Heat dissipation structure and electronic devices

Abstract

This invention discloses a heat dissipation structure and electronic device, belonging to the field of electronic device technology, including a housing, a heat-conducting plate, and a thin film. The housing includes a wall surface, which includes a receiving groove, a supporting surface, and an inclined surface. The receiving groove is recessed into the supporting surface, and the inclined surface is connected to the supporting surface and located on one side of the receiving groove. The heat-conducting plate is disposed in the receiving groove, and its surface is flush with the surface of the supporting surface. The thin film covers the supporting surface, the heat-conducting plate, and the inclined surface. By inserting a pluggable heat source into the housing of the heat dissipation structure, heat dissipation is directly achieved through the heat-conducting plate, improving the heat dissipation effect. Furthermore, the inclined surface on the housing can guide the pluggable heat source into the housing. In addition, the thin film on the housing can further assist in the effortless insertion of the pluggable heat source into the housing.

Description

Technical Field

[0001] This invention relates to the field of electronic device technology, and more particularly to heat dissipation structures and electronic devices. Background Technology

[0002] With the widespread use of electronic devices, users' demands for these devices are also increasing. Therefore, electronic devices are often equipped with expansion ports, allowing users to connect additional electronic components as needed. To facilitate user expansion, these components are usually configured with pluggable connections, making it easy for users to expand or remove them.

[0003] However, to ensure smooth insertion and removal of pluggable electronic components, gaps are usually reserved in the space within electronic devices for these components to allow for easy insertion. However, after the pluggable components are inserted, the gaps around them become air layers, which have high thermal resistance, leading to poor heat dissipation and requiring improvement. Summary of the Invention

[0004] The purpose of this invention is to provide a heat dissipation structure and electronic device that facilitates pluggable heat source connection, has a stable and reliable structure, and can effectively dissipate heat from pluggable heat sources.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] This invention provides a heat dissipation structure, comprising:

[0007] The housing includes a wall surface, which includes a receiving groove, a supporting surface, and an inclined surface. The receiving groove is recessed in the supporting surface, and the inclined surface is connected to the supporting surface and located on one side of the receiving groove.

[0008] A heat-conducting sheet is disposed in the receiving groove, and the surface of the heat-conducting sheet is flush with the surface of the supporting surface;

[0009] A thin film covering the support surface, the heat-conducting sheet, and the inclined surface.

[0010] Optionally, the heat-conducting sheet has a first thickness, and the film has a second thickness, which is 10 to 35% of the first thickness.

[0011] Optionally, the coefficient of friction of the thin film is less than that of the heat-conducting sheet.

[0012] Optionally, the coefficient of friction of the film is less than the coefficient of friction of the supporting surface.

[0013] Alternatively, the film may be made of polyethylene or polytetrafluoroethylene.

[0014] Optionally, the first direction is perpendicular to the support surface, the receiving groove has a groove bottom surface, the inclined surface has a first end and a second end, the first end is connected to the support surface, and in the first direction, the second end is farther away from the support surface than the groove bottom surface.

[0015] Optionally, the housing also has an interface, with the second end of the inclined surface closer to the interface than the first end.

[0016] Optionally, the direction perpendicular to the first direction is the second direction, in which the support surface has a first length between the receiving groove and the inclined surface, and the inclined surface has a second length between the first end and the second end, the second length being greater than the first length.

[0017] Optionally, the supporting surface and the inclined surface have a connection angle at the first end, and the connection angle is an obtuse angle.

[0018] Optionally, the wall surface further includes an extension surface that connects to the inclined surface, the slope of the extension surface being greater than the slope of the inclined surface.

[0019] This invention provides an electronic device, comprising:

[0020] The housing includes a wall surface, which includes a receiving groove, a supporting surface, and an inclined surface. The receiving groove is recessed in the supporting surface, and the inclined surface is connected to the supporting surface and located on one side of the receiving groove.

