A perovskite solar cell module, its fabrication method, and electrical equipment thereof.

Abstract

This invention discloses a perovskite solar cell module, its fabrication method, and an electrical device thereof. The perovskite solar cell module includes a substrate, a conductive layer, a first charge carrier layer, a perovskite layer, a second charge carrier layer, a back electrode layer, a thermoplastic film, and an encapsulation cover, stacked sequentially. The layer structure from the conductive layer to the back electrode layer is divided into multiple sub-cells, and the back electrode side has multiple grooves formed by P2 and P3 laser scribing. The thermoplastic film has multiple first protrusions that completely fill the grooves formed by the P2 and P3 laser scribing. By completely filling the gaps in the P2 and P3 laser scribing grooves with multiple first protrusions, the perovskite solar cell module is free of gas gaps or bubbles, thus avoiding the formation of water-oxygen channels, enhancing the encapsulation effect of the perovskite solar cell module, slowing down the degradation of the perovskite material and the decline in battery efficiency, and extending its service life.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic functional materials and devices, and more specifically, to a perovskite battery module, its preparation method, and its electrical equipment. Background Technology

[0002] Perovskite solar cells are an emerging solar cell technology that has attracted much attention due to their high conversion efficiency and low-cost fabrication. A typical perovskite solar cell includes a perovskite light-absorbing layer, an electron transport layer, a hole transport layer, and a transparent conductive layer. The perovskite light-absorbing layer is usually composed of an organic-inorganic mixture. The conversion efficiency of perovskite solar cells has improved rapidly. Since its invention in 2009, the conversion efficiency of perovskite solar cells has increased from only 3.8% to 26.1%, comparable to that of silicon-based cells, demonstrating broad development prospects. Furthermore, perovskite crystals can be attached to glass, possessing the potential for large-scale production and showing promise as a mainstream technology in the future, alongside TOPcon and HJT.

[0003] Currently, perovskite solar cell modules for industrial applications often use laser scribing to connect sub-cells in series. The laser scribing process typically involves three steps (named P1, P2, and P3). P1 involves patterning the transparent conductive glass to divide it into multiple sub-cells. P2 involves patterning the prepared first carrier transport layer / perovskite layer / second carrier transport layer structure together, exposing a small portion of the bottom transparent electrode. P3 involves patterning the electrodes after their preparation. Ultimately, this forms a perovskite solar cell module consisting of multiple separate sub-cells connected in series.

[0004] In existing technologies, perovskite solar modules are commonly encapsulated with thermoplastic films to bond them to a cover plate when forming battery modules. The specific steps involve placing the perovskite solar module in a heated laminator for vacuum degassing, melting the film, and then applying pressure to bond the cover plate to the perovskite solar module using the encapsulation film. However, due to the unevenness of the film caused by laser scribing, simple vacuum degassing, melting, and pressurization still results in some gaps not being filled. This method of encapsulation also leaves some gas voids in the battery module, forming water and oxygen channels, affecting the module's performance and lifespan. Therefore, there is an urgent need to develop a novel encapsulation structure for titanium dioxide solar cells to meet the requirements for long lifespan applications.

[0005] In view of this, the present invention is proposed. Summary of the Invention

[0006] The purpose of this invention is to provide a perovskite battery module, its preparation method, and an electrical device thereof, in order to improve the above-mentioned technical problems.

[0007] This invention is implemented as follows:

[0008] In a first aspect, the present invention provides a perovskite battery module, which includes a substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, a back electrode layer, a thermoplastic film, and an encapsulation cover plate stacked sequentially.

[0009] The layer structure consisting of the conductive layer, the first charge carrier layer, the perovskite layer, the second charge carrier layer, and the back electrode layer is divided into multiple sub-cells, and the back electrode side has multiple trenches formed by P2 laser scribing and P3 laser scribing.

[0010] The thermoplastic film has a plurality of first protrusions extending toward the substrate, the plurality of first protrusions completely filling the plurality of grooves formed by the P2 laser scribing and the P3 laser scribing.

