Stress cone and cable contact stress acquisition method, system, device and storage medium

Abstract

The application belongs to the field of high-voltage cable assembly testing, and particularly relates to a stress cone and cable contact stress acquisition method, system, device and storage medium, which comprises the following steps: obtaining a simulation device, defining materials of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly and the cable; constructing a stress cone simulation model based on the structural relationship among the epoxy joint, the spring device, the semiconductor rubber assembly and the insulating rubber assembly and the material definition; obtaining a constraint simulation model based on the stress cone simulation model and constraint conditions; setting a contact rule of the cable and the stress cone simulation model; and obtaining the contact stress between the stress cone and the cable based on the contact rule and the constraint simulation model. The application can accurately calculate the contact stress between the cable and the stress cone.

Description

Technical Field

[0001] This invention belongs to the field of high-voltage cable assembly testing, specifically relating to a method, system, equipment, and storage medium for obtaining stress at the contact between a stress cone and a cable. Background Technology

[0002] With the advancement of technology, my country's high-speed rail and urban rail transit are developing rapidly, greatly facilitating people's daily travel. High-voltage cable assemblies are a key component of high-speed rail and urban rail transit systems. They connect the pantograph and onboard transformer of electric locomotives and are core components ensuring safe vehicle operation. High-voltage electricity is transmitted between two carriages via the high-voltage cable assembly; therefore, the safety performance of the high-voltage cable assembly must be guaranteed. The interference fit between the cable and the stress cone has a significant impact on the safety performance of the high-voltage cable assembly.

[0003] The contact stress between the stress cone and the cable simulates the process of inserting the stress cone into the cable. This insertion process has two design variables: one is the contact stress, from which the frictional force during insertion can be calculated; the second is the size of the interference fit. If the interference fit is designed to be too large, the frictional force between the stress cone and the cable will increase sharply, causing difficulty in insertion and installation, or even damage to the stress cone. If the interference fit is designed to be too small, the contact pressure between the stress cone and the cable will be too small, possibly less than 0.3 MPa, leading to a sharp increase in the risk of the stress cone being broken down by current. Therefore, obtaining the contact stress between the stress cone and the cable indirectly reflects whether the interference fit design is reasonable.

[0004] In related technologies, the contact stress when the cable and stress cone are interference-fitted is mainly calculated by measuring the contact stress of the entire contact surface between the cable and the stress cone, and by obtaining the total contact area between the cable and the stress cone.

[0005] Regarding the aforementioned technologies, since the outer surface of the cable is usually wrapped with insulating tape, the stress cone and the cable are not in continuous contact. If the contact setting is not reasonable, the calculated contact stress between the cable and the stress cone may be inaccurate or even fail due to simulation non-convergence. Inaccurate calculation of contact stress will make it impossible to know the actual interference between the stress cone and the cable, which may pose a safety risk to the designed high-voltage cable assembly. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to be able to calculate the contact stress between the cable and the stress cone more accurately, thereby improving the safety performance of the designed high-voltage cable assembly. This application provides a method, system, device and storage medium for obtaining the contact stress between the stress cone and the cable.

[0007] A method for obtaining the contact stress between a stress cone and a cable includes:

[0008] Obtain simulation devices, which include epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, and cables;

[0009] Material definitions are provided for the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, and the cable.

[0010] A stress cone simulation model is constructed based on the structural relationships between the epoxy joint, the spring device, the semiconductor rubber assembly, and the insulating rubber assembly, as well as the material definition.

[0011] Based on the stress cone simulation model and the constraint conditions, a constraint simulation model is obtained;

[0012] Set the contact rules between the cable and the stress cone simulation model;

[0013] Based on the contact rules and the constraint simulation model, the contact stress between the stress cone and the cable is obtained.

[0014] Optionally, defining the materials for the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, and the cable includes:

[0015] The material of the semiconductor rubber component is defined as a first preset material, the material of the insulating rubber component is defined as a second preset material, the stiffness of the spring device is defined as a preset stiffness, and the epoxy joint is defined as a third preset material.

