Antenna device and communication module

Abstract

A dielectric block having a bottom surface includes: a conductive grounding member having an antenna grounding surface inclined with respect to the bottom surface; a power feeding element disposed apart from the antenna grounding surface and constituting a patch antenna together with the antenna grounding surface; a power feeding line connected to a power feeding point of the power feeding element; and a dielectric member supporting the power feeding element with respect to the grounding member. The bottom surface is taken as a reference of height, and the grounding member is exposed at the bottom surface on both sides of a lower side and an upper side of an isohypse passing through an intersection of a perpendicular line drawn from the power feeding point to an imaginary plane including the bottom surface and a plane including the antenna grounding surface.

Description

Technical Field

[0001] This invention relates to antenna devices and communication modules. Background Technology

[0002] Patent Document 1 discloses an antenna device capable of freely controlling the maximum gain angle of the directional pattern. In the antenna device disclosed in Patent Document 1, a dielectric holds the radiating element (power supply element) and the antenna ground (ground electrode). The dielectric is mounted on a circuit board so that the power supply element and the ground electrode form a predetermined tilt angle relative to the circuit board.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2004-235729 Summary of the Invention

[0004] Based on simulation experiments conducted by the inventors of this application, it has been determined that even when the power supply element and the ground electrode are tilted towards the direction where the maximum gain is desired, there are cases where the direction for obtaining the maximum gain is not tilted sufficiently towards the desired direction. The object of this invention is to provide an antenna device and a communication module that enables the direction for obtaining the maximum gain to be tilted towards the desired direction.

[0005] According to one aspect of the present invention, an antenna device is provided, comprising a dielectric block having a bottom surface, wherein the dielectric block includes: a conductive grounding member having an antenna ground plane inclined relative to the bottom surface; a power supply element disposed at a distance from the antenna ground plane and forming a patch antenna together with the antenna ground plane; a power supply line connected to a power supply point of the power supply element; and a dielectric member supporting the power supply element relative to the grounding member, wherein the grounding member is exposed on the bottom surface, with the bottom surface as a height reference, on both a side lower than and a side higher than the contour line of the intersection of a vertical line from the power supply point to an imaginary plane including the bottom surface and a plane including the antenna ground plane.

[0006] According to another aspect of the present invention, a communication module is provided, comprising: the antenna device described above; and a substrate having a substrate ground plane, wherein the dielectric block is mounted on the substrate in an orientation such that its bottom surface faces the substrate, and a portion of the grounding member exposed on its bottom surface is electrically connected to the substrate ground plane, and further comprising a circuit element supported on the substrate and housed in the recess.

[0007] According to another aspect of the present invention, an antenna device is provided, comprising: a dielectric component having a bottom surface and a side surface; a conductive grounding component disposed on the dielectric component having an antenna ground plane inclined relative to the bottom surface; a power supply element disposed on the dielectric component, arranged at a distance from the antenna ground plane, and forming a patch antenna together with the antenna ground plane; and a power supply line connected to a power supply point of the power supply element, wherein the bottom surface is used as a height reference, and the grounding component is exposed on either the bottom surface or the side surface, on both sides of the contour line which is lower than or higher than the intersection of a vertical line from the power supply point to an imaginary plane including the bottom surface and a plane including the antenna ground plane.

[0008] By connecting the exposed area of ​​the grounding component on the bottom surface to the ground of the mounting substrate, the ground potential of the antenna ground plane is stabilized. This allows the antenna ground plane to tilt in the desired direction to achieve maximum gain, following its tilt. Attached Figure Description

[0009] Figure 1A as well as Figure 1B These are, respectively, a cross-sectional view and a top view of the antenna device of the first embodiment.

[0010] Figure 2A as well as Figure 2B These are perspective views of the first embodiment of the simulated object and the antenna device of the comparative example, respectively.

[0011] Figure 3A This is a graph showing the frequency dependence of the reflection coefficient S11. Figure 3B This is a graph representing the dependence of the gain on the angle θ. Figure 3C It is a graph showing the frequency dependence of peak gain.

[0012] Figure 4 This is a cross-sectional view of the antenna device of the second embodiment.

[0013] Figure 5A This is a graph showing the simulation results of the pointing characteristics of the antenna device according to the second embodiment. Figure 5B This is a diagram showing the coordinate system defined by the antenna device of the second embodiment.

[0014] Figure 6A These are graphs showing the simulation results of the pointing characteristics of the comparative antenna device. Figure 6B This is a diagram showing the coordinate system defined by the antenna device of the comparative example.

[0015] Figure 7A as well as Figure 7B These are perspective views of the second embodiment of the simulated object and the antenna device of the comparative example, respectively.

[0016] Figure 8A This is a graph showing the frequency dependence of the reflection coefficient S11. Figure 8B This is a graph representing the dependence of the gain on the angle θ. Figure 8C It is a graph showing the frequency dependence of peak gain.

[0017] Figure 9A as well as Figure 9B These are, respectively, a cross-sectional view and a top view of the antenna device of a modified example of the second embodiment.

[0018] Figure 10A This is a cross-sectional view of the antenna device according to the third embodiment. Figure 10B It is a top sectional view of the power supply lines and connecting components. Figure 10C This is a top sectional view of the power supply line and connecting components of the antenna device in a modified embodiment of the third embodiment.

[0019] Figure 11A , Figure 11B ,as well as Figure 11C This is a cross-sectional view of the lower end of the connecting member included in the antenna device of another variation of the third embodiment.

[0020] Figure 12A as well as Figure 12B These are, respectively, a cross-sectional view and a top view of the antenna device according to the fourth embodiment. Figure 12C This is a top view of the antenna assembly with the connecting components offset towards the lowest edge of the antenna ground plane.

[0021] Figure 13A as well as Figure 13B These are, respectively, a cross-sectional view and a top view of the antenna device according to the fifth embodiment. Figure 13C This is a top view of the antenna device of a modified example of the fifth embodiment.

[0022] Figure 14A as well as Figure 14B This is a top view of the antenna device of a modified example of the fifth embodiment.

[0023] Figure 15A This is a cross-sectional view of the antenna device according to the sixth embodiment. Figure 15B This is a cross-sectional view of an antenna device according to a variation of the sixth embodiment.

[0024] Figure 16 This is a top view of the antenna device according to the seventh embodiment.

[0025] Figure 17 This is a cross-sectional view of an antenna device according to a variation of the seventh embodiment.

[0026] Figure 18 This is a cross-sectional view of the antenna device according to the eighth embodiment.

[0027] Figure 19A as well as Figure 19B These are perspective views of the antenna devices simulating the second and eighth embodiments, respectively.

[0028] Figure 20A This is a graph showing the frequency dependence of the reflection coefficient S11. Figure 20B This is a graph representing the dependence of the angle θ on the gain. Figure 20C It is a graph showing the frequency dependence of peak gain.

[0029] Figure 21 This is a cross-sectional view of the antenna device according to the ninth embodiment.

[0030] Figure 22A This is a cross-sectional view of the antenna device according to the tenth embodiment. Figure 22B This is a cross-sectional view of the antenna device of a modified example of the tenth embodiment. Figure 22C This is a cross-sectional view of an antenna device of another variation of the tenth embodiment.

[0031] Figure 23 This is a cross-sectional view of the antenna device according to the eleventh embodiment.

[0032] Figure 24A as well as Figure 24B These are cross-sectional views of the antenna device of the twelfth embodiment and its variations.

[0033] Figure 25 This is a cross-sectional view of the antenna device in the thirteenth embodiment (reference example).

[0034] Figure 26A as well as Figure 26B These are perspective views of the antenna devices of the fourteenth embodiment and the comparative example, respectively.

[0035] Figure 27 This indicates that the fourteenth embodiment ( Figure 26A ) and comparative examples ( Figure 26B A chart showing the simulation results of the radiation pattern of the antenna device when it performs phased array operation. Detailed Implementation

[0036] [First Embodiment]

[0037] Reference Figures 1A to 3C The antenna device of the first embodiment will be described with reference to the accompanying drawings. Figure 1A as well as Figure 1B These are, respectively, a cross-sectional view and a top view of the antenna device of the first embodiment. Figure 1B The cross-sectional view at the single-dotted line 1A-1A is equivalent to Figure 1A .

[0038] A dielectric block 40 is mounted on a substrate 20. The substrate 20 includes a first ground conductor 21 disposed on one surface, a second ground conductor 22 disposed on the other surface, and a power supply line 23. The surface of the first ground conductor 21 is referred to as the substrate ground plane 20A. The power supply line 23 includes a strip 23A, a through-hole conductor 23B, and a pad 23C. The strip 23A is disposed between the first ground conductor 21 and the second ground conductor 22, and the pad 23C is disposed within an opening provided in the first ground conductor 21. The through-hole conductor 23B connects the strip 23A and the pad 23C.

[0039] As the substrate 20, low-temperature simultaneous firing (LTCC) ceramic multilayer substrates, multilayer resin substrates, and low-temperature simultaneous firing ceramic multilayer substrates other than ceramics can be used. Examples of resin materials for multilayer resin substrates include epoxy resin, polyimide resin, liquid crystal polymers with low dielectric constant, and fluorinated resins. The first ground conductor 21, the second ground conductor 22, the strip 23A, the through-hole conductor 23B, and the pad 23C are formed of metals such as Al, Cu, Au, and Ag, or alloys with these metals as the main components.

