Inductor, circuit board integrated inductor and electronic device

Abstract

The application provides an inductor device, a circuit board integrated inductor and an electronic device. The inductor device comprises a magnetic core, the magnetic core has a plurality of through holes and a plurality of air gaps, at least part of the plurality of through holes are communicated with the air gaps, and the air gaps pass through the magnetic core; and a coil, the coil is arranged in the plurality of through holes and wound on the magnetic core, and the coil is arranged in an insulating mode with the magnetic core. The magnetic density distribution of the inductor device is relatively uniform, the inductor device has strong anti-magnetic saturation characteristics, and has high inductance.

Description

Technical Field

[0001] This application relates to the field of electronics, specifically to an inductor, a circuit board integrated inductor, and an electronic device. Background Technology

[0002] An inductor consists of a coil and magnetic components. When an alternating current flows through the coil, an alternating magnetic flux is generated inside and around the coil, enabling it to store and release energy. In electronic circuits, inductors limit alternating current. They, along with resistors or capacitors, can form high-pass or low-pass filters, phase-shifting circuits, and resonant circuits, thus finding wide application in various instruments and equipment. However, existing inductors exhibit relatively uneven magnetic flux density distribution and weak anti-magnetic saturation characteristics. Summary of the Invention

[0003] This application provides an inductor device with a relatively uniform magnetic flux density distribution, strong anti-magnetic saturation characteristics, and high inductance.

[0004] A first aspect of this application provides an inductor device comprising:

[0005] A magnetic core having a plurality of through holes and a plurality of air gaps, wherein at least a portion of the plurality of through holes communicates with the air gaps, and the air gaps penetrate the magnetic core; and

[0006] A coil, which passes through the plurality of through holes and is wound around the magnetic core, and the coil is insulated from the magnetic core.

[0007] A second aspect of this application provides a circuit board integrated inductor, comprising:

[0008] Circuit boards; and

[0009] The inductor device described in the first aspect of this application is embedded in the circuit board, which includes a first circuit layer, a first substrate layer, a support layer, a second substrate layer, and a second circuit layer stacked sequentially. The coil portion is formed on a conductive layer used to prepare the first circuit layer and the second circuit layer, and the magnetic core is embedded in the support layer.

[0010] A third aspect of this application provides an electronic device comprising:

[0011] Display screen;

[0012] The inductor device described in the first aspect of this application or the circuit board integrated inductor described in the second aspect of this application; and

[0013] The processor is electrically connected to the inductor integrated on the circuit board or the coil in the inductor device. The processor is used to control the magnitude and direction of the current flowing through the coil. The processor is also electrically connected to the display screen to control the display screen to display.

[0014] The inductor device of this application embodiment includes a magnetic core and a coil. The magnetic core has multiple through holes and multiple air gaps. At least a portion of the multiple through holes communicates with the air gaps, and the air gaps penetrate the magnetic core. The coil passes through the multiple through holes and is wound around the magnetic core, and the coil is insulated from the magnetic core. The coil passing through the multiple through holes and being wound around the magnetic core allows the magnetic core to cover a larger area in the inductor device. Given a fixed inductor device size, this allows for a better increase in the proportion of the magnetic core in the inductor device (i.e., higher area utilization), increasing the magnetic energy storage capacity of the inductor device. It can store more magnetic energy, thereby increasing the inductance of the inductor device. Furthermore, the air gaps in at least a portion of the multiple through holes block the magnetic circuit around the through holes, thus preventing excessively high magnetic induction near the through holes. This makes the magnetic induction intensity at various locations within the inductor device more similar and the distribution of magnetic induction intensity more uniform, thereby improving the inductor's anti-magnetic saturation characteristics. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an inductor device according to an embodiment of this application.

[0017] Figure 2 This is an exploded structural diagram of an inductor device according to an embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the planar structure of a magnetic core according to an embodiment of this application.

[0019] Figure 4 yes Figure 3 Enlarged view of dashed box I.

[0020] Figure 5 This is an exploded structural diagram of an inductor device according to another embodiment of this application.

[0021] Figure 6 This is the book Figure 5 A planar perspective view of an inductor.

[0022] Figure 7 This is a cross-sectional structural schematic diagram of a magnetic core according to an embodiment of this application.

[0023] Figure 8 This is a cross-sectional structural schematic diagram of the magnetic core according to another embodiment of this application.

[0024] Figure 9 This is a schematic flowchart of a method for fabricating an inductor device according to an embodiment of this application.

[0025] Figure 10 This is an exploded structural diagram of the inductor device according to Embodiment 1 of this application.

[0026] Figure 11 This is an exploded structural diagram of the inductor device according to Embodiment 2 of this application.

[0027] Figure 12 This is an exploded structural diagram of the inductor device of Comparative Example 1 of this application.

[0028] Figure 13 This is a color diagram of the magnetic flux density distribution of the inductor device in Embodiment 1 of this application along its extended plane.

[0029] Figure 14 This is a grayscale image of the magnetic flux density distribution of the inductor device in Embodiment 1 of this application along its extended plane.

[0030] Figure 15 This is a color diagram of the magnetic flux density distribution of the inductor device along its extended plane in Embodiment 2 of this application.

[0031] Figure 16 This is a grayscale image of the magnetic flux density distribution of the inductor device along its extended plane in Embodiment 2 of this application.

[0032] Figure 17 This is a color diagram of the magnetic flux density distribution of the inductor device of Comparative Example 1 of this application along its extended plane.

[0033] Figure 18 This is a grayscale image of the magnetic flux density distribution of the inductor device of Comparative Example 1 of this application along its extended plane.

[0034] Figure 19 This is a schematic diagram of the structure of an integrated inductor on a circuit board according to an embodiment of this application.

[0035] Figure 20 This application describes an embodiment of a circuit board integrated inductor. Figure 19 A cross-sectional view along the QQ direction.

[0036] Figure 21 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0037] Figure 22This is a partial exploded structural diagram of an electronic device according to an embodiment of this application.

[0038] Figure 23 This is a circuit block diagram of an electronic device according to an embodiment of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 100-Inductor, 10-Magnetic core, 11-Through hole, 11a-First through hole, 11a-Second through hole, 12-First surface, 13-Air gap, 14-Second surface, 17-Magnetic film sublayer, 18-Insulator layer, 19-Adhesive sublayer, 30-Coil, 31-First conductor, 32-Second conductor, 33-First electrical connector, 34-Second electrical connector, 50-First insulator, 51-First through hole, 70-Second insulator, 71-Second through hole, 200-Integrated inductor on circuit board, 210-Circuit board, 211-First circuit layer, 215-Support layer, 219-Second circuit layer, 500-Electronic device, 510-Display screen, 520-Housing, 530-Processor, 550-Memory. Detailed Implementation

[0041] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0042] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0043] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0044] It should be noted that, for ease of explanation, the same reference numerals denote the same components in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0045] An inductor consists of a coil and magnetic components. When an alternating current flows through the coil, an alternating magnetic flux is generated inside and around the coil, giving it the function of storing and releasing energy. In electronic circuits, inductors limit alternating current. They can be combined with resistors or capacitors to form high-pass or low-pass filters, phase-shifting circuits, and resonant circuits, and are therefore widely used in various instruments and equipment.

[0046] In solenoid-structured inductors, the via connection structure of the solenoid coil winding is located in the outer area on both sides of the magnetic film. In order to avoid short circuits between the via connection and the magnetic film, a certain safety distance is maintained between the via and the edge of the magnetic film. As a result, there are more empty spaces on both sides of the magnetic film, which are not occupied by magnetic material. Especially when the device size is small, the area occupied by the safety distance will be higher, and the proportion of magnetic film material in the total volume of the device will be lower, which limits the improvement of the inductance.

