probe holder and probe unit

Abstract

A probe card of the present invention holds contact probes that make contact with electrodes of a contact object at both ends in a length direction, and is provided with: a first laminated member that is laminated from a plurality of members; and a second laminated member that is laminated from a plurality of members and is joined to the first laminated member, the first laminated member and the second laminated member each having: a first member that is made of a material with a low dielectric constant; a second member that is provided on one surface of the first member and has a higher rigidity than the first member; and a third member that is provided on the other surface of the first member and has a higher rigidity than the first member, the probe card joining the third members of the first laminated member and the second laminated member to each other, forming a holding hole that penetrates in a laminating direction of the first laminated member and the second laminated member and is a stepped hole with a reduced diameter on the second member side. The probe card can suppress an increase in loss at high frequencies.

Description

Technical Field

[0001] This invention relates to probe holders and probe units. Background Technology

[0002] Traditionally, when performing continuity or operational characteristic testing on objects such as semiconductor integrated circuits or liquid crystal panels, a probe unit is used to electrically connect the object to the signal processing device used to output the detection signal. This probe unit includes multiple contact probes and a probe holder for housing the multiple contact probes (see, for example, Patent Document 1). The conventional probe holder shown in Patent Document 1 is composed of three stacked plates. Each plate has a hole formed to receive a portion of a contact probe, and by connecting the holes in the plates, a holding hole for receiving each contact probe is formed. This holding hole has a stepped shape with reduced diameter at both ends. In the probe unit, the contact probe is prevented from falling off the probe holder by engaging the stepped portion of the holding hole.

[0003] Typically, when outputting / inputting high-frequency electrical signals, signal loss known as insertion loss occurs. In probe units, reducing this insertion loss in the frequency domain used is crucial for high-precision, high-speed operation. To reduce insertion loss, probe holders are formed using materials with low dielectric constants, such as polytetrafluoroethylene (PTFE), to adjust the characteristic impedance.

[0004] In addition, when using PTFE to make probe holders, since PTFE is a relatively soft material, the strength of the probe holder is increased by sandwiching the first plate made of PTFE between two second plates made of a harder material, such as polyether ether ketone (PEEK).

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-36129 Summary of the Invention

[0006] However, because PTFE is a relatively soft material, the position of the retaining hole can sometimes deviate during the machining process. Therefore, when combining the first and second plates to form a probe holder, this deviation in hole position between the plates can lead to deterioration of frequency characteristics, particularly increased losses at high frequencies. Furthermore, when forming a retaining hole by combining one second plate with the first plate, and then combining another second plate to fabricate the probe holder, the positional accuracy of the hole formation is improved compared to forming the hole only on the first plate. However, warping can sometimes occur due to differences in the plate materials. This warping causes the hole position to deviate. If the hole position deviates between the plates, it leads to increased losses.

[0007] The present invention was made in view of the above circumstances, and its object is to provide a probe holder and probe unit that can suppress the increase of loss at high frequencies.

[0008] To address the aforementioned problems and achieve the objective, the present invention relates to a probe holder that holds a contact probe whose two ends, respectively, are in contact with electrodes of a contact object in the longitudinal direction. The probe holder comprises: a first stacked member formed by stacking multiple members; and a second stacked member formed by stacking multiple members and engaging with the first stacked member. The first and second stacked members each have: a first member made of a material with a low dielectric constant; a second member disposed on one surface of the first member and having a higher rigidity than the first member; and a third member disposed on another surface of the first member and having a higher rigidity than the first member. The probe holder is formed by engaging the first and second stacked members with the third member. The probe holder has a retaining hole that extends through the stacking direction of the first and second stacked members, and the retaining hole has a stepped hole with a reduced diameter on the second member side.

[0009] Furthermore, the probe holder of the present invention has, in the above invention, a countersunk portion, which, in the second component and / or the third component, forms a hollow space by a through hole formed around the retaining hole.

