A temperature-adjustable curing apparatus for epoxy resin processing

Abstract

This invention discloses a temperature-adjustable epoxy resin curing device, comprising an insulated box; further comprising: a plurality of mesh plates, which are equidistantly fixed inside the insulated box, each mesh plate having a plurality of molds, each mold having a demolding mechanism for demolding the cured epoxy resin; and a heating mechanism located on the side wall of the insulated box. This improved epoxy resin curing device provides stable and rapid heating of the epoxy resin, preventing overheating of parts of the mold. Furthermore, after scratching of the epoxy resin, it automatically demolds most of the cured epoxy resin from the inner wall of the mold. After the epoxy resin curing process, the temperature of both the mold and the cured epoxy resin remains low, ensuring high safety for the operator's material handling and subsequent operations. The device has a simple structure and low energy and water consumption.

Description

Technical Field

[0001] This invention relates to the technical field of epoxy resin curing apparatus, specifically to a temperature-adjustable epoxy resin curing apparatus. Background Technology

[0002] Epoxy resin is a high molecular polymer, which refers to a class of polymers containing two or more epoxy groups in their molecules. Generally, epoxy resin and epoxy resin coagulant are mixed evenly, and then the mixed solution is poured into a mold for curing to complete the production of epoxy resin products.

[0003] During the epoxy resin curing process, some epoxy resin coagulants, after being mixed with epoxy resin, require heating to accelerate curing and improve production efficiency. Heating of the epoxy resin mixture is typically achieved through heating blocks within the mold. However, excessively high temperatures in certain areas of the mold, and significant temperature differences between different parts, can negatively impact the curing effect. This can lead to strong adhesion between the cured epoxy resin and the mold's inner wall, hindering removal. Furthermore, the high temperature of the cured epoxy resin, due to thermal expansion and contraction, causes it to adhere tightly to the mold's inner wall, further increasing friction and making it difficult to remove. Handling over hot epoxy resin also reduces operator safety. Summary of the Invention

[0004] The purpose of this invention is to provide a temperature-adjustable curing apparatus for epoxy resin processing, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a temperature-adjustable curing apparatus for epoxy resin processing, comprising a heat-insulated box;

[0006] Also includes:

[0007] A plurality of mesh panels are fixedly installed at equal intervals inside a heat insulation box. A plurality of molds are provided on the mesh panels. A demolding mechanism is provided inside the molds, and the demolding mechanism performs demolding treatment on the cured epoxy resin.

[0008] A heating mechanism is provided on the side wall of the heat insulation box, and the heating mechanism performs heating treatment on epoxy resin. The heating mechanism is equipped with a cooling mechanism, and the cooling mechanism performs cooling treatment on epoxy resin.

[0009] Preferably, the heating mechanism includes a water storage tank, which is fixedly installed on the side wall of the heat insulation box. A heat insulation plate is fixedly installed in the middle of the water storage tank, and a semiconductor cooling plate is fixedly installed inside the heat insulation plate. Two three-way valves are fixedly installed on the upper and lower sides of the water storage tank, and the two open ends of each three-way valve inside the water storage tank are located on both sides of the heat insulation plate.

[0010] By adopting the above technical solution, the three-way valve and the heat insulation plate can divide the water storage tank into two independent flow spaces, allowing the airflow to perform cooling and heating operations separately in the water storage tank. The device is small in size, reducing the space occupied by the device.

[0011] Preferably, a plurality of heat-conducting plates are fixedly inserted at equal intervals on one side of the heat insulation plate, and each heat-conducting plate is fixedly connected to the inner wall of the water storage tank and the heat dissipation surface of the semiconductor refrigeration plate. The heat-conducting plates are provided with honeycomb-shaped holes. An air pump is fixedly installed at the center of the top side of the heat insulation box, and the air inlet end of the air pump is inserted into the heat insulation box and fixedly connected to the box wall of the heat insulation box. The exhaust end of the air pump is connected to the air inlet end of the three-way valve below through a connecting pipe.

