Display panel and display panel manufacturing method

Abstract

The display panel and the display panel manufacturing method provided by the embodiments of the present application relate to the technical field of display. The first support column is arranged on the driving backboard of the display panel and protrudes outward relative to the surface of the display device, and the first support column is arranged between the edge display device close to the side trace and the side trace. In this way, when the display device is pressure-bonded, the flatness change trend of the pressure-bearing film layer at the position of the edge display device can be reduced, so as to weaken the influence of the non-vertical direction force of the pressure-bearing film layer on the edge display device, and avoid the displacement of the edge display device caused by the non-vertical direction force. In addition, the first support column can also weaken the non-vertical direction force of the pressure-bearing film layer on the side trace, so as to avoid the falling off of the side trace. Therefore, the design of the first support column can reduce the adverse effects caused by the displacement of the edge display and the falling off of the side trace, and improve the manufacturing yield of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel and a method for manufacturing the display panel. Background Technology

[0002] Micro-LED display technology, with its high color gamut, high brightness, high contrast, and long lifespan, is hailed by the industry as the next-generation display technology. To meet market demand, Micro-LED display technology is widely used in large-size display panels. Taking the solution of achieving full-color display through mass transfer of RGB three-color display devices as an example, this solution is greatly limited by the maturity of the transfer technology and transfer production capacity. Therefore, for large-size display panels, the current mainstream approach is to use a splicing method, combining small panels with medium ones, and medium ones with large ones, to achieve the production of large-size display panels. This reduces the demand for large-area display devices and the difficulty of subsequent repairs. When using a splicing method, the challenges of achieving narrow bezels and side wiring must be addressed. However, the production of display panels for splicing suffers from low panel yield rates. Summary of the Invention

[0003] In order to overcome the technical problems mentioned in the above technical background, this application provides a substrate and a display panel.

[0004] A first aspect of this application provides a display panel having a display area and a non-display area at least partially surrounding the display area, the display panel including a driving backplate, display devices, and side traces;

[0005] The drive backplate has a first surface and a second surface opposite to each other;

[0006] The display device is bonded to a first surface corresponding to the display area, and the side traces are connected to the electrode traces of the display device and connected to the bonding leads located on the second surface via the side between the first surface and the second surface.

[0007] The drive backplate includes a first support post that protrudes outward relative to a first surface corresponding to the display area. The first support post is located between the edge display device near the non-display area and the side trace.

[0008] In one possible embodiment of this application, in the direction perpendicular to the light-emitting surface of the display panel, the height difference between the side of the first support column away from the first surface corresponding to the display area and the side of the display device away from the first surface corresponding to the display area is less than a preset value.

[0009] Preferably, the height difference between the side of the first support column away from the first surface corresponding to the display area and the side of the display device away from the first surface corresponding to the display area is zero.

[0010] In one possible embodiment of this application, the second surface of the drive backplate is provided with an outwardly protruding second support column.

[0011] In one possible embodiment of this application, the driving backplane includes a substrate and a buffer layer, an insulating layer, a metal trace layer and a protective layer sequentially stacked on opposite sides of the substrate.

[0012] The first support column and the second support column are formed by at least one of the buffer layer, the insulating layer, the metal trace layer and the protective layer;

[0013] Preferably, the first support column and the second support column are symmetrically distributed relative to the substrate.

[0014] In one possible embodiment of this application, a first connection reinforcement structure is provided on the electrode trace, and the side trace is connected to the electrode trace through the first connection reinforcement structure.

[0015] In one possible embodiment of this application, a second connection reinforcement structure is provided on the bonding lead, and the side trace is connected to the bonding lead through the second connection reinforcement structure;

[0016] Preferably, the first connection reinforcement structure and the second connection reinforcement structure include grooves and / or protrusions.

[0017] In one possible embodiment of this application, the first support column is located between the edge display device and the first connection reinforcement structure, and the distance between the first support column and the edge display device is less than the distance between the first support column and the first connection reinforcement structure.

[0018] In one possible embodiment of this application, the first support column and the second support column are distributed in the region of the drive back plate near the side;

[0019] The first support column and the second support column each include one support column, or the first support column and the second support column each include multiple discretely arranged support columns;

[0020] The cross-sections of the first support column and the second support column are one of trapezoidal, rectangular or arc-shaped.