[0011] Secondly, the present invention also provides a method for preparing the above-mentioned perovskite battery module, which includes: stacking the thermoplastic film and the encapsulation cover plate on one side of the back electrode layer of the perovskite battery module, which is composed of the substrate, the conductive layer, the first charge carrier layer, the perovskite layer, the second charge carrier layer and the back electrode layer; and bonding the perovskite battery module and the encapsulation cover plate together by means of the thermoplastic film using a lamination process.

[0012] The thermoplastic film has a raised structure on the side that contacts the back electrode layer for forming a plurality of first protrusions; and / or, the encapsulation cover has a plurality of second protrusions on the side that contacts the thermoplastic film, and the positions of the plurality of second protrusions correspond one-to-one with the plurality of grooves formed by P2 laser scribing and P3 laser scribing, so that during the lamination process, the plurality of second protrusions can compress the thermoplastic film to form a plurality of first protrusions.

[0013] Thirdly, the present invention also provides an electrical device comprising the above-mentioned perovskite battery module.

[0014] The present invention has the following beneficial effects: By completely filling the gaps in the laser-scribed grooves P2 and P3 through multiple first protrusions in the thermoplastic film, gas gaps or bubbles are eliminated inside the perovskite solar cell module, thus preventing the formation of water-oxygen channels, enhancing the encapsulation effect of the perovskite solar cell module, slowing down the degradation of the perovskite material and the decline in battery efficiency, and extending its service life. Furthermore, in the specific preparation process, protruding structures are provided on the thermoplastic film and / or the encapsulation cover plate. Through a lamination process, the thermoplastic film, after melting, can completely fill the gaps in the laser-scribed grooves P2 and P3 and expel air bubbles, thereby compensating for the discontinuity formed by the laser-scribed grooves P2 and P3. Simultaneously, due to the large contact surface between the encapsulation cover plate and the thermoplastic film, no air bubbles exist between them, thus achieving a better encapsulation effect. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A schematic diagram of the structure of a perovskite solar cell module provided for an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the process flow for preparing the perovskite battery module in an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram of the process flow for packaging perovskite battery modules to prepare perovskite battery components in Embodiment 1 of the present invention.

[0019] Figure 4 This is a schematic diagram of the process flow for packaging perovskite battery modules to prepare perovskite battery components in Embodiment 4 of the present invention.

[0020] Figure 5 This is a schematic diagram of the process flow for packaging perovskite battery modules to prepare perovskite battery components in Embodiment 5 of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0022] Some embodiments of the present invention provide a perovskite solar cell assembly, comprising a substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, a back electrode layer, a thermoplastic film, and an encapsulation cover plate stacked sequentially. The layer structure composed of the conductive layer, the first carrier layer, the perovskite layer, the second carrier layer, and the back electrode layer is divided into multiple sub-cells, and the back electrode side has multiple trenches formed by P2 laser scribing and P3 laser scribing. The thermoplastic film has multiple first protrusions extending toward the substrate, and the multiple first protrusions completely fill the multiple trenches formed by P2 laser scribing and P3 laser scribing.

[0023] The perovskite solar cell module described above consists of a layered structure comprising a substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, and a back electrode layer. This module is fabricated using traditional P1, P2, and P3 laser scribing processes. In this embodiment, multiple sub-cells are connected in series, and the P2 and P3 laser scribing processes create multiple trenches. This can easily lead to gas gaps or bubbles during encapsulation, forming water-oxygen channels and affecting the stability of the perovskite material. Based on this structure, the inventors have conducted research and practice, designing the thermoplastic film and encapsulation cover plate used for encapsulating the perovskite solar cell module. The thermoplastic film forms multiple first protrusions that completely fill the trenches created by the P2 and P3 laser scribing processes. This prevents gas gaps or bubbles from forming inside the perovskite solar cell module, thus avoiding the formation of water-oxygen channels, enhancing the encapsulation effect, slowing down the degradation of the perovskite material and the decline in battery efficiency, and extending its service life.