[0021] A heat-conducting sheet is disposed in the receiving groove, and the surface of the heat-conducting sheet is flush with the surface of the supporting surface;

[0022] A thin film covering the support surface, the heat-conducting sheet, and the inclined surface;

[0023] A pluggable heat source is disposed on the membrane.

[0024] Optionally, the housing also has an interface through which the pluggable heat source slides into the housing.

[0025] Optionally, the electronic device also includes a main unit, with the housing disposed on one side surface of the main unit.

[0026] This invention provides an electronic device, comprising:

[0027] The housing includes a wall surface, which includes a receiving groove, a supporting surface, and an inclined surface. The receiving groove is recessed in the supporting surface, and the inclined surface is connected to the supporting surface and located on one side of the receiving groove.

[0028] A heat-conducting sheet is disposed in the receiving groove, and the surface of the heat-conducting sheet is flush with the surface of the supporting surface;

[0029] A pluggable heat source is disposed on the support surface and the heat-conducting plate.

[0030] Optionally, the housing further includes a sidewall that surrounds the periphery of the wall surface, and the sidewall and one side of the wall surface together define an accommodating space for the insertion of the pluggable heat source.

[0031] Optionally, the side wall has an interface connecting to the accommodating space.

[0032] Optionally, the inclined surface has a first end and a second end opposite to each other, the first end being connected to the support surface and the second end being away from the support surface and facing the interface.

[0033] The beneficial effects of this invention are as follows:

[0034] This invention provides a heat dissipation structure that improves heat dissipation efficiency by directly dissipating heat through heat-conducting plates after a pluggable heat source is inserted into the housing of the heat dissipation structure. Furthermore, the inclined surface on the housing guides the pluggable heat source into the housing. In addition, the thin film on the housing further assists in the effortless insertion of the pluggable heat source into the housing.

[0035] The electronic device provided by the present invention, by applying the above-mentioned heat dissipation structure, can greatly improve the heat dissipation effect of pluggable heat sources inserted into the electronic device, and extend the service life of the electronic device and the pluggable heat source. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the external appearance of the electronic device having the heat dissipation structure described in this invention;

[0037] Figure 2 This is a three-dimensional structural diagram of the heat dissipation structure used in conjunction with the pluggable heat source in this invention;

[0038] Figure 3 This is an exploded planar schematic diagram of the heat dissipation structure used in conjunction with the pluggable heat source in this invention;

[0039] Figure 4 This is a schematic diagram of the planar combination of the heat dissipation structure and the pluggable heat source in this invention;

[0040] Figure 5 for Figure 4 A magnified view of a portion of point 5 selected in the middle circle;

[0041] Figure 6 This is a schematic diagram of a planar combination of another embodiment of the heat dissipation structure in this invention, used in conjunction with a pluggable heat source.

[0042] In the picture:

[0043] 10. Plug-in heat source;

[0044] 20. Shell; 21. Wall; 211. Receiving groove; 2111. Bottom surface of groove; 2112. Side surface of groove; 212. Supporting surface; 213. Inclined surface; 2131. First end; 2132. Second end; 214. Extension surface; 22. Side wall; 221. Interface;

[0045] 30. Heat-conducting sheet; 31. First side; 32. Second side;

[0046] 40. Film;

[0047] 51. First connecting terminal; 52. Second connecting terminal;

[0048] S, accommodating space;

[0049] D1, First Direction;

[0050] D2, Second Direction;

[0051] T1, First Thickness;

[0052] T2, second thickness;

[0053] L1, the first length;

[0054] L2, the second length;

[0055] θ, junction angle;

[0056] E, electronic device; E1, main unit. Detailed Implementation

[0057] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0058] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0059] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0061] To improve the heat dissipation effect of pluggable heat sources, this embodiment provides a heat dissipation structure and electronic device, the electronic device including the heat dissipation structure.

