Wafer marking tool

Abstract

A wafer marking fixture is provided, comprising a frame and two elastic movable clamps. The frame forms a hollow space. The two elastic movable clamps are disposed within the frame and face each other, and can move elastically closer to or further away from each other. The two elastic movable clamps are configured to: elastically clamp the outer peripheral walls of opposite corners of a cuboid wafer in a face-up, back-down orientation to suspend and clamp the wafer. After the wafer marking fixture is placed upside down on the marking machine stage, the front of the wafer remains suspended and clamped by the two elastic movable clamps, while the back of the wafer protrudes from the hollow space of the frame for marking. The frame and the two elastic movable clamps are configured such that: when the wafer is in a face-up, back-down orientation, the entire periphery of the wafer is within the frame, and after the wafer marking fixture is placed upside down on the marking machine stage, the front of the wafer does not contact the marking machine stage.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and more specifically to a wafer marking fixture. Background Technology

[0002] In the semiconductor industry, wafer marking is an essential step in the wafer fabrication process, as it requires marking each wafer to track processes and data. The principle of a marking machine is to use intense pulsed light energy to create marks on the surface of different materials. Laser marking machines are commonly used in the semiconductor industry due to their susceptibility to environmental influences, wide applicability, high precision, non-contact operation, and high processing efficiency.

[0003] Therefore, for high-cost chips, efficient marking, strict control over the front side of the chip, and ensuring the safety of the front side of the chip are particularly important in the chip marking process. Summary of the Invention

[0004] In view of the problems existing in the background art, the purpose of this disclosure is to provide a wafer marking fixture that can prevent the front side of the wafer from being contacted, thereby strictly controlling the contact with the front side of the wafer and ensuring the safety of the front side of the wafer.

[0005] Therefore, a wafer marking fixture is provided, comprising a frame and two elastic movable clamps. The frame forms a ring with a hollow space extending through its thickness direction, which is parallel to the vertical direction. The two elastic movable clamps are disposed within the frame and face each other. The two elastic movable clamps can move elastically closer to or further away from each other. Each elastic movable clamp has a top side, and the top sides of the two elastic movable clamps are coplanar on the horizontal plane formed by the left-right and front-back directions. The two elastic movable clamps are configured to elastically clamp a cuboid shape in a face-up, back-down orientation. The outer peripheral walls at the two opposite corners of the wafer are used to suspend and hold the wafer in place. With the wafer suspended and held in place, the wafer marking fixture is placed upside down on the marking machine stage. The front of the wafer remains suspended and held in place by two elastic movable clamps, while the back of the wafer is exposed from the hollow space of the frame for marking. The frame and the two elastic movable clamps are configured such that when the wafer is in a front-up and back-down position, the entire periphery of the wafer is within the frame. With the wafer suspended and held in place, the front of the wafer does not contact the marking machine stage.

[0006] The beneficial effects of this disclosure are as follows: In the wafer marking fixture, two elastic movable clamps are configured to elastically clamp the outer peripheral walls of the opposite two corners of a cuboid wafer in a face-up, back-down orientation, thereby suspending and clamping the wafer in mid-air, ensuring that the two elastic movable clamps do not contact the front of the wafer; the frame and the two elastic movable clamps are configured such that when the wafer is in a face-up, back-down orientation, the entire periphery of the wafer is within the frame. When the wafer marking fixture is placed upside down on the marking machine stage while the wafer is suspended and clamped, the front of the wafer does not contact the marking machine stage, thus protecting the wafer from contact by objects outside the frame. Since the wafer marking fixture is placed upside down on the marking machine stage and the front of the wafer does not contact the marking machine stage, the front of the wafer is protected by the back of the wafer 200b and the marking machine stage, preventing the front of the wafer from being contacted, thereby strictly controlling contact with the front of the wafer and ensuring the safety of the front of the wafer. In other words, whether the wafer is in a face-up or back-down orientation, or in a marking orientation where the wafer marking fixture is placed upside down on the marking machine stage, the front of the wafer will not be touched, thus strictly controlling the contact with the front of the wafer and ensuring the safety of the wafer 20. Attached Figure Description

[0007] Figure 1 This is a top-view perspective view of the wafer marking fixture according to this disclosure.