[0010] Furthermore, in the probe holder of the present invention, the countersunk portion has: a first countersunk portion, which forms a hollow space by a through hole formed on the second component of the first stacked component; a second countersunk portion, which forms a hollow space by a through hole formed on the second component of the second stacked component; and a third countersunk portion, which forms a hollow space by through holes formed on the third component of the first stacked component and the second stacked component respectively.

[0011] Furthermore, in the probe holder of the present invention, the countersunk portion uses the surface of the first component as the bottom surface.

[0012] Furthermore, the probe unit of the present invention comprises: a contact probe, which contacts an electrode of a contact object at both ends in the longitudinal direction; and a probe holder having an insulating main body portion that holds the contact probe. The probe holder comprises: a first stacked member formed by stacking multiple members; and a second stacked member formed by stacking multiple members and engaging with the first stacked member. The first stacked member and the second stacked member each have: a first member made of a material with a low dielectric constant; a second member disposed on one surface of the first member and having a higher rigidity than the first member; and a third member disposed on another surface of the first member and having a higher rigidity than the first member. The probe holder is formed by engaging the third member of the first stacked member and the second stacked member with each other. The probe holder has a retaining hole that extends through the stacking direction of the first stacked member and the second stacked member, and the second member side of the retaining hole has a stepped hole shape with a reduced diameter.

[0013] According to the present invention, it is possible to suppress the increase in loss at high frequencies. Attached Figure Description

[0014] Figure 1 This is a perspective view showing the structure of the probe unit according to Embodiment 1 of the present invention.

[0015] Figure 2 This is a cross-sectional view showing the structure of the main parts of the probe unit according to Embodiment 1 of the present invention.

[0016] Figures 3A to 3C This is a cross-sectional view used to illustrate the manufacturing method of the probe holder according to Embodiment 1 of the present invention.

[0017] Figure 4 This is a top view showing the structure of the main parts of the probe unit according to Embodiment 1 of the present invention.

[0018] Figure 5 This is a cross-sectional view showing the structure of the main part of the probe unit according to Embodiment 2 of the present invention.

[0019] Figure 6 This is a top view showing the structure of the probe holder of the probe unit according to Embodiment 2 of the present invention.

[0020] Figure 7 This is a top view showing the structure of the main parts of the probe unit according to Embodiment 2 of the present invention.

[0021] Figure 8 This is a top view showing the structure of the main part of the probe unit involved in a variation of Embodiment 2 of the present invention.

[0022] Symbol Explanation

[0023] 1 probe unit

[0024] 2. Contact probe (probe)

[0025] 3. Probe mount

[0026] 21 First plunger

[0027] 22 Second plunger

[0028] 23. Coil spring

[0029] 34 First countersunk hole section

[0030] 35 Second countersunk hole section

[0031] 36 Third countersunk hole section

[0032] 100 Semiconductor Integrated Circuits

[0033] 200 Circuit Board

[0034] 31 Retaining Hole

[0035] 32 First stacked component

[0036] 33 Second-layer components

[0037] 321, 331 First Component

[0038] 322, 332 Second Component

[0039] 323, 333 Third Component

[0040] 400 First-layer base material

[0041] 410 Second-layer base material

[0042] 401, 411 First parent material

[0043] 402, 412 Second Base Material

[0044] 403, 413 Third parent material

[0045] 420, 421 Through holes Detailed Implementation

[0046] The embodiments for carrying out the present invention will now be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below. Furthermore, the figures referenced in the following description are merely schematic representations of shapes, sizes, and positional relationships to the extent that the content of the present invention can be understood. Therefore, the present invention is not limited to the shapes, sizes, and positional relationships illustrated in the figures.

[0047] Implementation Method 1

[0048] Figure 1 This is a perspective view showing the structure of the probe unit according to Embodiment 1 of the present invention. Figure 1 The probe unit 1 shown is a device used to detect the electrical characteristics of the semiconductor integrated circuit 100, which is the object to be detected. It is a device that electrically connects the semiconductor integrated circuit 100 to the circuit board 200 that outputs detection signals to the semiconductor integrated circuit 100.