[0047] To increase the area ratio of the magnetic film in an inductor, vias can be directly deposited with copper to connect the upper and lower layers of conductors on the magnetic film, forming a solenoid-type coil. This ensures that the magnetic film is present around the periphery of the vias, maximizing its occupancy within the entire device area and enhancing magnetic energy storage capacity. This allows for higher inductance within the same device area. However, the shorter magnetic path length around vias results in higher magnetic flux density, leading to higher magnetic flux density near the vias and lower magnetic flux density further away. This uneven distribution of magnetic flux density within the magnetic film causes local saturation when the magnetic flux density exceeds the saturation magnetic flux density at higher locations. This results in a decrease in overall effective permeability and inductance, causing the entire inductor to exhibit lower anti-saturation characteristics.

[0048] Please see Figure 1 and Figure 2 This application provides an inductor device 100, which includes a magnetic core 10 and a coil 30; the magnetic core 10 has a plurality of through holes 11 and a plurality of air gaps 13, at least a portion of the plurality of through holes 11 communicates with the air gaps 13, and the air gaps 13 penetrate the magnetic core 10; the coil 30 passes through the plurality of through holes 11 and is wound around the magnetic core 10, and the coil 30 is insulated from the magnetic core 10.

[0049] The inductor 100 of this application embodiment can be applied to electronic devices, etc., for limiting AC current. The inductor 100 can be combined with resistors or capacitors to form high-pass filters or low-pass filters, phase-shifting circuits, and resonant circuits, etc.

[0050] Understandably, both the through hole 11 and the air gap 13 penetrate the magnetic core 10 along the thickness direction of the magnetic core 10.

[0051] It should be noted that at least some of the plurality of through holes 11 are connected to the air gap 13. It can be understood that each through hole 11 may be provided with an air gap 13, or only some of the through holes 11 may be provided with an air gap 13.

[0052] It should be noted that the magnetic core 10 is not only located inside the coil 30 (i.e., the central part of the coil 30), but also part of the magnetic core 10 is located between the through holes 11 of the coil 30, or outside the coil 30 (i.e., beyond the area covered by the coil 30). Understandably, on average, each turn of the coil 30 passes through the magnetic core 10 twice.

[0053] Optionally, the coil 30 can be, but is not limited to, a solenoid-type coil 30. The material of the coil 30 can be, but is not limited to, copper.

[0054] Optionally, the number of turns of coil 30 can be, but is not limited to, 0.5 to 20 turns. For example, the number of turns of coil 30 can be, but is not limited to, 0.5, 1, 2, 3, 4, 5, 8, 10, 12, 14, 16, 18, 20 turns, etc. The more turns of coil 30, the greater the inductance of inductor 100, assuming other conditions remain unchanged. Therefore, the number of turns of coil 30 can be designed according to the application scenario and the required inductance, etc., and this application does not impose specific limitations.

[0055] The inductor 100 of this embodiment includes a magnetic core 10 and a coil 30. The magnetic core 10 has a plurality of through holes 11 and a plurality of air gaps 13. At least a portion of the plurality of through holes 11 communicates with the air gaps 13, and the air gaps 13 penetrate the magnetic core 10. The coil 30 passes through the plurality of through holes 11 and is wound around the magnetic core 10. The coil 30 is insulated from the magnetic core 10. The coil 30 passing through the plurality of through holes 11 and being wound around the magnetic core 10 allows the magnetic core 10 to cover a larger area in the inductor 100. Given a fixed size of the inductor 100, this allows for a better increase in the proportion of the magnetic core 10 in the inductor 100 (i.e., a higher area utilization rate), increasing the magnetic energy storage capacity of the inductor 100. This allows for the storage of more magnetic energy, thereby increasing the inductance of the inductor 100. In addition, an air gap 13 is provided in at least part of the multiple through holes 11 to block the magnetic circuit around the through holes 11, thereby avoiding excessive magnetic induction intensity near the through holes 11. This makes the magnetic induction intensity at various locations of the inductor 100 more similar and the distribution of magnetic induction intensity in the inductor 100 more uniform, thereby improving the anti-magnetic saturation characteristics of the inductor 100.

[0056] Please see Figure 3 and Figure 4In some embodiments, the width w of the air gap 13 is in the range of 5μm ≤ w ≤ 100μm. Specifically, the width w of the air gap 13 can be, but is not limited to, 5μm, 8μm, 10μm, 13μm, 15μm, 18μm, 20μm, 23μm, 25μm, 28μm, 30μm, 35μm, 40μm, 45μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, etc. If the width w of the air gap 13 is too small, the uniformity of the magnetic flux density distribution of the inductor 100 will be weak (i.e., less uniform), which will reduce the anti-magnetic saturation characteristics of the inductor 100 (i.e., the improvement on the anti-magnetic saturation characteristics of the inductor 100 will be limited). In addition, it will increase the difficulty of the processing technology of the air gap 13. If the width w of the air gap 13 is too large, although it can improve the uniformity of the magnetic flux density distribution of the inductor 100, the magnetic reluctance of the magnetic circuit will be too large, resulting in the inductance of the inductor 100 being too low.

[0057] Furthermore, the width w of the air gap 13 is in the range of 5μm≤w≤80μm. When the width of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0058] Furthermore, the width w of the air gap 13 is in the range of 5μm≤w≤65μm. When the width of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0059] Furthermore, the width w of the air gap 13 is in the range of 5μm≤w≤50μm. When the width of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0060] Furthermore, the width w of the air gap 13 is in the range of 5μm≤w≤30μm. When the width of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0061] In some embodiments, the length L of the air gap 13 is in the range of 20μm≤L≤500μm. Specifically, the length L of the air gap 13 can be, but is not limited to, 20μm, 30μm, 50μm, 60μm, 80μm, 100μm, 120μm, 140μm, 160μm, 180μm, 200μm, 230μm, 250μm, 280μm, 300μm, 350μm, 400μm, 450μm, 500μm, etc. If the length of the air gap 13 is too short, the uniformity of the magnetic flux density distribution of the inductor 100 will be weak, and the improvement of the anti-magnetic saturation characteristics of the inductor 100 will be limited. If the length of the air gap 13 is too long, the magnetic reluctance of the magnetic circuit will be too large, and the inductance of the inductor 100 will be too low. In addition, the farther away from the through hole 11, the lower the magnetic flux density. Therefore, the portion of the air gap 13 that is farther away from the through hole has a smaller effect on enhancing the magnetic saturation characteristics.

[0062] Furthermore, the length L of the air gap 13 is in the range of 20μm≤L≤400μm. When the length of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0063] Furthermore, the length L of the air gap 13 is in the range of 20μm≤L≤300μm. When the length of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0064] Furthermore, the length L of the air gap 13 is in the range of 50μm≤L≤200μm. When the length of the air gap 13 is within this range, the inductor 100 can have both high anti-magnetic saturation characteristics and high inductance.

[0065] In some embodiments, the ratio w / d of the width w of the air gap 13 to the radial dimension d of the through hole 11 is in the range of 0.01 ≤ w / d ≤ 0.1. Specifically, the ratio w / d of the width w of the air gap 13 to the radial dimension d of the through hole 11 can be, but is not limited to, 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, etc. If the ratio w / d of the width w of the air gap 13 to the radial dimension d of the through hole 11 is too small, the improvement on the uniformity of the magnetic flux density distribution of the inductor 100 is limited, thus the improvement on the anti-magnetic saturation characteristics of the inductor 100 is limited; if the ratio w / d of the width w of the air gap 13 to the radial dimension d of the through hole 11 is too large, the inductance attenuation of the inductor 100 is too large, which is not conducive to obtaining an inductor 100 with high inductance.