[0008] Figure 2 This is another top-view perspective view of the wafer marking fixture according to this disclosure.

[0009] Figure 3 This is a bottom-view perspective view of the wafer marking fixture according to this disclosure.

[0010] Figure 4 This is a top view of the wafer marking fixture according to the present disclosure, wherein the wafer is shown.

[0011] Figure 5 This is a bottom view of the wafer marking fixture according to the present disclosure, wherein the wafer is shown.

[0012] Figure 6 This is a side view of the wafer marking fixture and the wafer placed on the stage of the marking machine according to the present disclosure.

[0013] Figure 7 This is a top view of the wafer marking fixture according to the present disclosure, wherein two elastic movable clips are in different positions and two wafers are shown in dashed lines, and the spring is not shown.

[0014] Figure 8 These are side views, AA cross-sectional views, and BB cross-sectional views of the flexible movable clip of the wafer marking fixture according to this disclosure.

[0015] Figure 9 These are top views and CC cross-sectional views of the flexible movable clamp of the wafer marking fixture according to this disclosure.

[0016] Figure 10 This is a right view of the flexible movable clip of the wafer marking fixture according to this disclosure.

[0017] Figure 11 This is a perspective view of the upside-down position of the locking block of the flexible movable locking component of the wafer marking fixture according to this disclosure.

[0018] The reference numerals in the attached figures are explained below.

[0019] 100-chip marking fixture 231a first lower side

[0020] D1 Up and down direction 231b Second lower side

[0021] D2 Left and right directions 231c First upper side

[0022] D3 Front and rear directions 231d Second upper side

[0023] 1 Enclosure R1 first recess

[0024] S hollow space R2 second concave part

[0025] 11 upper surface 24 springs

[0026] 12 inner corners 3 support plates

[0027] 13 First frame strip 31 Top surface

[0028] 131 gap 32 bottom surface

[0029] 14 Second frame strip 33 Side wall surface

[0030] 15 Lower surface 34 grooves

[0031] 2 Flexible movable clips 341 opening

[0032] 21 top-side 200 chips

[0033] 22 slider 200a front

[0034] 221 top plane 200b back face

[0035] 23-card block 200c outer peripheral wall

[0036] 231 holding recess 300 marking machine stage Detailed Implementation

[0037] The accompanying drawings illustrate embodiments of this disclosure, and it will be understood that the disclosed embodiments are merely examples of this disclosure, which can be implemented in various forms. Therefore, the specific details disclosed herein should not be construed as limiting, but are intended only as the basis for the claims and as an illustrative basis to teach those skilled in the art how to implement this disclosure in various ways.

[0038] Reference Figures 1 to 7 The chip marking fixture 100 includes a frame 1 and two flexible movable clips 2.

[0039] The frame 1 forms a ring-shaped hollow space S that extends along the thickness direction of the frame 1, and the thickness direction of the frame 1 is parallel to the vertical direction D1.

[0040] Two flexible movable clips 2 are disposed within the frame 1 and face each other. The two flexible movable clips 2 can move elastically closer to or further away from each other. Each flexible movable clip 2 has a top side 21, and the top sides 21 of the two flexible movable clips 2 are coplanar on the horizontal plane formed by the left-right direction D2 and the front-back direction D3. The two flexible movable clips 2 are configured to elastically lock the outer peripheral walls 200c at the two opposite corners of the cuboid-shaped wafer 200 in a posture where the front side 200a is facing up and the back side 200b is facing down, so as to suspend and lock the wafer 200 in the air (see...). Figure 4 With the wafer 200 suspended and held in place, the wafer marking fixture 100 is placed upside down on the marking machine stage 300. The front side 200a of the wafer 200 remains suspended and held in place by the two elastic movable clips 2, while the back side 200b of the wafer 200 protrudes from the hollow space S of the frame 1 for marking (see reference). Figure 6 And compare Figure 5 The frame 1 and the two flexible movable clips 2 are configured such that, when the chip 200 is in a position with its front side 200a facing upwards and its back side 200b facing downwards, the entire periphery of the chip 200 is contained within the frame 1 (see reference). Figure 4 With the wafer 200 suspended and held in place, the wafer marking fixture 100 is placed upside down on the marking machine stage 300, ensuring that the front surface 200a of the wafer 200 does not contact the marking machine stage 300 (refer to...). Figure 6 ).