[0016] Optionally, the stress cone simulation model constructed based on the structural relationship between the epoxy joint, the spring device, the semiconductor rubber assembly, and the insulating rubber assembly, as well as the material definition, includes:

[0017] The semiconductor rubber assembly and the insulating rubber assembly are connected to form a stress cone. The stress cone has a through hole that extends along the length direction. The stress cone is inserted into the epoxy joint. The spring device abuts against the semiconductor rubber assembly and is used to push the stress cone into the epoxy joint. The outer surface of the cable is wrapped with insulating tape.

[0018] Optionally, setting the contact rules between the cable and the stress cone simulation model includes:

[0019] Set the inner surface of the stress cone as the contact surface;

[0020] Using the top surface of the cable tape as the dividing surface, the upper surface of the cable is set as the first contact surface, and the lower surface of the cable is set as the second contact surface;

[0021] Both the first contact surface and the second contact surface are in contact with the secondary contact surface.

[0022] Optionally, obtaining the constraint simulation model based on the stress cone simulation model and the constraint conditions includes:

[0023] The simulation device is meshed;

[0024] Based on the constraints, all constraints are applied to the cable and the epoxy joint, wherein U1=U2=U3=UR1=UR2=UR3=0, the stress cone and the spring device are in normal contact, the stress cone and the epoxy joint are in normal contact, and the mesh of the semiconductor rubber assembly is bound to the mesh of the insulating rubber assembly to obtain the constraint simulation model.

[0025] Optionally, the contact stress between the stress cone and the cable, obtained based on the contact rules and the constraint simulation model, includes:

[0026] Calculate the first stress based on the first contact surface and the secondary contact surface;

[0027] The second stress is calculated based on the second contact surface and the secondary contact surface;

[0028] Based on the first stress and the second stress, the contact stress between the stress cone simulation model and the cable is obtained.

[0029] Optionally, obtaining the contact stress between the stress cone and the cable based on the first stress and the second stress includes:

[0030] Obtain the first weight corresponding to the first stress and the second weight corresponding to the second stress;

[0031] Based on the first weight, the first stress, the second weight, and the second stress, the contact stress between the stress cone and the cable is obtained.

[0032] A stress acquisition system for contact stress between a stress cone and a cable, characterized in that it includes:

[0033] An acquisition module is used to acquire simulation devices, which include epoxy joints, spring devices, semiconductor rubber assemblies, insulating rubber assemblies, and cables;

[0034] The definition module is used to define the materials of the epoxy joint, the spring device, the semiconductor rubber assembly, the insulating rubber assembly, and the cable.

[0035] A construction module is used to construct a stress cone simulation model based on the structural relationships between the epoxy joint, the spring device, the semiconductor rubber component, and the insulating rubber component, as well as the material definition.

[0036] The constraint module is used to obtain a constraint simulation model based on the stress cone simulation model and the constraint conditions.

[0037] The setting module is used to set the contact rules between the cable and the stress cone simulation model;

[0038] The calculation module is used to obtain the contact stress between the stress cone and the cable based on the contact rules and the constraint simulation model.

[0039] Based on the same inventive concept, this application also provides a terminal device.

[0040] A terminal device includes a memory and a processor, the memory storing a computer program that can run on the processor, and the processor loading and executing the computer program employs a method for obtaining stress in contact between a stress cone and a cable.

[0041] Based on the same inventive concept, this application also provides a computer-readable storage medium.

[0042] A computer-readable storage medium storing a computer program, which, when loaded and executed by a processor, employs a method for obtaining stress in contact between a stress cone and a cable.

