A stress cone surface pressure acquisition method, system, device and storage medium

Abstract

The present application belongs to the field of high-voltage cable assembly testing, and particularly relates to a stress cone surface pressure obtaining method, system, device and storage medium, which comprises the following steps: obtaining a simulation device; defining the materials of an epoxy joint, a spring device, a semiconductor rubber assembly, an insulating rubber assembly and a cable, wherein the semiconductor rubber assembly and the insulating rubber assembly constitute a stress cone; constructing a stress cone simulation model based on the structural relationship and material definition of the epoxy joint, the spring device, the stress cone and the cable; setting the constraint conditions of the stress cone simulation model to obtain a constraint model; obtaining a first contact surface of the epoxy joint and a second contact surface of the stress cone based on a contact condition; obtaining the contact area and the contact pressure in real time based on an operation condition and the constraint model; and obtaining the stress cone surface pressure based on the contact pressure and the contact area. The present application can calculate the pressure of the contact surface at each moment during the process of inserting the stress cone into the epoxy joint.

Description

Technical Field

[0001] This invention belongs to the field of high-voltage cable assembly testing, specifically relating to a method, system, equipment, and storage medium for obtaining surface pressure of a stress cone. Background Technology

[0002] With the advancement of technology, my country's high-speed rail and urban rail transit are developing rapidly, greatly facilitating people's daily travel. High-voltage cable assemblies are a key component of high-speed rail and urban rail transit systems. They connect the pantograph and onboard transformer of electric locomotives and are core components ensuring safe vehicle operation. High-voltage electricity is transmitted between two carriages via the high-voltage cable assembly, therefore, the safety performance of the high-voltage cable assembly must be guaranteed. The high-voltage cable assembly includes epoxy joints and stress cones, etc. The cable is inserted into the stress cone, which is then pushed into the epoxy joint by a spring device. The pressure at the contact surface between the stress cone and the epoxy joint when the stress cone is inserted has a significant impact on the safety performance of the high-voltage cable assembly.

[0003] In related technologies, the pressure at the contact surface between the stress cone and the epoxy joint is mainly obtained by measuring the interface pressure after the stress cone is fully inserted into the epoxy joint, and the entire contact surface is used as the contact area.

[0004] Regarding the aforementioned technologies, as the thrust from the bottom spring device gradually increases, the contact area between the stress cone and the epoxy joint gradually increases. Therefore, the contact area between the stress cone and the epoxy joint changes in real time. Moreover, it cannot be guaranteed that the entire contact surface is in contact when fully inserted. Inaccurate acquisition of the contact area leads to inaccurate data on the interface pressure. In actual products, the average interface pressure should be greater than 0.3 MPa; otherwise, there is a risk of current breakdown. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to obtain the interface pressure in real time as the stress cone is inserted into the epoxy joint, so as the thrust of the stress cone gradually increases under the thrust of the bottom spring device, and to prevent the actual product from being damaged by current. This application provides a method, system, device and storage medium for obtaining the surface pressure of the stress cone.

[0006] A method for obtaining surface pressure of a stress cone includes:

[0007] Obtain simulation devices, which include epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, and cables;

[0008] Material definitions are provided for the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly, and cable, wherein the semiconductor rubber assembly and the insulating rubber assembly constitute a stress cone;

[0009] A stress cone simulation model is constructed based on the structural relationships of the epoxy joint, the spring device, the stress cone, and the cable, as well as the material definition.

[0010] The constraint model is obtained by setting the constraint conditions of the stress cone simulation model;

[0011] Set the contact conditions between the stress cone and the epoxy joint;

[0012] Based on the aforementioned contact conditions, the first contact surface of the epoxy joint and the second contact surface of the stress cone are obtained;

[0013] Obtain runtime conditions;

[0014] Based on the operating conditions and the constraint model, the contact area of ​​the second contact surface and the contact pressure between the first contact surface and the second contact surface are obtained in real time.

[0015] The surface pressure of the stress cone is obtained based on the contact pressure and the contact area.