[0041] In the wafer marking fixture 100, two elastic movable clamps 2 are configured to elastically clamp the outer peripheral walls 200c at opposite corners of the cuboid wafer 200, which is in a position where the front 200a is facing upwards and the back 200b is facing downwards, thereby suspending and clamping the wafer 200 in mid-air, so that the two elastic movable clamps 2 do not contact the front 200a of the wafer 200; the frame 1 and the two elastic movable clamps 2 are configured such that when the wafer 200 is in a position where the front 200a is facing upwards and the back 200b is facing downwards, the entire periphery of the wafer 200 is within the frame 1, and the wafer marking fixture 100 is placed upside down on the marking machine stage 3 in the suspended and clamped state. After the wafer 200 is placed upside down on the marking machine stage 300, the front 200a of the wafer 200 does not contact the marking machine stage 300, thus protecting the wafer 200 from contact by objects outside the stage 1. Since the wafer marking fixture 100 is placed upside down on the marking machine stage 300, the front 200a of the wafer 200 does not contact the marking machine stage 300. Therefore, the front 200a of the wafer 200 is protected by the back 200b of the wafer 200 and the marking machine stage 300, preventing the front 200a of the wafer 200 from being contacted, thereby strictly controlling contact with the front 200a of the wafer 200 and ensuring the safety of the front 200a of the wafer 200. In other words, whether the chip 200 is in a position with its front 200a facing up and its back 200b facing down, or in a position where the chip marking fixture 100 is placed upside down on the marking machine stage 300 for marking, the front 200a of the chip 200 will not be touched, thus strictly controlling contact with the front 200a of the chip 200 and ensuring the safety of the front 200a of the chip 200.

[0042] Based on the relationship between the top side 21 of the two elastic movable clips 2 and the upper surface 11 of the frame 1, there are multiple ways to place the wafer marking fixture 100 upside down on the marking machine stage 300 when the wafer 200 is suspended and clipped.

[0043] The first way is, such as Figure 1 As shown, the top sides 21 of the two flexible movable clips 2 extend upward beyond the upper surface 11 of the frame 1. When the chip 200 is in a position with its front side 200a facing upward and its back side 200b facing downward, the front side 200a of the chip 200 is lower than the top sides 21 of the two flexible movable clips 2 in the vertical direction D1; Figure 6 As shown, with the wafer 200 suspended and locked, the wafer marking fixture 100 is placed upside down on the marking machine stage 300, and the top sides 21 of the two elastic movable clips 2 are supported on the marking machine stage 300.

[0044] In the second embodiment (not shown), the top sides 21 of the two flexible movable clips 2 are lower than the upper surface 11 of the frame 1. With the front side 200a facing upwards and the back side 200b facing downwards, the top sides 21 of the two flexible movable clips 2 are lower than the upper surface 11 of the frame 1. When the wafer 200 is suspended and locked, the wafer marking fixture 100 is placed upside down on the marking machine stage 300, and the upper surface 11 of the frame 1 is supported on the marking machine stage 300. Of course, regarding the relationship between the wafer 200 and the flexible movable clips 2, if, with the front side 200a facing upwards and the back side 200b facing downwards, the front side 200a of the wafer 200 is lower than the top sides 21 of the two flexible movable clips 2, the top sides 21 of the two flexible movable clips 2 can be flush with the upper surface 11 of the frame 1.

[0045] In one example, such as Figures 1 to 5 As shown, the frame 1 is a frame strip that encloses a rectangular hollow space S, and two elastic movable clips 2 are respectively set at two opposite inner corners 12 of the frame 1. This makes it very convenient to set the two elastic movable clips 2 facing each other.