[0021] A second aspect of this application provides a method for manufacturing a display panel, the display panel having a display area and a non-display area at least partially surrounding the display area, the method comprising:

[0022] A driving backplate is fabricated, wherein the driving backplate has a first surface and a second surface opposite to each other, a display device is bonded to the first surface of the display area, a side trace is connected to the electrode trace of the display device and then connected to the bonding lead located on the second surface via the side between the first surface and the second surface, and a first support post protruding outward relative to the first surface of the display area is fabricated on the driving backplate, the first support post being located between the edge display device and the side trace;

[0023] The display device is bonded to the first surface of the drive backplate.

[0024] In one possible embodiment of this application, the second surface of the drive backplate is provided with an outwardly protruding second support post, and the step of manufacturing a drive backplate includes:

[0025] Provide a substrate;

[0026] A first buffer layer, a first metal trace layer, a first insulating layer, a second metal trace layer, and a first protective layer are sequentially formed on the first surface of the substrate, and the first support pillar is formed based on at least one of the first buffer layer, the first insulating layer, the second metal trace layer, and the first protective layer, wherein the second metal trace layer is used to fabricate electrode traces.

[0027] A second buffer layer, a second insulating layer, a third metal trace layer, and a second protective layer are sequentially formed on the second surface of the substrate, and a second support pillar is formed based on at least one of the second buffer layer, the second insulating layer, the third metal trace layer, and the second protective layer, wherein the third metal trace layer is used to fabricate bonding leads;

[0028] Create a side trace connecting the electrode trace and the bonding lead.

[0029] The display panel and display panel manufacturing method provided in this application embodiment include a first support post protruding outward from the first surface of the bonding display device on the driving back plate of the display panel, and the first support post is positioned between the edge display device and the side traces near the non-display area. This design reduces the flatness variation trend of the pressure-bearing film layer at the edge display device position during the bonding process, thereby weakening the influence of the non-perpendicular force exerted by the pressure-bearing film layer on the edge display device and preventing displacement of the edge display device due to non-perpendicular forces. Furthermore, the first support post also weakens the non-perpendicular force exerted by the pressure-bearing film layer on the side traces, preventing the side traces from detaching. Therefore, the design of the aforementioned first support post can reduce defects caused by edge display device displacement and side trace detachment, improving the manufacturing yield of the display panel. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 A schematic diagram illustrating the bonding of the display device to the driver backplane is shown.

[0032] Figure 2 This embodiment illustrates the distribution of the display devices on the display panel.

[0033] Figure 3 Example Figure 2 A schematic diagram of a possible cross-section of the display panel in the MM' direction;

[0034] Figure 4 An example is shown in the stress comparison diagram between the side wiring and the stress point B of the pressure-bearing membrane layer in the existing scheme and this scheme;

[0035] Figure 5 Example Figure 2 A schematic diagram of another possible cross-section of the display panel in the MM' direction;

[0036] Figure 6 A flowchart illustrating the display panel manufacturing method provided in this embodiment is shown.

[0037] Figure 7 and Figure 8 The process diagram corresponding to the display panel manufacturing method provided in this embodiment is illustrated.

[0038] Icons: 10-Display panel; 10A-Display area; 10B-Non-display area; 100-Drive backplane; 100A-First surface; 100B-Second surface; 101-Substrate; 1021-First buffer layer; 1022-Second buffer layer; 1031-First insulating layer; 1032-Second insulating layer; 1041-First metal trace layer; 1042-Second metal trace layer; 1043-Third metal trace layer; 1051-First protective layer; 1052-Second protective layer; 110-First support pillar; 120-Second support pillar; 200-Display device; 200'-Edge display device; 300-Side trace; 410-Electrode trace; 4101-First connection reinforcement structure; 420-Bond lead; 4201-Second connection reinforcement structure; 20-Pressure-bearing film layer. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0040] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0041] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0042] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0043] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0044] In response to the technical problems mentioned in the background art, the inventors discovered through analysis of the defective display panel structure that the displacement of edge display devices near the side traces and the detachment of side traces are important reasons for the defective display panels.