[0040] The dielectric block 40 includes a grounding component 41, a power supply element 42, a non-power supply element 43, a power supply line 44, and a dielectric component 50. Additionally, the dielectric block 40 has a bottom surface 40A opposite to the substrate 20. The grounding component 41, power supply element 42, non-power supply element 43, and power supply line 44 are formed of conductive materials, such as metals like Al, Cu, Au, and Ag, or alloys with these metals as the main components. The grounding component 41 is exposed on the bottom surface 40A of the dielectric block 40 and is connected and fixed to the substrate ground plane 20A via a solder layer 80. The grounding component 41 has an antenna ground plane 41A that is inclined relative to the substrate ground plane 20A. The antenna ground plane 41A faces the side opposite to the substrate 20 side.

[0041] The power supply element 42 is a plate-shaped conductive component that is spaced apart from and parallel to the antenna ground plane 41A. The power supply element 42 and the antenna ground plane 41A together constitute a patch antenna.

[0042] A non-powered element 43 is disposed at a distance from the power supply element 42, and the non-powered element 43 is mounted on the power supply element 42. The antenna ground plane 41A, the power supply element 42, and the non-powered element 43 form a stacked patch antenna. Alternatively, the non-powered element 43 may be omitted.

[0043] A power supply line 44 is connected to the power supply point 42A of the power supply element 42. The power supply line 44 intersects the antenna ground plane 41A from the power supply point 42A and extends toward the bottom surface 40A of the dielectric block 40 through a through hole 41H provided in the grounding member 41. At the intersection of the power supply line 44 and the antenna ground plane 41A, insulation between the power supply line 44 and the antenna ground plane 41A is ensured. That is, the grounding member 41 includes the portion surrounding the power supply line 44 from the bottom surface 40A of the dielectric block 40 to the antenna ground plane 41A. The leading end of the power supply line 44 is exposed on the bottom surface 40A of the dielectric block 40 and is connected to the pad 23C of the substrate 20 via another solder layer 80.

[0044] The dielectric component 50 supports the power supply element 42, the non-power supply element 43, and the power supply line 44 relative to the grounding component 41, and fixes their relative positional relationship. The dielectric component 50 has an inclined surface 50A parallel to the antenna ground plane 41A and a side surface 50C substantially perpendicular to the bottom surface 40A of the dielectric block 40. The inclined surface 50A is continuous with the side surface 50C over its entire outer periphery. When viewed from above the antenna ground plane 41A, the power supply element 42 is contained within the inclined surface 50A. Furthermore, when viewed from above the antenna ground plane 41A, the non-power supply element 43 is contained within the power supply element 42, and the power supply element 42 is contained within the antenna ground plane 41A.

[0045] A perpendicular line from power supply point 42A to an imaginary plane containing the bottom surface 40A of dielectric block 40 intersects an imaginary plane containing antenna ground plane 41A. This intersection point is marked as PX. Using the bottom surface 40A of dielectric block 40 as a height reference, a contour line on the imaginary plane containing the antenna ground plane 41A passing through the intersection point PX is marked as LC. Here, a "contour line" refers to a line connecting points at equal heights to the bottom surface 40A on the imaginary plane containing antenna ground plane 41A. When viewed from above, the grounding component 41 is exposed on the bottom surface 40A of dielectric block 40 on both the side PL, which is lower than the contour line LC, and the side PH, which is higher than the contour line LC. That is, the antenna ground plane 41A is connected to the substrate ground plane 20A via the grounding component 41 on both the side PL, which is lower than the contour line LC, and the side PH, which is higher than the contour line LC. Here, "antenna ground plane 41A is connected to substrate ground plane 20A via grounding member 41" means that grounding member 41 has a conductive path extending from antenna ground plane 41A in a direction intersecting with antenna ground plane 41A to substrate ground plane 20A. In particular, in the first embodiment, grounding member 41 is composed of a block of conductors, so antenna ground plane 41A is connected to substrate ground plane 20A throughout its entire area via grounding member 41.

[0046] The dielectric block 40 of the antenna device in the first embodiment can be shaped, for example, using a 3D printer.

[0047] Next, the superior effects of the first embodiment will be explained.

[0048] The antenna ground plane 41A and the power supply element 42 are tilted relative to the substrate ground plane 20A, so the direction of the main beam is tilted relative to the substrate ground plane 20A.

[0049] Generally, the power supply element 42 of the patch antenna has a size approximately half the wavelength of the radio wave in the operating frequency domain. The antenna ground plane 41A is slightly larger than the power supply element 42, and therefore the antenna ground plane 41A is larger than half the wavelength of the radio wave in the operating frequency domain. When the antenna ground plane 41A is connected to the substrate ground plane 20A only at its lowermost end, a potential difference equivalent to a phase difference of more than 180° is generated between the uppermost and lowermost ends of the antenna ground plane 41A.

[0050] In the first embodiment, the grounding component 41 is exposed on the bottom surface 40A of the dielectric block 40 on both the side PL (lower than the contour line LC) and the side PH (higher than the contour line LC). The exposed area is connected to the substrate ground plane 20A via the solder layer 80. With this structure, the ground potential of the antenna ground plane 41A is more stable compared to a structure where the antenna ground plane 41A is only connected to the substrate ground plane 20A at its lowest point. Here, "stable ground potential" means that the potential of the antenna ground plane 41A is close to the potential of the substrate ground plane 20A throughout its entire area. In particular, in the first embodiment, the entire area of ​​the antenna ground plane 41A is connected to the substrate ground plane 20A via the grounding component 41, thus achieving a higher degree of stability in the ground potential of the antenna ground plane 41A. By stabilizing the ground potential of the antenna ground plane 41A, the excellent effect of facilitating directional control of the antenna device is achieved.

[0051] Furthermore, in the first embodiment, the power supply line 44 is disposed within the through hole 41H of the grounding member 41. That is, the power supply line 44 is surrounded by the grounding member 41. Therefore, the impedance of the power supply line 44 can be managed. For example, the characteristic impedance of the power supply line 44 in the dielectric block 40 can be matched with the characteristic impedance of the power supply line 23 in the substrate 20.

[0052] Next, refer to Figures 2A to 3C The accompanying drawings illustrate the impedance management of the power supply line and the radiation characteristics of the antenna device of the first embodiment. Simulations are provided for the reflection coefficient S11, the angle dependence of the realized gain, and the peak realized gain of the antenna devices of the first embodiment and the comparative example.

[0053] Figure 2A as well as Figure 2BThese are perspective views of the first embodiment of the simulated object and the antenna device of the comparative example, respectively. The power supply element 42 and the non-power supply element 43 have a shape in which the four corners of a square are cut into squares. The antenna device of the comparative example ( Figure 2B The antenna ground plane 41A is only connected to the substrate ground plane 20A at its lower end (in Figure 2A , Figure 2B (The text is omitted here.)

[0054] Define the bottom surface 40A of the dielectric block 40 as an orthogonal xyz coordinate system of the xy plane. Define the direction from the bottom surface 40A toward the power supply element 42 as the positive z-axis. Define the tilt direction of the antenna ground plane 41A as the x-axis. Define the tilt angle α when the negative edge of the antenna ground plane 41A on the x-axis is lifted as positive, and the tilt angle α when the positive edge of the x-axis is lifted as negative. A power supply point 42A is arranged at a position on the negative x-axis side of the power supply element 42. Define the angle θ when tilting from the positive z-axis direction toward the x-axis direction. Define the angle θ when tilting from the positive z-axis direction toward the positive x-axis direction as positive, and the angle θ when tilting toward the negative x-axis direction as negative.

[0055] The power supply point 42A is located on the negative side of the x-axis, relative to the geometric center of the power supply element 42. That is, as the tilt angle α increases in the positive direction, the power supply line 44 becomes longer. Conversely, as the tilt angle α increases in the negative direction, the power supply line 44 becomes shorter.

[0056] Figure 3A This is a graph showing the frequency dependence of the reflection coefficient S11. The horizontal axis represents frequency in "GHz", and the vertical axis represents the reflection coefficient S11 in "dB". Figure 3A The solid lines and dashed lines in the text represent the first embodiment ( Figure 2A ) and comparative examples ( Figure 2B The reflection coefficient S11 of the antenna device is given. Furthermore, the tilt angle α is assumed to be -45°.

[0057] It can be seen that in the antenna device of the first embodiment, the reflection coefficient S11 is less than -10dB in a bandwidth of approximately 7GHz centered at a frequency of 58GHz. In contrast, it can be seen that in the antenna device of the comparative example, the reflection coefficient S11 is larger, and the impedance management is insufficient.

[0058] Figure 3B This is a graph showing the dependence of the achieved gain on the angle θ. The horizontal axis represents the angle θ in degrees, and the vertical axis represents the achieved gain in dBi. Figure 3B The solid lines and dashed lines in the text represent the first embodiment ( Figure 2A ) and comparative examples ( Figure 2BThe gain of the antenna device is calculated. Furthermore, the frequency is set to 60 GHz, and the tilt angle α is set to -45°.

[0059] It can be seen that in the antenna device of the first embodiment, the maximum gain is achieved at an angle θ = -45°, and the direction of the main beam is tilted corresponding to the tilt of the antenna ground plane 41A. In contrast, it can be seen that in the antenna device of the comparative example, even if the antenna ground plane 41A is tilted, the gain achieved in the θ = -45° direction is not higher than that of the first embodiment.