[0046] Specifically, the frame 1 includes two opposing first frame strips 13 and two second frame strips 14; the two first frame strips 13 extend parallel to each other in the left-right direction D2 and are spaced apart in the front-back direction D3; the two second frame strips 14 extend parallel to each other in the front-back direction D3 and are spaced apart in the left-right direction D2; the two second frame strips 14 are respectively connected to the two ends of the two first frame strips 13 in the left-right direction D2 to form four inner corners 12 together. The wafer marking fixture 100 also includes two support plates 3; the two support plates 3 are disposed at two opposing inner corners 12 formed by the two second frame strips 14 and the two first frame strips 13, and each support plate 3 is fixedly connected to the first frame strip 13 and the second frame strip 14 at the corresponding inner corner 12; the two first frame strips 13, the two second frame strips 14 and the two support plates 3 enclose the hollow space S; two elastic movable clips 2 are respectively elastically movable and disposed on the two support plates 3. Therefore, the strength of the overall structure formed by the frame 1, the two elastic movable clips 2, and the two support plates 3 is improved. The setting of the two support plates 3 improves the stability of the two elastic movable clips 2, and thus improves the stability of the two elastic movable clips 2 in elastically locking the outer peripheral wall 200c at the two opposite corners of the wafer 200 to suspend and lock the wafer 200. This helps to ensure the safety of the front side 200a of the wafer 200 and is beneficial to the quality of marking (i.e., laser marking).

[0047] In one example, such as Figure 1 and Figure 3As shown, the top surfaces of the first frame strip 13 and the second frame strip 14 constitute the upper surface 11 of the frame 1; the top surface 31 of each support plate 3 is lower than the upper surface 11 of the frame 1; the bottom surfaces of the first frame strip 13 and the second frame strip 14 constitute the lower surface 15 of the frame 1; and the bottom surface 32 of each support plate 3 is flush with the lower surface 15 of the frame 1. When the wafer 200 is not installed, the bottom surface 32 of each support plate 3 and the lower surface 15 of the frame 1 can be placed on the marking machine stage 300. In this way, the bottom surface 32 of each support plate 3 and the lower surface 15 of the frame 1 increase the contact area with the marking machine stage 300, which improves the stability of the wafer marking fixture 100. Then, the wafer 200 can be clamped by a jig (not shown) and the elastic movement of the two elastic movable clamps 2 can be controlled to elastically clamp the outer peripheral wall 200c at the two opposite corners of the cuboid wafer 200 with the front 200a facing up and the back 200b facing down, so as to suspend and clamp the wafer 200.

[0048] To facilitate the operation of the clamp holding the chip 200, such as Figures 1 to 4 As shown, each first frame strip 13 has a notch 131 in its middle, which is recessed from the top surface of the first frame strip 13 towards the bottom surface of the first frame strip 13, and extends through in the front-rear direction D3 but is closed in the left-right direction D2. The notch 131 is configured to allow the jig holding the wafer 200 to pass through. The configuration of the notch 131 facilitates the jig holding the wafer 200 to place the wafer 200 into the enclosure 1 and to remove it from the enclosure 1 after marking (i.e., from...). Figure 6 The orientation is then reversed, and the outer peripheral wall 200c of the wafer 200 is clamped from the two notches 131. The two elastic movable clips 2 are released, and then the fixture moves the marked crystal 200 upward out of the frame 1. The shape of the notches 131 can be adopted. Figure 1 The arc shape shown can also be other shapes.

[0049] like Figures 1 to 5 As shown, the opposing sidewalls 33 of the two support plates 3 are arc-shaped and concave towards the corresponding inner corners 12. This minimizes the occupation of the hollow space S by the two support plates 3, and fully ensures the area of ​​the back surface 200b of the chip 200 exposed from the hollow space S during marking, which is beneficial for marking more content on the back surface 200b of the chip 200.

[0050] In one example, such as Figure 1 and Figure 11 As shown, each support plate 3 is provided with a sliding groove 34; each elastic movable locking component 2 includes a slider 22, a locking block 23, and a spring 24; the slider 22 is installed in the sliding groove 34 and can slide within the sliding groove 34; the locking block 23 is fixedly disposed above the slider 22, and the locking block 23 has a locking recess 231; the spring 24 is fixedly connected between the corresponding inner corner 12 and one of the slider 22 or the locking block 23 (in Figure 1In this configuration, spring 24 is fixedly connected between the corresponding inner corner 12 and slider 22, allowing the retaining recess 231 of the locking block 23 to elastically lock the outer peripheral wall 200c at the corresponding corner of the cuboid-shaped wafer 200 in an orientation where the front 200a faces upward and the back 200b faces downward. The cooperation of slider 22 and groove 34 improves the stability of movement of each elastic movable locking member 2 and the ease of operation. Slider 22 and locking block 23 are preferably integrally formed to reduce the deviation of the outer peripheral walls 200c at the two opposite corners of the cuboid-shaped wafer 200 caused by separate manufacturing and assembly, and also simplifies manufacturing. Figure 1 As shown, spring 24 can be, but is not limited to, a helical spring.