[0012] By adopting the above technical solution, the heat-conducting plate with honeycomb-shaped holes can increase the contact area between the airflow and the heat dissipation surface of the semiconductor refrigeration plate, thereby improving the heat exchange rate between the airflow and the heat dissipation surface of the semiconductor refrigeration plate.

[0013] Preferably, a one-way valve is fixedly installed on the outer wall of the bottom of the heat insulation box, and the one-way valve is located below the water storage tank. The air inlet of the one-way valve is connected to the exhaust end of the three-way valve above through a conduit.

[0014] By adopting the above technical solution, the installation of one-way valves, three-way valves, connecting pipes and conduits can form an internal gas circulation within the device, preventing the intake of external gas into the insulation box and the simultaneous intake of dust into the insulation box, which would cause dust to adhere to the epoxy resin.

[0015] Preferably, a circular tube is fixedly inserted through the center of several heat-conducting plates. A rotating shaft is inserted through the top opening of the circular tube, and the top of the rotating shaft is inserted into the air inlet corresponding to the upper three-way valve. Impellers are fixedly installed at both ends of the rotating shaft. A support frame is rotatably sleeved on the middle position of the outer periphery of the rotating shaft through a bearing, and the support frame is fixedly connected to the circular tube.

[0016] By adopting the above technical solution, the arrangement of the circular tube, rotating shaft and impeller allows the hot air to simultaneously push the water flow in the middle of the heat-conducting plate upward during the circulation process, thereby enabling the water flow between the heat-conducting plates to circulate and enhancing the heat exchange rate between the heat-conducting plates and the water.

[0017] Preferably, the cooling mechanism includes a plurality of heat-conducting sheets, which are equidistantly fixedly disposed on the other side of the heat insulation plate, and each heat-conducting sheet is fixedly connected to the inner wall of the water storage tank and the cooling surface of the semiconductor refrigeration plate, and the heat-conducting sheets are provided with honeycomb-shaped holes.

[0018] By adopting the above technical solution, the heat-conducting sheet with honeycomb-shaped holes can increase the contact area between the airflow and the cooling surface of the semiconductor refrigeration plate, and enhance the heat exchange rate between the airflow and the cooling surface of the semiconductor refrigeration plate.

[0019] Preferably, a number of pressure relief valves are fixedly installed at equal intervals at the bottom of the heat insulation plate, and each pressure relief valve is located below the semiconductor cooling plate.

[0020] By adopting the above technical solution, the pressure relief valve allows excess water in the lower temperature space inside the water storage tank to flow into the other side of the water storage tank, thereby reusing the evaporated water vapor and reducing the water consumption of the device.

[0021] Preferably, the demolding mechanism includes several springs, and several T-shaped grooves are equidistantly provided at the middle position of the inner bottom wall of the mold. Push rods with I-shaped cross-sections slide through the grooves, and the two ends of the springs are fixedly connected to the corresponding push rods and the inner bottom wall of the corresponding grooves, respectively.

[0022] By adopting the above technical solution, the setting of the slide and push rod can constrain and limit the cured epoxy resin by the middle position of the cured epoxy resin, so that the cured epoxy resin is always located in the middle position inside the mold.

[0023] Preferably, a plurality of circular grooves are fixedly inserted into the inner wall of the opening of the slide groove, and a hemispherical groove is opened on the outer peripheral wall of the push rod at the position corresponding to the circular groove. An elastic block with a hemispherical shape is fixedly inserted into the circular groove, and the interior of the elastic block is hollow and filled with a filling liquid.

[0024] By adopting the above technical solution, the arrangement of the spring, elastic block and hemispherical groove can apply an upward thrust to the epoxy resin during the cooling process of the cured epoxy resin.

[0025] Compared with the prior art, the beneficial effects of the present invention are: the improved epoxy resin processing curing device has stable heating intensity and fast rate for epoxy resin, and will not cause the temperature of some parts of the mold to be too high. After the epoxy resin is scratched, it can automatically complete the demolding process between most of the cured epoxy resin and the inner wall of the mold. After the epoxy resin curing operation is completed, the temperature of the mold and the cured epoxy resin is low. The operator's material handling and subsequent operations are highly safe. The device has a simple structure and low energy and water consumption. The specific details are as follows.