[0024] Specifically, for reference, see Figure 1 In some embodiments, the side of the encapsulation cover that contacts the thermoplastic film is further provided with a plurality of second protrusions. The number of the plurality of second protrusions is adapted to the number of grooves formed by laser scribing P2 and P3, and the plurality of second protrusions extend from one end of the groove to the other end. The positions of the plurality of second protrusions correspond one-to-one with the plurality of grooves formed by laser scribing P2 and P3, and the width of the plurality of second protrusions is also adapted to the width of the corresponding grooves, so that when the thermoplastic film is squeezed by the encapsulation cover, the plurality of second protrusions can squeeze the thermoplastic film, thereby enabling the molten thermoplastic film to completely fill the corresponding grooves under the action of the second protrusions.

[0025] Specifically, in some embodiments, the width of the multiple trenches formed by P2 laser scribing and P3 laser scribing is 30µm to 100µm. To facilitate the extrusion of the thermoplastic film, the width of the second protrusion is 32µm to 98µm, and the height is 100µm to 2µm. That is, the width of the second protrusion is adapted to the width of the formed trenches, typically slightly smaller than the width of the trenches, and its depth is selected and set according to the depth of the trenches (i.e., the thickness of the multilayer structure composed of the first carrier layer, perovskite layer, second carrier layer, and back electrode layer) and the extrusion effect.

[0026] Furthermore, some embodiments of the present invention also provide a method for preparing a perovskite solar cell module with the above-described structure, comprising:

[0027] S1. A thermoplastic film and an encapsulation cover are stacked on one side of the back electrode layer of a perovskite battery module, which consists of a substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, and a back electrode layer.

[0028] Specifically, the fabrication method of the perovskite battery module consisting of a substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, and a back electrode layer in step S1 is detailed in [link to documentation]. Figure 2 This includes the following steps:

[0029] i. Clean the conductive substrate (e.g., a transparent substrate).

[0030] Specifically, the conductive substrate has a surface covered with a single layer of conductive material. In some embodiments, the substrate is selected from any one of glass, silicon wafer, carbon fiber, marble, PI, and PET. The conductive layer is made of at least one of transparent conductive materials, metallic conductive materials, and highly conductive materials. Specifically, transparent conductive materials include at least one of indium tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, and indium zinc oxide; metallic conductive materials include at least one of Au, Ag, Cu, Ni, Ti, and Cr; and highly conductive materials include at least one of graphene, silver nanowires, and carbon nanotubes.

[0031] Therefore, for example, the substrate can be made of common transparent materials such as glass and flexible plastics. Conductive substrates commonly use ITO conductive glass, FTO conductive glass, AZO conductive glass, silver nanowire-modified conductive glass, graphene-modified conductive glass, and carbon nanotube-modified conductive glass, etc.

[0032] In some embodiments, the cleaning method is a conventional method for cleaning conductive substrates in the art, such as ultrasonic cleaning with deionized water, acetone, optical glass cleaner, isopropanol, and ultraviolet ozone treatment to enhance the wettability of the substrate surface.

[0033] ii. Perform P1 laser scribing on the conductive substrate to form multiple small conductive sub-electrodes.

[0034] Specifically, laser scribing P1 will be performed using a femtosecond laser scribing device. Different laser power parameters and scribing conditions will be selected for different types of conductive substrates. The scribing width will be 30 to 100 μm, such as 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm.

[0035] iii. Prepare the first carrier layer, such as the hole transport layer.

[0036] Specifically, the hole transport layer material (first carrier layer) includes, but is not limited to, one or more combinations of organic or inorganic P-type semiconductor materials such as Spiro-OMeTAD, PEDOT:PSS, TPD, PTAA, P3HT, PCPDTBT, NixO, V2O5, CuI, MoO3, CuO, and Cu2O. The first carrier layer can be prepared using uniform film deposition methods such as solution coating or vapor deposition, typically with a film thickness not exceeding 100 nm.

[0037] iV. Preparation of perovskite layers.