[0051] Furthermore, such as Figure 1 and Figure 10 As shown, the slider 22 is inverted T-shaped, and the groove 34 is also inverted T-shaped to mate with the slider 22. The top plane 221 of the slider 22 is higher than or flush with the plane of the upwardly open opening 341 of the groove 34. This maximizes the restriction on the flipping of the slider 22 on both sides of the groove 34 that are perpendicular to the direction of movement of the slider 22 relative to the groove 34, thereby improving the accuracy of the outer peripheral walls 200c at the two opposite corners of the two elastic movable clips 2 facing the cuboid-shaped wafer 200.

[0052] like Figure 8 As shown, the angle between the retaining recess 231 and the horizontal cross-section at any position along the vertical direction D1 is 90 degrees.

[0053] Furthermore, referring to Figures 8 to 11In one example, the retaining recess 231 includes a first lower side surface 231a, a second lower side surface 231b, a first upper side surface 231c, and a second upper side surface 231d. The first lower side surface 231a and the second lower side surface 231b are both perpendicular to the horizontal plane formed by the left-right direction D2 and the front-back direction D3 and are connected together at a 90-degree angle to form the first recess R1. The first upper side surface 231c extends upward from the top edge of the first lower side surface 231a and obliquely towards the elastic movable retaining member 2 on the opposite side. The second upper side surface 231d extends upward from the top edge of the second lower side surface 231b and obliquely towards the elastic movable retaining member 2 on the opposite side. The first upper side surface 231c and the second upper side surface 231d are connected together at a 90-degree angle on the horizontal cross-section made at any position along the up-down direction D1 to form the second recess R2. When the thickness of the wafer 200 is less than or equal to the height of the first lower side surface 231a and the second lower side surface 231b in the vertical direction D1, the first recess R1 clamps the outer peripheral wall 200c at the corresponding corner of the cuboid-shaped wafer 200 in a face-to-face manner. When the thickness of the wafer 200 is greater than the height of the first lower side surface 231a and the second lower side surface 231b in the vertical direction D1, the second recess R2 clamps the outer peripheral wall 200c at the corresponding corner of the cuboid-shaped wafer 200 in a line-to-line manner, thereby improving the adaptability of the wafer marking fixture 100 to the thickness of the wafer 200. Furthermore, when in… Figure 6 When the wafer is in its natural position, the first upper surface 231c and the second upper surface 231d constituting the second recess R2 also provide stable support. Simultaneously, the elastic movement characteristics of the two elastic movable clips 2 also improve the adaptability of the wafer 200's size (the dimension between the two opposite corners of the wafer 200), such as... Figure 7 As shown.

[0054] In one example, such as Figure 10 and Figure 11 As shown, the dimension of the second recess R2 in the vertical direction D1 is larger than the dimension of the first recess R1 in the vertical direction D1. Since the first recess R1 corresponds to the thinner wafer 200, when the wafer marking fixture 100 is in the position... Figure 6 When the chip 200 is in the correct orientation, the front surface 200a of the chip 200 is further away from the stage 300 of the marking machine, which is more conducive to improving the protection of the front surface 200a of the chip 200.

[0055] Reference Figure 8In one example, the first lower side surface 231a and the second lower side surface 231b project onto the vertical direction D1 with the same length. That is, in the vertical direction D1 projection, the first lower side surface 231a and the second lower side surface 231b form an isosceles triangle, and the angle bisector of the vertex angle of the isosceles triangle is 45 degrees. The first lower side surface 231a and the second lower side surface 231b hold the outer peripheral walls 200c on both sides of the corresponding corner of the cuboid-shaped wafer 200 within the same range, which improves the balance of the force that holds the wafer 200 at the corresponding corner. Similarly, the first upper side surface 231c and the second lower side surface 231b... On the horizontal cross-section taken at any position along the vertical direction D1 of the second upper side 231d, the lengths of the corresponding sides of the first upper side 231c and the second upper side 231d are the same. That is, in the projection on the vertical direction D1, the first upper side 231c and the second upper side 231d form an isosceles triangle, and the angle bisector of the vertex angle of the isosceles triangle is 45 degrees. The range of the outer peripheral walls 200c on both sides of the corresponding corner of the cuboid-shaped wafer 200 by the first upper side 231c and the second upper side 231d is the same, which improves the balance of the force that suspends and holds the wafer 200 at the corresponding corner.