[0060] Figure 3C This is a graph showing the frequency dependence of peak realized gain. The horizontal axis represents frequency in "GHz", and the vertical axis represents peak realized gain in "dBi". Figure 3C The solid lines and dashed lines in the text represent the first embodiment ( Figure 2A ) and comparative examples ( Figure 2B The peak gain of the antenna device is calculated. Furthermore, the tilt angle α is set to -45°.

[0061] It can be seen that the antenna device in the first embodiment achieves a larger peak gain than the antenna device in the comparative example.

[0062] according to Figure 3A , Figure 3B ,as well as Figure 3C The simulation results shown confirm that by adopting the structure of the antenna device of the first embodiment, impedance management can be easily performed, and the main beam can be directed in the desired direction.

[0063] [Second Embodiment]

[0064] Next, refer to Figures 4 to 8C The antenna device of the second embodiment will be described with reference to the accompanying drawings. Hereinafter, the antenna device will be described in relation to the reference drawings. Figures 1A to 3C The antenna device of the first embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0065] Antenna device in the first embodiment ( Figure 1A In the first embodiment, the inclined surface 50A of the dielectric component 50 is continuous with the side surface 50C over its entire outer periphery. In contrast, in the antenna device of the second embodiment, the dielectric component 50 has a shape in which its top is cut off by a plane parallel to the substrate ground plane 20A. That is, the dielectric component 50 has a top surface 50B parallel to the substrate ground plane 20A. Also in the second embodiment, when viewed from above the antenna ground plane 41A, the power supply element 42 is included in the inclined surface 50A.

[0066] Next, the superior effects of the second embodiment will be explained.

[0067] In the second embodiment, similarly to the first embodiment, by stabilizing the grounding potential of the antenna ground plane 41A, the superior effect of making directional control of the antenna device easier is achieved. Furthermore, as in the first embodiment, the impedance of the power supply line 44 can be managed.

[0068] Furthermore, in the second embodiment, the dimension of the dielectric block 40 in the height direction is smaller compared to the first embodiment. Therefore, a thinner antenna device can be achieved. Also, the dielectric block 40 can be mounted on the substrate 20 by using a pick-and-place machine to adhere the top surface 50B. Therefore, the dielectric block 40 can be easily mounted on the substrate 20.

[0069] To confirm the superior performance of the antenna device in the second embodiment, a simulation of its pointing characteristics was performed. Next, referring to... Figures 5A to 6B The accompanying drawings illustrate the simulation results. In the simulation, the frequency was set to 60 GHz, and the size of the dielectric block 40 was optimized for 60 GHz. Simulations were performed for the antenna devices of the second embodiment and the comparative example.

[0070] Figure 5A This is a graph showing the simulation results of the pointing characteristics of the antenna device according to the second embodiment. Figure 5B This is a cross-sectional view and a diagram showing the coordinate system of the antenna device according to the second embodiment. The definition and reference of the xyz orthogonal coordinate system, angle θ, and tilt angle α are also shown. Figure 2A as well as Figure 2B The definitions are the same. Power supply point 42A is located on the positive side of the x-axis, closer to the geometric center of power supply element 42. Therefore, as the tilt angle α increases in the positive direction, the power supply line 44 becomes shorter. Conversely, as the tilt angle α increases in the negative direction, the power supply line 44 becomes longer.

[0071] Figure 5A The horizontal axis represents angle θ in degrees, and the vertical axis represents the gain in dBi. With a tilt angle α of 0°, i.e., when the antenna ground plane 41A is parallel to the bottom surface 40A of the dielectric block 40, the maximum gain is achieved in the direction where angle θ is approximately 0°. If the tilt angle α is increased in the positive direction, the angle θ for maximum gain increases in the positive direction. Conversely, if the tilt angle α is increased in the negative direction, the angle θ for maximum gain increases in the negative direction. For example, maximum gain can be achieved in any direction within the range of angle θ from -45° to +45°. That is, the main beam can be directed in any direction within a range of ±45° from the normal direction of the substrate ground plane 20A.

[0072] Figure 6A These are graphs showing the simulation results of the pointing characteristics of the comparative antenna device. Figure 6B This is a cross-sectional view and a coordinate system diagram showing the antenna device of the comparative example.

[0073] In the comparative examples, such as Figure 6B As shown, the antenna ground plane 41A is connected to the substrate ground plane 20A only at its lower end. That is, when the tilt angle α is positive, the edge of the antenna ground plane 41A on the positive side of the x-axis is connected to the substrate ground plane 20A; when the tilt angle α is negative, the edge of the antenna ground plane 41A on the negative side of the x-axis is connected to the substrate ground plane 20A. The definitions of other structures, coordinate systems, tilt angle α, and angle θ are the same as those in the diagram. Figure 5B The situation is the same in the second embodiment shown.

[0074] Figure 6A The horizontal axis represents angle θ in degrees, and the vertical axis represents the gain in dBi. When the tilt angle α is 0°, i.e., the antenna ground plane 41A is parallel to the substrate ground plane 20A, the maximum gain is achieved in the direction where angle θ is approximately 0°. If the tilt angle α is increased in the positive direction, the angle θ at which the maximum gain is achieved increases in the positive direction. However, even if the tilt angle α is increased in the negative direction, the angle θ at which the maximum gain is achieved does not increase in the negative direction. In the comparative example, even if the antenna ground plane 41A is tilted, the direction of the main beam cannot be controlled to the desired direction.

[0075] In the comparative example, the direction of the main beam cannot be controlled because the antenna ground plane 41A is only connected to the substrate ground plane 20A at its lower end. In this structure, the antenna ground plane 41A does not function as a ground for the antenna. In contrast, in the second embodiment, the ground potential of the antenna ground plane 41A is stable, thereby allowing the direction of the main beam to be controlled by following the tilt of the antenna ground plane 41A.

[0076] Next, refer to Figures 7A to 8C The accompanying drawings illustrate the impedance management of the power supply line and the radiation characteristics of the antenna device of the second embodiment. Simulations were performed for the reflection coefficient S11, the angle dependence of the achieved gain, and the peak achieved gain of the antenna devices of the second embodiment and the comparative example.

[0077] Figure 7A as well as Figure 7B These are perspective views of the second embodiment of the simulated object and the antenna device of the comparative example, respectively. The power supply element 42 and the non-power supply element 43 have square cutouts at the four corners of a square. The antenna device of the comparative example ( Figure 7B )and Figure 6B The antenna device of the comparative example shown is similar, except that it is connected to the substrate ground plane 20A at the lower end of the antenna ground plane 41A. Figure 7A , Figure 7B (The text is omitted here.) The definition and reference of the xyz orthogonal coordinate system, the tilt angle α, and the angle θ. Figure 5B as well as Figure 6B The definitions used are the same.

[0078] Figure 8A This is a graph showing the frequency dependence of the reflection coefficient S11. The horizontal axis represents frequency in "GHz", and the vertical axis represents the reflection coefficient S11 in "dB". Figure 8A The solid and dashed lines in the text represent the second embodiment ( Figure 7A ) and comparative examples ( Figure 7B The reflection coefficient S11 of the antenna device is given. Furthermore, the tilt angle α is assumed to be -45°.

[0079] It can be seen that in the antenna device of the second embodiment, the reflection coefficient S11 is less than -10dB in a bandwidth of approximately 7GHz centered at a frequency of 61GHz. In contrast, it can be seen that in the antenna device of the comparative example, the reflection coefficient S11 is larger, and the impedance management is insufficient.

[0080] Figure 8B This is a graph showing the dependence of the achieved gain on the angle θ. The horizontal axis represents the angle θ in degrees, and the vertical axis represents the achieved gain in dBi. Figure 8B The solid and dashed lines in the text represent the second embodiment ( Figure 7A ) and comparative examples ( Figure 7B The gain of the antenna device is calculated. Furthermore, the frequency is set to 60 GHz, and the tilt angle α is set to -45°.

[0081] It can be seen that in the antenna device of the second embodiment, the direction of the main beam is tilted in accordance with the tilt of the antenna ground plane 41A. In contrast, it can be seen that in the antenna device of the comparative example, even if the antenna ground plane 41A is tilted, the direction of the main beam hardly changes.

[0082] Figure 8C This is a graph showing the frequency dependence of peak realized gain. The horizontal axis represents frequency in "GHz", and the vertical axis represents peak realized gain in "dBi". Figure 8C The solid and dashed lines in the text represent the second embodiment ( Figure 7A ) and comparative examples ( Figure 7B The peak gain of the antenna device is calculated. Furthermore, the tilt angle α is set to -45°.

[0083] It can be seen that in the antenna device of the second embodiment, a larger peak gain is obtained than that of the antenna device of the comparative example.

[0084] according to Figure 8A , Figure 8B ,as well as Figure 8CThe simulation results shown confirm that by adopting the antenna device structure of the second embodiment, impedance management can be easily performed, and the main beam can be directed in the desired direction.

[0085] Next, refer to Figure 9A as well as Figure 9B The antenna device of the modified example of the second embodiment will be described. Figure 9A as well as Figure 9B These are, respectively, a cross-sectional view and a top view of the antenna device of a modified example of the second embodiment. Figure 9B The sectional view at point 9A-9A with a single-dotted line is equivalent to Figure 9A .