[0038] Specifically, the perovskite layer is made of a material with the chemical formula ABX3, where A is CH3NH3. + (MA + ), NH2=CHNH2 + (FA + C4H9NH3 + Cs + and Rb + At least one of; B is Pb 2+ Sn 2+ 、Ge 2+ Sb 3+ Bi 3+ Ag + Au 3+ and Ti 4+ At least one of them; X is Cl - ,Br - I - Or at least one of the halogens. The perovskite layer can be deposited using any solution or vapor deposition method such as slot coating, blade coating, screen printing, vacuum evaporation, inkjet printing, etc., with a deposition thickness of 500 nm to 2000 nm.

[0039] V. Prepare a second carrier layer, such as an electron transport layer.

[0040] Specifically, the electron transport layer material includes, but is not limited to, any one of titanium oxide (TiO2), zinc oxide (ZnO), tin oxide (SnO2), nickel oxide, magnesium oxide, copper oxide, cuprous oxide, and tungsten oxide. The second carrier layer can be prepared by uniform film formation methods such as solution coating or vapor deposition, and the film thickness is usually no more than 100 nm.

[0041] Vi. Perform P2 laser scribing on the device.

[0042] Specifically, the laser scribing P2 uses a femtosecond laser device to scribing the module. The scribing width is 30um to 100um, for example, 30um, 40um, 50um, 60um, 70um, 80um, 90um or 100um, etc. The width of the P2 laser scribing groove is also the scribing width.

[0043] Vii. Deposit a metal back electrode layer on a device with an insulating shielding layer.

[0044] Specifically, the metal electrode can be made of metals such as Au, Ag, and Cu, and is prepared by vacuum thermal evaporation.

[0045] Viii. Perform P3 laser scribing on the device.

[0046] Specifically, the laser scribing P3 uses a femtosecond laser device to scribing the module. The scribing width is 30 to 100 μm, for example, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm, etc. The width of the P3 laser scribing groove is also the scribing width.

[0047] Furthermore, step S1 also includes the following steps:

[0048] IX. Stack a thermoplastic film and an encapsulation cover on one side of the back electrode layer of the perovskite battery module.

[0049] For example, see Figure 3 The prepared, unencapsulated perovskite solar module is placed on a laminator, and thermoplastic film and glass encapsulation cover are stacked sequentially on the surface of the perovskite solar module.

[0050] The encapsulation cover has multiple second protrusions on the side in contact with the thermoplastic film. The positions of these second protrusions correspond one-to-one with the grooves formed by the P2 and P3 laser scribing lines, allowing the second protrusions to compress the thermoplastic film during the lamination process to form multiple first protrusions. The width of each second protrusion is 32–98 μm, and the height is 100 nm–2 μm. The thickness of the encapsulation cover is 1.1 mm–2.5 mm. In some embodiments, to completely fill the grooves formed by the P2 and P3 laser scribing lines, the thickness of the thermoplastic film is 100 μm–2 mm; the specific thickness needs to be selected based on the depth of the grooves.

[0051] In addition, in some embodiments, multiple raised structures may be provided on the side of the thermoplastic film that contacts the back electrode layer, while the side of the encapsulation cover that contacts the thermoplastic film is a flat surface. This allows the encapsulation cover to fully contact the thermoplastic film, apply uniform pressure to it, and prevent air bubbles from forming between them. The multiple raised structures of the thermoplastic film can fill the groove to form the first raised structure, thus completely filling the groove. Generally, the depth of the raised structures on the thermoplastic film is less than the depth of the groove, for example, 2 / 3 of the groove depth. This means that the raised structures can partially fill the groove, and in the molten state, the encapsulation cover can also squeeze some of the thermoplastic film material into the groove to fill it completely. Alternatively, the size of the raised structures on the thermoplastic film can be designed to precisely fill the groove.

[0052] In some embodiments, both the thermoplastic film and the encapsulation cover can be designed with raised structures. Specifically, the raised structure (second raised structure) on the encapsulation cover can compress a portion of the molten thermoplastic film to fill the grooves, and the raised structure on the thermoplastic film itself can also partially fill the grooves. Therefore, generally speaking, the depth of both the raised structure on the thermoplastic film and the raised structure on the encapsulation cover is less than the depth of the corresponding grooves.