[0016] Optionally, defining the materials for the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly, and cable includes:

[0017] The material of the semiconductor rubber component is defined as semiconductor rubber material, the material of the insulating rubber component is insulating rubber material, the material of the epoxy joint is epoxy resin material, the stiffness of the spring device is a preset stiffness, and the material of the cable is a preset material.

[0018] Optionally, the construction of the stress cone simulation model based on the structural relationships of the epoxy joint, the spring device, the stress cone, and the cable, and the material definition, includes:

[0019] The semiconductor rubber assembly and the insulating rubber assembly are connected to form a stress cone. The stress cone has a through hole extending along its length. The cable is inserted into the through hole of the stress cone and is interference-fitted with the stress cone. The stress cone is inserted into the epoxy joint. The spring device abuts against the semiconductor rubber assembly and is used to push the stress cone into the epoxy joint. In the initial state, the stress cone is not inserted into the epoxy joint.

[0020] Optionally, setting the constraint conditions of the stress cone simulation model to obtain the constraint model includes:

[0021] The simulation device is meshed;

[0022] Based on the aforementioned constraints, all constraints are applied to the cable and the epoxy joint, wherein U1 = U2 = U3 = UR1 = UR2 = UR3 = 0, the stress cone and the spring device are in ordinary contact, and the mesh division of the semiconductor rubber assembly is bound to the mesh division of the insulating rubber assembly to obtain the constraint model.

[0023] Optionally, obtaining the first contact surface of the epoxy joint and the second contact surface of the stress cone based on the contact conditions includes:

[0024] Based on the aforementioned contact conditions, a standard contact pair is established between the stress cone and the epoxy joint;

[0025] The inclined surface where the epoxy joint contacts the stress cone is designated as the first contact surface, and the inclined surface where the stress cone contacts the epoxy joint is designated as the second contact surface.

[0026] Optionally, the step of obtaining the contact area of ​​the second contact surface and the contact pressure between the first contact surface and the second contact surface in real time based on the operating conditions includes:

[0027] Set up real-time contact pressure and contact area statements;

[0028] Based on the real-time contact pressure statement, the contact pressure is obtained in real time;

[0029] The contact area is obtained in real time based on the contact area statement.

[0030] Optionally, before acquiring the contact area of ​​the second contact surface and the contact pressure between the first and second contact surfaces in real time based on the operating conditions, the following steps are included:

[0031] Based on the operating conditions, a preset thrust is applied to the spring device;

[0032] Based on the preset thrust, the stress cone is pushed into the epoxy joint, and the contact area of ​​the second contact surface and the contact pressure between the first contact surface and the second contact surface are obtained in real time during the process of the stress cone being inserted into the epoxy joint.

[0033] A stress cone surface pressure acquisition system, comprising:

[0034] The first acquisition module is used to acquire simulation devices, which include epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, and cables;

[0035] The definition module defines the materials for the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly and cable. The semiconductor rubber assembly and the insulating rubber assembly form a stress cone.

[0036] The construction module is used to build a stress cone simulation model based on the structural relationships and material definitions of the epoxy joint, the spring device, the stress cone, and the cable.

[0037] The first setting module is used to set the constraint conditions of the stress cone simulation model to obtain the constraint model;

[0038] The second setting module is used to set the contact conditions between the stress cone and the epoxy joint;

[0039] The second acquisition module is used to obtain the first contact surface of the epoxy joint and the second contact surface of the stress cone based on the contact conditions.

[0040] The third acquisition module is used to acquire the running conditions;

[0041] The fourth acquisition module is used to acquire, in real time, the contact area of ​​the second contact surface and the contact pressure between the first contact surface and the second contact surface based on the operating conditions and the constraint model.

[0042] The calculation module is used to obtain the surface pressure of the stress cone based on the contact pressure and the contact area.

[0043] Based on the same inventive concept, this application also provides a terminal device.

[0044] A terminal device includes a memory and a processor, the memory storing a computer program that can run on the processor, and the processor loading and executing the computer program employs a method for obtaining surface pressure of a stress cone.

