Multi-functional shaping apparatus and method for packaging devices

Abstract

The utility model provides a kind of multifunctional shaping device and method of packaging device, it is related to the field of packaging device, device includes upper cover plate, waffle, shaping tooling;Multiple holes are set in waffle, and the hole of waffle is placed in the edge position of hole and is provided with support frame, support frame is used to support packaging device;Upper cover plate is covered in the side of waffle, for pressing the end of packaging device away from support frame;Shaping tooling is set with multiple shaping holes, the position of shaping hole corresponds with the welding post connected with packaging device one to one, shaping tooling is installed in the side of waffle away from upper cover plate, and welding post is inserted into shaping hole, to correct the skew welding post.Effective correction can be carried out to skew welding post, reduce the turnover times of device during transfer, reduce the problem of skew welding post before welding, improve production efficiency, and ensure product quality.

Description

Technical Field

[0001] This invention belongs to the field of electrical assembly technology, and particularly relates to a multifunctional shaping device and method for packaged devices. Background Technology

[0002] CCGA (Ceramic Column Grid Arrav) packaged devices, or simply packaged devices, have multiple solder posts connected to one side. One end of each solder post needs to be soldered to a printed circuit board, and the solder posts need to correspond one-to-one with the pads on the printed circuit board.

[0003] However, due to the material characteristics of the solder pillars connecting the packaged devices, the solder pillars are prone to skew relative to the packaged devices before soldering. This inevitably leads to solder pillar skew before and after soldering. Furthermore, the inability to protect the solder pillars from damage and fix the devices before mounting directly affects the first-pass yield and product quality, posing a risk of decreased product reliability. Summary of the Invention

[0004] The technical problem solved by this application is to overcome the shortcomings of the prior art and provide a multifunctional shaping device and method for CCGA packaged devices, so as to achieve the purpose of shaping the skewed solder pillars of CCGA packaged devices. The shaping device is simple and effective to operate and improves production efficiency.

[0005] The technical solution provided in this application is as follows:

[0006] In a first aspect, a multifunctional shaping device for packaged devices is provided, including a top cover plate, a waffle plate, and a shaping fixture; the waffle plate has multiple holes penetrating through the waffle plate placement holes, and a support frame is provided at the edge of the placement holes on the waffle plate to support the packaged device; the top cover plate is placed on one side of the waffle plate to press the end of the packaged device away from the support frame; the shaping fixture has multiple shaping holes, the positions of which correspond one-to-one with the solder posts connected to the packaged device, and the shaping fixture is installed on the side of the waffle plate away from the top cover plate, with the solder posts inserted into the shaping holes to correct any skewed solder posts.

[0007] The position of the support frame satisfies the following condition: when the end of the bonding post of the packaged device is supported by the support frame, the bonding post is suspended in the placement hole.

[0008] The upper cover plate has multiple device fixing slots, which are shaped to match the end of the packaged device away from the solder post, and the device fixing slots correspond one-to-one with the placement holes.

[0009] The shaping hole is funnel-shaped, with the inner diameter of the small diameter end of the shaping hole being 0.04 to 0.08 mm larger than the diameter of the welding column, and the inner diameter of the large diameter end of the shaping hole being 0.29 to 0.39 mm larger than the diameter of the welding column.

[0010] The waffle plate has a chamfer at the end where the placement hole faces the top cover plate.

[0011] The waffle tray has a first pick-and-place slot at the center of the edge of the placement hole, through which the packaged device is picked up; the waffle tray has a third placement slot at the included angle of the edge of the placement hole.

[0012] The waffle plate has a second pick-and-place slot on the edge facing the shaping fixture, and the second placement slot extends from the outer wall of the waffle plate to the placement hole.

[0013] The waffle plate is connected to the four corners of the end facing the upper cover plate with a first positioning post. The upper cover plate has a first positioning hole, and the first positioning post cooperates with the first positioning hole.

[0014] The waffle plate is connected to a second positioning post at one end facing the shaping fixture. The shaping fixture has a second positioning hole, and the second positioning post cooperates with the second positioning hole.

