole double-throw switch is connected to the second single-pole double-throw switch, and the third single-pole double-throw switch is connected to the fourth single-pole double-throw switch.

[0015] In some possible implementations, the radio frequency coaxial connector is an SMPM connector; the positioning component is a pin, and pin holes for cooperating with the pin are provided on the antenna and composite substrate; the composite substrate is a high-low frequency mixed voltage composite substrate.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: This invention significantly reduces the size and weight of the front-end module by blind-interlocking interconnection between the high- and low-frequency mixed voltage composite substrate, the antenna, the composite substrate, and the front-end module, making it easy to integrate into the system. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the composite substrate and substrate coupler in this invention; Figure 3 This is a schematic diagram of the composite substrate near the front-end module in this invention; Figure 4 This is a side view of the substrate in this invention; Figure 5 This is a top view of the antenna in this invention; Figure 6 This is a side view of the antenna and positioning components in this invention; Figure 7 This is a schematic diagram of the side of the antenna near the composite substrate in this invention; Figure 8 This is a top view of Embodiment 1 of the present invention; Figure 9 This is a side view of Embodiment 1 of the present invention; Figure 10 This is a schematic diagram of the connection between the front-end module and the composite substrate in Embodiment 1 of the present invention; Figure 11 This is a top view of Embodiment 2 of the present invention; Figure 12 This is a side view of Embodiment 2 of the present invention; Figure 13 This is a schematic diagram of the connection between the front-end module and the composite substrate in Embodiment 2 of the present invention; Figure 14 This is a schematic diagram of the link layout of the input circuit and output circuit in Embodiment 1 or Embodiment 2 of the present invention; Figure 15 This is a schematic diagram of the link layout of the second front-end device in this invention; Wherein: 1-Antenna, 11-Radiating patch, 2-RF coaxial connector, 3-Composite substrate, 31-Substrate coupler, 32-RF socket, 33-Low-frequency connector, 34-Detector, 35-Driver, 36-Self-test RF connector, 37-Power supply control low-frequency connector, 4-Front-end module, 41-First front-end device, 42-Second front-end device, 43-Printed circuit board, 44-Blind-mating connector, 45-Pad, 46-Limiter, 47-High-pass filter, 48-First amplifier, 49-First digitally controlled attenuator, 410-First equalizer, 4 11-First single-pole double-throw switch, 412-First stage low-noise amplifier, 413-Second single-pole double-throw switch, 414-Low-pass filter, 415-Third single-pole double-throw switch, 416-Second stage low-noise amplifier, 417-Fourth single-pole double-throw switch, 418-Second amplifier, 419-Temperature compensation circuit, 420-Second equalizer, 421-Third amplifier, 422-Second fixed attenuator, 423-Coupled, 424-Fourth amplifier, 425-Detector, 426-Power converter, 427-Capacitor, 430-Single-pole single-throw switch. Detailed Implementation

[0018] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," etc., do not indicate a quantity limitation, but rather indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. For example, multiple positioning posts refer to two or more positioning posts. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0019] The present invention will now be described in detail.

[0020] Example 1: like Figures 1-10 , Figure 14 , Figure 15 As shown: A radio frequency direction finding front-end module includes an antenna 1, a composite substrate 3 connected to the antenna 1, multiple front-end modules 4 located on the side of the composite substrate 3 away from the antenna 1 and plugged into the composite substrate 3, a radio frequency coaxial connector 2 disposed between the antenna 1 and the composite substrate 3 for connecting the antenna 1 and the composite substrate 3, and a positioning component for fixing the antenna 1 and the composite substrate 3.

[0021] Front-end module 4 has a complete channel that can be expanded arbitrarily according to the scale of the application, and has strong versatility; Antenna 1 and composite substrate 3 are stacked, with antenna 1 positioned on top of composite substrate 3 and the two connected by radio frequency coaxial connector 2 to achieve interconnection. The front-end module 4 is located on the side of the substrate away from the antenna 1 and is connected to the composite substrate 3 by interlocking. Antenna 1 transmits radio frequency signals to composite substrate 3, which are then processed by front-end module 4 and output to composite substrate 3 again. Composite substrate 3 detects the processed radio frequency signals, converts them into voltage signals, and outputs them to back-end signal processors via low-frequency connector 33 for amplitude comparison and direction finding.