[0045] Based on the same inventive concept, this application also provides a computer-readable storage medium.

[0046] A computer-readable storage medium storing a computer program, which, when loaded and executed by a processor, employs a method for obtaining surface pressure of a stress cone.

[0047] The beneficial effect of this invention is that, after applying a preset thrust to the spring device, traditional designs only roughly calculate the area of ​​the contact surface between the stress cone and the epoxy joint, or use the entire contact surface of the stress cone as the contact area. Inaccurate calculation of the contact area will lead to inaccurate calculation of the surface pressure of the stress cone. The average pressure at the interface should be greater than 0.3 MPa, otherwise there is a risk of current breakdown. With this invention, as the stress cone is pushed into the stress cone by the spring device, the contact area between the stress cone and the epoxy joint can be obtained in real time, making the calculated surface pressure of the stress cone more accurate and improving the safety performance of the high-voltage cable assembly. Attached Figure Description

[0048] Figure 1 This is a flowchart illustrating one embodiment of a method for obtaining stress cone parameters according to an embodiment of this application;

[0049] Figure 2 This is a schematic diagram of the stress cone structure in an embodiment of this application;

[0050] Figure 3 This is a schematic diagram showing the relationship between the stress cone and the epoxy joint structure in an embodiment of this application;

[0051] Figure 4 This is a schematic diagram showing the relationship between the stress cone and the epoxy joint contact surface in an embodiment of this application.

[0052] Explanation of reference numerals in the attached drawings: 1. Epoxy joint; 2. Insulating rubber assembly; 3. Spring device; 4. Semiconductor rubber assembly; 5. Cable; 6. Stress cone; 7. First contact surface; 8. Second contact surface. Detailed Implementation

[0053] A method for obtaining surface pressure of a stress cone 6, such as Figure 1 As shown, it includes:

[0054] S100. Obtain the simulation device, which includes an epoxy joint 1, a spring device 3, a semiconductor rubber assembly 4, an insulating rubber assembly 2, and a cable 5.

[0055] Specifically, the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5 are part of the entire simulation device. The epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5 constitute the entire stress cone 6 simulation model. Semiconductor rubber assembly 4 and insulating rubber assembly 2 form the stress cone 6, which is cone-shaped with a through hole in the middle for the cable 5 to pass through. The stress cone 6 is inserted into the epoxy joint 1, and the spring device 3 pushes the stress cone 6 inward, thus fixing the stress cone 6 inside the epoxy joint 1.

[0056] S110 defines the materials for epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2 and cable 5. Semiconductor rubber assembly 4 and insulating rubber assembly 2 constitute stress cone 6.

[0057] Specifically, the material definition is used to simulate the performance of each material during the simulation. Therefore, each material needs to be defined as the required material. For example, the material of semiconductor rubber component 4 should be defined as semiconductor rubber.

[0058] S120. Based on the structural relationships and material definitions of epoxy joint 1, spring device 3, stress cone 6 and cable 5, a simulation model of stress cone 6 is constructed.

[0059] Specifically, the structural relationship is the connection relationship between the simulated devices. For example, the semiconductor rubber is connected to the insulating rubber component 2, and the epoxy joint 1 has a socket adapted to the insertion of the stress cone 6. The whole consisting of the semiconductor rubber component 4 and the insulating rubber component 2, namely the stress cone 6, is inserted into the epoxy joint 1.

[0060] S130. Set the constraint conditions for the stress cone 6 simulation model to obtain the constraint model.

[0061] Specifically, the constraint condition is the fixed relationship of the simulation device during the simulation process. For example, cable 5 and epoxy connector 1 must be completely constrained, that is, no matter what conditions are applied, cable 5 and epoxy connector 1 will remain stationary.

[0062] S140. Set the contact conditions between the stress cone 6 and the epoxy joint 1.

[0063] Specifically, the contact conditions are set during simulation to determine how the stress cone 6 and the epoxy joint 1 make contact, such as normal contact or interference contact.

[0064] S150. Based on the contact conditions, the first contact surface 7 of the epoxy joint 1 and the second contact surface 8 of the stress cone 6 are obtained.