[0015] Secondly, a multi-functional shaping method for packaged devices is provided, using any of the multi-functional shaping devices for packaged devices described above, comprising:

[0016] S1: With the solder pillar facing down, place the packaged device into the placement hole, and the packaged device is supported by the support frame in the placement hole;

[0017] S2: Align the first positioning hole with the first positioning post so that the upper cover plate covers the top of the waffle plate.

[0018] S3: Flip the top cover plate and waffle plate together until the waffle plate is above the top cover plate, and manually perform initial alignment of the weld column.

[0019] S4: Align the second positioning hole with the second positioning post, so that the large diameter end of the shaping hole faces down, move the shaping fixture down, and insert the welding posts one by one into the shaping hole;

[0020] S5: Move the shaping fixture upwards until it is detached from the waffle plate, then flip the waffle plate and the top cover plate together until the top cover plate is above the waffle plate. Move the top cover plate upwards until it is detached from the waffle plate. At this point, the packaged device after the correction of the solder post is obtained, and the side of the packaged device away from the solder post is facing upwards.

[0021] In summary, this application includes at least the following beneficial technical effects:

[0022] The multi-functional shaping device for CCGA packaged devices uses tooling to fix the solder pillars and effectively correct skewed solder pillars. By fixing the device and solder pillars and reducing the number of times the device is flipped during transport, the device reduces the problem of solder pillar skew before soldering. The device also uses fixing holes designed on the tooling to correct skewed solder pillars, thereby improving production efficiency and ensuring product quality. Attached Figure Description

[0023] Figure 1 A schematic diagram of the multi-functional shaping device for CCGA packaged devices;

[0024] Figure 2 Schematic diagram of the top cover plate of a multi-functional shaping device for CCGA packaged devices;

[0025] Figure 3 Schematic diagram of a waffle plate for a multi-functional shaping device for CCGA packaged devices;

[0026] Figure 4 This is a schematic diagram of a multi-functional shaping fixture for CCGA packaged devices.

[0027] Explanation of icon numbers:

[0028] 1. Top cover plate; 11. First positioning hole; 12. Component fixing slot;

[0029] 2. Waffle tray; 21. Placement hole; 22. Support frame; 23. First pick-and-place slot; 24. Second pick-and-place slot; 25. First positioning post; 26. Second positioning post; 27. Third pick-and-place slot;

[0030] 3. Shaping fixture; 31. Second positioning hole; 32. Shaping hole. Detailed Implementation

[0031] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] A multifunctional shaping device for CCGA packaged devices, such as Figure 1 As shown, it includes an upper cover plate 1, a waffle plate 2, and a shaping fixture 3 arranged in sequence.

[0033] like Figure 1 and Figure 3As shown, the waffle tray 2 has multiple placement holes 21 that penetrate the waffle tray 2. A support frame 22 is provided at the edge of the placement holes 21 on the waffle tray 2. The support frame 22 supports the packaged device so that when the end of the packaged device connected to the solder post is supported by the support frame 22, the solder post is suspended within the placement hole 21, and the bottom of the solder post does not contact the plane on which the waffle tray 2 is placed. The support frame 22 is determined according to the size characteristics of the packaged device, i.e., it supports the device but does not touch the solder post. The placement holes 21 are designed to correspond to the shape of the device, serving to fix the device. After the packaged device is placed in the support frame 22, the solder post is located in the placement hole 21, preventing damage from external forces. The waffle tray 2 serves to fix the packaged device, realizing the fixation of the packaged device and its use in equipment mounting. Used together with the top cover plate 1 and the shaping fixture 3, it protects the solder post from external forces during all processes before welding. The waffle plate 2 has a chamfer at the end of the placement hole 21 facing the upper cover plate 1, so that the packaged device is accurately placed into the placement hole 21 by the positioning and guidance of the chamfer position during the process of being placed into the placement hole 21.