[0043] The beneficial effect of this invention is that by uniquely setting multiple contact surfaces, namely a first contact surface, a second contact surface, and a secondary contact surface, the contact pressure between each contact surface and the secondary contact surface is calculated and the average value is taken as the overall contact pressure cable. This solves the problem that the calculated contact stress is inaccurate because the stress cone and the cable are not in continuous contact due to the insulating tape wrapped around the outer surface of the cable. As a result, the simulated contact pressure is more accurate, thereby improving the safety performance of the high-voltage cable assembly. Attached Figure Description

[0044] Figure 1 This is a flowchart illustrating one embodiment of a method for obtaining the contact stress between a stress cone and a cable according to an embodiment of this application.

[0045] Figure 2 This is a schematic diagram of the stress cone structure in an embodiment of this application;

[0046] Figure 3 This is a schematic diagram of the stress cone simulation model of an embodiment of this application;

[0047] Figure 4 This is an embodiment of the present application. Figure 3A partial schematic diagram.

[0048] Explanation of reference numerals in the attached drawings: 1. Epoxy joint; 2. Insulating rubber assembly; 3. Spring device; 4. Semiconductor rubber assembly; 5. Cable; 6. First contact surface; 7. Second contact surface; 8. Second contact surface. Detailed Implementation

[0049] A method for obtaining the contact stress between a stress cone and a cable, such as Figure 1 As shown, it includes:

[0050] S100. Obtain the simulation device, which includes an epoxy joint 1, a spring device 3, a semiconductor rubber assembly 4, an insulating rubber assembly 2, and a cable 5.

[0051] Specifically, the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5 are part of the entire simulation device. The epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5 constitute the entire stress cone simulation model. Semiconductor rubber assembly 4 and insulating rubber assembly 2 form a stress cone, which is cone-shaped with a through hole in the middle for the cable 5 to pass through. The stress cone is inserted into the epoxy joint 1, and the spring device 3 pushes the stress cone inward, thus fixing the stress cone inside the epoxy joint 1.

[0052] S110 defines the materials for epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5.

[0053] Specifically, the material definition is to simulate the performance of each material during the simulation. Therefore, each material needs to be defined as the required material. For example, the material of semiconductor rubber component 4 should be defined as semiconductor rubber, the material of insulating rubber component 2 should be insulating rubber, and the stiffness of spring device 3 should be set according to the actual device. Since the stress cone formed by semiconductor rubber component 4 and insulating rubber component 2 is a whole, the expansion coefficients of the two materials need to be close or even the same.

[0054] S120. Based on the structural relationship and material definition between epoxy joint 1, spring device 3, semiconductor rubber component 4, and insulating rubber component 2, a stress cone simulation model is constructed.

[0055] Specifically, the structural relationship is the connection relationship between the simulation devices. For example, the semiconductor rubber is connected to the insulating rubber component 22, the semiconductor rubber component 4 and the insulating rubber component 2 are inserted into the epoxy joint 1, and the spring device 3 abuts against the semiconductor rubber.

[0056] S130. Based on the stress cone simulation model and the constraint conditions, the constraint simulation model is obtained.

[0057] Specifically, the constraint condition is the fixed relationship of the simulated device during the simulation process. For example, when the spring device 3 pushes the stress cone, the cable 5 must remain stationary, and the epoxy joint 1 must also remain stationary. Therefore, the cable 5 and the epoxy joint 1 need to be constrained and kept stationary. The semiconductor and the insulating component are a whole, so they need to be kept relatively fixed.

[0058] S140. Set the contact rules between cable 5 and the stress cone simulation model.

[0059] Specifically, the contact rule is that cable 5 and the stress cone are in interference contact. However, the contact area will affect the calculation of contact stress depending on who is in contact with whom, the amount of interference, and how to determine the contact area due to the discontinuity caused by the tape wrapped around the outer surface of cable 5.

[0060] S150. Based on the contact rules and constraint simulation model, the contact stress between the stress cone and cable 5 is obtained.

[0061] Specifically, after setting up the constraint simulation model, the simulation begins. At this time, the spring device 3 applies a fixed thrust to the stress cone. The cable 5 and the stress cone are interference-fitted. The contact stress of each segment is obtained based on the set contact area. Then, the average value of the calculated contact stress of each segment is taken as the contact stress between the stress cone and the cable 5.