[0056] like Figure 8 As shown and referenced Figure 1 In one example, the top plane 221 of the slider 22 protrudes from the part where the first recess R1 connects with the top plane 221 of the slider 22 toward the opposite elastic movable member 2. The size of the protrusion of the top plane 221 of the slider 22 from the part where the first recess R1 connects with the top plane 221 of the slider 22 toward the opposite elastic movable member 2 is less than or equal to the distance between the part where the first recess R1 connects with the top plane 221 of the slider 22 and the point on the top side 21 of the second recess R2 that is closest to the opposite elastic movable member 2. In this way, not only can the protrusion of the top plane 221 of the slider 22 from the part where the first recess R1 connects with the top plane 221 of the slider 22 towards the opposite elastic movable member 2 be controlled to be as short as possible, but when the top plane 221 of the slider 22 is higher than the upwardly open opening 341 of the slide groove 34, the part of the top plane 221 of the slider 22 protruding from the part where the first recess R1 connects with the top plane 221 of the slider 22 towards the opposite elastic movable member 2 can provide effective support for the back surface 200b of the wafer 200. In addition, it also cooperates with the side wall surface 33 of the aforementioned support plate 3 to ensure that the size of the hollow space S is as large as possible.

[0057] Several exemplary embodiments have been described in detail above, but this document is not intended to limit itself to the explicitly disclosed combinations. Therefore, unless otherwise stated, the various features disclosed herein can be combined to form several other combinations, which are not shown for simplicity.

Claims

1. A wafer marking fixture, characterized in that, The chip marking fixture (100) includes a frame (1) and two flexible movable clips (2). The frame (1) forms a ring of hollow space (S) that runs through the thickness direction of the frame (1), and the thickness direction of the frame (1) is parallel to the vertical direction (D1). Two flexible movable clips (2) are set inside the frame (1) and face each other. The two flexible movable clips (2) can move elastically closer to or further away from each other. Each flexible movable clip (2) has a top side (21). The top sides (21) of the two flexible movable clips (2) are coplanar on the horizontal plane formed by the left-right direction (D2) and the front-back direction (D3). Two flexible movable clips (2) are configured to: elastically clamp the outer peripheral walls (200c) at the two opposite corners of the cuboid-shaped wafer (200) in a posture where the front (200a) is facing up and the back (200b) is facing down, so as to suspend and clamp the wafer (200). When the wafer (200) is suspended and clamped, the wafer marking fixture (100) is placed upside down on the marking machine stage (300). The front (200a) of the wafer (200) is still suspended and clamped by the two flexible movable clips (2), and the back (200b) of the wafer (200) is exposed from the hollow space (S) of the frame (1) for marking. The frame (1) and two flexible movable clips (2) are configured such that when the wafer (200) is in the position with its front (200a) facing up and its back (200b) facing down, the entire periphery of the wafer (200) is within the frame (1). When the wafer (200) is suspended and clipped, the wafer marking fixture (100) is placed upside down on the marking machine stage (300), and the front (200a) of the wafer (200) does not contact the marking machine stage (300). The chip marking fixture (100) also includes two support plates (3); Two flexible movable clips (2) are respectively flexibly movable on two support plates (3); Each support plate (3) is provided with a sliding groove (34); Each flexible movable component (2) includes a slider (22), a locking block (23), and a spring (24); The slider (22) is installed in the slide groove (34) and can slide within the slide groove (34); The locking block (23) is fixedly set above the slider (22), and the locking block (23) has a locking recess (231). The spring (24) is fixedly connected between the corresponding inner corner (12) and one of the slider (22) or the locking block (23) so that the locking recess (231) of the locking block (23) can elastically move to lock the outer peripheral wall (200c) of the corresponding corner of the cuboid-shaped wafer (200) in the posture of front (200a) facing up and back (200b) facing down. The slider (22) is inverted T-shaped, and the groove (34) is inverted T-shaped to match the slider (22); The top plane (221) of the slider (22) is higher than or flush with the plane of the upward-opening opening (341) of the groove (34); The angle between the retaining recess (231) and the horizontal cross-section at any position along the vertical direction (D1) is 90 degrees; The retaining recess (231) includes a first lower side surface (231a), a second lower side surface (231b), a first upper side surface (231c), and a second upper side surface (231d); The first lower side (231a) and the second lower side (231b) are both perpendicular to the horizontal plane formed by the left-right direction (D2) and the front-back direction (D3) and are connected together at a 90-degree angle to form the first recess (R1). The first upper side (231c) extends upward and obliquely toward the elastic movable latch (2) on the opposite side from the top edge of the first lower side (231a), and the second upper side (231d) extends upward and obliquely toward the elastic movable latch (2) on the opposite side from the top edge of the second lower side (231b). The first upper side (231c) and the second upper side (231d) are connected together at an angle of 90 degrees on the horizontal cross section made at any position along the vertical direction (D1) to form the second recess (R2). The second recess (R2) has a larger vertical dimension (D1) than the first recess (R1) in the vertical direction (D1).