[0049] The probe unit 1 includes: a conductive contact probe 2 (hereinafter referred to as "probe 2"), which is in contact with the electrodes of two different contact objects at both ends in the length direction, the two contact objects being a semiconductor integrated circuit 100 and a circuit board 200; a probe holder 3, which houses and holds a plurality of probes 2 according to a prescribed pattern; and a holding member 4, which is disposed around the probe holder 3 to suppress positional deviation of the semiconductor integrated circuit 100 in contact with the plurality of probes 2 during detection.

[0050] Figure 2 This is a cross-sectional view showing the structure of the main parts of the probe unit according to Embodiment 1 of the present invention. Figure 2 The probe 2 shown is made of a conductive material and includes: a first plunger 21, which contacts the electrodes of the semiconductor integrated circuit 100 when detecting the semiconductor integrated circuit 100; a second plunger 22, which contacts the electrodes of the circuit board 200 having a detection circuit; and a helical spring 23, which is disposed between the first plunger 21 and the second plunger 22 and connects the first plunger 21 and the second plunger 22 in a telescoping manner. The first plunger 21, the second plunger 22, and the helical spring 23 constituting the probe 2 have a coaxial axis. When the probe 2 contacts the semiconductor integrated circuit 100, the extension and retraction of the helical spring 23 in the axial direction mitigates the impact on the electrodes of the semiconductor integrated circuit 100 while applying a load to the semiconductor integrated circuit 100 and the circuit board 200.

[0051] The first plunger 21 has a flange 21a, which has the maximum diameter of the first plunger 21.

[0052] The second plunger 22 abuts against an electrode formed on the circuit board 200. The second plunger 22 has a flange portion 22a, which has the maximum diameter of the second plunger 22. In this embodiment 1, the diameter of the flange portion 21a is the same as the diameter of the flange portion 22a. Here, the diameter of the flange portion corresponds to the length in a direction orthogonal to the axial direction of the probe.

[0053] The first plunger 21 side of the helical spring 23 has a tightly wound portion 23a, while the second plunger 22 side has a loosely wound portion 23b. The end of the tightly wound portion 23a is pressed into the first plunger 21 and abuts against the flange portion 21a. On the other hand, the end of the loosely wound portion 23b is pressed into the second plunger 22 and abuts against the flange portion 22a. Furthermore, the first plunger 21 and the second plunger 22 are joined to the helical spring 23 by the spring's winding force and / or welding.

[0054] The probe holder 3 has multiple retaining holes 31 for receiving the probes 2. These retaining holes 31 are through holes that penetrate the first stacked member 32 and the second stacked member 33 in the stacking direction of the first stacked member 32 and the second stacked member 33. The location of the retaining holes 31 is determined according to the configuration pattern of the probes 2. Figure 2 The image shows an example of keeping the central axis of the hole 31 aligned with the length axis of the probe 2.

[0055] The retaining hole 31 is formed as a stepped hole with different diameters along the through direction. That is, the retaining hole 31 is a hole with diameters decreasing at both ends, and it consists of a first small-diameter portion 31a with an opening on the upper end face of the probe holder 3, a large-diameter portion 31b with a diameter larger than the first small-diameter portion 31a, and a second small-diameter portion 31c with an opening on the lower end face of the probe holder 3. The shape (diameter) of the retaining hole 31 depends on the structure of the probe 2 housed within it. Since the flange portion 21a of the first plunger 21 abuts against the boundary wall between the first small-diameter portion 31a and the large-diameter portion 31b, it has the function of preventing the probe 2 from falling out of the probe holder 3. Furthermore, since the flange portion 22a of the second plunger 22 abuts against the boundary wall between the large-diameter portion 31b and the second small-diameter portion 31c, it also has the function of preventing the probe 2 from falling out of the probe holder 3.

[0056] Probe holder 3 is composed of Figure 2 It is formed by stacking the first stacked component 32 located on the upper side and the second stacked component 33 located on the lower side.

[0057] The first stacked component 32 is composed of the first component 321. Figure 2 It is composed of a second component 322 located above the first component 321 and a third component 323 located below the first component 321.