[0066] Furthermore, the ratio w / d of the width w of the air gap 13 to the radial dimension d of the through hole 11 is in the range of 0.03≤w / d≤0.08. This effectively improves the anti-magnetic saturation characteristics of the inductor 100 while preventing excessive attenuation of the inductance of the inductor 100.

[0067] Optionally, the radial dimension d of the through hole 11 is in the range of 50μm≤d≤1000μm. Specifically, the radial dimension d of the through hole 11 can be, but is not limited to, 50μm, 100μm, 150μm, 200μm, 250μm, 300μm, 400μm, 500μm, 600μm, 700μm, 800μm, 900μm, 1000μm, etc. When the radial dimension d of the through hole 11 is within this range, the portion of the coil 30 located in the through hole 11 can have a suitable safe distance from the magnetic core 10, while also allowing the magnetic core 10 to have a higher area ratio in the inductor, thereby enabling the inductor device 100 to have a higher inductance.

[0068] Furthermore, the radial dimension d of the through hole 11 is in the range of 50μm≤d≤800μm. When the radial dimension d of the through hole 11 is within this range, the portion of the coil 30 located in the through hole 11 can have a suitable safe distance from the magnetic core 10, while also allowing the magnetic core 10 to have a higher area ratio in the inductor, thereby enabling the inductor device 100 to have a higher inductance.

[0069] Furthermore, the radial dimension d of the through hole 11 is in the range of 50μm≤d≤500μm. When the radial dimension d of the through hole 11 is within this range, the portion of the coil 30 located in the through hole 11 can have a suitable safe distance from the magnetic core 10, while also allowing the magnetic core 10 to have a higher area ratio in the inductor, thereby enabling the inductor device 100 to have a higher inductance.

[0070] Furthermore, the radial dimension d of the through hole 11 is in the range of 100μm≤d≤300μm. When the radial dimension d of the through hole 11 is within this range, the portion of the coil 30 located in the through hole 11 can have a suitable safe distance from the magnetic core 10, while also allowing the magnetic core 10 to have a higher area ratio in the inductor, thereby enabling the inductor device 100 to have a higher inductance.

[0071] In some embodiments, the plurality of through holes 11 includes a plurality of first through holes 11a and a plurality of second through holes 11b, wherein the plurality of first through holes 11a are along a first direction (e.g., Figure 3The plurality of second through holes 11b are arranged at intervals in sequence (as indicated by arrow A), and are arranged at intervals in sequence along the first direction. The first through hole 11a and the second through hole 11b are arranged along the second direction (as indicated by arrow A). Figure 3 As indicated by arrow B, the coils 30 are arranged at intervals and alternately passed through the first through hole 11a and the second through hole 11b; along the first direction, the two closest to the edge of the plurality of first through holes 11a are provided with the air gap 13; the two closest to the edge of the plurality of second through holes 11b are provided with the air gap 13; wherein, the first direction intersects the second direction.

[0072] It should be noted that the coil 30 is alternately passed through the first through hole 11a and the second through hole 11b. Understandably, the coil 30 can pass through the first through hole 11a, go around the magnetic core 10 to the second through hole 11b, go through the second through hole 11b, and then go around the magnetic core 10 to another first through hole 11a and another second through hole 11b. This cycle is repeated, and the coil 30 is wound between the first through hole 11a and the second through hole 11b until the number of turns of the coil 30 meets the preset number.

[0073] In one specific embodiment, the first direction is perpendicular to the second direction. In other embodiments, the first direction may also be inclined to the second direction, for example, at an angle greater than or equal to 60°.

[0074] Understandably, along the first direction, except for the two first through holes 11a at the edge, the other first through holes 11a are not provided with air gaps 13 (i.e., they are not connected to air gaps 13). Similarly, along the first direction, except for the two second through holes 11b at the edge, the other second through holes 11b are not provided with air gaps 13 (i.e., they are not connected to air gaps 13).

[0075] For example, there are three first through holes 11a, which are arranged sequentially along the first direction. Among the three first through holes 11a, only the first and last two first through holes 11a are provided with air gaps 13, while the middle first through hole 11a is not provided with air gaps 13. There are three second through holes 11b, which are arranged sequentially along the first direction. Among the three second through holes 11b, only the first and last two second through holes 11b are provided with air gaps 13, while the middle second through hole 11b is not provided with air gaps 13.

[0076] In this embodiment, for the first through holes 11a or second through holes 11b that are not at the beginning or end, since the current direction of the portion of the coil 30 located in the plurality of first through holes 11a is the same and the current direction of the portion of the coil 30 located in the plurality of second through holes 11b is the same, the magnetic flux density between the first through holes 11a or second through holes 11b that are not at the beginning or end is relatively uniform. If an air gap 13 is provided, it will not contribute much to the uniformity of magnetic flux density, but it will excessively reduce the inductance of the inductor 100. In this embodiment, an air gap 13 is provided only in the first two first through holes 11a and the first two second through holes 11b in the first direction. This can improve the magnetic flux density of the inductor 100, so that the inductor 100 has better anti-magnetic saturation characteristics, while also allowing the inductor 100 to retain a high inductance.

[0077] In some embodiments, the air gap 13 extends along the radial direction of the through hole 11. In other words, the length of the air gap 13 is along the radial direction of the through hole 11. This can better improve the uniformity of the magnetic flux density distribution of the inductor and improve the anti-magnetic saturation characteristics of the inductor device 100.

[0078] Please see Figure 5 Optionally, the magnetic core 10 includes a first surface 12 and a second surface 14 disposed opposite to each other, and the first through hole 11a and the second through hole 11b both penetrate the first surface 12 and the second surface 14; the coil 30 includes multiple first wires 31, multiple second wires 32, multiple first electrical connectors 33 and multiple second electrical connectors 34, the first wires 31, the first electrical connectors 33, the second wires 32 and the second electrical connectors 34 are connected in series alternately; the multiple first wires 31 are arranged at intervals along the first direction on the first surface 12, the multiple second wires 32 are arranged at intervals along the first direction on the second surface 14, each first electrical connector 33 passes through a first through hole 11a and the first electrical connector 33 corresponds one-to-one with the first through hole 11a, and each second electrical connector 34 passes through a second through hole 11b and the second electrical connector 34 corresponds one-to-one with the second through hole 11b.

[0079] Understandably, the coil 30 is wound in a loop with the first wire 31, the first electrical connector 33, the second wire 32, and the second electrical connector 34 as the smallest repeating unit. It is also understood that each turn of the coil 30 includes the first wire 31, the first electrical connector 33, the second wire 32, and the second electrical connector 34.

[0080] Optionally, multiple first conductors 31 are arranged in parallel with each other, and multiple second conductors 32 are arranged in parallel with each other. The first conductors 31 and the second conductors 32 can be arranged in parallel or at an acute angle (e.g., less than or equal to 30°).