[0053] It should be noted that in some embodiments, the thermoplastic film is selected from at least one of EVA, POE, and PVB. The encapsulation cover is made of glass.

[0054] S2. Using a lamination process, the perovskite battery module and the encapsulation cover are bonded together with a thermoplastic film.

[0055] Specifically, exemplarily, see 3, the operation steps are as follows:

[0056] X. Vacuum is drawn using a laminator, and the temperature is heated to a melting temperature of 100℃~150℃. Then, pressure is applied for lamination, with a pressure of 40kPa~80kPa.

[0057] Furthermore, some embodiments of the present invention also provide an electrical device that includes a perovskite solar cell module with the above-described structure. For example, this electrical device may be a solar charger, a solar lamp, a solar water pump, a solar fan, or a solar vehicle, etc.

[0058] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0059] Example 1

[0060] This embodiment provides a method for fabricating a perovskite solar cell module. See [link to documentation]. Figure 2 and Figure 3 Specifically, it includes the following steps:

[0061] The first step involves ultrasonically cleaning the transparent glass substrate sequentially with deionized water, acetone, optical glass cleaner, and isopropanol, and then drying it in an oven at 60°C for 6 hours.

[0062] The second step involves thermally evaporating an ITO conductive layer with a thickness of 100–500 nm and a resistance of 15 Ω / □. A femtosecond laser is then used to scribing the conductive layer onto the substrate, with an etching width of 30–100 μm. Subsequently, the substrate is ultrasonically cleaned sequentially with deionized water, acetone, optical glass cleaner, and isopropanol, followed by ultraviolet ozone treatment to enhance surface wettability.

[0063] The third step involves depositing a 5 mg / mL PTAA solution (Mw ~ 10000) onto a transparent conductive substrate via spin coating. The spin coating parameters are 4000 rpm for 30 s, with an acceleration of 2000 rpm / s. Annealing at 100°C for 10 mins completes the preparation of the hole transport layer.

[0064] The fourth step involves cleaning the PTAA transport layer surface with DMF to improve wettability, followed by deposition of a 1.35M FAPbI3 perovskite solution (VDMF / VDMSO = 9:1). The spin coating speed is 5000 rpm, the spin coating time is 25 s, and the acceleration is 2500 rpm / s. At the 20th second of spin coating, 100 μL of chlorobenzene antisolvent is used to dynamically coat the perovskite precursor film to promote uniform crystal growth. The perovskite layer is then annealed in air (RH ~ 40%) at 150℃ for 15 min to complete the preparation of the perovskite layer.

[0065] The fifth step involves spin-coating a 10 mg / mL chlorobenzene solution of PC61BM onto the surface of the perovskite film at a spin speed of 2000 rpm for 60 seconds to obtain the electron transport layer.

[0066] The sixth step involves etching the P2 line using a femtosecond laser. The etching parameters are adjusted and optimized to reduce damage to the perovskite and functional layers. The etching width is 30–100 μm.

[0067] Step 7: Vacuum thermal evaporation deposition of a 100nm Ag electrode on the quasi-device after scribing.

[0068] The eighth step involves further etching the P3 line using a femtosecond laser with an etching width of 30–100 μm, cutting off the surface metal electrodes, forming an effective series connection of sub-cells, and realizing the fabrication of the perovskite battery module.

[0069] Step 9: The thermoplastic film is POE with a thickness of 100um to 2mm; the glass encapsulation cover has a thickness of 1.1mm to 2.5mm, a raised structure width of 32 to 98um, and a height of 100nm to 2um; the raised positions correspond to the laser scribing grooves of P2 / P3.

[0070] The tenth step involves a lamination process, followed by vacuum heating and pressurization. The encapsulation board is bonded to the perovskite battery module using a hot-melt adhesive film (POE) to form a complete perovskite battery module. The melting temperature is 100–150°C, and the pressurization pressure is 40–80 kPa.