[0065] Specifically, after setting the contact conditions, ensuring that the stress cone 6 and the epoxy joint 1 are in contact, the first contact surface 7 is the surface where the inclined surface of the epoxy joint 1 contacts the stress cone 6, and the second contact surface 8 is the surface where the stress cone 6 contacts the epoxy joint 1.

[0066] S160, Obtain operating conditions.

[0067] Specifically, the operating conditions are as follows: when the pressure at the interface of stress cone 6 is obtained, that is, when stress cone 6 is slowly pushed into epoxy joint 1, and stress cone 6 is pushed by spring device 3, so the operating conditions are to apply a certain thrust to spring device 3.

[0068] S170. Based on the operating conditions and constraint model, the contact area of ​​the second contact surface 8 and the contact pressure of the first contact surface 7 and the second contact surface 8 are obtained in real time.

[0069] Specifically, the contact area and contact pressure are achieved by setting statements in the simulation software. This embodiment uses Abaqus simulation software as an example, adding statements for real-time contact pressure and real-time contact area to the calculation input file.

[0070] S180. Based on the contact pressure and contact area, the surface pressure of stress cone 6 is obtained.

[0071] Specifically, the surface pressure of stress cone 6 = contact pressure / contact area.

[0072] In one embodiment of this invention, step S110, which involves defining the materials for the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5, includes:

[0073] S200, the material of the semiconductor rubber component 4 is defined as semiconductor rubber material, the material of the insulating rubber component 2 is insulating rubber material, the material of the epoxy joint 1 is epoxy resin material, the stiffness of the spring device 3 is a preset stiffness, and the material of the cable 5 is a preset material.

[0074] Specifically, different materials produce different effects during simulation. For example, the semiconductor rubber component 4 and the insulating rubber component 2 use different rubber materials and have different conductivity properties. The specific material is defined according to the material of the product being measured. In this application, since the semiconductor rubber component 4 and the insulating rubber component 2 are a single unit, the coefficients of thermal expansion used are almost the same, only the materials are different—one is insulating rubber and the other is semiconductor rubber. In this embodiment, the spring stiffness of the spring device 3 is defined as 0.1 kN / mm, but it can also be defined according to the product. The material and type of the cable 5 are also set according to the actual material.

[0075] In one embodiment of this example, step S120, which involves constructing a simulation model of the stress cone 6 based on the structural relationships and material definitions of the epoxy joint 1, the spring device 3, the stress cone 6, and the cable 5, includes:

[0076] S300, the semiconductor rubber component 4 and the insulating rubber component 2 are connected to form a stress cone 6. The stress cone 6 has a through hole that runs through the length direction. The cable 5 is inserted into the through hole of the stress cone 6 and the cable 5 is interference-fitted with the stress cone 6. The stress cone 6 is inserted into the epoxy joint 1. The spring device 3 abuts against the semiconductor rubber component 4. The spring device 3 is used to push the stress cone 6 into the epoxy joint 1. In the initial state, the stress cone 6 is not inserted into the epoxy joint 1.

[0077] Specifically, such as Figure 2 and Figure 3As shown, the semiconductor rubber component 4 and the insulating rubber component 2 constitute the stress cone 6. The semiconductor rubber component 4 and the insulating rubber component 2 are injection molded, and their contact surfaces are arc-shaped. The stress cone 6 has two conical surfaces with different angles. A through-hole is opened in the middle of the stress cone 6, running along its length. The cable 5 is inserted into the through-hole and interference-fitted with it. The epoxy connector 11 has a socket for accommodating the conical surface of the stress cone 6. The spring device 3 pushes the stress cone 6 into the socket of the epoxy connector 1, fixing the stress cone 6 and the epoxy connector 1 together. When the spring device 3 pushes the stress cone 6, the applied force is fixed, and the direction of the push is along the length of the stress cone 6. After defining the structure of each simulation device, and then defining the material of each simulation device, the simulation model of the stress cone 6 is obtained.