[0081] In this embodiment, multiple first wires 31 are disposed on the first surface 12, and multiple second wires 32 are disposed on the second surface 14. The first electrical connector 33 and the second electrical connector 34 are respectively disposed on the magnetic core 10. In this way, regardless of the number of turns of the coil 30, only one conductive layer needs to be disposed on each of the opposite sides of the magnetic core 10. After processes such as exposure, development, etching, stripping, and deposition of conductive materials (e.g., copper plating), the coil 30 can be fabricated. This can better simplify the fabrication process of the coil 30 and make the inductor device 100 thinner and lighter.

[0082] Optionally, the diameter d1 of the first electrical connector 33 can be in the range of 0.02mm ≤ d1 ≤ 0.5mm. Specifically, the diameter of the first electrical connector 33 can be, but is not limited to, 0.02mm, 0.05mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc. If the diameter of the first electrical connector 33 is too small, the resistance of the coil 30 will increase. If the diameter of the first electrical connector 33 is too large, the first through hole 11a needs to be set larger to maintain a safe distance from the magnetic core 10, thus reducing the proportion of the magnetic core 10.

[0083] Optionally, the diameter d2 of the second electrical connector 34 can be in the range of 0.02mm ≤ d2 ≤ 0.5mm. Specifically, the diameter of the second electrical connector 34 can be, but is not limited to, 0.02mm, 0.05mm, 0.08mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc. If the diameter of the second electrical connector 34 is too small, the resistance of the coil 30 will increase; if the diameter of the second electrical connector 34 is too large, the second through hole 11b needs to be larger to maintain a safe distance from the magnetic core 10, thus reducing the proportion of the magnetic core 10.

[0084] Please see Figure 6Optionally, the distance s1 between the first electrical connector 33 and the magnetic core 10 is in the range of 0.05mm ≤ s1 ≤ 0.3mm. In other words, the distance s1 between the outer peripheral sidewall of the first electrical connector 33 and the inner peripheral sidewall of the first through hole 11a is in the range of 0.05mm ≤ s1 ≤ 0.3mm. Specifically, the distance s1 between the first electrical connector 33 and the magnetic core 10 can be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the distance between the first electrical connector 33 and the magnetic core 10 is too small, a short circuit may easily occur between them, affecting the normal operation of the inductor 100. If the distance between the first electrical connector 33 and the magnetic core 10 is too large, the volume ratio of the magnetic core 10 will be reduced, the magnetic energy storage capacity of the magnetic core 10 will be reduced, and thus the inductance of the inductor 100 will be reduced. When the distance s1 between the first electrical connector 33 and the magnetic core 10 is 0.05mm to 0.3mm, it not only ensures a suitable safe distance between the first electrical connector 33 and the magnetic core 10 to avoid short circuits, but also allows the magnetic core 10 of the inductor 100 to have a higher volume ratio.

[0085] Optionally, the distance s2 between the second electrical connector 34 and the magnetic core 10 is in the range of 0.05mm ≤ s2 ≤ 0.3mm. In other words, the distance s2 between the outer peripheral sidewall of the second electrical connector 34 and the inner peripheral sidewall of the second through hole 11b is in the range of 0.05mm ≤ s2 ≤ 0.3mm. Specifically, the distance s2 between the second electrical connector 34 and the magnetic core 10 can be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the distance between the second electrical connector 34 and the magnetic core 10 is too small, a short circuit may easily occur between them, affecting the normal operation of the inductor 100. If the distance between the second electrical connector 34 and the magnetic core 10 is too large, the volume ratio of the magnetic core 10 will be reduced, thus reducing its magnetic energy storage capacity and consequently decreasing the inductance of the inductor 100. When the distance s2 between the second electrical connector 34 and the magnetic core 10 is between 0.05mm and 0.3mm, it not only ensures a suitable safe distance between them, preventing short circuits, but also allows the magnetic core 10 of the inductor 100 to have a higher volume ratio.

[0086] Please see Figure 7In some embodiments, the magnetic core 10 includes N magnetic film sub-layers 17 and at least N-1 insulator layers 18, the magnetic film sub-layers 17 and the insulator layers 18 are stacked alternately along a third direction, the third direction intersects with the first direction and the second direction, wherein N≥2 and is a positive integer.

[0087] In one specific embodiment, the third direction is perpendicular to both the first and second directions. Optionally, the third direction is the thickness direction of the magnetic core 10.

[0088] Understandably, both the first through hole 11a and the second through hole 11b penetrate the magnetic core 10 along the stacking direction of the magnetic film sub-layer 17 and the insulator layer 18. In other words, the first through hole 11a penetrates each magnetic film sub-layer 17 and each insulator layer 18, and the second through hole 11b penetrates each magnetic film sub-layer 17 and each insulator layer 18.

[0089] Understandably, the air gap 13 penetrates each magnetic film sub-layer 17 and each insulator layer 18 along a third direction (i.e., the thickness direction of the magnetic core 10). It should be noted that although the air gap 13 penetrates each magnetic film sub-layer 17 along a third direction, each magnetic film sub-layer 17 is a monolithic film layer, and the air gap 13 does not divide the magnetic film sub-layer 17 into multiple spaced parts.

[0090] When the magnetic core 10 has only one magnetic film layer, a large eddy current effect will be generated in the thickness direction of the magnetic core 10. In this embodiment, each magnetic film sub-layer 17 is made thin, and an insulator layer 18 is provided between any two adjacent magnetic film sub-layers 17. The insulator layer 18 can prevent the conduction of eddy currents in the magnetic film sub-layers 17 in the thickness direction of the magnetic core 10, thereby reducing the eddy current loss of the entire magnetic core 10 in the thickness direction, and thus reducing the eddy current loss of the entire inductor 100 and improving the efficiency of the inductor 100. Under the same thickness, compared with the scheme with only one magnetic film layer, using at least two magnetic film sub-layers 17 to be sequentially insulated can reduce the eddy current loss in the cross-section of the magnetic core 10 by 75%.

[0091] Optionally, the thickness h1 of each magnetic film sublayer 17 ranges from 0.5 μm ≤ h1 ≤ 10 μm; in other words, along the stacking direction of the magnetic film sublayer 17 and the insulator layer 18, the thickness of each magnetic film sublayer 17 ranges from 0.5 μm to 10 μm. Specifically, the thickness h1 of each magnetic film sublayer 17 can be, but is not limited to, 0.5 μm, 0.8 μm, 1 μm, 1.5 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. When the thickness of the magnetic film sublayer 17 is too small, the proportion of the magnetic film sublayer 17 in the total thickness of the magnetic core 10 is too small, which is not conducive to improving the inductance of the inductor device 100. In addition, to achieve the same total thickness of magnetic film sublayer 17, more layers are required, which increases the complexity of the process and the production cost. When the thickness of the magnetic film sublayer 17 is too large, it increases the eddy current loss within the single magnetic film sublayer 17 and increases the difficulty of depositing the magnetic film sublayer 17.

[0092] Optionally, the total thickness h of the N-layer magnetic film sub-layer 17 in the magnetic core 10 is in the range of 5 μm ≤ h ≤ 500 μm. Further, the total thickness h of the N-layer magnetic film sub-layer 17 in the magnetic core 10 is in the range of 50 μm ≤ h ≤ 500 μm. Specifically, the total thickness h of the N-layer magnetic film sub-layer 17 in the magnetic core 10 can be, but is not limited to, 5 μm, 8 μm, 10 μm, 20 μm, 30 μm, 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc. If the total thickness of the N-layer magnetic film sub-layer 17 in the magnetic core 10 is too small, the proportion of the magnetic film sub-layer 17 in the total thickness of the magnetic core 10 is too small, which is not conducive to improving the inductance of the inductor device 100. If the total thickness of the N-layer magnetic film sub-layer 17 in the magnetic core 10 is too large, it will increase the manufacturing difficulty and cost of the magnetic core 10.