[0034] A first pick-and-place slot 23 is provided on the side of the waffle tray 2 facing the upper cover plate 1. The first pick-and-place slot 23 is located at the middle of the edge of the placement hole 21 and extends to the plane of the support frame 22. The first pick-and-place slot 23 facilitates the retrieval of the packaged device. A third placement slot is provided at the included angle of the edge of the placement hole 21 on the waffle tray 2. When picking up the packaged device with tweezers, the third placement slot can be used for more precise placement. A second pick-and-place slot 24 is provided on the edge of the waffle tray 2 facing the shaping fixture 3. The second placement slot extends from the outer wall of the waffle tray 2 to the placement hole 21. The second pick-and-place slot 24 facilitates the removal of the shaping fixture 3 from one side of the waffle tray 2. The waffle tray 2 has four corners connected to first positioning posts 25 at the end facing the upper cover plate 1. The upper cover plate 1 has first positioning holes 11. The first positioning posts 25 cooperate with the first positioning holes 11 to achieve positioning between the waffle tray 2 and the upper cover plate 1. The waffle tray 2 has two positioning posts 26 connected to the end facing the shaping fixture 3. The shaping fixture 3 has second positioning holes 31. The second positioning posts 26 cooperate with the second positioning holes 31 to position between the waffle tray 2 and the shaping fixture 3. This achieves fixation and protection of the packaged device when the waffle tray 2 is flipped.

[0035] The upper cover plate 1 has multiple device fixing slots 12. The device fixing slots 12 are shaped to match the end of the packaged device away from the solder post, and the device fixing slots 12 correspond one-to-one with the placement holes 21. After the packaged device is placed in the placement hole 21, the upper cover plate 1 is placed on the end of the placement hole 21. The end of the packaged device is precisely positioned and fixed by the device fixing slots 12, ensuring the stability of the position of the packaged device.

[0036] The shaping fixture 3 has multiple shaping holes 32, each corresponding to a solder post connected to the packaged device. The design of the shaping holes 32 matches the dimensions of the solder posts. The shaping holes 32 are funnel-shaped to facilitate the smooth shaping of misaligned solder posts and are through-hole designs. The inner diameter of the smaller diameter end of the shaping hole 32 is 0.07 mm larger than the outer diameter of the solder post, allowing for accurate correction of the solder post. The inner diameter of the larger diameter end of the shaping hole 32 is 0.37 mm larger than the outer diameter of the solder post, ensuring easy entry of the solder post end into the shaping hole 32 and enabling accurate correction of the solder post. In this embodiment, the outer diameter of the solder post is 0.51 mm, the inner diameter of the smaller diameter end of the shaping hole is 0.58 mm, and the inner diameter of the larger diameter end of the shaping hole is 0.88 mm.

[0037] The number of shaping holes 32, the number of solder pillars connecting the array and the packaged device are consistent. The shaping holes 32 are funnel-shaped and the thickness is less than the height of the solder pillars to shape the solder pillars of the device.

[0038] The waffle tray 2, the top cover plate 1, and the shaping fixture 3 are all made of anti-static material.

[0039] Among them, the upper cover plate 1, the first positioning hole 11, and the component fixing groove 12 are integrated; the waffle plate 2, the positioning post, the support frame 22, the placement hole 21, the first pick-and-place groove 23, and the second pick-and-place groove 24 are integrated; the shaping fixture 3, the second positioning hole 31, and the shaping hole 32 are integrated; and the waffle plate 2, the upper cover plate 1, and the shaping fixture 3 are connected through the positioning post and the positioning hole.

[0040] Figure 2 The diagram shows the upper cover plate 1 of the multi-functional shaping device for CCGA packaged devices. According to the structural characteristics of the device, after the first positioning hole 11 is connected with the first positioning post 25, the device fixing frame groove and the device body are accurately positioned. The device fixing groove 12 plays a role in fixing and supporting the device during the shaping of the device solder post.

[0041] Figure 3 This is a schematic diagram of a waffle plate for a multi-functional shaping device for CCGA packaged devices. The first positioning post 25 and the second positioning post 26 are bonded to the waffle plate 2 with adhesive, while the remaining parts are integrated with the base, ensuring device quality during the solder post shaping process. The first pick-and-place slot 23 and the second pick-and-place slot 24 facilitate the placement and removal of the packaged device and the waffle plate 2, preventing damage to the device from tools and the base during operation. The first positioning post 25 and the second positioning post 26, respectively located on both sides of the waffle plate 2, are connected to the upper cover plate 1 and the shaping fixture 3. Precise positioning of these three components achieves the shaping of the device solder posts. After the packaged device is placed on the support frame 22, the solder posts are located in the placement hole 21 area, protected by the placement slots.