[0062] In one embodiment of this invention, step S110, which involves defining the materials for the epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5, includes:

[0063] S200, define the material of semiconductor rubber component 4 as the first preset material, the material of insulating rubber component 2 as the second preset material, the stiffness of spring device 3 as the preset stiffness, and epoxy joint 1 as the third preset material.

[0064] Specifically, the material of the semiconductor rubber component 4 is defined as the first preset material, which is semiconductor rubber. Semiconductor rubber has a certain conductivity and can conduct current under specific conditions. The second preset material is insulating rubber material. The spring device 3 is used to push the stress cone into the epoxy joint 1. The spring stiffness of the spring device 3, that is, the elastic coefficient, is set according to the actual equipment used. The epoxy joint 1 is made of epoxy resin.

[0065] In one embodiment of this example, step S120, which involves constructing a stress cone simulation model based on the structural relationship and material definitions between the epoxy joint 1, the spring device 3, the semiconductor rubber assembly 4, and the insulating rubber assembly 2, includes:

[0066] S300, the semiconductor rubber component 4 and the insulating rubber component 2 are connected to form a stress cone. The stress cone has a through hole that runs through the length direction. The stress cone is inserted into the epoxy joint 1. The spring device 3 abuts against the semiconductor rubber component 4. The spring device 3 is used to push the stress cone into the epoxy joint 1. The outer surface of the cable 5 is wrapped with insulating tape.

[0067] Specifically, such as Figure 2 and Figure 3 As shown, the semiconductor rubber component 4 and the insulating rubber component 2 constitute a stress cone. The semiconductor rubber component 4 and the insulating rubber component 2 are injection molded, and their contact surfaces are arc-shaped. The stress cone has two conical surfaces with different angles. A through-hole is opened in the middle of the stress cone, running along its length. The cable 5 is inserted into the through-hole and interference-fitted with it. The epoxy connector 1 has a socket for accommodating the conical surface of the stress cone. The spring device 3 pushes the stress cone into the socket of the epoxy connector 1, fixing the stress cone to the epoxy connector 1. When the spring device 3 pushes the stress cone, the applied force is fixed, and the direction of the push is along the length of the stress cone. After defining the structure of each simulation device, and then defining the material of each simulation device, the stress cone simulation model is obtained.

[0068] In one embodiment of this example, step S120, which sets the contact rules between cable 5 and the stress cone simulation model, includes:

[0069] S400, Set the inner surface of the stress cone to be from the contact surface 8.

[0070] S410. Using the top surface of the cable 5 tape as the dividing surface, the upper surface of the cable 5 is set as the first contact surface 6, and the lower surface of the cable 5 is set as the second contact surface 7.

[0071] S420, the first contact surface 6 and the second contact surface 7 are both in contact with the secondary contact surface 8.

[0072] Specifically, such as Figure 3 and Figure 4 As shown, because the outer surface of cable 5 is wrapped with insulating tape, cable 5 is not a smooth plane. Therefore, when it is inserted into the stress cone, it does not make continuous contact with the inner surface of the stress cone, and a discontinuity will occur in the middle. Therefore, the contact surface is set as multiple segments, and the contact stress of each segment is calculated. Taking the top surface of the tape of cable 5 as the dividing surface, the upper surface of cable 5 is set as the first contact surface 6, and the lower surface of cable 5 is set as the second contact surface 7. The first contact surface 6 and the second contact surface 7 are respectively set to contact the stress cone from the contact surface 8, which can greatly improve the convergence.

[0073] In one embodiment of this example, step S130, which involves obtaining a constraint simulation model based on the stress cone simulation model and constraint conditions, includes:

[0074] S500 performs mesh generation on the simulation device.