[0022] In some possible implementations, the RF coaxial connector 2 is an SMPM connector. Further, the SMPM RF connector is selected as a type without escapement force to reduce insertion and extraction force. The positioning component is a pin, and pin holes are provided on the antenna 1 and the composite substrate 3 to cooperate with the pin. Precise insertion and extraction positioning is achieved through the cooperation between the pin holes and the pin. The composite substrate 3 is a high-low frequency mixed voltage composite substrate 3, which has functions such as coupling correction, radio frequency signal transmission, power supply and control signal transmission.

[0023] In some possible implementations, multiple sets of front-end modules 4 are provided on the side of the antenna 1 away from the composite substrate 3, and the radio frequency coaxial connector 2 is provided in a one-to-one correspondence with the radiating patch 11. A substrate coupler 31 is provided in the composite substrate 3, which corresponds one-to-one with the radiating patch 11. The substrate coupler 31 is embedded in the composite substrate 3 and is connected to the input port provided on the composite substrate 3 through the power divider network, thereby realizing the coupling correction of radio frequency signals.

[0024] The radiating patch 11 is a microstrip antenna 1 array pattern, which can be changed according to the operating frequency band requirements; when the operating bandwidth cannot meet the requirements, the antenna 1 can be replaced as a whole with other antennas 1 with a wider operating bandwidth; Both ends of the RF coaxial connector 2 are plugs. The plugs are replaced with sockets set on the antenna 1 and the composite substrate 3 to achieve plug-in interconnection.

[0025] In some possible implementations, in order to effectively realize the interlocking and interconnection between the composite substrate 3 and the front-end module 4, and to enable the composite substrate 3 to have functions such as radio frequency signal transmission, power supply and control signal transmission; On the side of the composite substrate 3 near the front-end module 4, there are RF socket 32, detector 34, low-frequency connector 33, driver 35, self-test RF connector 36 installed in the input port, and power supply control low-frequency connector 37; the RF socket 32, detector 34, and low-frequency connector 33 are respectively connected to the front-end module 4 and are arranged in a one-to-one correspondence.

[0026] Furthermore, the detector 34 is a continuous detector logarithmic video amplifier (SDLVA); Among them, there are two radio frequency sockets 32 corresponding to each group of front-end modules 4; In some possible implementations, the front-end module 4 includes a printed circuit board 43, a first front-end device 41 and a second front-end device 42 disposed on the same side of the printed circuit board 43, a port blind-mating connector 44 disposed on the radio frequency interface of the printed circuit board 43 and connected to the radio frequency socket 32, and a pad 45 disposed corresponding to the low-frequency socket and disposed at the low-frequency interface of the printed circuit board 43; the pad 45 is interconnected with the low-frequency connector 33 by interlocking. The radio frequency signals between the port blind-mating connector 44 and the first front-end device 41, and between the first front-end device 41 and the second front-end device 42, are all transmitted through the inner band line in the printed circuit board 43.

[0027] The radio frequency signals between the port blind-mating connector 44 and the first front-end device 41, and between the first front-end device 41 and the second front-end device 42, are all transmitted through the inner band line in the printed circuit board 43.

[0028] The printed circuit board 43 is provided with a mounting position for fixing the printed circuit board 43 to the heat-conducting plate.

[0029] The mounting positions are multiple semi-circular slots located on both sides of the printed circuit board 43 symmetrically and on the opposite side of the port blind connector 44; the printed circuit board 43 can be fixed to the heat-conducting plate using head screws.

[0030] In some possible implementations, the port blind-mating connector 44 is disposed corresponding to the radio frequency socket 32 ​​on the substrate, including an input port blind-mating connector 44 and an output port blind-mating connector 44 disposed on the same side; Both the input port blind-mating connector 44 and the output port blind-mating connector 44 are SMPM connectors. Their transmission interfaces are surface-mounted and soldered onto the printed circuit board 43, and then connected to the printed circuit board 43 by soldering.