[0045] Further analysis by the inventors revealed that the electrical connection between the display device and the driving backplane can include methods such as metal bonding and ACF bonding. Regardless of the connection method used, this bonding method is required. Please refer to... Figure 1 , Figure 1A schematic diagram illustrating the pressure bonding between the edge display device 200' and the driving backplate 100 is provided. The pressure-bearing membrane layer 20 converts air pressure into pressure and applies it to the edge display device 200' to achieve electrical connection between the edge display device 200' and the driving backplate 100. However, due to the exposed narrow bezel (the portion between the edge display device 200' and the side traces 300) and the exposed side traces 300, the pressure-bearing membrane layer 20 comes into contact with both. Because of the height difference between the edge display device 200' and the narrow bezel, the pressure-bearing membrane layer 20 exhibits significant flatness variations on the side of the edge display device 200' closest to the narrow bezel. As shown in the diagram, the edge display device 200' may be displaced by a non-perpendicular force F1 acting at point A along the extension direction of the pressure-bearing membrane layer 20 (primarily caused by the horizontal component of force F1 along the X direction). At the same time, the side trace 300 may also be pulled off by the non-perpendicular force F2 at point B along the extension direction of the pressure-bearing film layer 20 (mainly the horizontal component of force F2 along the X direction pulls the side trace 300), which will lead to the displacement of the edge display device and the detachment of the side trace.

[0046] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0047] Please refer to Figure 2 and Figure 3 , Figure 2 This embodiment illustrates the distribution of the display devices on the display panel. Figure 3 Example Figure 2A schematic cross-sectional view of a display panel in the MM' direction. The display panel 10 has a display area 10A and a non-display area 10B that at least partially surrounds the display area 10A. A large number of display devices 200 can be arrayed in the display area 10A. The display devices 200 may include edge display devices 200' near the non-display area 10B. The display panel 10 may also include a driving backplate 100 and side traces 300. The driving backplate 100 has opposing first surfaces 100A and second surfaces 100B. The display devices 200 are bonded to the first surface 100A. The side traces 300 are connected to the electrode traces 410 of the display devices 200 and are connected to the bonding leads 420 located on the second surface 100B via the side between the first surface 100A and the second surface 100B. In this embodiment, the driving backplate 100 may include a first support post 110 that protrudes outward relative to the surface of the bonded display device 200 (the first surface 100A corresponding to the display area 10A), and the first support post 110 is located between the edge display device 200' and the side trace 300.

[0048] In the above structure, when the display device 200 is pressed and bonded, the flatness variation trend of the pressure-bearing film layer 20 at the edge display device 200' position can be reduced, thereby weakening the influence of the non-perpendicular force exerted by the pressure-bearing film layer 20 on the edge display device 200' and preventing displacement of the edge display device 200' due to the non-perpendicular force. Additionally, please refer to... Figure 4 , Figure 4 A comparison diagram of the forces acting on the side trace 300 and the pressure-bearing film layer 20 in the existing and present solutions is shown. Force F2 represents the force in the existing solution, and force F2' represents the force in this solution. Decomposing forces F2 and F2' along the vertical (Y direction in the diagram) and horizontal (X direction in the diagram) directions reveals that, due to the presence of the first support column 110, the angle between force F2' and the horizontal direction is greater than the angle between force F2 and the horizontal direction. When forces F2 and F2' are equal, the horizontal component of force F2' is less than the horizontal component of force F2. This means that the first support column 110 can also weaken the horizontal force exerted by the pressure-bearing film layer 20 on the side trace 300, thus preventing the side trace 300 from detaching. Therefore, designing the aforementioned first support column 110 can reduce defects caused by the displacement of the edge display device 200' and the detachment of the side trace 300, thereby improving the manufacturing yield of the display panel 10.

[0049] Furthermore, in this embodiment, in the direction perpendicular to the light-emitting surface of the display panel 10, the height of the side of the first support post 110 away from the first surface 100A corresponding to the display area 10A and the height of the side of the display device 200 away from the first surface 100A corresponding to the display area 10A are approximately equal. This "approximately equal height" can mean that the height difference between the side of the first support post 110 away from the first surface 100A corresponding to the display area 10A and the side of the display device 200 away from the first surface 100A corresponding to the display area 10A is less than a preset value (e.g., 0.1µm). The side of the display device 200 away from the first surface 100A corresponding to the display area 10A can be either the side of a non-edge display device 200 away from the first surface 100A corresponding to the display area 10A, or the side of an edge display device 200' away from the first surface 100A corresponding to the display area 10A. The side of the first support post 110 furthest from the display area 10A corresponding to the first surface 100A can be higher or lower than the side of the display device 200 furthest from the display area 10A corresponding to the first surface 100A. Preferably, the side of the first support post 110 furthest from the display area 10A corresponding to the first surface 100A can be at the same height as the side of the display device 200 furthest from the display area 10A, that is, the height difference between the side of the first support post 110 furthest from the display area 10A and the side of the display device 200 furthest from the display area 10A is zero. This design ensures that the pressure-bearing film layer 20 at the edge display device 200' has good flatness, and the force exerted on the edge display device 200' by the pressure-bearing film layer 20 is basically a vertical force, ensuring that the edge display device 200' will not shift during the pressure bonding process.