[0078] In one embodiment of this example, step S110, which involves setting the constraint conditions of the stress cone 6 simulation model to obtain the constraint model, includes:

[0079] S400: Mesh the simulation device.

[0080] Specifically, meshing is the process of dividing a model or geometry into small geometric units (such as triangles, quadrilaterals, hexagons, tetrahedrons, hexahedrons, etc.). Meshing can better define boundary conditions and loading, so as to accurately describe the constraints and external effects of the model. During meshing, each simulation device is treated as a whole for meshing.

[0081] S410. Based on the constraint conditions, all constraints are applied to cable 5 and epoxy joint 1, where U1=U2=U3=UR1=UR2=UR3=0. Stress cone 6 and spring device 3 are set as ordinary contact pairs. The mesh of semiconductor rubber component 4 is bound to the mesh of insulating rubber component 2 to obtain the constraint model.

[0082] Specifically, U1, U2, and U3 represent the displacements of the node in the X, Y, and Z axes, respectively, indicating the amount of displacement of the node relative to its initial position in these axes. UR1, UR2, and UR3 represent the rotation angles of the node around the X, Y, and Z axes, respectively. These represent the rotational constraints of the node around the X, Y, and Z axes, and can be either fixed or free constraints. U1 = U2 = U3 = UR1 = UR2 = UR3 = 0 indicates that cable 5 and epoxy connector 1 are fixed. The constraint conditions represent the fixed relationships of the simulated components. The constraint model includes the connection relationships of the simulated components and their fixed relationships during the simulation. Fixed relationships include relative fixedness and absolute fixedness. Absolute fixedness means remaining stationary under all conditions, such as the epoxy connector and cable. Relative fixedness means they can move together, such as the semiconductor rubber assembly and the insulating rubber assembly.

[0083] like Figure 4 As shown, in one embodiment of this example, step S150, which involves obtaining the first contact surface 7 of the epoxy joint 1 and the second contact surface 8 of the stress cone 6 based on contact conditions, includes:

[0084] S500, Based on the contact conditions, the stress cone 6 and the epoxy joint 1 are set to a normal contact pair.

[0085] Specifically, the ordinary contact pair setting indicates that the stress cone 6 and the epoxy joint 1 are only in contact, and there are no other special requirements.

[0086] S510. The inclined surface where the epoxy joint 1 contacts the stress cone 6 is designated as the first contact surface 7, and the inclined surface where the stress cone 6 contacts the epoxy joint 1 is designated as the second contact surface 8.

[0087] Specifically, the first contact surface 7 is the inclined surface of the epoxy joint 1, which is the inclined surface that contacts the stress cone 6. Since the stress cone 6 has two conical surfaces along its length, when the stress cone 6 is inserted into the epoxy joint 1, one of the conical surfaces is inserted into the epoxy joint 1. The epoxy joint 1 has a hole that fits the conical surface of the epoxy joint 1. Therefore, the surface in contact between the epoxy joint 1 and the stress cone 6 is the inclined surface, which is the first contact surface 7, and the surface in contact between the stress cone 6 and the epoxy joint 1 is also the inclined surface, which is the second contact surface 8.

[0088] In one embodiment of this example, step S170, which involves obtaining the contact area of ​​the second contact surface 8 and the contact pressure between the first contact surface 7 and the second contact surface 8 in real time based on operating conditions, includes:

[0089] S600, set real-time contact pressure statement and contact area statement.

[0090] S610: Based on the real-time contact pressure statement, the contact pressure is obtained in real time.

[0091] S620: Based on the contact area statement, obtain the contact area in real time.

[0092] Specifically, add the following statement to the Abaqus calculation input file to display real-time contact pressure and real-time contact area: *Contact Output,master=M1,slave=S1 CAREA,CFNM, where M1 is the area of ​​the first contact surface 7 and S1 is the area of ​​the second contact surface 8, used to output the real-time contact pressure and real-time contact area. The specific statement may vary depending on the simulation software.