[0031] The SMPM connector is used for mating connection with the RF socket 32 ​​on the composite substrate 3; The SMPM connector has four pins on the through-hole printed circuit board 43. Its signal transmission interface is surface-mounted on the printed circuit board 43, and the four pins are also reinforced by soldering to enhance the reliability during blind mating. In some possible implementations, the first front-end device 41 includes an input circuit connected to an input port and an output circuit connected to an output port; the input circuit, the second front-end device 42, and the output circuit are connected in sequence.

[0032] In some possible implementations, the input circuit includes a limiter 46, a high-pass filter 47, a first amplifier 48, a first digitally controlled attenuator 49, and a first equalizer 410 connected in sequence; the first equalizer 410 is connected to a second front-end device 42; and the limiter 46 is connected to an input port.

[0033] The radio frequency signal enters the first front-end device 41 through the SMPM connector of the input port, and after passing through the limiter 46, high-pass filter 47, first amplifier 48, first digitally controlled attenuator 49, and first equalizer 410, it is output to the second front-end device 42. In some possible implementations, the output circuit includes a temperature compensation circuit 419, a second equalizer 420, a third amplifier 421, a second fixed attenuator 422, a coupler 423, a fourth amplifier 424, and a detector 425 connected in sequence; the temperature compensation circuit 419 is connected to the second front-end device 42.

[0034] After passing through the second front-end device 42, the radio frequency signal enters the output circuit of the first front-end device 41 via the internal wiring of the printed circuit board 43. After passing through the temperature compensation circuit 419, the second equalizer 420, the third amplifier 421, the second fixed attenuator 422, and the coupler 423, part of the radio frequency signal is output from the SMPM connector provided on the output port. At the same time, the radio frequency signal is output from its coupling end after passing through the coupler 423, and is output through the fourth amplifier 424, the detector 425, and the pad 45 provided at the low frequency interface.

[0035] In some possible implementations, the second front-end device 42 includes a first single-pole double-throw switch 411, a first-stage low-noise amplifier 412, a second single-pole double-throw switch 413, a low-pass filter 414, a third single-pole double-throw switch 415, a second-stage low-noise amplifier 416, a fourth single-pole double-throw switch 417, and a second amplifier 418, which are connected in sequence to the first equalizer 410; the second amplifier 418 is connected to a temperature compensation circuit 419. The first single-pole double-throw switch 411 is connected to the second single-pole double-throw switch 413, and the third single-pole double-throw switch 415 is connected to the fourth single-pole double-throw switch 417.

[0036] The radio frequency signal is transmitted to the second front-end device 42 via the internal wiring of the printed circuit board 43. After passing through the first single-pole double-throw switch 411, the first-stage low-noise amplifier 412, the second single-pole double-throw switch 413, the low-pass filter 414, the third single-pole double-throw switch 415, the second-stage low-noise amplifier 416, the fourth single-pole double-throw switch 417, and the low-pass filter 414, it is output to the output circuit of the first front-end device 41. Furthermore, printed circuit board 43 is a digital-analog hybrid composite substrate.

[0037] The first front-end device 41 also includes a power converter 426 and a capacitor 427.

[0038] The power converter 426 is used to convert the external input power signal into the voltage value required by the internal circuitry, so as to prevent the poor quality of the external power signal from affecting the working state of the internal components of the front-end module; the capacitor 427 filters the power signal. The front-end module using this embodiment has a front-end thickness of 4mm and a weight of less than 20g, while the traditional hybrid integrated RF front-end module has a thickness of more than 8mm and a weight of more than 50g, which can greatly reduce the size and weight of the receiving array.

[0039] Example 2: like Figures 1-7 , Figures 11-15 As shown: The difference between this embodiment and embodiment 2 is that the first front-end device 41 and the second front-end device 42 are located on the printed circuit board in different positions. In this embodiment, the first front-end device 41 and the second front-end device 42 are on two symmetrical sides, namely the front and back sides of the printed circuit board. The front-end module used in this embodiment has a thickness of 7mm and a weight of less than 20g, while the traditional hybrid integrated RF front-end module has a thickness of more than 8mm and a weight of more than 50g, which can greatly reduce the size and weight of the receiving array.