2. The wafer marking fixture according to claim 1, characterized in that, The top side (21) of the two elastic movable clips (2) extends upward beyond the upper surface (11) of the frame (1). With the chip (200) in a position where the front (200a) faces up and the back (200b) faces down, the front (200a) of the chip (200) is lower than the top side (21) of the two elastic movable clips (2) in the vertical direction (D1). With the wafer (200) suspended and locked, the wafer marking fixture (100) is placed upside down on the marking machine stage (300), and the top sides (21) of the two elastic movable clips (2) are supported on the marking machine stage (300).

3. The wafer marking fixture according to claim 1, characterized in that, The top side (21) of the two flexible movable clips (2) is lower than or flush with the upper surface (11) of the frame (1). With the chip (200) in a position where the front (200a) faces up and the back (200b) faces down, the top side (21) of the two elastic movable clips (2) is lower than the upper surface (11) of the frame (1). After the wafer (200) is suspended and stuck, the wafer marking fixture (100) is placed upside down on the marking machine stage (300), and the upper surface (11) of the frame (1) is supported on the marking machine stage (300).

4. The wafer marking fixture according to claim 1, characterized in that, The frame (1) is a frame strip that encloses a rectangular hollow space (S), and two elastic movable clips (2) are respectively set at the two opposite inner corners (12) of the frame (1). The frame (1) includes two opposing first frame strips (13) and two second frame strips (14); The two first frame strips (13) extend parallel to each other in the left-right direction (D2) and are spaced apart in the front-back direction (D3); The two second frame strips (14) extend parallel to each other in the front-back direction (D3) and are spaced apart in the left-right direction (D2); The two second frame bars (14) are respectively connected to the two ends of the left and right directions (D2) of the two first frame bars (13) to form four inner corners (12). Two support plates (3) are set at two opposite inner corners (12) formed by two second frame bars (14) and two first frame bars (13), and each support plate (3) is fixedly connected to the first frame bar (13) and the second frame bar (14) at the corresponding inner corner (12). The two first frame bars (13), the two second frame bars (14), and the two support plates (3) form the hollow space (S).

5. The wafer marking fixture according to claim 1, characterized in that, The first lower side surface (231a) and the second lower side surface (231b) have the same length when projected in the vertical direction (D1); In a horizontal cross-section taken at any position along the vertical direction (D1) of the first upper side surface (231c) and the second upper side surface (231d), the corresponding sides of the first upper side surface (231c) and the second upper side surface (231d) have the same length.

6. The wafer marking fixture according to claim 1, characterized in that, The top plane (221) of the slider (22) protrudes from the part where the first recess (R1) and the top plane (221) of the slider (22) are connected to the opposite elastic movable member (2). The top plane (221) of the slider (22) protrudes from the part where the first recess (R1) and the top plane of the slider (22) are connected to the opposite elastic movable member (2) by a dimension less than or equal to the distance between the part where the first recess (R1) and the top plane (221) of the slider (22) are connected to the point on the top side (21) of the second recess (R2) that is closest to the opposite elastic movable member (2).

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