[0062] like Figure 1-3 As shown, the heat dissipation structure includes a housing 20, a heat-conducting plate 30, and a thin film 40. The housing 20 includes a wall surface 21, which includes a receiving groove 211, a supporting surface 212, and an inclined surface 213. The receiving groove 211 is recessed into the supporting surface 212, and the inclined surface 213 is connected to the supporting surface 212 and located on one side of the receiving groove 211. The heat-conducting plate 30 is disposed within the receiving groove 211, and the surface of the heat-conducting plate 30 is flush with the surface of the supporting surface 212. The thin film 40 covers the supporting surface 212, the heat-conducting plate 30, and the inclined surface 213.

[0063] Therefore, after the pluggable heat source 10 is inserted into the housing 20, it can directly dissipate heat through the heat-conducting plate 30, improving the heat dissipation effect. The inclined surface 213 on the housing 20 can guide the pluggable heat source 10 into the housing 20, making the pluggable heat source 10 more accurately inserted into the corresponding position of the housing 20. In addition, the thin film 40 on the housing 20 can further assist the pluggable heat source 10 in being inserted into the housing 20 with less effort, and the thin film 40 extends to cover the inclined surface 213, thus preventing the pluggable heat source 10 from contacting the end of the thin film 40 during the insertion and removal process, reducing the risk of the thin film 40 being picked up by the pluggable heat source 10, and improving structural stability.

[0064] like Figure 1As shown, in some embodiments, the heat dissipation structure is part of the electronic device E. In these embodiments, the electronic device E includes a host E1, a heat dissipation structure, and a pluggable heat source 10. The heat dissipation structure is disposed on one side surface of the host E1, and the pluggable heat source 10 is a pluggable electronic component that can be freely inserted into or removed from the housing 20 of the heat dissipation structure as needed. The pluggable heat source 10 can be electrically connected to a second connection terminal 52 in the electronic device E through a first connection terminal 51. The electronic device E is, for example, but not limited to, a notebook computer, tablet, keyboard dock, mobile phone, or camera. The pluggable heat source 10 is, for example, but not limited to, a pluggable memory, a pluggable hard drive, a TV tuner card, or other types of peripheral controller interface card (PCI card).

[0065] like Figure 3-4 As shown, a housing 20 is disposed on one side surface of the host E1 to accommodate a pluggable heat source 10. In some embodiments, the housing 20 includes a wall 21 and a side wall 22, the side wall 22 being disposed around the periphery of the wall 21, and the side wall 22 and one side of the wall 21 together define an accommodating space S for insertion of the pluggable heat source 10. In these embodiments, the other side of the wall 21 is used to connect to the host E1, and the side wall 22 has an interface 221 communicating with the accommodating space S for insertion of the pluggable heat source 10 into the accommodating space S.

[0066] like Figure 1 , Figure 4 As shown, in some embodiments, the receiving groove 211, support surface 212, and inclined surface 213 of the wall 21 are located on the side of the wall 21 facing the receiving space S. Therefore, the heat-conducting sheet 30 housed in the receiving groove 211 and the thin film 40 covering the support surface 212 are also located on the side of the wall 21 facing the receiving space S. In this way, when the pluggable heat source 10 is inserted into the housing 20 through the interface 221, the pluggable heat source 10 can be housed in the receiving space S and contact the heat-conducting sheet 30 or the thin film 40. That is, the heat dissipation structure of the electronic device E may include the thin film 40 (e.g., Figure 2-5 (As shown) can also be without the film 40 (e.g.) Figure 6 (As shown).