[0058] The second stacked component 33 is composed of the first component 331. Figure 2 It is composed of a second component 332 located below the first component 331 and a third component 333 located above the first component 331.

[0059] Here, the first components 321 and 331 are formed using a material with a low dielectric constant. Examples of materials with a low dielectric constant include those with a relatively low dielectric constant, such as materials having a relative dielectric constant of 1.5 to 2.5. Examples of such materials include PTFE. In this embodiment 1, an example of using PTFE to form the first components 321 and 331 will be described.

[0060] On the other hand, the second components 322, 332 and the third components 223, 333 are formed using a material that is harder than the material used to form the first component. Examples of such materials include super engineering plastics such as PEEK, polyimide, polyamide, and PPS. In this embodiment 1, an example of forming the second components 322, 332 and the third components 223, 333 using PEEK will be described.

[0061] In other words, each of the stacked components has a structure in which rigid PEEK sandwiches PTFE with a low dielectric constant in the middle.

[0062] Furthermore, the third component 323 of the first stacked component 32 is joined with the third component 333 of the second stacked component 33 to form the probe holder 3.

[0063] Here, refer to Figures 3A to 3C The manufacturing method of probe holder 3 will be explained. Figures 3A to 3C This is a cross-sectional view used to illustrate the manufacturing method of the probe holder according to Embodiment 1 of the present invention.

[0064] First, prepare the first-layer base material 400 and the second-layer base material 410 (refer to...). Figure 3A ).

[0065] The first laminated substrate 400 is formed by sandwiching and bonding a plate-shaped first substrate 401 made of PTFE with a low dielectric constant between a second substrate 402 and a third substrate 403 made of rigid PEEK.

[0066] The second laminated substrate 410 is formed by sandwiching and bonding a plate-shaped first substrate 411 made of PTFE with a low dielectric constant between a second substrate 412 and a third substrate 413 made of rigid PEEK.

[0067] At this point, known joining methods such as adhesives and crimping sheets can be used for joining the base materials.

[0068] Then, through holes are formed on each of the laminated base materials (see reference). Figure 3BSpecifically, a through hole 420 is formed in the first laminated base material 400. This through hole 420 is a stepped hole with a diameter decreasing on the second base material 402 side. Furthermore, a through hole 421 is formed in the second laminated base material 410. This through hole 421 is a stepped hole with a diameter decreasing on the second base material 412 side. By forming the through holes, a first laminated component 32 with the through hole 420 and a second laminated component 33 with the through hole 421 are manufactured.

[0069] After forming the through hole, the first stacked component 32 is joined to the second stacked component 33. Figure 3C The probe holder 3 is fabricated by joining the third part 323 of the first stacked component 32 with the third part 333 of the second stacked component 33 in such a way that the positions of the through holes are aligned.

[0070] In addition, when manufacturing the probe unit, the probe 2 is appropriately arranged in the through hole before the first stacked component 32 and the second stacked component 33 are joined.

[0071] Figure 4 This diagram illustrates the state when the semiconductor integrated circuit 100 is tested using the probe holder 3. During testing of the semiconductor integrated circuit 100, the helical spring 23 is compressed along its length due to the contact load from the semiconductor integrated circuit 100. When the helical spring 23 is compressed, as... Figure 4 As shown, the tightly wound portion 23a contacts the base end side of the second plunger 22. This enables reliable electrical conduction. At this time, the base end side of the second plunger 22 extends below the tightly wound portion 23a, thus preventing a significant deviation of the axis of the second plunger 22.

[0072] During detection, the detection signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 travels from the electrode 201 of the circuit board 200 through the second plunger 22, the tightly wound portion 23a, and the first plunger 21 of the probe 2 to the connection electrode 101 of the semiconductor integrated circuit 100. Thus, in the probe 2, since the first plunger 21 and the second plunger 22 are connected via the tightly wound portion 23a, the conduction path of the electrical signal is minimized. Therefore, it is possible to prevent the signal from flowing through the sparsely wound portion 23b during detection and to stabilize the inductance.