[0040] The other structures of this embodiment are the same as those of Embodiment 1, and will not be described in detail here; When the front-end module (first front-end device, second front-end device) operates with a wide frequency band, the filter bank can filter out unwanted signals within the passband; the first digitally controlled attenuator is used to adjust the average gain of the front-end module and the amplitude consistency among multiple components; the first equalizer and the second equalizer can improve the gain flatness of the entire front-end module; the power converter is used to convert the external input power signal into the voltage value required internally, preventing the poor quality of the external power signal from affecting the working state of the internal devices of the front-end module; the three-stage amplifier formed by the first amplifier 48, the second amplifier 418, and the third amplifier 421 can offset the insertion loss of passive devices in the link, and at the same time, it works with the first digitally controlled attenuator to adjust to obtain the ideal gain value.

[0041] This invention is particularly suitable for receiver arrays, where each front-end module is a complete channel, which can be arbitrarily expanded according to the array size, exhibiting strong versatility. In array applications, each channel is completely independent, with channel isolation reaching 70dBc, compared to only 40dBc for ordinary multi-channel hybrid integrated front-end modules; the blind-mating design using SMPM connectors facilitates assembly, disassembly, and troubleshooting.

[0042] This invention uses a substrate coupler embedded in the substrate 3 that is plugged into the front-end module. The front-end module can receive signals input from the antenna end, perform coupling self-tests, report the working status of the front-end module, and detect faults in a timely manner and locate and repair them upon power-on.

[0043] Currently, commonly used high-reliability connectors such as the J30J series and J63 series are relatively large in size. For example, the size of a 25-pin J30J connector is 29.8×24.5×7.6mm, and the size of a J63 connector is 20.91×11.54×3.48mm. However, this invention draws on the gold finger pads commonly used in digital modules and integrates them on a composite substrate. Taking a single pad of 1.5×5mm and a spacing of 0.5mm as an example, the area of ​​a 25-pin connector is only 16×5mm, and the height is negligible. Compared with the J63 connector, the area is reduced by more than 67%, and the mating length is reduced by more than 50%.

[0044] Compared to the extremely high mating accuracy requirements of ordinary connectors in existing units, with mating accuracy requirements in the X / Y direction of ±0.02mm, which far exceeds the processing accuracy capabilities of printed circuit boards, the mating accuracy requirements of the pads proposed in this invention are greatly reduced, and ±0.1mm and above are acceptable.

[0045] The printed circuit board 43 in the first front-end device 41 and the second front-end device 42 respectively adopts hermetically sealed ceramic substrates, with a maximum area of ​​25×25mm, which can realize high-density complex function integration; compared with silicon-based substrates, the maximum size can only be 15×15mm, and the integration density is relatively high.

[0046] Furthermore, a single-pole single-throw switch 430 is provided between the limiter 46 and the high-pass filter 47; it is turned on during normal reception and turned off when the system acquires the noise floor to isolate external signals, eliminate electromagnetic signal interference in the space environment, and improve the system's receiving sensitivity.

[0047] A high-pass filter 47 is set before the first amplifier 48 to effectively filter out low-frequency signals and their harmonics outside the operating bandwidth, ensuring the accuracy of direction finding.

[0048] The first amplifier 48 is a low-noise amplifier. The first amplifier 48 adopts a high-gain, low-noise model. The low noise ensures the system sensitivity, and the high gain can effectively reduce the impact of subsequent links on the noise figure.

[0049] The switching filter formed by the single-pole double-throw switch and the filter in the second front-end device 42 effectively filters out large-signal interference from 4G and 5G communication in space when it is in broadband receiving mode, ensuring the accuracy of direction finding.

[0050] In the second front-end device 42, a low-pass filter 414 is provided between the first-stage low-noise amplifier 412 and the second-stage low-noise amplifier 416 to balance noise and filtering requirements. Placed after the first-stage low-noise amplifier 412, it reduces the impact on the noise figure; placed before the second-stage low-noise amplifier 416, it can promptly isolate high-frequency signals outside the operating frequency band, eliminate the influence of high-frequency out-of-band signals on the system noise floor, and improve the system's receiving sensitivity.