[0067] In some embodiments, the receiving groove 211 has a bottom surface 2111 and a side surface 2112 surrounding the periphery of the bottom surface 2111. In these embodiments, the external shape of the heat-conducting sheet 30 corresponds to the sheet structure of the receiving groove 211, and has opposing first surfaces 31 and second surfaces 32. Therefore, when the heat-conducting sheet 30 is received in the receiving groove 211, the first surface 31 of the heat-conducting sheet 30 abuts against the bottom surface 2111, the second surface 32 of the heat-conducting sheet 30 is flush with the support surface 212, and the periphery of the heat-conducting sheet 30 abuts against the side surface 2112 for stable positioning by the side surface 2112. In this way, when the pluggable heat source 10 is inserted into the receiving space S of the housing 10, the pluggable heat source 10 directly contacts the second surface 32 of the heat-conducting sheet 30 (e.g., ...). Figure 6 As shown), this achieves a heat dissipation effect. Furthermore, when the thin film 40 covers the heat-conducting sheet 30, the pluggable heat source 10 directly contacts the thin film 40 (as shown). Figure 4 , Figure 5 As shown in the diagram, the thin film 40 directly contacts the heat-conducting sheet 30, allowing the heat from the pluggable heat source 10 to be directly conducted to the heat-conducting sheet 30 through the thin film 40 covering the support surface 212, thus still achieving a heat dissipation effect. Therefore, the heat-conducting sheet 30 is a sheet structure with thermal conductivity. In other embodiments, the heat-conducting sheet 30 may also be a thermal pad, thermal grease, heat pipe, or thermal adhesive; this invention is not limited to these.

[0068] like Figure 3-5 As shown, in some embodiments, the direction of the support surface 212 of the vertical housing 20 is a first direction D1, and the direction perpendicular to the first direction D1 is a second direction D2. The inclined surface 213 has a first end 2131 and a second end 2132. The first end 2131 is connected to the support surface 212, and in the first direction D1, the second end 2132 is farther away from the support surface 212 than the bottom surface 2111 of the groove. The inclined surface 213 can guide the pluggable heat source 10 to be smoothly inserted into the housing 20 along the second direction D2 and disposed on the support surface 212. On the other hand, the length of the film 40 extending out of the support surface 212 and covering the inclined surface 213 in the second direction D2 is greater than the depth of the receiving groove 211 in the first direction D1. This ensures that the length of the portion of the film 40 extending out of the support surface 212 and covering the inclined surface 213 in the second direction D2 is sufficient to ensure that the film 40 can still be stably attached to the inclined surface 213 even after the bend at the junction of the support surface 212 and the inclined surface 213.

[0069] In some embodiments, in the second direction D2, the support surface 212 has a first length L1 between the receiving groove 211 and the inclined surface 213, and a second length L2 between the first end 2131 and the second end 2132 of the inclined surface 213, the second length L2 being greater than the first length L1. In these embodiments, the film 40 completely covers the inclined surface 213, and the end of the film 40 extends to the second end 2132 of the inclined surface 213, thus ensuring that the length of the film 40 extending from the support surface 212 and covering the inclined surface 213 is sufficient, further ensuring the stability of the film 40 attached to the inclined surface 213.

[0070] In addition, such as Figure 5 As shown, in some embodiments, in the second direction D2, the second end 2132 is closer to the interface 221 than the first end 2131. Thus, the inclined surface 213 extends in a direction with the second end 2132 facing the interface 221 and away from the support surface 212. Therefore, since the plug-in / plug-out process of the pluggable heat source 10 involves contacting the film 40 on the support surface 212, and the film 40 covers the inclined surface 213, the inclined orientation of the inclined surface 213 keeps the end of the film 40 away from the pluggable heat source 10's pluggable path. Thus, the pluggable heat source 10 does not contact the end of the film 40 during pluggable operation, and the pluggable heat source 10's pluggable action does not lift the film 40, ensuring the stability of the film 40.

[0071] like Figure 4-5 As shown, in some embodiments, to ensure that the heat from the pluggable heat source 10 can be conducted through the thin film 40 to the heat-conducting sheet 30, the heat-conducting sheet 30 has a first thickness T1 in the first direction D1, while the thin film 40 has a second thickness T2, wherein the second thickness T2 of the thin film 40 is 10 to 35% of the first thickness T1 of the heat-conducting sheet 30. Therefore, by setting the thickness of the thin film 40, it is ensured that the heat from the pluggable heat source 10 can be effectively conducted through the thin film 40 to the heat-conducting sheet 30 for heat dissipation.