[0026] Equipped with heating, cooling, and demolding mechanisms, the epoxy resin curing process utilizes the combined action of an insulated chamber, mold, and heating mechanism. Gas simultaneously heats both the mold and epoxy resin from multiple points, ensuring stable heating intensity across the mold and preventing overheating in any area. The heating and demolding mechanisms maintain the flatness of the mold's bottom surface. The cooling and heating mechanisms also recover moisture from the system and rehydrate it for reuse, reducing the temperature of the cured epoxy resin. This cooling deformation decreases the adhesion between the cured epoxy resin and the mold's inner wall. When the operator removes the cured epoxy resin, the low temperature of both the mold and the resin ensures high operator safety. The combined heating, cooling, and demolding mechanisms automatically separate the cured epoxy resin from the lower mold's inner wall after curing, allowing for easy removal of the cured epoxy resin from the mold. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall invention;

[0028] Figure 2 This is a schematic diagram of the internal structure of the heat insulation box of the present invention;

[0029] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point A;

[0030] Figure 4 This is a schematic diagram of the internal structure of the water storage tank of the present invention;

[0031] Figure 5 For the present invention Figure 4 Enlarged structural diagram at point B;

[0032] Figure 6 This is a schematic diagram of the internal structure of the mold of the present invention;

[0033] Figure 7 For the present invention Figure 6 Enlarged structural diagram at point C;

[0034] Figure 8 For the present invention Figure 7 A magnified structural diagram at point D.

[0035] In the diagram: 1. Insulation box; 2. Mesh plate; 3. Heating mechanism; 31. Water storage tank; 32. Insulation plate; 33. Semiconductor cooling plate; 34. Three-way valve; 35. Heat-conducting plate; 36. Air pump; 37. Connecting pipe; 38. One-way valve; 39. Conduit; 310. Round pipe; 311. Rotating shaft; 312. Impeller; 313. Support frame; 4. Cooling mechanism; 41. Heat-conducting plate; 42. Pressure limiting valve; 5. Demolding mechanism; 51. Slide groove; 52. Push rod; 53. Spring; 54. Round groove; 55. Hemispherical groove; 56. Elastic block; 7. Mold. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Please see Figure 1 , Figure 2 , Figure 6 , Figure 7 and Figure 8This invention provides a technical solution: a temperature-adjustable epoxy resin curing device, comprising an insulated box 1, which is mainly divided into a box body and a cover. The cover is fixed to the opening of the box body by bolts to seal the opening. The cover is made of vacuum-insulated tempered glass, and the box body is made of vacuum-insulated plate 32. The water storage tank 31 is also made of vacuum-insulated plate 32. The device further comprises: a plurality of mesh plates 2, which are equidistantly fixedly installed in the insulated box 1. The mesh plates 2 are provided with a plurality of molds 7, which are divided into an upper mold and a lower mold. The upper mold slides through the opening of the lower mold. The mold 7 is provided with a demolding mechanism 5, which performs demolding treatment on the cured epoxy resin. The demolding mechanism 5 includes several springs 53. Several T-shaped grooves 51 are equidistantly spaced at the center of the bottom wall of the mold 7. Push rods 52 with I-shaped cross-sections slide through the grooves 51. The two ends of the springs 53 are fixedly connected to the corresponding push rods 52 and the inner bottom wall of the corresponding grooves 51, respectively. After the bottom of the push rod 52 retracts into the corresponding groove 51, the arc-shaped end of the elastic block 56 inserts into the corresponding hemispherical groove 55. The outer peripheral wall of the push rod 52 is flush with the opening of the groove 51. A sealing ring is fitted at the junction of the inner walls of the groove 51 and on the outer periphery of the push rod 52 to ensure there is no gap between the push rod 52 and the inner wall of the groove 51. Several circular grooves 54 are fixedly inserted on the inner wall of the groove 51. A hemispherical groove 55 is formed on the outer periphery of the push rod 52 at the position corresponding to the circular grooves 54. A hemispherical elastic block 56 is fixedly inserted in the circular groove 54. The elastic block 56 is hollow and filled with a filling liquid. The elastic block 56 is made of elastic plastic. The arrangement of the groove 51 and the push rod 52 can constrain and limit the cured epoxy resin at the middle position. The arrangement of the spring 53, the elastic block 56 and the hemispherical groove 55 can apply an upward thrust to the epoxy resin during the cooling process of the cured epoxy resin.