[0050] When bonding the display device 200 to the first surface 100A of the drive backplane 100, the second surface 100B of the drive backplane 100 needs to be placed on the support stage to prevent the traces on the second surface 100B from being crushed or damaged during bonding. Please refer to... Figure 5 , Figure 5 Another cross-sectional schematic diagram of the display panel in the MM' direction is illustrated. In this embodiment, a protruding second support post 120 may be provided on the second surface 100B of the drive back plate 100.

[0051] Please refer to this again. Figure 5 The driving backplane 100 may include a substrate 101 and a buffer layer, an insulating layer, a metal trace layer and a protective layer sequentially stacked on opposite sides of the substrate 101.

[0052] The substrate 101 may be a glass substrate. The buffer layer may include a first buffer layer 1021 and a second buffer layer 1022 located on opposite sides of the substrate 101. The insulating layer includes a first insulating layer 1031 located on the side of the first buffer layer 1021 away from the substrate 101, and a second insulating layer 1032 located on the side of the second buffer layer 1022 away from the substrate 101. The metal trace layer may include a first metal trace layer 1041, a second metal trace layer 1042, and a third metal trace layer 1043, wherein the first metal trace layer 1041 is located on the side of the first buffer layer 1021 away from the substrate 101, and the first insulating layer 1031 exposes at least a portion of the first metal trace layer 1041; the first metal trace layer 1041 may be used as an anode. The second metal trace layer 1042 is located on the side of the first insulating layer 1031 away from the substrate 101. The second metal trace layer 1042 includes conductive traces for connecting the anode of the display device 200 and the first metal trace layer 1041, and electrode traces 410 for connecting the cathode of the display device 200. The third metal trace layer 1043 is located on the side of the second buffer layer 1022 away from the substrate 101. The third metal trace layer 1043 is used to form bonding leads 420. The protective layer includes a first protective layer 1051 for covering the exposed second metal trace layer 1042 and a second protective layer 1052 for protecting the third metal trace layer 1043. The side traces 300 are connected to the electrode traces 410 and the bonding leads 420 that connect to the cathode of the display device 200.

[0053] In this embodiment, the first support post 110 and the second support post 120 can be formed by at least one of a buffer layer, an insulating layer, a metal trace layer, and a protective layer, for example, such as Figure 5 As shown, the first support post 110 can be formed by the first buffer layer 1021, the first insulating layer 1031, the second metal trace layer 1042, and the first protective layer 1051; alternatively, the first support post 110 can also be formed by the second metal trace layer 1042 and the first protective layer 1051; furthermore, the first support post 110 can also be formed by the first protective layer 1051. Similarly, the second support post 120 can also be formed by at least one of the second buffer layer 1022, the second insulating layer 1032, the third metal trace layer 1043, and the second protective layer 1052.

[0054] In order to avoid screen breakage due to excessive pressure on the first support post 110 during the bonding process, in this embodiment, the first support post 110 and the second support post 120 are symmetrically arranged with respect to the substrate 101. This can strengthen the structural strength of the screen at the location of the first support post 110 and reduce the risk of screen breakage.

[0055] Furthermore, in this embodiment, a first connection reinforcement structure 4101 may be provided on the electrode trace 410, and the side trace 300 may be connected to the electrode trace 410 through the first connection reinforcement structure 4101 to increase the connection strength between the side trace 300 and the electrode trace 410 in the horizontal direction (X direction in the figure), and to prevent the side trace 300 and the electrode trace 410 from falling off under the action of the horizontal component force of the pressure-bearing film layer 20.

[0056] In this embodiment, a second connection reinforcement structure 4201 is provided on the bonding lead 420, and the side trace 300 can be connected to the bonding lead 420 through the second connection reinforcement structure 4201. Providing the second connection reinforcement structure 4201 can enhance the connection strength between the side trace 300 and the drive backplate 100, preventing the side trace 300 from separating from the drive backplate 100. Exemplarily, the side trace 300 can be connected to the electrode trace 410 and the bonding lead 420 respectively through a concave-convex fit structure, wherein the first connection reinforcement structure 4101 and the second connection reinforcement structure 4201 may include grooves and / or protrusions, for example, as shown in the image. Figure 5 As shown, both the first connecting reinforcement structure 4101 and the second connecting reinforcement structure 4201 include grooves and protrusions. It is understood that in this embodiment, the first connecting reinforcement structure 4101 and the second connecting reinforcement structure 4201 may be the same or different.