[0072] In some embodiments, to improve the smoothness of plugging and unplugging the pluggable heat source 10 into the housing 20, the thin film 40, which directly contacts the pluggable heat source 10 during the plugging and unplugging operation, is made of a material with a low coefficient of friction. In these embodiments, the coefficient of friction of the thin film 40 is less than that of the heat-conducting sheet 30 and the support surface 212. Exemplarily, the thin film 40 may be made of polyethylene or polytetrafluoroethylene, but this is not a limitation thereof.

[0073] like Figure 3-5As shown, in some embodiments, to further extend the lifespan of the thin film 40, a connection angle θ is formed at the first end 2131 between the support surface 212 and the inclined surface 213. In these embodiments, the connection angle θ is an obtuse angle. Therefore, when the thin film 40 covers the support surface 212 and extends to cover the inclined surface 213, since the thin film 40 will inevitably cover the connection angle θ, the obtuse angle θ can avoid sharp relative contact with the thin film 40. During the insertion and removal of the pluggable heat source 10, the damage to the thin film 40 caused by the connection angle θ can be minimized, thus extending the lifespan of the thin film 40.

[0074] like Figure 3-5 As shown, in some embodiments, the wall surface 21 further includes an extension surface 214, which is connected to the second end 2132 of the inclined surface 213, and the slope of the extension surface 214 is greater than the slope of the inclined surface 213. In these embodiments, the end of the film 40 extends to the second end 2132 of the inclined surface 213. Since the second end 2132 of the inclined surface 213 is connected to the extension surface 214, in addition to extending to the second end 2132 of the inclined surface 213, longer films 40 can also be extended and attached to the extension surface 214 without being unable to be attached due to excessive length. This effectively avoids the situation where the end of the film 40 lifts up, affecting the stability of the film 40, and expands the length tolerance of the film 40, reducing manufacturing difficulty.

[0075] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure, characterized in that, The heat dissipation structure includes: The housing (20) includes a wall (21), which includes a receiving groove (211), a supporting surface (212) and an inclined surface (213). The receiving groove (211) is recessed in the supporting surface (212), and the inclined surface (213) is connected to the supporting surface (212) and located on one side of the receiving groove (211). A heat-conducting plate (30) is disposed in the receiving groove (211), and the surface of the heat-conducting plate (30) is flush with the surface of the support surface (212); A thin film (40) covers the support surface (212), the heat-conducting sheet (30), and the inclined surface (213). The inclined surface (213) is used to guide the pluggable heat source (10) into the housing (20), so that the pluggable heat source (10) is inserted more accurately into the corresponding position of the housing (20). The direction perpendicular to the support surface (212) is the first direction (D1). The receiving groove (211) has a groove bottom surface (2111). The inclined surface (213) has a first end (2131) and a second end (2132). The first end (2131) is connected to the support surface (212). In the first direction (D1), the second end (2132) is farther away from the support surface (212) than the groove bottom surface (2111). The wall surface (21) also includes an extension surface (214) that connects to the second end (2132) of the inclined surface (213), and the slope of the extension surface (214) is greater than the slope of the inclined surface (213).

2. The heat dissipation structure according to claim 1, characterized in that, The heat-conducting sheet (30) has a first thickness (T1), and the thin film (40) has a second thickness (T2), which is 10 to 35% of the first thickness (T1).

3. The heat dissipation structure according to claim 1, characterized in that, The coefficient of friction of the thin film (40) is less than that of the heat-conducting sheet (30).

4. The heat dissipation structure according to claim 1, characterized in that, The coefficient of friction of the thin film (40) is less than that of the support surface (212).

5. The heat dissipation structure according to claim 1, characterized in that, The film (40) is made of polyethylene or polytetrafluoroethylene.

6. The heat dissipation structure according to claim 1, characterized in that, The housing (20) also has an interface (221), and the second end (2132) of the inclined surface (213) is closer to the interface (221) than the first end (2131).