[0038] according to Figure 1-5As shown, heating mechanism 3 is installed on the side wall of the heat insulation box 1, and heating mechanism 3 performs epoxy resin heating treatment. Heating mechanism 3 includes a water storage tank 31, a water supply pipe is fixedly installed on the side wall of water storage tank 31, and the water inlet of the water supply pipe is connected to an external water supply device to maintain the water storage in water storage tank 31. Water storage tank 31 is fixedly installed on the side wall of heat insulation box 1. Heat insulation plate 32 is fixedly installed in the middle position of water storage tank 31. Semiconductor cooling plate 33 is fixedly installed in heat insulation plate 32. Two three-way valves 34 are fixedly installed on the upper and lower sides of water storage tank 31, and each three-way valve 34 is located at two openings in water storage tank 31. The ends are located on both sides of the heat insulation plate 32. The three-way valve 34 is an electrically controlled three-way valve 34. Several heat-conducting plates 35 are fixedly installed at equal intervals on one side of the heat insulation plate 32, and each heat-conducting plate 35 is fixedly connected to the inner wall of the water storage tank 31 and the heat dissipation surface of the semiconductor cooling plate 33. The heat-conducting plates 35 have honeycomb-shaped holes, and the holes are located outside the heat insulation plate 32. An air pump 36 is fixedly installed at the center of the top side of the heat insulation box 1, and the air inlet end of the air pump 36 is inserted into the heat insulation box 1 and fixedly connected to the box wall of the heat insulation box 1. The water storage tank A control unit is fixedly installed on the rear side of the water tank 31 to control the operation of the three-way valve 34, the air pump 36, and the semiconductor cooling plate 33. The exhaust end of the air pump 36 is connected to the air inlet end of the lower three-way valve 34 through a connecting pipe 37. A one-way valve 38 is fixedly installed on the outer wall of the bottom of the heat insulation box 1, and the one-way valve 38 is located below the water storage tank 31. The air inlet end of the one-way valve 38 is connected to the exhaust end of the upper three-way valve 34 through a conduit 39. A circular tube 310 is fixedly installed at the center of several heat-conducting plates 35. A rotating shaft 311 is inserted through the top opening of the circular tube 310, and the top of the rotating shaft 311 is inserted into the air inlet corresponding to the upper three-way valve 34. Impellers 312 are fixedly installed at both ends of the rotating shaft 311. A support frame 313 is provided at the middle position of the outer circumference of the rotating shaft 311. The support frame 313 is composed of a sleeve and several support rods, and the several support rods are fixedly installed in a circumferential array on the outer circumference of the sleeve. The bottom end of the support rod is fixedly connected to the circular tube 310. The sleeve is rotated and sleeved on the outer circumference of the rotating shaft 311 through a bearing. The three-way valve 34 and the heat insulation plate 32 can divide the water storage tank 31 into two independent flow spaces, allowing the airflow to perform cooling and heating operations separately in the water storage tank 31. The heat-conducting plate 35 with honeycomb-shaped holes can increase the contact area between the airflow and the heat dissipation surface of the semiconductor cooling plate 33. The one-way valve 38, the three-way valve 34, the connecting pipe 37 and the conduit 39 can form an internal gas circulation within the device. The arrangement of the round pipe 310, the rotating shaft 311 and the impeller 312 allows the hot air to push the water flow in the middle of the heat-conducting plate 35 upwards during the circulation process, thereby making the water flow between the heat-conducting plates 35 circulate.

