Method for etching aluminum foil with aluminum foil etching solution, aluminum substrate pcb and etching method thereof

Abstract

This invention provides a method for etching aluminum foil with an aluminum foil etching solution, an aluminum substrate PCB, and the etching method thereof. The aluminum foil etching solution comprises ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagents, and water. The aluminum foil etching solution proposed in this invention is mainly composed of ferric chloride and water, with the addition of hydrochloric acid and alcohol solutions. The etched aluminum foil pattern is complete, with uniform and smooth lines. The etching time is short and the efficiency is high, overcoming the shortcomings of existing aluminum foil etching solutions, such as difficulty in controlling the size, uneven etching depth, high roughness of the etched lines, and long etching time.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, and in particular to a method for etching aluminum foil with an aluminum foil etching solution, an aluminum substrate PCB, and the etching method thereof. Background Technology

[0002] Aluminum-based PCBs have excellent heat dissipation performance, are lightweight and flexible, and have excellent durability. They are widely used in industries such as high-power LED environmental lighting, power, electronics, communications, medical equipment, machinery, and new energy batteries.

[0003] Traditional aluminum-based PCB etching solutions often suffer from drawbacks such as difficulty in controlling the size of the aluminum foil, uneven etching depth, high roughness of the etched circuits, and long etching time.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] This invention provides a method for etching aluminum foil with an aluminum foil etching solution, an aluminum substrate PCB and the etching method thereof, aiming to solve the technical problems mentioned in the background section of the prior art for aluminum foil etching solutions.

[0006] The contents of this invention are as follows: The first aspect of the present invention provides an aluminum foil etching solution comprising ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagents and water.

[0007] In an optional embodiment of the first aspect of the present invention, the alcohol reagent includes one or more of xylitol, sorbitol, 2-ethylhexanol, 1-hexadecyl alcohol, ethylene glycol, 1-chloro-2-propanol, methyl isobutylmethanol, propylene glycol, glycerol, butanediol, methanol, ethanol, propanol, isopropanol, butanol, isobutanol, sec-butanol, and tert-butanol.

[0008] In an optional embodiment of the first aspect of the present invention, the mixture comprises, by mass fraction, 5-50 parts ferric chloride, 0-10 parts cerium ammonium nitrate, 0-20 parts hydrochloric acid, 0-90 parts alcohol reagent and 0-90 parts water.

[0009] In an optional embodiment of the first aspect of the present invention, the mixture comprises, by mass fraction, 20 parts ferric chloride, 5 parts cerium ammonium nitrate, 3 parts hydrochloric acid, 36 parts alcohol reagent and 36 parts water.

[0010] A second aspect of the present invention provides a method for preparing an aluminum foil etching solution, comprising: providing ferric chloride, cerium ammonium nitrate, hydrochloric acid, an alcohol reagent, and water; and mixing the ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagent, and water evenly to obtain the aluminum foil etching solution. A third aspect of the present invention provides an etching method for an aluminum substrate PCB, comprising the following steps: Provide ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagents, and water; Ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagents and water are mixed evenly to obtain aluminum foil etching solution; The developed aluminum substrate PCB is etched using the aluminum foil etching solution to obtain a patterned aluminum substrate PCB. In an optional embodiment of the third aspect of the present invention, the etching of the developed aluminum substrate PCB by the aluminum foil etching solution is performed at room temperature for 5-8 minutes.

[0011] In an optional embodiment of the third aspect of the present invention, the etching of the developed aluminum substrate PCB by the aluminum foil etching solution is performed under heating conditions, and the etching time is 20-40 seconds. In an optional embodiment of the third aspect of the present invention, the heating conditions are 30-60°C.

[0012] The fourth aspect of the present invention provides an aluminum substrate PCB, which is manufactured by the etching method of any of the above-described aluminum substrate PCBs.

[0013] Beneficial Effects: This invention provides a method for etching aluminum foil with an aluminum foil etching solution, an aluminum substrate PCB, and the etching method thereof. The aluminum foil etching solution comprises ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagents, and water. The aluminum foil etching solution proposed in this invention is mainly composed of ferric chloride and water, with the addition of hydrochloric acid and alcohol solutions. The etched aluminum foil pattern is complete, with uniform and smooth lines. The etching time is short and the efficiency is high, overcoming the shortcomings of existing aluminum foil etching solutions, such as difficulty in controlling the size, uneven etching depth, high roughness of the etched lines, and long etching time. Attached Figure Description

[0014] Figure 1 This is a physical diagram of the circuit structure of the aluminum substrate PCB prepared in Example 1 of the present invention.

