A stress cone parameter acquisition method, system, device and storage medium

Abstract

The present application belongs to the field of high-voltage cable assembly testing, and particularly relates to a stress cone parameter acquisition method, system, device and storage medium, the method comprising: obtaining a simulation device; performing material definition on an epoxy joint, a spring device, a semiconductor rubber assembly, an insulating rubber assembly, a cable and a virtual spring; constructing a stress cone simulation model based on the structural relationship and material definition of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, the virtual spring and the cable; obtaining constraint conditions of the stress cone simulation model; based on the constraint conditions, constraining the positional relationship of the stress cone simulation model to obtain a constrained simulation model; presetting an environmental temperature range; based on the environmental temperature range and the constrained simulation model, obtaining the displacement and load of the virtual spring, and taking the displacement and load of the virtual spring as stress cone parameters. The present application has the effect of simultaneously obtaining stress cone load and displacement.

Description

Technical Field

[0001] This invention belongs to the field of high-voltage cable assembly testing, specifically relating to a method, system, equipment, and storage medium for obtaining stress cone parameters. Background Technology

[0002] High-voltage cable assemblies are a critical component of high-speed railways and urban rail transit systems. They connect the pantograph and onboard transformer of electric locomotives and are a core component ensuring safe operation. High-voltage electricity is transmitted between two carriages via the high-voltage cable assembly; therefore, its safety performance must be guaranteed. Stress cones are one component of the high-voltage cable assembly. Composed of both insulating and semi-semiconductor rubber, stress cones expand outwards due to the high temperatures generated by the current during operation. To ensure safe operation, accurate testing of the stress cone's displacement and load at different temperatures is necessary.

[0003] In related technologies, the displacement and load of a stress cone are tested by first applying a fixed load to the stress cone at room temperature using a spring device, and then changing the ambient temperature to gradually increase the temperature of the stress cone. The rubber body of the stress cone expands and squeezes the spring device, thereby measuring the load or displacement of the spring device.

[0004] Regarding the aforementioned technologies, since the spring device applies a fixed load to ensure tight contact between the stress cone and the epoxy joint, when testing the displacement and load generated by the expansion of the stress cone rubber body, the force of the spring device is fixed and cannot be adjusted according to the displacement of the stress cone. Therefore, it is not possible to obtain both displacement and load simultaneously; only one of them can be measured. However, the stiffness design of the stress cone requires both load and displacement variables to exist simultaneously, resulting in inaccurate design loads or requiring multiple attempts to determine the load, thus wasting a lot of manpower and resources. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to simultaneously measure the displacement and load of the stress cone when it is thermally expanded, thus saving the need to determine the load through a large number of experiments during the design process. This application provides a method, system, device and storage medium for obtaining stress cone parameters.

[0006] A method for obtaining stress cone parameters includes:

[0007] Obtain simulation devices, including epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, cables, and virtual springs;

[0008] Material definitions are provided for the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly, cable, and virtual spring.

[0009] A stress cone simulation model is constructed based on the structural relationships and material definitions of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, the virtual spring, and the cable.

[0010] Obtain the constraint conditions of the stress cone simulation model;

[0011] Based on the aforementioned constraints, the positional relationship of the stress cone simulation model is constrained to obtain a constrained simulation model.

[0012] Preset ambient temperature range;

[0013] Based on the ambient temperature range and the constraint simulation model, the displacement and load of the virtual spring are obtained, and the displacement and load of the virtual spring are used as the stress cone parameters.

[0014] Optionally, defining the materials for the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly, cable, and virtual spring includes:

[0015] The stiffness of the virtual spring is defined as a preset stiffness, the material of the semiconductor rubber component is defined as a first preset material, and the material of the insulating rubber component is defined as a second preset material.