[0073] In Embodiment 1 described above, the probe holder 3 with the retaining hole 31 is formed as a two-layer structure consisting of a first stacked component 32 and a second stacked component 33 joined together. The first stacked component 32 is formed by sandwiching a first component 321 made of PTFE between a second component 322 and a third component 323 made of PEEK. Similarly, the second stacked component 33 is formed by sandwiching a first component 331 made of PTFE between a second component 332 and a third component 333 made of PEEK. In this case, when forming holes in each stacked component, since the PTFE is sandwiched by PEEK, warping during hole formation can be suppressed, and the reduction in the positional accuracy of the formed holes can be suppressed. By suppressing warping and ensuring that the holes in each component are formed in appropriate positions, the reduction in frequency characteristics can be suppressed, particularly the increase in loss at high frequencies.

[0074] Furthermore, according to Embodiment 1, by forming the components constituting the probe holder 3 with PTFE, the characteristic impedance can be adjusted, and since it contains PEEK, the strength of the probe holder 3 can be ensured. At this time, in order to improve the high-frequency characteristics, it is only necessary to reduce the proportion of PEEK, while in order to improve the strength, it is only necessary to increase the proportion of PEEK.

[0075] Furthermore, according to Embodiment 1, PEEK is present in the central part of the component in the stacking direction of the probe holder 3, thus improving the balance of strength in the stacking direction.

[0076] Implementation Method 2

[0077] Next, Embodiment 2 of the present invention will be described. Figure 5 This is a cross-sectional view showing the structure of the main parts of the probe unit according to Embodiment 2 of the present invention. The probe unit according to Embodiment 2 includes a probe holder 3A, which replaces the probe holder 3 of the probe unit 1 described above. The structure other than the probe holder 3A is the same as that of Embodiment 1, and therefore its description is omitted.

[0078] The probe holder 3A includes the first stacked member 32 and the second stacked member 33 described above. The probe holder 3A has the aforementioned retaining hole 31, and a first countersunk portion 34 to a third countersunk portion 36 that are provided around the retaining hole 31 and are in the shape of a groove.

[0079] The first countersunk hole 34 is formed on the side of the second component 322. The first countersunk hole 34 is formed by a hole penetrating the second component 322 and the outer surface of the first component 321, and is a bottomed hole with the surface of the first component 321 as the bottom surface.

[0080] The second countersunk hole 35 is formed on the side of the second component 332. The second countersunk hole 35 is a bottomed hole formed by a hole penetrating the second component 332 and the outer surface of the first component 331.

[0081] The third countersunk portion 36 is formed at the center of the component constituting the probe holder 3A in the stacking direction. The third countersunk portion 36 forms a space formed by the outer surfaces of the first components 321 and 331 sealing the holes that pass through the third components 323 and 333, respectively.

[0082] Figure 6 This is a top view showing the structure of the probe holder of the probe unit according to Embodiment 2 of the present invention. Figure 7 This is a top view showing the structure of the main parts of the probe unit according to Embodiment 2 of the present invention. Figure 6 and Figure 7 Corresponding to viewing from above Figure 5 The diagram shows a probe holder. Here, we examine an example where three adjacent probes 2 are arranged such that the central probe 2 is in contact with the signal transmission electrode, and the other probes 2 are connected to the grounding electrode. In this case, the probe 2 connected to the signal electrode is designated as probe 2S, and the probe 2 connected to the grounding electrode is designated as probe 2G. Around these probes 2S and 2G, countersunk holes are formed (only the first countersunk hole 34 is shown in the diagram).

[0083] In Embodiment 2 described above, the effects of Embodiment 1 can be achieved, and in the probe holder 3A, a countersunk hole is provided around the probe 2, thereby further reducing the insertion loss on the high-frequency side. According to Embodiment 2, by forming the countersunk hole, the attenuation of the high-frequency signal can be further suppressed.