[0039] according to Figure 1 , Figure 2 and Figure 4As shown, the heating mechanism 3 is equipped with a cooling mechanism 4, which performs a cooling treatment on the epoxy resin. The cooling mechanism 4 includes several heat-conducting plates 41, which are equidistantly fixedly installed on the other side of the heat insulation plate 32. Each heat-conducting plate 41 is fixedly connected to the inner wall of the water storage tank 31 and the cooling surface of the semiconductor refrigeration plate 33. The heat-conducting plates 41 have honeycomb-shaped holes located outside the heat insulation plate 32. Several pressure-limiting valves 42 are equidistantly fixedly installed at the bottom of the heat insulation plate 32, and each pressure-limiting valve 42 is located below the semiconductor refrigeration plate 33. The heat-conducting plates 41 with honeycomb-shaped holes can increase the contact area between the airflow and the cooling surface of the semiconductor refrigeration plate 33. The pressure-limiting valves 42 allow excess water in the lower-temperature space inside the water storage tank 31 to flow into the other side of the water storage tank 31, thereby reusing the evaporated water vapor.

[0040] Example 1: When using mold 7 to cure epoxy resin, first unscrew the bolts inside the cover and pull the cover out from the opening of the box. Then take mold 7 out of the heat insulation box 1 and inject an appropriate amount of epoxy resin and epoxy resin mixture into mold 7. Then place mold 7 on the mesh plate 2 inside the heat insulation box 1. Finally, reinsert the cover into the opening of the box and fix it with bolts. The epoxy resin feeding operation is completed.

[0041] After the epoxy resin loading operation is completed, the semiconductor cooling plate 33 is activated, and then heat is transferred to the water on one side of the water storage tank 31 through the heat conduction plate 35 to heat the water on one side of the water storage tank 31, so that the water on one side of the water storage tank 31 is maintained within a relatively stable range. Then, the air pump 36 is activated to extract the gas in the heat insulation box 1 and introduce it into the three-way valve 34 above through the connecting pipe 37. Then, it is injected into the hot water in the water storage tank 31 from the bottom. When the airflow passes through the hot water, it is repeatedly divided into several small streams of gas due to the obstruction of the heat conduction plate 35. When the gas flows into full contact with hot water, a small amount of impurities mixed in the gas flow are trapped in the hot water due to adsorption. At the same time, the gas exchanges heat with the hot water, and the temperature of the gas rises. The heated gas flow emerges from the water and is guided into the insulation box 1 by the conduit 39 and the one-way valve 38. The gas flow is repeatedly subjected to heating treatment of a specific intensity according to the above-mentioned circulating flow, thereby increasing the temperature and humidity inside the insulation box 1. Finally, the epoxy resin exchanges heat with the hot air inside the insulation box 1 through the mold 7 for a long time, thereby continuously subjecting the epoxy resin to heating treatment of a specific intensity from multiple locations at the same time.

[0042] It should be noted that during the process of hot air entering the upper three-way valve 34, it blows onto the upper impeller 312 and drives the lower impeller 312 to rotate through the rotating shaft 311, pushing the water at the top of the round tube 310 upward, pushing the water in the top of the round tube 310 out of the round tube 310, and then falling back into the hot water after passing through the gap between the support rods. At the same time, it pulls the water at the bottom of the round tube 310 upward to replenish the water lost at the top of the round tube 310. Meanwhile, the hot water at the bottom is pulled into the bottom of the round tube 310 by the negative pressure inside the round tube 310 to replenish the water lost at the bottom of the round tube 310. This causes the hot water on one side of the water storage tank 31 to circulate, so that the hot water continuously passes through the holes of the heat conduction plate 35, so that each part of the hot water is in full contact with the heat conduction plate 35, and heat exchange between the hot water and the heat conduction plate 35 is carried out quickly.