[0042] like Figure 4As shown, when the device uses the shaping fixture in the CCGA packaged device multifunctional shaping device, the device is fixed by the waffle plate 2 and the upper cover plate 1. After the second positioning hole 31 is aligned with the second positioning post 26, the shaping hole 32 is completely aligned with the solder post connected to the packaged device. Pressing the shaping fixture 3, the solder post slides into the shaping hole 32, achieving the shaping purpose of the solder post.

[0043] like Figure 1 The diagram shows the multi-functional shaping device for CCGA packaged devices. The top cover plate 1, waffle plate 2, and shaping fixture 3 are stacked together to avoid the risk of skewed solder pillars of CCGA packaged devices, and at the same time solve the problems of support, fixation and shaping of CCGA packaged devices.

[0044] A multi-functional shaping method for CCGA packaged devices, using the aforementioned multi-functional shaping device for CCGA packaged devices, includes the following steps:

[0045] S1: With the solder pillar facing down, place the packaged device in the placement hole 21. The packaged device is supported by the support frame 22 in the placement hole 21, and the solder pillar connected to the packaged device is suspended in the placement hole 21.

[0046] S2: Align the first positioning hole 11 with the first positioning post 25 so that the upper cover plate 1 covers the top of the waffle plate 2 until the device fixing groove 12 presses against the end of the packaged device.

[0047] S3: Rotate the top cover plate 1 and waffle plate 2 together by 180 degrees so that the waffle plate 2 is above the top cover plate 1. At this time, manually correct any excessively skewed solder posts connected to the packaged device.

[0048] S4: Align the second positioning hole 31 with the second positioning post 26, and make the large diameter end of the shaping hole 32 face downwards. Move the shaping fixture 3 down, and under the guidance of the shaping hole 32, the welding posts are inserted into the shaping hole 32 one by one, thereby achieving precise correction of all welding posts.

[0049] S5: Move the shaping fixture 3 upwards until it is detached from the waffle plate 2. Then, rotate the waffle plate 2 and the upper cover plate 1 together by 180 degrees so that the upper cover plate 1 is above the waffle plate 2. Move the upper cover plate 1 upwards until it is detached from the waffle plate 2. At this time, the packaged device after the correction of the solder pillar is obtained, and the side of the packaged device away from the solder pillar is facing upwards. At this time, the packaged device can be moved westwards by the suction cup for soldering.

[0050] This invention provides a multi-functional shaping device for CCGA packaged devices that can be used directly. The device design comprises three parts: a top cover plate 1, a waffle tray 2, and a shaping fixture 3. This reduces the number of device transfers and flips, decreasing the probability of solder post misalignment. The shaping device achieves the purpose of solder post shaping and equipment mounting, realizing the best results in shaping and fixing CCGA packaged device solder posts, with a 100% device soldering pass rate. The multi-functional shaping device is well-designed, easy to operate, and effectively protects the device solder posts from damage while simultaneously completing the solder post shaping process.

[0051] The present application has been described in detail above with reference to specific embodiments and exemplary examples; however, these descriptions should not be construed as limiting the present application. Those skilled in the art will understand that various equivalent substitutions, modifications, or improvements can be made to the technical solutions and implementation methods of the present application without departing from the spirit and scope of the present application, and all such modifications and improvements fall within the scope of the present application. The scope of protection of the present application is determined by the appended claims.

[0052] The contents not described in detail in this application specification are common knowledge to those skilled in the art.