[0084] Variations of Implementation Method 2

[0085] Next, refer to Figure 8 A variation of implementation method 2 is described. Figure 8 This is a top view showing the structure of the main part of the probe unit involved in a variation of Embodiment 2 of the present invention. Figure 8 Corresponding to viewing from above Figure 5 The diagram shows the probe holder. Here, in a modified example, for the four adjacent probes 2, the two central probes 2 are used as signal transmission probes 2S, and the two probes on both sides are used as grounding probes 2G. Around these probes 2S and 2G, countersunk holes are formed (in... Figure 8 Only the first countersunk portion 34 is shown in the diagram. Even when configured as described above with the GSSG structure, the insertion loss on the high-frequency side can be reduced by providing a countersunk portion around the probe 2.

[0086] Furthermore, in the modified embodiment 2 described above, an example of forming a countersunk hole on components (the second and third components) made of PEEK was described. However, the countersunk hole can be formed on a portion of the second and third components, or it can be formed on the first component made of PTFE. In this case, the countersunk hole formed on the first component can be a through hole, or it can be a hole with a closed space formed at one or both ends.

[0087] Furthermore, in the variation of Embodiment 2 described above, an example of an elliptical opening was described as the countersunk hole portion, but other shapes such as a perfect circle, a shape formed by text, a polygon, or a star can also be used. By giving the opening a unique shape, the recognizability of the countersunk hole portion can be improved, and the placement of the probe 2 can be easily confirmed.

[0088] As described above, the present invention may include various embodiments not described herein, and various design changes may be made without departing from the technical concept defined in the claims.

[0089] Furthermore, the contact probe structure described here is merely an example, and various types of known probes can be applied. For example, it is not limited to the plunger and coil spring described above, but can also include: probes with tubular components, spring pins, solid conductive components, conductive tubing, wire probes, or connecting terminals (connectors) for connecting electrical contacts, and these probes can be appropriately combined.

[0090] As described above, the probe holder and probe unit of the present invention are suitable for suppressing increased loss at high frequencies.

Claims

1. A probe holder that holds a contact probe whose two ends, respectively, in contact with an electrode of a contact object in the longitudinal direction, characterized in that, have: The first stacked component is composed of multiple stacked components; and The second stacked component, which is composed of multiple stacked components, is coupled to the first stacked component. The first stacked component and the second stacked component each have: The first component is made of a material with a low dielectric constant; The second component is disposed on one surface of the first component and has a higher degree of hardness than the first component; as well as A third component is disposed on another surface of the first component and has a higher degree of hardness than the first component. The probe holder is formed by joining the third component of the first stacked component and the second stacked component together. The probe holder has a retaining hole that extends through the stacking direction of the first and second stacked components, and the retaining hole has a stepped shape with a reduced diameter on the second component side.

2. The probe holder according to claim 1, characterized in that, have: The countersunk portion, in the second component and / or the third component, is formed into a hollow space by through holes formed around the retaining hole.

3. The probe holder according to claim 2, characterized in that: The countersunk portion has: The first countersunk portion has a hollow space formed by a through hole formed on the second component of the first stacked component; The second countersunk portion forms a hollow space by a through hole formed on the second component of the second stacked component; as well as The third countersunk portion forms a hollow space by through holes formed on the third component of the first stacked component and the second stacked component respectively.

4. The probe holder according to claim 3, characterized in that: The countersunk hole section uses the surface of the first component as its bottom surface.

5. A probe unit, characterized in that, have: Contact probes, whose two ends along their length respectively contact the electrodes of the contact object; and A probe holder having an insulating main body portion that holds the contact probe. The probe holder includes: The first stacked component is composed of multiple stacked components; and The second stacked component, which is composed of multiple stacked components, is coupled to the first stacked component. The first stacked component and the second stacked component each have: The first component is made of a material with a low dielectric constant; The second component is disposed on one surface of the first component and has a higher degree of hardness than the first component; as well as A third component is disposed on another surface of the first component and has a higher degree of hardness than the first component. The probe holder is formed by joining the third component of the first stacked component and the second stacked component together. The probe holder has a retaining hole that extends through the stacking direction of the first and second stacked components, and the retaining hole has a stepped shape with a reduced diameter on the second component side.

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