[0093] In one embodiment of this example, before step S170, which involves obtaining the contact area of ​​the second contact surface 8 and the contact pressure between the first contact surface 7 and the second contact surface 8 in real time based on operating conditions, the following steps are included:

[0094] S700, based on the operating conditions, apply a preset thrust to the spring device 3.

[0095] S710, based on the preset thrust, push the stress cone 6 into the epoxy joint 1.

[0096] Specifically, the preset thrust is set to 1200N in this embodiment. After the preset thrust is applied, the spring device 3 pushes the stress cone 6 into the epoxy joint 1. During the insertion process, the stress cone 6 and the epoxy joint 1 gradually connect from the lower part of the inclined plane to the upper part of the inclined plane. The contact area between the stress cone 6 and the epoxy joint 1 continuously increases until it remains unchanged after complete insertion. Therefore, the pressure on the contact surface also changes continuously and eventually tends to stabilize.

[0097] A stress cone surface pressure acquisition system, comprising:

[0098] The first acquisition module is used to acquire the simulation device, which includes an epoxy joint 1, a spring device 3, a semiconductor rubber assembly 4, an insulating rubber assembly 2, and a cable 5.

[0099] The definition module defines the materials for epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2 and cable 5. Semiconductor rubber assembly 4 and insulating rubber assembly 2 form stress cone 6.

[0100] The module is used to build a simulation model of stress cone 6 based on the structural relationships and material definitions of epoxy joint 1, spring device 3, stress cone 6 and cable 5.

[0101] The first setting module is used to set the constraint conditions of the stress cone 6 simulation model to obtain the constraint model;

[0102] The second setting module is used to set the contact conditions between the stress cone 6 and the epoxy joint 1;

[0103] The second acquisition module is used to obtain the first contact surface 7 of the epoxy joint 1 and the second contact surface 8 of the stress cone 6 based on the contact conditions.

[0104] The third acquisition module is used to acquire the running conditions;

[0105] The fourth acquisition module is used to acquire the contact area of ​​the second contact surface 8 and the contact pressure of the first contact surface 7 and the second contact surface 8 in real time based on the operating conditions and constraint model.

[0106] The calculation module is used to obtain the surface pressure of stress cone 6 based on contact pressure and contact area.

[0107] This application also discloses a terminal device, including a memory and a processor. The memory stores a computer program that can run on the processor. When the processor loads and executes the computer program, a method for obtaining the surface pressure of a stress cone is used.

[0108] The terminal device can be a computer device such as a desktop computer, a laptop computer, or a cloud server. The terminal device includes, but is not limited to, a processor and a memory. For example, the terminal device may also include input / output devices, network access devices, and buses.

[0109] The processor can be a central processing unit (CPU). Of course, depending on the actual use, it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc., and this application does not limit it in this regard.

[0110] The memory can be an internal storage unit of the terminal device, such as a hard disk or RAM of the terminal device, or an external storage device of the terminal device, such as a plug-in hard disk, smart memory card (SMC), secure digital card (SD), or flash memory card (FC) equipped on the terminal device. Furthermore, the memory can be a combination of internal storage units and external storage devices of the terminal device. The memory is used to store computer programs and other programs and data required by the terminal device. The memory can also be used to temporarily store data that has been output or will be output. This application does not limit this.

[0111] In this terminal device, the stress cone surface pressure acquisition method of the above embodiment is stored in the memory of the terminal device and loaded and executed on the processor of the terminal device for convenient use.

[0112] This application also discloses a computer-readable storage medium, which stores a computer program, wherein when the computer program is executed by a processor, it employs a stress cone surface pressure acquisition method described in the above embodiments.

[0113] The computer program can be stored in a computer-readable medium. The computer program includes computer program code, which can be in the form of source code, object code, executable file, or certain middleware. The computer-readable medium includes any entity or device capable of carrying computer program code, recording media, USB flash drive, portable hard drive, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the computer-readable medium includes, but is not limited to, the above-mentioned components.

[0114] The stress cone surface pressure acquisition method described in the above embodiments is stored in the computer-readable storage medium and loaded and executed on the processor to facilitate the storage and application of the above method.