[0093] In some embodiments, the material of the magnetic film sublayer 17 includes at least one of soft magnetic materials such as magnetic metals and magnetic alloys. Optionally, the magnetic metal includes at least one of iron, cobalt, and nickel; the magnetic alloy includes at least one of iron-based crystalline alloys, iron-based amorphous alloys, and cobalt-based amorphous alloys; the iron-based crystalline alloy includes at least one of FeNi alloys, FeCo alloys, FeAl alloys, FeSiAl alloys, FeNiMo alloys, and FeC alloys; the iron-based amorphous alloy includes at least one of FeSiB alloys, FeB alloys, FeNiPB alloys, and FeNiMoB alloys; and the cobalt-based amorphous alloy includes at least one of CoFeSiB alloys, CoFeCrSiB alloys, and CoNiFeSiB alloys. Compared to iron-based crystalline alloys and iron-based amorphous alloys, cobalt-based amorphous alloys have higher relative permeability. Therefore, when the magnetic core 10 requires a high relative permeability, the magnetic film sublayer 17 can be made of at least one of cobalt-based amorphous alloys. Compared to cobalt-based amorphous alloys, iron-based crystalline alloys and iron-based amorphous alloys have higher saturation magnetic properties. When the magnetic core 10 requires higher saturation magnetic properties, the magnetic film sublayer 17 can be selected from at least one of iron-based crystalline alloys and iron-based amorphous alloys. Compared to iron-based crystalline alloys, iron-based amorphous alloys and cobalt-based amorphous alloys have lower coercivity. When the magnetic core 10 requires lower coercivity, the magnetic film sublayer 17 can be selected from iron-based amorphous alloys and cobalt-based amorphous alloys. Coercivity refers to the magnetic flux density B of a magnetic material after saturation magnetization. When the external magnetic field returns to zero, the magnetic flux density does not return to zero. Only when a magnetic field of a certain magnitude is applied in the opposite direction of the original magnetization field can the magnetic flux density return to zero. This magnetic field is called the coercive magnetic field, also known as coercivity.

[0094] Optionally, the relative permeability of the magnetic film sublayer 17 is 100 ≤ μr³ ≤ 1000. Further, the relative permeability of the magnetic film sublayer 17 is 200 ≤ μr³ ≤ 800. Even further, the relative permeability of the magnetic film sublayer 17 is 300 ≤ μr³ ≤ 500. Specifically, the relative permeability of the magnetic film sublayer 17 can be, but is not limited to, 100, 150, 200, 250, 300, 350, 400, 450, 500, 600, 700, 800, 900, 1000, etc. If the relative permeability of the magnetic film sublayer 17 is too low, the effective relative permeability of the resulting magnetic core 10 will be too low, resulting in too low inductance of the inductor device 100. If the relative permeability of the magnetic film sublayer 17 is too high, the requirements for the material will be too stringent, increasing the material cost, or even making it impossible to achieve the desired result.

[0095] Optionally, along the stacking direction of the magnetic film sublayer 17 and the insulator layer 18, the thickness h2 of the insulator layer 18 ranges from 10 μm ≤ h2 ≤ 60 μm. Specifically, the thickness h2 of each insulator layer 18 can be, but is not limited to, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, etc. If the thickness of the insulator layer 18 is too small, the mechanical properties are low (i.e., the mechanical properties are limited), which is not conducive to the deposition of the magnetic film sublayer 17. If the thickness of the insulator layer 18 is too large, it will increase the thickness of the magnetic core 10, which is not conducive to the ultra-thin fabrication of the inductor device 100.

[0096] Optionally, the insulator layer 18 includes at least one of a polyimide film (PI film) and a glass fiber / epoxy resin composite board (Prepreg). The polyimide film has better flexibility and is better suited for flexible circuit boards. The glass fiber / epoxy resin composite board has better rigidity and is more suitable for printed circuit boards.

[0097] Please see Figure 8 In some embodiments, the magnetic core 10 further includes at least N layers of adhesive sublayers 19, with insulator layers 18, magnetic film sublayers 17, and adhesive sublayers 19 alternately stacked. During the fabrication of the magnetic core 10, a magnetic film sublayer 17 is first deposited on the insulator layer 18 using methods such as electroplating. Then, multiple insulator layers 18 with deposited magnetic film sublayers 17 are bonded together using adhesive sublayers 19 to form a magnetic core 10 with multiple layers of insulator layers 18, multiple layers of magnetic film sublayers 17, and multiple layers of adhesive sublayers 19 alternately stacked. The adhesive sublayers 19 can bond multiple insulator layers 18 with magnetic film sublayers 17 to form an integrated magnetic core 10. Using adhesive sublayers 19 to stack multiple layers of insulator layers 18 / magnetic film sublayers 17 simplifies the assembly process of the magnetic core 10, allowing each layer of insulator layer 18 / magnetic film sublayer 17 to be more securely assembled together.

[0098] Specifically, the number of adhesive sublayers 19 can be one or more, such as one, two, three, four, or five layers. The number of adhesive sublayers 19 can be determined based on the number of magnetic film sublayers 17 included in the magnetic core 10, and this application does not make any specific limitation.

[0099] Optionally, the adhesive sublayer 19 may be, but is not limited to, a pure film.

[0100] Optionally, the pure film includes at least one of acrylic resin and epoxy resin. Acrylic resin has high adhesive strength and good ductility and flexibility, making it more suitable for use in flexible circuits, but its electrical performance is not ideal, and it can cause copper migration under high temperature conditions; epoxy resin has good adhesive and electrical properties, as well as good corrosion resistance, so its various properties are relatively balanced and good.

[0101] Optionally, along the stacking direction of the insulator layer 18, the magnetic film layer 17, and the adhesive layer 19, the thickness h3 of each adhesive layer 19 is in the range of 10 μm ≤ h3 ≤ 30 μm. Specifically, the thickness h3 of each adhesive layer 19 can be, but is not limited to, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 26 μm, 28 μm, 30 μm, etc. If the thickness of the adhesive layer 19 is too thin, the adhesive performance will be insufficient, affecting the adhesion of the magnetic film layer 17. In addition, if the adhesive layer 19 is too thin, the mechanical properties will be limited, and it will be difficult to manufacture. If the thickness of the adhesive layer 19 is too large, it will increase the thickness of the magnetic core 10, which is not conducive to the thinning of the inductor device 100.

[0102] In other embodiments, the adhesive sublayer 19 may also be formed by using a liquid adhesive, which is applied by coating, spin coating, scraping, or other methods to form a film, and then heated and cured.

[0103] In other embodiments, the magnetic core 10 may also be at least one of a metal powder core, ferrite, etc., which are made entirely of magnetic materials.

[0104] Please see again Figure 6 Optionally, the inductor 100 further includes a first insulating member 50 and a second insulating member 70. The first insulating member 50 is disposed in the first through hole 11a and has a first through hole 51 for passing through the first electrical connector 33. The second insulating member 70 is disposed in the second through hole 11b and has a second through hole 71 for passing through the second electrical connector 34.

[0105] In this embodiment, by providing the first insulating member 50 and the second insulating member 70, the first electrical connector 33 and the second electrical connector 34 can be better insulated from the magnetic core 10, thereby better avoiding short-circuit connections between the first electrical connector 33 and the second electrical connector 34 and the magnetic core 10.