[0016] Optionally, the construction of the stress cone simulation model based on the structural relationships and material definitions of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, the virtual spring, and the cable includes:

[0017] The semiconductor rubber assembly and the insulating rubber assembly are connected to form a stress cone. The stress cone has a through hole that extends along its length. The cable is inserted into the through hole of the stress cone and is interference-fitted with the stress cone. The stress cone is inserted into the epoxy joint. The spring device abuts against the semiconductor rubber assembly and is used to insert the stress cone into the epoxy joint.

[0018] Optionally, the step of constraining the positional relationship of the stress cone simulation model based on the constraints to obtain the constrained simulation model includes:

[0019] The simulation device is meshed;

[0020] Based on the aforementioned positional relationship, all constraints are applied to the cable and the epoxy joint, wherein U1 = U2 = U3 = UR1 = UR2 = UR3 = 0. The top end of the virtual spring is fixed to the spring device, the tail end of the virtual spring is fixed, the stress cone is set to a normal contact pair with the spring device, the stress cone is set to a normal contact pair with the epoxy joint, and the mesh partition of the semiconductor rubber assembly is bound to the mesh partition of the insulating rubber assembly to obtain the constraint simulation model.

[0021] Optionally, based on the ambient temperature range and the constraint simulation model, the displacement and load of the virtual spring are obtained as follows:

[0022] A preset thrust is applied to the tail end of the virtual spring along the length direction of the stress cone to obtain the first result;

[0023] Based on the first result, the constraint simulation model is simulated within the preset ambient temperature range to obtain the displacement and load of the virtual spring.

[0024] Optionally, applying a preset temperature to the stress cone to obtain the displacement and load of the virtual spring includes:

[0025] Obtain the displacement of the top of the virtual spring;

[0026] The load on the virtual spring is obtained based on the displacement of the top of the virtual spring and the spring constant of the virtual spring.

[0027] The displacement is taken as the displacement of the virtual spring.

[0028] Optionally, obtaining the load of the virtual spring based on the displacement of the virtual top and the spring constant of the virtual spring includes:

[0029] The load of the virtual spring = the material coefficient of the virtual spring * the displacement.

[0030] A stress cone parameter acquisition system, comprising:

[0031] The first acquisition module is used to acquire simulation devices, which include epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, cables, and virtual springs;

[0032] The definition module is used to define the materials of the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly, cable and virtual spring.

[0033] A construction module is used to construct a stress cone simulation model based on the structural relationships and material definitions of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, the virtual spring, and the cable.

[0034] The second acquisition module is used to acquire the constraint conditions of the stress cone simulation model;

[0035] The constraint module is used to constrain the positional relationship of the stress cone simulation model based on the constraint conditions, so as to obtain a constrained simulation model.

[0036] The preset module is used to preset the ambient temperature range;

[0037] The calculation module is used to obtain the displacement and load of the virtual spring based on the ambient temperature range and the constraint simulation model, and to use the displacement and load of the virtual spring as the stress cone parameters.

[0038] Based on the same inventive concept, this application also provides a terminal device.

[0039] A terminal device includes a memory and a processor, characterized in that the memory stores a computer program that can run on the processor, and the processor loads and executes the computer program using a stress cone parameter acquisition method.

[0040] Based on the same inventive concept, this application also provides a computer-readable storage medium.

[0041] A computer-readable storage medium storing a computer program, characterized in that, when the computer program is loaded and executed by a processor, a method for obtaining stress cone parameters is employed.

[0042] The beneficial effects of this invention are that by setting a virtual spring and fixing it to a spring device, the load on the stress cone can be calculated using the displacement of the virtual spring when the stress cone expands due to heat. This allows for the simultaneous acquisition of both the displacement and load during stress cone expansion. Traditional methods, however, can only obtain one parameter—either load or displacement—leading to inaccurate load designs or requiring multiple trials to determine the load. Testing ensures the safety performance of the stress cone, preventing structural changes due to temperature variations and potential breakdown under high pressure. Furthermore, the simultaneous measurement of load and displacement saves design time. Attached Figure Description

[0043] Figure 1 This is a flowchart illustrating one embodiment of a method for obtaining stress cone parameters according to an embodiment of this application;

[0044] Figure 2 This is a schematic diagram of the stress cone structure in an embodiment of this application;

[0045] Figure 3 This is a schematic diagram of the stress cone simulation model of an embodiment of this application.