[0086] Second embodiment ( Figure 4 In one embodiment, the power supply point 42A is positioned slightly inward from the midpoint of the edge at the lowest point of the power supply element 42. That is, the power supply point 42A is positioned lower than the geometric center of the power supply element 42. In contrast, in this modified embodiment, the power supply point 42A is positioned slightly inward from the midpoint of one of the inclined edges of the power supply element 42. That is, the height from the bottom surface 40A of the dielectric block 40 to the geometric center of the power supply element 42 is equal to the height up to the power supply point 42A.

[0087] In this modified example, similar to the second embodiment, the antenna ground plane 41A is connected to the substrate ground plane 20A on both the side PL, which is lower than the contour line LC, and the side PH, which is higher than the contour line LC.

[0088] In this way, the position of the power supply point 42A can be set at any position that can excite the power supply element 42 regardless of the tilt direction of the power supply element 42. Alternatively, the power supply point 42A can be set at two locations.

[0089] [Third Embodiment]

[0090] Next, refer to Figure 10A as well as Figure 10B The antenna device of the third embodiment will now be described. Hereinafter, the antenna device will be compared with that of the referenced... Figures 4 to 8C The antenna device of the second embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0091] Figure 10A This is a cross-sectional view of the antenna device according to the third embodiment. In the second embodiment ( Figure 4In the first embodiment, the grounding component 41 is composed of a block of conductors. In contrast, in the third embodiment, the grounding component 41 includes a plate-shaped conductor component 41P and a connecting component 41C extending from the conductor component 41P toward the substrate ground plane 20A. The connecting component 41C includes a plurality of columnar components extending in a direction perpendicular to the substrate ground plane 20A. The lower ends of the plurality of columnar components are exposed on the bottom surface 40A of the dielectric block 40, and the plurality of columnar components are respectively connected to the substrate ground plane 20A via solder layers 80. The plate-shaped conductor component 41P is supported in an inclined position relative to the substrate ground plane 20A, and the upper surface of the conductor component 41P functions as the antenna ground plane 41A.

[0092] exist Figure 10A In this embodiment, the power supply point 42A is located at a position higher than the geometric center of the power supply element 42, but it can also be located as in the second embodiment. Figure 4 As in the second embodiment, it can be positioned lower than the geometric center, or it can be a variation thereof. Figure 9A , Figure 9B In that case, it is set at the same height as the geometric center.

[0093] Figure 10B This is a top sectional view of the power supply line 44 and the connecting component 41C. The six columnar components of the connecting component 41C are arranged circumferentially spaced around the power supply line 44. Figure 10A As shown, a portion of the columnar components are connected to the antenna ground plane 41A on the side PH, which is higher than the contour line LC, and are exposed on the bottom surface 40A of the dielectric block 40. The remaining portion of the columnar components are connected to the antenna ground plane 41A on the side PL, which is lower than the contour line LC, and are exposed on the bottom surface 40A of the dielectric block 40.

[0094] Furthermore, the conductor component 41P is connected to the substrate ground plane 20A via the solder layer 80 at its lowest edge 41E. Thus, the antenna ground plane 41A is connected to the substrate ground plane 20A on both the side PH, which is higher than the contour line LC, and the side PL, which is lower than the contour line LC.

[0095] Next, the superior effects of the third embodiment will be explained.

[0096] In the third embodiment, compared to the structure where the antenna ground plane 41A is only connected to the substrate ground plane 20A at its lowest point, the ground potential of the antenna ground plane 41A is stable. Furthermore, since the connection member 41C connected to the substrate ground plane 20A surrounds the power supply line 44, the impedance management of the power supply line 44 becomes easier, resulting in the excellent effect of this.

[0097] Next, refer to Figure 10C The antenna device of the modified example of the third embodiment will be described. Figure 10CThis is a top sectional view of the power supply line 44 and the connecting member 41C of the antenna device in a modified embodiment of the third embodiment. In this modified embodiment, the connecting member 41C has a cylindrical shape, such as a cylinder. The power supply line 44 passes through the cylindrical connecting member 41C. Alternatively, as in this modified embodiment, the connecting member 41C may be cylindrical in shape, and the connecting member 41C may continuously surround the power supply line 44 in the circumferential direction.

[0098] Next, refer to Figure 11A , Figure 11B ,as well as Figure 11C Other variations of the antenna device according to the third embodiment will be described. Figure 11A , Figure 11B ,as well as Figure 11C This is a cross-sectional view of the lower end of the connecting member 41C included in an antenna device of another variation of the third embodiment. The solder layer 80 is in contact with the lower end of the connecting member 41C.

[0099] like Figure 11A , Figure 11B ,as well as Figure 11C As shown, a circumferentially extending protrusion or recess is formed on the side of the lower end of the connecting member 41C. This structure is sometimes referred to as a frame structure 41CF. Figure 11A In the variant shown, multiple protrusions are arranged axially around the perimeter. Figure 11B In the variant shown, the height of the circumferential protrusion increases in a stepped manner from the lower end of the connecting member 41C upwards. Furthermore, the surface of the frame structure 41CF does not necessarily have to be geometrically perfectly stepped; it can also be an undulating shape with an indistinct boundary between the tread (tread plate) and the kick plate (vertical plate). Figure 11C In the variant shown, a circumferential recess is formed on the side of the connecting member 41C. The recess temporarily deepens from the lower end of the connecting member 41C upwards, and then becomes shallower.

[0100] Through formation Figure 11A , Figure 11B , Figure 11C The frame structure 41CF shown improves the bonding strength between the connecting member 41C and the dielectric member 50 at the interface. Furthermore, it suppresses moisture ingress from the lower end of the connecting member 41C along the interface between the connecting member 41C and the dielectric member 50. Therefore, the moisture resistance of the antenna device is improved.

[0101] [Fourth Embodiment]

[0102] Next, refer to Figures 12A to 12C The antenna device of the fourth embodiment will be described with reference to the accompanying drawings. Hereinafter, the antenna device will be described with reference to the accompanying drawings. Figure 10A as well as Figure 10BThe structure shared by the antenna device in the third embodiment described herein is omitted from the description.

[0103] Figure 12A as well as Figure 12B These are, respectively, a cross-sectional view and a top view of the antenna device of the fourth embodiment. Figure 12B The sectional view at point 12A-12A with a single-dotted line is equivalent to Figure 12A In the fourth embodiment, similar to the third embodiment, the grounding component 41 is composed of a flat conductor component 41P and a columnar connecting component 41C. In the third embodiment ( Figure 10B In the first embodiment, multiple columnar members constituting the connecting member 41C surround the power supply line 44. However, in the fourth embodiment, the connecting member 41C does not surround the power supply line 44. The connecting member 41C is connected to the antenna ground plane 41A on the side PH that is higher than the contour line LC, and is exposed on the bottom surface 40A of the dielectric block 40. In addition, the grounding member 41 is also exposed on the bottom surface 40A of the dielectric block 40 at its lowest edge 41E (the side PL that is lower than the contour line LC), and is connected to the substrate ground plane 20A.

[0104] Next, the superior effects of the fourth embodiment will be explained. In the fourth embodiment, similar to the third embodiment, compared with the structure in which the antenna ground plane 41A is connected to the substrate ground plane 20A only at its lowermost edge 41E, the ground potential of the antenna ground plane 41A can be stabilized.

[0105] Next, the preferred location for connecting the connecting component 41C within the antenna ground plane 41A will be described. In order to stabilize the grounding potential of the antenna ground plane 41A, it is preferable that the connection between the antenna ground plane 41A and the substrate ground plane 20A is not localized, but rather distributed over a large area as much as possible.

[0106] exist Figure 12B In the example shown, the antenna ground plane 41A is connected to the substrate ground plane 20A at the connection point with the lowermost edge 41E and the connecting member 41C. To avoid the partial existence of the connection point between the antenna ground plane 41A and the substrate ground plane 20A, it is preferable to arrange the area of ​​the convex hull 41CH of the connection point to the substrate ground plane 20A towards the substrate ground plane 20A by increasing the area of ​​the convex hull 41CH. Here, the convex hull refers to the smallest convex polygon containing a set of points.

[0107] Figure 12CThis is a top view of the antenna assembly with the position of the connecting member 41C shifted towards the lowermost edge 41E of the antenna ground plane 41A. If the position of the connecting member 41C is shifted towards the lowermost edge 41E of the antenna ground plane 41A, the area of ​​the convex hull 41CH decreases. If the connecting member 41C is made too close to the lowermost edge 41E, the effect of stabilizing the ground potential of the antenna ground plane 41A weakens.

[0108] In order to achieve a sufficient effect of stabilizing the grounding potential of the antenna ground plane 41A, it is preferable to arrange the connection portion to the substrate ground plane 20A such that the area of ​​the convex hull 41CH is more than 20% of the area of ​​the antenna ground plane 41A.

[0109] Next, a modified example of the antenna device according to the fourth embodiment will be described. In the fourth embodiment, the lowermost edge 41E of the antenna ground plane 41A may be connected to the substrate ground plane 20A, but it is not necessary to connect the lowermost edge 41E to the substrate ground plane 20A. Connecting members 41C may be connected to multiple locations other than the lowermost edge 41E. In this case, it is preferable to arrange multiple connecting members 41C such that the area of ​​the convex hull 41CH is 20% or more of the area of ​​the antenna ground plane 41A.

[0110] [Fifth Embodiment]

[0111] Next, refer to Figure 13A as well as Figure 13B The antenna device of the fifth embodiment will be described below. Hereinafter, compared with the referenced... Figures 12A to 12C The structure common to the antenna device of the fourth embodiment described in the accompanying drawings is omitted from the description.