[0115] The foregoing has described specific embodiments of the invention. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0116] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of protection of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of one or more embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0117] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. A method for obtaining surface pressure of a stress cone, characterized in that, include: Acquire a simulation device, which includes an epoxy joint (1), a spring device (3), a semiconductor rubber assembly (4), an insulating rubber assembly (2), and a cable (5); Material definitions are given for the epoxy joint (1), spring device (3), semiconductor rubber assembly (4), insulating rubber assembly (2) and cable (5), wherein the semiconductor rubber assembly (4) and the insulating rubber assembly (2) constitute a stress cone (6); Based on the structural relationship of the epoxy joint (1), the spring device (3), the stress cone (6), and the cable (5) and the material definition, a simulation model of the stress cone (6) is constructed. The constraint conditions of the stress cone (6) simulation model are set to obtain the constraint model; Set the contact conditions between the stress cone (6) and the epoxy joint (1); Based on the contact conditions, the first contact surface (7) of the epoxy joint (1) and the second contact surface (8) of the stress cone (6) are obtained; Obtain runtime conditions; Based on the operating conditions and the constraint model, the contact area of ​​the second contact surface (8) and the contact pressure of the first contact surface (7) and the second contact surface (8) are obtained in real time. Based on the contact pressure and the contact area, the surface pressure of the stress cone (6) is obtained; The simulation model of the stress cone (6) constructed based on the structural relationship and material definition of the epoxy joint (1), the spring device (3), the stress cone (6), and the cable (5) includes: The semiconductor rubber assembly (4) and the insulating rubber assembly (2) are connected to form a stress cone (6). The stress cone (6) has a through hole that extends along the length direction. The cable (5) is inserted into the through hole of the stress cone (6) and the cable (5) is interference-fitted with the stress cone (6). The stress cone (6) is inserted into the epoxy joint (1). The spring device (3) abuts against the semiconductor rubber assembly (4). The spring device (3) is used to push the stress cone (6) into the epoxy joint (1). In the initial state, the stress cone (6) is not inserted into the epoxy joint (1). The constraint conditions for setting the simulation model of the stress cone (6) to obtain the constraint model include: The simulation device is meshed; Based on the constraints, the cable (5) and the epoxy joint (1) are all constrained, where U1=U2=U3=UR1=UR2=UR3=0, the stress cone (6) and the spring device (3) are in normal contact, and the mesh of the semiconductor rubber assembly (4) is bound to the mesh of the insulating rubber assembly (2) to obtain the constraint model; The real-time acquisition of the contact area of ​​the second contact surface (8) and the contact pressure between the first contact surface (7) and the second contact surface (8) based on the operating conditions includes: Set up real-time contact pressure and contact area statements; Based on the real-time contact pressure statement, the contact pressure is obtained in real time; Based on the contact area statement, the contact area is obtained in real time; The process of obtaining the first contact surface (7) of the epoxy joint (1) and the second contact surface (8) of the stress cone (6) based on the contact conditions includes: Based on the contact conditions, the stress cone (6) and the epoxy joint (1) are configured as a normal contact pair; The inclined surface where the epoxy joint (1) contacts the stress cone (6) is set as the first contact surface (7), and the inclined surface where the stress cone (6) contacts the epoxy joint (1) is set as the second contact surface (8). Before acquiring the contact area of ​​the second contact surface (8) and the contact pressure between the first contact surface (7) and the second contact surface (8) in real time based on the operating conditions, the following steps are included: Based on the operating conditions, a preset thrust is applied to the spring device (3); Based on the preset thrust, the stress cone (6) is pushed into the epoxy joint (1).

2. The method for obtaining surface pressure of a stress cone as described in claim 1, characterized in that, The material definitions for the epoxy joint (1), spring device (3), semiconductor rubber assembly (4), insulating rubber assembly (2), and cable (5) include: The material of the semiconductor rubber component (4) is defined as semiconductor rubber material, the material of the insulating rubber component (2) is insulating rubber material, the material of the epoxy joint (1) is epoxy resin material, the stiffness of the spring device (3) is a preset stiffness, and the material of the cable (5) is a preset material.