[0057] To mitigate the impact of pressure from the pressure-bearing membrane layer 20 along its direction on the edge display device 200', the first support column 110 can be positioned as close as possible to the edge display device 200'. In this embodiment, the first support column 110 can be located between the edge display device 200' and the first connecting reinforcement structure 4101, wherein the distance between the first support column 110 and the edge display device 200' can be less than the distance between the first support column 110 and the first connecting reinforcement structure 4101.

[0058] Further, in this embodiment, the first support column 110 and the second support column 120 are distributed in the region of the drive back plate 100 near the side. The first support column 110 and the second support column 120 may each include one support column, or the first support column 110 and the second support column 120 may each include multiple discretely arranged support columns. The cross-section of the first support column 110 and the second support column 120 may be trapezoidal, rectangular, or arc-shaped, such as... Figure 5 As shown, preferably, the cross-sections of the first support column 110 and the second support column 120 are trapezoidal.

[0059] This embodiment also provides a method for manufacturing a display panel; please refer to [link / reference]. Figure 6 , Figure 7 and Figure 8 , Figure 6A flowchart illustrating the display panel manufacturing process is provided. Figure 7 and Figure 8 Example Figure 6 The corresponding manufacturing process diagram. (See below for details.) Figure 6 , Figure 7 and Figure 8 The method for manufacturing the display panel provided in this embodiment will be described in detail.

[0060] Step S11: Fabricate a drive backplane 100.

[0061] Please refer to this again. Figure 3 In this embodiment, the driving backplate 100 has a first surface 100A and a second surface 100B opposite to each other. The display device is bonded to the first surface 100A of the display area. The side trace 300 is connected to the electrode trace 410 of the display device and then connected to the bonding lead 420 located on the second surface 100B via the side between the first surface 100A and the second surface 100B. A first support post 110 is made on the driving backplate 100 that protrudes outward relative to the first surface of the display area. The first support post 110 is located between the edge display device 200' near the non-display area and the side trace 300.

[0062] In this embodiment, step S11 can be implemented in the following way.

[0063] First, a substrate 101 is provided.

[0064] Next, a first buffer layer 1021, a first metal trace layer 1041, a first insulating layer 1031, a second metal trace layer 1042, and a first protective layer 1051 are sequentially formed on the first surface of the substrate 101, and a first support pillar 110 is formed based on at least one of the first buffer layer 1021, the first insulating layer 1031, the second metal trace layer 1042, and the first protective layer 1051. The second metal trace layer 1042 is used to fabricate electrode traces 410, which can be used to connect to the cathode of the display device 200.

[0065] For example, taking the formation of a first support pillar 110 by a first buffer layer 1021, a first insulating layer 1031, a second metal wiring layer 1042, and a first protective layer 1051 as an example, when fabricating the first buffer layer 1021, a protrusion can be formed in the area corresponding to the first support pillar 110. For example, a halftone mask can be used to reduce the film thickness in the area of ​​the first buffer layer 1021 that does not correspond to the first support pillar 110 through photolithography. The first support pillar 110 is formed by sequentially stacking the first insulating layer 1031, the second metal wiring layer 1042, and the first protective layer 1051 on the protrusion.

[0066] Then, a second buffer layer 1022, a second insulating layer 1032, a third metal trace layer 1043 and a second protective layer 1052 are sequentially formed on the second surface 100B of the substrate 101, and a second support pillar 120 is formed based on at least one of the second buffer layer 1022, the second insulating layer 1032, the third metal trace layer 1043 and the second protective layer 1052, wherein the third metal trace layer 1043 is used to fabricate the bonding lead 420.

[0067] In this embodiment, the second support column 120 is formed in a similar manner to the first support column 110, and will not be described again here.

[0068] Finally, fabricate the side trace 300 that connects the electrode trace 410 and the bonding lead 420.

[0069] Step S12: Bond the display device 200 on the first surface 100A of the drive backplate 100.

[0070] In this step, a pressure-bearing film layer can be covered on the display device 200, and the pressure converted from the air pressure applied to the pressure-bearing film layer can be used to bond the display device 200 to the first surface 100A of the drive backplate 100.