[0051] The first front-end device 41 includes a self-test branch formed by a fourth amplifier 424 and a detector 425, used for reporting operating status. A third amplifier 421 connects to a coupler 423, coupling the radio frequency signal in the link to the self-test branch. The self-test branch, equipped with a fourth amplifier 424, amplifies the coupled signal to the operating power range of the detector 425, which outputs a self-test voltage. The system loads a self-test signal from the input of the front-end module, and the output voltage from the coupled detector branch is used by the back-end processor to collect and report the operating status, promptly identifying and replacing faulty components.

[0052] The third amplifier 421 adopts the low-gain, high-output P-1 model, which neither affects the link noise nor compresses the receiving link under large signal input conditions, thus ensuring the linear dynamic range of the system.

[0053] This invention is not limited to the specific embodiments described above. The invention extends to any new feature or combination disclosed in this specification, as well as any new method or process step or combination disclosed herein.

Claims

1. A radio frequency direction finding front-end module, characterized in that, The device includes an antenna, a composite substrate connected to the antenna, multiple front-end modules located on the side of the composite substrate away from the antenna and plugged into the composite substrate, an RF coaxial connector disposed between the antenna and the composite substrate for connecting the antenna and the composite substrate, and a positioning component for fixing the antenna and the composite substrate. On the side of the composite substrate near the front-end module, there are RF sockets, detectors, low-frequency connectors, drivers, self-test RF connectors installed at the input ports, and power supply control low-frequency connectors; the RF sockets, detectors, and low-frequency connectors are respectively connected to the front-end module and are arranged in a one-to-one correspondence. The front-end module includes a printed circuit board, a first front-end device and a second front-end device disposed on the printed circuit board, a port blind-mating connector disposed on the radio frequency interface of the printed circuit board and connected to the radio frequency socket, and a pad disposed on the low-frequency interface of the printed circuit board corresponding to the low-frequency socket; the pads are interconnected with the low-frequency connector by interlocking. The first front-end device includes an input circuit connected to an input port and an output circuit connected to an output port; the input circuit, the second front-end device, and the output circuit are connected in sequence. The input circuit includes a limiter, a high-pass filter, a first amplifier, a first digitally controlled attenuator, and a first equalizer connected in sequence; the first equalizer is connected to a second front-end device; and the limiter is connected to the input port. The output circuit includes a temperature compensation circuit, a second equalizer, a third amplifier, a second fixed attenuator, a coupler, a fourth amplifier, and a detector connected in sequence; the temperature compensation circuit is connected to the second front-end device. The second front-end device includes a first single-pole double-throw switch, a first-stage low-noise amplifier, a second single-pole double-throw switch, a low-pass filter, a third single-pole double-throw switch, a second-stage low-noise amplifier, a fourth single-pole double-throw switch, and a second amplifier, which are connected in sequence to the first equalizer; the second amplifier is connected to a temperature compensation circuit. The first single-pole double-throw switch is connected to the second single-pole double-throw switch, and the third single-pole double-throw switch is connected to the fourth single-pole double-throw switch.

2. The radio frequency direction finding front-end module according to claim 1, characterized in that, On the side of the antenna away from the composite substrate, there are multiple sets of radiating patches corresponding to the front-end modules, and the radio frequency coaxial connectors are corresponding to the radiating patches. A substrate coupler is provided in the composite substrate, which corresponds one-to-one with the radiating patch.

3. The radio frequency direction finding front-end module according to claim 1, characterized in that, The radio frequency signals between the port blind-mating connector and the first front-end device, and between the first front-end device and the second front-end device, are all transmitted through the inner band line in the printed circuit board.

4. The radio frequency direction finding front-end module according to claim 3, characterized in that, The port blind-mating connector includes an input port blind-mating connector and an output port blind-mating connector arranged on the same side; Both the input port blind-mating connector and the output port blind-mating connector are SMPM connectors. Their transmission interfaces are surface-mounted on the printed circuit board and then connected to the printed circuit board by soldering.

5. A radio frequency direction finding front-end module according to any one of claims 1-4, characterized in that, The radio frequency coaxial connector is an SMPM connector; the positioning component is a pin, and pin holes for cooperating with the pin are provided on the antenna and the composite substrate; the composite substrate is a high-low frequency mixed voltage composite substrate.

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