[0106] Optionally, the wall thickness of the first insulating member 50 can be in the range of 0.05mm ≤ L1 ≤ 0.3mm; specifically, the wall thickness of the first insulating member 50 can be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the wall thickness of the first insulating member 50 is too small, a short circuit can easily occur between the first electrical connector 33 and the magnetic core 10, affecting the normal operation of the inductor 100; if the wall thickness of the first insulating member 50 is too large, the volume ratio of the magnetic core 10 is reduced, the magnetic energy storage capacity of the magnetic core 10 is reduced, and thus the inductance of the inductor 100 is reduced. When the wall thickness of the first insulating member 50 is 0.05mm to 0.3mm, it not only allows for a suitable safe distance between the first electrical connector 33 and the magnetic core 10 to avoid short circuits, but also allows the magnetic core 10 of the inductor device 100 to have a higher volume ratio.

[0107] Optionally, the wall thickness of the second insulating member 70 is in the range of 0.05mm ≤ L2 ≤ 0.3mm; specifically, the wall thickness of the second insulating member 70 can be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm, 0.23mm, 0.25mm, 0.28mm, 0.3mm, etc. If the wall thickness of the second insulating member 70 is too small, the second electrical connector 34 and the magnetic core 10 are prone to short circuit, affecting the normal operation of the inductor 100; if the wall thickness of the second insulating member 70 is too large, the volume ratio of the magnetic core 10 is reduced, the magnetic energy storage capacity of the magnetic core 10 is reduced, thereby reducing the inductance of the inductor 100. When the wall thickness of the second insulating member 70 is 0.05mm to 0.3mm, it not only allows for a suitable safe distance between the second electrical connector 34 and the magnetic core 10 to avoid short circuits, but also allows the magnetic core 10 of the inductor device 100 to have a higher volume ratio.

[0108] Can the first insulating member 50 be annular in structure? The outer peripheral sidewall of the first insulating member 50 is fitted to the inner peripheral sidewall of the first through hole 11a, and the inner peripheral sidewall of the first insulating member 50 is fitted to the outer peripheral sidewall of the first electrical connector 33. Similarly, the second insulating member 70 is annular in structure? The outer peripheral sidewall of the second insulating member 70 is fitted to the inner peripheral sidewall of the second through hole 11b, and the inner peripheral sidewall of the second insulating member 70 is fitted to the outer peripheral sidewall of the second electrical connector 34.

[0109] In some embodiments, the first insulating member 50 may be made of, but is not limited to, epoxy resin. The second insulating member 70 may be made of, but is not limited to, epoxy resin. Both the first insulating member 50 and the second insulating member 70 may be formed by curing liquid epoxy resin.

[0110] In one specific embodiment, liquid epoxy resin is filled into the first through hole 11a and cured to form a resin part. A hole is drilled in the resin part to obtain a first insulating part. A conductive material (e.g., copper plating) is deposited in the hole to form a first electrical connector 33, thereby connecting the magnetic core 10, the first insulating part 50, and the first electrical connector 33 into one unit. Similarly, liquid epoxy resin is filled into the second through hole 11b and cured to form a resin part. A hole is drilled in the resin part to obtain a second insulating part. A conductive material (e.g., copper plating) is deposited in the hole to form a second electrical connector 34, thereby connecting the magnetic core 10, the second insulating part 70, and the second electrical connector 34 into one unit.

[0111] Please see Figure 9 This application also provides a method for fabricating an inductor device 100, comprising:

[0112] S201 provides insulator layer 18;

[0113] For a detailed description of the insulator layer 18, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0114] S202, a magnetic film sub-layer 17 is formed on the insulator layer 18 to obtain a stacked insulator layer 18 / magnetic film sub-layer 17.

[0115] Optionally, a magnetic film sublayer 17 may be deposited on the surface of the insulator layer 18 by means of electroplating or the like. For a detailed description of the magnetic film sublayer 17, please refer to the description in the corresponding section of the above embodiments, which will not be repeated here.

[0116] In other embodiments, the self-supporting magnetic film sublayer 17 can also be prepared using a cathode roller process without using an insulator layer 18 as a supporting substrate.

[0117] S203, multiple insulator layers 18 / magnetic film layers 17 are stacked and bonded together using an adhesive layer 19, resulting in an alternating stack of insulator layers 18 / magnetic film layers 17 / adhesive layers 19, thus obtaining the magnetic core 10 structure; and

[0118] Optionally, the prepared insulator layer 18 / magnetic film layer 17 are hot-pressed together using an adhesive layer 19 to obtain an alternating stack of insulator layer 18 / magnetic film layer 17 / adhesive layer 19, thus obtaining the magnetic core 10 structure. For a detailed description of the adhesive layer 19, please refer to the description in the corresponding section of the above embodiments, which will not be repeated here.

[0119] S204, multiple first through holes 11a and multiple second through holes 11b are drilled on the alternately stacked insulator layer 18 / magnetic film layer 17 / adhesive layer 19.

[0120] Optionally, only one magnetic core 10 can be fabricated at a time, or multiple magnetic cores 10 can be fabricated simultaneously. When multiple magnetic cores 10 need to be fabricated simultaneously, a large-sized alternating layer of insulator layer 18 / magnetic film layer 17 / adhesive layer 19 can be fabricated, and multiple first through holes 11a and multiple second through holes 11b can be drilled at positions corresponding to multiple first through holes 11a and multiple second through holes 11b in each magnetic core 10 using laser or mechanical drilling.

[0121] For other aspects of the magnetic core 10, please refer to the descriptions in the corresponding sections of the above embodiments, which will not be repeated here.

[0122] S205, a first insulating element 50 is formed in a plurality of first through holes 11a of the magnetic core 10, and a second insulating element 70 is formed in a plurality of second through holes 11b of the magnetic core 10;

[0123] Optionally, liquid epoxy resin is injected into a plurality of first through holes 11a of the magnetic core 10 and heated to cure, forming a first insulating element 50. Liquid epoxy resin is also injected into a plurality of second through holes 11b of the magnetic core 10 and heated to cure, forming a second insulating element 70.

[0124] S206, providing a first substrate layer / first conductive layer stacked together and a second substrate layer / second conductive layer stacked together;

[0125] Optionally, the first substrate layer / first conductive layer may be, but is not limited to, a single-sided copper-clad laminate, and the second substrate layer / second conductive layer may be, but is not limited to, a single-sided copper-clad laminate. Optionally, the first substrate layer may be, but is not limited to, a polyimide film (PI film) or a fiberglass / epoxy resin composite board (Prepreg board). The second substrate layer may be, but is not limited to, a polyimide film (PI film) or a fiberglass / epoxy resin composite board (Prepreg board). The first conductive layer may be, but is not limited to, a copper layer, and the second conductive layer may be, but is not limited to, a copper layer.

[0126] S207, the first substrate layer / first conductive layer and the second substrate layer / second conductive layer are respectively stacked on opposite sides of the magnetic core 10 having the first insulating member 50 and the second insulating member 70, and the first conductive layer and the second conductive layer are both disposed away from the magnetic core 10, and cover the magnetic core 10, the first insulating member 50 and the second insulating member 70.

[0127] Optionally, the first substrate layer / first conductive layer, the second substrate layer / second conductive layer, and the magnetic core 10 having the first insulating member 50 and the second insulating member 70 are stacked in sequence and pressed together.