[0075] Specifically, meshing is the process of dividing a model or geometry into small geometric units (such as triangles, quadrilaterals, hexagons, tetrahedrons, and hexahedrons). Meshing can better define boundary conditions and loading, so as to accurately describe the constraints and external effects of the model. During meshing, each simulation device is treated as a whole for meshing.

[0076] S510. Based on the constraint conditions, all constraints are applied to cable 5 and epoxy joint 1, where U1=U2=U3=UR1=UR2=UR3=0. The stress cone and spring device 3 are set to a normal contact pair, and the stress cone and epoxy joint 1 are set to a normal contact pair. The mesh of semiconductor rubber component 4 is bound to the mesh of insulating rubber component 2 to obtain the constraint simulation model.

[0077] Specifically, U1, U2, and U3 represent the displacements of the node in the X, Y, and Z axes, respectively. They represent the amount of displacement of the node relative to its initial position in the X, Y, and Z axes. UR1, UR2, and UR3 represent the rotation angles of the node about the X, Y, and Z axes, respectively. They represent the rotational constraints of the node about the X, Y, and Z axes, which can be fixed constraints or free constraints.

[0078] U1=U2=U3=UR1=UR2=UR3=0 indicates that cable 5 and epoxy connector 1 are fixed in place.

[0079] In one embodiment of this invention, step S130, based on contact rules and constraint simulation models, obtains the contact stress between the stress cone and the cable 5, including:

[0080] S600, calculate the first stress based on the first contact surface 6 and from the contact surface 8.

[0081] S610. Calculate the second stress based on the second contact surface 7 and from the contact surface 8.

[0082] S620. Based on the first stress and the second stress, the contact stress between the stress cone simulation model and cable 5 is obtained.

[0083] Specifically, since the contact is not continuous, the stress of each contact segment is calculated and averaged. The average of the first stress on the first contact surface 6 and the second stress on the second contact surface 7 is taken as the contact stress.

[0084] In one embodiment of this example, step S130, based on the first stress and the second stress, obtains the contact stress between the stress cone simulation model and the cable 5, including:

[0085] S700: Obtain the first weight corresponding to the first stress and the second weight corresponding to the second stress.

[0086] S710. Based on the first weight, the first stress, the second weight, and the second stress, the contact stress between the stress cone and the cable 5 is obtained.

[0087] Specifically, the first weight and the second weight are the contact stress calculated by assigning certain weights to the first stress and the second stress. The sum of the first weight and the second weight is 1. Usually, both the first weight and the second weight are 0.5, which means that the contact stress is the average of the first stress and the second stress.

[0088] A stress acquisition system for the contact stress between a stress cone and a cable, comprising:

[0089] The acquisition module is used to acquire the simulation device, which includes an epoxy joint 1, a spring device 3, a semiconductor rubber assembly 4, an insulating rubber assembly 2, and a cable 5.

[0090] The definition module is used to define the materials for epoxy joint 1, spring device 3, semiconductor rubber assembly 4, insulating rubber assembly 2, and cable 5.

[0091] The module is used to construct a stress cone simulation model based on the structural relationship and material definition between epoxy joint 1, spring device 3, semiconductor rubber component 4, and insulating rubber component 2.

[0092] The constraint module is used to obtain a constraint simulation model based on the stress cone simulation model and constraint conditions;

[0093] The settings module is used to set the contact rules between cable 5 and the stress cone simulation model;

[0094] The calculation module is used to obtain the contact stress between the stress cone and cable 5 based on the contact rules and the constraint simulation model.

[0095] This application also discloses a terminal device, including a memory and a processor. The memory stores a computer program that can run on the processor. When the processor loads and executes the computer program, a method for obtaining the contact stress between a stress cone and a cable is used.

[0096] The terminal device can be a computer device such as a desktop computer, a laptop computer, or a cloud server. The terminal device includes, but is not limited to, a processor and a memory. For example, the terminal device may also include input / output devices, network access devices, and buses.

[0097] The processor can be a central processing unit (CPU). Of course, depending on the actual use, it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), off-the-shelf programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor, etc., and this application does not limit it in this regard.