7. The heat dissipation structure according to claim 1, characterized in that, The first direction (D1) is perpendicular to the second direction (D2). In the second direction (D2), the support surface (212) has a first length (L1) between the receiving groove (211) and the inclined surface (213). The inclined surface (213) has a second length (L2) between the first end (2131) and the second end (2132) of the first end (2132). The second length (L2) is greater than the first length (L1).

8. The heat dissipation structure according to claim 1, characterized in that, The supporting surface (212) and the inclined surface (213) have a connection angle (θ) at the first end (2131), and the connection angle (θ) is an obtuse angle.

9. An electronic device, characterized in that, The electronic device includes: The housing (20) includes a wall (21), which includes a receiving groove (211), a supporting surface (212) and an inclined surface (213). The receiving groove (211) is recessed in the supporting surface (212), and the inclined surface (213) is connected to the supporting surface (212) and located on one side of the receiving groove (211). A heat-conducting plate (30) is disposed in the receiving groove (211), and the surface of the heat-conducting plate (30) is flush with the surface of the support surface (212); A thin film (40) covers the support surface (212), the heat-conducting sheet (30), and the inclined surface (213); A pluggable heat source (10) is disposed on the thin film (40). The inclined surface (213) is used to guide the pluggable heat source (10) into the housing (20), so that the pluggable heat source (10) is inserted more accurately into the corresponding position of the housing (20). The direction perpendicular to the support surface (212) is the first direction (D1). The receiving groove (211) has a groove bottom surface (2111). The inclined surface (213) has a first end (2131) and a second end (2132). The first end (2131) is connected to the support surface (212). In the first direction (D1), the second end (2132) is farther away from the support surface (212) than the groove bottom surface (2111). The wall surface (21) also includes an extension surface (214) that connects to the second end (2132) of the inclined surface (213), and the slope of the extension surface (214) is greater than the slope of the inclined surface (213).

10. The electronic device according to claim 9, characterized in that, The housing (20) also has an interface (221) through which the pluggable heat source (10) is slidably disposed in the housing (20).

11. The electronic device according to claim 9, characterized in that, The electronic device also includes a main unit (E1), and the housing (20) is disposed on one side surface of the main unit (E1).

12. An electronic device, characterized in that, The electronic device includes: The housing (20) includes a wall (21), which includes a receiving groove (211), a supporting surface (212) and an inclined surface (213). The receiving groove (211) is recessed in the supporting surface (212), and the inclined surface (213) is connected to the supporting surface (212) and located on one side of the receiving groove (211). A heat-conducting plate (30) is disposed in the receiving groove (211), and the surface of the heat-conducting plate (30) is flush with the surface of the support surface (212); A pluggable heat source (10) is disposed on the support surface (212) and the heat-conducting plate (30). The inclined surface (213) is used to guide the pluggable heat source (10) into the housing (20), so that the pluggable heat source (10) is inserted more accurately into the corresponding position of the housing (20). The direction perpendicular to the support surface (212) is the first direction (D1). The receiving groove (211) has a groove bottom surface (2111). The inclined surface (213) has a first end (2131) and a second end (2132). The first end (2131) is connected to the support surface (212). In the first direction (D1), the second end (2132) is farther away from the support surface (212) than the groove bottom surface (2111). The wall surface (21) also includes an extension surface (214) that connects to the second end (2132) of the inclined surface (213), and the slope of the extension surface (214) is greater than the slope of the inclined surface (213).

13. The electronic device according to claim 12, characterized in that, The housing (20) also includes a side wall (22) which surrounds the periphery of the wall (21) and the side wall (22) and one side of the wall (21) together define an accommodating space (S) for the insertion of the pluggable heat source (10).

14. The electronic device according to claim 13, characterized in that, The side wall (22) has an interface (221) that connects to the accommodating space (S).

15. The electronic device according to claim 14, characterized in that, The second end (2132) faces the interface (221).

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