[0128] S208, the first conductive layer and the second conductive layer are etched, and conductive material is deposited through vias on the first insulating member 50 and the second insulating member 70 to form the coil 30; and

[0129] Optionally, the first conductive layer is exposed, developed, etched, and delaminated to obtain multiple first conductive wires 31; the second conductive layer is exposed, developed, etched, and delaminated to obtain multiple second conductive wires 32 spaced apart. Vias are formed on the stacked first conductive layer / first substrate layer / magnetic core 10 + first insulating element 50 + second insulating element 70 / second substrate layer / second conductive layer at positions corresponding to the first insulating element 50 and the second insulating element 70, and conductive material (e.g., copper) is deposited in the vias to form first electrical connectors 33 and second electrical connectors 34, thereby producing first conductive wires 31, first electrical connectors 33, second conductive wires 32, and second electrical connectors 34 connected in series to form a coil 30.

[0130] It should be noted that the method of this embodiment can be used to fabricate a single inductor device 100 or to fabricate multiple inductor devices 100 simultaneously.

[0131] S209, an air gap 13 is opened in at least a portion of the plurality of through holes corresponding to the air gap 13 in the magnetic core 10.

[0132] Optionally, the air gap 13 can be created by laser etching. For a detailed description of other aspects of the air gap 13, please refer to the description of the corresponding section of the above embodiments, which will not be repeated here.

[0133] The fabrication method of the inductor device 100 in this embodiment can be used to fabricate multiple inductor devices 100 simultaneously on a single board. After fabrication, they are then cut into individual inductor devices 100 by laser cutting or die cutting. Furthermore, the inductor device 100 of this application can also be formed during the circuit board manufacturing process. A coil 30 is fabricated using a copper-clad laminate forming the circuit board (i.e., the first substrate layer / first conductive layer and the second substrate layer / second conductive layer are copper-clad laminates), thereby fabricating an inductor device 100 embedded in the circuit board (i.e., a circuit board integrated inductor).

[0134] The inductor device 100 of this application will be further described below through specific embodiments.

[0135] Example 1

[0136] The inductor device 100 in this embodiment includes a magnetic core 10 and a coil 30. The magnetic core 10 has three first through holes 11a and three second through holes 11b. The three first through holes 11a are arranged alternately along a first direction, and the three second through holes 11b are arranged alternately along the first direction. The first through holes 11a and the second through holes 11b are arranged alternately along a second direction, wherein the first direction and the second direction intersect. The coil 30 is alternately passed through the first through holes 11a and the second through holes 11b and wound around the magnetic core 10. The coil 30 is insulated from the magnetic core 10.

[0137] The magnetic core 10 also has two long air gaps 13 and two short air gaps 13. One long air gap 13 and one short air gap 13 are respectively disposed at two of the first through holes 11a at both ends of the three first through holes 11a. The other long air gap 13 and the other short air gap 13 are respectively disposed at two of the second through holes 11b at both ends of the three second through holes 11b. The length of the long air gap 13 is 0.54 mm, the length of the short air gap 13 is 0.1 mm, and the width of both the long air gap 13 and the short air gap 13 is 10 μm.

[0138] The magnetic core 10 of the inductor device 100 in this embodiment has dimensions of 1.95mm × 1.5mm. The magnetic core 10 includes alternating layers of insulator layers 18, magnetic film layers 17, and adhesive layers 19. The magnetic film layers 17 have six layers, each with a thickness of 6μm. The material of the magnetic film layers 17 is FeNi soft magnetic alloy, and the relative permeability of the magnetic film layers 17 is 230, and the conductivity is 2353 KS / m. The insulator layers 18 are polyimide (PI) layers with a thickness of 12μm. The adhesive layers 19 are epoxy resin layers with a thickness of 15μm. The coil 30 has 3.5 turns, a linewidth of 350μm, a line thickness of 60μm, and a line spacing of 120μm. A schematic diagram of the magnetic core 10 in this embodiment is shown below. Figure 10 As shown.

[0139] Example 2

[0140] The difference between the inductor device 100 in this embodiment and that in Embodiment 1 is that all four air gaps 13 in this embodiment are short air gaps 13. Two short air gaps 13 are respectively disposed at the two first through holes 11a at the beginning and end of the three first through holes 11a, and the other two short air gaps 13 are respectively disposed at the two second through holes 11b at the beginning and end of the three second through holes 11b. The length of each air gap 13 is 0.1 mm, and the width of each air gap 13 is 10 μm. A schematic diagram of the magnetic core 10 in this embodiment is shown below. Figure 11 As shown.

[0141] Comparative Example 1

[0142] The difference between the inductor 100 in this comparative example and that in Example 1 is that the air gap 13 is not provided in this comparative example. A schematic diagram of the magnetic core 10 in this comparative example is shown below. Figure 12 As shown.

[0143] The inductance of Examples 1, 2, and Comparative Example 1 was measured according to GB / T 8554-1998, and the test results are shown in Table 1 below. The magnetic flux density distribution of Examples 1, 2, and Comparative Example 1 was simulated using Ansys Maxwell software. The magnetic flux density distribution cloud diagram along the extended plane of the inductor 100 in Example 1 is shown below. Figure 13 and Figure 14 As shown, the magnetic flux density distribution cloud map of the inductor 100 along its extended plane in Embodiment 2 is as follows. Figure 15 and Figure 16 As shown, the magnetic flux density distribution cloud diagram along the extended plane of the inductor 100 in Comparative Example 1 is as follows: Figure 17 and Figure 18 As shown in Table 1, the average magnetic film, standard deviation of magnetic flux density distribution, and other parameters of each embodiment and comparative example are shown below.

[0144] Table 1. Parameter information for each embodiment and comparative example.

[0145]

[0146]

[0147] From Table 1 and Figures 13 to 18 The test results show that creating an air gap 13 at the through-hole 11 reduces the inductance of the inductor 100, and the longer the air gap 13, the greater the reduction in inductance. However, creating an air gap 13 can improve the uniformity of the magnetic flux density distribution of the inductor 100, reduce the standard deviation of the magnetic flux density distribution, and increase the length of the air gap 13 can make the magnetic film distribution more uniform, thus increasing the anti-magnetic saturation characteristics of the inductor 100. Therefore, the length of the air gap 13 can achieve a balance between inductance and anti-magnetic saturation characteristics, allowing the inductor 100 to retain a high inductance while also having good anti-magnetic saturation characteristics.

[0148] Please see Figure 19 This application provides a circuit board integrated inductor 200, which includes a circuit board 210 and an inductor device 100 according to this application embodiment, with the inductor device 100 supported on the circuit board 210.

[0149] For a detailed description of the inductor 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0150] Optionally, circuit board 210 may be, but is not limited to, a printed circuit board (PCB) or a flexible circuit board (FPC).

[0151] Please see Figure 20Optionally, the inductor 100 is embedded within a circuit board 210. The circuit board 210 includes a first circuit layer 211, a first substrate layer 213, a support layer 215, a second substrate layer 217, and a second circuit layer 219 stacked sequentially. The coil 30 is partially formed on the conductive layer used to fabricate the first circuit layer 211 and the second circuit layer 219, and the magnetic core 10 is embedded in the support layer 215. Understandably, the magnetic core 10 is located between the first substrate layer 213 and the second substrate layer 217. In this embodiment, the inductor 100 is embedded inside the circuit board 210, which fully utilizes the internal space of the circuit board 210, thereby reducing the overall thickness of the integrated inductor 200 on the circuit board. This better saves the surface area of ​​the circuit board 210, improves the wiring and component capabilities of the circuit board 210, reduces the cumbersome mounting of the inductor 100, and significantly improves packaging efficiency. Furthermore, the coil 30 of the inductor 100 is formed by the first circuit layer 211 and the second circuit layer 219 of the circuit board 210 during the manufacturing process, and the inductor 100 can be embedded in the circuit board 210 manufacturing process, which greatly simplifies the manufacturing process of the inductor 100 and improves production efficiency. In addition, using the first circuit layer 211 and the second circuit layer 219 of the circuit board 210 to prepare the coil 30 can better reduce the size of the inductor 100, especially greatly reducing the thickness of the inductor 100, which is conducive to the miniaturization of the circuit board integrated inductor 200.