[0112] Figure 13A as well as Figure 13B These are, respectively, a cross-sectional view and a top view of the antenna device of the fifth embodiment. Figure 13B The sectional view at point 13A-13A with a single-dotted line is equivalent to Figure 13A In the fourth embodiment ( Figure 12A , Figure 12B In the first embodiment, a connecting member 41C is connected deep inside the antenna ground plane 41A. In contrast, in the fifth embodiment, multiple columnar members constituting the connecting member 41C extend from the four edges of the antenna ground plane 41A toward the bottom surface 40A of the dielectric block 40. Figure 13B In the diagram, the connecting component 41C is marked with a shading.

[0113] A portion of the columnar components of the connecting member 41C are connected to the antenna ground plane 41A on the side PH, which is higher than the contour line LC, and exposed on the bottom surface 40A of the dielectric block 40. The remaining columnar components are connected to the antenna ground plane 41A on the side PL, which is lower than the contour line LC, and exposed on the bottom surface 40A of the dielectric block 40. Alternatively, the columnar components may be omitted, and the lowermost edge 41E of the antenna ground plane 41A may be connected to the substrate ground plane 20A via the solder layer 80.

[0114] Next, the superior effects of the fifth embodiment will be explained.

[0115] In the fifth embodiment, the same as in the fourth embodiment, excellent results are achieved, such as stable grounding potential of antenna ground plane 41A.

[0116] Next, refer to Figure 13C , Figure 14A , Figure 14B A variation of the fifth embodiment will be described. Figure 13C , Figure 14A , Figure 14B This is a top view of the antenna device of a modified example of the fifth embodiment. Figure 13C , Figure 14A ,as well as Figure 14B In the diagram, the connecting component 41C is marked with a shading.

[0117] exist Figure 13C In the modified example shown, the plurality of columnar members constituting the connecting member 41C are connected to the lowermost edge 41E and the uppermost edge 41F of the antenna ground plane 41A. Figure 14A In the illustrated variation, the connecting member 41C is continuously arranged along the four edges of the antenna ground plane 41A. Figure 14B In the variant shown, the connecting member 41C is continuously arranged along the lowermost edge 41E and the uppermost edge 41F of the antenna ground plane 41A. Figure 14A as well as Figure 14B In the modified example shown, the connecting member 41C is configured to connect with the bottom surface 40A of the dielectric block 40. Figure 13A Vertical wall.

[0118] It can also be like Figure 13C as well as Figure 14B As shown in the modified example, the connecting member 41C is positioned along the lowermost edge 41E and the uppermost edge 41F of the antenna ground plane 41A. Alternatively, it can be like... Figure 14A as well as Figure 14B As shown in the modified example, the connecting member 41C is composed of a wall perpendicular to the substrate ground plane 20A.

[0119] [Sixth Embodiment]

[0120] Next, refer to Figure 15A The antenna device of the sixth embodiment will be described below. Hereinafter, compared with the referenced... Figures 4 to 8C The antenna device of the second embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0121] Figure 15A This is a cross-sectional view of the antenna device according to the sixth embodiment. In the second embodiment, the bottom surface 40A of the dielectric block 40 is flat. In contrast, in the sixth embodiment, a recess 55 is formed on the bottom surface 40A of the dielectric block 40. More specifically, it is formed on the bottom surface of the grounding member 41. As a result, a void is created between the substrate ground plane 20A and the antenna ground plane 41A.

[0122] The circuit element 56, mounted on the substrate 20, is housed within the recess 55. The circuit element 56 may be, for example, a high-frequency integrated circuit element including a high-frequency power amplifier circuit. The circuit element 56 is connected to the power supply element 42 via the power supply line 23 within the substrate 20 and the power supply line 44 within the dielectric block 40. High-frequency components such as filters may also be included in the circuit element 56.

[0123] Furthermore, a connector 57 is mounted on the substrate 20. For example, the connector 57 is connected to an external baseband integrated circuit via a coaxial cable, and is also connected to circuit elements 56 via wiring within the substrate 20. Baseband signals, control signals, power supplies, etc., are transmitted and received between the baseband integrated circuit and the circuit elements 56 via a coaxial cable.

[0124] Next, the superior effects of the sixth embodiment will be explained. Similar to the second embodiment, the sixth embodiment can stabilize the grounding potential of the antenna ground plane 41A.

[0125] Furthermore, in the sixth embodiment, the dielectric block 40 and the circuit element 56 are mounted so that they overlap when viewed from above. Therefore, the utilization efficiency of the mounting surface of the substrate 20 can be improved. Moreover, the grounding member 41 covering the circuit element 56 functions as a shielding structure. Therefore, electromagnetic interference between the circuit element 56 and other components, including the dielectric block 40, can be suppressed.

[0126] Next, refer to Figure 15B The antenna device of the modified example of the sixth embodiment will be described. Figure 15B This is a cross-sectional view of an antenna device according to a modified example of the sixth embodiment. In the sixth embodiment, the same conductor block as in the second embodiment is used as the grounding component 41. In contrast, in Figure 15B In the modified example shown, the grounding component 41 is the same as in the fifth embodiment ( Figure 13ASimilarly, it is composed of a flat conductor component 41P and a connecting component 41C composed of multiple columnar components. A recess 55 is formed on the surface of the dielectric component 50 opposite to the substrate 20. A circuit element 56 is housed in the recess 55.

[0127] In this modified example, the flat conductor member 41P and the multiple columnar members of the connecting member 41C function as a shielding structure. Furthermore, as the grounding member 41, it can also be adopted... Figure 13C , Figure 14A , Figure 14B The grounding component 41 of the antenna device in the modified example of the fifth embodiment shown has the same structure.

[0128] The circuit element 56 of the antenna device in the sixth embodiment is a high-frequency integrated circuit element or a filter, but other elements can also be used as the circuit element 56. For example, various surface-mount components related to antenna operation, circuit elements formed by conductor patterns formed on the surface layer of the substrate 20, etc., can also be housed in the recess 55. Furthermore, circuit elements unrelated to antenna operation can also be housed in the recess 55. For example, if in Figure 15A The surface layer of the substrate 20 has a conductor pattern arranged such that it is contained within the recess 55 when viewed from above. Compared to the case where the recess 55 is not provided, the distance from the conductor pattern to the grounding member 41 becomes longer. As a result, changes in the characteristics of the circuit elements composed of the conductor pattern are suppressed before and after the dielectric block 40 is installed.

[0129] [Seventh Embodiment]

[0130] Next, refer to Figure 16 The antenna device of the seventh embodiment will be described below. Hereinafter, compared with the referenced... Figures 4 to 8C The antenna device of the second embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0131] Figure 16 This is a top view of the antenna device according to the seventh embodiment. In the second embodiment ( Figure 4 In one embodiment, a patch antenna comprising a grounding component 41, a power supply element 42, and a non-power supply element 43 is assembled on a dielectric component 50. In contrast, in the seventh embodiment, a plurality of patch antennas 60 are assembled on a dielectric component 50. That is, a dielectric block 40 comprises a plurality of patch antennas 60. Each of the plurality of patch antennas 60 comprises a grounding component 41, a power supply element 42, and a non-power supply element 43. A power supply line 23 is configured for each power supply element 42.

[0132] Multiple grounding components 41 have their antenna ground planes 41A arranged on a common imaginary plane. Additionally, multiple power supply components 42 and multiple non-power supply components 43 are also arranged on the common imaginary plane. That is, the normal directions of the multiple antenna ground planes 41A, the multiple power supply components 42, and the multiple non-power supply components 43 are parallel to each other. Multiple patch antennas 60 are arrayed, and the antenna assembly operates as an array antenna.

[0133] Next, the superior effects of the seventh embodiment will be explained.

[0134] In the seventh embodiment, the ground potential of the antenna ground plane 41A of each of the plurality of patch antennas 60 can also be stabilized. Furthermore, since the plurality of patch antennas 60 are fabricated on a single dielectric component 50, the mounting process can be simplified compared to mounting each patch antenna on the substrate 20.

[0135] Next, refer to Figure 17 The antenna device of the modified example of the seventh embodiment will be described. Figure 17 This is a cross-sectional view of an antenna device according to a variation of the seventh embodiment.

[0136] In the seventh embodiment, the normal directions of the antenna ground plane 41A of the plurality of patch antennas 60 are parallel to each other. In contrast, in this modified example, the normal directions of the antenna ground plane 41A of the plurality of patch antennas 60 fabricated on a dielectric component 50 are different from each other. Figure 17 In the example shown, three patch antennas 60 are fabricated on a dielectric component 50. The antenna ground plane 41A of the left-hand patch antenna 60 and the antenna ground plane 41A of the right-hand patch antenna 60 are tilted in opposite directions relative to the substrate ground plane 20A. The antenna ground plane 41A of the central patch antenna 60 is parallel to the substrate ground plane 20A.

[0137] In this modified antenna device, a patch antenna 60 with its main beam pointing in the normal direction to the substrate ground plane 20A and a patch antenna 60 with its beam tilted relative to the substrate ground plane 20A are obtained. As a result, an antenna device with a wider directivity can be realized.