[0071] Example 2

[0072] This embodiment provides a method for preparing a perovskite solar cell module, which differs from Embodiment 1 only in that:

[0073] In the first step, the transparent glass is replaced with a flexible PET substrate, and the same subsequent steps can be used to realize flexible perovskite solar cell modules.

[0074] Example 3

[0075] This embodiment provides a method for preparing a perovskite solar cell module, which differs from Embodiment 1 only in that:

[0076] In steps three and five, the p-type PTAA transport layer is replaced with an n-type SnO2 transport layer, and the n-type PC... 61 By replacing the BM transport layer with a p-type spiro-OMeTAD transport layer, inverted perovskite solar cell modules can be fabricated.

[0077] Example 4

[0078] This embodiment provides a method for preparing a perovskite solar cell module, which differs from Embodiment 1 only in that:

[0079] The surface of the thermoplastic POE film is designed with an irregularly shaped raised structure, with a raised height of 100nm to 5µm and a raised width of 32µm to 98µm. The raised positions correspond to the P2 and P3 laser-scribed grooves. When placing the POE film, it can be placed precisely into the laser-scribed grooves. After lamination and heating to melt, it can fill the P2 and P3 laser-scribed grooves, achieving a better encapsulation effect. Figure 4 As shown.

[0080] Example 5

[0081] This embodiment provides a method for preparing a perovskite solar cell module, which differs from Embodiment 1 only in that:

[0082] The surface of the thermoplastic POE film is designed with an irregularly shaped raised structure, with a height of 100nm to 5µm and a width of 32µm to 98µm. Simultaneously, the surface of the glass encapsulation cover is also designed with an irregularly shaped raised structure, with a width of 32 to 98µm and a height of 100nm to 2µm. The raised positions of both the thermoplastic POE film and the glass encapsulation cover correspond to the grooves marked by laser scribing P2 and P3. Together, they fill the grooves marked by laser scribing P2 and P3, achieving a better encapsulation effect. Figure 5 As shown.

[0083] In summary, the solution of this invention addresses the problem of poor encapsulation effect of thermoplastic films by designing an irregular shape for the encapsulation cover and / or thermoplastic film. The encapsulation cover corresponding to the laser-marked positions P2 and P3 is provided with raised structures, and / or the thermoplastic film is provided with raised structures. In a laminator, the thermoplastic film (EVA / POE / PVB, etc.) is placed on the prepared, unencapsulated perovskite solar module, while the encapsulation cover is placed on the surface of the thermoplastic film (with the raised structures of the encapsulation cover and / or thermoplastic film facing downwards). For the grooves marked by laser scribing (P2 / P3), the laminator is evacuated and degassed. After the adhesive film melts, pressure is applied. The raised structures on the surface of the glass encapsulation backplate and / or the raised structures of the thermoplastic film can compensate for the discontinuity of the P2 and P3 laser scribing positions of the perovskite solar module, allowing the thermoplastic film to completely fill the gaps in the P2 and P3 laser scribing grooves and eliminate air bubbles. Furthermore, when the surface of the encapsulation cover plate has raised structures, the spacing between the raised structures is relatively wide, preventing air bubbles from existing between the encapsulation cover plate and the thermoplastic film. This solution enhances the encapsulation effect of the new perovskite solar cell, slows down the degradation of perovskite materials and the decline in cell efficiency, and extends its service life.

[0084] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A perovskite solar cell module, characterized in that, It includes a substrate, a conductive layer, a first carrier layer, a perovskite layer, a second carrier layer, a back electrode layer, a thermoplastic film, and an encapsulation cover plate stacked sequentially. The layer structure consisting of the conductive layer, the first charge carrier layer, the perovskite layer, the second charge carrier layer, and the back electrode layer is divided into multiple sub-cells, and the back electrode layer has multiple trenches formed by P2 laser scribing and P3 laser scribing on one side. The thermoplastic film has a plurality of first protrusions extending toward the substrate, the plurality of first protrusions completely filling the plurality of grooves formed by the P2 laser scribing and the P3 laser scribing.