[0152] Optionally, the first circuit layer 211 may be, but is not limited to, a copper circuit layer. The second circuit layer 219 may be, but is not limited to, a copper circuit layer.

[0153] Optionally, the first line layer is disposed on the same layer as the first conductor 31 (211), and the second line layer 219 is disposed on the same layer as the second conductor 32.

[0154] In other embodiments, the inductor 100 may be fabricated first and then mounted on the surface of the circuit board 210 by surface mounting.

[0155] It is understood that the circuit board integrated inductor 200 in this embodiment is merely one form of the circuit board integrated inductor 200 used in the inductor device 100, and should not be construed as a limitation on the circuit board integrated inductor 200 provided in this application, nor should it be construed as a limitation on the inductor device 100 provided in various embodiments of this application.

[0156] Please see Figures 21 to 23This application provides an electronic device 500, which includes a display screen 510, an inductor 100 or a circuit board integrated inductor 200, and a processor 530. The processor 530 is electrically connected to the coil 30 in the circuit board integrated inductor 200 or the inductor 100. The processor 530 is used to control the magnitude and direction of the current flowing through the coil 30. The processor 530 is also electrically connected to the display screen 510 to control the display screen 510 to display.

[0157] For a detailed description of the inductor 100 or the circuit board integrated inductor 200, please refer to the description of the corresponding part of the above embodiments, which will not be repeated here.

[0158] The electronic device 500 in this application embodiment can be, but is not limited to, a mobile phone, tablet computer, laptop computer, desktop computer, smart bracelet, smartwatch, e-reader, game console, or other portable electronic device 500. The electronic device 500 in this application embodiment can also be at least one of a power adapter (computer adapter, mobile phone adapter, etc.), mobile phone charger, etc. It is understood that the electronic device 500 in this embodiment is merely one form of the electronic device 500 using the inductor 100 or the circuit board integrated inductor 200, and should not be construed as a limitation on the electronic device 500 provided in this application, nor should it be construed as a limitation on the inductor 100 or the circuit board integrated inductor 200 provided in the various embodiments of this application.

[0159] Optionally, the display screen 510 may be, but is not limited to, one or more of the following: liquid crystal display screen, light-emitting diode display screen (LED display screen), micro light-emitting diode display screen (Micro LED display screen), mini light-emitting diode display screen (Mini LED display screen), organic light-emitting diode display screen (OLED display screen).

[0160] Optionally, processor 530 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), microprocessor, microcontroller, main processor, controller, and ASIC, etc. Processor 530 is used to execute various types of digital storage instructions, such as software or firmware programs stored in memory 550, which enables the computing device to provide a wide range of services.

[0161] Optionally, the electronic device 500 of this application also includes a memory 550. The memory 550 is electrically connected to the processor 530 and is used to store the program code required for the processor 530 to run, the program code required to control the display screen 510 and the inductor device 100 or the circuit board integrated inductor 200, the display content of the display screen 510, etc.

[0162] Optionally, memory 550 may include volatile memory, such as random access memory (RAM); memory 550 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). Memory 550 may also include combinations of the above types of memory.

[0163] Optionally, the electronic device 500 in this embodiment of the application further includes a housing 520. The housing 520 and the display screen 510 form a receiving space for receiving components of the electronic device 500, such as the processor 530, the memory 550, and the inductor 100 or the circuit board integrated inductor 200.

[0164] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form yet another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0165] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. An inductor device, characterized in that, include: A magnetic core having multiple through holes and multiple air gaps, at least a portion of the through holes communicating with the air gaps, the air gaps penetrating the magnetic core along its thickness direction; and A coil, which passes through the plurality of through holes and is wound around the magnetic core, and the coil is insulated from the magnetic core; The plurality of through holes includes a plurality of first through holes and a plurality of second through holes. The plurality of first through holes are arranged at intervals along a first direction, and the plurality of second through holes are arranged at intervals along the first direction. The first through holes and the second through holes are arranged at intervals along a second direction. The coil is alternately passed through the first through holes and the second through holes. Along the first direction, the two first through holes closest to both ends of the plurality of first through holes are provided with the air gap. The two second through holes closest to both ends of the plurality of second through holes are provided with the air gap. The first direction and the second direction intersect.

2. The inductor device according to claim 1, characterized in that, The width w of the air gap is in the range of 5μm≤w≤100μm; the length L of the air gap is in the range of 20μm≤L≤500μm.

3. The inductor device according to claim 2, characterized in that, The width w of the air gap is in the range of 5μm≤w≤30μm; the length L of the air gap is in the range of 50μm≤L≤200μm.

4. The inductor device according to claim 1, characterized in that, The ratio w / d of the width w of the air gap to the radial dimension d of the through hole is in the range of 0.01≤w / d≤0.

1.

5. The inductor device according to claim 1, characterized in that, The magnetic core includes N magnetic film sublayers and at least N-1 insulator layers, wherein the magnetic film sublayers and the insulator layers are stacked alternately in sequence, and N≥2 and is a positive integer; the plurality of through holes penetrate the magnetic core along the stacking direction of the magnetic film sublayers and the insulator layers.

6. The inductor device according to claim 5, characterized in that, The thickness h1 of each magnetic film sublayer is in the range of 0.5μm≤h1≤10μm, and the total thickness h of the N magnetic film sublayers in the magnetic core is in the range of 5μm≤h≤500μm; the relative permeability μr3 of the magnetic film sublayers is in the range of 100≤μr3≤1000.

7. The inductor device according to any one of claims 1-6, characterized in that, Each turn of the coil includes a first conductor, a first electrical connector, a second conductor, and a second electrical connector connected in series. The first conductor and the second conductor are respectively disposed on two opposite surfaces of the magnetic core. The inductor also includes a first insulating member and a second insulating member. The first insulating member is disposed in the first through hole and has a first through hole for the first electrical connector to pass through. The second insulating member is disposed in the second through hole and has a second through hole for the second electrical connector to pass through.

8. The inductor device according to claim 7, characterized in that, The distance s1 between the first electrical connector and the magnetic core is in the range of 0.05mm ≤ s1 ≤ 0.3mm; And / or, The distance s2 between the second electrical connector and the magnetic core is in the range of 0.05mm≤s2≤0.3mm.

9. An integrated inductor on a circuit board, characterized in that, include: Circuit board; as well as The inductor according to any one of claims 1-8, wherein the inductor is embedded in the circuit board, the circuit board comprising a first circuit layer, a first substrate layer, a support layer, a second substrate layer and a second circuit layer stacked sequentially, the coil portion being formed on a conductive layer for fabricating the first circuit layer and the second circuit layer, and the magnetic core being embedded in the support layer.

10. An electronic device, characterized in that, include: Display screen; The inductor device according to any one of claims 1 to 8 or the circuit board integrated inductor according to claim 9; as well as The processor is electrically connected to the inductor integrated on the circuit board or the coil in the inductor device. The processor is used to control the magnitude and direction of the current flowing through the coil. The processor is also electrically connected to the display screen to control the display screen to display.

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