[0138] Next, other variations of the antenna device according to the seventh embodiment will be described. Figure 17 In the illustrated variation, multiple patch antennas 60 with different frontal orientations are fabricated on a dielectric component 50. As another variation, dielectric blocks having antenna ground planes 41A inclined relative to the substrate ground plane 20A and dielectric blocks having antenna ground planes 41A parallel to the substrate ground plane 20A can also be fabricated independently, and these dielectric blocks can be mounted on a common substrate 20.

[0139] [Eighth Embodiment]

[0140] Next, refer to Figures 18 to 20C The antenna device of the eighth embodiment will be described with reference to the accompanying drawings. Hereinafter, the antenna device will be described with reference to the accompanying drawings. Figures 4 to 8C The antenna device of the second embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0141] Figure 18 This is a cross-sectional view of the antenna device according to the eighth embodiment. In the second embodiment ( Figure 4 In the first embodiment, the dielectric component 50 has an inclined surface 50A that is inclined relative to the bottom surface 40A of the dielectric block 40. In contrast, in the eighth embodiment, the dielectric component 50 does not have an inclined surface 50A. The entire area of ​​the upward-facing surface of the dielectric component 50 is formed solely by a top surface 50B that is parallel to the bottom surface 40A of the dielectric block 40. The dielectric block 40 has a cuboid shape.

[0142] Next, refer to Figures 19A to 20C The accompanying drawings illustrate the simulation results of the antenna characteristics of the antenna devices in the second and eighth embodiments.

[0143] Figure 19A as well as Figure 19B These are the second embodiments ( Figure 4 (and a perspective view of the antenna device of the simulated object in the eighth embodiment.) Figure 19A The antenna device shown is Figure 7A The antenna assembly shown is identical. The dielectric component 50 has an inclined surface 50A and a top surface 50B. Figure 19B The dielectric component 50 of the antenna device shown in the eighth embodiment does not have an inclined surface 50A, and the entire area of ​​the upward-facing surface is connected to the bottom surface 40A of the dielectric block 40. Figure 18 It consists of a parallel top surface 50B.

[0144] Figure 20A This is a graph showing the frequency dependence of the reflection coefficient S11. The horizontal axis represents frequency in "GHz", and the vertical axis represents the reflection coefficient S11 in "dB". Figure 20A The solid and dashed lines in the text represent the second embodiment ( Figure 19A ) and the eighth embodiment ( Figure 19B The reflection coefficient S11 of the antenna device is given. Furthermore, the tilt angle α is assumed to be -45°.

[0145] It is known that in the antenna device of the second embodiment, the reflection coefficient S11 is -10dB or less in a bandwidth of approximately 7GHz centered at a frequency of approximately 61GHz. Similarly, it is known that in the antenna device of the eighth embodiment, the reflection coefficient S11 is also -10dB or less in a bandwidth of approximately 7GHz centered at a frequency of approximately 60GHz. In the eighth embodiment, as in the second embodiment, sufficient impedance management is also possible.

[0146] Figure 20B This is a graph showing the dependence of the achieved gain on the angle θ. The horizontal axis represents the angle θ in degrees, and the vertical axis represents the achieved gain in dBi. Figure 20B The solid and dashed lines in the text represent the second embodiment ( Figure 19A ) and the eighth embodiment ( Figure 19B The gain of the antenna device is calculated. Furthermore, the frequency is set to 60 GHz, and the tilt angle α is set to -45°.

[0147] It is understood that in any antenna device in the second and eighth embodiments, the direction of the main beam is tilted in accordance with the tilt of the antenna ground plane 41A. Thus, in the eighth embodiment, similar to the second embodiment, the direction of the main beam can be changed by tilting the antenna ground plane 41A.

[0148] Figure 20C This is a graph showing the frequency dependence of peak realized gain. The horizontal axis represents frequency in "GHz", and the vertical axis represents peak realized gain in "dBi". Figure 20C The solid and dashed lines in the text represent the second embodiment ( Figure 19A ) and the eighth embodiment ( Figure 19B The peak gain of the antenna device is calculated. Furthermore, the tilt angle α is set to -45°. It can be seen that the peak gain of the same magnitude as in the second embodiment is also obtained in the eighth embodiment.

[0149] according to Figure 20A , Figure 20B ,as well as Figure 20C The simulation results shown confirm that the antenna characteristics obtained in the antenna device of the eighth embodiment are the same as those in the second embodiment.

[0150] Next, the superior effects of the eighth embodiment will be explained. In the eighth embodiment, the entire area of ​​the upward-facing surface of the dielectric component 50 is a top surface 50B parallel to the substrate ground plane 20A. Therefore, during the process of mounting the dielectric block 40 onto the substrate 20, the top surface 50B of the dielectric block 40 can be easily adsorbed by a pick-and-place machine. Thus, the dielectric block 40 can be easily mounted onto the substrate 20.

[0151] In the eighth embodiment, the entire area of ​​the upward-facing surface of the dielectric component 50 is formed by a top surface 50B parallel to the bottom surface 40A of the dielectric block 40, but it is not necessarily required that the entire area of ​​the upward-facing surface be a top surface 50B parallel to the bottom surface 40A. When viewed from above the bottom surface 40A, the top surface 50B may include the antenna ground plane 41A. In this case, the top surface 50B of the dielectric block 40 can also be easily attached using a pick-and-place machine.

[0152] [Ninth Embodiment]

[0153] Next, refer to Figure 21 The antenna device of the ninth embodiment will be described below. Hereinafter, compared with the referenced... Figures 4 to 8C The antenna device of the second embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0154] Figure 21 This is a cross-sectional view of the antenna device according to the ninth embodiment. In the second embodiment ( Figure 4 In the first embodiment, the antenna ground plane 41A, the surface of the power supply element 42, and the surface of the non-power supply element 43 are all generally flat surfaces. In contrast, in the ninth embodiment, the antenna ground plane 41A, the surface of the power supply element 42, and the surface of the non-power supply element 43 are stepped. The tread of the stepped surface is parallel to the base plate ground plane 20A, and the kick plate is perpendicular to the base plate ground plane 20A. Here, "stepped" does not mean a strictly geometrically stepped shape; the boundary between the tread and the kick plate is indistinct, and undulating surfaces are also included in the "stepped" surface.

[0155] Next, the superior effects of the ninth embodiment will be explained.

[0156] When using a 3D printer to shape the dielectric block 40, if the stacking direction 45 is set to be perpendicular to the substrate ground plane 20A, the surface inclined relative to the substrate ground plane 20A becomes stepped, depending on the resolution of the 3D printer. In the ninth embodiment, since the surface inclined relative to the substrate ground plane 20A is stepped, the 3D printer shaping the dielectric block 40 does not require a high resolution.

[0157] Furthermore, since the antenna ground plane 41A, the surface of the power supply element 42, and the surface without the power supply element 43 are stepped, the adhesion between the dielectric material of the dielectric component 50 and the metal material of the power supply element 42 is improved on these stepped surfaces. As a result, delamination at the interface is less likely to occur.

[0158] Furthermore, since the power supply element 42 and the non-power supply element 43 are stepped, the path of the current flowing in the direction that causes the steps to rise and fall becomes longer. If the conductive path becomes longer, the resonant frequency decreases. Conversely, if the resonant frequency is the same, the size of the power supply element 42 and the non-power supply element 43 when viewed from above becomes smaller when the steps are stepped. Therefore, the dielectric block 40 can be further reduced in size.

[0159] Next, a modified example of the antenna device according to the ninth embodiment will be described. In the ninth embodiment, the dielectric component 50 is formed of a single dielectric material, but it may also be formed of multiple dielectric materials with different dielectric constants. When the interface between the different dielectric materials is parallel to the antenna ground plane 41A, the interface between the dielectric components is stepped. Therefore, the adhesion at the interface between the different dielectric materials can be improved.

[0160] [Tenth Embodiment]

[0161] Next, refer to Figure 22A The antenna device of the tenth embodiment will be described below. Hereinafter, compared with the referenced... Figure 21 The structure shared by the antenna device in the ninth embodiment described herein is omitted from the description.

[0162] Figure 22A This is a cross-sectional view of the antenna device according to the tenth embodiment. In the ninth embodiment ( Figure 21 In the first embodiment, the surface inclined relative to the bottom surface 40A of the dielectric block 40 is stepped. In contrast, in the tenth embodiment, the antenna ground plane 41A, the surface of the power supply element 42, and the surface of the non-power supply element 43 are flat, and the surfaces inclined relative to these surfaces are stepped. For example, the top surface 50B, side surface 50C of the dielectric component 50, and the bottom surface 40A of the dielectric block 40 (along the surface of the substrate ground plane 20A) are stepped. Furthermore, the side surface 41B of the grounding component 41 and the surface of the power supply line 44 are stepped. The stepped surface is formed by a tread (tread) parallel to the antenna ground plane 41A and a vertical kick plate (vertical plate).

[0163] Next, the superior effects of the tenth embodiment will be explained.

[0164] When using a 3D printer to shape the dielectric block 40, if the stacking direction 45 is set to be perpendicular to the antenna ground plane 41A, the surface tilted relative to the antenna ground plane 41A will be stepped, depending on the resolution of the 3D printer. In the tenth embodiment, since the surface tilted relative to the antenna ground plane 41A is stepped, the 3D printer shaping the dielectric block 40 does not require a high resolution.

[0165] Furthermore, in the tenth embodiment, since the antenna ground plane 41A, the surface of the power supply element 42, and the surface of the non-power supply element 43 are flat, the increase in losses caused by these shapes can be suppressed. Also, similarly to the ninth embodiment, the adhesion between the dielectric and the metal is improved at the stepped interface, making peeling less likely.