[0046] Explanation of reference numerals in the attached drawings: 1. Epoxy joint; 2. Insulating rubber assembly; 3. Spring device; 4. Semiconductor rubber assembly; 5. Cable; 6. Virtual spring. Detailed Implementation

[0047] A method for obtaining stress cone parameters includes:

[0048] S100. Obtain the simulation device, which includes an epoxy joint 1, a spring device 3, a semiconductor rubber assembly 4, an insulating rubber assembly 2, a cable 5, and a virtual spring 6.

[0049] Specifically, the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, cable 5, and virtual spring 6 are part of the entire simulation device. The virtual spring 6 is added to measure the stress cone parameters. The epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5 constitute the entire stress cone simulation model. The semiconductor rubber assembly 4 and insulating rubber assembly 2 form the stress cone, which is cone-shaped with a through hole in the middle for the cable 5 to pass through. The stress cone is inserted into the epoxy joint 1, and the spring device 3 pushes the stress cone inward, thus fixing it inside the epoxy joint 1.

[0050] S110 defines the materials for epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, cable 5, and virtual spring 6.

[0051] Specifically, the material definition is to simulate the performance of each material during the simulation. Therefore, each material needs to be defined as the required material. For example, the material of the semiconductor rubber component 4 should be defined as semiconductor rubber. In particular, the stiffness of the virtual spring 6 needs to be defined to facilitate testing. In this embodiment, the stiffness of the virtual spring 6 is defined as 0.1kN / mm.

[0052] S120. A stress cone simulation model is constructed based on the structural relationships and material definitions of epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, virtual spring 6, and cable 5.

[0053] Specifically, the structural relationship refers to the connection relationship between the simulation devices, such as the connection between the semiconductor rubber and the insulating rubber component 2, and the overall structure of the semiconductor rubber component 4 and the insulating rubber component 2 is inserted into the epoxy joint 1.

[0054] S130. Obtain the constraint conditions of the stress cone simulation model.

[0055] Specifically, the constraint condition is the fixed relationship of the simulated device during the simulation process. For example, when the spring device 3 pushes the stress cone, the cable 5 must remain stationary, and the epoxy joint 1 must also remain stationary. Therefore, the cable 5 and the epoxy joint 1 need to be constrained and kept stationary. The semiconductor and the insulating component are a whole, so they need to be kept relatively fixed.

[0056] S140. Based on the constraints, the positional relationship of the constraint stress cone simulation model is used to obtain the constraint simulation model.

[0057] S150, preset ambient temperature range.

[0058] Specifically, the preset ambient temperature range is the ambient temperature range during the simulation, which is the temperature applied to the semiconductor rubber and insulating rubber component 2. The entire simulation process increases from the ambient temperature to the highest temperature within the ambient temperature range.

[0059] S160. Based on the ambient temperature range and the constraint simulation model, the displacement and load of the virtual spring 6 are obtained, and the displacement and load of the virtual spring 6 are used as stress cone parameters.

[0060] Specifically, since the semiconductor rubber and insulating rubber assembly 2 expands when heated, and the virtual spring 6 is connected to the semiconductor rubber and insulating rubber assembly 2, the force generated when the semiconductor rubber and insulating rubber assembly 2 expands will compress the virtual spring 6. By obtaining the displacement of the virtual spring 6, the stress cone parameters can be obtained, which are the displacement and load generated when the semiconductor rubber and insulating rubber assembly 2 expands due to heat.

[0061] In one embodiment of this example, step S110, which involves defining the materials for the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, cable 5, and virtual spring 6, includes:

[0062] S200, Define the stiffness of the virtual spring 6 as the preset stiffness, the material of the semiconductor rubber component 4 as the first preset material, and the material of the insulating rubber component 2 as the second preset material.