[0043] Example 2: As shown in Example 1, when heating one side of the water storage tank 31, the water on the other side of the water storage tank 31 exchanges heat with the cooling surface of the semiconductor cooling plate 33 through the heat-conducting plate 41, thereby continuously absorbing heat from the water on the other side of the water storage tank 31, keeping the water on the other side of the water storage tank 31 at a low temperature. After the epoxy resin is cured, the control host controls the three-way valve 34 to change the internal gas flow trajectory. The circulating gas is injected into the other side of the heat insulation plate 32, and is repeatedly diverted due to the obstruction of the heat-conducting plate 41. During the process of the gas passing through the low-temperature water in the water storage tank 31, the airflow exchanges heat with the low-temperature water, causing the gas temperature to decrease and the temperature of the environment inside the heat insulation box 1 to be lowered. At the same time, the temperature of the mold 7 and the cured epoxy resin is also reduced. Due to the principle of thermal expansion and contraction, a certain degree of separation occurs between the part of the cured epoxy resin and the inner wall of the mold 7, and the adhesion between the cured epoxy resin and the inner wall of the mold 7 is greatly reduced.

[0044] It should be noted that during the airflow cooling process, the water vapor in the airflow recondenses into water in the cold water for recycling and reuse. As the cold water level rises, some water flows into the hot water through the pressure relief valve 42 to replenish the water on one side of the water storage tank 31 and at the same time lower the temperature of the hot water, so that the hot water can continuously absorb the heat on the heat dissipation surface of the semiconductor cooling plate 33, continuously perform heat dissipation treatment of the semiconductor cooling plate 33, and store the heat dissipated from the heat dissipation surface of the semiconductor cooling plate 33.

[0045] In Example 3, as shown in Examples 1 and 2, before the epoxy resin feeding operation, the air pump 36 and the semiconductor cooling plate 33 are started to preheat the mold 7 to a certain extent. At this time, the filling liquid in the elastic block 56 partially vaporizes due to absorbing the heat on the mold 7, thereby increasing the pressure in the elastic block 56.

[0046] After removing the mold 7 from the heat insulation box 1, press down on the push rod 52 so that the elastic block 56 is inserted into the corresponding hemispherical shell. Due to the mutual contact between the elastic block 56 and the inner wall of the hemispherical shell, the bottom of the push rod 52 can be constrained and limited in the slide groove 51. At this time, the epoxy resin mixture solution can be poured into the mold 7 to complete the epoxy resin feeding operation.

[0047] It should be noted that during the heating and curing of epoxy resin, most of the filling liquid in the elastic block 56 vaporizes, thereby further enhancing the contact force between the elastic block 56 and the inner wall of the hemispherical groove 55, thus enhancing the constraint and limiting effect of the push rod 52.

[0048] During the cooling process of the cured epoxy resin, as the temperature of the mold 7 decreases, the water vapor in the elastic block 56 gradually condenses into liquid, which reduces the pressure in the elastic block 56. Consequently, the constraint force of the elastic block 56 on the push rod 52 continues to decrease. At this time, the spring 53 pushes the push rod 52 out of the slide groove 51 and pushes the cured epoxy resin into the mold 7 through the elastic rod.

[0049] During the process of the epoxy resin shrinking and deforming as the temperature decreases, the epoxy resin remains in the middle position inside the mold 7 due to the mutual contact between the push rod 52 and the epoxy resin. This causes the epoxy resin to separate slightly from the inner wall of the mold 7. With the push rod 52 pushing the epoxy resin, the bottom side of the epoxy resin can be slightly separated from the bottom surface of the mold 7.

[0050] It should be noted that when the spring 53 pushes the push rod 52, the elastic block 56 and the inner arc wall of the hemispherical groove 55 abut against each other. At this time, the elastic block 56 contracts and deforms into the circular groove 54, automatically releasing the constraint limit state of the push rod 52.

[0051] Working principle: The epoxy resin is cured according to Examples 1, 2 and 3. After the epoxy resin curing is completed, the mold 7 is taken out from the heat insulation box 1, and the upper mold is taken out from the opening of the lower mold so that the cured epoxy resin can be taken out from the lower mold together. At this time, the cured epoxy resin is directly exposed to the outside world, and the operator can easily remove it from the upper mold.