[0015] Figure 2 This is a physical diagram of the circuit structure of the aluminum substrate PCB prepared in Example 2 of the present invention. Detailed Implementation

[0016] To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the invention.

[0017] A first aspect of the present invention provides an aluminum foil etching solution comprising ferric chloride, ceric ammonium nitrate, hydrochloric acid, an alcohol reagent, and water. In an optional embodiment of the first aspect of the present invention, the solution comprises, by mass fraction, 5-50 parts ferric chloride, 0-10 parts ceric ammonium nitrate, 0-20 parts hydrochloric acid, 0-90 parts alcohol reagent, and 0-90 parts water. More specifically, in an optional embodiment of the first aspect of the present invention, the solution comprises, by mass fraction, 20 parts ferric chloride, 5 parts ceric ammonium nitrate, 3 parts hydrochloric acid, 36 parts alcohol reagent, and 36 parts water.

[0018] In an optional embodiment of the first aspect of the present invention, the alcohol reagent includes one or more of xylitol, sorbitol, 2-ethylhexanol, 1-hexadecyl alcohol, ethylene glycol, 1-chloro-2-propanol, methyl isobutyl methanol, propylene glycol, glycerol, butanediol, methanol, ethanol, propanol, isopropanol, butanol, isobutanol, sec-butanol, and tert-butanol. In the present invention, exemplarily, the alcohol reagent is a polyol such as sorbitol, and the polyol can also act as a surfactant to further improve the etching effect.

[0019] A second aspect of the present invention provides a method for preparing an aluminum foil etching solution, comprising: providing ferric chloride, cerium ammonium nitrate, hydrochloric acid, an alcohol reagent, and water; and mixing the ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagent, and water evenly to obtain the aluminum foil etching solution. A third aspect of the present invention provides an etching method for an aluminum substrate PCB, comprising the following steps: Provides ferric chloride, ceric ammonium nitrate, hydrochloric acid, alcohol reagents and water; exemplary, by mass fraction, it includes 5-50 parts ferric chloride, 0-10 parts ceric ammonium nitrate, 0-20 parts hydrochloric acid, 0-90 parts alcohol reagents and 0-90 parts water; Ferric chloride, ceric ammonium nitrate, hydrochloric acid, alcohol reagent, and water are mixed evenly to obtain an aluminum foil etching solution. In an optional embodiment of the present invention, the order of adding ferric chloride, ceric ammonium nitrate, hydrochloric acid, alcohol reagent, and water may be to add ferric chloride and water first, followed by ceric ammonium nitrate, hydrochloric acid, and alcohol reagent in sequence. The developed aluminum substrate PCB is etched using the aluminum foil etching solution to obtain a patterned aluminum substrate PCB. In an optional embodiment of the third aspect of the present invention, the etching of the developed aluminum substrate PCB using the aluminum foil etching solution is performed at room temperature for 5-8 minutes; or the etching of the developed aluminum substrate PCB using the aluminum foil etching solution is performed under heating conditions for 20-40 seconds, wherein the heating conditions are 30-60°C.

[0020] A fourth aspect of this invention provides an aluminum substrate PCB, which is manufactured by the etching method described in any of the preceding claims. To better illustrate the effects of the technical solution of this invention, the following embodiments and comparative examples are provided for etching effect testing.

[0021] Example 1: The etching solution comprises 20 parts ferric chloride, 5 parts cerium ammonium nitrate, 3 parts hydrochloric acid, 36 parts sorbitol, and 36 parts water. The mixture is homogeneous, and the developed aluminum foil pattern is etched at room temperature for 5 minutes. The aluminum foil lines are complete, uniform, and have smooth, flat edges. Figure 1 As shown.

[0022] Example 2: The etching solution comprises 20 parts ferric chloride, 5 parts cerium ammonium nitrate, 3 parts hydrochloric acid, 36 parts sorbitol, and 36 parts water. The mixture is homogeneous and used to etch the developed aluminum foil pattern at 50°C for 20 seconds. The resulting aluminum foil pattern is complete and uniform, with smooth and flat line edges. Figure 2 As shown.