[0063] Specifically, different materials produce different effects during simulation. For example, the semiconductor rubber component 4 and the insulating rubber component 2 use different rubber materials, resulting in different displacements and loads when thermally expanded. The specific material is defined based on the material of the product being measured. In this application, the semiconductor rubber component and the insulating rubber component are integrated, therefore the materials used have almost the same coefficient of thermal expansion, differing only in material: one is insulating rubber, and the other is semiconductor rubber. In this embodiment, the preset stiffness is defined as 0.1 kN / mm, and the stiffness of the virtual spring is consistent with the stiffness of the actual spring device.

[0064] In one embodiment of this example, step S120, which involves constructing a stress cone simulation model based on the structural relationships and material definitions of the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, virtual spring 6, and cable 5, includes:

[0065] S300, the semiconductor rubber component 4 and the insulating rubber component 2 are connected to form a stress cone. The stress cone has a through hole that runs through the entire length direction. The cable 5 is inserted into the through hole of the stress cone and is interference-fitted with the stress cone. The stress cone is inserted into the epoxy joint 1. The spring device 3 abuts against the semiconductor rubber component 4 and is used to insert the stress cone into the epoxy joint 1.

[0066] Specifically, such as Figure 2 and Figure 3 As shown, the semiconductor rubber component 4 and the insulating rubber component 2 constitute a stress cone. The semiconductor rubber component 4 and the insulating rubber component 2 are injection molded, and their contact surfaces are arc-shaped. The stress cone has two conical surfaces with different angles. A through-hole is opened in the middle of the stress cone, running along its length. The cable 5 is inserted into the through-hole and interference-fitted with it. The epoxy connector 1 has a socket for accommodating the conical surface of the stress cone. The spring device 3 pushes the stress cone into the socket of the epoxy connector 1, fixing the stress cone to the epoxy connector 1. When the spring device 3 pushes the stress cone, the applied force is fixed, and the direction of the push is along the length of the stress cone. After defining the structure of each simulation device, and then defining the material of each simulation device, the stress cone simulation model is obtained.

[0067] In one embodiment of this example, step S110, based on the constraint conditions and the positional relationship of the constraint stress cone simulation model, obtains the constraint simulation model, including:

[0068] S400: Mesh the simulation device.

[0069] Specifically, meshing is the process of dividing a model or geometry into small geometric units such as triangles, quadrilaterals, hexagons, tetrahedrons, and hexahedrons. Meshing can better define boundary conditions and loading, so as to accurately describe the constraints and external effects of the model. During meshing, each simulation device is treated as a whole for meshing.

[0070] S410. Based on the positional relationship, all constraints are applied to cable 5 and epoxy joint 1, where U1 = U2 = U3 = UR1 = UR2 = UR3 = 0. The top end of virtual spring 6 is fixed to spring device 3, the tail end of virtual spring 6 is fixed, stress cone is set to a normal contact pair with spring device 3, stress cone is set to a normal contact pair with epoxy joint 1, and the mesh partitioning of semiconductor rubber component 4 is bound to the mesh partitioning of rubber insulation component to obtain the constraint simulation model.

[0071] Specifically, U1, U2, and U3 represent the displacements of the node in the X, Y, and Z axes, respectively, indicating the amount of displacement of the node relative to its initial position in the X, Y, and Z axes. UR1, UR2, and UR3 represent the rotation angles of the node about the X, Y, and Z axes, respectively. These represent the rotational constraints of the node about the X, Y, and Z axes, which can be fixed or free constraints. U1=U2=U3=UR1=UR2=UR3=0 indicates that cable 5 and epoxy connector 1 are fixed.