Claims

1. A multifunctional shaping device for packaged devices, characterized in that, Includes top cover plate (1), waffle plate (2), and shaping fixture (3); The waffle plate (2) has multiple holes through the placement holes (21) of the waffle plate (2), and a support frame (22) is provided at the edge of the placement holes (21) of the waffle plate (2). The support frame (22) is used to support the packaged device. The waffle plate (2) is connected to a second positioning post (26) at one end facing the shaping fixture (3). The shaping fixture (3) has a second positioning hole (31), and the second positioning post (26) cooperates with the second positioning hole (31). The top cover (1) is placed on one side of the waffle plate (2) to press the end of the packaged device away from the support frame (22); The shaping fixture (3) has multiple shaping holes (32), the positions of which correspond one-to-one with the solder posts connected to the packaged device. The shaping fixture (3) is installed on the side of the waffle plate (2) away from the upper cover plate (1), and the solder posts are inserted into the shaping holes (32) to correct any skewed solder posts. The upper cover plate (1) and the waffle plate (2) are flipped together until the waffle plate (2) is above the upper cover plate (1), and the weld column is manually initially corrected. The second positioning hole (31) is directly opposite the second positioning post (26), and the large diameter end of the shaping hole (32) is facing down. The shaping fixture (3) is moved down, and the welding posts are inserted into the shaping hole (32) one by one. The shaping fixture (3) is moved up until it is separated from the waffle plate (2). Then the waffle plate (2) and the upper cover plate (1) are flipped together until the upper cover plate (1) is above the waffle plate (2). The upper cover plate (1) is moved up until it is separated from the waffle plate (2) to obtain the packaged device after the welding posts are corrected, and the side of the packaged device away from the welding posts is facing upward.

2. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The position of the support frame (22) satisfies the following condition: when the end of the bonding post of the packaged device is supported by the support frame (22), the bonding post is suspended in the placement hole (21).

3. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The upper cover plate (1) has multiple device fixing slots (12), the device fixing slots (12) are matched with the shape of the end of the packaged device away from the solder post, and the device fixing slots (12) correspond one-to-one with the placement holes (21).

4. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The shaping hole (32) is funnel-shaped. The inner diameter of the small diameter end of the shaping hole (32) is 0.04 to 0.08 mm larger than the diameter of the welding column, and the inner diameter of the large diameter end of the shaping hole (32) is 0.29 to 0.39 mm larger than the diameter of the welding column.

5. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The waffle plate (2) has a chamfer at the end of the placement hole (21) facing the upper cover plate (1).

6. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The waffle plate (2) has a first pick-and-place groove (23) at the middle of the edge of the placement hole (21) to pick up the packaged device through the first pick-and-place groove (23); The waffle plate (2) has a third placement groove at the edge of the placement hole (21).

7. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The waffle plate (2) has a second pick-and-place groove (24) on the edge of the side facing the shaping fixture (3). The second pick-and-place groove (24) extends from the outer wall of the waffle plate (2) to the placement hole (21).

8. The multifunctional shaping device for packaged devices according to claim 1, characterized in that, The waffle plate (2) is connected to the four corners of the end facing the upper cover plate (1) with first positioning posts (25), and the upper cover plate (1) has a first positioning hole (11), and the first positioning post (25) cooperates with the first positioning hole (11).

9. A multifunctional shaping method for packaged devices, characterized in that, The process is performed using a multifunctional shaping device for a packaged device as described in any one of claims 1-8, comprising: S1: With the solder pillar facing down, place the packaged device in the placement hole (21), and the packaged device is supported in the placement hole (21) by the support frame (22); S2: Align the first positioning hole (11) with the first positioning post (25) so that the upper cover plate (1) covers the top of the waffle plate (2); S3: Flip the upper cover plate (1) and waffle plate (2) together until the waffle plate (2) is above the upper cover plate (1), and manually perform initial correction on the weld column; S4: Align the second positioning hole (31) with the second positioning post (26), so that the large diameter end of the shaping hole (32) faces down, move the shaping fixture (3) down, and insert the welding posts into the shaping hole (32) one by one; S5: Move the shaping fixture (3) up until it is separated from the waffle plate (2), then flip the waffle plate (2) and the upper cover plate (1) together until the upper cover plate (1) is above the waffle plate (2), move the upper cover plate (1) up until it is separated from the waffle plate (2), and at this time the packaged device after the correction of the solder post is obtained, and the side of the packaged device away from the solder post is facing upward.

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