[0071] The display panel and its manufacturing method provided in this embodiment include a first support post protruding outward from the surface of the bonding display device on the driving back plate of the display panel. This first support post is positioned between the edge display device and the side traces, near the side traces. This design reduces the flatness variation of the pressure-bearing film layer at the edge display device location during the bonding process, thereby weakening the influence of the non-perpendicular force exerted by the pressure-bearing film layer on the edge display device and preventing displacement of the edge display device due to such forces. Furthermore, the first support post also weakens the non-perpendicular force exerted by the pressure-bearing film layer on the side traces, preventing them from detaching. Therefore, the design of the aforementioned first support post can reduce defects caused by edge display device displacement and side trace detachment, improving the manufacturing yield of the display panel.

[0072] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and at least a non-display area surrounding the display area, and the display panel includes a driving backplate, display devices, and side traces; The drive backplate has a first surface and a second surface opposite to each other; The display device is bonded to a first surface corresponding to the display area, and the side traces are connected to the electrode traces of the display device and connected to the bonding leads located on the second surface via the side between the first surface and the second surface. The driving backplate includes a first support post that protrudes outward relative to the first surface corresponding to the display area. The first support post is located between the edge display device near the non-display area and the side trace. In the direction perpendicular to the light-emitting surface of the display panel, the height difference between the side of the first support column away from the first surface corresponding to the display area and the side of the display device away from the first surface corresponding to the display area is less than 0.1 μm.

2. The display panel as described in claim 1, characterized in that, The height difference between the side of the first support column away from the first surface corresponding to the display area and the side of the display device away from the first surface corresponding to the display area is zero.

3. The display panel as described in claim 2, characterized in that, The second surface of the drive back plate is provided with an outwardly protruding second support column.

4. The display panel as described in claim 3, characterized in that, The drive backplane includes a substrate, and a buffer layer, an insulating layer, a metal trace layer and a protective layer that are sequentially stacked on opposite sides of the substrate. The first support post and the second support post are formed by at least one of the buffer layer, the insulating layer, the metal trace layer and the protective layer.

5. The display panel as described in claim 4, characterized in that, The first support column and the second support column are symmetrically distributed relative to the substrate.

6. The display panel as described in any one of claims 3-5, characterized in that, The electrode trace is provided with a first connection reinforcement structure, and the side trace is connected to the electrode trace through the first connection reinforcement structure.

7. The display panel as described in claim 6, characterized in that, The bonding lead is provided with a second connection reinforcement structure, and the side trace is connected to the bonding lead through the second connection reinforcement structure.

8. The display panel as described in claim 7, characterized in that, The first and second connection reinforcement structures include grooves and / or protrusions.

9. The display panel as described in claim 7, characterized in that, The first support column is located between the edge display device and the first connection reinforcement structure, and the distance between the first support column and the edge display device is less than the distance between the first support column and the first connection reinforcement structure.

10. The display panel as claimed in claim 9, characterized in that, The first support column and the second support column are distributed in the area of ​​the drive back plate near the side; The first support column and the second support column each include one support column, or the first support column and the second support column each include multiple discretely arranged support columns; The cross-sections of the first support column and the second support column are one of trapezoidal, rectangular or arc-shaped.

11. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area at least partially surrounding the display area, the method comprising: A driving backplate is fabricated, wherein the driving backplate has a first surface and a second surface opposite to each other. A display device is bonded to the first surface of the display area. Side traces are connected to the electrode traces of the display device and then connected to the bonding leads located on the second surface via the side surface between the first surface and the second surface. A first support post protruding outward relative to the first surface of the display area is fabricated on the driving backplate. The first support post is located between the edge display device near the non-display area and the side traces. In the direction perpendicular to the light-emitting surface of the display panel, the height difference between the side of the first support post away from the first surface of the display area and the side of the display device away from the first surface of the display area is less than 0.1 μm. The display device is bonded to the first surface of the drive backplate.

12. The method for manufacturing a display panel as described in claim 11, characterized in that, The second surface of the drive backplate is provided with an outwardly protruding second support post, and the step of manufacturing a drive backplate includes: Provide a substrate; A first buffer layer, a first metal trace layer, a first insulating layer, a second metal trace layer, and a first protective layer are sequentially formed on the first surface of the substrate, and the first support pillar is formed based on at least one of the first buffer layer, the first insulating layer, the second metal trace layer, and the first protective layer, wherein the second metal trace layer is used to fabricate electrode traces. A second buffer layer, a second insulating layer, a third metal trace layer, and a second protective layer are sequentially formed on the second surface of the substrate, and a second support pillar is formed based on at least one of the second buffer layer, the second insulating layer, the third metal trace layer, and the second protective layer, wherein the third metal trace layer is used to fabricate bonding leads; Create a side trace connecting the electrode trace and the bonding lead.

Images