[0072] like Figure 3 As shown, the top end of the virtual spring 6 is fixed to the spring device 3, and the tail end of the virtual spring 6 is fixed. When the stress cone expands due to heat, the top spring is fixed to the stress cone and the bottom end of the virtual spring 6 is fixed. When the stress cone expands, the virtual spring 6 will be compressed. The stress cone and the spring device 3 are in normal contact. The stress cone and the epoxy joint 1 are in normal contact, indicating that they are just in contact and there are no other requirements.

[0073] The mesh division of the semiconductor rubber component 4 is bound to the mesh division of the insulating rubber component 2 because in the actual product, the semiconductor rubber component 4 and the insulating rubber component 2 are a whole, just made of two different materials. Therefore, they will definitely move together when they expand. Binding the mesh divisions makes them a whole.

[0074] In one embodiment of this example, step S160, which involves obtaining the displacement and load of the virtual spring 6 based on the ambient temperature range and the constraint simulation model, includes:

[0075] S500, apply a preset thrust along the length of the stress cone at the tail end of the virtual spring 6 to obtain the first result.

[0076] Specifically, the preset thrust is the thrust applied by the spring device 3 to the stress cone. In this embodiment, the preset thrust is set to 1200N. The first result is the displacement and load of the virtual spring 6 under the thrust applied by the spring device 3, which are usually both 0 by default.

[0077] S510. Based on the first result, the constraint simulation model is simulated within the preset ambient temperature range to obtain the displacement and load of the virtual spring 6.

[0078] Specifically, the first result is obtained under the initial ambient temperature, for example, an initial temperature of 23 degrees Celsius and a maximum temperature of 70 degrees Celsius, so the preset temperature range is 23 degrees Celsius to 70 degrees Celsius. Cable 5 will generate heat during use, leading to an increase in temperature; the preset temperature range simulates the heating of cable 5. The preset ambient temperature directly affects the stress cone. By changing the ambient temperature, the stress cone expands due to heat, causing the virtual spring 6 to be compressed. Comparing this compression with the spring deformation from the first result yields the displacement of the virtual spring 6. Then, based on the set elastic coefficient of the virtual spring 6, the load can be obtained.

[0079] In one embodiment of this invention, step S110, which involves applying a preset temperature to the stress cone to obtain the displacement and load of the virtual spring 6, includes:

[0080] S600, obtain the displacement of the top of the virtual spring 6.

[0081] Specifically, when installing the virtual spring 6, the spring is generally kept in its natural state at the initial temperature, that is, without deformation. Then, as the stress value increases with heat, the spring expands and is compressed. At this time, the amount of compression of the spring is the amount of displacement at the top of the virtual spring 6.

[0082] S610. Based on the displacement of the top of the virtual spring 6 and the elastic coefficient of the virtual spring 6, the load of the virtual spring 6 is obtained.

[0083] The load on virtual spring 6 = material coefficient of virtual spring 6 * displacement.

[0084] Specifically, the elastic coefficient of the virtual spring 6 is set when the material is defined, which is the stiffness (elastic coefficient) of the virtual spring 6. Assuming the stiffness is set to K and the displacement is X, then the load F = KX.

[0085] S620, The displacement is taken as the displacement of the virtual spring 6.

[0086] Traditional methods for obtaining stress cone parameters involve setting up a simulation model and then applying a thrust to the stress cone using a spring device 3 at the initial temperature. The ambient temperature is then changed while maintaining this thrust. However, because the thrust of the stress cone remains constant, the load and displacement of the spring device 3 cannot change simultaneously, failing to simulate real-world conditions. This application addresses this by setting a virtual spring 6. The displacement and load of the virtual spring 6 can accurately determine the displacement and load of the stress cone at different temperatures.

[0087] This application also discloses a terminal device, including a memory and a processor. The memory stores a computer program that can run on the processor. When the processor loads and executes the computer program, a stress cone parameter acquisition method is used.

[0088] The terminal device can be a computer device such as a desktop computer, a laptop computer, or a cloud server. The terminal device includes, but is not limited to, a processor and a memory. For example, the terminal device may also include input / output devices, network access devices, and buses.