2. The perovskite solar cell module according to claim 1, characterized in that, The side of the encapsulation cover that contacts the thermoplastic film is provided with a plurality of second protrusions, all of which are embedded in the thermoplastic film, and the positions of the plurality of second protrusions correspond one-to-one with the plurality of grooves formed by the P2 laser scribing and the P3 laser scribing.

3. The perovskite solar cell module according to claim 2, characterized in that, The widths of the multiple grooves formed by P2 laser scribing and P3 laser scribing are all between 30µm and 100µm.

4. The perovskite solar cell module according to claim 3, characterized in that, The width of the second protrusion is 32um to 98um, and the height is 100nm to 2um.

5. The perovskite solar cell module according to claim 1, characterized in that, The substrate is selected from any one of glass, silicon wafer, carbon fiber, marble, PI and PET; And / or, the material of the conductive layer is selected from at least one of transparent conductive materials, metallic conductive materials, and highly conductive materials; the transparent conductive materials include at least one of indium tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, and indium zinc oxide; the metallic conductive materials include at least one of Au, Ag, Cu, Ni, Ti, and Cr; and the highly conductive materials include at least one of graphene, silver nanowires, and carbon nanotubes. And / or, the first charge carrier layer and the second charge carrier layer are respectively selected from hole transport layer materials and electron transport layer materials, wherein the hole transport layer material is selected from Spiro-OMeTAD, PEDOT:PSS, TPD, PTAA, P3HT, PCPDTBT, Ni x At least one of O, V2O5, CuI, MoO3, CuO, and Cu2O; the electron transport layer material is selected from at least one of titanium oxide, zinc oxide, tin oxide, nickel oxide, magnesium oxide, copper oxide, cuprous oxide, and tungsten oxide; And / or, the perovskite layer is made of a material with the chemical formula ABX3, wherein A is CH3NH3. + (MA + ), NH2=CHNH2 + (FA + C4H9NH3 + Cs + and Rb + At least one of; B is Pb 2+ Sn 2+ 、Ge 2+ Sb 3+ Bi 3+ Ag + Au 3+ and Ti 4+ At least one of them; X is Cl - ,Br - I - Or at least one of the halogens; And / or, the material of the back electrode layer is selected from any one of Au, Ag and Cu; And / or, the material of the thermoplastic film is selected from at least one of EVA, POE, and PVB; And / or, the encapsulation cover is made of glass.

6. The perovskite solar cell module according to any one of claims 1 to 5, characterized in that, The thickness of the conductive layer is 100nm to 500nm; and / or, the thickness of both the first carrier layer and the second carrier layer is less than or equal to 100nm; and / or, the thickness of the perovskite layer is 500nm to 2000nm; and / or, the thickness of the thermoplastic film is 100um to 2mm; and / or, the thickness of the encapsulation cover is 1.1mm to 2.5mm.

7. A method for preparing a perovskite solar cell module as described in any one of claims 1 to 6, characterized in that, It includes: The thermoplastic film and the encapsulation cover are stacked on one side of the back electrode layer of the perovskite battery module, which is composed of the substrate, the conductive layer, the first carrier layer, the perovskite layer, the second carrier layer and the back electrode layer. The perovskite battery module and the encapsulation cover are bonded together using a lamination process via the thermoplastic film. The thermoplastic film has a raised structure on the side that contacts the back electrode layer for forming a plurality of first protrusions; and / or, the encapsulation cover has a plurality of second protrusions on the side that contacts the thermoplastic film, and the positions of the plurality of second protrusions correspond one-to-one with the plurality of grooves formed by P2 laser scribing and P3 laser scribing, so that during the lamination process, the plurality of second protrusions can compress the thermoplastic film to form a plurality of first protrusions.

8. The preparation method according to claim 7, characterized in that, The lamination process is carried out using a laminator, which first involves vacuuming and heating, and then applying pressure.

9. The preparation method according to claim 8, characterized in that, The melting temperature of the heating element is 100℃~150℃, and the pressure applied is 40kPa~80kPa.

10. An electrical appliance, characterized in that, It includes the perovskite solar cell module as described in any one of claims 1 to 6.

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