[0052] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0053] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A temperature-adjustable curing apparatus for epoxy resin processing, comprising an insulated chamber (1); Its features are, Also includes: A number of mesh plates (2) are fixedly installed at equal intervals in the heat insulation box (1). A number of molds (7) are provided on the mesh plates (2). A demolding mechanism (5) is provided in the molds (7), and the demolding mechanism (5) performs demolding treatment on the cured epoxy resin. Heating mechanism (3), the heating mechanism (3) is located on the side wall of the heat insulation box (1), and the heating mechanism (3) performs heating treatment of epoxy resin. The heating mechanism (3) is provided with a cooling mechanism (4), and the cooling mechanism (4) performs cooling treatment of epoxy resin. The heating mechanism (3) includes a water storage tank (31), which is fixedly installed on the side wall of the heat insulation box (1). A heat insulation plate (32) is fixedly installed in the middle position of the water storage tank (31). A semiconductor cooling plate (33) is fixedly installed in the heat insulation plate (32). Two three-way valves (34) are fixedly installed on the upper and lower sides of the water storage tank (31), and the two open ends of each three-way valve (34) in the water storage tank (31) are located on both sides of the heat insulation plate (32). The cooling mechanism (4) includes several heat-conducting sheets (41), which are fixedly installed at equal intervals on the other side of the heat insulation plate (32). Each heat-conducting sheet (41) is fixedly connected to the inner wall of the water storage tank (31) and the cooling surface of the semiconductor cooling plate (33). The heat-conducting sheet (41) has honeycomb-shaped holes. The demolding mechanism (5) includes several springs (53). Several T-shaped grooves (51) are equidistantly provided at the middle position of the inner bottom wall of the mold (7). Push rods (52) with I-shaped cross-sections slide through the grooves (51). The two ends of the springs (53) are fixedly connected to the corresponding push rods (52) and the inner bottom wall of the corresponding grooves (51), respectively. The inner wall of the opening of the slide (51) is provided with several circular grooves (54) fixedly inserted. The outer peripheral wall of the push rod (52) is provided with a hemispherical groove (55) at the position corresponding to the circular grooves (54). An elastic block (56) in the shape of a hemispherical is fixedly inserted in the circular groove (54), and the interior of the elastic block (56) is hollow. The interior of the elastic block (56) is filled with filling liquid.

2. The temperature-adjustable curing apparatus for epoxy resin processing according to claim 1, characterized in that: A number of heat-conducting plates (35) are fixedly inserted at equal intervals on one side of the heat insulation plate (32), and each heat-conducting plate (35) is fixedly connected to the inner wall of the water storage tank (31) and the heat dissipation surface of the semiconductor cooling plate (33). The heat-conducting plate (35) has honeycomb-shaped holes. An air pump (36) is fixedly installed at the center of the top side of the heat insulation box (1), and the air inlet end of the air pump (36) is inserted into the heat insulation box (1) and fixedly connected to the box wall of the heat insulation box (1). The exhaust end of the air pump (36) is connected to the air inlet end of the three-way valve (34) below through the connecting pipe (37).

3. The temperature-adjustable curing apparatus for epoxy resin processing according to claim 2, characterized in that: A one-way valve (38) is fixedly installed on the outer wall of the bottom of the heat insulation box (1), and the one-way valve (38) is located below the water storage tank (31). The air inlet of the one-way valve (38) is connected to the exhaust end of the three-way valve (34) above through the conduit (39).

4. The temperature-adjustable curing apparatus for epoxy resin processing according to claim 3, characterized in that: A circular tube (310) is fixedly inserted through the center of several heat-conducting plates (35). A rotating shaft (311) is inserted through the top opening of the circular tube (310), and the top of the rotating shaft (311) is inserted into the air inlet corresponding to the upper three-way valve (34). Impellers (312) are fixedly installed at both ends of the rotating shaft (311). A support frame (313) is rotatably sleeved at the middle position of the outer periphery of the rotating shaft (311) through a bearing, and the support frame (313) is fixedly connected to the circular tube (310).

5. The temperature-adjustable curing apparatus for epoxy resin processing according to claim 4, characterized in that: Several pressure relief valves (42) are fixedly installed at equal intervals at the bottom of the heat insulation plate (32), and each pressure relief valve (42) is located below the semiconductor cooling plate (33).

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