[0089] The processor can be a central processing unit (CPU). Of course, depending on the actual use, it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc., and this application does not limit it in this regard.

[0090] The memory can be an internal storage unit of the terminal device, such as a hard disk or RAM of the terminal device, or an external storage device of the terminal device, such as a plug-in hard disk, smart memory card (SMC), secure digital card (SD), or flash memory card (FC) equipped on the terminal device. Furthermore, the memory can be a combination of internal storage units and external storage devices of the terminal device. The memory is used to store computer programs and other programs and data required by the terminal device. The memory can also be used to temporarily store data that has been output or will be output. This application does not limit this.

[0091] In this terminal device, a stress cone parameter acquisition method from the above embodiments is stored in the terminal device's memory and loaded and executed on the terminal device's processor for convenient use.

[0092] This application also discloses a computer-readable storage medium, which stores a computer program, wherein when the computer program is executed by a processor, it employs a stress cone parameter acquisition method described in the above embodiments.

[0093] The computer program can be stored in a computer-readable medium. The computer program includes computer program code, which can be in the form of source code, object code, executable file, or certain middleware. The computer-readable medium includes any entity or device capable of carrying computer program code, recording media, USB flash drive, portable hard drive, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the computer-readable medium includes, but is not limited to, the above-mentioned components.

[0094] The stress cone parameter acquisition method described in the above embodiments is stored in the computer-readable storage medium and loaded and executed on the processor to facilitate the storage and application of the above method.

[0095] The foregoing has described specific embodiments of the invention. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0096] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of protection of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of one or more embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0097] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. A method for obtaining stress cone parameters, characterized in that, include: Acquire a simulation device, which includes an epoxy joint (1), a spring device (3), a semiconductor rubber assembly (4), an insulating rubber assembly (2), a cable (5), and a virtual spring (6); Material definitions are provided for the epoxy joint (1), spring device (3), semiconductor rubber assembly (4), insulating rubber assembly (2), cable (5) and virtual spring (6); Based on the structural relationships and material definitions of the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), the insulating rubber assembly (2), the virtual spring (6), and the cable (5), a stress cone simulation model is constructed. Obtain the constraint conditions of the stress cone simulation model; Based on the aforementioned constraints, the positional relationship of the stress cone simulation model is constrained to obtain a constrained simulation model. Preset ambient temperature range; Based on the ambient temperature range and the constraint simulation model, the displacement and load of the virtual spring (6) are obtained, and the displacement and load of the virtual spring (6) are used as the stress cone parameters; The stress cone simulation model constructed based on the structural relationships and material definitions of the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), the insulating rubber assembly (2), the virtual spring (6), and the cable (5) includes: The semiconductor rubber assembly (4) and the insulating rubber assembly (2) are connected to form a stress cone. The stress cone has a through hole that extends along the length direction. The cable (5) is inserted into the through hole of the stress cone and is interference-fitted with the stress cone. The stress cone is inserted into the epoxy joint (1). The spring device (3) abuts against the semiconductor rubber assembly (4). The spring device (3) is used to insert the stress cone into the epoxy joint (1). The constraint simulation model obtained by constraining the positional relationship of the stress cone simulation model based on the constraints includes: The simulation device is meshed; Based on the positional relationship, the cable (5) and the epoxy joint (1) are all constrained, wherein U1=U2=U3=UR1=UR2=UR3=0, the top end of the virtual spring (6) is fixed to the spring device (3), the tail end of the virtual spring (6) is fixed, the stress cone is set to a normal contact pair with the spring device (3), the stress cone is set to a normal contact pair with the epoxy joint (1), and the mesh division of the semiconductor rubber assembly (4) is bound to the mesh division of the insulating rubber assembly (2) to obtain the constraint simulation model; The displacement and load of the virtual spring (6) obtained based on the ambient temperature and the constraint simulation model include: A preset thrust is applied to the tail end of the virtual spring (6) along the length direction of the stress cone to obtain the first result; Based on the first result, the constraint simulation model is simulated within the preset ambient temperature range to obtain the displacement and load of the virtual spring (6).