[0166] Next, refer to Figure 22B The antenna device of the modified example of the tenth embodiment will be described. Figure 22B This is a cross-sectional view of an antenna device, a variation of the tenth embodiment. In the tenth embodiment ( Figure 22A In the first example, the bottom surface 40A of the dielectric block 40 and the side surface 50C of the dielectric component 50 are continuous via an edge. In contrast, in this modified example, the bottom surface 40A and the side surface 50C are connected via an inclined surface 40B parallel to the antenna ground plane 41A.

[0167] The dimension L2 of the dielectric block 40 in the direction perpendicular to the antenna ground plane 41A (stack direction 45) is smaller than the dimension L1 in the direction perpendicular to the substrate ground plane 20A. Because the dimension of the stack direction 45 is smaller, the number of stacking steps when using a 3D printer to create the shape is reduced, which can reduce manufacturing costs.

[0168] Next, refer to Figure 22C Other variations of the antenna device according to the tenth embodiment will be described. Figure 22C This is a cross-sectional view of an antenna device according to another variation of the tenth embodiment. In this variation, the power supply line 44 extends in a direction parallel to the stacking direction 45 when the dielectric block 40 is shaped using a 3D printer. Therefore, the power supply line 44 is inclined relative to the bottom surface 40A of the dielectric block 40. The surface of the power supply line 44 is not stepped, resulting in a generally flat surface. By making the surface of the power supply line 44 flat, transmission losses can be reduced compared to a stepped power supply line 44.

[0169] Next, another variation of the tenth embodiment will be described. Figure 22A , Figure 22B , Figure 22C In the antenna device shown, a stepped top surface 50B is provided on the dielectric component 50, but it can also be like the first embodiment ( Figure 1A Therefore, the top surface 50B is not set. When using a 3D printer to stack layers from the inclined surface 50A along the stacking direction 45 to create a shape, if the inclined surface 50A is enlarged, the antenna device can be supported more stably during the middle stage of the modeling process.

[0170] [Eleventh Embodiment]

[0171] Next, refer to Figure 23The antenna device of the eleventh embodiment will be described below. Hereinafter, the antenna device will be described in relation to the referenced... Figures 1A to 3C The antenna device of the first embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0172] Figure 23 This is a cross-sectional view of the antenna device according to the eleventh embodiment. In the first embodiment ( Figure 1A In one embodiment, a patch antenna comprising an antenna ground plane 41A, a power supply element 42, and a non-power supply element 43 is assembled on a dielectric component 50. In contrast, in the eleventh embodiment, multiple patch antennas 60 are assembled on a dielectric component 50. The substrate 20 of the antenna assembly is a substrate 20 that is curved to correspond to the shape of the portion of the dielectric block 40 mounted within the communication device. Multiple grounding components 41 are respectively mounted on a flat area of ​​the substrate ground plane 20A.

[0173] The antenna ground planes 41A of the multiple patch antennas 60 are located on a common imaginary plane or are parallel to each other. The bottom surface 41D of the grounding component 41 included in each of the multiple patch antennas 60 corresponds to the shape of the substrate 20 and is inclined relative to the antenna ground plane 41A. Considering each patch antenna among the multiple patch antennas, the antenna ground plane 41A is inclined relative to the bottom surface 40A of the area where the grounding component 41 of that patch antenna is disposed. Furthermore, there are also patch antennas 60 in which the bottom surface 41D of the grounding component 41 is assembled is parallel to the antenna ground plane 41A (in...). Figure 23 The situation is as follows (the patch antenna 60 is in the center).

[0174] Next, the superior effects of the eleventh embodiment will be explained. Even when the substrate 20 is bent in shape corresponding to the part where the dielectric block 40 should be mounted and mounted on the communication device, the main beams of the multiple patch antennas can be aligned.

[0175] Next, a variation of the eleventh embodiment will be described.

[0176] In the eleventh embodiment, although the main beam directions of the multiple patch antennas 60 are consistent, the main beam directions may also be different for each patch antenna 60. Alternatively, a dielectric block 40 containing a single patch antenna may be mounted in each of several flat regions of a substrate having a curved portion. Figure 1A , Figure 4 wait).

[0177] In this variation, the main beam can be oriented in a direction tilted from the normal direction of each of the multiple flat regions. Therefore, a wider coverage can be achieved compared to structures where multiple dielectric blocks 40 are mounted on a common plane, or existing patch antenna structures where each of the multiple flat regions of a curved substrate is mounted.

[0178] For example, dielectric blocks 40 can be mounted on the flat areas on both sides of the bend of a substrate bent at a right angle into an L-shape. In a structure where existing patch antennas are arranged in two flat areas, the directions of the two main beams are at a 90° angle. In contrast, the dielectric block 40 used in this variation ( Figure 1A In the figure, like a reference Figure 5A As explained, the main beam can be emitted from the substrate ground plane 20A ( Figure 1A , Figure 4 The normal direction is tilted by approximately ±45°. Therefore, the coverage angle can be expanded from 90° to 180°.

[0179] Alternatively, dielectric blocks 40 can be mounted on each of the three flat regions of the substrate bent into a trapezoidal shape. Or, dielectric blocks 40 can be mounted on each of the four inclined surfaces of the substrate bent along the four sides of a truncated pyramid, as well as on the top surface. In this way, dielectric blocks 40 can be freely mounted in each of the multiple flat regions of the bent substrate.

[0180] [Twelfth Embodiment]

[0181] Next, refer to Figure 24A The antenna device of the twelfth embodiment will be described. Hereinafter, compared with the reference... Figures 1A to 3C The antenna device of the first embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0182] Figure 24A This is a cross-sectional view of the antenna device according to the twelfth embodiment. In the first embodiment ( Figure 1A In the first embodiment, the side of the grounding component 41 is covered by the dielectric component 50. In contrast, in the twelfth embodiment, the side of the grounding component 41 is exposed. Thus, the grounding component 41 is exposed over the entire area of ​​the bottom surface 40A of the dielectric block 40.

[0183] Next, the superior effects of the twelfth embodiment will be explained. Similar to the first embodiment, the twelfth embodiment also achieves the excellent effect of stable grounding potential at the antenna ground plane 41A.

[0184] Next, refer to Figure 24B The antenna device of the modified example of the twelfth embodiment will be described. Figure 24B This is a cross-sectional view of the antenna device of a modified example of the twelfth embodiment.

[0185] In this variation, the antenna device of the fifth embodiment ( Figure 13ASimilarly, the grounding component 41 includes a plate-shaped conductor component 41P and a connecting component 41C. The connecting component 41C is exposed at its lower end on the side 50C of the dielectric component 50. The exposed portion of the connecting component 41C is connected to the substrate ground plane 20A via the solder layer 80. Alternatively, as in this variation, the grounding component 41 may be exposed on the side of the dielectric component 50, and the exposed portion on the side may be connected to the substrate ground plane 20A via the solder layer 80. Alternatively, the grounding component 41 may be exposed on the bottom surface 40A of the dielectric block 40 or the side 50C of the dielectric component 50 on both the side PL, which is lower than the contour line LC, and the side PH, which is higher than the contour line LC.

[0186] [Thirteenth Embodiment (Reference Example)]

[0187] Next, refer to Figure 25 The antenna device of the thirteenth embodiment (reference example) will be described below. Hereinafter, the antenna device will be described in relation to the reference example. Figures 1A to 3C The antenna device of the first embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0188] Figure 25 This is a cross-sectional view of the antenna device according to the thirteenth embodiment (reference example). In the first embodiment (… Figure 1A In the first embodiment, the antenna ground plane 41A is inclined relative to the bottom surface 40A of the dielectric block 40. In contrast, in the thirteenth embodiment (reference example), the antenna ground plane 41A is parallel to the bottom surface 40A of the dielectric block 40. The direction of the main beam of the patch antenna, which is composed of the antenna ground plane 41A, the power supply element 42, and the non-power supply element 43, is perpendicular to the bottom surface 40A of the dielectric block 40.

[0189] Next, the superior performance of the antenna device in the thirteenth embodiment (reference example) will be explained.

[0190] By mixing and mounting the dielectric block 40 of the antenna device of the first embodiment and the dielectric block 40 of the antenna device of the thirteenth embodiment (reference example) on a common substrate 20, the main beams of the multiple patch antennas can be oriented in a direction perpendicular to or inclined relative to the substrate ground plane 20A. Thus, by having the dielectric block 40 of the first embodiment and the dielectric block 40 of the eighth embodiment coexist on a single substrate, the excellent effect of increased freedom in selecting the pointing characteristics of the antenna device is achieved.

[0191] [Fourteenth Embodiment]

[0192] Next, refer to Figure 26A , Figure 26B as well as Figure 27 The antenna device of the fourteenth embodiment will be described below. Hereinafter, it will be compared with the referenced... Figures 1A to 3CThe antenna device of the first embodiment described in the accompanying drawings shares a common structure, which is omitted from the description.

[0193] Figure 26A as well as Figure 26B These are perspective views of the antenna device according to the fourteenth embodiment and the comparative example, respectively. Four dielectric blocks 40 are arranged in a row on the substrate 20. Antenna device of the fourteenth embodiment ( Figure 26A The four dielectric blocks 40 of the antenna device of the first embodiment each have the same structure as the dielectric block 40 of the antenna device of the first embodiment.