[0098] The memory can be an internal storage unit of the terminal device, such as a hard disk or RAM of the terminal device, or an external storage device of the terminal device, such as a plug-in hard disk, smart memory card (SMC), secure digital card (SD), or flash memory card (FC) equipped on the terminal device. Furthermore, the memory can be a combination of internal storage units and external storage devices of the terminal device. The memory is used to store computer programs and other programs and data required by the terminal device. The memory can also be used to temporarily store data that has been output or will be output. This application does not limit this.

[0099] In this terminal device, the stress acquisition method for the contact stress between the stress cone and the cable in the above embodiment is stored in the memory of the terminal device and loaded and executed on the processor of the terminal device for convenient use.

[0100] This application also discloses a computer-readable storage medium, which stores a computer program, wherein when the computer program is executed by a processor, it employs a method for obtaining the contact stress between a stress cone and a cable as described in the above embodiments.

[0101] The computer program can be stored in a computer-readable medium. The computer program includes computer program code, which can be in the form of source code, object code, executable file, or certain middleware. The computer-readable medium includes any entity or device capable of carrying computer program code, recording media, USB flash drive, portable hard drive, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media, etc. It should be noted that the computer-readable medium includes, but is not limited to, the above-mentioned components.

[0102] The method for obtaining stress in the contact between a stress cone and a cable, as described in the above embodiments, is stored in the computer-readable storage medium and loaded and executed on a processor to facilitate the storage and application of the above method.

[0103] The foregoing has described specific embodiments of the invention. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired results. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0104] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of protection of this application is limited to these examples; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of one or more embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0105] One or more embodiments in this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this application should be included within the protection scope of this application.

Claims

1. A method for obtaining the contact stress between a stress cone and a cable, characterized in that, include: Acquire a simulation device, which includes an epoxy joint (1), a spring device (3), a semiconductor rubber assembly (4), an insulating rubber assembly (2), and a cable (5); Material definitions are provided for the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), the insulating rubber assembly (2), and the cable (5); Based on the structural relationship between the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), and the insulating rubber assembly (2), and the material definition, a stress cone simulation model is constructed; Based on the stress cone simulation model and the constraint conditions, a constraint simulation model is obtained; Set the contact rules between the cable (5) and the stress cone simulation model; Based on the contact rules and the constraint simulation model, the contact stress between the stress cone and the cable (5) is obtained; The contact rules for setting the cable (5) and the stress cone simulation model include: Set the inner surface of the stress cone to be from the contact surface (8); Using the top surface of the cable (5) tape as the dividing surface, the upper surface of the cable (5) is set as the first contact surface (6), and the lower surface of the cable (5) is set as the second contact surface (7); Both the first contact surface (6) and the second contact surface (7) are in contact with the secondary contact surface (8); Based on the contact rules and the constraint simulation model, the contact stress between the stress cone and the cable (5) is obtained as follows: The first stress is calculated based on the first contact surface (6) and the secondary contact surface (8); The second stress is calculated based on the second contact surface (7) and the secondary contact surface (8); Based on the first stress and the second stress, the contact stress between the stress cone simulation model and the cable (5) is obtained; The stress cone simulation model constructed based on the structural relationship between the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), and the insulating rubber assembly (2), and the material definition, includes: The semiconductor rubber assembly (4) and the insulating rubber assembly (2) are connected to form a stress cone. The stress cone has a through hole that runs through the length direction. The stress cone is inserted into the epoxy joint (1). The spring device (3) abuts against the semiconductor rubber assembly (4). The spring device (3) is used to push the stress cone into the epoxy joint (1). The outer surface of the cable (5) is wrapped with insulating tape. The constraint simulation model obtained based on the stress cone simulation model and the constraint conditions includes: The simulation device is meshed; Based on the constraints, all constraints are applied to the cable (5) and the epoxy joint (1), where U1=U2=U3=UR1=UR2=UR3=0. The stress cone and the spring device (3) are in normal contact, and the stress cone and the epoxy joint (1) are in normal contact. The mesh of the semiconductor rubber assembly (4) is bound to the mesh of the insulating rubber assembly (2) to obtain the constraint simulation model.