2. The method for obtaining stress cone parameters as described in claim 1, characterized in that, The material definition for the epoxy joint (1), spring device (3), semiconductor rubber assembly (4), insulating rubber assembly (2), cable (5), and virtual spring (6) includes: The stiffness of the virtual spring (6) is defined as a preset stiffness, the material of the semiconductor rubber component (4) is defined as a first preset material, and the material of the insulating rubber component (2) is defined as a second preset material.

3. The method for obtaining stress cone parameters as described in claim 1, characterized in that, The process of applying a preset temperature to the stress cone to obtain the displacement and load of the virtual spring (6) includes: Obtain the displacement of the top of the virtual spring (6); The load of the virtual spring (6) is obtained based on the displacement of the top of the virtual spring (6) and the elastic coefficient of the virtual spring (6); The displacement is taken as the displacement of the virtual spring (6).

4. The method for obtaining stress cone parameters as described in claim 3, characterized in that, The load on the virtual spring (6) obtained based on the displacement at the top of the virtual spring (6) and the elastic coefficient of the virtual spring (6) includes: The load of the virtual spring (6) = the material coefficient of the virtual spring (6) * the displacement.

5. A stress cone parameter acquisition system, characterized in that, include: The first acquisition module is used to acquire simulation devices, which include epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, cables, and virtual springs; The definition module is used to define the materials of the epoxy joint, spring device, semiconductor rubber assembly, insulating rubber assembly, cable and virtual spring. A construction module is used to construct a stress cone simulation model based on the structural relationships and material definitions of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, the virtual spring, and the cable. The second acquisition module is used to acquire the constraint conditions of the stress cone simulation model; The constraint module is used to constrain the positional relationship of the stress cone simulation model based on the constraint conditions, so as to obtain a constrained simulation model. The preset module is used to preset the ambient temperature range; The calculation module is used to obtain the displacement and load of the virtual spring based on the ambient temperature range and the constraint simulation model, and to use the displacement and load of the virtual spring as the stress cone parameters. The stress cone simulation model constructed based on the structural relationships and material definitions of the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), the insulating rubber assembly (2), the virtual spring (6), and the cable (5) includes: The semiconductor rubber assembly (4) and the insulating rubber assembly (2) are connected to form a stress cone. The stress cone has a through hole that extends along the length direction. The cable (5) is inserted into the through hole of the stress cone and is interference-fitted with the stress cone. The stress cone is inserted into the epoxy joint (1). The spring device (3) abuts against the semiconductor rubber assembly (4). The spring device (3) is used to insert the stress cone into the epoxy joint (1). The constraint simulation model obtained by constraining the positional relationship of the stress cone simulation model based on the constraints includes: The simulation device is meshed; Based on the positional relationship, the cable (5) and the epoxy joint (1) are all constrained, wherein U1=U2=U3=UR1=UR2=UR3=0, the top end of the virtual spring (6) is fixed to the spring device (3), the tail end of the virtual spring (6) is fixed, the stress cone is set to a normal contact pair with the spring device (3), the stress cone is set to a normal contact pair with the epoxy joint (1), and the mesh division of the semiconductor rubber assembly (4) is bound to the mesh division of the insulating rubber assembly (2) to obtain the constraint simulation model; The displacement and load of the virtual spring (6) obtained based on the ambient temperature and the constraint simulation model include: A preset thrust is applied to the tail end of the virtual spring (6) along the length direction of the stress cone to obtain the first result; Based on the first result, the constraint simulation model is simulated within the preset ambient temperature range to obtain the displacement and load of the virtual spring (6).

6. A terminal device, comprising a memory and a processor, characterized in that, The memory stores a computer program that can run on a processor, and the processor loads and executes the computer program using the method described in any one of claims 1 to 4.

7. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is loaded and executed by the processor, it employs the method as described in any one of claims 1 to 4.

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