3. A system for acquiring surface pressure of a stress cone, characterized in that, include: The first acquisition module is used to acquire the simulation device, which includes an epoxy joint (1), a spring device (3), a semiconductor rubber assembly (4), an insulating rubber assembly (2), and a cable (5); The definition module defines the materials of the epoxy joint (1), spring device (3), semiconductor rubber assembly (4), insulating rubber assembly (2) and cable (5), wherein the semiconductor rubber assembly (4) and the insulating rubber assembly (2) constitute a stress cone (6); A construction module is used to construct a simulation model of the stress cone (6) based on the structural relationship and material definition of the epoxy joint (1), the spring device (3), the stress cone (6), and the cable (5); The first setting module is used to set the constraint conditions of the stress cone (6) simulation model to obtain the constraint model; The second setting module is used to set the contact conditions between the stress cone (6) and the epoxy joint (1); The second acquisition module is used to obtain the first contact surface (7) of the epoxy joint (1) and the second contact surface (8) of the stress cone (6) based on the contact conditions. The third acquisition module is used to acquire the running conditions; The fourth acquisition module is used to acquire, in real time, the contact area of ​​the second contact surface (8) and the contact pressure of the first contact surface (7) and the second contact surface (8) based on the operating conditions and the constraint model; The calculation module is used to obtain the surface pressure of the stress cone (6) based on the contact pressure and the contact area; The simulation model of the stress cone (6) constructed based on the structural relationship and material definition of the epoxy joint (1), the spring device (3), the stress cone (6), and the cable (5) includes: The semiconductor rubber assembly (4) and the insulating rubber assembly (2) are connected to form a stress cone (6). The stress cone (6) has a through hole that extends along the length direction. The cable (5) is inserted into the through hole of the stress cone (6) and the cable (5) is interference-fitted with the stress cone (6). The stress cone (6) is inserted into the epoxy joint (1). The spring device (3) abuts against the semiconductor rubber assembly (4). The spring device (3) is used to push the stress cone (6) into the epoxy joint (1). In the initial state, the stress cone (6) is not inserted into the epoxy joint (1). The constraint conditions for setting the simulation model of the stress cone (6) to obtain the constraint model include: The simulation device is meshed; Based on the constraints, the cable (5) and the epoxy joint (1) are all constrained, where U1=U2=U3=UR1=UR2=UR3=0, the stress cone (6) and the spring device (3) are in normal contact, and the mesh of the semiconductor rubber assembly (4) is bound to the mesh of the insulating rubber assembly (2) to obtain the constraint model; The real-time acquisition of the contact area of ​​the second contact surface (8) and the contact pressure between the first contact surface (7) and the second contact surface (8) based on the operating conditions includes: Set up real-time contact pressure and contact area statements; Based on the real-time contact pressure statement, the contact pressure is obtained in real time; Based on the contact area statement, the contact area is obtained in real time; The process of obtaining the first contact surface (7) of the epoxy joint (1) and the second contact surface (8) of the stress cone (6) based on the contact conditions includes: Based on the contact conditions, the stress cone (6) and the epoxy joint (1) are configured as a normal contact pair; The inclined surface where the epoxy joint (1) contacts the stress cone (6) is set as the first contact surface (7), and the inclined surface where the stress cone (6) contacts the epoxy joint (1) is set as the second contact surface (8). Before acquiring the contact area of ​​the second contact surface (8) and the contact pressure between the first contact surface (7) and the second contact surface (8) in real time based on the operating conditions, the following steps are included: Based on the operating conditions, a preset thrust is applied to the spring device (3); Based on the preset thrust, the stress cone (6) is pushed into the epoxy joint (1).

4. A terminal device, comprising a memory and a processor, characterized in that, The memory stores a computer program that can run on a processor, and when the processor loads and executes the computer program, it employs the method of any one of claims 1 to 2.

5. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is loaded and executed by the processor, it employs the method described in any one of claims 1 to 2.

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