2. The method for obtaining the contact stress between a stress cone and a cable as described in claim 1, characterized in that, The material definition for the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), the insulating rubber assembly (2), and the cable (5) includes: The material of the semiconductor rubber component (4) is defined as a first preset material, the material of the insulating rubber component (2) is defined as a second preset material, the stiffness of the spring device (3) is defined as a preset stiffness, and the epoxy joint (1) is defined as a third preset material.

3. The method for obtaining the contact stress between a stress cone and a cable as described in claim 2, characterized in that, The contact stress between the stress cone simulation model and the cable (5) obtained based on the first stress and the second stress includes: Obtain the first weight corresponding to the first stress and the second weight corresponding to the second stress; Based on the first weight, the first stress, the second weight, and the second stress, the contact stress between the stress cone and the cable (5) is obtained.

4. A stress acquisition system for the contact stress between a stress cone and a cable, characterized in that, include: The acquisition module is used to acquire the simulation device, which includes an epoxy joint (1), a spring device (3), a semiconductor rubber assembly (4), an insulating rubber assembly (2), and a cable (5); The definition module is used to define the materials of the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), the insulating rubber assembly (2), and the cable (5); A construction module is used to construct a stress cone simulation model based on the structural relationship between the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), and the insulating rubber assembly (2) and the material definition; The constraint module is used to obtain a constraint simulation model based on the stress cone simulation model and the constraint conditions. The setting module is used to set the contact rules between the cable (5) and the stress cone simulation model; The calculation module is used to obtain the contact stress between the stress cone and the cable (5) based on the contact rules and the constraint simulation model; The contact rules for setting the cable (5) and the stress cone simulation model include: Set the inner surface of the stress cone to be from the contact surface (8); Using the top surface of the cable (5) tape as the dividing surface, the upper surface of the cable (5) is set as the first contact surface (6), and the lower surface of the cable (5) is set as the second contact surface (7); Both the first contact surface (6) and the second contact surface (7) are in contact with the secondary contact surface (8); Based on the contact rules and the constraint simulation model, the contact stress between the stress cone and the cable (5) is obtained as follows: The first stress is calculated based on the first contact surface (6) and the secondary contact surface (8); The second stress is calculated based on the second contact surface (7) and the secondary contact surface (8); Based on the first stress and the second stress, the contact stress between the stress cone simulation model and the cable (5) is obtained; The stress cone simulation model constructed based on the structural relationship between the epoxy joint (1), the spring device (3), the semiconductor rubber assembly (4), and the insulating rubber assembly (2), and the material definition, includes: The semiconductor rubber assembly (4) and the insulating rubber assembly (2) are connected to form a stress cone. The stress cone has a through hole that runs through the length direction. The stress cone is inserted into the epoxy joint (1). The spring device (3) abuts against the semiconductor rubber assembly (4). The spring device (3) is used to push the stress cone into the epoxy joint (1). The outer surface of the cable (5) is wrapped with insulating tape. The constraint simulation model obtained based on the stress cone simulation model and the constraint conditions includes: The simulation device is meshed; Based on the constraints, all constraints are applied to the cable (5) and the epoxy joint (1), where U1=U2=U3=UR1=UR2=UR3=0. The stress cone and the spring device (3) are in normal contact, and the stress cone and the epoxy joint (1) are in normal contact. The mesh of the semiconductor rubber assembly (4) is bound to the mesh of the insulating rubber assembly (2) to obtain the constraint simulation model.

5. A terminal device, comprising a memory and a processor, characterized in that, The memory stores a computer program that can run on a processor, and when the processor loads and executes the computer program, it employs the method of any one of claims 1 to 3.

6. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is loaded and executed by the processor, it employs the method described in any one of claims 1 to 3.

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