[0023] Comparative Example 1: The etching solution included 20 parts cerium nitrate, 3 parts hydrochloric acid, and 77 parts water, which were mixed evenly to form a cerium ammonium nitrate mixed solution. The developed aluminum foil pattern was etched at 50°C for 20 minutes. No corrosion was produced on the aluminum foil, and a passivation layer was formed on the surface of the aluminum foil.

[0024] Comparative Example 2: The etching solution contained 40 parts ferric chloride, 5 parts cerium ammonium nitrate, 3 parts hydrochloric acid, and 52 parts water. The mixture was homogeneous and etched the pattern on the developed aluminum foil at 50°C for 20 seconds. The aluminum foil pattern was complete, but the lines were uneven and the edges were rough.

[0025] Comparative Example 3: The etching solution comprised 40 parts ferric chloride, 5 parts cerium ammonium nitrate, 2 parts hydrochloric acid, and 52 parts alcohol reagent. After thorough mixing, the solution was used to etch the developed aluminum foil pattern at 50°C for 20 minutes. No corrosion was observed on the aluminum foil, and a passivation layer formed on the surface. The formulation parameters and results of each embodiment and comparative example are shown in Table 1 below. Table 1. Formulation parameters and etching effects of various embodiments and comparative examples.

[0026] See Figure 1 and Figure 2 It is easy to see that the pattern structure of the aluminum substrate PCB etched in Embodiments 1 and 2 of the present invention has a complete aluminum foil pattern and uniform and smooth lines.

[0027] In summary, this invention provides a method for etching aluminum foil with an aluminum foil etching solution, an aluminum substrate PCB, and the etching method thereof. The aluminum foil etching solution comprises ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagents, and water. The aluminum foil etching solution proposed in this invention is primarily composed of ferric chloride and water, with the addition of hydrochloric acid and alcohol solutions. This results in complete etched aluminum foil patterns, uniform and smooth lines, and a short etching time with high efficiency. It overcomes the shortcomings of existing aluminum foil etching solutions, such as difficulty in controlling dimensions, uneven etching depth, high post-etching line roughness, and long etching time.

[0028] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for etching aluminum foil with an aluminum foil etching solution, characterized in that, By mass, the content is 5-50 parts ferric chloride, 5-10 parts cerium ammonium nitrate, 3-20 parts hydrochloric acid, 36-90 parts alcohol reagents and 36-90 parts water; The alcohol reagents include one or more of xylitol, sorbitol, 2-ethylhexanol, 1-hexadecyl alcohol, ethylene glycol, 1-chloro-2-propanol, methyl isobutyl methanol, propylene glycol, glycerol, butanediol, methanol, ethanol, propanol, isopropanol, butanol, isobutanol, sec-butanol, and tert-butanol. The etching can be performed at room temperature for 5-8 minutes, or under heating conditions for 20-40 seconds at 30-60°C.

2. The method for etching aluminum foil with the aluminum foil etching solution according to claim 1, characterized in that, By weight, it includes 20 parts ferric chloride, 5 parts cerium ammonium nitrate, 3 parts hydrochloric acid, 36 parts alcohol reagents, and 36 parts water.

3. The method for etching aluminum foil with the aluminum foil etching solution according to claim 1, characterized in that, include: The ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagent and water are mixed evenly to obtain aluminum foil etching solution.

4. An etching method for an aluminum substrate PCB, comprising etching aluminum foil using the aluminum foil etching solution described in claim 1, characterized in that, Includes the following steps: The ferric chloride, cerium ammonium nitrate, hydrochloric acid, alcohol reagent and water are mixed evenly to obtain aluminum foil etching solution; The developed aluminum substrate PCB is etched using the aluminum foil etching solution to obtain a patterned aluminum substrate PCB.

5. The etching method for aluminum substrate PCB according to claim 4, characterized in that, The aluminum substrate PCB after development is etched using the aluminum foil etching solution at room temperature for 5-8 minutes.

6. The etching method for aluminum substrate PCB according to claim 4, characterized in that, The etching of the developed aluminum substrate PCB using the aluminum foil etching solution is performed under heating conditions, and the etching time is 20-40 seconds.

7. The etching method for aluminum substrate PCB according to claim 6, characterized in that, The heating conditions are 30-60℃.

8. An aluminum-based PCB, characterized in that, The aluminum substrate PCB is manufactured by the etching method of any one of claims 4-7.

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