[0194] A xyz orthogonal coordinate system is defined, with the direction in which the four dielectric blocks 40 are arranged defined as the x-direction and the normal direction of the substrate 20 defined as the z-direction. The direction in which the surface of the substrate 20 on which the dielectric blocks 40 are arranged faces is defined as the positive direction of the z-axis. In the fourteenth embodiment, the outward normal direction of the antenna ground plane 41A is such that the vector in the positive z-axis direction is tilted towards the positive x-axis direction. The tilt angle of the antenna ground plane 41A relative to the xy plane is denoted as α. In the comparative example antenna device, the tilt angle α of the antenna ground plane 41A relative to the xy plane is 0°.

[0195] Figure 27 This indicates that the fourteenth embodiment ( Figure 26A ) and comparative examples ( Figure 26B A graph showing the simulation results of the radiation pattern of the antenna device during phased array operation. The x-direction spacing (center-to-center distance) of the power supply elements 42 is set to 3 mm, and the frequency of the excitation signal is set to 60 GHz. The antenna device of the fourteenth embodiment ( Figure 26A The tilt angle α of the antenna grounding 41A is set to 30°.

[0196] Figure 27 The horizontal axis of the chart uses the unit "°" to represent the angle θ of the inclination from the positive z-axis towards the positive x-axis, and the vertical axis uses the unit "dBi" to represent the gain. Figure 27 In the chart, the dashed line represents the antenna device using the same comparative example ( Figure 26B The radiation pattern under the condition that the four power supply elements 42 are excited.

[0197] Figure 27 The thin and thick solid lines in the chart represent the comparison examples ( Figure 26B ) and the fourteenth embodiment ( Figure 26A The four power supply elements 42 of the antenna device are given a 135° phase difference for excitation, resulting in a radiation pattern. Furthermore, the phase of the excitation signal is delayed by 135° each time, from the power supply element 42 on the positive side of the x-axis toward the power supply element 42 on the negative side.

[0198] When excited using four power supply elements 42 in the same direction, it is known that the maximum gain is achieved in the frontal direction (θ = 0°). When excited with a phase difference of 135°, the main lobe also appears near angle θ = 40° in any of the antenna devices in the fourteenth embodiment and the comparative example. However, in the antenna device of the comparative example, a grating lobe appears near angle θ = -60°, while in contrast, no grating lobe appears in the antenna device of the fourteenth embodiment.

[0199] Next, the superior effects of the fourteenth embodiment will be explained.

[0200] like Figure 27 As shown, if the tilt angle α of the antenna ground plane 41A is set to 0°, grating lobes are generated when the beam is swung at a wide angle. In contrast, in the fourteenth embodiment, grating lobes are not generated even when the beam is swung at a wide angle from the positive z-axis direction toward the direction of the normal to the antenna ground plane 41A.

[0201] Next, a variation of the fourteenth embodiment will be described.

[0202] In the fourteenth embodiment, the phased array antenna is composed of four dielectric blocks 40, but the number of dielectric blocks 40 can also be more than four. Additionally, as... Figure 27 The simulation conditions shown make the tilt angle α of the antenna ground plane 41A 30°, but it can also be other angles.

[0203] The above embodiments are illustrative, and of course, parts of the structures shown in different embodiments can be replaced or combined. The same effects of the same structure based on multiple embodiments are not mentioned sequentially in each embodiment. Furthermore, the present invention is not limited to the above embodiments. For example, various changes, improvements, combinations, etc., are readily apparent to those skilled in the art.

[0204] Explanation of reference numerals in the attached figures

[0205] 20…Substrate; 20A…Substrate ground plane; 21…First ground conductor; 22…Second ground conductor; 23…Power supply line; 23A…Line; 23B…Through-hole conductor; 23C…Pad; 40…Dielectric block; 40A…Bottom surface of dielectric block; 40B…Sloping surface of dielectric block 40; 41…Grounding component; 41A…Antenna ground plane; 41B…Side of grounding component; 41C…Connecting component; 41CF…Frame structure; 41CH…Protrusion; 41D…Bottom surface of grounding component; 41E…Lowermost edge; 41F…Uppermost edge Edge of end; 41H…Through hole; 41P…Plate-shaped conductor component; 42…Power supply component; 42A…Power supply point; 43…No power supply component; 44…Power supply line; 45…Layer direction; 50…Dielectric component; 50A…Sloping surface of dielectric component; 50B…Top surface of dielectric component; 50C…Side of dielectric component; 55…Void; 56…Circuit element; 57…Connector; 60…Patch antenna; 80…Solder layer; LC…Contour line; PX…Intersection point; PH…The side higher than the contour line; PL…The side lower than the contour line.

Claims

1. An antenna device comprising a dielectric block having a bottom surface, wherein, The dielectric block comprises: A conductive grounding component having an antenna ground plane that is inclined relative to the bottom surface; The power supply element is arranged at a distance from the antenna ground plane, and together with the antenna ground plane, they form a patch antenna; A power supply line is connected to the power supply point of the power supply element; as well as The dielectric component supports the power supply element relative to the grounding component. Using the bottom surface as a height reference, the grounding component is exposed on both the side lower than and the side higher than the contour line on the antenna ground surface. The contour line is the intersection of a perpendicular line from the power supply point to an imaginary plane containing the bottom surface and the plane containing the antenna ground surface.

2. The antenna device according to claim 1, wherein, The power supply line intersects the antenna ground plane at the power supply point and extends towards the bottom surface. Insulation between the power supply line and the antenna ground plane is ensured at the intersection. The grounding component includes the portion that surrounds the power supply line from the bottom surface to the antenna ground plane.

3. The antenna device according to claim 2, wherein, The grounding component includes: A plate-shaped conductor component, with the antenna ground plane as one surface; as well as Multiple columnar connecting components extend from the plate-shaped conductor component toward the bottom surface. The plurality of connecting components are arranged at intervals around the power supply line in a circumferential direction.

4. The antenna device according to claim 2, wherein, The grounding component includes: A plate-shaped conductor component, with the antenna ground plane as one surface; and A cylindrical connecting member extends from the plate-shaped conductor member toward the bottom surface. The power supply line passes through the cylindrical connecting component.

5. The antenna device according to claim 2, wherein, The grounding component includes: A plate-shaped conductor component, with the antenna ground plane as one surface; and A connecting component extends from the edge of the plate-shaped conductor component toward the bottom surface.

6. The antenna device according to claim 1 or 2, wherein, The grounding component is composed of blocks of conductors.

7. The antenna device according to any one of claims 1 to 5, wherein, A recess is provided on the bottom surface.

8. The antenna device according to any one of claims 1 to 5, wherein, The dielectric component has an inclined surface parallel to the power supply element at a position farther than the power supply element when viewed from the antenna ground plane.

9. The antenna device according to any one of claims 1 to 5, wherein, Using the bottom surface as a height reference, the dielectric component has a top surface parallel to the bottom surface at a position higher than the power supply element.

10. The antenna device according to any one of claims 1 to 5, wherein, The dielectric component has a top surface that is parallel to the bottom surface and includes the antenna ground plane when viewed from above the bottom surface.

11. The antenna device according to any one of claims 1 to 5, wherein, The antenna ground plane and the surface of the power supply element are stepped.

12. The antenna device according to any one of claims 1 to 5, wherein, The antenna ground plane and the surface of the power supply element are flat, while the bottom surface is stepped.

13. The antenna device according to claim 12, wherein, The dimension of the dielectric block in the direction perpendicular to the antenna ground plane is smaller than the dimension in the direction perpendicular to the bottom surface.

14. The antenna device according to any one of claims 1 to 5, wherein, A plurality of power supply elements are supported on the dielectric component and arranged in an array. Each of the power supply components is equipped with a power supply line.

15. The antenna device according to any one of claims 1 to 5, wherein, It also has a substrate with a substrate ground plane. The dielectric block is mounted on the substrate in an orientation in which its bottom surface faces the substrate. The exposed portion of the grounding component on the bottom surface is electrically connected to the grounding ground of the substrate.

16. The antenna device according to claim 15, wherein, The substrate has a bent portion. The grounding component is installed in a flat area of ​​the substrate.

17. The antenna device according to claim 1, wherein, The power supply element is embedded in the dielectric component.

18. A communication module, comprising: The antenna device according to claim 7; and The substrate has a substrate ground plane. The dielectric block is mounted on the substrate in an orientation in which its bottom surface faces the substrate. The exposed portion of the grounding component on the bottom surface is electrically connected to the ground plane of the substrate. It also includes circuit elements supported on the substrate and housed in the recess.

19. The communication module according to claim 18, wherein, The circuit element is a high-frequency integrated circuit element that supplies power to the power supply line. It also has a connector for connecting to the high-frequency integrated circuit element.

20. An antenna device comprising: Dielectric component, having a bottom surface and side surfaces; A conductive grounding component is disposed on the dielectric component and has an antenna ground plane that is inclined relative to the bottom surface; A power supply element is disposed on the dielectric component and is arranged at a distance from the antenna ground plane, together with the antenna ground plane forming a patch antenna; as well as The power supply line is connected to the power supply point of the power supply element. Using the bottom surface as a height reference, the grounding component is exposed on both the side lower than and the side higher than the contour line. The contour line is the intersection of a perpendicular line from the power supply point to an imaginary plane containing the bottom surface and a plane containing the antenna ground plane.

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